JP4814580B2 - Laminated film for packaging and packaging bag - Google Patents

Description

  The present invention relates to a laminated film for packaging and a packaging bag, and, as an example, relates to a laminated film for packaging and a packaging bag suitable for packaging electronic parts such as semiconductors and ICs, and electronic machine devices provided with these electronic parts.

  Semiconductors, ICs, and other electronic components are susceptible to adverse effects of static electricity and surrounding electric and magnetic fields, which may cause errors, malfunctions, damage, and the like. For this reason, a packaging material for packaging such electronic components is required to have antistatic properties and electrostatic shielding properties.

  From such demands, packaging laminated films with antistatic properties and electrostatic shielding properties, and packaging bags obtained by making bags are used for packaging electronic components, etc. A laminated film for packaging having the layer structure shown in FIG.

  The laminated film for packaging shown in FIG. 6 is printed on the laminated surface side of the outer-layer PET film subjected to antistatic treatment to form a printed layer, and an aluminum foil is bonded to the printed layer as a conductive layer, A reinforcing nylon film is bonded to an aluminum foil, and a low-density polyethylene (LDPE) film that is further subjected to antistatic treatment is laminated on the nylon film as a sealant layer.

  In the laminated film for packaging thus formed, not only can the outer layer and the sealant layer be subjected to antistatic treatment so that charging can be suitably prevented, but also provided in the middle. Since the aluminum foil thus formed has conductivity, the packaged object is electrostatically shielded by being covered with a conductor when the packaged object is packaged. It is possible to protect simultaneously from the electric field.

  Moreover, since the aluminum foil provided as the conductive layer has a high barrier property, the laminated film for packaging having the above-described structure exhibits high gas barrier properties and moisture resistance.

  However, in the packaging laminated film configured as described above, the transparency is lost due to the shielding property of the aluminum foil provided as the conductive layer, and as a result, the packaged object cannot be seen from the outside. This is inconvenient when it is necessary to check the package.

  Therefore, instead of such an aluminum foil, a conductive metal such as aluminum is vapor-deposited to such an extent that the transparency is not impaired (the vapor deposition having such transparency is hereinafter referred to as “half vapor deposition”). A laminated film for packaging in which is formed has also been proposed. In the description of the present invention, “transparent” includes “translucent”.

Prior art document information of the present invention includes the following.
JP 2003-145661 A

  In the laminated film for packaging provided with a conductive layer obtained by vapor deposition of conductive metal instead of the aluminum foil provided in the intermediate layer in the laminated film for packaging shown in FIG. By obtaining the conductive layer by the aforementioned “half vapor deposition”, it is possible to achieve both electrostatic shielding and transparency.

  On the other hand, due to the high barrier property of the aluminum foil, characteristics such as moisture resistance, which have been realized by the laminated film shown in FIG. 6, are reduced by replacing it with a conductive layer obtained by half vapor deposition.

  However, since some articles to be packaged such as electronic parts are disliked by humidity, such a packaging material for electronic parts is not only antistatic, but also has transparency and electrostatic shielding properties. In addition, there is a high demand for a packaging material having a composite property with high barrier properties.

  Accordingly, the present invention has been made to eliminate the above-mentioned drawbacks of the prior art, and has antistatic properties, electrostatic shielding properties, and moisture proof properties while maintaining the transparency with which the object to be packaged can be confirmed from the outside. It has an object to provide a laminated film for packaging having heat sealability, and a packaging bag obtained by bag-making the laminated film.

In order to achieve the above object, the laminated film for packaging according to the present invention is a vapor deposited film of at least a conductive metal between a transparent outer layer and a sealant layer, the surface specific resistance of which is antistatic treated to 10 ¹³ Ω / cm ² or less. And a transparent barrier layer made of a vapor-deposited film of an inorganic oxide such as metal oxide or silicon oxide, and having a water vapor permeability of 1.0 g / m ² · d or less,
The sealant layer is formed of linear low density polyethylene, and an organic lubricant is added to the sealant layer in an amount of 0 to 500 ppm and / or an organic antiblocking agent is added in an amount of 500 to 5000 ppm. with facilities to prevent contamination process, characterized by be Rukoto and 0.4 or less in coefficient of static friction slip properties of the sealant layer (claim 1).

  In the laminated film for packaging having the above structure, the conductive layer and / or the barrier layer is provided on a transparent base material layer, and the base material provided with the conductive layer and / or the barrier layer is provided as the outer layer and the sealant. It may be laminated between layers (claim 2).

