JP7085008B2 - 発光ダイオード - Google Patents
発光ダイオード Download PDFInfo
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- JP7085008B2 JP7085008B2 JP2020544497A JP2020544497A JP7085008B2 JP 7085008 B2 JP7085008 B2 JP 7085008B2 JP 2020544497 A JP2020544497 A JP 2020544497A JP 2020544497 A JP2020544497 A JP 2020544497A JP 7085008 B2 JP7085008 B2 JP 7085008B2
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- 230000000737 periodic effect Effects 0.000 claims description 39
- 239000004065 semiconductor Substances 0.000 claims description 35
- 239000000463 material Substances 0.000 claims description 34
- 238000010030 laminating Methods 0.000 claims description 13
- 230000004888 barrier function Effects 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 10
- 229910002601 GaN Inorganic materials 0.000 claims description 7
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 claims description 3
- 238000005381 potential energy Methods 0.000 claims 1
- 239000010410 layer Substances 0.000 description 91
- 229910002704 AlGaN Inorganic materials 0.000 description 17
- 238000005036 potential barrier Methods 0.000 description 9
- 239000002800 charge carrier Substances 0.000 description 8
- 230000000670 limiting effect Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 150000004767 nitrides Chemical class 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 4
- 229910052738 indium Inorganic materials 0.000 description 4
- 230000005855 radiation Effects 0.000 description 4
- 230000006798 recombination Effects 0.000 description 4
- 238000005215 recombination Methods 0.000 description 4
- 230000006866 deterioration Effects 0.000 description 3
- 238000003917 TEM image Methods 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000002488 metal-organic chemical vapour deposition Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000000407 epitaxy Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 230000005641 tunneling Effects 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/04—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/04—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction
- H01L33/06—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction within the light emitting region, e.g. quantum confinement structure or tunnel barrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/0004—Devices characterised by their operation
- H01L33/0008—Devices characterised by their operation having p-n or hi-lo junctions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/14—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a carrier transport control structure, e.g. highly-doped semiconductor layer or current-blocking structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/26—Materials of the light emitting region
- H01L33/30—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table
- H01L33/32—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table containing nitrogen
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Led Devices (AREA)
Description
Claims (21)
