JP7065385B2 - Mounting device - Google Patents

Description

The present disclosure relates to a mounting device in general, and more particularly to a mounting device in which a first object is mounted on a second object.

Patent Document 1 describes a component mounting device for mounting an electronic component on a substrate. The component mounting device described in Patent Document 1 includes a component recognition camera that captures an image of an electronic component held by a mounting head from below, and a substrate recognition camera that captures a mark on the surface of the substrate. That is, in the component mounting device described in Patent Document 1, the electronic component held by the substrate and the mounting head can be recognized by the two cameras.

Japanese Unexamined Patent Publication No. 2011-165856

In a component mounting device (mounting device) as described in Patent Document 1, an electronic component (first object) held (captured) by a substrate (second object), a mounting head (capturing unit), and the like. It is desired that one camera (imaging device) recognizes the electronic components mounted on the substrate.

This disclosure has been made in view of the above problems, and includes a second object, a first object captured by a capturing unit, and a first object mounted on a second object. It is an object of the present invention to provide a mounting device that can be recognized by one imaging device.

The mounting device according to one aspect of the present disclosure mounts the first object captured by the capturing unit that captures the first object on the second object positioned at a predetermined position. The mounting device includes the capture unit, one image pickup device, and an image pickup area selection mechanism. The imaging region selection mechanism enables the imaging apparatus to capture a plurality of imaging regions including a first imaging region, a second imaging region, and a third imaging region. The first imaging region is an region provided on the second object and including a recognition mark for recognizing the second object in the subject. The second image pickup region is a region including the first object captured by the capture unit in the subject. The third image pickup region is a region in which the first object in a state of being mounted on the second object is included in the subject, and at least a part of the capture portion is included in the subject .

According to the present disclosure, one image pickup apparatus can recognize a second object, a first object captured by a capturing unit, and a first object mounted on a second object. It has the effect of being able to do it.

FIG. 1 is a perspective view showing the appearance of a mounting device according to an embodiment of the present disclosure. FIG. 2A is a perspective view showing a state in which the cover module of the mounting device of the same is removed. FIG. 2B is a schematic enlarged view of region A1 of FIG. 2A. 3A and 3B are schematic views illustrating an operation when the first imaging region is imaged by the imaging device in the mounting device of the same. 4A and 4B are schematic views illustrating an operation when the second imaging region is imaged by the imaging device in the mounting device of the same. 5A and 5B are schematic views illustrating an operation when the third imaging region is imaged by the imaging device in the mounting device of the same. 6A and 6B are schematic views illustrating an operation when the first imaging region is imaged by the imaging apparatus in the mounting apparatus according to the first modification of the first embodiment of the present disclosure. 7A and 7B are schematic views illustrating an operation when the second imaging region is imaged by the imaging device in the mounting device of the same. 8A and 8B are schematic views illustrating an operation when the third imaging region is imaged by the imaging device in the mounting device of the same.

(1) Outline An outline of the mounting apparatus 1 according to the present embodiment will be described with reference to FIGS. 1 to 2B. FIG. 2A is a perspective view of the mounting device 1 in a state where the cover module 14 (see FIG. 1), which will be described later, is removed. FIG. 2B is a schematic enlarged view of region A1 of FIG. 2A. Further, a pipe for circulating cooling water, a cable for supplying electric power, a pipe for supplying pneumatic pressure (including positive pressure and vacuum), and the like are connected to the mounting device 1, but these illustrations are omitted as appropriate. ..

The mounting device 1 is used for manufacturing various products such as electronic devices, automobiles, clothing, groceries, pharmaceuticals and crafts in facilities such as factories, laboratories, offices, stores and educational facilities. In the present embodiment, a case where the mounting device 1 is used for manufacturing an electronic device in a factory and the work of mounting the first object on the second object will be described.

A general electronic device has various circuit blocks such as a power supply circuit and a control circuit, for example. In manufacturing these circuit blocks, as an example, a soldering step, a mounting step, and a soldering step are performed in this order. In the solder application process, creamy solder is applied (or printed) to the substrate (printed wiring board). In the mounting process, components (electronic components) are mounted (mounted) on the board. In the soldering step, for example, the cream-like solder is melted and soldered by heating the substrate in which the parts are mounted in a reflow oven. In the mounting process, the mounting device 1 has a component P1 (hereinafter, "first object") which is a first object with respect to a substrate B1 (hereinafter, also referred to as "second object B1") which is a second object. Work to implement (also called P1). In this embodiment, as an example, a case where the mounting device 1 is used for mounting the component P1 by the surface mount technology (SMT) will be described. However, the present invention is not limited to this example, and the mounting device 1 may be used for mounting the component P1 by the insertion mounting technology (IMT: Insertion Mount Technology).

The mounting device 1 according to the present embodiment includes a control module 11, a holding module 12, and a working module 13. The holding module 12 holds the second object B1. The work module 13 executes work on the second object (board) B1. The control module 11 has a function of controlling the holding module 12 and the working module 13. That is, the mounting device 1 includes at least three modules including a control module 11, a holding module 12, and a working module 13, which are modularized according to functions. Each of at least three modules included in the mounting device 1 is appropriately selected from a plurality of types of modules having different functions according to the functions required for the mounting device 1.

In the present embodiment, since the mounting device 1 performs the mounting work of the component P1 on the board B1 which is the second object, the holding module 12 has a function of holding the board B1. More specifically, the holding module 12 conveys the substrate B1, which is the second object, from the outside of the mounting apparatus 1 to the internal space of the mounting apparatus 1, and the substrate B1 for which the work is completed is transferred to the internal space of the mounting apparatus 1. It is a transport device that transports from to the outside of the mounting device 1. The holding module 12 holds the board B1 in the internal space of the mounting device 1 at least during the work on the board B1 (mounting of the component P1). Further, the work module 13 executes the work of mounting the component P1 on the board B1. That is, the work module 13 captures the component P1 which is the first object, moves the captured component P1 onto the substrate B1, and releases the component P1 on the substrate B1 (releases the capture), whereby the substrate B1 It is a pick-and-place device that mounts (mounts) the component P1 on the surface.