  Furthermore, a transparent reinforcing film layer may be provided between the outer layer and the sealant layer as required (Claim 3).

In addition, the packaging bag of the present invention is made by the above-described laminated film for packaging (Claim 4 ), and preferably, this is produced by one continuous laminated film for packaging (Claim). 5 ).

  With the configuration described above, it has antistatic properties, electrostatic shielding properties, gas barrier properties, moisture proof properties, and has transparency that allows the contents to be confirmed, and can be easily made into a packaging bag or the like. It was possible to provide a laminated film for packaging having a composite characteristic of heat sealability and a packaging bag.

  In the case of the laminated film for packaging formed on the base material provided with the above-mentioned conductive layer and / or barrier layer separately from the outer layer, these base materials on which the conductive layer and the barrier layer are separately formed are pasted together. Thus, the laminated film for packaging of the present invention can be obtained, and the manufacturing process can be divided, and the strength of the obtained laminated film for packaging can be improved by providing the substrate. It becomes possible.

  Moreover, it becomes possible to ensure a required intensity | strength according to the performance requested | required with respect to the laminated | multilayer film for packaging by providing a reinforcing film layer as needed.

  Furthermore, when the antistatic treatment for the sealant layer is performed by adding an antistatic agent without forming an antistatic agent layer by applying an antistatic agent, heat sealability is impaired due to the presence of the antistatic agent layer. Can be prevented.

  Moreover, the occurrence of defects such as wrinkles at the time of bag making is prevented by setting the slipperiness to 0.4 or less, and problems such as opening of the mouth when filling the package are eliminated.

  The packaging bag obtained by making the packaging laminated film has both the characteristics of the packaging laminated film and, for example, half-folds one continuous packaging laminated film. In the case of packaging bags formed by folding, gusset bags formed by folding, etc., the conductive layer is continuous, so that it is possible to prevent the loss of electrostatic shielding even after processing into a packaging bag. I was able to.

  Next, embodiments of the present invention will be described below.

[Laminated film for packaging]
The laminated film for packaging of the present invention has an electrostatic shielding property between an outer layer treated with antistatic treatment and a sealant layer treated with antistatic treatment, and a conductive layer having transparency, and transparency. And a barrier layer having a gas barrier property, in particular, a barrier property against water vapor, and, if necessary, a reinforcing film layer for maintaining strength, each layer is configured as follows.

  In addition, although the formation order of the above-mentioned conductive layer, barrier layer, and reinforcing film layer is not limited to the above-mentioned order, it can be changed as appropriate. It will be described as being.

1. Outer layer The outer layer described above is a layer that forms the outer side when a bag is made into a packaging bag or the like, and can be formed of various transparent resin films. In this embodiment, polyethylene terephthalate ( PET) film is used as the outer layer.

As an antistatic treatment for the outer layer, an antistatic agent is applied to one surface (outer surface) of the PET film to form an antistatic agent layer, thereby reducing the surface specific resistance to the above value or less. Various methods can be used as long as they can be lowered or an antistatic agent can be contained in the resin constituting the outer layer, and the surface specific resistance of the outer layer can be 10 ¹³ Ω / cm ² or less. Can be adopted.

2. Conductive layer When a package is wrapped with the packaging laminated film of the present invention, the conductive layer surrounds the package and acts as an electrostatic shield. Aluminum, nickel, chromium, and other conductive materials It is formed by depositing these conductive metals to such an extent that transparency is not lost.

  This conductive layer may be formed by directly vapor-depositing on the other surface (the inner surface) of the outer layer described above, and the conductive metal is formed on a transparent substrate provided separately from the outer layer. May be deposited to form a conductive layer, and the substrate on which the conductive layer is formed may be bonded to the outer layer.

  The conductive layer to be formed preferably has a low degree of vapor deposition in order to ensure high transparency. However, if the degree of adhesion is reduced with emphasis only on transparency, the conductivity is impaired and sufficient as an electrostatic shield. Therefore, it is preferable to deposit so that the transmittance is in the range of 10 to 60%, preferably 13 to 40%, more preferably 30%. .

3. Barrier layer A barrier layer is a layer that provides gas barrier properties, particularly barrier properties against water vapor, to moisture resistance, etc. without impairing the transparency of the laminated film for packaging. A metal oxide film formed by vapor deposition or an inorganic oxide film that is a silicon oxide film is used.

