JP7051517B2 - Imaging device - Google Patents

Description

The present invention relates to an image pickup device including an image pickup device such as a digital still camera or a digital video camera.

In image pickup devices such as digital video cameras and digital still cameras, due to recent demands for miniaturization, circuit boards on which electronic components that process control signals and image signals of image sensors and image sensors are mounted have become smaller, and these electrons have become smaller. The components are arranged around the image sensor. On the other hand, as the image quality of the image sensor becomes higher, the power consumption of the image sensor increases and the amount of heat generated also increases. Since the performance of an image pickup device generally deteriorates as the temperature rises, an image pickup device that detects the temperature of the image pickup device has been proposed (Patent Document 1).

JP-A-2007-202067

However, the image pickup apparatus described in Patent Document 1 is trying to solve the problem by attaching a temperature sensor so as to abut on an empty terminal of the image pickup element chip. However, it is not possible to block the heat from the electronic components mounted around the image sensor, and sufficient consideration is not given to the heat of the electronic components, so there is a problem that accurate temperature data cannot be obtained. ..

Therefore, an object of the present invention is to provide an image pickup apparatus capable of blocking the heat of other electronic components and detecting the accurate temperature of the image pickup device.

In order to achieve the above object, the image pickup device of the present invention includes a sensor substrate on which an image pickup element and a temperature detection element are mounted and a rectangular opening is formed in a central portion, and a sensor plate that holds the image pickup element. A heat shield member provided on a surface of the sensor substrate opposite to the surface on which the image sensor is mounted is provided, and the heat shield member is provided parallel to at least one side of the opening, and the sensor plate is provided. Is a first surface arranged parallel to the sensor substrate separated in the optical axis direction, a second surface bonded to the image sensor at the opening, the first surface, and the above. It has a stepped portion formed between the second surface and the temperature detecting element, and is characterized in that the temperature detecting element is arranged in a space surrounded by the first surface, the stepped portion, and the heat shield member. do.

According to the present invention, since it is hardly affected by the heat of the electronic components arranged around the image pickup device, the accurate temperature of the image pickup device can be detected.

It is a block diagram of the digital video camera which is an example of embodiment of the image pickup apparatus of this invention. (A) is a perspective view of the camera body as viewed from the front side, and (b) is a perspective view of the camera body as viewed from the rear side. (A) is a front perspective view of the front cover unit, and (b) is a rear perspective view of the front cover unit. (A) is an exploded perspective view of the front side of the front cover unit, and (b) is an exploded perspective view of the back side of the front cover unit. (A) is an exploded perspective view of the front side of the image pickup unit, (b) is an exploded perspective view of the back side of the image pickup unit, and (c) is a cross-sectional view of the image pickup element. (A) is a front perspective view of the sensor plate, and (b) is a rear perspective view of the sensor plate. (A) is a front perspective view of the sensor board with the image sensor soldered, (b) is a rear perspective view of the sensor board with the image sensor soldered, and (c) is the front view of the sensor board. It is a figure. It is a rear view of the image pickup unit. It is a rear view of the image pickup unit which shows the embodiment of this invention. (A) is a sectional view taken along line BB of FIG. 8, and (b) is an enlarged view of part D of (a). (A) is a sectional view taken along line CC of FIG. 8, and (b) is an enlarged view of part E of FIG. (A) is a perspective view when the finger is not compressed, and (b) is a perspective view when the finger is compressed.

Hereinafter, an example of an embodiment of the present invention will be described with reference to the drawings.

FIG. 1 is a block diagram of a digital video camera which is an example of an embodiment of the image pickup apparatus of the present invention. In FIG. 1, the camera body 10 of the digital video camera (hereinafter referred to as a camera) of the present embodiment includes an image pickup element 401, and the image pickup element 401 is mounted on a sensor board 402 (see FIGS. 4 and 5). Has been done. The image pickup element 401 has a CCD or CMOS element and an A / D converter. Then, an optical image is formed on the CCD or CMOS element via a lens barrel (not shown). The CCD or CMOS element outputs an electric signal (analog signal) corresponding to the optical image, and the A / D converter converts the analog signal into a digital signal and outputs it as image data.