Further, the mounting device 1 according to the present embodiment further includes a cover module 14, a supply module 15, and a signal lamp 16 (see FIG. 1) in addition to the control module 11, the holding module 12, and the working module 13. In the present embodiment, the control module 11 is at the bottom, and the holding module 12, the working module 13, and the cover module 14 are combined with the control module 11 so as to be stacked in this order on the control module 11. The supply module 15 is housed in a recess 17 formed across the control module 11 and the holding module 12.

The cover module 14 will be described in detail later, but the cover module 14 is a terminal module connected to the most downstream module in the power supply path among a plurality of modules connected in series with the control module 11. .. The supply module 15 supplies the first object (part P1) to the work module 13. That is, the work module 13 receives the supply of the component P1 from the supply module 15, and mounts the component P1 on the substrate B1 held by the holding module 12. The signal lamp 16 is attached to the cover module 14. The signal lamp 16 visualizes the operating state of the mounting device 1 by changing the display mode (for example, the emission color) according to the operating state of the mounting device 1.

By the way, the component mounting device described in Patent Document 1 described above includes a camera for component recognition and a camera for substrate recognition, and the electronic components held by the substrate and the mounting head by these cameras. Can be recognized. On the other hand, there is a demand for a component mounting device capable of recognizing a board, an electronic component held by a mounting head, and an electronic component mounted on the board with a single camera.

The mounting device 1 according to the present embodiment uses one image pickup device to capture the second object, the first object captured by the capturing unit, and the first object mounted on the second object. It has the following configurations so that it can be recognized.

As shown in FIGS. 3A to 5B, in the mounting apparatus 1 according to the present embodiment, the first object P1 captured by the capturing unit 70 that captures the first object P1 is positioned at a predetermined position. It is a mounting device to be mounted on the object B1. The mounting device 1 includes a capturing unit 70, one image pickup device 91, and an image pickup area selection mechanism 92. The imaging region selection mechanism 92 enables the imaging apparatus 91 to capture a plurality of imaging regions including a first imaging region, a second imaging region, and a third imaging region. The first imaging region is an region provided on the second object B1 and includes a recognition mark M1 for recognizing the second object B1 in the subject. The second imaging region is an region including the first object P1 captured by the capture unit 70 in the subject. The third imaging region is an region including the first object P1 mounted on the second object B1 in the subject.

As described above, since the mounting device 1 according to the present embodiment includes the imaging region selection mechanism 92, the second object B1, the first object P1 captured by the capture unit 70, and the second object. The first object P1 mounted on the object B1 can be recognized by one image pickup device 91.

(2) Details Hereinafter, details of the mounting device 1 according to the present embodiment will be described with reference to FIGS. 1 to 3B.

In the following, the internal space of the mounting device 1 is defined as the "X-axis direction" in which the substrate B1 which is the second object is conveyed, and the direction orthogonal to the X-axis direction in the horizontal plane is defined as the "Y-axis direction". The direction along the direction will be described as "Z-axis direction". That is, the X-axis direction, the Y-axis direction, and the Z-axis direction are directions orthogonal to each other. Further, when distinguishing between the positive direction in the Z-axis direction and the negative direction, the positive direction in the Z-axis direction is "upward" and the negative direction in the Z-axis direction is based on the direction of the arrow shown in FIG. The orientation is described as "downward". Similarly, when distinguishing between the positive direction in the X-axis direction and the negative direction, the positive direction in the X-axis direction will be described as "right" and the negative direction in the X-axis direction will be described as "left". .. Similarly, when distinguishing between the positive direction in the Y-axis direction and the negative direction, the positive direction in the Y-axis direction will be described as "rear" and the negative direction in the Y-axis direction will be described as "forward". The arrows indicating "X-axis direction", "Y-axis direction", and "Z-axis direction" in the drawings are shown for the sake of explanation only and are not accompanied by substance. However, these directions do not mean to limit the direction when the mounting device 1 is used, and for example, even if the mounting device 1 is used with the X-axis direction and the Y-axis direction slightly inclined with respect to the horizontal plane. good.

(2.1) Overall Configuration As described above, the mounting device 1 according to the present embodiment includes a control module 11, a holding module 12, a working module 13, a cover module 14, a supply module 15, and a signal lamp 16. , Is equipped. Further, the mounting device 1 according to the present embodiment further includes an imaging system 9.

In the control module 11, the holding module 12, the working module 13, and the cover module 14, the holding module 12, the working module 13, and the cover module 14 are stacked in this order in the Z-axis direction, with the control module 11 at the bottom. A recess 17 is formed on the front surface of the control module 11 and the holding module 12 so as to straddle the control module 11 and the holding module 12. The recess 17 is open forward. The supply module 15 is housed in the recess 17. The signal lamp 16 is fixed to the front surface of the work module 13 and the cover module 14 so as to straddle the work module 13 and the cover module 14.

In this mounting device 1, as shown in FIG. 2A, the cover module 14 can be physically separated (removed) from the working module 13. The example of FIG. 2A shows a state in which the cover module 14 is removed together with the signal lamp 16. Further, the control module 11, the holding module 12, the working module 13, and the supply module 15 are physically separable. That is, the mounting device 1 is configured by combining a plurality of (five here) modules of a physically separable control module 11, a holding module 12, a working module 13, a cover module 14, and a supply module 15. ing.

