JP7021792B2 - 半導体デバイスと熱拡散マウントとの銀-インジウム過渡液相接合方法および銀-インジウム過渡液相接合ジョイントを有する半導体構造 - Google Patents
半導体デバイスと熱拡散マウントとの銀-インジウム過渡液相接合方法および銀-インジウム過渡液相接合ジョイントを有する半導体構造 Download PDFInfo
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- JP7021792B2 JP7021792B2 JP2019562577A JP2019562577A JP7021792B2 JP 7021792 B2 JP7021792 B2 JP 7021792B2 JP 2019562577 A JP2019562577 A JP 2019562577A JP 2019562577 A JP2019562577 A JP 2019562577A JP 7021792 B2 JP7021792 B2 JP 7021792B2
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Description
無し。
良好な接合結果を得るためには、加える接合圧力の大きさを最適化する必要がある。
加えられる接合圧力が高すぎると、GaAsチップ1内にクラックが発生するであろう。
加えられる接合圧力が低すぎると、元の接合界面にいくつかのギャップまたはボイドを有する部分的な接合結果になるであろう。
例示された実施形態では、100psi(0.69MPa)から300psi(2.07MPa)の範囲内の接合圧力は、好ましい接合結果をもたらすであろう。一方、200psi(1.38MPa)程度の接合圧力は、GaAsからダイヤモンドへの銀-インジウムTLP接合工程に最も適したものになるであろう。
このレベルの接合圧力では、この銀-インジウムTLP接合工程は、低圧接合工程とみなされなければならない。
Claims (38)
- 半導体デバイスと熱拡散マウントとの銀-インジウム過渡液相接合方法であって、前記半導体デバイスの底側への第1接合構造の形成と、前記熱拡散マウントの上側への第2接合構造の形成と、銀-インジウム接合工程の実施とを含み、
前記第1接合構造の形成は、前記半導体デバイスの底への第1銀TLP接合層の形成を含み、
前記第2接合構造の形成は、前記熱拡散マウントの上の第2銀TLP接合層と、前記第2銀TLP接合層の上の中間過渡AgIn2IMC(金属間化合物)層と、前記中間過渡AgIn2IMC層の上のインジウムTLP接合層と、前記インジウムTLP接合層の上の酸化防止AgIn2IMCキャッピング層とを有する多層構造体の形成を含み、
前記銀-インジウム接合工程の実施は、前記第1接合構造および前記第2接合構造に、銀-インジウム接合工程を行い、前記第1接合構造および前記第2接合構造を、前記半導体デバイスに接触した第1銀-インジウム固溶体層と、前記熱拡散マウントに接触した第2銀-インジウム固溶体層と、前記第1銀-インジウム固溶体層および前記第2銀-インジウム固溶体層に挟まれたAg2InIMC層とを有するサンドイッチ接合構造を含む接合ジョイントに変換し、前記接合ジョイントが前記半導体デバイスと前記熱拡散マウントとを接合し、前記Ag2InIMC層の厚さが、前記第1銀-インジウム固溶体層の厚さより大きく、前記第2銀-インジウム固溶体層の厚さよりも大きくなるようにする、方法。 - 前記半導体デバイスの底側に前記第1接合構造を形成するステップ全体が、たった1つの中断されない真空サイクルの下でPVD(物理蒸着)により行われる、請求項1に記載の方法。
- 前記半導体デバイスの底側に前記第1接合構造を形成するステップは、前記半導体デバイスの底に前記第1銀TLP接合層を形成するステップの後、前記第1接合構造および前記半導体デバイスにアニール処理を施すことをさらに含む、請求項1に記載の方法。