The camera body 10 includes a CPU 150, a ROM 151, and a RAM 152, and the CPU 150, the ROM 151, and the RAM 152 are mounted on a main board (not shown). The ROM 151 is a memory that can be electrically erased and recorded, and for example, an EEPROM or the like is used. Further, the ROM 151 stores constants and programs for the operation of the CPU 150.

The CPU 150 controls the entire camera body 10. Then, the CPU 150 performs a predetermined process by executing the program recorded in the ROM 151. The RAM 152 is used as a system memory, a work memory, an image memory, and an audio memory. In this RAM 152, constants and variables for the operation of the CPU 150, a program read from the ROM 151, and the like are developed. The voice data is once recorded in, for example, the RAM 152.

The CPU 150 sends the image data and audio data recorded in the RAM 152 to the recording unit 153, and records the image data and audio data in the recording unit 153. The recording unit 153 is a recording medium such as a memory card. The above-mentioned image data is once recorded in, for example, RAM 152. A liquid crystal panel, an organic EL, or the like is used for the display unit 107.

As the temperature detection unit 154, for example, a temperature thermistor 424 described later is used, and the temperature detection unit 154 is mounted on the sensor board 402. The operation unit 155 is operated by the user and gives various instructions to the CPU 150. The operation unit 155 is a touch sensor unit (see FIG. 2) on the image pickup button 104, the operation button group 106, and the display unit 107, which will be described later. Further, the camera body 10 is provided with a cooling fan 300A, and the rotation state of the cooling fan 300A is controlled by the CPU 150.

Next, the structure of the camera body 10 will be described with reference to FIG. FIG. 2A is a perspective view of the camera body 10 as viewed from the front side, and FIG. 2B is a perspective view of the camera body 10 as viewed from the rear side. In FIG. 2A, the Z axis indicates the front-rear direction of the camera body 10, and the front side of the paper surface is defined as the front side (subject side) and the back side of the paper surface is defined as the back side. Further, this Z axis corresponds to the image pickup optical axis of the camera body 10. The Y-axis corresponds to the vertical direction of the camera body 10, and the X-axis corresponds to the horizontal direction of the camera body 10. When viewed from the front side of the camera body 10, the side surface in the + X-axis direction is the right side surface, and the side surface in the −X-axis direction is the left side surface.

As shown in FIG. 2A, on the front side (subject side) of the camera body 10, a telecommunication contact portion 101 electrically connected to a lens barrel (not shown) and a mount to which the lens barrel is attached are attached. A unit 102 is provided. Further, on the front side of the camera body 10, a mount knob ring 103 for rotating the mount rotating portion 102b of the mount unit 102 to hold the lens barrel, an optical component unit 200, and the like are provided.

An ND unit 300 and an image pickup unit 400, which will be described later, are provided in the back of the optical component unit 200. It is converted and output to the image processing unit of the main board (not shown). Further, an image pickup button 104, a power button 105, an operation button group 106, a display unit 107, and the like are provided on the side surface portion on the right side when viewed from the front side of the camera body 10.

As shown in FIG. 2B, a card lid 108, an external input / output terminal group 109, a shooting button 110, an intake port 111, and an exhaust port 112 are located on the left side surface of the camera body 10 when viewed from the front side. It is provided. The intake port 111 sucks in outside air by driving a fan (not shown) inside the main body, and the exhaust port 112 exhausts heat generated inside the main body to the outside. A battery mounting portion 113 and a power supply terminal 114 are provided on the back side of the camera body 10, and power is supplied to the camera body 10 by either the battery mounting portion 113 or the power supply terminal 114.

Next, with reference to FIGS. 3 and 4, a front cover unit forming an exterior on the front side of the camera body 10 will be described. FIG. 3A is a front perspective view of the front cover unit 100, and FIG. 3B is a rear perspective view of the front cover unit 100. FIG. 4A is an exploded perspective view of the front side of the front cover unit 100, and FIG. 4B is an exploded perspective view of the back side of the front cover unit 100.

As shown in FIGS. 3 and 4, the front cover unit 100 is a unit including a mount unit 102 to which a lens barrel is attached to an image pickup unit 400. In the front cover unit 100, the mount unit 102 and the image pickup unit 400 are fixed to the front base 115 formed of a high-rigidity material such as magnesium die-cast.

