JP7083547B1 - Manufacturing method of chamfered wheel, chamfered wheel, and pre-use adjustment method of chamfered wheel - Google Patents

Manufacturing method of chamfered wheel, chamfered wheel, and pre-use adjustment method of chamfered wheel Download PDF

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JP7083547B1
JP7083547B1 JP2021153110A JP2021153110A JP7083547B1 JP 7083547 B1 JP7083547 B1 JP 7083547B1 JP 2021153110 A JP2021153110 A JP 2021153110A JP 2021153110 A JP2021153110 A JP 2021153110A JP 7083547 B1 JP7083547 B1 JP 7083547B1
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disk
wheel
shaft component
runout
chamfered
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JP2023044962A (en
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昌広 鈴木
政明 津田
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Tokyo Diamond Tools Mfg Co Ltd
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Tokyo Diamond Tools Mfg Co Ltd
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Priority to PCT/JP2022/010352 priority patent/WO2023047640A1/en
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B45/00Means for securing grinding wheels on rotary arbors
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D5/00Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D5/00Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
    • B24D5/02Wheels in one piece

Abstract

【課題】 より精度よく形成する面取りホイールの製造方法を提供すること。【解決手段】 面取りホイールの製造方法は、円盤の1対の側面の一方の基準面、円盤に回転軸部品が嵌合される嵌合穴部、円盤が回転するとき円盤の外周面の振れを調整するための、円環状の芯出し溝の第1の面、及び、第1の面に隣接し、円盤が回転するときの基準面の振れを調整するための、芯出し溝の第2の面を同軸加工により同心状に形成することと、円盤の外周面に砥石部を形成することとを含む。【選択図】 図7PROBLEM TO BE SOLVED: To provide a method for manufacturing a chamfered wheel which is formed more accurately. A method for manufacturing a chamfered wheel includes a reference surface on one of a pair of side surfaces of a disk, a fitting hole in which a rotary shaft component is fitted to the disk, and a runout of an outer peripheral surface of the disk when the disk rotates. A first surface of the annular centering groove for adjustment, and a second surface of the centering groove adjacent to the first surface and for adjusting the runout of the reference surface when the disk rotates. It includes forming the surfaces concentrically by coaxial processing and forming a grindstone portion on the outer peripheral surface of the disk. [Selection diagram] Fig. 7

Description

本発明は、面取りホイールの製造方法、面取りホイール、及び、面取りホイールの使用前調整方法に関する。 The present invention relates to a method for manufacturing a chamfered wheel, a chamfered wheel, and a method for adjusting the chamfered wheel before use.

面取りホイールは、例えばスピンドル等の回転軸部品に取り付けられ、回転軸部品とともに回転されることで、外周面の砥石部でガラスやシリコンウェハ等の被研体を面取りするために用いられる。例えば面取りホイールの外周面に円環状に形成された砥石部の溝に対して、被研体を入れると、溝形状の形に被研体のエッジが面取りされる。 The chamfering wheel is attached to a rotating shaft component such as a spindle, and is rotated together with the rotating shaft component to chamfer an object to be inspected such as glass or a silicon wafer at a grindstone portion on an outer peripheral surface. For example, when the object to be inspected is inserted into the groove of the grindstone portion formed in an annular shape on the outer peripheral surface of the chamfered wheel, the edge of the object to be inspected is chamfered in the shape of the groove.

特開2006-116686号公報Japanese Unexamined Patent Publication No. 2006-116686

面取りホイールの砥石寿命は、面取りホイールのもつ幾何精度に起因することが分かってきている。このため、面取りホイールのベース体となる円盤がより精度良く形成されることが求められている。 It has been found that the grindstone life of a chamfered wheel is due to the geometric accuracy of the chamfered wheel. Therefore, it is required that the disk that is the base body of the chamfer wheel is formed more accurately.

本発明は、より精度よく形成する面取りホイールの製造方法、面取りホイール、及び、その面取りホイールの使用前調整方法を提供することを目的とする。 An object of the present invention is to provide a method for manufacturing a chamfered wheel, a chamfered wheel, and a method for adjusting the chamfered wheel before use, which are formed more accurately.

本発明の一態様に係る面取りホイールの製造方法は、円盤の1対の側面の一方となる基準面、円盤に回転軸部品が嵌合される嵌合穴部、前記基準面に設けられ、前記面取りホイールが回転するとき前記面取りホイールの外周面の振れに対応する振れ検出し、前記円盤の位置を調整するときに用いる、円環状の芯出し溝の第1の面、及び、前記基準面に設けられ、前記第1の面に隣接し、前記面取りホイールが回転するときの前記基準面の振れを検出し、前記円盤の位置を調整するときに用いる、前記芯出し溝の第2の面を工作機械で前記円盤を保持した状態を維持して、同軸加工を行い、前記芯出し溝を前記嵌合穴部の中心軸に対して同心状に形成し、前記第1の面及び前記第2の面の精度を確保することと、円盤の外周面に円環状の砥石部を形成することとを含む。
The method for manufacturing a chamfered wheel according to one aspect of the present invention is provided on a reference surface which is one of a pair of side surfaces of a disk, a fitting hole where a rotating shaft component is fitted to the disk, and the reference surface. The first surface of the annular centering groove and the reference used when detecting the runout corresponding to the runout of the outer peripheral surface of the chamfer wheel when the chamfer wheel rotates and adjusting the position of the disk. A second of the centering grooves provided on the surface, adjacent to the first surface, detecting runout of the reference surface when the chamfer wheel rotates , and adjusting the position of the disk . The surface is maintained in a state where the disk is held by a machine tool, coaxial processing is performed, the centering groove is formed concentrically with respect to the central axis of the fitting hole portion, and the first surface and the said It includes ensuring the accuracy of the second surface and forming an annular grindstone portion on the outer peripheral surface of the disk.

本発明によれば、より精度よく形成する面取りホイールの製造方法、面取りホイール、及び、その面取りホイールの使用前調整方法を提供することを提供することができる。 INDUSTRIAL APPLICABILITY According to the present invention, it is possible to provide a method for manufacturing a chamfered wheel, a chamfered wheel, and a method for adjusting the chamfered wheel before use, which are formed more accurately.

実施形態に係る面取りホイールの図2中の符号Iで示す方向から見た概略図。FIG. 2 is a schematic view of the chamfered wheel according to the embodiment as viewed from the direction indicated by reference numeral I in FIG. 図1中のII-II線に沿う断面図。FIG. 2 is a cross-sectional view taken along the line II-II in FIG. 図2中の符号IIIで示す位置の拡大図。Enlarged view of the position indicated by reference numeral III in FIG. 実施形態に係る面取りホイールの円盤のための母材の概略的な斜視図。Schematic perspective of the base metal for the disc of the chamfered wheel according to the embodiment. 面取りホイールの図4に続く製造工程を示す概略的な斜視図。FIG. 6 is a schematic perspective view showing a manufacturing process following FIG. 4 of the chamfered wheel. 面取りホイールの図5に続く製造工程を示す概略的な斜視図。FIG. 6 is a schematic perspective view showing a manufacturing process following FIG. 5 of the chamfered wheel. 面取りホイールの図6に続く製造工程を示す概略的な斜視図。FIG. 6 is a schematic perspective view showing a manufacturing process following FIG. 6 of the chamfered wheel. 面取りホイールの図7に続く製造工程を示す概略的な斜視図。The schematic perspective view which shows the manufacturing process which follows FIG. 7 of a chamfer wheel. 面取りホイールの図8に続く製造工程を示す概略的な斜視図。The schematic perspective view which shows the manufacturing process which follows FIG. 8 of a chamfer wheel. 面取りホイールの図9に続く製造工程を示す概略的な斜視図。The schematic perspective view which shows the manufacturing process which follows FIG. 9 of a chamfer wheel. 面取りホイールの図10に続く製造工程を示す概略的な斜視図。The schematic perspective view which shows the manufacturing process which follows FIG. 10 of a chamfer wheel. 面取りホイールの図11に続く製造工程を示す概略的な斜視図。FIG. 6 is a schematic perspective view showing a manufacturing process following FIG. 11 of the chamfered wheel. 面取りホイールの図12に続く製造工程を示す概略的な斜視図。FIG. 2 is a schematic perspective view showing a manufacturing process following FIG. 12 of the chamfered wheel. 面取りホイールの図13に続く製造工程を示す概略的な斜視図。FIG. 6 is a schematic perspective view showing a manufacturing process following FIG. 13 of the chamfered wheel. 面取りホイールの図14に続く製造工程を示す概略的な斜視図。FIG. 6 is a schematic perspective view showing a manufacturing process following FIG. 14 of the chamfered wheel. 面取りホイールの図15に続く製造工程を示す概略的な斜視図。FIG. 6 is a schematic perspective view showing a manufacturing process following FIG. 15 of the chamfered wheel. 面取りホイールの図16に続く製造工程を示す概略的な斜視図。FIG. 6 is a schematic perspective view showing a manufacturing process following FIG. 16 of the chamfered wheel. 面取りホイールの使用前調整方法を示す概略的な斜視図。Schematic perspective showing how to adjust the chamfer wheel before use.

