JP7041669B2 - 加熱接合用シートおよび加熱接合用シート付きダイシングテープ - Google Patents
加熱接合用シートおよび加熱接合用シート付きダイシングテープ Download PDFInfo
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- JP7041669B2 JP7041669B2 JP2019508651A JP2019508651A JP7041669B2 JP 7041669 B2 JP7041669 B2 JP 7041669B2 JP 2019508651 A JP2019508651 A JP 2019508651A JP 2019508651 A JP2019508651 A JP 2019508651A JP 7041669 B2 JP7041669 B2 JP 7041669B2
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Description
焼結性粒子としての銀微粒子(平均粒径100nm,DOWAエレクトロニクス株式会社製)225質量部と、熱分解性高分子バインダーとしてのポリカーボネート樹脂(商品名「QPAC40」,重量平均分子量は150000,常温で固体,Empower Materials社製)25質量部と、低沸点バインダーとしてのイソボルニルシクロヘキサノール(商品名「テルソルブMTPH」,常温で液体,日本テルペン化学工業株式会社製)16質量部と、溶剤としてのメチルエチルケトン 10質量部とを、ハイブリッドミキサー(商品名「HM-500」,株式会社キーエンス製)をその撹拌モードで使用して混合し、ワニスを調製した。撹拌時間は3分間とした。そして、得られたワニスを、離型処理フィルム(商品名「MRA50」,三菱樹脂株式会社製)に塗布した後に乾燥させて、厚さ40μmの粘着層を形成した。乾燥温度は110℃とし、乾燥時間は3分間とした。以上のようにして、焼結性粒子と、熱分解性高分子バインダーと、低沸点バインダーとを含む粘着層を有する実施例1の加熱接合用シートを作製した。実施例1の加熱接合用シートに関する組成を表1に掲げる(後記の実施例および比較例についても同様である。また、表1において、組成を表す各数値の単位は、相対的な“質量部”である)。
熱分解性高分子バインダーとしてポリカーボネート樹脂に代えてアクリル樹脂(商品名「MM2002-1」,重量平均分子量は170000,常温で固体,藤倉化成株式会社)25質量部を用いたこと以外は実施例1の加熱接合用シートと同様にして、実施例2の加熱接合用シートを作製した。
焼結性粒子としての銀微粒子に代えて銅微粒子(平均粒径200μm,三井金属鉱業株式会社)335質量部を用いたこと、および、熱分解性高分子バインダーとしてポリカーボネート樹脂に代えてアクリル樹脂(商品名「MM2002-1」,重量平均分子量は170000,常温で固体,藤倉化成株式会社)38質量部を用いたこと以外は、実施例1の加熱接合用シートと同様にして、実施例3の加熱接合用シートを作製した。
常温で固体のバインダーとしてポリカーボネート樹脂に代えて低分子の1-オクタデカノール(分子量270.49,常温で固体)25質量部を用いたこと以外は実施例1の加熱接合用シートと同様にして、比較例1の加熱接合用シートを作製した。
実施例1~3および比較例1の各加熱接合用シートについて、70℃での接着力を調べた。具体的には、まず、一方の面に蒸着膜としての銀平面電極(5mm角)の形成されたシリコンチップ(5mm角)の当該銀平面電極に対し、圧着ロールを備えるラミネータを使用して加熱接合用シートを貼り付けた。貼付け温度は70℃であり、圧着ロールの速度は10mm/秒であり、貼付け用の荷重(圧着ロールによる圧力)は0.5MPaである。このようにして、5mm角の加熱接合用シートないし粘着層を片面に伴うシリコンチップを得た。次に、得られた加熱接合用シート付きシリコンチップを、ダイボンディング装置(商品名「ダイボンダ SPA-300」,株式会社新川製)を使用して、銀めっき銅板(20mm角)に圧着して仮固定した。当該銅板は、銀めっきが施されて表面に銀平面を伴うものであり、本工程では、加熱接合用シートを介してシリコンチップを当該銀平面に仮固定した。この仮固定において、圧着温度は70℃であり、圧着圧力は0.5MPaであり、圧着時間は1秒間である。そして、銀めっき銅板に圧着された加熱接合用シートについて、せん断接着力測定装置(商品名「DAGE4000」,デイジ社)を使用して、せん断接着力(第1せん断接着力)を測定した。測定温度は70℃であり、加熱接合用シート付きシリコンチップをせん断方向に押動するツールの速度は0.5mm/秒である。加熱接合用シートごとに第1せん断接着力の測定値(MPa)を表1に掲げる。
