JP7055590B2 - Press-through pack lid material and press-through pack packaging - Google Patents

Description

The present invention relates to a press-through pack lid material and a press-through pack package using the lid material.

In a press-through pack (hereinafter, may be referred to as "PTP") package that has been commercially available, the lid material is mainly composed of an aluminum foil and a heat-adhesive layer (see, for example, Patent Document 1). A lid material and a resin sheet having a pocket capable of accommodating a drug (tablet, capsule, etc.) are adhered to each other via a heat-adhesive layer to form a PTP package. By applying pressure to the container (pocket) of the PTP package with a finger, the drug as the content breaks through the lid material and can be easily taken out, so that it is widely used in hospitals, pharmacies, drug stores and the like.

In recent years, it has been desired to control whether or not the drugs prescribed to patients are properly taken. In order to manage such information, for example, in Patent Document 2, a circuit that is partially disconnected due to discharge of a drug is provided on the surface of the lid material, and in Patent Document 3, the IC chip is used. It has been proposed to mount the mounted module on the surface of the lid. In both proposals, the PTP package including the lid material is the one of the prior art. Specifically, the circuit and the IC module prepared separately from the PTP package are covered with the adhesive material. Information management is possible by attaching it to the surface.

In both Patent Documents 2 and 3, the use of an adhesive material is indispensable because a member prepared separately from the PTP package is attached to the surface. Therefore, when the drug is taken out, there is a risk that the adhesive material adheres to the surface of the drug and is accidentally swallowed together with the drug. Further, if the mounting position of the circuit or the IC module with respect to the PTP package is displaced, the adhesive material may be exposed and attached to the hand, and may be accidentally swallowed as it is. Furthermore, the surface of the lid material is obliged to display the drug name, dose, barcode, etc., but if a circuit or IC module is attached, these information cannot be read.

Japanese Unexamined Patent Publication No. 2006-591 Japanese Unexamined Patent Publication No. 2013-161638 Japanese Unexamined Patent Publication No. 2015-170247

In order to solve the above-mentioned problems of the techniques of Patent Documents 2 and 3, a member that enables information management such as a circuit or an IC module in advance on the lid material before becoming a PTP package (hereinafter, "medication management"). It is conceivable to incorporate (sometimes referred to as a "member") and heat-bond the lid material to the resin film to obtain the desired PTP package. However, even in that case, the following problems may occur.

(A) Unlike the conventional lid material, a medication control member is added inside, so that heat is poorly transferred to the heat-bonding layer during the bonding process as compared with a lid material that does not have a medication control member. As a result, the adhesion between the resin sheet and the lid material is weakened, so that the sealing property is deteriorated, and the drug reacts with oxygen and moisture in the outside air to reduce the efficacy.
(B) By incorporating the medication control member into the lid material, the strength of the lid material is increased, and it becomes difficult to take out the drug (hereinafter, the drug take-out performance may be referred to as "press-through property") (that is,). Press-through property is reduced).
(C) Since strong heat and pressure are applied to the lid material during thermal adhesion to the resin sheet, the medication control member is destroyed and the expected function cannot be obtained.

An object of the present invention is to provide a PTP lid material and a PTP package that do not cause the above-mentioned problems (A) to (C) while solving the problems of the above-mentioned techniques of Patent Documents 2 and 3. ..

The present inventors have investigated whether or not the above problems can be solved by laminating specific materials in a specific order so as to have a specific thickness, and further improve the obtained findings to present the present invention. Has been completed.

That is, the present invention includes, for example, the subjects described in the following sections.
Item 1.
A heat-adhesive layer, an aluminum foil, a resin layer, and a circuit-patterned conductor layer are provided in order from the side closest to the contents.
The conductor layer has a thickness of 5 μm or more, and the total thickness of the conductor layer and the aluminum foil is 15 μm or more and 55 μm or less.
The resin layer has a thickness of 3 μm or more and 22 μm or less, and a puncture strength of 3 N or more and 20 N or less.
A press-through pack lid material characterized by being.
Item 2.
Item 2. The press-through pack lid material according to Item 1, wherein the resin layer contains polyethylene terephthalate or polyethylene naphthalate. (It is more preferable that the resin layer contains a polyethylene terephthalate film or a polyethylene naphthalate film, and it is further preferable that the resin layer has an adhesive layer on both sides of the polyethylene terephthalate film or the polyethylene naphthalate film).
Item 3.
Item 2. The press-through pack lid material according to Item 1 or 2, wherein the conductor layer is made of aluminum foil, copper foil, or a conductive paste.
Item 4.
Item 2. The press-through pack lid material according to any one of Items 1 to 3, wherein at least a part of the conductor layer is coated with a resin.
Item 5.
Item 2. The press-through pack lid material according to any one of Items 1 to 4, wherein the heat-adhesive layer contains a vinyl chloride-vinyl acetate copolymer resin.
Item 6.
A resin sheet with a storage unit that can store the contents, and
Item 2. The press-through pack lid material according to any one of Items 1 to 5, which is laminated so as to close the opening of the storage portion with respect to the resin sheet.
Press-through pack packaging with.

