JP7045673B2 - 圧電エネルギーハーベスティング曲げ構造及びその製造方法 - Google Patents

圧電エネルギーハーベスティング曲げ構造及びその製造方法 Download PDF

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JP7045673B2
JP7045673B2 JP2019572414A JP2019572414A JP7045673B2 JP 7045673 B2 JP7045673 B2 JP 7045673B2 JP 2019572414 A JP2019572414 A JP 2019572414A JP 2019572414 A JP2019572414 A JP 2019572414A JP 7045673 B2 JP7045673 B2 JP 7045673B2
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reinforcing material
shim
piezoelectric
beam reinforcing
reinforcement
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JP2020526168A5 (enExample
JP2020526168A (ja
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ルーファー,リボル
バスラウール,スキャンダー
トリウー,エミリー
フェリン,ギヨーム
バンティグニーズ,クレール
カン,フン ル
ロジンスキー,ボグダン
グェン-ディン,アン
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Vermon SA
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Vermon SA
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/30Piezoelectric or electrostrictive devices with mechanical input and electrical output, e.g. functioning as generators or sensors
    • H10N30/304Beam type
    • H10N30/306Cantilevers
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02NELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N2/00Electric machines in general using piezoelectric effect, electrostriction or magnetostriction
    • H02N2/18Electric machines in general using piezoelectric effect, electrostriction or magnetostriction producing electrical output from mechanical input, e.g. generators
    • H02N2/186Vibration harvesters
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/01Manufacture or treatment
    • H10N30/05Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/50Piezoelectric or electrostrictive devices having a stacked or multilayer structure
    • H10N30/508Piezoelectric or electrostrictive devices having a stacked or multilayer structure adapted for alleviating internal stress, e.g. cracking control layers

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • General Electrical Machinery Utilizing Piezoelectricity, Electrostriction Or Magnetostriction (AREA)
JP2019572414A 2017-07-05 2018-07-05 圧電エネルギーハーベスティング曲げ構造及びその製造方法 Active JP7045673B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201762528886P 2017-07-05 2017-07-05
US62/528,886 2017-07-05
US201762532195P 2017-07-13 2017-07-13
US62/532,195 2017-07-13
PCT/IB2018/000716 WO2019008431A1 (en) 2017-07-05 2018-07-05 PIEZOELECTRIC ENERGY COLLECTION FOLDING STRUCTURE AND METHOD FOR MANUFACTURING SAME

Publications (3)

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JP2020526168A JP2020526168A (ja) 2020-08-27
JP2020526168A5 JP2020526168A5 (enExample) 2020-12-17
JP7045673B2 true JP7045673B2 (ja) 2022-04-01

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JP2019572414A Active JP7045673B2 (ja) 2017-07-05 2018-07-05 圧電エネルギーハーベスティング曲げ構造及びその製造方法

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US (1) US11387403B2 (enExample)
EP (1) EP3649678B1 (enExample)
JP (1) JP7045673B2 (enExample)
CN (1) CN111066165B (enExample)
WO (1) WO2019008431A1 (enExample)

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NO20201324A1 (en) * 2018-05-24 2020-12-02 Baker Hughes Holdings Llc Transducers including laser etched substrates
EP3892325B1 (fr) * 2020-04-09 2022-03-16 Cairdac Implant cardiaque autonome de type capsule leadless, comprenant un récupérateur d'énergie à lame piézoélectrique
JP7379296B2 (ja) * 2020-08-25 2023-11-14 京セラ株式会社 振動発電デバイスおよびセンサモジュール
DE102022200796A1 (de) * 2022-01-25 2023-07-27 Robert Bosch Gesellschaft mit beschränkter Haftung Piezoelektrische Wandlervorrichtung
US20230319484A1 (en) * 2022-03-31 2023-10-05 Skyworks Solutions, Inc. Mems sensor with two compliances
CN118257364B (zh) * 2024-05-07 2025-03-11 北京工业大学 具有复合减振功能的多翼式悬挑阻尼器

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US20130207520A1 (en) 2012-02-10 2013-08-15 Genziko, Incorporated Power generator
CN104022685A (zh) 2014-05-23 2014-09-03 厦门大学 可调频阵列式压电悬臂梁俘能器及可调频阵列式压电悬臂梁俘能方法

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JPS5698883A (en) * 1980-01-10 1981-08-08 Sony Corp Transducer
US5408376A (en) 1992-10-06 1995-04-18 Matsushita Electric Industrial Co., Ltd. Piezoelectric head actuator
JP3340206B2 (ja) * 1992-10-06 2002-11-05 松下電器産業株式会社 圧電アクチュエータおよびヘッドアクチュエータ
EP0768532B1 (en) * 1995-10-09 2003-04-23 Matsushita Electric Industrial Co., Ltd Acceleration sensor and method for producing the same, and shock detecting device using the same
JP2005160028A (ja) * 2003-10-27 2005-06-16 Nec Tokin Corp 撓み振動型エキサイタ
JP3866258B2 (ja) * 2004-08-24 2007-01-10 太平洋セメント株式会社 圧電デバイスおよびこれを備える圧電スイッチ
JP2007074062A (ja) * 2005-09-05 2007-03-22 Citizen Electronics Co Ltd パネル型スピーカ用エキサイタ及びパネル型スピーカ
US7663295B2 (en) * 2005-12-15 2010-02-16 Imec Method and system for measuring physical parameters with a piezoelectric bimorph cantilever in a gaseous or liquid environment
GB2447600A (en) * 2006-01-25 2008-09-17 Univ California Energy harvesting by means of thermo-mechanical device utilizing bistable ferromagnets
US20080302024A1 (en) * 2007-06-05 2008-12-11 Gm Global Technology Operations, Inc. Tunable impedance load-bearing structures
JP5167957B2 (ja) * 2008-05-30 2013-03-21 株式会社リコー 圧電バイモルフ素子を用いたベルト加振装置、及びこれを用いた転写装置並びに画像形成装置
FR2971650B1 (fr) 2011-02-11 2013-02-22 Commissariat Energie Atomique Didspositif de conversion d'energie mecanique en energie electrique optimise
WO2013035478A1 (ja) * 2011-09-06 2013-03-14 株式会社村田製作所 圧電アクチュエータ
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Patent Citations (2)

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Publication number Priority date Publication date Assignee Title
US20130207520A1 (en) 2012-02-10 2013-08-15 Genziko, Incorporated Power generator
CN104022685A (zh) 2014-05-23 2014-09-03 厦门大学 可调频阵列式压电悬臂梁俘能器及可调频阵列式压电悬臂梁俘能方法

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Publication number Publication date
CN111066165B (zh) 2023-09-26
WO2019008431A1 (en) 2019-01-10
JP2020526168A (ja) 2020-08-27
EP3649678B1 (en) 2022-11-30
CN111066165A (zh) 2020-04-24
US20200220067A1 (en) 2020-07-09
US11387403B2 (en) 2022-07-12
EP3649678A1 (en) 2020-05-13

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