As shown in FIG. 1, the mounting device 1 can handle the plurality of modules as one integrated device in a state where the plurality of modules are combined. In this state, the mounting device 1 has a substantially cubic shape, for example, when the dimensions in the three axial directions of the X-axis direction, the Y-axis direction, and the Z-axis direction are substantially the same. As an example, the size of this cube is set to a size of 500 mm or more and 1000 mm or less on one side, and more preferably a size of about 600 mm on one side. With such dimensions, it can be used as a tabletop-mounted device, and can be easily installed in facilities other than factories, such as laboratories, offices, stores, and educational facilities. Further, when viewed from the mounting device 1, for example, another device can be arranged in an empty space generated above.

The mounting device 1 is configured to be bidirectionally communicable between the control module 11 and each of the holding module 12, the working module 13, and the supply module 15. As a result, a plurality of physically separable modules can cooperate with each other and operate as one mounting device 1. Further, the mounting device 1 is configured so that the control module 11 can communicate with various equipment or communication terminals other than the mounting device 1.

Further, the mounting device 1 is connected to the power supply, the positive pressure source, and the vacuum source, which are the power supply sources, by the control module 11. That is, the mounting device 1 is configured to once acquire the power of each part by the control module 11 and distribute the power from the control module 11 to modules other than the control module 11.

The image pickup system 9 is a system for recognizing the substrate B1 and the component P1 in order to attach the component P1 which is the first object to the normal position of the substrate B1 which is the second object. The imaging system 9 is configured to be capable of imaging a plurality of imaging regions including a first imaging region, a second imaging region, and a third imaging region. The "first imaging region" referred to here is an region including the recognition mark M1 (see FIG. 3A) for recognizing the substrate B1 which is the second object in the subject. In the present embodiment, the recognition mark M1 is provided on the upper surface (surface) of the substrate B1. Further, the "second imaging region" referred to here is an region including the component P1 which is the first object captured by the capturing unit 70 in the subject. Further, the "third imaging region" referred to here is an region including the component P1 which is the first object in a state of being mounted on the substrate B1 which is the second object. According to this imaging system 9, the first imaging region, the second imaging region, and the third imaging region can be imaged by one imaging device 91 (described later). In other words, according to the image pickup system 9, the component B1 which is the second object, the component P1 which is the first object captured by the capture unit 70, and the component P1 mounted on the substrate B1. Can be recognized by one image pickup device 91.

(2.2) Control module The control module 11 has a housing 110 as shown in FIG. 2A.

The housing 110 has a substantially square shape when viewed from one side in the Z-axis direction, and is formed in a rectangular parallelepiped shape flat in the Z-axis direction. A first recess 171 recessed in the positive direction in the Y-axis direction is formed on the front surface of the housing 110. The first recess 171 is open upward. The first recess 171 together with the second recess 172 described later constitutes a recess 17 for accommodating the supply module 15.

An operation unit 114 is arranged on the front surface of the housing 110. The operation unit 114 includes, for example, a power switch, an start / stop switch, an emergency switch, and the like.

(2.3) Holding module As shown in FIG. 2A, the holding module 12 has a housing 120 and a first drive mechanism.

The housing 120 has a substantially square shape when viewed from one side in the Z-axis direction, similar to the housing 110 of the control module 11, and is formed in a rectangular parallelepiped shape flat in the Z-axis direction. A second recess 172 recessed in the positive direction in the Y-axis direction is formed on the front surface of the housing 120. The second recess 172 is open downward. Further, the housing 120 has a pair of substrate passage holes 125 penetrating in the X-axis direction on both end faces in the X-axis direction. As a result, the internal space of the housing 120 can be accessed from both sides in the X-axis direction through the pair of substrate passage holes 125.

The first drive mechanism is a mechanism for holding the substrate B1 which is the second object. In the present embodiment, the first drive mechanism has a function of transporting the substrate B1 along the X-axis direction. Specifically, the first drive mechanism is, for example, a belt conveyor or the like. The first drive mechanism introduces the substrate B1 from one of the pair of substrate passage holes 125 into the housing 120, conveys the substrate B1 along the X-axis direction, and conveys the substrate B1 along the X-axis direction to the other substrate passage hole 125. Discharge from. The first drive mechanism stops the board B1 in the mounting space in the housing 120 until the mounting of the component P1 on the board B1 is completed.

(2.4) Work module The work module 13 has a housing 130 and a second drive mechanism 134.

The housing 130 has a substantially square shape when viewed from one side in the Z-axis direction, similar to the housing 110 of the control module 11, and is formed in a rectangular parallelepiped shape flat in the Z-axis direction.

The second drive mechanism 134 is a mechanism for mounting the component P1 which is the first object on the substrate B1 which is the second object. The second drive mechanism 134 includes a mounting head unit 56, an X-axis moving device 4, and a Y-axis moving device 3. The mounting head unit 56 includes a capture unit 70 that captures the component P1 and an actuator 6 for moving the capture unit 70. The mounting device 1 according to the present embodiment includes a plurality of capturing units 70 and actuators 6 (two in the example of FIG. 2A) in the mounting head unit 56. As a result, the mounting head unit 56 can simultaneously capture a plurality of components P1 (two in the example of FIG. 2A).

The capture unit 70 is, for example, a suction nozzle. The capture unit 70 can switch between a capture state in which the component P1 is captured (held) and a release state in which the component P1 is released (released from capture). However, the capturing unit 70 is not limited to the suction nozzle, and may be configured to capture (hold) the component P1 by sandwiching (picking) it, for example, like a robot hand. The actuator 6 moves the capture unit 70 straight in the Z-axis direction. Further, the actuator 6 rotationally moves the capturing portion 70 in the rotational direction (hereinafter referred to as “θ direction”) about the axis along the Z-axis direction. The X-axis moving device 4 moves the mounting head unit 56 in a straight line in the X-axis direction. The Y-axis moving device 3 moves the mounting head unit 56 in a straight line in the Y-axis direction. As a result, the second drive mechanism 134 can move the capture unit 70 in the X-axis direction, the Y-axis direction, the Z-axis direction, and the θ direction.