一実施形態に係る面取りホイール10について、図1から図18を用いて説明する。 The chamfer wheel 10 according to the embodiment will be described with reference to FIGS. 1 to 18.

図1から図3に示すように、面取りホイール10は、中心軸Cが規定される円盤12と、円盤12の外周面に形成される砥石部14とを有する。 As shown in FIGS. 1 to 3, the chamfer wheel 10 has a disk 12 in which the central axis C is defined, and a grindstone portion 14 formed on the outer peripheral surface of the disk 12.

円盤12は、砥石部14を固定するベース体となる。円盤12は、例えばアルミニウム合金を用いることが好適である。円盤12は、アルミニウム合金のうち、加工性が良好で、耐摩耗性を有する超々ジュラルミン(A7075材)を用いることが好適である。円盤12は、面取りホイール10の円盤12としての剛性を有し、所望の状態に加工でき、所望の寸法安定性があれば、アルミニウム合金に限らず、種々の素材を用いることができる。
円盤12は、中心軸Cが規定される円盤体22と、円盤体22の中心軸Cを貫通する嵌合穴部24と、中心軸Cの軸回りに形成される凹状の芯出し溝26とを有する。
The disk 12 serves as a base body for fixing the grindstone portion 14. For the disk 12, for example, it is preferable to use an aluminum alloy. For the disk 12, it is preferable to use extra super duralumin (A7075 material), which has good workability and wear resistance, among aluminum alloys. The disk 12 has the rigidity of the chamfered wheel 10 as the disk 12, can be processed into a desired state, and can use various materials, not limited to aluminum alloys, as long as it has the desired dimensional stability.
The disk 12 includes a disk body 22 in which a central axis C is defined, a fitting hole portion 24 penetrating the central axis C of the disk body 22, and a concave centering groove 26 formed around the axis of the central axis C. Have.

円盤体22は、1対の平面32a,32bを有するボス32と、ボス32の外側に形成される1対の円環状面(凹面)34a,34bを有する円環状部34と、外周面36とを有する。ボス32は、嵌合穴部24を形成する。ボス32の平面32a,32bは、例えば、1対の円環状面34a,34bに対してそれぞれ突出する。平面32a,32bは互いに平行な円環状面として形成され、1対の平面32a,32bの法線はそれぞれ反対側を向く。一方の平面32aは、後述する外周振れ、及び、側面振れの基準となる基準面として用いられる。一方の円環状面34aは、ボス32の平面32aである基準面と面一に形成されていてもよい。以後、説明の簡略化のため、ボス32の一方の平面32aと円環状面34aとが面一であるとし、これを一方(第1)の側面38aとする。平面32aと円環状面34aとが面一である場合、この側面38aが基準面となる。すなわち、基準面は、側面38aのうち、ボス32の平面32aであってもよく、平面32aと円環状面34aとを合わせた領域であってもよい。他方の円環状面34bは、例えば、製造番号や製造メーカ等の表示(図示せず)が刻印される刻印面(以下、適宜に符号34bを付す)として用いられる。他方の円環状面34bは、ボス32の平面32bと面一に形成されていてもよい。以後、ボス32の他方の平面32bと円環状面34bとが面一であるとし、これを他方(第2)の側面38bとするとともに、これを刻印面とする。この場合、嵌合穴部24は1対の側面38a,38bを貫通するように見える。図4から図18は、ボス32の1対の平面32a,32bと1対の円環状面34a,34bとの段差を適宜に省略し、それぞれ円環平面状の1対の側面38a,38bとして図示する。外周面36は、外側外周面42aを有するフランジ部42と、内側外周面44とを有する。円盤体22の内側外周面44には、円環状の砥石部14が配置される。砥石部14は、フランジ部42により円盤体22に対して位置決めされる。 The disk body 22 includes a boss 32 having a pair of planes 32a and 32b, an annular portion 34 having a pair of annular surfaces (concave surfaces) 34a and 34b formed on the outside of the boss 32, and an outer peripheral surface 36. Has. The boss 32 forms the fitting hole portion 24. The planes 32a and 32b of the boss 32 project, for example, with respect to the pair of annular surfaces 34a and 34b, respectively. The planes 32a and 32b are formed as annular planes parallel to each other, and the normals of the pair of planes 32a and 32b face opposite to each other. One of the planes 32a is used as a reference plane as a reference for outer peripheral runout and side runout, which will be described later. One annular surface 34a may be formed flush with the reference surface which is the plane 32a of the boss 32. Hereinafter, for the sake of simplification of the description, it is assumed that one plane 32a of the boss 32 and the annular surface 34a are flush with each other, and this is referred to as the one (first) side surface 38a. When the plane 32a and the annular surface 34a are flush with each other, this side surface 38a serves as a reference surface. That is, the reference plane may be the plane 32a of the boss 32 in the side surface 38a, or may be a region where the plane 32a and the annular surface 34a are combined. The other annular surface 34b is used, for example, as an engraved surface (hereinafter, appropriately designated with reference numeral 34b) on which an indication (not shown) such as a serial number or a manufacturer is engraved. The other annular surface 34b may be formed flush with the plane 32b of the boss 32. Hereinafter, it is assumed that the other plane 32b of the boss 32 and the annular surface 34b are flush with each other, and this is referred to as the other (second) side surface 38b and this is referred to as the engraved surface. In this case, the fitting hole portion 24 appears to penetrate the pair of side surfaces 38a, 38b. 4 to 18 show a pair of annular planes 38a and 38b, respectively, by appropriately omitting a step between the pair of planes 32a and 32b of the boss 32 and the pair of annular surfaces 34a and 34b. Illustrated. The outer peripheral surface 36 has a flange portion 42 having an outer outer peripheral surface 42a and an inner outer peripheral surface 44. An annular grindstone portion 14 is arranged on the inner outer peripheral surface 44 of the disk body 22. The grindstone portion 14 is positioned with respect to the disk body 22 by the flange portion 42.

嵌合穴部24は、基準面38a(平面32a)に対して垂直で、各位置の法線がそれぞれ中心軸Cに向かう円環状の面(内周面)として形成される。嵌合穴部24には、スピンドル又はアーバーなどの回転軸部品80,90が嵌合される。 The fitting hole portion 24 is formed as an annular surface (inner peripheral surface) perpendicular to the reference surface 38a (plane surface 32a) and having normals at each position facing the central axis C. Rotating shaft components 80 and 90 such as a spindle or an arbor are fitted into the fitting hole portion 24.

芯出し溝26は、円盤体22の外周面36の内側の側面38a(円環状面34a)に形成される。芯出し溝26は、それぞれ中心軸Cと同心状である円環状の第1の面52、第2の面54、及び、第3の面56を有する。第1の面52と第2の面54とは連続(隣接)する。第2の面54と第3の面56とは連続(隣接)する。
第1の面52は、基準面38a(平面32a)に対して直交し、嵌合穴部24に平行で、円環状に形成される。第1の面52の法線は、円盤12の中心軸Cに向かう。第2の面54は、基準面38a(平面32a)に平行で、嵌合穴部24に対して直交し、円環状に形成される。第3の面56は、円環状に形成されるが、本実施形態では、基準面38a(平面32a)に平行でなく、垂直でもない。なお、第3の面56は、本実施形態では、断面が直線状の例を示すが、断面が曲面状であってもよい。
The centering groove 26 is formed on the inner side surface 38a (annular annular surface 34a) of the outer peripheral surface 36 of the disk body 22. The centering groove 26 has an annular first surface 52, a second surface 54, and a third surface 56, which are concentric with the central axis C, respectively. The first surface 52 and the second surface 54 are continuous (adjacent). The second surface 54 and the third surface 56 are continuous (adjacent).
The first surface 52 is formed in an annular shape so as to be orthogonal to the reference surface 38a (plane surface 32a) and parallel to the fitting hole portion 24. The normal of the first surface 52 faces the central axis C of the disk 12. The second surface 54 is parallel to the reference surface 38a (plane surface 32a), orthogonal to the fitting hole portion 24, and formed in an annular shape. The third surface 56 is formed in an annular shape, but in the present embodiment, it is neither parallel to nor perpendicular to the reference surface 38a (plane 32a). In the present embodiment, the third surface 56 shows an example in which the cross section is linear, but the cross section may be curved.