The image pickup unit 400 is composed of an image pickup element 401, a sensor substrate 402, a sensor plate 403, an insulating sheet 408 (see FIG. 5), and the like. The detailed configuration of the image pickup unit 400 will be described later. A sensor heat sink 404 is attached to the back surface of the sensor plate 403 by screws 407a to 407c to dissipate heat generated from the image sensor 401. The sensor plate 403 is fixed to the front base 115 by the screws 406a to 406c with the washer 405a to 405c for adjusting the thickness interposed therebetween, so that the position of the image pickup light receiving surface 410 of the image pickup element 401 is determined with respect to the front base 115.

The mount unit 102 has a mount surface 102a with which the lens barrel abuts, and a mount rotating portion 102b that is rotationally engaged to hold the abutted lens barrel. By fixing the mount unit 102 to the front base 115 by the screws 117a to 117d with the thickness adjusting shim 116 sandwiched between them, the position of the mount surface 102a of the mount unit 102 with respect to the front base 115 is determined. That is, the positions of the image pickup light receiving surface 410 and the mount surface 102a are determined with respect to the front base 115, and the distance between the flange backs of the camera body 10 is determined. Further, a telecommunication contact portion 101 is fixed to the mount unit 102 and is electrically connected to the contact portion 118 in the main body.

An optical component unit 200 and an ND unit 300 are provided between the mount unit 102 and the image pickup unit 400, and are fixed to the front base 115 by screws 201a to 201d and screws 301a to 301c, respectively. The ND unit 300 has a plurality of ND filters (not shown), which are optical components, with different densities, and by dimming the incident light with the ND filter, it is possible to open the aperture or reduce the shutter speed during shooting. It becomes.

The ND unit 300 has an ND opening 302 that allows incident light to pass on the optical axis. The ND filter can be driven by a drive mechanism (not shown) at a use position where the incident light is transmitted and a retracted position where the incident light is not transmitted. The position information of the ND filter is detected by a detection means (not shown) provided in the ND unit 300, and is sent to the main body control unit as an electrical signal.

A low-pass filter 303 is provided on the back side of the ND unit 300, and the low-pass filter 303 is hermetically held by a holding sheet metal 304 and a cushion (not shown) so as to close the back side of the ND opening 302. The front side of the ND opening 302 is closed by the optical component unit 200 fixed to the front base 115. The space between the ND unit 300 and the image sensor 401 is sealed by the ND cushion 305 to prevent dust and unnecessary light from entering the image pickup light receiving surface 410.

The front cover subunit 119 is composed of a front frame 119a, a front cover 119b, a front plate 119c, and the like. The front frame 119a is made of a highly rigid material such as magnesium die-cast, and is strongly responsible for the skeleton of the main body. The front cover 119b and the front plate 119c are fixed to the front frame 119a with screws. The front base 115 holding the mount unit 102, the optical component unit 200, the ND unit 300, and the image pickup unit 400 is fixed to the front frame 119a via the front plate 119c.

Next, the image pickup unit will be described with reference to FIGS. 5 and 6. 5A is an exploded perspective view of the front side of the image pickup unit 400, FIG. 5B is an exploded perspective view of the back side of the image pickup unit 400, and FIG. 5C is a cross-sectional view of the image pickup element 401. FIG. 6A is a front perspective view of the sensor plate 403, and FIG. 6B is a rear perspective view of the sensor plate 403.

As shown in FIG. 5, the image pickup unit 400 is arranged in the order of the image pickup element 401, the sensor substrate 402, the insulating sheet 408, and the sensor plate 403 in the optical axis direction when viewed from the front side. The image pickup device 401 has a protective glass 411, a base member 412, and an image pickup light receiving surface 410, and the image pickup light receiving surface 410 is mounted on the base member 412 (FIG. 5 (c)). A contact surface 413 attached to the sensor plate 403 is formed on the back surface side of the image sensor 401.

The image sensor 401 is mounted on the front surface of the sensor board 402, and a plurality of peripheral circuit components are mounted on the back surface. A rectangular opening 422 is provided in the center of the sensor substrate 402, and the contact surface 413 of the image pickup device 401 is exposed from the opening 422. The insulating sheet 408 is a sensor plate so as to be projectedly overlapped with the peripheral circuit parts so as not to short-circuit even if the peripheral circuit parts of the sensor board 402 inadvertently come into contact with the sensor plate 403 when an impact or the like is applied. It is attached to the base surface 431 of the 403.