In the present embodiment, as an example, regarding the movement of the capture unit 70 in the X-axis direction, the Y-axis direction, and the Z-axis direction, the second drive mechanism 134 is driven by the driving force generated by the linear motor. Regarding the movement of the capture unit 70 in the θ direction, the second drive mechanism 134 is driven by the driving force generated by the rotary motor. Regarding the capture of the component P1 by the capture unit 70, the second drive mechanism 134 operates by receiving the supply of pneumatic pressure (vacuum) as power. That is, the second drive mechanism 134 switches between the capture state and the release state of the capture unit 70 by opening and closing the valve on the pneumatic (vacuum) supply path connected to the capture unit 70.

(2.5) Other Module As shown in FIG. 1, the cover module 14 has a frame body 140 and a door body 141.

The frame body 140 has a substantially square shape similar to that of the housing 110 of the control module 11 when viewed from one side in the Z-axis direction, and is formed in a flat shape in the Z-axis direction. The frame body 140 has a penetrating portion penetrating in the Z-axis direction. The door body 141 is held openable and closable with respect to the frame body 140 so as to be movable between a closed position for closing the penetrating portion and an open position for opening the penetrating portion. As a result, when the door body 141 is in the open position, the inside of the work module 13 can be accessed through the penetrating portion of the frame body 140.

As shown in FIGS. 1 and 2A, the supply module 15 has a main body portion 150 and a feeder cassette 154.

The feeder cassette 154 has a built-in tape reel holding a plurality of parts P1, and the tape reels are rotated inside to sequentially supply the parts P1. The feeder cassette 154 has a mechanism for winding the tape after the component P1 is taken out. The feeder cassette 154 is provided, for example, for each type of the built-in component P1.

At least one feeder cassette 154 can be mounted on the main body 150. The main body 150 is housed in a recess 17 composed of a first recess 171 of the control module 11 and a second recess 172 of the holding module 12 with at least one feeder cassette 154 mounted. 1 and 2A show an example in which only one feeder cassette 154 is attached to the main body 150, but a plurality of feeder cassettes 154 can be attached to the main body 150 at the same time.

As shown in FIG. 1, the signal lamp 16 has a plurality of light emitting units 161. The plurality of light emitting units 161 emit green, yellow, and red, respectively, according to the operating state of the mounting device 1.

(2.6) Imaging System The imaging system 9 includes one imaging device 91 and an imaging region selection mechanism 92, as shown in FIGS. 3A and 3B. Further, the imaging region selection mechanism 92 includes an optical element 921, a first light source 922A, a second light source 922B, and a third light source 922C. In the following description, when the first light source 922A, the second light source 922B, and the third light source 922C are not particularly distinguished, each of the first light source 922A, the second light source 922B, and the third light source 922C is referred to as "light source 922". Also called.

The image pickup device 91 is, for example, a camera that captures a moving image. Further, the image pickup device 91 is, for example, a camera that captures a color image. The image pickup device 91 may be a camera that captures a still image or a camera that captures a monochrome image.

The optical element 921 is configured to output an image of a subject incident from each of the first image pickup area, the second image pickup area, and the third image pickup area to the image pickup apparatus 91. As shown in FIGS. 3A and 3B, the optical element 921 includes a first reflection unit 921A, a second reflection unit 921B, a third reflection unit 921C, a fourth reflection unit 921D, and a fifth reflection unit 921E. The sixth reflecting unit 921F and the like are included. In other words, the optical element 921 includes a reflecting unit that reflects an image of a subject incident from the image pickup region to be imaged by the image pickup apparatus 91 to the image pickup apparatus 91 among the plurality of imaging regions. The first reflection unit 921A, the second reflection unit 921B, the third reflection unit 921C, the fifth reflection unit 921E, and the sixth reflection unit 921F are, for example, half mirrors (beam splitters) and reflect a part of the incident light. It has a reflection function and a transmission function that transmits the remaining part. The fourth reflecting unit 921D is, for example, a mirror and has a reflecting function of reflecting all incident light.

As shown in FIG. 3B, the first reflecting portion 921A and the second reflecting portion 921B are formed so as to be inclined diagonally upward toward the right on the paper surface. These first reflection unit 921A and second reflection unit 921B are arranged between the image pickup apparatus 91 and the recognition mark M1 of the substrate B1 in the vertical direction (Z-axis direction). As shown in FIG. 3B, the third reflecting portion 921C and the fifth reflecting portion 921E are formed so as to be inclined diagonally upward toward the left on the paper surface. These third reflecting portions 921C and fifth reflecting portions 921E are arranged between the actuator 6 (capturing portion 70) and the component mounting position on the substrate B1 in the vertical direction. The shape of the optical element 921, the tilt angle of each reflecting portion, the refractive index, and the like are appropriately set according to the positional relationship between the image pickup device 91, the actuator 6, and the substrate B1.

The first light source 922A is, for example, a ring illumination formed in an annular shape, and is arranged at a position facing the recognition mark M1 on the substrate B1 held by the holding module 12. Then, the first light source 922A is turned on when the first image pickup region is imaged by the image pickup apparatus 91. The second light source 922B is a ring illumination like the first light source 922A, and is arranged so as to face the component P1 in a state of being captured by the capture unit 70. Then, the second light source 922B is turned on when the image pickup device 91 takes an image of the second image pickup region. The third light source 922C is a ring illumination like the first light source 922A, and is arranged so as to face the component P1 mounted on the substrate B1. Then, the third light source 922C is turned on when the image pickup device 91 takes an image of the third image pickup region. Each of the first light source 922A, the second light source 922B, and the third light source 922C is turned on according to the control signal from the control module 11 described above.

