JP7077327B2 - 熱伝達を向上させた半導体リソグラフィ用の投影露光装置 - Google Patents
熱伝達を向上させた半導体リソグラフィ用の投影露光装置 Download PDFInfo
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- JP7077327B2 JP7077327B2 JP2019544822A JP2019544822A JP7077327B2 JP 7077327 B2 JP7077327 B2 JP 7077327B2 JP 2019544822 A JP2019544822 A JP 2019544822A JP 2019544822 A JP2019544822 A JP 2019544822A JP 7077327 B2 JP7077327 B2 JP 7077327B2
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
- G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
- G03F7/70875—Temperature, e.g. temperature control of masks or workpieces via control of stage temperature
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/70075—Homogenization of illumination intensity in the mask plane by using an integrator, e.g. fly's eye lens, facet mirror or glass rod, by using a diffusing optical element or by beam deflection
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/702—Reflective illumination, i.e. reflective optical elements other than folding mirrors, e.g. extreme ultraviolet [EUV] illumination systems
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/70208—Multiple illumination paths, e.g. radiation distribution devices, microlens illumination systems, multiplexers or demultiplexers for single or multiple projection systems
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
- G03F7/7045—Hybrid exposures, i.e. multiple exposures of the same area using different types of exposure apparatus, e.g. combining projection, proximity, direct write, interferometric, UV, x-ray or particle beam
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
- G03F7/70825—Mounting of individual elements, e.g. mounts, holders or supports
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
- G03F7/70883—Environment aspects, e.g. pressure of beam-path gas, temperature of optical system
- G03F7/70891—Temperature
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Public Health (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Atmospheric Sciences (AREA)
- Toxicology (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Mounting And Adjusting Of Optical Elements (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Description
2 光学アセンブリ;視野ファセットミラー
3 光源
4 照明光学ユニット
5 物体視野
6 物体面
7 レチクル
8 レチクルホルダ
9 投影光学ユニット
10 像視野
11 像面
12 ウェハ
13 ウェハホルダ
14 EUV放射線
15 中間焦点面
16 瞳ファセットミラー
17 光学アセンブリ
18 ミラー
19 ミラー
20 ミラー
21 接続素子
22 コンポーネント、光学コンポーネント
23 支持冷却構造体
24 受部領域
25 足部領域
26 関節、フレクシャ
261 受部領域における関節の取付点
262 足部領域における関節の取付点
263 像面内の軸に関する傾動用の関節
264 像面に対して垂直な軸に関する傾動用の関節
27 熱伝導素子
271 受部領域における熱伝導素子の取付点
272 足部領域における熱伝導素子の取付点
29 材料狭窄部を有する関節
291 受部領域における関節の取付点
292 足部領域における関節の取付点
30 従動関節
31 中間部
32 板ばね
33 ワイヤ
40 中間部
G 直線
D 支点
Claims (7)
- 半導体リソグラフィ用の投影露光装置(1)であって、該装置の光学コンポーネント(22)を支持冷却構造体(23)に接続する接続素子(21)を備え、該接続素子(21)は、前記光学コンポーネント(22)を受ける受部領域(24)と、投影露光装置(1)の前記支持冷却構造体(23)に接続する足部領域(25)とを有し、少なくとも1つの関節(26)が、前記受部領域(24)と前記足部領域(25)との間に配置され、さらに少なくとも1つの熱伝導素子(27)が、前記受部領域(24)と前記足部領域(25)との間に配置される投影露光装置(1)において、
前記熱伝導素子(27)は、前記接続素子の前記受部領域(24)及び前記足部領域(25)における前記熱伝導素子(27)の取付点(271、272)を通る接続直線(G)に沿って中断される形で形成され、
前記熱伝導素子(27)は平坦な傾斜素子として形成されることを特徴とする投影露光装置。 - 請求項1に記載の投影露光装置(1)において、
前記関節(26)はフレクシャであることを特徴とする投影露光装置。 - 請求項1又は2に記載の投影露光装置(1)において、
前記関節(26)及び前記熱伝導素子(27)は一体的に形成されることを特徴とする投影露光装置。 - 請求項1~3のいずれか一項に記載の投影露光装置(1)において、
前記熱伝導素子(27)は、前記接続直線(G)に対して斜めに延びる部分を有することを特徴とする投影露光装置。 - 請求項4に記載の投影露光装置(1)において、
前記熱伝導素子(27)は、前記接続直線(G)に対して垂直に延びる部分を有することを特徴とする投影露光装置。 - 請求項1~5のいずれか1項に記載の投影露光装置(1)において、
前記熱伝導素子(27)は、少なくとも1つの板ばね状部分に接続された中心部を有することを特徴とする投影露光装置。 - 請求項1~6のいずれか1項に記載の投影露光装置(1)において、
前記接続素子(21)は2自由度以上で作動可能であり、
前記接続素子(21)は2軸に関する傾動を可能にすることを特徴とする投影露光装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102017202653.7A DE102017202653A1 (de) | 2017-02-20 | 2017-02-20 | Projektionsbelichtungsanlage für die Halbleiterlithographie mit verbessertem Wärmeübergang |
DE102017202653.7 | 2017-02-20 | ||