The central portion of the insulating sheet 408 has an opening 480 that exposes the finger 423 mounted on the sensor substrate 402, and the finger 423 abuts on the sensor plate 403. The configuration of this finger 423 will be described later.

As shown in FIG. 6, the sensor plate 403 has a base surface (first surface) 431 and a mounting surface (second surface) projecting at a predetermined height from the base surface 431 to the front side in the optical axis direction at the center. Surface) with 430. The base surface 431 is arranged parallel to the sensor substrate 402 so as to be separated from each other in the optical axis direction, and the contact surface 413 of the image pickup element 401 abuts on the mounting surface 430, and both are surface-contacted and adhesively fixed. To.

Further, four step connecting portions (step portions) 432a to 432d are formed between the base surface 431 and the mounting surface 430. A central deformation prevention hole 438 is formed in the central portion of the mounting surface 430 of the sensor plate 403, and a plurality of adhesive filling holes 433 are formed around the central deformation prevention hole 438. The surface of the mounting surface 430 to be mounted on the contact surface 413 is provided by providing a central deformation prevention hole 438 in the center of the mounting surface 430 and forming the central portion of the drawn mounting surface 430 which is difficult to obtain surface accuracy. The accuracy can be improved.

A deformation prevention hole 434 is formed between the step connecting portions 432a to 432d. A positioning hole 435, a rotation stop hole 436, and a screw hole 437 are formed on the base surface 431 so that the sensor plate 403 can be fixed to the front base 115.

Next, the sensor board 402 will be described with reference to FIG. 7. FIG. 7A is a front perspective view of the sensor board 402 with the image sensor 401 soldered, and FIG. 7B is a rear perspective view of the sensor board 402 with the image sensor 401 soldered. be. FIG. 7C is a front view of the sensor substrate 402. Note that FIG. 7C shows a state in which the image sensor 401 on the back surface side is projected, and the image sensor 401 is shown by a broken line.

As shown in FIG. 7, only the image pickup device 401 is mounted on the front surface of the sensor substrate 402. The image pickup device 401 is electrically connected to the sensor substrate 402 by soldering a plurality of soldering portions 414 arranged on the side surface portions of the base member 412 of the image pickup element 401. On the back side of the sensor board 402, an AD conversion element IC 420 that converts a signal photoelectrically converted by the image pickup element 401 into a digital signal, peripheral circuit components, and the like are mounted. The video signal AD-converted by the AD conversion element IC 420 of the sensor board 402 is output to a main board (not shown) via the connector 421.

Further, a reinforcing plate (heat shield member) 440 is arranged at a position provided with a predetermined gap from the opening 422, and the reinforcing plate 440 has both sides on the surface of the sensor substrate 402 opposite to the surface on which the image pickup element 401 is mounted. It is attached with tape or the like. The reinforcing plate 440 is attached as a reinforcement for preventing the sensor substrate 402 from warping when the image sensor 401 is soldered to the thin sensor substrate 402, and is attached to the back surface of the soldering portion 414 described above.

In the present embodiment, in order to reinforce the soldering portion 414 arranged on the entire circumference of the image pickup element 401, as shown in FIG. 7C, the reinforcing plate 440 is the position of the soldering portion 414 of the image pickup element 401. It is formed in a rectangular frame shape having a predetermined width H around the center. In the present embodiment, the reinforcing plate 440 is provided parallel to the four sides of the opening 422, but it may be provided at least parallel to one side of the opening 422.

A temperature thermistor 424 and a plurality of fingers (conducting members) 423 are arranged between the opening 422 and the reinforcing plate 440, both of which are mounted on the sensor substrate 402. The temperature thermistor (temperature detection element) 424 and the plurality of finger 423s are arranged at positions where they overlap on the projection of the image pickup element 401. The finger 423 is arranged in the center of the top, bottom, left, and right between the opening 422 and the reinforcing plate 440, and the temperature thermistor 424 is arranged in the vicinity of the finger 423 below the opening 422.

The finger 423 electrically connects the sensor substrate 402 and the sensor plate 403. The temperature thermistor 424 detects the temperature of the image sensor 401, and the detected temperature information is output to a main board (not shown) via the connector 421.