Here, in the present embodiment, the image pickup apparatus 91 and the image pickup area selection mechanism 92 (optical element 921) are fixed to the mounting head unit 56 described above. Further, in the present embodiment, the imaging region selection mechanism 92 further has a plurality of light sources 922. That is, in the image pickup system 9 according to the present embodiment, by switching the light source 922 to be turned on among the plurality of light sources 922, a plurality of image pickup areas can be imaged by one image pickup device 91. The operation of the image pickup system 9 will be described in detail in the column of "(3.2) Operation of the image pickup system".

(3) Operation (3.1) Basic operation The mounting device 1 according to the present embodiment basically operates as follows, and is a component that is the first object with respect to the substrate B1 that is the second object. Perform the mounting work of P1.

That is, the holding module 12 conveys the board B1 from the outside of the mounting device 1 to the internal space of the mounting device 1 along the X-axis direction, and holds the board B1 in the internal space of the mounting device 1.

Further, the work module 13 captures the component P1 supplied from the supply module 15 by the capture unit 70 (see FIG. 2B). The work module 13 moves the capture unit 70 that has captured the component P1 in the X-axis direction, the Y-axis direction, and the Z-axis direction, and releases the capture unit P1 from the capture unit 70 at a predetermined position on the substrate B1. The component P1 is mounted (mounted) on the board B1. Further, the work module 13 can change the direction of the component P1 in the horizontal plane (XY plane) by rotating the catching portion 70 in the θ direction.

When the mounting of the component P1 on the board B1 is completed, the holding module 12 transports (discharges) the board B1 from the internal space of the mounting device 1 to the outside of the mounting device 1.

(3.2) Operation of the image pickup system Next, the operation of the image pickup system 9 will be described with reference to FIGS. 3A to 5B. In FIGS. 3A and 4A, since the image pickup apparatus 91 and the actuator 6 overlap each other in the front-rear direction (direction perpendicular to the paper surface), the actuator 6 (including the capture unit 70) is not shown. Further, FIGS. 3A to 5B illustrate the case where the actuator 6 is one.

First, a case where the first image pickup region is imaged by the image pickup apparatus 91 will be described with reference to FIGS. 3A and 3B. In this case, the actuator 6 is moved in the left-right direction by the X-axis moving device 4 and is moved in the front-back direction by the Y-axis moving device 3, so that the actuator 6 overlaps with the image pickup device 91 when viewed from the front.

The control module 11 outputs a control signal to the first light source 922A to turn on the first light source 922A in order for the image pickup device 91 to image the first image pickup region. At this time, the second light source 922B and the third light source 922C are turned off. As a result, when viewed from the image pickup device 91 side (upper side), the first image pickup region including the recognition mark M1 on the substrate B1 can be recognized via the first reflection unit 921A and the second reflection unit 921B. Specifically, the image of the subject (recognition mark M1) from the first imaging region is refracted at the second reflecting unit 921B, passes through the optical element 921, and then refracted at the first reflecting unit 921A. As a result, the image of the subject from the first image pickup region faces vertically upward and is incident on the image pickup apparatus 91 located above.

Next, a case where the second image pickup region is imaged by the image pickup apparatus 91 will be described with reference to FIGS. 4A and 4B. Even in this case, the actuator 6 is moved in the left-right direction by the X-axis moving device 4 and is moved in the front-back direction by the Y-axis moving device 3, so that the actuator 6 overlaps with the image pickup device 91 when viewed from the front. be.

The control module 11 outputs a control signal to the second light source 922B to turn on the second light source 922B in order for the image pickup device 91 to image the second image pickup region. At this time, the first light source 922A and the third light source 922C are turned off. As a result, when viewed from the image pickup device 91 side, the second image pickup region including the component P1 (first object) captured by the capture unit 70 via the first reflection unit 921A and the third reflection unit 921C. Becomes recognizable. Specifically, the image of the subject (component P1) from the second imaging region is reflected backward by the third reflecting unit 921C, and then reflected upward by the first reflecting unit 921A. As a result, the image of the subject from the second imaging region faces vertically upward and is incident on the imaging device 91 located above. In this case, the inclination angles of the first reflecting portion 921A and the third reflecting portion 921C with respect to the horizontal plane (the plane orthogonal to the Z-axis direction) are preferably 45 degrees.

Further, a case where the third imaging region is imaged by the imaging apparatus 91 will be described with reference to FIGS. 5A and 5B. In this case, the actuator 6 is in a state of being moved forward and to the right of the image pickup device 91 by moving in the left-right direction by the X-axis moving device 4 and moving in the front-back direction by the Y-axis moving device 3. ..

The control module 11 outputs a control signal to the third light source 922C to turn on the third light source 922C in order for the image pickup device 91 to image the third image pickup region. At this time, the first light source 922A and the second light source 922B are turned off. As a result, when viewed from the image pickup apparatus 91 side, it is mounted on the substrate B1 via the first reflection unit 921A, the third reflection unit 921C, the fourth reflection unit 921D, the fifth reflection unit 921E, and the sixth reflection unit 921F. The third imaging region including the state component P1 becomes recognizable. Specifically, the image of the subject (component P1) from the third imaging region is refracted by the fifth reflection unit 921E and the sixth reflection unit 921F, passes through the optical element 921, and then passes through the optical element 921, and then the third reflection unit 921C and the third reflection unit 921C. 4 Reflects at the reflecting unit 921D. The image of the subject reflected by the fourth reflection unit 921D is refracted by the third reflection unit 921C and then reflected upward by the first reflection unit 921A. As a result, the image of the subject from the third imaging region faces vertically upward and is incident on the imaging device 91 located above.

Here, when the image pickup device 91 images the third image pickup region, the mounting device 1 is configured to image the component P1 from the diagonally left direction by the sixth reflection unit 921F (see FIG. 5A). Therefore, before the component P1 is mounted on the board B1, the land position and the solder position on the board B1 can be recognized, and as a result, it is possible to perform fine correction in the X-axis direction and the Y-axis direction. The mounting accuracy can be improved. Further, after the component P1 is mounted, the mounting position of the component P1 can be recognized, and as a result, the mounting defect or the like can be detected after the component P1 is mounted, and it can also be used for the cause analysis of the mounting defect or the like. ..

