JP7020109B2 - Luminescent device - Google Patents

Description

Embodiments of the present invention relate to a light emitting device.

A light emitting device including a substrate in which a plurality of LED chips are arranged is known. A wiring pattern having a plurality of connection portions to which each LED chip is connected is formed on the substrate. The connection portion has a predetermined pad pattern (land pattern) connected to the electrode pattern of the LED chip.

JP-A-2009-16093

When the arrangement of the LED chips is changed in the above-mentioned light emitting device, a new wiring pattern in which the connection portion is provided at the position corresponding to the arrangement of the LED chips is formed on the substrate, and the arrangement of the LED chips is different. It causes a decrease in the productivity of the light emitting device. On the other hand, when changing the arrangement of the LED chips and using an existing board on which a predetermined wiring pattern is formed, the wiring pattern is conducted by connecting the jumper chip to the connection portion to which the LED chip is not connected. .. In this way, the work of selecting a jumper chip that can be connected to the pad pattern of the connection portion and connecting the jumper chip to the connection portion is complicated. Therefore, when changing the arrangement of a plurality of LED chips, it is difficult to divert the existing substrate.

Further, a light emitting device using a plurality of LED chips that emit ultraviolet rays is known. The luminous efficiency of the LED chip that emits ultraviolet rays differs depending on the wavelength that emits it. For example, the luminous efficiency of an LED chip that emits light having a wavelength of 405 [nm] is about 40 [%], and the luminous efficiency of an LED chip that emits light having a wavelength of 365 [nm] is about 38 [%]. On the other hand, the luminous efficiency of the LED chip that emits light having a wavelength of 280 [nm] is about 3 [%], and the luminous efficiency of the LED chip that emits light having a wavelength of 265 [nm] is about 0.5 [%]. The shorter the wavelength of the light emitted from the LED chip, the lower the luminous efficiency. Therefore, in a light emitting device using a plurality of LED chips that emit ultraviolet rays, for example, a light emitting device having a wavelength of 405 [nm] and a light emitting device having a wavelength of 265 [nm] require the required illuminance and the required LED. Since the number of chips is different, it was difficult to divert the existing substrate.

Therefore, an object of the present invention is to provide a light emitting device capable of increasing the degree of freedom in changing the arrangement of LED chips.

The light emitting device according to the embodiment is formed into the LED chip having the first electrode pattern, the jumper chip having the second electrode pattern, the wiring pattern to which the LED chip and the jumper chip are connected, and the wiring pattern. 1. It has a pad pattern and a second pad pattern to which the second electrode pattern of the jumper tip is connected.

According to the present invention, the degree of freedom for changing the arrangement of LED chips can be increased.

It is a top view which shows the light emitting device which concerns on 1st Embodiment. It is a top view which shows the connection part which the substrate of the light emitting device which concerns on 1st Embodiment has. It is a top view which shows the structural example of the light emitting device which concerns on 1st Embodiment. It is a top view which shows the connection part which the substrate of the light emitting device which concerns on 2nd Embodiment has. It is a top view which shows the common electrode pattern which the LED chip of the light emitting device which concerns on 2nd Embodiment has. It is a top view which shows the common electrode pattern which the jumper chip of the light emitting device which concerns on 2nd Embodiment has. It is a top view which shows the connection part which the substrate of the light emitting device which concerns on 3rd Embodiment has.

The light emitting device 1 according to the embodiment described below includes an LED chip 11, a jumper chip 13, and a substrate 15. The LED chip 11 has a first electrode pattern 12. The jumper tip 13 has a second electrode pattern 14. The substrate 15 has a wiring pattern 16 and a connection portion 17. The LED chip 11 and the jumper chip 13 are connected to the wiring pattern 16. The connection portion 17 is formed in the wiring pattern 16. The LED chip 11 and the jumper chip 13 are selectively connected to the connection portion 17. The connecting portion 17 has a first pad pattern 18 and a second pad pattern 19. The first electrode pattern 12 of the LED chip 11 is connected to the first pad pattern 18. The second electrode pattern 14 of the jumper tip 13 is connected to the second pad pattern 19.

Further, in the light emitting device 2 according to the embodiment described below, the first electrode pattern 12 of the LED chip 11 and the second electrode pattern 14 of the jumper chip 13 are the same common electrode pattern 24. The first pad pattern 18 and the second pad pattern 19 of the connecting portion 17 are a single unit to which the first electrode pattern 12 of the LED chip 11 and the second electrode pattern 14 of the jumper chip 13 are selectively connected. It is a common pad pattern 25.

Further, the common pad pattern 25 in the light emitting device according to the embodiment described below has a pair of pads 24a. In the wiring pattern 31 and the common pad pattern 33, a continuous wiring pattern 31 and each pad 33a connected to both ends of the wiring pattern 31 are formed by one block pattern 34.

Further, the LED chip 11 in the light emitting device (1, 2) according to the embodiment described below emits ultraviolet rays having a wavelength of 200 [nm] to 450 [nm].

