JP7032660B2 - A collet and a method for manufacturing a light emitting device using a collet. - Google Patents

A collet and a method for manufacturing a light emitting device using a collet. Download PDF

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JP7032660B2
JP7032660B2 JP2018205030A JP2018205030A JP7032660B2 JP 7032660 B2 JP7032660 B2 JP 7032660B2 JP 2018205030 A JP2018205030 A JP 2018205030A JP 2018205030 A JP2018205030 A JP 2018205030A JP 7032660 B2 JP7032660 B2 JP 7032660B2
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hole
collet
convex portion
light emitting
tip
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JP2020072170A (en
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誠司 久龍
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Nichia Corp
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Nichia Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/27—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
    • H01L2224/92—Specific sequence of method steps
    • H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
    • H01L2224/9222—Sequential connecting processes
    • H01L2224/92242—Sequential connecting processes the first connecting process involving a layer connector
    • H01L2224/92247—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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Description

本開示は、コレット及びコレットを用いた発光装置の製造方法に関する。 The present disclosure relates to a collet and a method for manufacturing a light emitting device using the collet.

半導体素子を移送する際に用いられるコレットとして、先端部にゴムを用いたコレットが知られている（例えば、特許文献１）。これにより、半導体素子にかかる荷重を軽減し、半導体素子が破損するのを抑制することができる。 As a collet used when transferring a semiconductor element, a collet using rubber at the tip is known (for example, Patent Document 1). As a result, the load applied to the semiconductor element can be reduced and the semiconductor element can be prevented from being damaged.

特開２０１３－０４６０２６号公報Japanese Unexamined Patent Publication No. 2013-046026

しかしながら、ゴムはタック性が高いため、半導体素子を持ち帰ってしまう場合がある。 However, since rubber has a high tack property, a semiconductor element may be brought back.

本実施形態は、以下の構成を含む。
第１貫通孔を有する本体部と、
前記本体の先端に接続されるゴム弾性部と、
前記ゴム弾性部の先端に接続される先端部と、
を備えるコレット。 The present embodiment includes the following configurations.
The main body having the first through hole and
The rubber elastic part connected to the tip of the main body and
The tip portion connected to the tip of the rubber elastic portion and the tip portion
Collet with.

以上により、半導体素子の持ち帰りを防ぎつつ、半導体素子の破損を抑制可能なコレットとすることができる。また、このようなコレットを用いて、発光装置を製造することができる。 As described above, it is possible to obtain a collet capable of suppressing damage to the semiconductor element while preventing the semiconductor element from being taken home. Further, such a collet can be used to manufacture a light emitting device.

実施形態１に係るコレットを示す概略斜視図である。It is a schematic perspective view which shows the collet which concerns on Embodiment 1. FIG. 実施形態１に係るコレットの分解斜視図である。It is an exploded perspective view of the collet which concerns on Embodiment 1. FIG. 実施形態２に係る発光装置の製造方法を示す図である。It is a figure which shows the manufacturing method of the light emitting device which concerns on Embodiment 2. 実施形態２に係る発光装置の製造方法を示す図である。It is a figure which shows the manufacturing method of the light emitting device which concerns on Embodiment 2. 実施形態２に係る発光装置の製造方法を示す図である。It is a figure which shows the manufacturing method of the light emitting device which concerns on Embodiment 2. 実施形態２に係る発光装置の製造方法を示す図である。It is a figure which shows the manufacturing method of the light emitting device which concerns on Embodiment 2. 実施形態２に係る発光装置の製造方法を示す図である。It is a figure which shows the manufacturing method of the light emitting device which concerns on Embodiment 2. 実施形態２に係る発光装置の製造方法を示す図である。It is a figure which shows the manufacturing method of the light emitting device which concerns on Embodiment 2. 実施形態２に係る発光装置の製造方法を示す図である。It is a figure which shows the manufacturing method of the light emitting device which concerns on Embodiment 2. 実施形態２に係る発光装置の製造方法を示す図である。It is a figure which shows the manufacturing method of the light emitting device which concerns on Embodiment 2. 実施形態２に係る発光装置の製造方法を示す図である。It is a figure which shows the manufacturing method of the light emitting device which concerns on Embodiment 2. 実施形態２に係る発光装置の製造方法を示す図である。It is a figure which shows the manufacturing method of the light emitting device which concerns on Embodiment 2.

本発明を実施するための形態を、以下に図面を参照しながら説明する。ただし、以下に示す形態は、本発明の技術思想を具現化するためのコレット及び発光装置の製造方法を例示するものであって、以下に限定するものではない。また、実施の形態に記載されている構成部品の寸法、材質、形状、その相対的配置等は、特定的な記載がない限り、本発明の範囲をそれのみに限定する趣旨ではい。尚、各図面が示す部材の大きさや位置関係等は、説明を明確にするために誇張していることがある。 A mode for carrying out the present invention will be described below with reference to the drawings. However, the form shown below exemplifies a method for manufacturing a collet and a light emitting device for embodying the technical idea of the present invention, and is not limited to the following. Further, the dimensions, materials, shapes, relative arrangements, etc. of the components described in the embodiments are not intended to limit the scope of the present invention to that alone unless otherwise specified. The sizes and positional relationships of the members shown in each drawing may be exaggerated for the sake of clarity.