砥石部14は、例えばダイヤモンド粉を含む円環状の焼成体として形成される。砥石部14は、1対の端面62a,62bと、内周面64と、外周面66とを有する。一方の端面62aは、フランジ部42に当接する。他方の端面62bの法線は、例えば刻印面34bと同じ法線方向を向く。砥石部14の外周面66には、それぞれ円環状の複数の面取り溝68が形成されている。本実施形態では、中心軸Cの軸方向に沿って9つの面取り溝68が、面取りホイール10の厚さ方向に所定ピッチに形成されている。各面取り溝68は、被研体の面取り面の形状や粗さによって適宜、仕上げの工程を設けることにより、同一の形状や粒度でなくても良い。 The grindstone portion 14 is formed as an annular fired body containing, for example, diamond powder. The grindstone portion 14 has a pair of end faces 62a and 62b, an inner peripheral surface 64, and an outer peripheral surface 66. One end surface 62a abuts on the flange portion 42. The normal of the other end surface 62b faces, for example, the same normal direction as the engraved surface 34b. A plurality of annular chamfer grooves 68 are formed on the outer peripheral surface 66 of the grindstone portion 14, respectively. In the present embodiment, nine chamfer grooves 68 are formed at a predetermined pitch in the thickness direction of the chamfer wheel 10 along the axial direction of the central axis C. Each chamfered groove 68 does not have to have the same shape and grain size by appropriately providing a finishing step depending on the shape and roughness of the chamfered surface of the object to be studied.

次に、面取りホイール10の製造方法について図4から図17を用いて説明する。図4から図17に示す例では、適宜の工作機械に取り付ける工具T1-T8を用いる例について説明する。工具T1-T8は、必ずしも8つの工具を使用するのではなく、適宜に同一の工具を使用し得る。 Next, a method of manufacturing the chamfer wheel 10 will be described with reference to FIGS. 4 to 17. In the examples shown in FIGS. 4 to 17, an example using tools T1-T8 to be attached to an appropriate machine tool will be described. The tools T1-T8 do not necessarily use eight tools, but the same tool may be used as appropriate.

図4に示すように、例えば円柱状で、面取りホイール10の円盤12と同じ素材で形成される母材100を準備する。母材100の外径は、面取りホイール10の円盤12の外側外周面42aの外径と同じか、それよりも大きく形成されている。母材100から、例えば複数の面取りホイール10の円盤12を所定の厚さとなるように切り出す(工程1)。図4に示す母材100からは、複数の面取りホイール10の円盤12を形成することができる。 As shown in FIG. 4, for example, a base material 100 having a columnar shape and made of the same material as the disk 12 of the chamfer wheel 10 is prepared. The outer diameter of the base metal 100 is formed to be the same as or larger than the outer diameter of the outer outer peripheral surface 42a of the disk 12 of the chamfer wheel 10. For example, a disk 12 of a plurality of chamfered wheels 10 is cut out from the base material 100 so as to have a predetermined thickness (step 1). From the base material 100 shown in FIG. 4, a disk 12 of a plurality of chamfered wheels 10 can be formed.

図5に示すように、円盤12に対し、回転軸部品80,90を通す嵌合穴部24をある工作機械に取り付けた工具T1により粗加工するとともに、ある工作機械に取り付けた工具T2により外周面36を粗加工する(工程2)。 As shown in FIG. 5, the fitting hole portion 24 for passing the rotary shaft parts 80 and 90 is roughly machined on the disk 12 by the tool T1 attached to a certain machine tool, and the outer circumference is formed by the tool T2 attached to a certain machine tool. Roughing the surface 36 (step 2).

図6に示すように、円盤12の1対の側面38a,38bの他方の側面38bをある工作機械に取り付けた工具T3により仮基準面とするとともに、その他方の側面38bを製造番号や製造メーカ等の刻印面として加工する。また、回転軸部品80,90を通す嵌合穴部24の内径を、ある工作機械に取り付けた工具T4により大きくする加工を行う(工程3)。このときの嵌合穴部24の内径は、回転軸部品80,90の所定の内径よりも小さい。仮基準面(刻印面)38b、嵌合穴部24の加工工程は、粗加工を行うときに行うことができる。このため、仮基準面(刻印面)38b、嵌合穴部24の加工工程は、不要となり得る。 As shown in FIG. 6, the other side surface 38b of the pair of side surfaces 38a and 38b of the disk 12 is used as a temporary reference surface by a tool T3 attached to a machine tool, and the other side surface 38b is used as a serial number or a manufacturer. It is processed as an engraved surface such as. Further, the inner diameter of the fitting hole portion 24 through which the rotary shaft parts 80 and 90 are passed is increased by the tool T4 attached to a certain machine tool (process 3). The inner diameter of the fitting hole portion 24 at this time is smaller than the predetermined inner diameters of the rotary shaft components 80 and 90. The processing step of the temporary reference surface (engraved surface) 38b and the fitting hole portion 24 can be performed when rough processing is performed. Therefore, the processing step of the temporary reference surface (engraved surface) 38b and the fitting hole portion 24 may be unnecessary.

図7に示すように、例えば、円盤12の外周面36のうち、内側外周面44として形成する位置の外側を、ある工作機械で仮基準面38b側から保持する。すなわち、円盤12を反転させる。そして、円盤12の仮基準面38bとは反対側の面を基準面とするように、その工作機械に取り付けた工具T5により、側面38aを形成する。一例として、同一の工作機械で円盤12を保持した状態を維持しながら円盤12に対して同軸加工を行うことにより、平面32a及び円環状面34aを合わせた側面38aが面一の基準面として形成される。
また、円盤12の外周面36を刻印面38b側から保持した状態を維持しながら、回転軸部品80,90を通す嵌合穴部24を基準面38aと同軸加工により、その工作機械に取り付けた工具T6により、形成する。また、円盤12の外周面36を刻印面38b側から保持した状態を維持しながら、基準面38aに、円環状の芯出し溝26を、基準面38aと同軸加工により、その工作機械に取り付けた工具T7により、形成する。
すなわち、ここでは、円盤12の外周面36を1対の側面38a,38bの他方側である刻印面38b側から保持した状態で、円盤12の中心軸Cが共通な状態を確保した状態で、基準面38a、嵌合穴部24、及び、芯出し溝26を、ある工作機械に取り付けた工具T5,T6,T7で同軸加工により形成する(工程4)。同一の工作機械で円盤12を保持した状態を維持しながら円盤12に対して同軸加工を行うことにより、基準面38aに対して、嵌合穴部24の内周面が直交する状態に形成される。また、この加工により、円盤12の中心軸Cが規定される。
嵌合穴部24、及び、芯出し溝26は、同時に複数の工具T6,T7で加工される同時加工で形成されることが好適である。嵌合穴部24、及び、芯出し溝26は、同時に加工されず、順不同に加工されてもよい。
As shown in FIG. 7, for example, of the outer peripheral surface 36 of the disk 12, the outside of the position formed as the inner outer peripheral surface 44 is held by a machine tool from the temporary reference surface 38b side. That is, the disk 12 is inverted. Then, the side surface 38a is formed by the tool T5 attached to the machine tool so that the surface of the disk 12 opposite to the temporary reference surface 38b is used as the reference surface. As an example, by performing coaxial processing on the disk 12 while maintaining the state in which the disk 12 is held by the same machine tool, the side surface 38a in which the flat surface 32a and the annular surface 34a are combined is formed as a flush reference surface. Will be done.
Further, while maintaining the state in which the outer peripheral surface 36 of the disk 12 is held from the engraved surface 38b side, the fitting hole portion 24 through which the rotating shaft parts 80 and 90 are passed is attached to the machine tool by coaxial processing with the reference surface 38a. It is formed by the tool T6. Further, while maintaining the state in which the outer peripheral surface 36 of the disk 12 is held from the engraved surface 38b side, an annular centering groove 26 is attached to the reference surface 38a by coaxial processing with the reference surface 38a. It is formed by the tool T7.
That is, here, the outer peripheral surface 36 of the disk 12 is held from the engraved surface 38b side, which is the other side of the pair of side surfaces 38a and 38b, and the central axis C of the disk 12 is secured in a common state. The reference surface 38a, the fitting hole portion 24, and the centering groove 26 are formed by coaxial processing with tools T5, T6, and T7 attached to a certain machine tool (step 4). By performing coaxial processing on the disk 12 while maintaining the state in which the disk 12 is held by the same machine tool, the inner peripheral surface of the fitting hole portion 24 is formed so as to be orthogonal to the reference surface 38a. Orthogonal. Further, by this processing, the central axis C of the disk 12 is defined.
It is preferable that the fitting hole portion 24 and the centering groove 26 are formed by simultaneous machining with a plurality of tools T6 and T7 at the same time. The fitting hole portion 24 and the centering groove 26 may not be machined at the same time and may be machined in any order.

