JP7057432B2 - 樹脂組成物、膜、積層体、接合構造体、積層体の製造方法および接合構造体の製造方法 - Google Patents

樹脂組成物、膜、積層体、接合構造体、積層体の製造方法および接合構造体の製造方法 Download PDF

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JP7057432B2
JP7057432B2 JP2020549193A JP2020549193A JP7057432B2 JP 7057432 B2 JP7057432 B2 JP 7057432B2 JP 2020549193 A JP2020549193 A JP 2020549193A JP 2020549193 A JP2020549193 A JP 2020549193A JP 7057432 B2 JP7057432 B2 JP 7057432B2
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resin composition
capsule
resin
protrusion
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Japanese (ja)
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JPWO2020066974A1 (ja
Inventor
吉則 堀田
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Fujifilm Corp
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Fujifilm Corp
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/22—Layered products comprising a layer of synthetic resin characterised by the use of special additives using plasticisers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
    • B32B3/30—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by a layer formed with recesses or projections, e.g. hollows, grooves, protuberances, ribs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/10—Encapsulated ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits

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  • Chemical & Material Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP2020549193A 2018-09-27 2019-09-24 樹脂組成物、膜、積層体、接合構造体、積層体の製造方法および接合構造体の製造方法 Active JP7057432B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2018181635 2018-09-27
JP2018181635 2018-09-27
PCT/JP2019/037186 WO2020066974A1 (ja) 2018-09-27 2019-09-24 樹脂組成物、膜、積層体、接合構造体、積層体の製造方法および接合構造体の製造方法

Publications (2)

Publication Number Publication Date
JPWO2020066974A1 JPWO2020066974A1 (ja) 2021-09-24
JP7057432B2 true JP7057432B2 (ja) 2022-04-19

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JP2020549193A Active JP7057432B2 (ja) 2018-09-27 2019-09-24 樹脂組成物、膜、積層体、接合構造体、積層体の製造方法および接合構造体の製造方法

Country Status (3)

Country Link
JP (1) JP7057432B2 (zh)
TW (1) TW202033667A (zh)
WO (1) WO2020066974A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102021208433A1 (de) * 2021-08-04 2023-02-09 Contitech Ag Gesteuerter Polymerkettenabbau durch mikroverkapselte Substanzen

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000294889A (ja) 1999-04-06 2000-10-20 Sony Corp 実装基板およびこれを用いた回路部品の実装方法
JP2002163939A (ja) 2000-11-27 2002-06-07 Showa Electric Wire & Cable Co Ltd 可塑剤入りマイクロカプセル含有被覆層付ケーブル
JP2002356623A (ja) 2001-05-30 2002-12-13 Toyota Motor Corp 微生物を含む生分解性樹脂
JP2004227730A (ja) 2003-01-27 2004-08-12 Fuji Photo Film Co Ltd 光ディスク、及び光ディスクへの表示用シート貼り付け方法
JP2009288577A (ja) 2008-05-30 2009-12-10 Ricoh Co Ltd 静電荷像現像用トナー、現像剤、トナー入り容器、プロセスカートリッジ、画像形成装置、画像形成方法
JP2014164125A (ja) 2013-02-25 2014-09-08 Fujifilm Corp 紫外線感知シート、その製造方法、および紫外線感知方法
US20170029582A1 (en) 2015-07-29 2017-02-02 International Business Machines Corporation Method and composition to ensure degradation of plastic films in an anaerobic environment, such as a landfill
JP2017113911A (ja) 2015-12-22 2017-06-29 株式会社シード 字消し

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59204591A (ja) * 1983-05-09 1984-11-19 Mitsubishi Paper Mills Ltd 記録用媒体及びその処理方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000294889A (ja) 1999-04-06 2000-10-20 Sony Corp 実装基板およびこれを用いた回路部品の実装方法
JP2002163939A (ja) 2000-11-27 2002-06-07 Showa Electric Wire & Cable Co Ltd 可塑剤入りマイクロカプセル含有被覆層付ケーブル
JP2002356623A (ja) 2001-05-30 2002-12-13 Toyota Motor Corp 微生物を含む生分解性樹脂
JP2004227730A (ja) 2003-01-27 2004-08-12 Fuji Photo Film Co Ltd 光ディスク、及び光ディスクへの表示用シート貼り付け方法
JP2009288577A (ja) 2008-05-30 2009-12-10 Ricoh Co Ltd 静電荷像現像用トナー、現像剤、トナー入り容器、プロセスカートリッジ、画像形成装置、画像形成方法
JP2014164125A (ja) 2013-02-25 2014-09-08 Fujifilm Corp 紫外線感知シート、その製造方法、および紫外線感知方法
US20170029582A1 (en) 2015-07-29 2017-02-02 International Business Machines Corporation Method and composition to ensure degradation of plastic films in an anaerobic environment, such as a landfill
JP2017113911A (ja) 2015-12-22 2017-06-29 株式会社シード 字消し

Also Published As

Publication number Publication date
TW202033667A (zh) 2020-09-16
JPWO2020066974A1 (ja) 2021-09-24
WO2020066974A1 (ja) 2020-04-02

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