JP7027253B2 - ループ型ヒートパイプ及びその製造方法 - Google Patents

ループ型ヒートパイプ及びその製造方法 Download PDF

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Publication number
JP7027253B2
JP7027253B2 JP2018103266A JP2018103266A JP7027253B2 JP 7027253 B2 JP7027253 B2 JP 7027253B2 JP 2018103266 A JP2018103266 A JP 2018103266A JP 2018103266 A JP2018103266 A JP 2018103266A JP 7027253 B2 JP7027253 B2 JP 7027253B2
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Japan
Prior art keywords
metal layer
bottomed
evaporator
space
metal
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
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JP2018103266A
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English (en)
Japanese (ja)
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JP2019207083A5 (enExample
JP2019207083A (ja
Inventor
洋弘 町田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
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Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2018103266A priority Critical patent/JP7027253B2/ja
Priority to EP19176554.4A priority patent/EP3575727B1/en
Priority to US16/423,749 priority patent/US11262137B2/en
Priority to CN201910465344.2A priority patent/CN110553525B/zh
Publication of JP2019207083A publication Critical patent/JP2019207083A/ja
Publication of JP2019207083A5 publication Critical patent/JP2019207083A5/ja
Application granted granted Critical
Publication of JP7027253B2 publication Critical patent/JP7027253B2/ja
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/043—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure forming loops, e.g. capillary pumped loops
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3736—Metallic materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2018103266A 2018-05-30 2018-05-30 ループ型ヒートパイプ及びその製造方法 Active JP7027253B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2018103266A JP7027253B2 (ja) 2018-05-30 2018-05-30 ループ型ヒートパイプ及びその製造方法
EP19176554.4A EP3575727B1 (en) 2018-05-30 2019-05-24 Loop-type heat pipe
US16/423,749 US11262137B2 (en) 2018-05-30 2019-05-28 Loop-type heat pipe
CN201910465344.2A CN110553525B (zh) 2018-05-30 2019-05-30 环路式热管

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018103266A JP7027253B2 (ja) 2018-05-30 2018-05-30 ループ型ヒートパイプ及びその製造方法

Publications (3)

Publication Number Publication Date
JP2019207083A JP2019207083A (ja) 2019-12-05
JP2019207083A5 JP2019207083A5 (enExample) 2021-02-18
JP7027253B2 true JP7027253B2 (ja) 2022-03-01

Family

ID=66647318

Family Applications (1)

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JP2018103266A Active JP7027253B2 (ja) 2018-05-30 2018-05-30 ループ型ヒートパイプ及びその製造方法

Country Status (4)

Country Link
US (1) US11262137B2 (enExample)
EP (1) EP3575727B1 (enExample)
JP (1) JP7027253B2 (enExample)
CN (1) CN110553525B (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019106762A1 (ja) * 2017-11-29 2019-06-06 富士通株式会社 ループヒートパイプ及び電子機器
JP7372185B2 (ja) 2020-03-17 2023-10-31 新光電気工業株式会社 ループ型ヒートパイプ及びその製造方法
JP7513543B2 (ja) * 2021-02-12 2024-07-09 新光電気工業株式会社 ループ型ヒートパイプ
JP2024053369A (ja) * 2022-10-03 2024-04-15 新光電気工業株式会社 ループ型ヒートパイプ及びループ型ヒートパイプの製造方法
JP2024103226A (ja) * 2023-01-20 2024-08-01 新光電気工業株式会社 ループ型ヒートパイプ及びループ型ヒートパイプの製造方法
FI20245347A1 (en) * 2024-03-27 2025-09-28 Thermal Channel Tech Oy Evaporator and cooling element

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015087451A1 (ja) 2013-12-13 2015-06-18 富士通株式会社 ループ型ヒートパイプとその製造方法、及び電子機器
JP2015183880A (ja) 2014-03-20 2015-10-22 富士通株式会社 ループ型ヒートパイプとその製造方法、及び電子機器
JP2016142416A (ja) 2015-01-29 2016-08-08 富士通株式会社 ループヒートパイプ及びループヒートパイプの製造方法

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US6843308B1 (en) * 2000-12-01 2005-01-18 Atmostat Etudes Et Recherches Heat exchanger device using a two-phase active fluid, and a method of manufacturing such a device
WO2007029359A1 (en) * 2005-09-01 2007-03-15 Fuchigami Micro Co., Ltd. Heat pipe and method for manufacturing same
JP2009076650A (ja) * 2007-09-20 2009-04-09 Sony Corp 相変化型ヒートスプレッダ、流路構造体、電子機器及び相変化型ヒートスプレッダの製造方法
US20090139696A1 (en) * 2007-12-03 2009-06-04 Forcecon Technology Co., Ltd. Flat heat pipe with multi-passage sintered capillary structure
JP4557055B2 (ja) * 2008-06-25 2010-10-06 ソニー株式会社 熱輸送デバイス及び電子機器
US20100326644A1 (en) * 2009-06-30 2010-12-30 Shui-Hsu Hung Plane-type heat-dissipating structure with high heat-dissipating effect and method for manufacturing the same
JP5668325B2 (ja) * 2010-05-18 2015-02-12 富士通株式会社 ループ型ヒートパイプ及び電子機器
JP5553040B2 (ja) * 2011-02-03 2014-07-16 トヨタ自動車株式会社 電子部品
WO2015097451A1 (en) 2013-12-23 2015-07-02 Johnson Matthey Public Limited Company Scanning method
US10288330B2 (en) * 2016-04-18 2019-05-14 Qcip Holdings, Llc Microchannel evaporators with reduced pressure drop
JP6291000B2 (ja) * 2016-09-01 2018-03-07 新光電気工業株式会社 ループ型ヒートパイプ及びその製造方法
JP6691467B2 (ja) * 2016-11-18 2020-04-28 新光電気工業株式会社 ループ型ヒートパイプ及びその製造方法
JP6920231B2 (ja) * 2018-02-06 2021-08-18 新光電気工業株式会社 ループ型ヒートパイプ
JP7015197B2 (ja) * 2018-03-26 2022-02-02 新光電気工業株式会社 ループ型ヒートパイプ及びその製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015087451A1 (ja) 2013-12-13 2015-06-18 富士通株式会社 ループ型ヒートパイプとその製造方法、及び電子機器
JP2015183880A (ja) 2014-03-20 2015-10-22 富士通株式会社 ループ型ヒートパイプとその製造方法、及び電子機器
JP2016142416A (ja) 2015-01-29 2016-08-08 富士通株式会社 ループヒートパイプ及びループヒートパイプの製造方法

Also Published As

Publication number Publication date
EP3575727A1 (en) 2019-12-04
US20190368820A1 (en) 2019-12-05
CN110553525A (zh) 2019-12-10
EP3575727B1 (en) 2021-12-22
JP2019207083A (ja) 2019-12-05
CN110553525B (zh) 2022-12-13
US11262137B2 (en) 2022-03-01

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