図3に示す芯出し溝26の第1の面52、第2の面54及び第3の面56は、基準面38a、及び、嵌合穴部24と同軸加工により形成される。このため、第1の面52は、基準面38aに垂直で、嵌合穴部24の内周面に平行な状態に形成され、第2の面54は、基準面38aに平行で、嵌合穴部24の内周面に垂直な状態に形成される。 The first surface 52, the second surface 54, and the third surface 56 of the centering groove 26 shown in FIG. 3 are formed by coaxial processing with the reference surface 38a and the fitting hole portion 24. Therefore, the first surface 52 is formed so as to be perpendicular to the reference surface 38a and parallel to the inner peripheral surface of the fitting hole portion 24, and the second surface 54 is parallel to the reference surface 38a and is fitted. It is formed in a state perpendicular to the inner peripheral surface of the hole portion 24.

なお、例えば、図5に示す工程2から図7に示す工程4まで、同じ工作機械を用いて円盤12を加工することが好適である。 For example, from step 2 shown in FIG. 5 to step 4 shown in FIG. 7, it is preferable to machine the disk 12 using the same machine tool.

円盤12の外周面36を刻印面38b側から保持した状態から、基準面38a側から保持する状態に、ある工作機械での保持状態を変更する。すなわち、円盤12の外周面36のうち、外側外周面42aとなる位置の外側をその工作機械で、基準面38a側から保持する。そして、図8に示すように、円盤12の外周面36を刻印面38b側から、その工作機械に取り付けた工具T8を用いて切削加工する(工程5)。そして、円盤12の外周面36に、基準面38a側のフランジ部42と、刻印面38b側の内側外周面44とを形成する。 The holding state of a machine tool is changed from the state where the outer peripheral surface 36 of the disk 12 is held from the engraved surface 38b side to the state where the disk 12 is held from the reference surface 38a side. That is, of the outer peripheral surface 36 of the disk 12, the outside of the position to be the outer outer peripheral surface 42a is held by the machine tool from the reference surface 38a side. Then, as shown in FIG. 8, the outer peripheral surface 36 of the disk 12 is cut from the engraved surface 38b side using the tool T8 attached to the machine tool (step 5). Then, a flange portion 42 on the reference surface 38a side and an inner outer peripheral surface 44 on the engraved surface 38b side are formed on the outer peripheral surface 36 of the disk 12.

図9に示すように、例えばダイヤモンド粉を焼結させた円環状の砥石部14を、刻印面38b側から、フランジ部42に向かって嵌める。砥石部14の内周面を、内側外周面44に例えば接着して固定する(工程6)。このとき、砥石部14の基準面38a側の端面62aを、フランジ部42に当接させる。このため、砥石部14は、フランジ部42により、位置決めされる。砥石部14の刻印面38b側の端面62bは、刻印面38bに対して突出していてもよい。また、砥石部14の外周面66は、例えば円盤12の外側外周面42aに対して径方向外側に位置する。 As shown in FIG. 9, for example, an annular grindstone portion 14 obtained by sintering diamond powder is fitted from the engraved surface 38b side toward the flange portion 42. For example, the inner peripheral surface of the grindstone portion 14 is adhered and fixed to the inner outer peripheral surface 44 (step 6). At this time, the end surface 62a on the reference surface 38a side of the grindstone portion 14 is brought into contact with the flange portion 42. Therefore, the grindstone portion 14 is positioned by the flange portion 42. The end surface 62b on the engraved surface 38b side of the grindstone portion 14 may protrude from the engraved surface 38b. Further, the outer peripheral surface 66 of the grindstone portion 14 is located on the outer side in the radial direction with respect to the outer outer peripheral surface 42a of the disk 12, for example.

円盤12の内側外周面44に砥石部14が固定された後、図10に示すように、例えば面取りホイール10を所定の方向R1に回転させるとともに、別の砥石72を所定方向R2に回転させて、砥石部14の刻印面38b側の端面62bを研削加工し、砥石部14の刻印面38b側の端面62bを平面とする(工程7)。方向R1は、中心軸Cの軸回り方向である。方向R2は、砥石72の中心軸(円盤12の中心軸Cと直交する)C1の軸回り方向である。このとき、必要に応じて、砥石72を方向D1、及び、方向D1と反対側の方向D2に動かす。方向D1,D2は、中心軸Cに直交し、砥石72の中心軸に平行である。 After the grindstone portion 14 is fixed to the inner outer peripheral surface 44 of the disk 12, for example, the chamfer wheel 10 is rotated in a predetermined direction R1 and another grindstone 72 is rotated in a predetermined direction R2 as shown in FIG. The end surface 62b on the engraved surface 38b side of the grindstone portion 14 is ground, and the end surface 62b on the engraved surface 38b side of the grindstone portion 14 is made flat (step 7). The direction R1 is an axial direction of the central axis C. The direction R2 is the axial direction of the central axis (orthogonal to the central axis C of the disk 12) C1 of the grindstone 72. At this time, if necessary, the grindstone 72 is moved in the direction D1 and the direction D2 opposite to the direction D1. The directions D1 and D2 are orthogonal to the central axis C and parallel to the central axis of the grindstone 72.

図11に示すように、この状態の面取りホイール10に、加工軸として回転軸部品(同軸アーバー)80を組み込む。そして、回転軸部品80と円盤12との芯出し作業を行う(工程8)。芯出し作業は、距離検出センサS1,S2を用いて行う。ここでは、2つの距離検出センサS1,S2を用いる例について説明するが、1つのセンサで外周振れ及び側面振れの両方に検出するようにしてもよい。 As shown in FIG. 11, a rotary shaft component (coaxial arbor) 80 is incorporated as a machining shaft into the chamfer wheel 10 in this state. Then, the centering work of the rotary shaft component 80 and the disk 12 is performed (step 8). The centering work is performed using the distance detection sensors S1 and S2. Here, an example using two distance detection sensors S1 and S2 will be described, but one sensor may detect both the outer peripheral runout and the side runout.