  This barrier layer is formed by vapor-depositing the above-mentioned metal oxide or silicon oxide on the surface of a substrate made of a transparent resin film, and the substrate on which this barrier layer is formed is laminated between the outer layer and the sealant layer. Further, as described above, when the conductive layer is directly formed on the other surface (inside) of the film constituting the outer layer, the conductive layer may be formed by directly depositing on the conductive layer. May be formed by vapor deposition on the conductive layer or on the other surface of the base material on which the conductive layer is formed.

  As described above, when a base material for forming the barrier layer is separately provided, a resin having a high gas barrier property may be used as such a base material, due to a synergistic effect with the barrier layer. High barrier property can be given to the laminated film for packaging.

4). Reinforcing film layer Reinforcing film layer is provided as needed when strength is required in the laminated film for packaging. When high strength is not required, and as described above, the conductive layer or barrier layer If the required strength can be obtained by the provided base material, this can be omitted.

  In this embodiment, a nylon film is used as the reinforcing film layer, but it is transparent and can obtain the strength required for the resulting laminated film for packaging. If there is, the material of the reinforcing film layer is not limited to this, and various materials can be used.

5). Sealant layer The sealant layer imparts heat-sealability when the laminated film of the present invention is formed on a packaging bag, and has transparency and heat-sealability necessary for bag-making. Any material can be used as long as it exhibits, and in this embodiment, as an example, a film made of an ethylene-α olefin copolymer (linear low density polyethylene: L-LDPE) is used. I use it.

  In addition, as resin which comprises this sealant layer, in addition to the above-mentioned linear low density polyethylene (L-LDPE), branched low density polyethylene (LDPE) having a long chain branch can be suitably used.

  This sealant layer needs to be subjected to antistatic treatment in the same manner as the above-mentioned outer layer. As the method of this antistatic treatment, an antistatic agent is applied to the antistatic layer in the same manner as the above-mentioned outer layer. Although it is possible to form, in the case of this configuration, in consideration of the fact that the heat seal strength may decrease due to the presence of the antistatic agent layer, in this embodiment, a resin to which an antistatic agent is added Are formed by a known laminating method, and this is used as a sealant layer.

  In addition to the antistatic agent described above, a lubricant and an organic antiblocking agent can be added to the sealant layer. The lubricant is 500 ppm or less as an example, and the organic antiblocking agent is 500 to 5000 ppm as an example. Added.

  In addition, this sealant layer uses a transparent thing so that the transparency of the whole laminated film for packaging may not be impaired.

6). Bonding Except when laminated on other layers by direct vapor deposition or the like as described above, the formed layers are laminated together to form the laminated film for packaging of the present invention.

  Bonding for this lamination can be performed using various known methods, but in this embodiment, an adhesive of an aliphatic resin that hardly causes browning as an adhesive, for example, urethane Lamination was performed by dry lamination using a resin adhesive.

[Packaging bag]
The laminated film for packaging of the present invention configured as described above can be used to form a packaging bag, whereby the packaging bag of the present invention can be obtained.

  As a bag making method of the packaging bag using the packaging laminated film, the sealant layers of the packaging laminated film are arranged so as to overlap each other, and the packaging laminated film overlapped by heat sealing is heat sealed. Packaging bags can be made.

  When making this packaging bag, it is preferable to fold one side of the continuous laminated sheet for packaging so that the package can be continuously surrounded without cutting the conductive layer. Or it is preferable to set it as a three-side seal bag, or it is set as the gusset bag obtained by carrying out the folding | folding of the continuous laminated sheet for packaging.

  Next, the result of having compared the physical property of the laminated film for packaging (Examples 1-3) of this invention with the physical property of a comparative example (comparative examples 1 and 2) is demonstrated below.

  In addition, the structure of each laminated | multilayer film for packaging of the Example used as the comparison object and a comparative example is as follows.

[Configuration of laminated film for packaging]
1. Example 1
The layer structure of the laminated film for packaging of Example 1 is shown in FIG. The layer structure of the laminated film for packaging is as shown in Table 1 below.

  Outer layer: An antistatic agent was applied to one surface (outside) of a biaxially stretched polyethylene terephthalate film having a thickness of 12 μm for antistatic treatment.

  Conductive layer: Aluminum was directly deposited on the other surface of the outer layer to form a deposited film, which was used as the conductive layer.

  Barrier layer: A 12 μm-thick polyvinyl alcohol film as a base material, a silicon oxide vapor-deposited film is formed on one surface of the base material, and this is used as a barrier layer. The base silicon oxide on which the barrier layer is formed The vapor-deposited surface was bonded to the conductive layer.