In the present invention, in order to solve the problems of the techniques of Patent Documents 2 and 3 described above, a medication management member such as a circuit or an IC module is incorporated in advance in the lid material before the PTP package is formed. However, even if the lid material is heat-bonded to the resin film, the above-mentioned problems (A) to (C) are prevented from occurring.

The schematic diagram of the PTP lid material produced in Examples 1 to 4, 7 to 9 and Comparative Examples 1 to 2, 4 to 6 is shown. The schematic diagram of the PTP lid material produced in Example 5 is shown. The schematic diagram of the PTP lid material produced in Example 6 and Comparative Example 3 is shown.

Hereinafter, the PTP lid material (press-through pack lid material) and the PTP package (press-through pack package) according to the present invention will be described in more detail.

The PTP lid material according to the present invention includes a heat-adhesive layer, an aluminum foil, a resin layer, and a circuit-patterned conductor layer in this order. The circuit-patterned conductor layer here can serve as the above-mentioned medication management member. The heat-adhesive layer is a layer for adhering the resin sheet provided with the storage portion capable of accommodating the contents and the PTP lid material, and the PTP package can be manufactured by heat-adhering these. In other words, when the PTP package is formed, the side closer to the contents is the heat-adhesive layer.

Further, in the PTP lid material, the conductor layer has a thickness of 5 μm or more, and the conductor layer and the aluminum foil have a total thickness of 15 μm or more and 55 μm or less. The thickness of the resin layer is 3 μm or more and 22 μm or less, and the puncture strength is 3 N or more and 20 N or less. The heat-adhesive layer, the aluminum foil, the resin layer, and the circuit-patterned conductor layer may be provided with another layer between the respective layers as long as the effect of the present invention is not impaired, but these four layers are sequentially provided. It is preferable that they are in contact with each other (in other words, there is no other layer between each layer).

Hereinafter, each layer will be described more specifically.

As the heat-adhesive layer, a heat-adhesive layer (heat-adhesive) used in known PTP can be used. For example, a polypropylene-based adhesive, a vinyl chloride-based adhesive (particularly preferably a vinyl chloride-vinyl acetate copolymer) and the like can be used. These can be used alone or in combination of two or more as long as the effects of the present invention are not impaired. The amount of the heat adhesive applied is preferably about 0.5 to 15 g / m ² after drying, and more preferably about 1 to 10 g / m ² . Examples of the heat-sealing condition at the time of manufacturing the package are about 1 to 3 seconds at about 140 to 260 ° C. From the viewpoint of sealing performance, the cross-sectional shape after sealing is preferably a continuous uneven (preferably jagged) mesh seal. The thickness of the heat-adhesive layer depends on the amount of the adhesive applied, but is preferably about 4 to 10 μm, for example.

As the aluminum foil, for example, a known aluminum foil conventionally used in PTP can be used. More specifically, 1N30 material, 8021 material, 8079 material and the like in the JIS standard can be exemplified. Further, regarding the tempering of the aluminum foil, a soft material, a semi-hard material, or a hard material can be adopted, and the hard material is particularly preferable.

The thickness of the aluminum foil is preferably about 10 to 35 μm, more preferably about 15 to 35 μm. If the thickness of the aluminum foil is less than 10 μm, the moisture resistance may be poor, and if it exceeds 35 μm, the press-through property may be impaired.

A known resin film can be used as the resin layer. Known resin films include, for example, polyethylene-based resin, polypropylene-based resin, polyester-based resin, polyamide (nylon) resin, (meth) acrylic resin, polyvinyl chloride resin, polystyrene resin, polyvinylidene chloride resin, and ethylene-vinyl acetate. Examples thereof include resin films such as a polymer resin, a polyvinyl alcohol resin, a polycarbonate resin, a polyvinyl acetate resin, and an acetal resin.
Further, those films obtained by drilling holes can also be preferably used. The method of drilling is not particularly limited, and drilling can be performed by laser machining, melt machining with a hot needle, melt drilling with a solvent, machining with a protrusion roll, or the like.