＜実施形態１＞
実施形態１に係るコレット１００の一例を、図１Ａ、図１Ｂに示す。コレット１００は、棒状の部材であり、本体部１０と、ゴム弾性部２０と、先端部３０と、をこの順に備える。コレット１００を構成するこれら３つの部材は、それぞれの中心軸が一致するように同軸配置されている。 <Embodiment 1>
An example of the collet 100 according to the first embodiment is shown in FIGS. 1A and 1B. The collet 100 is a rod-shaped member, and includes a main body portion 10, a rubber elastic portion 20, and a tip portion 30 in this order. These three members constituting the collet 100 are coaxially arranged so that their central axes coincide with each other.

半導体素子等を移送する際に、コレット１００の下端の面である吸着面を半導体素子に当接させ、コレット１００の貫通孔内を真空状態にすることで、貫通孔内を真空にして半導体素子を吸着することができる。実施形態１に係るコレット１００は、半導体素子と当接する先端部３０と本体部１０の間にゴム弾性部２０が介在しており、このゴム弾性部２０の弾性により、半導体素子にかかる荷重を軽減することができる。 When transferring a semiconductor element or the like, the suction surface, which is the lower end surface of the collet 100, is brought into contact with the semiconductor element, and the inside of the through hole of the collet 100 is evacuated to create a vacuum inside the through hole. Can be adsorbed. In the collet 100 according to the first embodiment, the rubber elastic portion 20 is interposed between the tip portion 30 and the main body portion 10 in contact with the semiconductor element, and the elasticity of the rubber elastic portion 20 reduces the load applied to the semiconductor element. can do.

また、半導体素子を吸着した状態で、所望の位置までコレット１００を移動し、基板等の載置面に半導体素子を載置した後に、貫通孔内の真空状態を解除する。半導体素子は、ゴム弾性部２０とは当接していないため、貫通孔内の真空状態を解除した後において、コレット１００が半導体素子を持ち帰ることがない。
以下、各構成部材について詳説する。 Further, the collet 100 is moved to a desired position with the semiconductor element adsorbed, the semiconductor element is placed on a mounting surface such as a substrate, and then the vacuum state in the through hole is released. Since the semiconductor element is not in contact with the rubber elastic portion 20, the collet 100 does not bring back the semiconductor element after the vacuum state in the through hole is released.
Hereinafter, each component will be described in detail.

（本体部）
本体部１０は、コレット１００の主部品であり、上面から下面にかけて貫通する第１貫通孔１１を少なくとも１つ備える。第１貫通孔１１は、ゴム弾性部２０の第２貫通孔２１と連通するように配置される。第１貫通孔１１の開口部１４の形状は、円形、四角形、多角形等とすることができ、円形とすることが好ましい。第１貫通孔１１の断面は、開口部１４と同じ形状が好ましい。第１貫通孔１１の直径（幅）は、本体部１０の外形の直径の３０％～６０％とすることができる。あるいは、貫通孔１１の周囲の本体部１０の厚み（肉厚）を６５０μｍ～１１００μｍとすることができる。 (Main body)
The main body 10 is a main component of the collet 100 and includes at least one first through hole 11 penetrating from the upper surface to the lower surface. The first through hole 11 is arranged so as to communicate with the second through hole 21 of the rubber elastic portion 20. The shape of the opening 14 of the first through hole 11 can be circular, quadrangular, polygonal, or the like, and is preferably circular. The cross section of the first through hole 11 preferably has the same shape as the opening 14. The diameter (width) of the first through hole 11 can be 30% to 60% of the diameter of the outer shape of the main body 10. Alternatively, the thickness (thickness) of the main body 10 around the through hole 11 can be set to 650 μm to 1100 μm.

本体部１０は、先端（下端）に第１凸部１２を備えてもよい。第１凸部１２を、ゴム弾性部２０の第２貫通孔２１に挿入することで、本体部１０とゴム弾性部２０とを位置合わせし易くすることができる。特に、第１凸部１２の平面視形状を、ゴム弾性部２０の第２貫通孔２１の開口形状と略同じ形状とし、第１凸部１２と第２貫通孔２１とを嵌合させることで、本体部１０とゴム弾性部２０とを外れにくくすることができる。 The main body portion 10 may be provided with a first convex portion 12 at the tip end (lower end). By inserting the first convex portion 12 into the second through hole 21 of the rubber elastic portion 20, the main body portion 10 and the rubber elastic portion 20 can be easily aligned. In particular, the plan view shape of the first convex portion 12 is substantially the same as the opening shape of the second through hole 21 of the rubber elastic portion 20, and the first convex portion 12 and the second through hole 21 are fitted to each other. , The main body portion 10 and the rubber elastic portion 20 can be made difficult to come off.