芯出し作業では、例えば、図12に示すように、第1に、第1の距離検出センサS1として例えばダイヤルゲージを芯出し溝26の第1の面52に当接させた状態で回転軸部品80を回転させ、芯出し溝26の第1の面52の振れを検出する。第1の面52は円盤12の外周面36及び砥石部14の外周面66よりも精度よく形成されているため、第1の面52の振れは、円盤12の外周面36及び砥石部14の外周面66の振れ(外周振れ)と同視できる。芯出し作業では、例えば図13に示すように、第2に、第2の距離検出センサS2として例えばダイヤルゲージを芯出し溝26の第2の面54に当接させた状態で回転軸部品80を回転させ、芯出し溝26の第2の面54の振れを検出する。第2の面54は基準面38aと同軸加工により形成されているため、第2の面54の振れは、円盤12の側面である基準面38aの振れ(側面振れ)と同視できる。円盤12の外周振れ及び側面振れを検出後、必要に応じて、回転軸部品80に対する円盤12の取り付け状態の調整を行う。すなわち、ダイヤルゲージ(距離検出センサ)S1で検出される、回転軸部品80に対する第1の面52の振れに基づいて、回転軸部品80に対する円盤12の取り付け状態の調整を行う。また、ダイヤルゲージ(距離検出センサ)S2で検出される、回転軸部品80に対する第2の面54の振れに基づいて、回転軸部品80に対する円盤12の取り付け状態の調整を行う。このように、回転軸部品80と円盤12との取り付け状態の調整を行う芯出し作業により、回転軸部品80及び面取りホイール10の中心軸Cの同軸度、面取りホイール10の基準面38aに対する回転軸部品80の中心軸の直角度、面取りホイールの基準面38aに対する嵌合穴部24の面の直角度が確保される。
なお、円盤12の外周振れ及び側面振れを検出するとき、円盤12を固定し、距離検出センサS1,S2を円環状に動かしてもよい。このため、円盤12の外周振れ及び側面振れを検出するとき、距離検出センサS1を芯出し溝26の第1の面52に対して周方向に相対的に移動させ、回転軸部品80に対する円盤12の振れ(外周振れ)に基づいて、円盤12の位置を調整し、距離検出センサS1又は別の距離検出センサS2を芯出し溝26の第2の面54に対して周方向に相対的に移動させ、回転軸部品80に対する円盤12の基準面38aの振れ(側面振れ)に基づいて、円盤12の位置を調整することが好適である。
In the centering operation, for example, as shown in FIG. 12, first, as the first distance detection sensor S1, for example, the rotary shaft component in a state where the dial gauge is in contact with the first surface 52 of the centering groove 26. The 80 is rotated to detect the runout of the first surface 52 of the centering groove 26. Since the first surface 52 is formed more accurately than the outer peripheral surface 36 of the disk 12 and the outer peripheral surface 66 of the grindstone portion 14, the runout of the first surface 52 is caused by the outer peripheral surface 36 of the disk 12 and the grindstone portion 14. It can be equated with the runout of the outer peripheral surface 66 (outer peripheral runout). In the centering operation, for example, as shown in FIG. 13, secondly, as the second distance detection sensor S2, for example, the rotary shaft component 80 is in contact with the second surface 54 of the centering groove 26. Is rotated to detect the runout of the second surface 54 of the centering groove 26. Since the second surface 54 is formed by coaxial processing with the reference surface 38a, the runout of the second surface 54 can be equated with the runout (side runout) of the reference surface 38a which is the side surface of the disk 12. After detecting the outer peripheral runout and the side runout of the disk 12, the mounting state of the disk 12 with respect to the rotating shaft component 80 is adjusted as necessary. That is, the mounting state of the disk 12 with respect to the rotating shaft component 80 is adjusted based on the deflection of the first surface 52 with respect to the rotating shaft component 80 detected by the dial gauge (distance detection sensor) S1. Further, based on the deflection of the second surface 54 with respect to the rotary shaft component 80 detected by the dial gauge (distance detection sensor) S2, the mounting state of the disk 12 with respect to the rotary shaft component 80 is adjusted. In this way, by the centering work for adjusting the mounting state of the rotary shaft component 80 and the disk 12, the coaxiality of the central shaft C of the rotary shaft component 80 and the chamfer wheel 10 and the rotary shaft with respect to the reference surface 38a of the chamfer wheel 10 The squareness of the central axis of the component 80 and the squareness of the surface of the fitting hole 24 with respect to the reference surface 38a of the chamfered wheel are secured.
When detecting the outer peripheral runout and the side runout of the disk 12, the disk 12 may be fixed and the distance detection sensors S1 and S2 may be moved in an annular shape. Therefore, when detecting the outer peripheral runout and the side runout of the disk 12, the distance detection sensor S1 is moved relative to the first surface 52 of the centering groove 26 in the circumferential direction, and the disk 12 with respect to the rotary shaft component 80. The position of the disk 12 is adjusted based on the runout (outer runout), and the distance detection sensor S1 or another distance detection sensor S2 is moved relative to the second surface 54 of the centering groove 26 in the circumferential direction. It is preferable to adjust the position of the disk 12 based on the runout (side runout) of the reference surface 38a of the disk 12 with respect to the rotating shaft component 80.

図14に示すように、回転軸部品80を組み込み、芯出し作業を行った面取りホイール10の砥石部14の外周面66の外径を別の砥石74を用いて、一定にする加工を行う(工程9)。例えば、面取りホイール10を所定の方向R3の軸回りに回転させるとともに、砥石74を所定の方向R4の軸回りに回転させながら砥石74を方向D3及び方向D3と反対側の方向D4に往復移動させる。このとき、面取りホイール10の中心軸Cと、砥石74の中心軸C2とは平行であり、方向D3,D4は中心軸Cに平行である。 As shown in FIG. 14, the rotary shaft component 80 is incorporated, and the outer diameter of the outer peripheral surface 66 of the grindstone portion 14 of the chamfered wheel 10 that has been centered is made constant by using another grindstone 74 (. Step 9). For example, the chamfering wheel 10 is rotated around the axis of the predetermined direction R3, and the grindstone 74 is reciprocated in the direction D3 and the direction D4 opposite to the direction D3 while rotating the grindstone 74 around the axis of the predetermined direction R4. .. At this time, the central axis C of the chamfer wheel 10 and the central axis C2 of the grindstone 74 are parallel, and the directions D3 and D4 are parallel to the central axis C.

図15に示すように、その後、図12に示す円盤12の外周振れ、図13に示す円盤12の側面振れの確認を行い、回転軸部品80と面取りホイール10の同軸度、及び、直角度を確保する芯出し作業を再び行う(工程10)。 As shown in FIG. 15, after that, the outer peripheral runout of the disk 12 shown in FIG. 12 and the side runout of the disk 12 shown in FIG. 13 are confirmed, and the coaxiality and the squareness of the rotary shaft component 80 and the chamfer wheel 10 are determined. Perform the securing centering work again (step 10).

図16に示すように、砥石部14の外周面66に、放電加工用電極76を用いて、各種板状部材(図示せず)のエッジの面取り用の面取り溝(製品溝)68を加工する(工程11)。このとき、面取りホイール10の中心軸Cと、放電加工用電極76の中心軸C3とは平行である。 As shown in FIG. 16, a chamfering groove (product groove) 68 for chamfering the edges of various plate-shaped members (not shown) is machined on the outer peripheral surface 66 of the grindstone portion 14 by using the electric discharge machining electrode 76. (Step 11). At this time, the central axis C of the chamfer wheel 10 and the central axis C3 of the electric discharge machining electrode 76 are parallel to each other.

図17に示すように、面取りホイール10の面取り溝(製品溝)68にドレス(目立て)作業を行う(工程12)。このため、面取りホイール10の面取り溝(製品溝)68は、各種板状部材(図示せず)のエッジの面取りをするときに、所望の性能を発揮する。 As shown in FIG. 17, a dressing operation is performed on the chamfered groove (product groove) 68 of the chamfered wheel 10 (step 12). Therefore, the chamfered groove (product groove) 68 of the chamfered wheel 10 exhibits desired performance when chamfering the edges of various plate-shaped members (not shown).

最後に、回転軸部品80に対して面取りホイール10を取り外し、出荷検査を行う。ここでは、面取り溝(製品溝)68の加工形状検査、寸法検査、及び、面取りホイール10の全体の寸法検査を行う。 Finally, the chamfer wheel 10 is removed from the rotating shaft component 80, and a shipping inspection is performed. Here, the processing shape inspection of the chamfered groove (product groove) 68, the dimensional inspection, and the dimensional inspection of the entire chamfered wheel 10 are performed.

以上のようにして、面取りホイール10が製造され、ユーザに出荷される。 As described above, the chamfer wheel 10 is manufactured and shipped to the user.

以下、例えばユーザが行う、製造メーカから出荷された面取りホイール10の使用前調整方法について図18を用いて説明する。 Hereinafter, a pre-use adjustment method for the chamfered wheel 10 shipped from the manufacturer, which is performed by a user, will be described with reference to FIG.

例えば、板状体のエッジを面取りしたい面取りホイール10のユーザは、面取りホイール10の嵌合穴部24を所定の回転軸部品90に嵌合させる。そして、ユーザは、回転軸部品90と円盤12との芯出し作業を行う。芯出し作業は、距離検出センサS1,S2を用いて行う。距離検出センサとして、上述した例では、ダイヤルゲージS1,S2を用いる例について説明したが、芯出し溝26の第1の面52及び第2の面54に対して非接触で距離を検出可能な光学センサを用いてもよい。 For example, a user of a chamfered wheel 10 who wants to chamfer the edge of a plate-shaped body fits a fitting hole portion 24 of the chamfered wheel 10 into a predetermined rotating shaft component 90. Then, the user performs the centering work of the rotary shaft component 90 and the disk 12. The centering work is performed using the distance detection sensors S1 and S2. In the above-mentioned example, the dial gauges S1 and S2 are used as the distance detection sensor, but the distance can be detected without contacting the first surface 52 and the second surface 54 of the centering groove 26. An optical sensor may be used.

図12及び図13に示すように、円盤12の外周振れ及び側面振れを確認後、必要に応じて、回転軸部品90と円盤12との取り付け状態の調整を行う。このように、回転軸部品90と円盤12との取り付け状態の調整を行う芯出し作業により、回転軸部品90及び面取りホイール10の中心軸Cの同軸度、面取りホイール10の基準面38aに対する回転軸部品90の中心軸の直角度、及び、回転軸部品90の外周面に対する嵌合穴部24の内周面の直角度が確保される。 As shown in FIGS. 12 and 13, after confirming the outer peripheral runout and the side runout of the disk 12, the mounting state of the rotary shaft component 90 and the disk 12 is adjusted as necessary. In this way, by the centering work for adjusting the mounting state of the rotary shaft component 90 and the disk 12, the coaxiality of the rotary shaft component 90 and the central axis C of the chamfer wheel 10 and the rotary shaft with respect to the reference surface 38a of the chamfer wheel 10 The squareness of the central axis of the component 90 and the squareness of the inner peripheral surface of the fitting hole portion 24 with respect to the outer peripheral surface of the rotary shaft component 90 are secured.