As described above, according to the mounting device 1 according to the present embodiment, since the imaging region selection mechanism 92 is provided, a plurality of imaging regions including the first imaging region, the second imaging region, and the third imaging region are combined into one. The image pickup device 91 can take an image. In other words, according to the mounting device 1, the substrate B1 (second object), the component P1 captured by the capturing unit 70 (first object), and the component P1 mounted on the substrate B1 are used. It can be recognized by one image pickup device 91.

In the present embodiment, the second reflecting unit 921B, the fifth reflecting unit 921E, and the fifth reflecting unit 921F are formed of glass or the like when the refractive index is taken into consideration because they only refract the image of the subject. Is preferable.

(4) Modifications The above embodiment is only one of the various embodiments of the present disclosure. The above-described embodiment can be variously modified depending on the design and the like as long as the object of the present disclosure can be achieved.

(4.1) First Modification Example In the above-described embodiment, the case where the image pickup device 91 and the optical element 921 are fixed to the mounting head unit 56 has been described as an example, but the image pickup device 91 and the optical element 921 can be moved. It may be attached to the mounting head unit 56. Hereinafter, the mounting device 1A according to the first modification will be described with reference to FIGS. 6A to 8B.

(4.1.1) Configuration First, the configuration of the mounting device 1A according to the first modification will be described with reference to FIGS. 6A and 6B.

The mounting device 1A according to the first modification includes the above-mentioned control module 11, the holding module 12, the working module 13, the cover module 14, the supply module 15, the signal lamp 16, and the imaging system 9A. There is. The configurations other than the image pickup system 9A are the same as those in the above-described embodiment, and detailed description thereof will be omitted here.

As shown in FIGS. 6A and 6B, the image pickup system 9A includes one image pickup device 91 and an image pickup region selection mechanism 92. Further, the imaging region selection mechanism 92 includes a first moving mechanism 923, a second moving mechanism 924, an optical element 925, and a light source 926.

The first moving mechanism 923 is a mechanism for moving the image pickup apparatus 91 in the X-axis direction with respect to the mounting head unit 56. The first moving mechanism 923 includes a first moving shaft 923A extending in the X-axis direction and a first motor 923B. The first motor 923B moves the image pickup device 91 in the X-axis direction along the first movement axis 923A by rotating in the first direction or the second direction opposite to the first direction according to the drive signal from the control module 11. Let me. Here, as shown in FIG. 6A, the mounting device 1A according to the first modification includes a plurality of actuators 6 (four in FIG. 6A). In other words, the mounting device 1A includes a plurality of capture units 70 arranged side by side in one direction (X-axis direction). Then, the first moving mechanism 923 moves the image pickup device 91 in the arrangement direction (X-axis direction) of the plurality of capturing units 70.

The second moving mechanism 924 is a mechanism for moving the optical element 925 with respect to the mounting head unit 56 in the X-axis direction. The second moving mechanism 924 includes a second moving shaft 924A extending in the X-axis direction and a second motor 924B. The second motor 924B moves the optical element 925 along the second moving axis 924A in the X-axis direction by rotating in the first direction or the second direction opposite to the first direction according to the drive signal from the control module 11. Let me. In other words, the second moving mechanism 924 moves the optical element 925 in the arrangement direction (X-axis direction) of the plurality of capturing portions 70.

The optical element 925 is configured to output an image of a subject incident from at least one of the first image pickup area, the second image pickup area, and the third image pickup area to the image pickup apparatus 91. As shown in FIGS. 6A and 6B, the optical element 925 includes a first reflection unit 925A, a second reflection unit 925B, a third reflection unit 925C, a fourth reflection unit 925D, and a fifth reflection unit 925E. including. The first reflection unit 925A, the second reflection unit 925B, and the fifth reflection unit 925E are, for example, half mirrors, and the third reflection unit 925C and the fourth reflection unit 925D are, for example, mirrors.

The light source 926 is configured to light up according to a control signal from the control module 11 when the first image pickup area, the second image pickup area, and the third image pickup area are imaged by the image pickup apparatus 91.

Here, the image pickup region selection mechanism 92 adjusts the position of the image pickup device 91 and the position of the optical element 925 in the arrangement direction (X-axis direction) of the plurality of capture units 70, respectively, to perform an image pickup image taken by the image pickup device 91. It is configured to select an area. In the first modification, the image pickup area selection mechanism 92 adjusts the position of the image pickup device 91 and the position of the optical element 925 in the arrangement direction to obtain the first image pickup area, the second image pickup area, or the third image pickup area. select.

(4.1.2) Operation of Imaging System Next, the operation of the imaging system 9A according to the first modification will be described with reference to FIGS. 6A to 8B.

First, a case where the first image pickup region is imaged by the image pickup apparatus 91 will be described with reference to FIGS. 6A and 6B.

The control module 11 outputs a control signal to the first motor 923B to move the image pickup apparatus 91. In this case, the control module 11 moves the image pickup device 91 to a position where it overlaps with the actuator 6 located at the rightmost end of the plurality of actuators 6 in the front-rear direction (see FIG. 6A). Further, the control module 11 outputs a control signal to the second motor 924B to move the optical element 925. In this case, the control module 11 moves the optical element 925 to a position where it overlaps with the second and third actuators 6 from the right side in the front-rear direction among the plurality of actuators 6. That is, in this case, the optical element 925 is located on the left side of the image pickup apparatus 91 (see FIG. 6A).

The control module 11 turns on the light source 926 and causes the image pickup device 91 to take an image of the first image pickup region. In this case, the image of the subject (recognition mark M1) from the first imaging region is directly incident on the imaging device 91 as shown in FIGS. 6A and 6B.

Next, a case where the second image pickup region is imaged by the image pickup apparatus 91 will be described with reference to FIGS. 7A and 7B.