Next, the arrangement of the temperature thermistor 424 will be described with reference to FIGS. 8 and 9. FIG. 8 is a rear view of the image pickup unit 400. 9 (a) is a sectional view taken along line BB of FIG. 8, and FIG. 9 (b) is an enlarged view of a portion D of FIG. 9 (a).

As shown in FIG. 9, the insulating sheet 408 is attached to the base surface 431 of the sensor plate 403. The image pickup device 401 is fixed by an adhesive filled in a plurality of adhesive filling holes 433 in a state where the contact surface 413 is in close contact with the mounting surface 430 of the sensor plate 403. By providing a plurality of adhesive filling holes 433, the adhesive area can be widened, and the image pickup device 401 can be firmly held.

Further, the mounting surface 430 of the sensor plate 403 is projected to a predetermined height with respect to the base surface 431. As a result, while the contact surface 413 mounted on the front side of the sensor board 402 and the mounting surface 430 are in contact with each other, the mounting space L for the fingers 423 and peripheral circuit components mounted on the back side of the sensor board 402 is secured. be able to.

Since the image pickup element 401 uses a CMOS or CCD element, there is a problem that noise and the like increase due to the heat generated by the element itself, and the image quality deteriorates. Further, since the peripheral circuit components on the sensor board 402 also generate heat and supply heat to the image sensor 401, heat is dissipated from the sensor plate 403 in contact with the contact surface 413 of the image sensor 401.

As described above, by providing a plurality of adhesive filling holes 433 on the outer periphery of the mounting surface 430, the bonding area can be widened and the contact area of the mounting surface 430 in contact with the image pickup element 401 can be sufficiently secured. It is possible to achieve both adhesiveness and heat dissipation of 401.

The temperature thermistor 424 mounted on the sensor board 402 is arranged in the space 427 surrounded by the mounting surface 430, the step connecting portion 432b, the base surface 431, the reinforcing plate 440, and the sensor board 402. As described above, since the temperature thermistor 424 is mounted in the space 427 separated from the peripheral circuit components mounted on the sensor board 402 by the reinforcing plate 440, it is not affected by the heat from the peripheral circuit components.

Further, the reinforcing plate 440 is formed of a material having a low heat transfer coefficient, such as glass epoxy resin, so that the heat insulating performance can be further improved. Further, the temperature thermistor 424 is arranged at a position where it is projectedly overlapped with the image pickup light receiving surface 410 of the image pickup element 401. With these configurations, the temperature thermistor 424 can accurately detect the heat of the image pickup device 401 directly underneath without being affected by the heat from the peripheral circuit components.

Further, by providing the height of the reinforcing plate 440 higher than the height of the temperature thermistor 424, the space 427 can be made into a more closed space, and it is possible to eliminate the influence of heat from peripheral circuit parts. It becomes.

Next, the finger 423 will be described with reference to FIGS. 10 and 11. 10 (a) is a sectional view taken along line CC of FIG. 8, and FIG. 10 (b) is an enlarged view of part E of FIG. FIG. 11A is a perspective view when the finger is not compressed, and FIG. 11B is a perspective view when the finger is compressed.

The finger 423 is formed of a conductive spring material. As shown in FIG. 11, the finger 423 has a mounting surface 423b mounted on the substrate and a contact surface 423a in contact with a component to be electrically connected. The contact surface 423a is formed so as to be elastically deformable, and when a force F in the direction perpendicular to the contact surface 423a is applied, the contact surface 423a is compressed by a predetermined amount, and stable electrical connection is possible.

As shown in FIG. 10, in the assembled state in which the image sensor 401 soldered to the sensor board 402 and the sensor plate 403 are adhered to each other, the contact surface 423a of the finger 423 mounted on the sensor board 402 is compressed by a predetermined amount. It comes into contact with the base surface 431 of the sensor plate 403. By electrically connecting the sensor board 402 and the sensor plate 403 by the finger 423, it is possible to suppress the noise generated by the image pickup device 401 mounted on the sensor board 402.

As described above, the urging force F is applied in the optical axis direction by compressing the finger 423 by a predetermined amount, but the finger 423 projects with the image sensor 401 so that the flange back of the image sensor 401 does not shift due to this urging force F. Multiple positions are placed on top of each other. In general, the image sensor 401 is thicker than the sensor substrate 402, so by arranging the finger 423 at a position where it is projected and overlapped with the image sensor 401, it is possible to configure the flange back so as not to shift.