第１凸部１２は、本体部１０の中心軸を含む位置に配置することが好ましい。また、第１凸部１２は、図１Ｂに示すように、１つ設けることができる。ただし、これに限らず、第１凸部１２は複数であってもよい。 The first convex portion 12 is preferably arranged at a position including the central axis of the main body portion 10. Further, as shown in FIG. 1B, one first convex portion 12 can be provided. However, the present invention is not limited to this, and the number of the first convex portions 12 may be plural.

第１凸部１２が１つの場合は、本体部１０の中心軸を含む位置に配置されることが好ましい。さらに、第１凸部１２が１つの場合は、第１凸部１２の平面視形状は、ゴム弾性部２０の第２貫通孔２１に嵌合する形状であることが好ましい。特に、本体部１０とゴム弾性部２０とを嵌合させた状態で回転しないような形状とすることが好ましい。例えば、本体部１０の第１凸部１２の平面視形状及びゴム弾性部２０の第２貫通孔２１の開口形状を、四角形、三角形等の多角形や、楕円、さらにはこれらを組み合わせた形状とすることが好ましい。 When there is one first convex portion 12, it is preferable that the first convex portion 12 is arranged at a position including the central axis of the main body portion 10. Further, when there is only one first convex portion 12, the plan view shape of the first convex portion 12 is preferably a shape that fits into the second through hole 21 of the rubber elastic portion 20. In particular, it is preferable to have a shape that does not rotate in a state where the main body portion 10 and the rubber elastic portion 20 are fitted. For example, the plan view shape of the first convex portion 12 of the main body portion 10 and the opening shape of the second through hole 21 of the rubber elastic portion 20 may be a polygon such as a quadrangle or a triangle, an ellipse, or a shape combining these. It is preferable to do so.

第１凸部１２は、第１貫通孔１１の一部である第１凸部内貫通孔１５を備えることができる。これにより、吸着時にコレット１００全体の貫通孔内を真空にする際に、効率よく真空にすることができる。つまり、第１凸部内貫通孔１５を備える第１凸部１２は、吸着機能と位置合わせ機能の両方を兼ね備えることができる。第１凸部内貫通孔１５の直径は、第１凸部１２以外における第１貫通孔１１の直径と同じか、それよりも小さくすることができる。例えば、第１凸部内貫通孔１５の直径は、第１凸部１２以外における第１貫通孔１１の直径の３０％～６０％とすることができる。 The first convex portion 12 can include a through hole 15 in the first convex portion which is a part of the first through hole 11. As a result, when the inside of the through hole of the entire collet 100 is evacuated at the time of adsorption, the vacuum can be efficiently evacuated. That is, the first convex portion 12 provided with the through hole 15 in the first convex portion can have both a suction function and a positioning function. The diameter of the through hole 15 in the first convex portion can be the same as or smaller than the diameter of the first through hole 11 other than the first convex portion 12. For example, the diameter of the through hole 15 in the first convex portion can be 30% to 60% of the diameter of the first through hole 11 other than the first convex portion 12.

また、第１凸部１２は、第１貫通孔１１から離間していてもよい。換言すると、第１貫通孔１１とは別の位置に、貫通孔を備えない第１凸部１２を備えてもよい。つまり、吸着に必要な貫通孔１１と、位置合わせ等に寄与する第１凸部１２とを、それぞれ機能を分けるようにすることができる。 Further, the first convex portion 12 may be separated from the first through hole 11. In other words, the first convex portion 12 having no through hole may be provided at a position different from the first through hole 11. That is, the through hole 11 required for adsorption and the first convex portion 12 that contributes to alignment and the like can be separated from each other in function.

また、第１凸部１２を複数備える場合は、それらの全て又は一部に、第１凸部内貫通孔１５を備えてもよい。 Further, when a plurality of first convex portions 12 are provided, all or a part of them may be provided with a through hole 15 in the first convex portion.