  Sealant layer: a 70 μm thick ethylene-α-olefin copolymer film to which 400 ppm of higher fatty acid ester antistatic agent and lubricant and 3000 ppm of organic AB agent are added is used as a sealant layer, and this is the base material of the barrier layer Pasted together.

  Bonding method: The bonding was performed by a dry laminating method using a urethane adhesive.

2. Example 2
The layer structure of the laminated film for packaging of Example 2 is shown in FIG. The layer structure of the laminated film for packaging is as shown in Table 2 below.

  Outer layer: A biaxially stretched nylon film having a thickness of 15 μm to which a higher fatty acid ester-based antistatic agent was added was used as the outer layer.

  Conductive layer: A biaxially stretched polyethylene terephthalate film having a thickness of 12 μm was used as a base material, and an aluminum deposited film formed on one surface of the base material was used as a conductive layer. The vapor deposition surface side of the base material on which the conductive layer was formed was bonded to the nylon film constituting the outer layer.

  Barrier layer: A polyethylene terephthalate film having a thickness of 12 μm was used as a base material, and an aluminum oxide vapor deposition film formed on one surface of the base material was used as a barrier layer. The deposition surface of the base material on which the barrier layer was formed was bonded to the base material on which the conductive layer was formed.

  Sealant layer: A 50 μm thick ethylene-α-olefin copolymer film to which 400 ppm of higher fatty acid ester antistatic agent and lubricant and 3000 ppm of organic AB agent were added was used as a sealant layer, and the barrier layer was formed. It bonded together to the base material.

  Bonding method: The bonding was performed by a dry laminating method using a urethane adhesive.

3. Example 3
The layer structure of the laminated film for packaging of Example 3 is shown in FIG. The layer structure of the laminated film for packaging is as shown in Table 3 below.

  Outer layer: An antistatic agent was applied to one surface of a 12-μm thick biaxially stretched polyethylene terephthalate film to form an outer layer.

  Conductive layer: Aluminum was directly deposited on the other surface of the outer layer to form a conductive layer.

  Barrier layer: Aluminum oxide was directly deposited on the surface of the conductive layer to form a barrier layer.

  Reinforcing film layer: A biaxially stretched nylon film was used as a reinforcing film layer, and this was bonded to the barrier layer.

  Sealant layer: A 50 μm-thick ethylene-α-olefin copolymer film to which 400 ppm of a higher fatty acid ester antistatic agent and lubricant and 3000 ppm of an organic AB agent are added is used as a sealant layer. Pasted together.

  Bonding method: The bonding was performed by a dry laminating method using a urethane adhesive.

4). Comparative Example 1
The layer structure of the laminated film for packaging of Comparative Example 1 is shown in FIG. The layer structure of the laminated film for packaging is as shown in Table 4 below.

  Outer layer: An antistatic agent was applied to one surface of a 12-μm thick biaxially stretched polyethylene terephthalate film to form an outer layer.

  Conductive layer: An aluminum foil having a thickness of 7 μm was used as a conductive layer, and was bonded to the other surface of the outer layer.

  Sealant layer: A 50 μm-thick ethylene-α-olefin copolymer film to which a higher fatty acid ester-based antistatic agent was added was used as a sealant layer, which was bonded to the aluminum foil as the conductive layer.

  Bonding method: The bonding was performed by a dry laminating method using a urethane adhesive.

5). Comparative Example 2
The layer structure of the laminated film for packaging of Comparative Example 2 is shown in FIG. The layer structure of the laminated film for packaging is as shown in Table 5 below.

  Outer layer: An antistatic agent was applied to one surface of a 12-μm thick biaxially stretched polyethylene terephthalate film to form an outer layer.

  Conductive layer: An aluminum foil having a thickness of 7 μm was used as a conductive layer, and was bonded to the surface of the outer layer.

  Reinforcing film layer: A biaxially stretched nylon film having a thickness of 15 μm was used as a reinforcing film layer, and this was bonded to the aluminum foil as the conductive layer.

  Sealant layer: A 50 μm-thick ethylene-α-olefin-based copolymer film to which a higher fatty acid ester-based antistatic agent was added was used as a sealant layer, which was bonded to the reinforcing film layer.

  Bonding method: The bonding was performed by a dry laminating method using a urethane adhesive.

6). Comparative Example 3
The layer structure of the laminated film for packaging in Comparative Example 3 that has the same basic structure as that of Example 1 in FIG. 1 is as shown in Table 6 below. (The additive for the sealant layer is different from that in Example 1.)

