JP7080152B2 - 回転角度検出装置及び回転角度検出方法、並びにこれらを用いた基板処理装置及び基板処理方法 - Google Patents
回転角度検出装置及び回転角度検出方法、並びにこれらを用いた基板処理装置及び基板処理方法 Download PDFInfo
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- 238000001514 detection method Methods 0.000 title claims description 74
- 239000000758 substrate Substances 0.000 title claims description 39
- 238000012545 processing Methods 0.000 title claims description 29
- 238000003672 processing method Methods 0.000 title claims description 7
- 239000007789 gas Substances 0.000 claims description 50
- 230000005674 electromagnetic induction Effects 0.000 claims description 25
- 230000007246 mechanism Effects 0.000 claims description 25
- 238000000034 method Methods 0.000 claims description 19
- 230000002093 peripheral effect Effects 0.000 claims description 16
- 239000011295 pitch Substances 0.000 claims description 15
- 230000008569 process Effects 0.000 claims description 14
- 239000002994 raw material Substances 0.000 claims description 12
- 230000008859 change Effects 0.000 claims description 11
- 230000000737 periodic effect Effects 0.000 claims description 7
- 239000002052 molecular layer Substances 0.000 claims description 2
- 239000007795 chemical reaction product Substances 0.000 claims 2
- 239000012495 reaction gas Substances 0.000 claims 1
- 238000002407 reforming Methods 0.000 description 9
- 238000010586 diagram Methods 0.000 description 8
- 230000003647 oxidation Effects 0.000 description 7
- 238000007254 oxidation reaction Methods 0.000 description 7
- 238000000926 separation method Methods 0.000 description 6
- 229910004298 SiO 2 Inorganic materials 0.000 description 5
- 238000005192 partition Methods 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 238000001179 sorption measurement Methods 0.000 description 4
- 230000005856 abnormality Effects 0.000 description 3
- 235000012239 silicon dioxide Nutrition 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 229910052681 coesite Inorganic materials 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 229910052906 cristobalite Inorganic materials 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 229910052682 stishovite Inorganic materials 0.000 description 2
- 230000007723 transport mechanism Effects 0.000 description 2
- 229910052905 tridymite Inorganic materials 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000005672 electromagnetic field Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- C23C16/52—Controlling or regulating the coating process
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
- G01B7/30—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring angles or tapers; for testing the alignment of axes
-
- G—PHYSICS
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- G01D5/12—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means
- G01D5/14—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage
- G01D5/20—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage by varying inductance, e.g. by a movable armature
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- G01D5/12—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means
- G01D5/14—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage
- G01D5/20—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage by varying inductance, e.g. by a movable armature
- G01D5/204—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage by varying inductance, e.g. by a movable armature by influencing the mutual induction between two or more coils
- G01D5/2066—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage by varying inductance, e.g. by a movable armature by influencing the mutual induction between two or more coils by movement of a single coil with respect to a single other coil
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- G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