本体部１０は、例えば、直径（第１凸部１２を備える場合はそれ以外の部分の直径）が３ｍｍ～５ｍｍ、長さが１５ｍｍ～４０ｍｍとすることができる。第１凸部１２を備える場合は、第１凸部１２の直径（幅）は、第１凸部１２以外の部分の直径に対して３０％～５０％の直径（幅）とすることができる。また、第１凸部１２の長さは、ゴム弾性部２０の長さの１５％～３０％とすることができる。また、先端部３０の第２凸部３２も、ゴム弾性部２０の第２貫通孔２１に挿入される場合は、第１凸部１２の長さと第２凸部３２の長さの総和が、ゴム弾性部２０の長さよりも小さくなるようにする。好ましくは、第１凸部１２の長さと第２凸部３２の長さの総和が、ゴム弾性部２０の長さの４０％～６０％とすることができる。これにより、ゴム弾性部２０が荷重により縮んでも、その内部において第１凸部１２と第２凸部３２とが接触することがなく、弾性力を維持することができる。 The main body portion 10 can have, for example, a diameter (diameter of a portion other than the first convex portion 12 when the first convex portion 12 is provided) of 3 mm to 5 mm and a length of 15 mm to 40 mm. When the first convex portion 12 is provided, the diameter (width) of the first convex portion 12 can be a diameter (width) of 30% to 50% with respect to the diameter of the portion other than the first convex portion 12. .. Further, the length of the first convex portion 12 can be 15% to 30% of the length of the rubber elastic portion 20. Further, when the second convex portion 32 of the tip portion 30 is also inserted into the second through hole 21 of the rubber elastic portion 20, the sum of the length of the first convex portion 12 and the length of the second convex portion 32 becomes large. Make it smaller than the length of the rubber elastic portion 20. Preferably, the total length of the first convex portion 12 and the length of the second convex portion 32 can be 40% to 60% of the length of the rubber elastic portion 20. As a result, even if the rubber elastic portion 20 shrinks due to a load, the first convex portion 12 and the second convex portion 32 do not come into contact with each other inside the rubber elastic portion 20, and the elastic force can be maintained.

本体部１０の材料は、ゴム弾性部２０よりもロックウェル硬度が高いものが好ましい。本体部１０のロックウェル硬度は、例えば、８７～９２が好ましい。本体部１０としては、例えば、ステンレス、超硬、アルミ等の金属材料が挙げられる。特に、超硬が好ましい。 The material of the main body portion 10 is preferably a material having a higher Rockwell hardness than the rubber elastic portion 20. The Rockwell hardness of the main body 10 is preferably 87 to 92, for example. Examples of the main body 10 include metal materials such as stainless steel, cemented carbide, and aluminum. In particular, cemented carbide is preferable.

（ゴム弾性部）
ゴム弾性部２０は、本体部１０と先端部３０との間に挟まれる部材であり、弾性を備える部材である。ゴム弾性部２０は、上面から下面にかけて貫通する第２貫通孔２１を少なくとも１つ備える。第２貫通孔２１は、本体部１０の第１貫通孔１１と、先端部３０の第３貫通孔３１の両方と連通される。 (Rubber elastic part)
The rubber elastic portion 20 is a member sandwiched between the main body portion 10 and the tip portion 30, and is a member having elasticity. The rubber elastic portion 20 includes at least one second through hole 21 that penetrates from the upper surface to the lower surface. The second through hole 21 communicates with both the first through hole 11 of the main body 10 and the third through hole 31 of the tip 30.

第２貫通孔２１の直径（幅）は、第１凸部１２と同じ程度、もしくは、やや小さい大きさ（例えば、０．１ｍｍ以下小さい大きさ）とすることができる。これにより、ゴム弾性部２０の弾力により、第１凸部１２を第２貫通孔２１と嵌合させた状態で、本体部１０とゴム弾性部２０とを保持することができる。これは、第２貫通孔２１内に先端部３０の第２凸部３２が嵌合される場合も同様である。本体部１０の第１凸部１２と、先端部３０の第２凸部３２とは、同じ形状で、同じ幅（直径）とすることが好ましく、その場合は、第２貫通孔２１の上側開口部の形状と下側開口部の形状を同じ形状とすることが好ましい。第１凸部１２と第２凸部３２の形状が異なる場合は、第２貫通孔２１の上側開口部の形状と下側開口部の形状とは、異なっていてもよい。 The diameter (width) of the second through hole 21 can be about the same as or slightly smaller than that of the first convex portion 12 (for example, a size smaller than 0.1 mm). As a result, the elasticity of the rubber elastic portion 20 makes it possible to hold the main body portion 10 and the rubber elastic portion 20 in a state where the first convex portion 12 is fitted to the second through hole 21. This also applies when the second convex portion 32 of the tip portion 30 is fitted in the second through hole 21. It is preferable that the first convex portion 12 of the main body portion 10 and the second convex portion 32 of the tip portion 30 have the same shape and the same width (diameter), and in that case, the upper opening of the second through hole 21. It is preferable that the shape of the portion and the shape of the lower opening have the same shape. When the shapes of the first convex portion 12 and the second convex portion 32 are different, the shape of the upper opening and the shape of the lower opening of the second through hole 21 may be different.

ゴム弾性部２０は、例えば、外形の直径が３ｍｍ～５ｍｍ、長さが３ｍｍ～５ｍｍとすることができる。また、ゴム弾性部２０の第２貫通孔２１と外側面との間の厚みは、少なくとも１ｍｍ以上であることが好ましい。これにより、半導体素子にかかる荷重を緩衝するために必要な弾性力を、維持することができる。 The rubber elastic portion 20 may have, for example, an outer diameter of 3 mm to 5 mm and a length of 3 mm to 5 mm. Further, the thickness between the second through hole 21 of the rubber elastic portion 20 and the outer surface is preferably at least 1 mm or more. Thereby, the elastic force required for cushioning the load applied to the semiconductor element can be maintained.