  Outer layer: An antistatic agent was applied to one surface (outside) of a biaxially stretched polyethylene terephthalate film having a thickness of 12 μm for antistatic treatment.

  Conductive layer: Aluminum was directly deposited on the other surface of the outer layer to form a deposited film, which was used as the conductive layer.

  Barrier layer: A 12 μm-thick polyvinyl alcohol film as a base material, a silicon oxide vapor-deposited film is formed on one surface of the base material, and this is used as a barrier layer, and the silicon oxide of the base material on which this barrier layer is formed The vapor-deposited surface was bonded to the conductive layer.

  Sealant layer: A 70 μm-thick ethylene-α-olefin copolymer film to which only a higher fatty acid ester-based antistatic agent was added was used as a sealant layer, and this was bonded to the base material of the barrier layer.

  Bonding method: The bonding was performed by a dry laminating method using a urethane adhesive.

7). Comparative Example 4
The layer structure of the laminated film for packaging of Comparative Example 4 that takes the same basic structure as Example 1 of FIG. 1 is shown in FIG. The layer structure of the laminated film for packaging is as shown in Table 7 below. (The specific structure of the sealant layer is different.)

  Outer layer: An antistatic agent was applied to one surface (outside) of a biaxially stretched polyethylene terephthalate film having a thickness of 12 μm for antistatic treatment.

  Conductive layer: Aluminum was directly deposited on the other surface of the outer layer to form a deposited film, which was used as the conductive layer.

  Barrier layer: A 12 μm-thick polyvinyl alcohol film as a base material, a silicon oxide vapor-deposited film is formed on one surface of the base material, and this is used as a barrier layer, and the silicon oxide of the base material on which this barrier layer is formed The vapor-deposited surface was bonded to the conductive layer.

  Sealant layer: A 70 μm-thick ethylene-α-olefin copolymer film to which 600 ppm of a higher fatty acid ester antistatic agent and an organic lubricant was added was used as a sealant layer, and this was bonded to the base material of the barrier layer. .

  Bonding method: The bonding was performed by a dry laminating method using a urethane adhesive.

〔Comparison result〕
The results of comparing the physical properties of the packaging laminated films are shown in Table 8 below.

[Discussion]
As a result of the above comparison, the laminated film for packaging of the present invention not only has the same electrostatic shielding property and water vapor barrier as the conventional laminated film using an aluminum foil as a conductive layer, The visibility which was not able to be obtained with the laminated | multilayer film for packaging was able to be obtained, and in the state which packaged the packaged object, the packaged object could be confirmed from the outside.

Explanatory drawing which shows the (basic) layer structure of the laminated film for packaging of Example 1 and Comparative Examples 3 and 4. Explanatory drawing which shows the layer structure of the laminated | multilayer film for packaging of Example 2. FIG. Explanatory drawing which shows the layer structure of the laminated | multilayer film for packaging of Example 3. FIG. Explanatory drawing which shows the layer structure of the laminated | multilayer film for packaging of the comparative example 1. FIG. Explanatory drawing which shows the layer structure of the laminated | multilayer film for packaging of the comparative example 2. FIG. Explanatory drawing which shows an example of the conventional laminated film for packaging.

Claims (5)

A transparent conductive layer comprising at least a vapor-deposited film of a conductive metal is provided between the transparent outer layer and the sealant layer, which has an antistatic treatment with a surface resistivity of 10 ¹³ Ω / cm ² or less, and an inorganic oxide vapor-deposited film And a water vapor permeability of 1.0 g / m ² · d or less,
The sealant layer is formed of linear low density polyethylene, and an organic lubricant is added to the sealant layer in an amount of 0 to 500 ppm and / or an organic antiblocking agent is added in an amount of 500 to 5000 ppm. with facilities to prevent contamination process, laminated packaging film characterized to Rukoto and 0.4 or less in coefficient of static friction slip properties of the sealant layer.   The conductive layer and / or the barrier layer is provided on a transparent base material layer, and the base material provided with the conductive layer and / or the barrier layer is laminated between the outer layer and the sealant layer. The laminated film for packaging according to claim 1.   The laminated film for packaging according to claim 1, wherein a transparent reinforcing film layer is provided between the outer layer and the sealant layer. A packaging bag formed by the packaging laminated film according to any one of claims 1 to 3 . 5. The packaging bag according to claim 4 , wherein the packaging bag is formed by one continuous laminated film for packaging.

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