JP7080867B2 - Ｓｎ－Ｂｉ－Ｉｎ系低融点接合部材、微小部材および半導体電子回路、バンプの製造方法ならびに半導体電子回路の実装方法 - Google Patents

Ｓｎ－Ｂｉ－Ｉｎ系低融点接合部材、微小部材および半導体電子回路、バンプの製造方法ならびに半導体電子回路の実装方法 Download PDF

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JP7080867B2
JP7080867B2 JP2019165701A JP2019165701A JP7080867B2 JP 7080867 B2 JP7080867 B2 JP 7080867B2 JP 2019165701 A JP2019165701 A JP 2019165701A JP 2019165701 A JP2019165701 A JP 2019165701A JP 7080867 B2 JP7080867 B2 JP 7080867B2
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Japan
Prior art keywords
plating
melting point
low melting
plated
mass
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JP2019165701A
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Japanese (ja)
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JP2021041430A5 (https=
JP2021041430A (ja
Inventor
弘敏 西
毅 沢井
謙一郎 城川
聡一朗 尾前
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Shinryo Corp
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Shinryo Corp
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Priority to JP2019165701A priority Critical patent/JP7080867B2/ja
Application filed by Shinryo Corp filed Critical Shinryo Corp
Priority to PCT/JP2020/033647 priority patent/WO2021049437A1/ja
Priority to EP20863183.8A priority patent/EP4029639A4/en
Priority to US17/641,568 priority patent/US20220395935A1/en
Priority to KR1020227011610A priority patent/KR20220055494A/ko
Priority to TW109131104A priority patent/TWI879799B/zh
Publication of JP2021041430A publication Critical patent/JP2021041430A/ja
Publication of JP2021041430A5 publication Critical patent/JP2021041430A5/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/241—Dispositions, e.g. layouts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

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  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2019165701A 2019-09-11 2019-09-11 Ｓｎ－Ｂｉ－Ｉｎ系低融点接合部材、微小部材および半導体電子回路、バンプの製造方法ならびに半導体電子回路の実装方法 Active JP7080867B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2019165701A JP7080867B2 (ja) 2019-09-11 2019-09-11 Ｓｎ－Ｂｉ－Ｉｎ系低融点接合部材、微小部材および半導体電子回路、バンプの製造方法ならびに半導体電子回路の実装方法
EP20863183.8A EP4029639A4 (en) 2019-09-11 2020-09-04 SN-BI BASED LOW MELTING POINT CONNECTOR, METHOD OF MANUFACTURE THEREOF, SEMICONDUCTOR ELECTRONIC CIRCUIT AND ASSEMBLY METHOD THEREOF
US17/641,568 US20220395935A1 (en) 2019-09-11 2020-09-04 Sn-bi-in-based low melting-point joining member, production method therefor, semiconductor electronic circuit, and mounting method therefor
KR1020227011610A KR20220055494A (ko) 2019-09-11 2020-09-04 Sn-Bi-In계 저융점 접합 부재 및 그 제조 방법, 및 반도체 전자 회로 및 그 실장 방법
PCT/JP2020/033647 WO2021049437A1 (ja) 2019-09-11 2020-09-04 Ｓｎ－Ｂｉ－Ｉｎ系低融点接合部材およびその製造方法、ならびに半導体電子回路およびその実装方法
TW109131104A TWI879799B (zh) 2019-09-11 2020-09-10 Ｓｎ－Ｂｉ－Ｉｎ系低熔點接合構件及其製造方法，以及半導體電子回路及其構裝方法

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Application Number Priority Date Filing Date Title
JP2019165701A JP7080867B2 (ja) 2019-09-11 2019-09-11 Ｓｎ－Ｂｉ－Ｉｎ系低融点接合部材、微小部材および半導体電子回路、バンプの製造方法ならびに半導体電子回路の実装方法

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JP2021041430A JP2021041430A (ja) 2021-03-18
JP2021041430A5 JP2021041430A5 (https=) 2022-01-20
JP7080867B2 true JP7080867B2 (ja) 2022-06-06

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Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7080939B2 (ja) * 2020-09-04 2022-06-06 株式会社新菱 低融点接合部材およびその製造方法ならびに半導体電子回路およびその実装方法
JP7590236B2 (ja) * 2021-03-17 2024-11-26 株式会社三共 遊技機
CN119952337A (zh) * 2025-03-03 2025-05-09 哈工大郑州研究院 一种低温软钎焊无铅钎料合金及其制备方法和应用

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000511466A (ja) 1996-05-10 2000-09-05 フォード、モーター、カンパニー ロウ組成
JP2001219267A (ja) 2000-02-09 2001-08-14 Nippon Macdermid Kk 錫−インジウム−ビスマスはんだ合金めっき層の形成方法
WO2008016140A1 (en) 2006-08-04 2008-02-07 Panasonic Corporation Bonding material, bonded portion and circuit board
JP5534122B1 (ja) 2014-02-04 2014-06-25 千住金属工業株式会社 核ボール、はんだペースト、フォームはんだ、フラックスコート核ボールおよびはんだ継手
WO2016056656A1 (ja) 2014-10-10 2016-04-14 石原ケミカル株式会社 合金バンプの製造方法
JP2018079480A (ja) 2016-11-14 2018-05-24 住友金属鉱山株式会社 低温用のＢｉ−Ｉｎ−Ｓｎ系はんだ合金、それを用いた電子部品実装基板及びその実装基板を搭載した装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5344607A (en) * 1993-06-16 1994-09-06 International Business Machines Corporation Lead-free, high tin, ternary solder alloy of tin, bismuth, and indium

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000511466A (ja) 1996-05-10 2000-09-05 フォード、モーター、カンパニー ロウ組成
JP2001219267A (ja) 2000-02-09 2001-08-14 Nippon Macdermid Kk 錫−インジウム−ビスマスはんだ合金めっき層の形成方法
WO2008016140A1 (en) 2006-08-04 2008-02-07 Panasonic Corporation Bonding material, bonded portion and circuit board
JP5534122B1 (ja) 2014-02-04 2014-06-25 千住金属工業株式会社 核ボール、はんだペースト、フォームはんだ、フラックスコート核ボールおよびはんだ継手
WO2016056656A1 (ja) 2014-10-10 2016-04-14 石原ケミカル株式会社 合金バンプの製造方法
JP2018079480A (ja) 2016-11-14 2018-05-24 住友金属鉱山株式会社 低温用のＢｉ−Ｉｎ−Ｓｎ系はんだ合金、それを用いた電子部品実装基板及びその実装基板を搭載した装置

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