(First Embodiment)
Hereinafter, the light emitting device according to the embodiment will be described with reference to the drawings. FIG. 1 is a plan view showing a light emitting device 1 according to the first embodiment. FIG. 2 is a plan view showing a connection portion 17 included in the substrate 15 of the light emitting device 1 according to the first embodiment.

(Configuration of light emitting device)
As shown in FIG. 1, the light emitting device 1 according to the present embodiment has an LED chip 11 having a first electrode pattern 12, a jumper chip 13 having a second electrode pattern 14, an LED chip 11 and a jumper chip 13. A substrate 15 having a wiring pattern 16 to which the LEDs are connected is provided. The LED chip 11 and the jumper chip 13 are surface-mounted on the wiring pattern 16 of the substrate 15 via a conductive material such as solder, and may be flip-chip mounted. The LED chip 11 emits ultraviolet rays having a wavelength of about 200 [nm] to about 450 [nm].

As shown in FIGS. 1 and 2, a plurality of connection portions 17 to which the LED chip 11 and the jumper chip 13 are selectively connected are formed in the wiring pattern 16 of the substrate 15. As an example, the wiring pattern 16 meanders along one side of the substrate 15. The plurality of connecting portions 17 are arranged at predetermined intervals along the longitudinal direction of the wiring pattern 16. The connection portion 17 has a first pad pattern 18 to which the first electrode pattern 12 of the LED chip 11 is connected, and a second pad pattern 19 to which the second electrode pattern 14 of the jumper chip 13 is connected. Have.

As shown in FIG. 1, the first electrode pattern 12 of the LED chip 11 has a pair of electrodes 12a connected to the first pad pattern 18 of the substrate 15. Similarly, the second electrode pattern 14 of the jumper chip 13 has a pair of electrodes 14a connected to the second pad pattern 19 of the substrate 15.

As shown in FIG. 2, the first pad pattern 18 has a pair of pads 18a connected to each electrode 12a of the LED chip 11. Similarly, the second pad pattern 19 has a pair of pads 19a connected to each electrode 14a of the jumper tip 13. In the first pad pattern 18 and the second pad pattern 19, the pads 18a and 19a on the cathode side are connected to one end side of the wiring pattern 16, respectively, and the pads 18a and 19a on the anode side are the other ends of the wiring pattern 16. They are connected to each side.

Further, the substrate 15 is provided with a connection terminal 21 connected to the power supply (not shown) via the connection wiring 22, and the connection terminal 21 and the wiring pattern 16 are connected to each other. Although not shown, the pads 18a and 19a of the first pad pattern 18 and the second pad pattern 19 may have through holes (through holes) on the back surface side of the connection portion 17 on the substrate 15. Wiring patterns may be formed. Further, the number of the pads 18a and 19a included in the first pad pattern 18 and the second pad pattern 19 is not limited to two.

(Configuration example of light emitting device)
FIG. 3 is a plan view showing a configuration example of the light emitting device 1 according to the first embodiment. 3A, 3B, and 3C are configurations in which the arrangement of the LED chips 11 is changed in the light emitting device 1. In FIG. 3, the jumper tip 13 is shown with a shading.

The light emitting device 1 shown in FIG. 3A is a configuration example in which the LED chips 11 are arranged in an annular shape on the outer peripheral side of the substrate 15 and the jumper chips 13 are arranged in the center of the substrate 15, and the outer periphery of the substrate 15 is arranged. A light emitting region is provided on the side.

The light emitting device 1 shown in FIG. 3B is a configuration example in which the LED chips 11 are collected and arranged in the center of the substrate 15 and the jumper chips 13 are arranged at the four corners of the substrate 15, and the center side of the substrate 15 is arranged. Is provided with a light emitting region.

The light emitting device 1 shown in FIG. 3C is a configuration example in which the LED chips 11 are arranged in two rows in the center of the substrate 15 and the jumper chips 13 are arranged in one row on both sides of the LED chip 11. There is a linear light emitting region provided on the center side of the substrate 15.

As shown in FIGS. 3A, 3B and 3C, according to the light emitting device 1, the LED chip 11 and the jumper chip 13 are selectively connected to each of the plurality of connection portions 17. , The LED chips 11 can be easily changed to an arbitrary arrangement, and for example, the light emitting region, the illuminance, the uniformity, and the like of the light emitting device 1 can be easily changed.