Examples of the polyethylene-based resin include high-density polyethylene, low-density polyethylene, and linear polyethylene. Examples of the polypropylene-based resin include homopolypropylene, random polypropylene, and block polypropylene. Examples of the polyester resin include polyethylene terephthalate and polyethylene naphthalate.

Further, as the resin layer, a resin layer to which a known adhesive or ink is applied and dried can also be preferably used. Examples of such an adhesive include epoxy resin, polyester resin, acrylic resin, urethane resin, silicon resin, polyimide resin, vinyl chloride resin and the like. Further, those films obtained by drilling holes can also be preferably used.

The piercing strength of the resin layer is 3 to 20 N, preferably 5 to 15 N, and more preferably 6 to 12 N. The thickness is 3 to 22 μm, preferably 5 to 18 μm, and more preferably 6 to 15 μm.

The puncture strength and thickness of the resin layer can be arbitrarily set as long as they are in the range of 3 to 20 N and 3 to 22 μm, respectively, but are particularly preferably 6 to 12 N and 6 to 15 μm.

The piercing strength is defined as the maximum load required to penetrate the punch by piercing the resin layer with a punch having a hemispherical tip and a diameter of φ5 mm at a speed of 50 mm / min. The puncture strength can be adjusted by changing the number of through holes in the resin layer (particularly the resin film and / or the adhesive layer) in the drilling process. In particular, it is preferable to adjust the number of through holes by drilling by drilling using conical protrusions in order to adjust the puncture strength.

As a particularly preferable resin layer, a resin layer having adhesive layers on both sides of the resin film can be mentioned. As described above, where the resin layer is sandwiched between the aluminum foil and the conductor layer, the adhesive used to bond the resin film to the aluminum foil and the conductor layer is between the resin film and the aluminum foil as the adhesive layer. , And the form existing between the resin film and the conductor layer, respectively, is preferable. In this case, the portion where the resin film and the adhesive layer are combined corresponds to the resin layer. Therefore, in this case, the total thickness of the resin film and the adhesive layer is 3 to 22 μm, and the puncture strength of the resin film and the adhesive layer is 3 to 20 N. The adhesives used for these adhesive layers may be the same or different, and are preferably the same.

The conductor layer has a circuit-like pattern formed of a conductive material. Examples of the conductive material include metal foils such as aluminum foil and copper foil, and conductive pastes such as Ag ink and carbon ink. The aluminum foil may be either a pure aluminum foil or an aluminum alloy foil, and similarly, the copper foil may be either a pure copper foil or a copper alloy foil. The thickness of the conductor layer is 5 μm or more, and the total thickness of the aluminum foil existing between the heat-adhesive layer and the resin layer and the conductor layer is set to be 55 μm or less. The thickness of the conductor layer can be arbitrarily set within the above range, but it is preferably 5 to 20 μm, more preferably 6 to 15 μm. That is, the thickness of the aluminum foil existing between the heat-adhesive layer and the resin layer is preferably about 10 to 35 μm, and the thickness of the conductor layer is 5 μm or more and 45 μm or less (preferably 5 to 20 μm, more preferably 6 to 15 μm). ), However, the total thickness of these (the aluminum foil and the conductor layer) is 15 μm or more and 55 μm or less.

The circuit pattern of the conductor layer can be formed by a known method. For example, photolithography can be used to form a metal leaf into a circuit-like pattern. More specifically, for example, a circuit-like pattern can be formed by printing a resist on a metal foil, further performing an etching process, and then peeling off the resist. Further, for the conductive paste layer, a circuit-like pattern can be formed by, for example, a silk screen printing method.

Further, for protection, it is preferable that a part or the whole of the circuit pattern is covered with a protective resin. That is, in the present invention, a protective layer made of resin may be provided on the conductor layer. As the protective resin, a known one can be used. For example, polyester resin, nitrocellulose resin, epoxy resin and the like can be mentioned.

Further, the surface layer of the conductor layer may be provided with a printing layer, a colored layer, or the like, if necessary. The print layer and the colored layer may be provided on the protective layer.

The PTP lid material according to the present invention can be manufactured, for example, as follows. That is, after forming through holes in the resin film as necessary to adjust the piercing strength, an aluminum foil is adhered to one side of the resin film using an adhesive, and a circuit-like pattern is formed in advance on the other side. A preferred PTP lid according to the present invention is formed by adhering a layer (for example, a metal foil having a circuit-shaped pattern formed) with an adhesive and further applying a thermal adhesive to the surface of the aluminum foil opposite to the resin film. The material can be manufactured. Alternatively, for the conductive layer, a circuit-like pattern can be formed after being adhered to the resin film.