ゴム弾性部２０の材料は、例えば、ウレタンゴム、天然ゴム、シリコーンゴム等を用いることができる。さらに、ゴム弾性部２０の弾性率は、６５０～７５０ｐｓｉとすることができる。これにより、半導体素子にかかる荷重を吸収し、半導体素子の損傷を抑制することができる。 As the material of the rubber elastic portion 20, for example, urethane rubber, natural rubber, silicone rubber, or the like can be used. Further, the elastic modulus of the rubber elastic portion 20 can be 650 to 750 psi. As a result, it is possible to absorb the load applied to the semiconductor element and suppress damage to the semiconductor element.

（先端部）
先端部３０は、コレット１００の先端部に位置する部材であり、下面を吸着面３７とする部材である。先端部３０は、上面から下面にかけて貫通する第３貫通孔３１を備える。第３貫通孔３１は、ゴム弾性部２０の第２貫通孔２１と連通する。第３貫通孔３１の開口部の形状は、円形、四角形、多角形等とすることができ、円形とすることが好ましい。第３貫通孔３１の直径は、３００μｍ～６００μｍとすることができる。 (Tip)
The tip portion 30 is a member located at the tip portion of the collet 100, and has a lower surface as a suction surface 37. The tip portion 30 includes a third through hole 31 that penetrates from the upper surface to the lower surface. The third through hole 31 communicates with the second through hole 21 of the rubber elastic portion 20. The shape of the opening of the third through hole 31 can be circular, quadrangular, polygonal, or the like, and is preferably circular. The diameter of the third through hole 31 can be 300 μm to 600 μm.

先端部３０は、ゴム弾性部２０と略同一径の柱状部３４と、柱状部３４から徐々に径が小さくなる錐台状部３５と、錐台状部３５の下端と略同一径の吸着部３６と、を備えることができる。吸着部３６の下面は、コレット１００の下面でもあり、半導体素子等と当接して吸着する吸着面３７である。 The tip portion 30 has a columnar portion 34 having substantially the same diameter as the rubber elastic portion 20, a frustum-shaped portion 35 whose diameter gradually decreases from the columnar portion 34, and a suction portion having substantially the same diameter as the lower end of the frustum-shaped portion 35. 36 and can be provided. The lower surface of the suction portion 36 is also the lower surface of the collet 100, and is a suction surface 37 that abuts and sucks on a semiconductor element or the like.

先端部３０は、上面に第２凸部３２を備えてもよい。第２凸部３２をゴム弾性部２０の第２貫通孔２１に挿入することで、先端部３０とゴム弾性部２０とを位置合わせし易くすることができる。 The tip portion 30 may be provided with a second convex portion 32 on the upper surface. By inserting the second convex portion 32 into the second through hole 21 of the rubber elastic portion 20, the tip portion 30 and the rubber elastic portion 20 can be easily aligned.

第２凸部３２は、先端部３０の中心軸を含む位置に配置されることが好ましい。また、第２凸部３２は、図１Ｂに示すように１つ設けることができる。 The second convex portion 32 is preferably arranged at a position including the central axis of the tip portion 30. Further, one second convex portion 32 can be provided as shown in FIG. 1B.

第２凸部３２が１つの場合は、第２凸部３２は先端部３０の中心軸を含む位置に配置されることが好ましい。さらに、第２凸部３２が１つの場合は、第２凸部３２の平面視形状は、ゴム弾性部２０の第２貫通孔２１に嵌合する形状であることが好ましい。特に、先端３０とゴム弾性部２０とを嵌合させた状態で回転しないような形状とすることが好ましい。例えば、第２凸部３２の平面視形状及びゴム弾性部２０の第２貫通孔２１の開口形状は、四角形、三角形等の多角形や、楕円、さらにはこれらを組み合わせた形状とすることができる。 When there is one second convex portion 32, it is preferable that the second convex portion 32 is arranged at a position including the central axis of the tip portion 30. Further, when there is only one second convex portion 32, the plan view shape of the second convex portion 32 is preferably a shape that fits into the second through hole 21 of the rubber elastic portion 20. In particular, it is preferable to have a shape that does not rotate in a state where the tip 30 and the rubber elastic portion 20 are fitted. For example, the plan view shape of the second convex portion 32 and the opening shape of the second through hole 21 of the rubber elastic portion 20 can be a polygon such as a quadrangle or a triangle, an ellipse, or a shape in which these are combined. ..