ユーザは、このように調整された面取りホイール10を用いて、各板状体のエッジをそれぞれ面取りする。面取りは、板状体が例えばウェハであれば、面取りホイール10と、ウェハとを相対的に移動させ、オリエンテーションフラットのエッジに対して行うことができる。また、ノッチを有するウェハのエッジに対して、面取りを行うことができる。 The user chamfers the edge of each plate-like body by using the chamfering wheel 10 adjusted in this way. If the plate-shaped body is, for example, a wafer, the chamfering can be performed by relatively moving the chamfering wheel 10 and the wafer to the edge of the orientation flat. Further, chamfering can be performed on the edge of the wafer having the notch.

砥石部14は、例えば適宜の回数使用後、又は、例えば所定の期間の経過後、メンテナンスされる。メンテナンス時、出荷先から面取りホイール10が、例えば面取りホイール10のメーカに戻される。
一例として、円盤12から砥石部14を取り外し、新たな砥石部14を円盤12の内側外周面44に接着して固定する。以下、工程7-工程12を順に行って、再度面取りホイール10を、例えば同じユーザに出荷する。このように、面取りホイール10の円盤12は、再利用可能である。なお、面取り溝68の形状は、メンテナンス時に顧客の指示に基づいて、メンテナンス前に対して変化させてもよい。
The grindstone portion 14 is maintained, for example, after being used an appropriate number of times, or, for example, after a predetermined period of time has elapsed. At the time of maintenance, the chamfered wheel 10 is returned from the shipping destination to, for example, the manufacturer of the chamfered wheel 10.
As an example, the grindstone portion 14 is removed from the disc 12, and a new grindstone portion 14 is adhered to and fixed to the inner outer peripheral surface 44 of the disc 12. Hereinafter, steps 7 to 12 are performed in order, and the chamfer wheel 10 is shipped to the same user again, for example. In this way, the disc 12 of the chamfer wheel 10 is reusable. The shape of the chamfered groove 68 may be changed at the time of maintenance based on the customer's instruction with respect to the shape before the maintenance.

本実施形態により製造される面取りホイール10の円盤体22の基準面38a(平面32a)、嵌合穴部24、及び、芯出し溝26は、ある工作機械で円盤体22を保持した状態を維持した状態で同軸加工により実施される。基準面38a(平面32a)、嵌合穴部24、及び、芯出し溝26の形成のとき、一度も、円盤体22の外周面36の保持状態を変更しない。このため、嵌合穴部24の内周面、及び、芯出し溝26の第1の面52及び第2の面54は、工作機械に依存する所望の同軸度及び真円度が得られる。 The reference surface 38a (flat surface 32a), the fitting hole portion 24, and the centering groove 26 of the disk body 22 of the chamfered wheel 10 manufactured according to the present embodiment maintain the state in which the disk body 22 is held by a certain machine tool. It is carried out by coaxial processing in this state. When the reference surface 38a (flat surface 32a), the fitting hole portion 24, and the centering groove 26 are formed, the holding state of the outer peripheral surface 36 of the disk body 22 is never changed. Therefore, the inner peripheral surface of the fitting hole portion 24 and the first surface 52 and the second surface 54 of the centering groove 26 can obtain desired coaxiality and roundness depending on the machine tool.

面取りホイール10を回転させたときに、砥石部14の外周面66は、砥粒の突出により、真円とはならない。このため、砥石部14の外周面66をダイヤルゲージ等で測定しても、測定のバラツキの影響を受けやすい。本実施形態では、芯出し溝26の第1の面52を用いて、外周振れを測定する。このとき、第1の面52は、嵌合穴部24の内周面と同軸度を確保するように形成されているので、砥石部14の外周面66を測定する場合に比べて、はるかに高精度に外周振れの測定精度を得ることができる。したがって、本実施形態によれば、基準面38a(平面32a)に直交する第1の面52及び平行な第2の面54を有する芯出し溝26があるため、芯出し溝26がない場合に比べて、はるかに高い精度で、芯出し作業を行うことができる。
面取りホイール10を回転させたときに、砥石部14の外周面66の端面62bは、砥粒の突出により、平面とはならない。このため、砥石部14の外周面66の端面62bの側面振れ(平面度)をダイヤルゲージ等で測定しても、測定のバラツキの影響を受けやすい。本実施形態では、芯出し溝26の第2の面54を用いて、側面振れを測定する。このとき、芯出し溝26の第2の面54は、嵌合穴部24の内周面と直角度を確保するように形成されているので、砥石部14の外周面66の端面62bを測定する場合に比べて、はるかに高精度に側面振れの測定精度を得ることができる。したがって、本実施形態によれば、基準面38a(平面32a)に直交する第1の面52及び平行な第2の面54を有する芯出し溝26があるため、芯出し溝26がない場合に比べて、はるかに高い精度で、芯出し作業を行うことができる。
When the chamfer wheel 10 is rotated, the outer peripheral surface 66 of the grindstone portion 14 does not become a perfect circle due to the protrusion of the abrasive grains. Therefore, even if the outer peripheral surface 66 of the grindstone portion 14 is measured with a dial gauge or the like, it is easily affected by the variation in measurement. In the present embodiment, the outer peripheral runout is measured using the first surface 52 of the centering groove 26. At this time, since the first surface 52 is formed so as to secure coaxiality with the inner peripheral surface of the fitting hole portion 24, it is far more than the case where the outer peripheral surface 66 of the grindstone portion 14 is measured. It is possible to obtain the measurement accuracy of the outer peripheral runout with high accuracy. Therefore, according to the present embodiment, since there is a centering groove 26 having a first surface 52 orthogonal to the reference surface 38a (plane 32a) and a second surface 54 parallel to the reference surface 38a, there is no centering groove 26. In comparison, centering work can be performed with much higher accuracy.
When the chamfer wheel 10 is rotated, the end surface 62b of the outer peripheral surface 66 of the grindstone portion 14 does not become flat due to the protrusion of the abrasive grains. Therefore, even if the side surface runout (flatness) of the end surface 62b of the outer peripheral surface 66 of the grindstone portion 14 is measured with a dial gauge or the like, it is easily affected by the variation in the measurement. In the present embodiment, the side runout is measured using the second surface 54 of the centering groove 26. At this time, since the second surface 54 of the centering groove 26 is formed so as to secure a squareness with the inner peripheral surface of the fitting hole portion 24, the end surface 62b of the outer peripheral surface 66 of the grindstone portion 14 is measured. It is possible to obtain the measurement accuracy of the side runout with much higher accuracy than in the case of the above. Therefore, according to the present embodiment, since there is a centering groove 26 having a first surface 52 orthogonal to the reference surface 38a (plane 32a) and a second surface 54 parallel to the reference surface 38a, there is no centering groove 26. In comparison, centering work can be performed with much higher accuracy.

本実施形態では、図11から図14に示すように、砥石部14の外周面66を加工する前に、芯出し作業を行う。このため、回転軸部品80を組み込んだ面取りホイール10を回転させて、別の砥石74で砥石部14の外周面66を研削するときに、真円度が高い砥石部14の外周面66が形成される。 In the present embodiment, as shown in FIGS. 11 to 14, centering work is performed before processing the outer peripheral surface 66 of the grindstone portion 14. Therefore, when the chamfering wheel 10 incorporating the rotary shaft component 80 is rotated and the outer peripheral surface 66 of the grindstone portion 14 is ground by another grindstone 74, the outer peripheral surface 66 of the grindstone portion 14 having high roundness is formed. Will be done.