PCT/EP2018/052029 WO2018149622A1 (de) | 2017-02-20 | 2018-01-29 | Projektionsbelichtungsanlage für die halbleiterlithographie mit verbessertem wärmeübergang |
Publications (2)
Publication Number | Publication Date |
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JP2020508486A JP2020508486A (ja) | 2020-03-19 |
JP7077327B2 true JP7077327B2 (ja) | 2022-05-30 |
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JP2019544822A Active JP7077327B2 (ja) | 2017-02-20 | 2018-01-29 | 熱伝達を向上させた半導体リソグラフィ用の投影露光装置 |
Country Status (5)
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US (1) | US10969699B2 (ja) |
JP (1) | JP7077327B2 (ja) |
CN (1) | CN110312969B (ja) |
DE (1) | DE102017202653A1 (ja) |
WO (1) | WO2018149622A1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102020203713A1 (de) * | 2020-03-23 | 2021-04-01 | Carl Zeiss Smt Gmbh | Entkopplungsgelenk zur mechanischen Lagerung eines optischen Elements |
DE102020203765A1 (de) * | 2020-03-24 | 2021-09-30 | Carl Zeiss Smt Gmbh | Optische Baugruppe; Projektionsbelichtungsanlage und Verfahren zur Herstellung einer optischen Baugruppe |
DE102020209155A1 (de) | 2020-07-21 | 2021-07-15 | Carl Zeiss Smt Gmbh | Projektionsbelichtungsanlage mit einem Verbindungselement mit verbesserter Wärmeleitung |
DE102021200131A1 (de) | 2021-01-11 | 2022-07-14 | Carl Zeiss Smt Gmbh | Baugruppe mit einem Entkopplungsgelenk zur mechanischen Lagerung eines Elements |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012504323A (ja) | 2008-09-30 | 2012-02-16 | カール・ツァイス・エスエムティー・ゲーエムベーハー | マイクロリソグラフィー投影露光装置 |
DE102013215169A1 (de) | 2013-08-01 | 2015-02-05 | Carl Zeiss Smt Gmbh | Optische vorrichtung und lithographieanlage |
DE102014202737A1 (de) | 2014-02-14 | 2015-08-20 | Carl Zeiss Smt Gmbh | Lagerelement und system zum lagern eines optischen elements |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
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DE102006020734A1 (de) | 2006-05-04 | 2007-11-15 | Carl Zeiss Smt Ag | Beleuchtungssystem für die EUV-Lithographie sowie erstes und zweites optisches Element zum Einsatz in einem derartigen Beleuchtungssystem |
DE102012223034A1 (de) | 2012-12-13 | 2013-12-12 | Carl Zeiss Smt Gmbh | Beleuchtungssystem einer Mikrolithographischen Projektionsbelichtungsanlage |
US9658542B2 (en) * | 2013-10-14 | 2017-05-23 | Carl Zeiss Smt Gmbh | Optical element |
DE102014203144A1 (de) | 2014-02-21 | 2015-08-27 | Carl Zeiss Smt Gmbh | Baugruppe eines optischen Systems, insbesondere in einer mikrolithographischen Projektionsbelichtungsanlage |
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2017
- 2017-02-20 DE DE102017202653.7A patent/DE102017202653A1/de not_active Ceased
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2018
- 2018-01-29 CN CN201880012877.9A patent/CN110312969B/zh active Active
- 2018-01-29 JP JP2019544822A patent/JP7077327B2/ja active Active
- 2018-01-29 WO PCT/EP2018/052029 patent/WO2018149622A1/de active Application Filing
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2019
- 2019-08-15 US US16/541,579 patent/US10969699B2/en active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012504323A (ja) | 2008-09-30 | 2012-02-16 | カール・ツァイス・エスエムティー・ゲーエムベーハー | マイクロリソグラフィー投影露光装置 |
DE102013215169A1 (de) | 2013-08-01 | 2015-02-05 | Carl Zeiss Smt Gmbh | Optische vorrichtung und lithographieanlage |
DE102014202737A1 (de) | 2014-02-14 | 2015-08-20 | Carl Zeiss Smt Gmbh | Lagerelement und system zum lagern eines optischen elements |
Also Published As
Publication number | Publication date |
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CN110312969B (zh) | 2022-03-01 |
US20190384187A1 (en) | 2019-12-19 |
CN110312969A (zh) | 2019-10-08 |
JP2020508486A (ja) | 2020-03-19 |
WO2018149622A1 (de) | 2018-08-23 |
DE102017202653A1 (de) | 2018-08-23 |
US10969699B2 (en) | 2021-04-06 |
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