- 前記熱拡散マウントの上側に前記第2接合構造を形成するステップ全体が、たった1つの中断されない真空サイクルの下でPVDにより行われる、請求項1に記載の方法。
- 前記熱拡散マウントの上側に前記第2接合構造を形成後であって、前記第1接合構造および前記第2接合構造に、前記銀-インジウム接合工程を行う前に、前記第2接合構造を有する前記熱拡散マウントを、-20℃より低い温度下で保存することをさらに含む、請求項1に記載の方法。
- 請求項1に記載の方法であって、前記多層構造体を形成するステップは、以下を含む:
前記熱拡散マウントの上に、初期銀TLP接合層を形成すること;
前記初期銀TLP接合層を形成後、前記初期銀TLP接合層の上に初期インジウムTLP接合層を形成し、前記初期銀TLP接合層の一部と前記初期インジウムTLP接合層の一部とが反応して、前記第2銀TLP接合層と前記インジウムTLP接合層との界面に前記中間過渡AgIn2IMC層を形成すること;および
前記初期インジウムTLP接合層の上に銀酸化防止キャッピング層を形成し、前記初期インジウムTLP接合層の別の一部と前記銀酸化防止キャッピング層とが反応して、前記酸化防止AgIn2IMCキャッピング層を形成すること。 - 前記初期銀TLP接合層の上に前記初期インジウムTLP接合層を形成するステップは、4nm/sから5nm/sの範囲の速度でPVDにより行われる、請求項6に記載の方法。
- 前記酸化防止AgIn2IMCキャッピング層を形成するステップは、前記銀酸化防止キャッピング層の厚さのおよそ3倍の厚さを有する前記酸化防止AgIn2IMCキャッピング層を形成することを含む、請求項6に記載の方法。
- 前記熱拡散マウントの上に、前記初期銀TLP接合層を形成するステップは、たった1つの中断されない真空サイクルの下でPVDにより行われる、請求項6に記載の方法。
- 請求項9に記載の方法であって、前記熱拡散マウントの上側に前記第2接合構造を形成するステップは、さらに以下を含む:
前記熱拡散マウントの上に前記初期銀TLP接合層を形成後であって、前記初期銀TLP接合層の上に前記初期インジウムTLP接合層を形成するステップの前に、前記熱拡散マウントおよび前記熱拡散マウントの上の前記初期銀TLP接合層に、アニール処理を施すこと。 - 前記初期銀TLP接合層の上に前記初期インジウムTLP接合層を形成するステップおよび前記初期インジウムTLP接合層の上に前記銀酸化防止キャッピング層を形成するステップは、前記アニール処理後に行われ、前記1つの中断されない真空サイクルとは別のもう1つの中断されない真空サイクルの下でPVDにより行われる、請求項10に記載の方法。
- 請求項6に記載の方法であって、前記第1接合構造および前記第2接合構造を前記接合ジョイントに変換するステップは、以下を含む:
第1の所定の温度範囲で、前記第1の所定の温度範囲の最低温度から第1の昇温速度で、前記第2接合構造の前記インジウムTLP接合層と前記第1接合構造の前記第1銀TLP接合層との間で、前記酸化防止AgIn2IMCキャッピング層を介して、および、前記第2接合構造の前記インジウムTLP接合層と前記第2接合構造の前記第2銀TLP接合層との間で、前記中間過渡AgIn2IMC層を介して、固体相互拡散および固相反応を行い、前記第2接合構造の前記中間過渡AgIn2IMC層および前記酸化防止AgIn2IMCキャッピング層をさらに成長させること。 - 前記第1の昇温速度は、1K/sから20K/sの範囲である、請求項12に記載の方法。
- 請求項12に記載の方法であって、前記第1接合構造および前記第2接合構造を前記接合ジョイントに変換するステップは、さらに以下を含む:
前記固体相互拡散および固相反応を行った後、
前記第1の所定の温度範囲よりも高い第2の所定の温度範囲で、