本実施形態では、図15及び図16に示すように、砥石部14の外周面66に面取り溝68を加工する前に、芯出し作業を行う。このため、回転軸部品80を組み込んだ面取りホイール10を回転させて、放電加工用電極76で砥石部14の外周面66に面取り溝68を形成するときに、砥石部14の外周面66に対する深さを一定に保ちやすい。
そして、面取りホイール10の面取り溝68を形成する前に、芯出し作業を行うことにより、回転軸部品80と面取りホイール10の円盤12との間、回転軸部品80と面取りホイール10の面取り溝68との間には、所望の同軸度及び真円度が得られる。このため、面取りホイール10の面取り溝68に対する回転軸部品80の当接具合が良好となる結果、面取りホイール10を長寿命化することができるとともに、面取り溝68にチッピングが生じることを抑制することができる。
In the present embodiment, as shown in FIGS. 15 and 16, centering work is performed before the chamfering groove 68 is formed on the outer peripheral surface 66 of the grindstone portion 14. Therefore, when the chamfering wheel 10 incorporating the rotary shaft component 80 is rotated to form the chamfering groove 68 on the outer peripheral surface 66 of the grindstone portion 14 by the discharge processing electrode 76, the depth of the grindstone portion 14 with respect to the outer peripheral surface 66 is formed. It is easy to keep the wheel constant.
Then, by performing the centering work before forming the chamfering groove 68 of the chamfering wheel 10, the chamfering groove 68 of the rotating shaft component 80 and the chamfering wheel 10 is between the rotating shaft component 80 and the disk 12 of the chamfering wheel 10. The desired coaxiality and roundness can be obtained between and. Therefore, as a result of improving the contact condition of the rotary shaft component 80 with the chamfered groove 68 of the chamfered wheel 10, the life of the chamfered wheel 10 can be extended and the chipping of the chamfered groove 68 can be suppressed. Can be done.

本実施形態では、図18に示すように、砥石部14の外周面66の面取り溝68で板状体のエッジを加工する前に、芯出し作業を行う。このため、回転軸部品90を組み込んだ面取りホイール10を回転させたときに、寸法誤差を抑制することができる。 In the present embodiment, as shown in FIG. 18, centering work is performed before the edge of the plate-like body is machined in the chamfered groove 68 of the outer peripheral surface 66 of the grindstone portion 14. Therefore, when the chamfered wheel 10 incorporating the rotating shaft component 90 is rotated, a dimensional error can be suppressed.

本実施形態に係る面取りホイール10の製造方法を用い、芯出し溝26を形成する場合、より高精度に加工可能な工作機械を導入する必要がない。したがって、製造コストを抑制しながら、長寿命化可能な面取りホイール10を提供することができる。 When the centering groove 26 is formed by using the method for manufacturing the chamfered wheel 10 according to the present embodiment, it is not necessary to introduce a machine tool capable of processing with higher accuracy. Therefore, it is possible to provide a chamfered wheel 10 capable of extending the service life while suppressing the manufacturing cost.

本実施形態では、円盤12の中心軸Cから遠位の位置から近位の位置に向かって、第1の面52、第2の面54、第3の面56の順に配置されるが、反対であってもよい。本実施形態では、第1の面52の法線が中心軸Cに向かう例、すなわち、中心軸Cに対して径方向内方に向かう例について説明した。例えば、第3の面56の法線が、中心軸Cに対して径方向外方に向かうように形成されていてもよい。この場合、第3の面56を、外周振れ計測面としてもよい。第3の面56を外周振れ計測面とする場合、第1の面52は、基準面となる平面32aに平行でなく、垂直でもない面として形成されていてもよい。 In the present embodiment, the first surface 52, the second surface 54, and the third surface 56 are arranged in this order from the position distal to the position proximal to the central axis C of the disk 12, but the opposite. May be. In the present embodiment, an example in which the normal of the first surface 52 is directed toward the central axis C, that is, an example in which the normal line of the first surface 52 is directed inward in the radial direction with respect to the central axis C has been described. For example, the normal of the third surface 56 may be formed so as to be radially outward with respect to the central axis C. In this case, the third surface 56 may be used as the outer peripheral runout measurement surface. When the third surface 56 is used as the outer peripheral runout measurement surface, the first surface 52 may be formed as a surface that is neither parallel to nor perpendicular to the plane 32a serving as a reference surface.

本実施形態によれば、より精度よく形成する面取りホイールの製造方法、面取りホイール、及び、その面取りホイールの使用前調整方法を提供することができる。 According to the present embodiment, it is possible to provide a method for manufacturing a chamfered wheel, a chamfered wheel, and a method for adjusting the chamfered wheel before use, which are formed more accurately.

なお、本発明は、上記実施形態に限定されるものではなく、実施段階ではその要旨を逸脱しない範囲で種々に変形することが可能である。また、各実施形態は適宜組み合わせて実施してもよく、その場合組み合わせた効果が得られる。更に、上記実施形態には種々の発明が含まれており、開示される複数の構成要件から選択された組み合わせにより種々の発明が抽出され得る。例えば、実施形態に示される全構成要件からいくつかの構成要件が削除されても、課題が解決でき、効果が得られる場合には、この構成要件が削除された構成が発明として抽出され得る。
本願の出願当初の特許請求の範囲に記載された発明に相当する記載を以下に付記する。
[1]
円盤の1対の側面の一方の基準面、
前記円盤に回転軸部品が嵌合される嵌合穴部、
前記円盤が回転するとき前記円盤の外周面の振れを調整するための、円環状の芯出し溝の第1の面、及び、
前記第1の面に隣接し、前記円盤が回転するときの前記基準面の振れを調整するための、前記芯出し溝の第2の面
を同軸加工により同心状に形成することと、
前記円盤の外周面に砥石部を形成することと
を含む、面取りホイールの製造方法。
[2]
前記第1の面を、平面として形成される前記基準面に直交するように形成し、
前記第2の面を、前記基準面に平行となるように形成する、
付記1に記載の面取りホイールの製造方法。
[3]
1対の側面の一方を基準面とする円盤と、
前記基準面に対して直交する内周面を有し、前記円盤に回転軸部品が嵌合される嵌合穴部と、
前記基準面に設けられ、前記嵌合穴部の中心軸の軸回りに形成される円環状で凹状の芯出し溝と、
前記円盤の外周面に設けられる砥石部と、
を有し、
前記芯出し溝は、
前記基準面に対して直交し、前記円盤が前記回転軸部品の回転にしたがって回転するとき、前記円盤の前記外周面の振れを検出するための第1の面と、
前記基準面に平行で、前記円盤が前記回転軸部品の回転にしたがって回転するとき、前記基準面の振れを検出するための第2の面と
を有する、面取りホイール。
[4]
付記3に記載の面取りホイールの前記嵌合穴部に所定の回転軸部品を嵌め込むことと、
距離検出センサを前記芯出し溝の前記第1の面に対して周方向に相対的に移動させ、前記距離検出センサで検出される、前記回転軸部品に対する前記第1の面の振れに基づいて、前記回転軸部品に対する前記円盤の取り付け状態を調整することと、
前記距離検出センサ又は別の距離検出センサを前記芯出し溝の前記第2の面に対して周方向に相対的に移動させ、前記距離検出センサ又は前記別の距離検出センサで検出される、前記回転軸部品に対する前記第2の面の振れに基づいて、前記回転軸部品に対する前記円盤の取り付け状態を調整することと
を含む、面取りホイールの使用前調整方法。
The present invention is not limited to the above embodiment, and can be variously modified at the implementation stage without departing from the gist thereof. In addition, each embodiment may be carried out in combination as appropriate, in which case the combined effect can be obtained. Further, the above-described embodiment includes various inventions, and various inventions can be extracted by a combination selected from a plurality of disclosed constituent requirements. For example, even if some constituent elements are deleted from all the constituent elements shown in the embodiment, if the problem can be solved and the effect is obtained, the configuration in which the constituent elements are deleted can be extracted as an invention.
The description corresponding to the invention described in the claims at the time of filing the application of the present application is added below.
[1]
One reference plane on one pair of sides of the disk,
Fitting hole where the rotating shaft component is fitted to the disk,
The first surface of the annular centering groove for adjusting the runout of the outer peripheral surface of the disk when the disk rotates, and
The second surface of the centering groove adjacent to the first surface and for adjusting the runout of the reference surface when the disk rotates.
Is formed concentrically by coaxial processing,
To form a grindstone on the outer peripheral surface of the disk
How to make chamfered wheels, including.
[2]
The first surface is formed so as to be orthogonal to the reference surface formed as a plane.
The second surface is formed so as to be parallel to the reference surface.
The method for manufacturing a chamfered wheel according to Appendix 1.
[3]
A disk with one of the pair of sides as the reference surface,
A fitting hole portion having an inner peripheral surface orthogonal to the reference surface and into which a rotary shaft component is fitted to the disk,
An annular and concave centering groove provided on the reference surface and formed around the central axis of the fitting hole portion,
The grindstone portion provided on the outer peripheral surface of the disk and
Have,
The centering groove is
A first surface for detecting runout of the outer peripheral surface of the disk when the disk is orthogonal to the reference surface and rotates according to the rotation of the rotating shaft component.
A second surface for detecting runout of the reference surface when the disk rotates according to the rotation of the rotating shaft component in parallel with the reference surface.
Has a chamfered wheel.
[4]
Fitting a predetermined rotary shaft component into the fitting hole portion of the chamfered wheel described in Appendix 3 and
The distance detection sensor is moved relative to the first surface of the centering groove in the circumferential direction, and based on the runout of the first surface with respect to the rotary shaft component detected by the distance detection sensor. , Adjusting the mounting state of the disk with respect to the rotating shaft component,
The distance detection sensor or another distance detection sensor is moved relative to the second surface of the centering groove in the circumferential direction, and is detected by the distance detection sensor or the other distance detection sensor. To adjust the mounting state of the disk with respect to the rotating shaft component based on the runout of the second surface with respect to the rotating shaft component.
How to adjust the chamfer wheel before use, including.