Further, the PTP package according to the present invention includes a resin sheet provided with a storage portion capable of storing the contents and a resin sheet.
The PTP lid material laminated so as to close the opening of the storage portion with respect to the resin sheet is provided. As the resin sheet, a resin sheet used for a known PTP package can be used.

The PTP package can be obtained by heat-bonding the PTP lid material and the resin sheet. In this case, the PTP lid material and the resin sheet are adhered to each other by the thermal adhesive layer provided in the PTP lid material. Thermal adhesion can be performed by a known method. For example, it can be performed by adding a temperature of about 150 ° C. to 200 ° C. for 0.5 to several seconds (for example, about 1, 2, or 3 seconds).

According to the present invention, it is possible to prevent the above problems (A) to (C) from occurring.

Regarding the above problem (A), by setting the thickness of the resin layer and the conductor layer as described above, it is possible to apply heat equivalent to that of the lid material having no medication control member to the heat adhesive layer.

Adhesion between the resin sheet provided with the storage part that can store the contents and the PTP lid material is heat from the surface of the aluminum foil where the heat adhesive layer does not exist (the surface where the resin layer and the conductor layer exist). In order to obtain strong adhesion, it is necessary to apply sufficient heat to the heat-bonding layer via the conductor layer / resin layer / aluminum foil. If the resin layer is thicker than 22 μm, heat conduction to the heat-adhesive layer deteriorates, and the adhesion and sealing property between the resin sheet and the lid material become insufficient. Further, if the total thickness of the aluminum foil and the conductor layer exceeds 55 μm, the heat accumulated in these layers becomes large among the heat applied to the lid material, and the heat of the heat adhesive layer is also insufficient. Insufficient sealing.

Regarding the above problem (B), by setting the puncture strength of the resin layer to 3 to 20 N, the tablets can be taken out without any problem even if the medication control member is incorporated in the lid material. When the piercing strength exceeds 20 N, the press-through property is greatly reduced.

Regarding the above problem (C), when the piercing strength is less than 3N, the resin layer breaks when the resin sheet and the lid material are thermally bonded, and the aluminum foil and the conductor layer come into contact with each other as designed. You will not be able to get the circuit. Further, even if the puncture strength of the resin layer is in the range of 3 to 20 N, if the thickness is less than 3 μm, the same problem occurs.

Further, when the thickness of the conductor layer is less than 5 μm, the circuit is broken and the expected function cannot be obtained.

In addition, in this specification, "includes" also includes "consisting essentially" and "consisting of" (The term "comprising" includes "consisting essentially of" and "consisting of.").

Hereinafter, the present invention will be specifically described, but the present invention is not limited to the following examples.

The following evaluations and confirmations were carried out for Examples and Comparative Examples according to the present invention. As the test body, a total of 15 bodies shown in Examples 1 to 9 and Comparative Examples 1 to 6 below were used. Regarding the piercing strength, a punch having a hemispherical tip and a diameter of φ5 mm was pierced into the resin layer at a speed of 50 mm / min, and the maximum load required for the punch to penetrate was taken as the numerical value.

(I) After immersing the PTP package in a closed container filled with water colored with a sealing dye (methylene blue), the pressure was reduced to the reduced pressure set value of −500 mmHG and the mixture was left for 5 minutes. Then, the pressure was returned to normal pressure, and the presence or absence of water intrusion into the PTP package was confirmed. The evaluation results are indicated by the following symbols.
◯: No water ingress into the package.
×: There is water ingress inside the package.
(Ii) Press-through property The bottom of the container of each package (the pocket portion on the opposite side of the lid material) was pressed with a finger, and it was confirmed whether the tablet could break through the lid material and take out the tablet. The evaluation results are indicated by the following symbols.
◯: Tablets can be taken out without any problem.
X: The lid material cannot be pierced and the tablet cannot be taken out.
(Iii) The circuit pattern was broken and the contact between the aluminum foil and the conductor layer was visually observed and the electric resistance value was measured, and it was confirmed whether the circuit pattern was broken and there was no contact between the aluminum foil and the conductor layer. The results are displayed as follows.
◯: Neither problem has occurred.
× (disconnection): The circuit pattern is disconnected.
× (short circuit): The aluminum foil and the conductor layer are in contact with each other.

(Example 1)
A 14 μm-thick polyethylene terephthalate film (“Tiafine (registered trademark) TF110” manufactured by Toyobo Co., Ltd.) was perforated with 1900 through holes per cm ² using conical protrusions, and was thick as a conductor layer. Using a 10 μm aluminum foil (1N30, soft material manufactured by Toyo Aluminum Co., Ltd.), an adhesive resin (urethane resin adhesive manufactured by DIC Co., Ltd .: LX500, 100 parts) was cured on one side of the aluminum foil. 10 parts of KW75, which is an agent, was mixed), dried, and then laminated on the polyethylene terephthalate film.