The control module 11 outputs a control signal to the first motor 923B to move the image pickup apparatus 91. In this case, the control module 11 moves the image pickup device 91 to a position where it overlaps with the actuator 6 located at the rightmost end of the plurality of actuators 6 in the front-rear direction (see FIG. 7A). Further, the control module 11 outputs a control signal to the second motor 924B to move the optical element 925. In this case, the control module 11 moves the optical element 925 to a position where it overlaps with the actuator 6 located at the rightmost end of the plurality of actuators 6 in the front-rear direction (see FIG. 7A).

The control module 11 turns on the light source 926 and causes the image pickup apparatus 91 to take an image of the second image pickup area. In this case, the image of the subject (component P1) from the second imaging region is reflected backward by the second reflecting unit 925B and then upwardly reflected by the first reflecting unit 925A. As a result, the image of the subject from the second image pickup region is incident on the image pickup apparatus 91 via the optical element 925 (see FIG. 7B).

Further, a case where the third imaging region is imaged by the imaging apparatus 91 will be described with reference to FIGS. 8A and 8B.

The control module 11 outputs a control signal to the first motor 923B to move the image pickup apparatus 91. In this case, the control module 11 moves the image pickup device 91 to a position where it overlaps with the second actuator 6 from the right side in the front-rear direction among the plurality of actuators 6 (see FIG. 8A). Further, the control module 11 outputs a control signal to the second motor 924B to move the optical element 925. In this case, the control module 11 moves the optical element 925 to a position where it overlaps with the second and third actuators 6 from the right side in the front-rear direction among the plurality of actuators 6 (see FIG. 8A).

The control module 11 turns on the light source 926 and causes the image pickup device 91 to take an image of the third image pickup region. In this case, the image of the subject (component P1) from the third imaging region is refracted by the fifth reflection unit 925E, passes through the optical element 925, and is reflected by the fourth reflection unit 925D and the third reflection unit 925C. The image of the subject reflected by the third reflection unit 925C is refracted by the second reflection unit 925B and then reflected upward by the first reflection unit 925A. As a result, the image of the subject from the third imaging region is incident on the imaging device 91 via the optical element 925 (see FIG. 8B).

Also in the first modification, when the image pickup device 91 captures the third imaging region, the mounting device 1A is configured to image the component P1 from the diagonally left direction by the fifth reflection unit 925E (see FIG. 8A). ). Therefore, before the component P1 is mounted on the board B1, the land position and the solder position on the board B1 can be recognized, and as a result, it is possible to perform fine correction in the X-axis direction and the Y-axis direction. The mounting accuracy can be improved. Further, after the component P1 is mounted, the mounting position of the component P1 can be recognized, and as a result, the mounting defect or the like can be detected after the component P1 is mounted, and it can also be used for the cause analysis of the mounting defect or the like. ..

(4.2) Other Modifications The modifications of the above-described embodiment are listed below. The modifications described below can be applied in combination as appropriate.

The mounting devices 1 and 1A are not limited to factories, but may be used in facilities such as laboratories, offices, stores and educational facilities. In particular, when the mounting devices 1, 1A have a relatively small size of, for example, about 1000 mm or less on each side, even in a facility where it is difficult to secure an installation space for the mounting devices 1, 1A such as a laboratory. , Can be easily installed. By being installed in such a facility, the mounting devices 1, 1A can be used, for example, for the production of high-mix low-volume production products or prototypes.

The number of the capture unit 70 and the actuator 6 is not limited to one, two or four, respectively, and may be three or five or more. That is, the number of the capture unit 70 and the actuator 6 is not limited to the above-described embodiment and the first modification. Further, the capturing portions 70 may not be arranged side by side in one direction (X-axis direction), and may be arranged side by side in an annular shape, for example.

The shape and dimensions of each part of the mounting devices 1 and 1A described above are merely examples, and can be appropriately changed.

In the above-described embodiment, the case where the light source 922 to be turned on is switched according to the image pickup region to be imaged by the image pickup apparatus 91 has been described, but for example, it may be configured to be identified by the emission color. For example, the first light source 922A to be turned on when the first image pickup area is imaged is red, the second light source 922B to be turned on when the second image pickup area is imaged is green, and the third light source 922B to be turned on when the third image pickup area is imaged. When the three light sources 922C are blue, the first to third imaging regions can be identified.

In the above-described embodiment, the substrate B1 is recognized by the recognition mark M1 provided on the upper surface of the substrate B1, but the substrate B1 is recognized by a part of the substrate B1 (for example, the corner of the substrate B1) instead of the recognition mark M1. It may be configured to be recognized.

In the above-described embodiment, the case where the first object is the component P1 and the second object is the substrate B1 has been described as an example, but the first object and the second object are second to the second object. 1 As long as it is configured to mount an object, it is not limited to the component P1 and the substrate B1.

In the above-described embodiment, the case where the first imaging region, the second imaging region, and the third imaging region are imaged by one imaging device 91 has been described as an example, but the first imaging region, the second imaging region, and the third imaging region have been described. As long as the region is included, four or more imaging regions may be imaged by the imaging device 91.

In the above-described embodiment and the first modification, the control module 11 controls the light source 922,926, the first motor 923B, and the second motor 924B, but is configured to be controlled by, for example, the work module 13. May be.

In the above-mentioned first modification, the first moving shaft 923A and the first motor 923B form the first moving mechanism 923, and the second moving shaft 924A and the second motor 924B form the second moving mechanism 924. There is. On the other hand, the first moving shaft 923 with a built-in linear motor constitutes the first moving mechanism 923, and the second moving shaft 924A with a built-in linear motor constitutes the second moving mechanism 924. May be good.