前記第2接合構造の前記インジウムTLP接合層と前記第1接合構造の前記第1銀TLP接合層との間で、前記酸化防止AgIn2IMCキャッピング層を介して、および、前記第2接合構造の前記インジウムTLP接合層と前記第2接合構造の前記第2銀TLP接合層との間で、前記中間過渡AgIn2IMC層を介して、液固相互拡散および液固反応を行い、
前記中間過渡AgIn2IMC層および前記酸化防止AgIn2IMCキャッピング層中のAgIn2IMCは、包晶分解反応により液相のインジウムおよびγ相の固体Ag2InIMCに変換されるが、前記第2の所定の温度範囲で包晶分解反応が行われなくなるまで、前記液固相互拡散および液固反応を行う。 - 前記中間過渡AgIn2IMC層および前記酸化防止AgIn2IMCキャッピング層中のAgIn2IMCは、前記第2の所定の温度範囲内で、液相のインジウムおよびγ相の固体Ag2InIMCに完全に変換されている、請求項14に記載の方法。
- 前記第2の所定の温度範囲は、180℃から205℃である、請求項15に記載の方法。
- 前記第1接合構造および前記第2接合構造を前記接合ジョイントに変換するステップは、
前記第2の所定の温度範囲で包晶分解反応が行われなくなった後、第3の所定の温度範囲で、前記第3の所定の温度範囲の最高温度から第1の冷却速度で、前記接合ジョイントの所定の相同温度(Th)内にとどまったまま、均質化工程を行い、
均一なAg2InIMC層として前記Ag2InIMC層を有する前記サンドイッチ接合構造を形成することをさらに含み、
前記第3の所定の温度範囲は、前記第2の所定の温度範囲よりも低い、請求項14に記載の方法。 - 前記第1の冷却速度は、前記第1の昇温速度よりも低い、請求項17に記載の方法。
- 前記第1の冷却速度は、0.02K/sから1K/sの範囲であり、
前記接合ジョイントの前記所定の相同温度(Th)は、0.4よりも大きい、請求項17に記載の方法。 - 請求項17に記載の方法であって、さらに以下を含む:
前記銀-インジウム接合工程中に、前記第2銀-インジウム固溶体層の非接合領域に、リフローを行い、前記Ag2InIMC層の横の側壁および前記第2銀-インジウム固溶体層の上面と接触した、Ag2InIMCとAgIn2IMCの複合材料の層を形成すること。 - 前記第1接合構造および前記第2接合構造を前記接合ジョイントに変換するステップは、
前記均質化工程を行った後、第4の所定の温度範囲で、前記第4の所定の温度範囲の最高温度から第2の冷却速度で、前記サンドイッチ接合構造に対し、熱応力緩和工程を行うことをさらに含む、請求項17に記載の方法。 - 前記第2の冷却速度は、前記第1の冷却速度よりも低い、請求項21に記載の方法。
- 前記第2の冷却速度は、0.01K/sよりも低い、請求項21に記載の方法。
- 前記第1接合構造および前記第2接合構造を前記接合ジョイントに変換するステップは、
前記熱応力緩和工程に加えて、およそ100℃で接合後アニーリング工程を行うことをさらに含む、請求項21に記載の方法。 - 前記銀-インジウム接合工程を行うステップは、前記第1接合構造が前記第2接合構造に面し、前記第2接合構造上に対称的に配されるように、前記第2接合構造を有する前記熱拡散マウントの上に、前記第1接合構造を有する前記半導体デバイスを配置することを含む、請求項1に記載の方法。
- 前記銀-インジウム接合工程を行うステップは、
前記銀-インジウム接合工程中に、前記第1接合構造と前記第2接合構造との間に、静的接合圧力を加えることをさらに含む、請求項25に記載の方法。 - 前記静的接合圧力は、100psiから300psiの範囲内である、請求項26に記載の方法。
- 前記銀-インジウム接合工程の間、前記半導体デバイスの上側からおよび前記熱拡散マウントの底側から、それぞれ前記インジウムTLP接合層の中心まで、対称的な温度プロファイルと勾配を維持することをさらに含む、請求項1に記載の方法。