第２凸部３２は、第３貫通孔３１の一部である第２凸部内貫通孔３３を備えることができる。これにより、吸着時にコレット全体の貫通孔内を真空にする際に、効率よく真空にすることができる。つまり、第２凸部内貫通孔３３を備える第２凸部３２は、吸着機能と位置合わせ機能の両方を兼ね備えることができる。第２凸部内貫通孔３３の直径は、第２凸部３２以外の部分の第３貫通孔３１の直径と同じか、それよりも小さくすることができる。例えば、第２凸部内貫通孔３３の直径は、第２凸部２以外の部分の第３貫通孔３１の直径の７０％～１００％とすることができる。 The second convex portion 32 can include a through hole 33 in the second convex portion which is a part of the third through hole 31. As a result, when the inside of the through hole of the entire collet is evacuated at the time of adsorption, the vacuum can be efficiently evacuated. That is, the second convex portion 32 provided with the through hole 33 in the second convex portion can have both a suction function and a positioning function. The diameter of the through hole 33 in the second convex portion can be the same as or smaller than the diameter of the third through hole 31 in the portion other than the second convex portion 32. For example, the diameter of the through hole 33 in the second convex portion can be 70% to 100% of the diameter of the third through hole 31 in the portion other than the second convex portion 2.

また、第２凸部３２は、第３貫通孔３１から離間していてもよい。換言すると、第３貫通孔３１とは別の位置に、貫通孔を備えない第２凸部３２を備えてもよい。つまり、吸着に必要な貫通孔３１と、位置合わせ等に寄与する第２凸部３２とを、それぞれ機能を分けるようにすることができる。 Further, the second convex portion 32 may be separated from the third through hole 31. In other words, the second convex portion 32 having no through hole may be provided at a position different from the third through hole 31. That is, the through hole 31 required for suction and the second convex portion 32 that contributes to alignment and the like can be separated from each other in function.

また、第２凸部３２を複数備える場合は、それらの全て又は一部に、貫通孔３１を備えてもよい。 Further, when a plurality of second convex portions 32 are provided, through holes 31 may be provided in all or a part of them.

先端部３０は、例えば、柱状部３４の外形の直径は、本体部１０の直径と同じ程度とすることができる。例えば、柱状部の直径は３ｍｍ～５ｍｍとすることができる。柱状部３４の長さは０．５ｍｍ～１ｍｍとすることができる。錐台状部３５の外面の最大直径は、本体部１０の外形の直径と同じ程度とすることができる。例えば、錐台状部３５の最大直径は３ｍｍ～５ｍｍとすることができる。錐台状部３５の長さは２ｍｍ～４ｍｍとすることができる。吸着部３６の外形の直径は、例えば０．４ｍｍ～１ｍｍとすることができる。吸着部３６の長さは、例えば、０ｍｍ～１ｍｍとすることができる。 For the tip portion 30, for example, the outer diameter of the columnar portion 34 can be about the same as the diameter of the main body portion 10. For example, the diameter of the columnar portion can be 3 mm to 5 mm. The length of the columnar portion 34 can be 0.5 mm to 1 mm. The maximum diameter of the outer surface of the frustum-shaped portion 35 can be about the same as the outer diameter of the main body portion 10. For example, the maximum diameter of the frustum-shaped portion 35 can be 3 mm to 5 mm. The length of the frustum-shaped portion 35 can be 2 mm to 4 mm. The outer diameter of the suction portion 36 can be, for example, 0.4 mm to 1 mm. The length of the suction portion 36 can be, for example, 0 mm to 1 mm.

第２凸部３２の直径（幅）は、柱状部３４の直径に対して３０％～５０％の直径（幅）とすることができる。また、第２凸部３２の長さは、ゴム弾性部２０の長さの１５％～３０％とすることができる。 The diameter (width) of the second convex portion 32 can be a diameter (width) of 30% to 50% with respect to the diameter of the columnar portion 34. Further, the length of the second convex portion 32 can be 15% to 30% of the length of the rubber elastic portion 20.

先端部３０の材料は、ゴム弾性部２０よりもロックウェル硬度が高いものが好まし。先端部３０のロックウェル硬度は、例えば、８７～９２が好ましい。先端部３０としては、例えば、ステンレス、超硬、アルミ等の金属材料が挙げられる。特に、超硬が好ましい。 The material of the tip portion 30 is preferably one having a higher Rockwell hardness than the rubber elastic portion 20. The Rockwell hardness of the tip portion 30 is preferably 87 to 92, for example. Examples of the tip portion 30 include metal materials such as stainless steel, cemented carbide, and aluminum. In particular, cemented carbide is preferable.