実施例1~3および比較例1の各加熱接合用シートについて、23℃での接着力を調べた。具体的には、まず、一方の面に蒸着膜としての銀平面電極(5mm角)の形成されたシリコンチップ(5mm角)の当該銀平面電極に対し、圧着ロールを備えるラミネータを使用して加熱接合用シートを貼り付けた。貼付け温度は70℃であり、圧着ロールの速度は10mm/秒であり、貼付け用の荷重(圧着ロールによる圧力)は0.5MPaである。このようにして、5mm角の加熱接合用シートないし粘着層を片面に伴うシリコンチップを得た。次に、得られた加熱接合用シート付きシリコンチップを、ダイボンディング装置(商品名「ダイボンダ SPA-300」,株式会社新川製)を使用して、銀めっき銅板(20mm角)に圧着して仮固定した。当該銅板は、銀めっきが施されて表面に銀平面を伴うものであり、本工程では、加熱接合用シートを介してシリコンチップを当該銀平面に仮固定した。この仮固定において、圧着温度は70℃であり、圧着圧力は0.5MPaであり、圧着時間は1秒間である。そして、銀めっき銅板に圧着された加熱接合用シートについて、せん断接着力測定装置(商品名「DAGE4000」,デイジ社)を使用して、せん断接着力(第2せん断接着力)を測定した。測定温度は23℃であり、加熱接合用シート付きシリコンチップをせん断方向に押動するツールの速度は0.5mm/秒である。加熱接合用シートごとに第2せん断接着力の測定値(MPa)を表1に掲げる。
実施例1~3および比較例1の各加熱接合用シートについて、所定の高温加熱に付された場合のチップシフトの有無を調べた。具体的には、まず、一方の面に蒸着膜としての銀平面電極(5mm角)の形成されたシリコンチップ(5mm角)の当該銀平面電極に対し、圧着ロールを備えるラミネータを使用して加熱接合用シートを貼り付けた。貼付け温度は70℃であり、圧着ロールの速度は10mm/秒であり、貼付け用の荷重(圧着ロールによる圧力)は0.5MPaである。このようにして、5mm角の加熱接合用シートないし粘着層を片面に伴うシリコンチップを得た。次に、得られた加熱接合用シート付きシリコンチップを、ダイボンディング装置(商品名「ダイボンダ SPA-300」,株式会社新川製)を使用して、銀めっき銅板(20mm角)に圧着して仮固定した。当該銅板は、銀めっきが施されて表面に銀平面を伴うものであり、本工程では、加熱接合用シートを介してシリコンチップを当該銀平面に仮固定した。この仮固定において、圧着温度は70℃であり、圧着圧力は0.5MPaであり、圧着時間は1秒間である。このようにして、実施例1~3および比較例1の加熱接合用シートごとに、5サンプルを作製した。そして、作製されたサンプルをオーブン(商品名「LC-114」,エスペック株式会社製)内で加熱した(加熱処理)。この処理において、加熱温度は200℃であり、加熱時間は1時間である。このような加熱処理の後、シリコンチップに仮固定箇所からの10μm以上の位置ずれ(チップシフト)を生じたサンプルの個数を計測した。そのようなチップシフトの生じたサンプル数は、実施例1~3のそれぞれでは5サンプルのうち0、比較例1では5サンプルのうち2であった。そして、チップシフトの生じたサンプル数が0の場合を良(○)と評価し、1以上の場合を不良(×)と評価した。これら結果を表1に掲げる。
実施例1~3および比較例1の各加熱接合用シートについて、焼結接合にあたってのチップシフトの有無を調べた。具体的には、まず、一方の面に蒸着膜としての銀平面電極(5mm角)の形成されたシリコンチップ(5mm角)の当該銀平面電極に対し、圧着ロールを備えるラミネータを使用して加熱接合用シートを貼り付けた。貼付け温度は70℃であり、圧着ロールの速度は10mm/秒であり、貼付け用の荷重(圧着ロールによる圧力)は0.5MPaである。このようにして、5mm角の加熱接合用シートないし粘着層を片面に伴うシリコンチップを得た。次に、得られた加熱接合用シート付きシリコンチップを、ダイボンディング装置(商品名「ダイボンダ SPA-300」,株式会社新川製)を使用して、銀めっき銅板(20mm角)に圧着して仮固定した。当該銅板は、銀めっきが施されて表面に銀平面を伴うものであり、本工程では、加熱接合用シートを介してシリコンチップを当該銀平面に仮固定した。この仮固定において、圧着温度は70℃であり、圧着圧力は0.5MPaであり、圧着時間は1秒間である。このようにして、実施例1~3および比較例1の加熱接合用シートごとに、5サンプルを作製した。そして、作製されたサンプルについて焼結装置(商品名「HTM-3000」,伯東株式会社製)を使用して焼結工程を行った。焼結用の加熱温度は300℃であり、加圧力は40MPaであり、加熱時間は5分間である。このような焼結工程の後、シリコンチップに仮固定箇所からの10μm以上の位置ずれ(チップシフト)を生じたサンプルの個数を計測した。そのようなチップシフトの生じたサンプル数は、実施例1~3のそれぞれでは5サンプルのうち0、比較例1では5サンプルのうち1であった。そして、チップシフトの生じたサンプル数が0の場合を良(○)と評価し、1以上の場合を不良(×)と評価した。これら結果を表1に掲げる。
実施例1~3の加熱接合用シートによると、接合対象物の位置ずれを抑制しつつ当該接合対象物間の焼結接合を実現することができた。比較例1の加熱接合用シートによると、接合対象物間の焼結接合にあたり、接合対象物の位置ずれを生じた。
11 粘着層
12 焼結層
C 半導体チップ
X 加熱接合用シート付きダイシングテープ
20 ダイシングテープ
21 基材
22 粘着剤層
30 半導体ウエハ
Claims (10)
- 導電性金属含有の焼結性粒子を含む粘着層を備え、