Further, as shown in FIG. 7, by arranging the finger 423 in the center of the upper, lower, left, and right sides with respect to the opening 422, the urging force F applied to the image pickup element 401 can be made uniform, and the flange back is further displaced. No configuration is possible.

As described above, in the present embodiment, it is possible to provide a camera capable of detecting the accurate temperature of the image sensor 401 without being affected by the heat of the electronic components arranged around the image sensor 401. .. Further, the noise generated by the image pickup device 401 can be suppressed by ensuring the electrical connection with the sensor plate 403 by the plurality of fingers 423 mounted on the sensor substrate 402. Further, by arranging the finger 423 on the projection of the image pickup element 401, it is possible to configure the flange back so as not to shift.

The configuration of the present invention is not limited to that exemplified in the above embodiment, and the material, shape, dimensions, form, number, arrangement location, etc. can be appropriately changed as long as the gist of the present invention is not deviated. Is.

For example, in the above embodiment, the finger 423s that electrically connect the sensor board 402 and the sensor plate 403 are arranged at four positions symmetrically in the vertical and horizontal directions, but the urging force is uniformly generated on the plane of the sensor board 402. There may be three places at equal intervals in the circumferential direction so as to be.

Further, in the above embodiment, the component that electrically connects the sensor substrate 402 and the sensor plate 403 is a finger 423, but a gasket or the like may be used as a component having conductivity and elasticity as well.

10 Camera body 400 Image sensor 401 Image sensor 402 Sensor board 403 Sensor plate 422 Opening 424 Temperature thermistor 430 Mounting surface 431 Base surface

Claims (13)

A sensor board on which an image sensor and a temperature detection element are mounted and a rectangular opening is formed in the center.
A sensor plate that holds the image sensor and
A heat shield member provided on a surface of the sensor substrate opposite to the surface on which the image pickup element is mounted is provided.
The heat shield member is provided parallel to at least one side of the opening.
The sensor plate has a first surface that is arranged parallel to the sensor substrate so as to be separated from each other in the optical axis direction, a second surface that is adhered to the image pickup device at the opening, and the first surface. It has a stepped portion formed between the surface and the second surface, and has a stepped portion.
The image pickup device, characterized in that the temperature detecting element is arranged in a space surrounded by the first surface, the step portion, and the heat shield member. The image pickup apparatus according to claim 1, wherein the heat shield member is a reinforcing plate that reinforces a portion where the image pickup element is mounted on the sensor substrate. The imaging device according to claim 1 or 2, wherein the heat shield member has a rectangular shape so as to surround the opening. The image pickup device according to any one of claims 1 to 3, wherein the temperature detection element is arranged at a position where the image pickup elements are projected to overlap each other. The image pickup apparatus according to any one of claims 1 to 4, wherein the height of the heat shield member is higher than the height of the temperature detecting element. The image pickup apparatus according to any one of claims 1 to 5, wherein only the temperature detecting element is arranged between the heat shield member and the opening of the sensor substrate. It has elasticity and is provided with a conductive member that electrically connects the sensor substrate and the sensor plate.
The image sensor, the sensor substrate, the conduction member, and the sensor plate are arranged in this order from the subject side along the optical axis direction.
The image pickup apparatus according to any one of claims 1 to 6, wherein a plurality of the conductive members are arranged at positions that are projectedly overlapped with the image pickup element when viewed from the subject side. The image pickup apparatus according to claim 7, wherein the conduction members are arranged at four positions symmetrical with respect to the center of the image pickup element. The image pickup apparatus according to claim 7, wherein the conduction members are arranged at three positions at equal intervals in the circumferential direction of a circle centered on the center of the image pickup element. The image pickup apparatus according to any one of claims 7 to 9, wherein the conduction member is a finger mounted on the sensor substrate. The image pickup apparatus according to any one of claims 7 to 9, wherein the conductive member is a gasket. The image pickup apparatus according to any one of claims 7 to 11, wherein the conductive member abuts on the first surface. The second surface of the sensor plate has a deformation-preventing hole formed in a central portion to prevent deformation of the second surface, and a plurality of adhesive-filled holes formed around the deformation-preventing hole. The image pickup apparatus according to any one of claims 1 to 12, wherein the image pickup apparatus is provided.

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