- 前記銀-インジウム接合工程は、50mTorrよりも高い真空レベルの真空環境下、あるいは、不活性ガスまたは還元性ガス環境下で行われる、請求項1に記載の方法。
- 前記半導体デバイスは、その底部に第1メタライズ層を含み、
前記第1銀TLP接合層を形成するステップは、前記第1メタライズ層の底に、前記第1銀TLP接合層を形成することを含み、
前記熱拡散マウントは、その上部に第2メタライズ層を含み、
前記多層構造体を形成するステップは、前記第2メタライズ層の上に前記第2銀TLP接合層を形成することを含む、請求項1に記載の方法。 - 前記第1メタライズ層は、前記半導体デバイスの底部に第1CTE(熱膨張係数)不整合誘導応力補償層および、前記第1CTE不整合誘導応力補償層の上に第1拡散バリア層を含み、
前記第1メタライズ層の底に前記第1銀TLP接合層を形成するステップは、前記第1CTE不整合誘導応力補償層の底に前記第1銀TLP接合層を形成することを含み、
前記第2メタライズ層は、前記熱拡散マウントの上部に第2CTE(熱膨張係数)不整合誘導応力補償層と、前記第2CTE不整合誘導応力補償層の下に第2拡散バリア層とを含み、
前記第2銀TLP接合層を形成するステップは、前記第2CTE不整合誘導応力補償層の上に前記第2銀TLP接合層を形成することを含む、請求項30に記載の方法。 - 半導体デバイス、熱拡散マウント、および前記半導体デバイスと前記熱拡散マウントとを接合する接合ジョイントとを有する半導体構造であって、
前記接合ジョイントは、サンドイッチ接合構造を含み、
前記サンドイッチ接合構造は、
前記半導体デバイスと接触した第1銀-インジウム固溶体層と、
前記熱拡散マウントに接触した第2銀-インジウム固溶体層と、
前記第1銀-インジウム固溶体層および前記第2銀-インジウム固溶体層に挟まれたAg2InIMC(金属間化合物)層とを有し、
前記Ag2InIMC層の厚さは、前記第1銀-インジウム固溶体層の厚さより大きく、前記第2銀-インジウム固溶体層の厚さよりも大きい、半導体構造。 - 前記Ag2InIMC層の横の側壁および前記第2銀-インジウム固溶体層の上面と接触した、Ag2InIMCとAgIn2IMCの複合材料の層をさらに含む、請求項32に記載の半導体構造。
- 前記Ag2InIMCとAgIn2IMCの複合材料の層は、前記Ag2InIMC層の前記横の側壁を囲む、請求項33に記載の半導体構造。
- 前記サンドイッチ接合構造は、3μm以下の厚さを有する、請求項32に記載の半導体構造。
- 前記半導体デバイスは、その底部に、前記第1銀-インジウム固溶体層と接触した第1メタライズ層を含み、
前記熱拡散マウントは、その上部に、前記第2銀-インジウム固溶体層と接触した第2メタライズ層を含む、請求項32に記載の半導体構造。 - 前記Ag2InIMC層は、前記第1銀-インジウム固溶体層により、前記第1メタライズ層から完全に分離され、前記第2銀-インジウム固溶体層により、前記第2メタライズ層から完全に分離されている、請求項36に記載の半導体構造。
- 前記第1メタライズ層は、
前記半導体デバイスの底部に、前記第1銀-インジウム固溶体層と接触した第1CTE(熱膨張係数)不整合誘導応力補償層と、
前記第1CTE不整合誘導応力補償層の上に、前記第1CTE不整合誘導応力補償層により前記第1銀-インジウム固溶体層から完全に分離された第1拡散バリア層とを含み、
前記第2メタライズ層は、
前記熱拡散マウントの上部に、前記第2銀-インジウム固溶体層と接触した第2CTE不整合誘導応力補償層と、
前記第2CTE不整合誘導応力補償層の下に、前記第2CTE不整合誘導応力補償層により前記第2銀-インジウム固溶体層から完全に分離された第2拡散バリア層とを含む、請求項36に記載の半導体構造。
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