- N型の伝導層と、多重量子井戸と、P型の伝導層とを含み、多重量子井戸の少なくとも2つの周期構造における各周期は、ポテンシャル井戸である第1のサブ層と、ポテンシャルエネルギー障壁である第2のサブ層と、第3のサブ層とが順次積層されていて、且つ、前記第1のサブ層のエネルギーバンドギャップEg1と、第2のサブ層のエネルギーバンドギャップEg2と、第3のサブ層のエネルギーバンドギャップEg3との関係が、Eg1<Eg2<Eg3であり、
前記第1のサブ層は、InxGa1-xNであり、0≦x≦0.03であり、
前記第2のサブ層は、InyAlzGa1-y-zNであり、0≦y≦0.02であり、0.06≦z≦0.12であり、
前記第3のサブ層は、AlwGa1-wNであり、0.95≦w≦1である、発光ダイオードエピタキシャルウエハ。 - Eg3とEg2との差が、少なくとも1.5eV以上である、請求項1に記載の発光ダイオードエピタキシャルウエハ。
- 前記第3のサブ層の厚さは、30オングストローム以下である、請求項1に記載の発光ダイオードエピタキシャルウエハ。
- 多重量子井戸の各周期は、第1のサブ層と、第2のサブ層と、第3のサブ層とが順次積層されていて、前記第1のサブ層のエネルギーバンドギャップEg1と、第2のサブ層のエネルギーバンドギャップEg2と、第3のサブ層のエネルギーバンドギャップEg3との関係が、Eg1<Eg2<Eg3である、請求項1~3のいずれか1項に記載の発光ダイオードエピタキシャルウエハ。
- 前記多重量子井戸の少なくとも1つの周期構造において、更に第1のサブ層は、少なくとも2種類の半導体材料が積層されて形成されており、少なくとも2種類の半導体材料の積層方法は、第2のサブ層側へ近いほどEgが高くなり、且ついずれも第2のサブ層のEg2よりも低い、請求項1~3のいずれか1項に記載の発光ダイオードの多重量子井戸。
- 前記多重量子井戸の少なくとも1つの周期構造において、更に第2のサブ層は、少なくとも2種類以上の半導体材料が積層されて形成されており、少なくとも2種類の半導体材料の積層方法は、第1のサブ層側から遠いほどEgが高くなる、請求項1~3のいずれか1項に記載の発光ダイオードエピタキシャルウエハ。
- 前記多重量子井戸の少なくとも1つの周期構造において、更に第3のサブ層は、少なくとも2種類以上の半導体材料が積層されて形成されており、少なくとも2種類の半導体材料の積層方法は、第2のサブ層側から遠いほどEgが高くなり、且つ、いずれも第2のサブ層のEg2よりも高い、請求項1~3のいずれか1項に記載の発光ダイオードエピタキシャルウエハ。
- 前記多重量子井戸は、第1のサブ層と第2のサブ層とが積層された周期が少なくとも1つと、第1のサブ層と第2のサブ層と第3のサブ層とが順次積層されていて、前記第1のサブ層のエネルギーバンドギャップEg1と第2のサブ層のエネルギーバンドギャップEg2と第3のサブ層のエネルギーバンドギャップEg3との関係が、Eg1<Eg2<Eg3である周期構造が少なくとも2つとを含む、請求項1~3のいずれか1項に記載の発光ダイオードエピタキシャルウエハ。
- 前記発光ダイオードは、窒化ガリウム発光ダイオードである、請求項1に記載の発光ダイオードエピタキシャルウエハ。
- 前記第3のサブ層は、AlNである、請求項1~3のいずれか1項に記載の発光ダイオードエピタキシャルウエハ。
- 前記第3のサブ層の厚さは、10~15オングストロームである、請求項1~3のいずれか1項に記載の発光ダイオードエピタキシャルウエハ。
- 前記発光ダイオードの発光波長は、350~370nmである、請求項1~3のいずれか1項に記載の発光ダイオードエピタキシャルウエハ。
- 記第1のサブ層のエネルギーバンドギャップEg1は、3.3~3.5eVである、請求項12に記載の発光ダイオードエピタキシャルウエハ。
- 前記第2のサブ層のエネルギーバンドギャップEg2は、3.55~3.9eVである、請求項12に記載の発光ダイオードエピタキシャルウエハ。
- 前記第2のサブ層のEg2と第1のサブ層のEg1とのエネルギーバンドギャップの差は、0.25~0.30eVである、請求項12に記載の発光ダイオードエピタキシャルウエハ。
- 前記周期構造の数は、2~20である、請求項12に記載の発光ダイオードエピタキシャルウエハ。
- 前記第2のサブ層は、AlzGa1-zNであり、0.06≦z≦0.12である、請求項12に記載の発光ダイオードエピタキシャルウエハ。
- 前記第1のサブ層、第2のサブ層及び第3のサブ層の厚さは、それぞれ300オングストローム以下である、請求項1~3のいずれかに記載の発光ダイオードエピタキシャルウエハ。
- 前記第1のサブ層の厚さは、20~150オングストロームであり、第2のサブ層の厚さは、50~300オングストロームである、請求項1~3のいずれか1項に記載の発光ダイオードエピタキシャルウエハ。
- 前記量子井戸の総厚さは、100~3000オングストロームである、請求項1~3のいずれか1項に記載の発光ダイオードエピタキシャルウエハ。
- 請求項1~20のいずれか1項に記載の発光ダイオードエピタキシャルウエハから得られた発光ダイオード。
Applications Claiming Priority (1)
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PCT/CN2018/087515 WO2019218350A1 (zh) | 2018-05-18 | 2018-05-18 | 发光二极管 |
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JP2021516444A JP2021516444A (ja) | 2021-07-01 |
JP7085008B2 true JP7085008B2 (ja) | 2022-06-15 |
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US (1) | US11538960B2 (ja) |
EP (1) | EP3796401A4 (ja) |
JP (1) | JP7085008B2 (ja) |
KR (1) | KR102444467B1 (ja) |
CN (2) | CN110582857B (ja) |
WO (1) | WO2019218350A1 (ja) |
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CN115377259B (zh) * | 2022-10-26 | 2023-01-31 | 江西兆驰半导体有限公司 | 发光二极管外延片及其制备方法、发光二极管 |
Citations (6)
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JP2009182347A (ja) | 2009-05-18 | 2009-08-13 | Sharp Corp | 窒化物半導体発光素子及びその製造方法 |
JP2013149890A (ja) | 2012-01-23 | 2013-08-01 | Stanley Electric Co Ltd | GaN系半導体発光素子 |