＜実施形態２＞
実施形態２に係る発光装置４０の製造方法の一例を、図２Ａ～図４Ｃに示す。発光装置４０の製造方法は、以下の工程を含む。
（１）コレットを準備する工程として、本体部と、本体部の先端に接続されるゴム弾性部と、ゴム弾性部の先端に接続される先端部と、を備えるコレットを準備する工程
（２）半導体素子を準備する工程
（３）吸着工程として、コレットの先端部を発光素子に当接させて、コレットで発光素子を吸着する工程
（４）載置工程として、発光素子を支持体上に載置し、発光素子からコレットを外す工程 <Embodiment 2>
An example of the manufacturing method of the light emitting device 40 according to the second embodiment is shown in FIGS. 2A to 4C. The method for manufacturing the light emitting device 40 includes the following steps.
(1) As a step of preparing a collet, a step of preparing a collet including a main body portion, a rubber elastic portion connected to the tip of the main body portion, and a tip portion connected to the tip of the rubber elastic portion (2). Step of preparing a semiconductor element (3) As a suction step, a step of bringing the tip of a collet into contact with a light emitting element and adsorbing the light emitting element with a collet (4) As a mounting step, the light emitting element is mounted on a support. The process of placing and removing the collet from the light emitting element

（１）コレットを準備する工程
実施形態１に係るコレット１００を準備する。詳細には、本体部１０と、ゴム弾性部２０と、先端部３０と、をこの順に備えるコレット１００を準備する。なお、コレット１００は、例えば、ダイボンダ装置等に備えられており、水平方向及び垂直方向に移動可能に取り付けられている。 (1) Step of preparing a collet Prepare the collet 100 according to the first embodiment. Specifically, a collet 100 including a main body portion 10, a rubber elastic portion 20, and a tip portion 30 in this order is prepared. The collet 100 is provided in, for example, a die bonder device or the like, and is attached so as to be movable in the horizontal direction and the vertical direction.

（２）半導体素子を準備する工程
半導体素子として、発光素子４３を準備する。発光素子４３は、例えば、図２Ａに示すように、粘着シートなどの支持体５０上に載置されている。 (2) Step of preparing a semiconductor element A light emitting element 43 is prepared as a semiconductor element. The light emitting element 43 is mounted on a support 50 such as an adhesive sheet, for example, as shown in FIG. 2A.

（３）吸着工程
次に、図２Ｂに示すように、支持体５０上の発光素子４３の上面に、コレット１００の吸着面３７を当接させる。次に、コレット１００の貫通孔内を真空状態にする。これにより、図２Ｃに示すように、コレット１００で発光素子４３を吸着して持ち上げ、支持体５０から取り外す。 (3) Adsorption Step Next, as shown in FIG. 2B, the adsorption surface 37 of the collet 100 is brought into contact with the upper surface of the light emitting element 43 on the support 50. Next, the inside of the through hole of the collet 100 is evacuated. As a result, as shown in FIG. 2C, the light emitting element 43 is attracted and lifted by the collet 100, and is removed from the support 50.

（４）載置工程
次に、図３Ａに示すようなパッケージ４１を準備する。パッケージ４１は、発光装置のパッケージとして知られているものを用いることができる。ここでは、複数の凹部を備えたパッケージ４１の集合体を例示している。パッケージ４１の凹部の底面上に、接合部材４２を配置しておく。接合部材４２は、例えば、樹脂や半田等が挙げられる。 (4) Placement step Next, the package 41 as shown in FIG. 3A is prepared. As the package 41, what is known as a package of a light emitting device can be used. Here, an assembly of packages 41 having a plurality of recesses is illustrated. The joining member 42 is arranged on the bottom surface of the recess of the package 41. Examples of the joining member 42 include resin and solder.

次に、発光素子４３を吸着した状態のコレット１００を移動し、図３Ｂに示すように、パッケージ４１の凹部上の接合部材４２上に配置する。 Next, the collet 100 in a state where the light emitting element 43 is adsorbed is moved and arranged on the joining member 42 on the recess of the package 41 as shown in FIG. 3B.

次に、コレット１００を降下させて、図３Ｃに示すように、発光素子４３を接合部材４２上に載置する。 Next, the collet 100 is lowered and the light emitting element 43 is placed on the joining member 42 as shown in FIG. 3C.

次に、コレット１００の貫通孔内の減圧を解除し、図３Ｄに示すよう、コレット１００を上昇させる。コレット１００は、発光素子４３を持ち帰ることなく、発光素子４３は接合部材４２上に載置されている。 Next, the depressurization in the through hole of the collet 100 is released, and the collet 100 is raised as shown in FIG. 3D. The collet 100 does not bring back the light emitting element 43, and the light emitting element 43 is placed on the joining member 42.

以上のように、コレット１００を用いてパッケージ４１上に発光素子４３を順次載置した後、図４Ａに示すようにワイヤ４４を接続し、図４Ｂに示すように凹部内に封止部材４５を配置する。その後、図４Ｃに示すように個片化することで、発光装置４０を得ることができる。 As described above, after the light emitting elements 43 are sequentially placed on the package 41 using the collet 100, the wires 44 are connected as shown in FIG. 4A, and the sealing member 45 is placed in the recess as shown in FIG. 4B. Deploy. After that, the light emitting device 40 can be obtained by individualizing as shown in FIG. 4C.