(summary)
As is clear from the above-described embodiment, the mounting apparatus (1,1A) according to the first aspect is the first object (1,1A) captured by the capture unit (70) that captures the first object (P1). P1) is mounted on the second object (B1) positioned at a predetermined position. The mounting device (1,1A) includes a capturing unit (70), one image pickup device (91), and an image pickup area selection mechanism (92). The imaging region selection mechanism (92) enables the imaging apparatus (91) to capture a plurality of imaging regions including a first imaging region, a second imaging region, and a third imaging region. The first imaging region is an region provided on the second object (B1) and includes a recognition mark (M1) for recognizing the second object (B1) in the subject. The second imaging region is an region that includes the first object (P1) captured by the capture unit (70) in the subject. The third imaging region is an region including the first object (P1) mounted on the second object (B1) in the subject.

According to the first aspect, the state of being mounted on the second object (B1), the first object (P1) captured by the capturing unit (70), and the second object (B1). The first object (P1) can be recognized by one image pickup device (91).

The mounting device (1A) according to the second aspect includes, in the first aspect, a plurality of capture units (70) arranged side by side in one direction. The imaging region selection mechanism (92) has a first moving mechanism (923), an optical element (925), and a second moving mechanism (924). The first movement mechanism (923) moves the image pickup device (91) in the arrangement direction of the plurality of capture units (70). The optical element (925) outputs an image of a subject incident from at least one imaging region among the plurality of imaging regions to the imaging device (91). The second moving mechanism (924) moves the optical element (925) in the above-mentioned arrangement direction.

According to the second aspect, the image pickup device (91) and the optical element (925) can be moved separately.

In the mounting device (1A) according to the third aspect, in the second aspect, the image pickup region selection mechanism (92) adjusts the position of the image pickup device (91) and the position of the optical element (925) in the arrangement direction. By doing so, the imaging region to be imaged by the imaging apparatus (91) is selected from the plurality of imaging regions.

According to the third aspect, by adjusting the position of the image pickup device (91) and the position of the optical element (925), a plurality of image pickup areas can be imaged by one image pickup device (91).

In the mounting device (1) according to the fourth aspect, in the first aspect, the imaging region selection mechanism (92) outputs an image of a subject incident from each of the plurality of imaging regions to the imaging apparatus (91). It has an element (921). The image pickup apparatus (91) and the optical element (921) are fixed.

According to the fourth aspect, there is an advantage that a moving mechanism for moving the image pickup apparatus (91) and the optical element (921) is not required.

In the mounting device (1) according to the fifth aspect, in the fourth aspect, the imaging region selection mechanism (92) further has a plurality of light sources (922). The image pickup area selection mechanism (92) switches the light source (922) to be turned on among the plurality of light sources (922) according to the image pickup area to be imaged by the image pickup device (91) among the plurality of image pickup areas.

According to the fifth aspect, a plurality of imaging regions can be imaged by one imaging device (91) only by switching the light source (922) to be turned on.

In the mounting apparatus (1,1A) according to the sixth aspect, in any one of the second to fifth aspects, the optical element (921, 925) includes a reflecting unit (921A to 921F, 925A to 925E). The reflecting unit (921A to 921F, 925A to 925E) reflects the image of the subject incident from the image pickup area to be imaged by the image pickup device (91) to the image pickup device (91) among the plurality of image pickup areas.

According to the sixth aspect, the image of the subject reflected by the reflecting unit (921A to 921F, 925A to 925E) can be imaged by the image pickup apparatus (91).

The configurations according to the second to sixth aspects are not essential configurations of the mounting apparatus (1,1A) and can be omitted as appropriate.

1,1A Mounting device 9 Imaging system 91 Imaging device 92 Imaging area selection mechanism 921 Optical elements 921A to 921F Reflector 922 Light source 922A First light source (light source)
922B Second light source (light source)
922C 3rd light source (light source)
923 1st moving mechanism 924 2nd moving mechanism 925 Optical elements 925A to 925E Reflecting part 926 Light source 70 Capturing part P1 Parts (1st object)
B1 board (second object)
M1 recognition mark

Claims (6)

A mounting device for mounting the first object captured by a capturing unit that captures the first object on a second object positioned at a predetermined position.
With the catching part
One image pickup device and
It is provided with an imaging region selection mechanism that enables the imaging apparatus to capture a plurality of imaging regions including a first imaging region, a second imaging region, and a third imaging region.
The first imaging region is an region provided on the second object and includes a recognition mark for recognizing the second object in the subject.
The second image pickup region is a region including the first object captured by the capture unit in the subject.
The third imaging region is a mounting device that includes the first object mounted on the second object in the subject and includes at least a part of the capture unit in the subject . It is provided with a plurality of the capture portions arranged side by side in one direction.
The imaging region selection mechanism is
A first moving mechanism that moves the image pickup device in the arrangement direction of the plurality of capture units, and
An optical element that outputs an image of the subject incident from at least one of the plurality of imaging regions to the imaging apparatus.
The mounting device according to claim 1, further comprising a second moving mechanism for moving the optical element in the arrangement direction. 2. The imaging region selection mechanism selects an imaging region to be imaged by the imaging apparatus from the plurality of imaging regions by adjusting the position of the imaging apparatus and the position of the optical element in the arrangement direction. The mounting device described in. The image pickup area selection mechanism has an optical element that outputs an image of the subject incident from each of the plurality of image pickup areas to the image pickup apparatus.
The mounting device according to claim 1, wherein the image pickup device and the optical element are fixed. The imaging region selection mechanism further has a plurality of light sources and has a plurality of light sources.
The mounting device according to claim 4, wherein the imaging region selection mechanism switches a light source to be turned on among the plurality of light sources according to an imaging region to be imaged by the imaging apparatus among the plurality of imaging regions. The one according to any one of claims 2 to 5, wherein the optical element includes a reflecting portion that reflects an image of the subject incident from the imaging region imaged by the imaging apparatus to the imaging apparatus among the plurality of imaging regions. Mounting device.

Images