Next, after forming the aluminum foil into a circuit pattern by the photolithography method, an adhesive resin (similar to the above) is applied to the surface of the polyethylene terephthalate film on the side where the circuit is not formed, and then dried. It was laminated and bonded on top of a 20 μm thick aluminum foil (1N30, hard material manufactured by Toyo Aluminum Co., Ltd.).

At this time, the layer in which the adhesive resin and the polyethylene terephthalate film were combined was the resin layer, the thickness of the resin layer was about 18 μm, and the puncture strength was 10 N. As a sample for measuring the puncture strength, the above-mentioned "aluminum foil (conductor layer) with a thickness of 10 μm / adhesive resin / polyethylene terephthalate film 14 μm / adhesive resin / aluminum foil with a thickness of 20 μm" is concentrated. It was obtained by immersing in 8% hydrochloric acid (temperature 35 ° C.) for 5 minutes to dissolve the aluminum foils on both sides.

A vinyl chloride-vinyl acetate copolymer heat adhesive (weight 5 g / m ² after drying) is gravure-rolled on the non-bonded surface of a 20 μm-thick aluminum foil (that is, the surface opposite to the polyethylene terephthalate film side). Was applied and dried to form a heat-adhesive layer, and a lid material was prepared.

A tablet having a diameter of 8 mm was stored in a resin sheet for PTP made of vinyl chloride having a plurality of pockets, and the lid material was heat-sealed at 180 ° C. for 1 second to prepare a PTP package.

(Examples 2 to 4, 7 to 9 and Comparative Examples 1 to 2, 4 to 6)
A PTP package was produced in the same manner as in Example 1 except that the thickness of the conductor layer and the aluminum foil, and the thickness and the puncture strength of the resin layer were as shown in Table 1. In Example 4, a copper foil (Mitsui Mining & Smelting Co., Ltd. electrolytic copper foil: 3EC-M1S-VLP) was used as the conductor instead of the aluminum foil. The puncture strength of the resin layer was adjusted by changing the number of through holes in the drilling process using the conical protrusions.

(Example 5)
Adhesive resin (epoxy resin coating agent manufactured by DIC Corporation: TF-610) is applied to one side of the aluminum foil, and conductive Ag ink (Dotite FA-323 manufactured by Fujikura Kasei Co., Ltd.) is used on it. A PTP package was produced in the same manner as in Example 1 except that the circuit pattern was formed by the silk screen printing method.

(Example 6 and Comparative Example 3)
The aluminum foil and the conductor layer are directly bonded with an adhesive resin (epoxy resin adhesive manufactured by Toa Synthetic Co., Ltd., Alonmighty BX-60) to obtain the desired resin layer, and then the conductor layer is circuited by the photolithography method. A PTP package was produced in the same manner as in Example 1 except that it was formed in a pattern.

FIG. 1 shows a schematic diagram of the PTP lid material produced in Examples 1 to 4, 7 to 9 and Comparative Examples 1 to 2, 4 to 6, and FIG. 2 shows a schematic diagram of the PTP lid material produced in Example 5. FIG. 3 shows a schematic diagram of the PTP lid material produced in Example 6 and Comparative Example 3, respectively.

Claims (5)

A heat-adhesive layer, an aluminum foil, a resin layer, and a circuit-patterned conductor layer are provided in this order from the side closest to the contents, and a protective layer made of resin is provided on the conductor layer, and at least a part of the conductor layer is made of resin. Covered
The conductor layer has a thickness of 5 μm or more, and the total thickness of the conductor layer and the aluminum foil is 15 μm or more and 55 μm or less.
The resin layer has a thickness of 3 μm or more and 22 μm or less, and a puncture strength of 8 N or more and 20 N or less.
And
A press-through pack lid material, wherein the conductor layer is made of a metal foil. The press-through pack lid material according to claim 1, wherein the resin layer contains polyethylene terephthalate or polyethylene naphthalate. The press-through pack lid material according to claim 1 or 2, wherein the conductor layer is made of aluminum foil or copper foil. The press-through pack lid material according to any one of claims 1 to 3 , wherein the heat-adhesive layer contains a vinyl chloride-vinyl acetate copolymer resin. A resin sheet with a storage unit that can store the contents, and
The press-through pack lid material according to any one of claims 1 to 4 , which is laminated with respect to the resin sheet so as to close the opening of the storage portion.
Press-through pack packaging with.

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