JP2015043352A (ja) | 2013-08-24 | 2015-03-05 | 日亜化学工業株式会社 | 半導体発光素子 |
JP2016086017A (ja) | 2014-10-23 | 2016-05-19 | スタンレー電気株式会社 | 半導体発光素子 |
JP2016181553A (ja) | 2015-03-23 | 2016-10-13 | スタンレー電気株式会社 | 半導体発光素子 |
US20170033260A1 (en) | 2015-07-28 | 2017-02-02 | Genesis Photonics Inc. | Multiple quantum well structure and method for manufacturing the same |
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JP4032636B2 (ja) * | 1999-12-13 | 2008-01-16 | 日亜化学工業株式会社 | 発光素子 |
US8546846B2 (en) * | 2007-08-20 | 2013-10-01 | Samsung Electronics Co., Ltd. | Nitride semiconductor light emitting device |
KR101953716B1 (ko) * | 2012-08-23 | 2019-03-05 | 엘지이노텍 주식회사 | 발광소자, 발광 소자 패키지 및 조명 시스템 |
CN104157746A (zh) * | 2014-08-15 | 2014-11-19 | 湘能华磊光电股份有限公司 | 新型量子阱势垒层的led外延生长方法及外延层 |
JP6433247B2 (ja) * | 2014-11-07 | 2018-12-05 | スタンレー電気株式会社 | 半導体発光素子 |
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CN206471346U (zh) * | 2017-01-10 | 2017-09-05 | 安徽三安光电有限公司 | 一种发光二极管 |
CN107681027B (zh) * | 2017-09-30 | 2018-11-20 | 珠海宏光照明器材有限公司 | 白光led及其制作方法 |
CN107819058B (zh) * | 2017-11-28 | 2019-07-23 | 厦门三安光电有限公司 | 发光二极管 |
CN208580758U (zh) * | 2018-05-18 | 2019-03-05 | 厦门三安光电有限公司 | 一种发光二极管外延片及发光二极管 |
US11393948B2 (en) * | 2018-08-31 | 2022-07-19 | Creeled, Inc. | Group III nitride LED structures with improved electrical performance |
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2018
- 2018-05-18 JP JP2020544497A patent/JP7085008B2/ja active Active
- 2018-05-18 CN CN201880025463.XA patent/CN110582857B/zh active Active
- 2018-05-18 WO PCT/CN2018/087515 patent/WO2019218350A1/zh active Application Filing
- 2018-05-18 CN CN202310857688.4A patent/CN116895717A/zh active Pending
- 2018-05-18 EP EP18919298.2A patent/EP3796401A4/en active Pending
- 2018-05-18 KR KR1020207036317A patent/KR102444467B1/ko active IP Right Grant
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Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009182347A (ja) | 2009-05-18 | 2009-08-13 | Sharp Corp | 窒化物半導体発光素子及びその製造方法 |
JP2013149890A (ja) | 2012-01-23 | 2013-08-01 | Stanley Electric Co Ltd | GaN系半導体発光素子 |
JP2015043352A (ja) | 2013-08-24 | 2015-03-05 | 日亜化学工業株式会社 | 半導体発光素子 |
JP2016086017A (ja) | 2014-10-23 | 2016-05-19 | スタンレー電気株式会社 | 半導体発光素子 |
JP2016181553A (ja) | 2015-03-23 | 2016-10-13 | スタンレー電気株式会社 | 半導体発光素子 |
US20170033260A1 (en) | 2015-07-28 | 2017-02-02 | Genesis Photonics Inc. | Multiple quantum well structure and method for manufacturing the same |
Also Published As
Publication number | Publication date |
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EP3796401A1 (en) | 2021-03-24 |
CN116895717A (zh) | 2023-10-17 |
WO2019218350A1 (zh) | 2019-11-21 |
US20220013685A2 (en) | 2022-01-13 |
CN110582857B (zh) | 2023-08-15 |
JP2021516444A (ja) | 2021-07-01 |
US20210066542A1 (en) | 2021-03-04 |
KR20210005737A (ko) | 2021-01-14 |
CN110582857A (zh) | 2019-12-17 |
KR102444467B1 (ko) | 2022-09-16 |
US11538960B2 (en) | 2022-12-27 |
EP3796401A4 (en) | 2022-01-26 |
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