10…面取りホイール、12…円盤、14…砥石部、22…円盤体、24…嵌合穴部、26…芯出し溝、32…ボス、32a…平面(基準面)、32b…平面、34a…円環状面、34b…円環状面(刻印面)、36…外周面、38a…側面(基準面)、38b…側面(刻印面)、42…フランジ部、42a…外側外周面、44…内側外周面、52…第1の面、54…第2の面、56…第3の面、S1,S2…距離検出センサ(ダイヤルゲージ) 10 ... chamfering wheel, 12 ... disk, 14 ... grindstone part, 22 ... disk body, 24 ... fitting hole part, 26 ... centering groove, 32 ... boss, 32a ... flat surface (reference surface), 32b ... flat surface, 34a ... Circular surface, 34b ... Circular surface (engraved surface), 36 ... Outer peripheral surface, 38a ... Side surface (reference surface), 38b ... Side surface (engraved surface), 42 ... Flange portion, 42a ... Outer outer peripheral surface, 44 ... Inner outer circumference Surface, 52 ... 1st surface, 54 ... 2nd surface, 56 ... 3rd surface, S1, S2 ... Distance detection sensor (dial gauge)

Claims (4)

面取りホイールの製造方法であって、
円盤の1対の側面の一方となる基準面、
前記円盤に回転軸部品が嵌合される嵌合穴部、
前記基準面に設けられ、前記面取りホイールが回転するとき前記面取りホイールの外周面の振れに対応する振れ検出し、前記円盤の位置を調整するときに用いる、円環状の芯出し溝の第1の面、及び、
前記基準面に設けられ、前記第1の面に隣接し、前記面取りホイールが回転するときの前記基準面の振れを検出し、前記円盤の位置を調整するときに用いる、前記芯出し溝の第2の面
工作機械で前記円盤を保持した状態を維持して、同軸加工を行い、前記芯出し溝を前記嵌合穴部の中心軸に対して同心状に形成し、前記第1の面及び前記第2の面の精度を確保することと、
前記円盤の外周面に円環状の砥石部を形成することと
を含む、面取りホイールの製造方法。
It is a method of manufacturing chamfered wheels.
A reference plane, which is one of a pair of sides of a disk,
Fitting hole where the rotating shaft component is fitted to the disk,
An annular centering groove provided on the reference surface and used for detecting runout corresponding to runout of the outer peripheral surface of the chamfer wheel when the chamfer wheel rotates and adjusting the position of the disk . Surface 1 and
The centering groove, which is provided on the reference surface, is adjacent to the first surface, detects the runout of the reference surface when the chamfer wheel rotates , and adjusts the position of the disk . The surface of 2 is maintained in a state where the disk is held by a machine tool, coaxial processing is performed, and the centering groove is formed concentrically with respect to the central axis of the fitting hole portion, and the first surface is formed. And to ensure the accuracy of the second surface ,
A method for manufacturing a chamfered wheel, which comprises forming an annular grindstone portion on the outer peripheral surface of the disk.
前記第1の面を、平面として形成される前記基準面に直交するように形成し、
前記第2の面を、前記基準面に平行となるように形成する、
請求項1に記載の面取りホイールの製造方法。
The first surface is formed so as to be orthogonal to the reference surface formed as a plane.
The second surface is formed so as to be parallel to the reference surface.
The method for manufacturing a chamfered wheel according to claim 1.
面取りホイールであって、
1対の側面の一方を基準面とする円盤と、
前記基準面に対して直交する内周面を有し、前記円盤に回転軸部品が嵌合される嵌合穴部と、
前記基準面に設けられ、前記嵌合穴部の中心軸と同心状に形成される円環状で凹状の芯出し溝と、
前記円盤の外周面に設けられる円環状の砥石部と、
を有し、
前記芯出し溝は、
前記基準面に対して直交し、前記面取りホイールが前記回転軸部品の回転にしたがって回転するとき、前記円盤の前記外周面又は前記砥石部の外周面に対応する振れを検出し、前記円盤の位置を調整するときに用いられる精度が確保された第1の面と、
前記第1の面に隣接し、前記基準面に平行で、前記面取りホイールが前記回転軸部品の回転にしたがって回転するとき、前記基準面の振れを検出し、前記円盤の位置を調整するときに用いられる精度が確保された第2の面と
を有する、面取りホイール。
It ’s a chamfered wheel.
A disk with one of the pair of sides as the reference surface,
A fitting hole portion having an inner peripheral surface orthogonal to the reference surface and into which a rotary shaft component is fitted to the disk,
An annular and concave centering groove provided on the reference surface and formed concentrically with the central axis of the fitting hole portion.
An annular grindstone portion provided on the outer peripheral surface of the disk, and
Have,
The centering groove is
When the chamfered wheel is orthogonal to the reference surface and rotates according to the rotation of the rotating shaft component, the runout corresponding to the outer peripheral surface of the disk or the outer peripheral surface of the grindstone portion is detected , and the position of the disk is detected. The first surface, which ensures the accuracy used when adjusting , and
When the chamfer wheel rotates according to the rotation of the rotating shaft component , adjacent to the first surface and parallel to the reference surface, when the runout of the reference surface is detected and the position of the disk is adjusted . A chamfered wheel with a second surface that ensures the accuracy used .
請求項3に記載の面取りホイールの前記嵌合穴部に所定の回転軸部品を嵌め込むことと、
前記回転軸部品を回転させることにより前記面取りホイールを前記回転軸部品と一緒に回転させて、距離検出センサを前記芯出し溝の前記第1の面に対して周方向に相対的に移動させ、前記距離検出センサで検出される、前記回転軸部品に対する前記第1の面の振れを検出することと、
前記回転軸部品を回転させることにより前記面取りホイールを前記回転軸部品と一緒に回転させて、前記距離検出センサ又は別の距離検出センサを前記芯出し溝の前記第2の面に対して周方向に相対的に移動させ、前記距離検出センサ又は前記別の距離検出センサで検出される、前記回転軸部品に対する前記第2の面の振れを検出することと
前記距離センサで検出される前記第1の面の振れの検出結果、及び、前記距離検出センサ又は前記別の距離検出センサで検出される前記第2の面の振れの検出結果に基づいて、前記回転軸部品と前記面取りホイールとの取り付け状態の調整を行うことと
を含む、面取りホイールの使用前調整方法。
Fitting a predetermined rotating shaft component into the fitting hole portion of the chamfered wheel according to claim 3.
By rotating the rotary shaft component, the chamfering wheel is rotated together with the rotary shaft component, and the distance detection sensor is moved relative to the first surface of the centering groove in the circumferential direction. To detect the runout of the first surface with respect to the rotating shaft component, which is detected by the distance detection sensor,
By rotating the rotary shaft component, the chamfering wheel is rotated together with the rotary shaft component, and the distance detection sensor or another distance detection sensor is rotated in the circumferential direction with respect to the second surface of the centering groove. To detect the runout of the second surface with respect to the rotating shaft component, which is detected by the distance detection sensor or the other distance detection sensor .
Based on the detection result of the runout of the first surface detected by the distance sensor and the detection result of the runout of the second surface detected by the distance detection sensor or the other distance detection sensor, the said To adjust the mounting state of the rotating shaft component and the chamfered wheel.
How to adjust the chamfer wheel before use, including.
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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006116686A (en) * 2004-10-25 2006-05-11 Asahi Diamond Industrial Co Ltd Superabrasive wheel
JP2010052084A (en) * 2008-08-27 2010-03-11 Asahi Diamond Industrial Co Ltd Blade with hub

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Publication number Priority date Publication date Assignee Title
CN111496699B (en) * 2020-06-10 2021-08-20 郑州磨料磨具磨削研究所有限公司 Optical curve grinding wheel and preparation method thereof

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006116686A (en) * 2004-10-25 2006-05-11 Asahi Diamond Industrial Co Ltd Superabrasive wheel
JP2010052084A (en) * 2008-08-27 2010-03-11 Asahi Diamond Industrial Co Ltd Blade with hub

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