70℃、0.5MPa、および1秒間の圧着条件にて前記粘着層が5mm角のサイズで圧着された銀平面に対する当該粘着層の70℃でのせん断接着力が0.1MPa以上であり、
前記70℃でのせん断接着力に対する、70℃、0.5MPa、および1秒間の圧着条件にて前記粘着層が5mm角のサイズで圧着された銀平面に対する当該粘着層の23℃でのせん断接着力の比の値が、5~40である、加熱接合用シート。 - 50℃、0.5MPa、および1秒間の圧着条件にて前記粘着層が5mm角のサイズで圧着された銀平面に対する当該粘着層の50℃でのせん断接着力が0.11MPa以上である、請求項1に記載の加熱接合用シート。
- 70℃、0.5MPa、および1秒間の圧着条件にて前記粘着層が5mm角のサイズで圧着された銀平面に対する当該粘着層の70℃でのせん断接着力に対する、50℃、0.5MPa、および1秒間の圧着条件にて前記粘着層が5mm角のサイズで圧着された銀平面に対する当該粘着層の50℃でのせん断接着力の比の値が、1~40である、請求項1または2に記載の加熱接合用シート。
- 70℃、0.5MPa、および1秒間の圧着条件にて前記粘着層が5mm角のサイズで圧着された銀平面に対する当該粘着層の70℃でのせん断接着力に対する、90℃、0.5MPa、および1秒間の圧着条件にて前記粘着層が5mm角のサイズで圧着された銀平面に対する当該粘着層の90℃でのせん断接着力の比の値が、1~40である、請求項1から3のいずれか一つに記載の加熱接合用シート。
- 前記粘着層の70℃での粘度が5×103~1×107Pa・sである、請求項1から4のいずれか一つに記載の加熱接合用シート。
- 前記粘着層は熱分解性高分子バインダーを含む、請求項1から5のいずれか一つに記載の加熱接合用シート。
- 前記熱分解性高分子バインダーの重量平均分子量は10000以上である、請求項6に記載の加熱接合用シート。
- 前記熱分解性高分子バインダーは、ポリカーボネート樹脂および/またはアクリル樹脂である、請求項6または7に記載の加熱接合用シート。
- 前記焼結性粒子は、銀、銅、酸化銀、および酸化銅からなる群より選択される少なくとも一種を含む、請求項1から8のいずれか一つに記載の加熱接合用シート。
- 基材と粘着剤層とを含む積層構造を有するダイシングテープと、
前記ダイシングテープにおける前記粘着剤層上の、請求項1から9のいずれか一つに記載の加熱接合用シートと、を備える加熱接合用シート付きダイシングテープ。
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JP6858520B2 (ja) * | 2015-09-30 | 2021-04-14 | 日東電工株式会社 | 加熱接合用シート、及び、ダイシングテープ付き加熱接合用シート |
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JP6858519B2 (ja) * | 2016-09-21 | 2021-04-14 | 日東電工株式会社 | 加熱接合用シート及びダイシングテープ付き加熱接合用シート |
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2018
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- 2018-01-30 WO PCT/JP2018/003005 patent/WO2018179796A1/ja unknown
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- 2018-01-30 KR KR1020197031488A patent/KR102413907B1/ko active IP Right Grant
- 2018-01-30 CN CN201880022505.4A patent/CN110476233B/zh active Active
- 2018-03-21 TW TW107109598A patent/TWI762603B/zh active
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EP3608947A1 (en) | 2020-02-12 |
WO2018179796A1 (ja) | 2018-10-04 |
JPWO2018179796A1 (ja) | 2020-05-14 |
US20200048504A1 (en) | 2020-02-13 |
KR20190130152A (ko) | 2019-11-21 |
TW201900802A (zh) | 2019-01-01 |
TWI762603B (zh) | 2022-05-01 |
CN110476233B (zh) | 2023-09-29 |
CN110476233A (zh) | 2019-11-19 |
EP3608947A4 (en) | 2020-12-16 |
KR102413907B1 (ko) | 2022-06-29 |
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