本発明に係るコレットは、発光素子等の半導体素子をパッケージ等の実装部に移送する工程において用いることができる。 The collet according to the present invention can be used in a step of transferring a semiconductor element such as a light emitting element to a mounting portion such as a package.

１００…コレット
１０…本体部
１１…第１貫通孔
１２…第１凸部
１４…開口部
１５…第１凸部内貫通孔
２０…ゴム弾性部
２１…第２貫通孔
３０…先端部
３１…第３貫通孔
３２…第２凸部
３３…第２凸部内貫通孔
３４…柱状部
３５…錐台状部
３６…吸着部
３７…吸着面
４０…発光装置
４１…パッケージ
４２…接合部材
４３…発光素子
４４…ワイヤ
４５…封止部材
５０…支持体 100 ... Collet 10 ... Main body 11 ... First through hole 12 ... First convex part 14 ... Opening 15 ... First convex inner through hole 20 ... Rubber elastic part 21 ... Second through hole 30 ... Tip 31 ... Third Through hole 32 ... Second convex portion 33 ... Second convex inner through hole 34 ... Columnar part 35 ... Frustum-shaped part 36 ... Suction part 37 ... Suction surface 40 ... Light emitting device 41 ... Package 42 ... Joining member 43 ... Light emitting element 44 ... Wire 45 ... Sealing member 50 ... Support

Claims (6)

第１貫通孔を有する本体部と、
前記本体部の先端に接続され、前記第１貫通孔と連通する第２貫通孔を有するゴム弾性部と、
前記ゴム弾性部の先端に接続され、前記第２貫通孔と連通する第３貫通孔を有する先端部と、
を備え、
前記第２貫通孔の上側開口部と下側開口部が同じ幅であるコレット。 The main body having the first through hole and
A rubber elastic portion having a second through hole that is connected to the tip of the main body portion and communicates with the first through hole.
A tip portion having a third through hole connected to the tip of the rubber elastic portion and communicating with the second through hole, and a tip portion having a third through hole.
Equipped with
A collet in which the upper opening and the lower opening of the second through hole have the same width. 前記本体部は、先端に第１凸部を有し、前記第１凸部は前記第２貫通孔に嵌合される、請求項１に記載のコレット。 The collet according to claim 1, wherein the main body portion has a first convex portion at a tip thereof, and the first convex portion is fitted into the second through hole. 前記第１貫通孔は、前記第１凸部を連通する第１凸部内貫通孔を備える、請求項２に記載のコレット。 The collet according to claim 2, wherein the first through hole includes a through hole in the first convex portion that communicates with the first convex portion. 前記先端部は、前記ゴム弾性部に接続される上面に第２凸部を有し、前記第２凸部は前記第２貫通孔に嵌合される請求項２又は請求項３に記載のコレット。 The collet according to claim 2 or 3, wherein the tip portion has a second convex portion on an upper surface connected to the rubber elastic portion, and the second convex portion is fitted into the second through hole. .. 前記第３貫通孔は、前記第２凸部を連通する第２凸部内貫通孔を備える、請求項４に記載のコレット。 The collet according to claim 4, wherein the third through hole includes a through hole in the second convex portion that communicates with the second convex portion. 第１貫通孔を有する本体部と、前記本体部の先端に接続され、前記第１貫通孔と連通する第２貫通孔を有するゴム弾性部と、前記ゴム弾性部の先端に接続され、前記第２貫通孔と連通する第３貫通孔を有する先端部と、を備え、前記第２貫通孔の上側開口部と下側開口部が同じ幅であるコレットを準備する工程と、
発光素子を準備する工程と、
前記コレットの前記先端部を前記発光素子に当接させて、前記コレットで前記発光素子を吸着する工程と、
前記発光素子をパッケージ上に載置し、前記発光素子から前記コレットを外す工程と、
を備える発光装置の製造方法。 The main body portion having the first through hole, the rubber elastic portion having the second through hole connected to the tip of the main body portion and communicating with the first through hole, and the rubber elastic portion connected to the tip of the rubber elastic portion, the first A step of preparing a collet having a tip portion having a third through hole communicating with the two through holes, and having the same width as the upper opening and the lower opening of the second through hole.
The process of preparing the light emitting element and
A step of bringing the tip of the collet into contact with the light emitting element and adsorbing the light emitting element with the collet.
The step of placing the light emitting element on the package and removing the collet from the light emitting element,
A method of manufacturing a light emitting device comprising.
JP2018205030A 2018-10-31 2018-10-31 A collet and a method for manufacturing a light emitting device using a collet. Active JP7032660B2 (en)

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Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018085356A (en) 2016-11-21 2018-05-31 日亜化学工業株式会社 Method for manufacturing light-emitting device

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11288997A (en) * 1998-04-03 1999-10-19 Citizen Watch Co Ltd Ic suction collet

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018085356A (en) 2016-11-21 2018-05-31 日亜化学工業株式会社 Method for manufacturing light-emitting device

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