- G01D5/12—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means
- G01D5/14—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage
- G01D5/24—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage by varying capacitance
- G01D5/241—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage by varying capacitance by relative movement of capacitor electrodes
- G01D5/2412—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage by varying capacitance by relative movement of capacitor electrodes by varying overlap
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- H01L21/67005—Apparatus not specifically provided for elsewhere
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- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
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- G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
- G01D5/26—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light
- G01D5/32—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light with attenuation or whole or partial obturation of beams of light
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Description
前記回転軸の周囲に、前記可動側パターンに対向して固定配置され、前記回転軸の回転に伴い、前記可動側パターンとの重なり状態が変化する固定側パターンと、
前記可動側パターンと前記固定側パターンとの重なり状態の変化に応じて変化する物理量を検出し、該物理量に基づいて前記回転軸の回転角度を検出する検出部と、を有し、前記可動側パターン及び前記固定側パターンは、ピッチが異なるパターンを含む周期的な繰り返しパターンである。
転速度でウエハWが自転するように設定される。このように、載置台3は回転テーブル2の回転と同期せずに自転するので、各載置台3上のウエハWは自転及び公転によって、原料ガスの吸着領域R1を様々な向きで通過することになり、ウエハWの周方向に見て、ウエハWに形成されるSiO2膜の膜厚の偏りが抑えられる。
1 成膜装置
2 回転テーブル
21 回転軸
32 自転軸
60 パターン部
61、66 可動側パターン
62~65、67 固定側パターン
61a、62a 絶縁フィルム
61b~61e、62b 導電パターン
70 交流電源
80 検出部
81~84 電圧検出部
85~88 角度検出部
90~92 回転角度検出装置
Claims (15)
- 回転軸の外周側面に設けられ、該外周側面の周方向に沿って形状が変化する可動側パターンと、
前記回転軸の周囲に、前記可動側パターンに対向して固定配置され、前記回転軸の回転に伴い、前記可動側パターンとの重なり状態が変化する固定側パターンと、
前記可動側パターンと前記固定側パターンとの重なり状態の変化に応じて変化する物理量を検出し、該物理量に基づいて前記回転軸の回転角度を検出する検出部と、
を有し、
前記可動側パターン及び前記固定側パターンは、ピッチが異なるパターンを含む周期的な繰り返しパターンである、
回転角度検出装置。 - 前記可動側パターン及び前記固定側パターンは、導電パターンである請求項1に記載の回転角度検出装置。
- 前記固定側パターンには交流電流が供給され、
前記物理量は、前記固定側パターンで発生する磁界中で前記可動側パターンが移動することにより発生する電磁誘導電圧である請求項2に記載の回転角度検出装置。 - 前記固定側パターンは、周方向に離間して前記回転軸の周囲に複数設けられている請求項1乃至3のいずれか一項に記載の回転角度検出装置。
- 前記可動側パターンは、絶縁フィルムの表面上に設けられており、
該絶縁フィルムが前記回転軸の前記外周側面上に貼り付けられて設けられている請求項1乃至4のいずれか一項に記載の回転角度検出装置。 - 前記絶縁フィルムは、両端部が重ならないように前記回転軸の前記外周側面上に貼り付けられており、
前記絶縁フィルムが欠けている領域を覆う第2の絶縁フィルムが前記絶縁フィルムと軸方向において重ならない位置に貼り付けられており、
前記固定側パターンは、前記第2の絶縁フィルムの表面上に設けられている第2の可動側パターンとも対向し、重なるように設けられている請求項5に記載の回転角度検出装置。 - 前記物理量は、静電容量である請求項1又は2に記載の回転角度検出装置。
- 回転軸の外周側面に設けられ、該外周側面の周方向に沿って形状が変化する可動側パターンと、
前記回転軸の周囲に、前記可動側パターンに対向して固定配置され、前記回転軸の回転に伴い、前記可動側パターンとの重なり状態が変化する固定側パターンと、
前記可動側パターンと前記固定側パターンとの重なり状態の変化に応じて変化する物理量を検出し、該物理量に基づいて前記回転軸の回転角度を検出する検出部と、
を有し、
前記可動側パターンは、絶縁フィルムの表面上に設けられており、
該絶縁フィルムは、両端部が重ならないように前記回転軸の前記外周側面上に貼り付けられており、
前記絶縁フィルムが欠けている領域を覆う第2の絶縁フィルムが前記絶縁フィルムと軸方向において重ならない位置に貼り付けられており、
前記固定側パターンは、前記第2の絶縁フィルムの表面上に設けられている第2の可動側パターンとも対向し、重なるように設けられている、
回転角度検出装置。 - 処理室と、
該処理室内に設けられ、表面上に周方向に沿って複数の基板載置部が設けられた回転テーブルと、
前記複数の基板載置部の各々に設けられた自転軸と、
該自転軸を回転させる自転軸駆動機構と、
該自転軸の回転角度を検出する請求項1乃至8のいずれか一項に記載の回転角度検出装置と、を有する基板処理装置。 - 前記自転軸と前記自転軸駆動機構は、磁力を用いて非接触で連結されている請求項9に記載の基板処理装置。
- 前記自転軸駆動機構は、前記自転軸の各々と全周で磁気的に連結する環状の遊星型磁気ギアを有し、該遊星型磁気ギアの回転により総ての自転軸を回転可能である請求項10に記載の基板処理装置。
- 周方向に沿って設けられた複数の基板載置部の各々に基板が載置された回転テーブルを回転させる工程と、
前記複数の基板載置部の各々に設けられた自転軸を自転させる工程と、
前記自転軸の外周側面に設けられた可動側パターンと、該可動側パターンに対向して固定配置された固定側パターンとの重なり状態の変化に応じて変化する物理量を検出し、該物理量に基づいて前記自転軸の回転角度を検出する工程と、を有し、
前記可動側パターン及び前記固定側パターンは、ピッチが異なるパターンを含む周期的な繰り返しパターンである、
回転角度検出方法。 - 前記可動側パターン及び前記固定側パターンは導電パターンである請求項12に記載の回転角度検出方法。
- 前記自転軸の回転角度を検出する工程は、
前記固定側パターンには交流電流を供給する工程を含み、
前記物理量は、前記固定側パターンで発生する磁界中で前記可動側パターンが移動することにより発生する電磁誘導電圧である請求項13に記載の回転角度検出方法。 - 処理室内に設けられた回転テーブルの回転方向に沿って設けられた原料ガス供給領域において、基板の表面上に原料ガスを吸着させる工程と、
前記回転テーブルの回転方向において前記原料ガス供給領域の下流側に設けられた反応領域において、前記原料ガスが表面上に吸着した前記基板に前記原料ガスと反応して反応生成物を生成する反応ガスを前記基板に供給し、前記反応生成物の分子層を堆積させる工程とを、
請求項12乃至14のいずれか一項に記載の回転角度検出方法を実施しながら行う基板処理方法。
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