As described above, the substrate 15 in the light emitting device 1 of the first embodiment has a connection portion 17 to which the first electrode pattern 12 of the LED chip 11 and the second electrode pattern 14 of the jumper chip 13 are selectively connected. The connection portion 17 has a first pad pattern 18 to which the first electrode pattern 12 of the LED chip 11 is connected, and a second pad to which the second electrode pattern 14 of the jumper chip 13 is connected. It has a pattern 19. This makes it possible to increase the degree of freedom in changing the arrangement of the LED chips 11, and for example, the light emitting region, the illuminance, the uniformity, and the like can be easily changed. In other words, according to the present embodiment, since the versatility of the substrate 15 is enhanced, it is possible to easily change the configuration using the LED chip 11 and the jumper chip 13 in combination, and a plurality of different light emitting regions and the like can be easily changed. It is possible to increase the productivity of the type of light emitting device 1. In particular, in the light emitting device 1 using a plurality of LED chips 11 that emit ultraviolet rays, for example, the light emitting device 1 that emits light having a wavelength of 405 [nm] as the main wavelength and the light having a wavelength of 265 [nm] as the main wavelength. The required illuminance and the required number of LED chips 11 are different from those of the light emitting device 1 that emits light. However, by using the substrate 15 in the light emitting device 1 of the first embodiment, the versatility of the substrate 15 is enhanced, so that the configuration using the LED chip 11 and the jumper chip 13 in combination can be easily changed. Therefore, the productivity of a plurality of types of light emitting devices 1 can be increased.

Further, the LED chip 11 in the light emitting device 1 of the first embodiment emits ultraviolet rays having a wavelength of about 200 [nm] to about 450 [nm]. This configuration is preferable because the versatility of the substrate 15 is enhanced especially when the LED chip 11 used for the light emitting element 1 emits ultraviolet rays.

Hereinafter, the light emitting device of another embodiment will be described with reference to the drawings. In another embodiment, the same components as the light emitting device 1 of the first embodiment are designated by the same reference numerals as those of the first embodiment, and the description thereof will be omitted.

(Second embodiment)
FIG. 4 is a plan view showing a connection portion 17 included in the substrate 15 of the light emitting device 2 according to the second embodiment. FIG. 5 is a plan view showing a common electrode pattern included in the LED chip 11 of the light emitting device 2 according to the second embodiment. FIG. 6 is a plan view showing a common electrode pattern included in the jumper chip 13 of the light emitting device 2 according to the second embodiment. In the second embodiment, the electrode patterns of the LED chip 11 and the jumper chip 13 and the pad pattern of the substrate 15 are different from those of the first embodiment.

As shown in FIG. 4, the light emitting device 2 of the second embodiment has a wiring pattern 16 in which an LED chip 11 and a jumper chip 13 having a common electrode pattern 24 and a connection portion 17 having a common pad pattern 25 are formed. The substrate 15 to have is provided.

That is, in the second embodiment, as shown in FIGS. 5 and 6, the first electrode pattern 12 of the LED chip 11 and the second electrode pattern 14 of the jumper chip 13 in the first embodiment are the same. It is formed as a common electrode pattern 24. Each common electrode pattern 24 of the LED chip 11 and the jumper chip 13 has a pair of pads 24a. Further, in the second embodiment, as shown in FIG. 4, the first pad pattern 18 and the second pad pattern 19 of the connection portion 17 in the first embodiment are the first electrode patterns of the LED chip 11. The second electrode pattern 14 of the jumper tip 13 and the jumper tip 13 is formed as a single common pad pattern 25 to which the second electrode pattern 14 is selectively connected.

In the second embodiment, the LED chip 11 and the jumper chip 13 each have a common electrode pattern 24 having the same shape, but it is sufficient that the LED chip 11 has an electrode pattern that can be connected to the common pad pattern 25. The electrode patterns of 11 and the jumper tip 13 may be different. That is, in the case of this configuration, the first electrode pattern of the LED chip 11 and the second electrode pattern of the jumper chip 13 are formed in a pattern shape that can be connected to the common pad pattern 25 of the substrate 15, respectively. In other words, in the case of this configuration, the pattern shape of the common pad pattern 25 is formed into a pattern shape compatible with the first electrode pattern of the LED chip 11 and the second electrode pattern of the jumper chip 13.

In the light emitting device 2 of the second embodiment, the LED chip 11 and the jumper chip 13 have a common electrode pattern 24, and the connection portion 17 of the substrate 15 has the LED chip 11 and the jumper chip via the common electrode pattern 24. By having the common pad pattern 25 to which the 13 is selectively connected, it is possible to increase the degree of freedom in changing the arrangement of the LED chips 11 as in the first embodiment.

In addition, according to the second embodiment, the common pad pattern 25 simplifies the pad pattern of the connecting portion 17, and simplifies the wiring pattern 16, so that the productivity of the substrate 15 can be improved. Further, since the LED chip 11 and the jumper chip 13 have the common electrode pattern 24 corresponding to the common pad pattern 25, the LED chip 11 or the jumper chip 13 can be easily connected to the connection portion 17, and the connection is made. It is possible to improve the reliability of the connection state of the LED chip 11 and the jumper chip 13 in the unit 17.

In the first embodiment described above, the first pad pattern 18 is used for connecting the LED chip 11, and the second pad pattern 19 is used for connecting the jumper chip 13. Not limited to the configuration. As in the second embodiment, for example, the first pad pattern 18 is configured as the first common pad pattern to which the first LED chip and the first jumper chip can be connected, and the second pad pattern is the second. It may be a second common pad pattern to which the 2 LED chips and the 2nd jumper chips can be connected. In the case of this configuration, in the connection portion 17, different first LED chips and second LED chips can be selectively connected, and different first jumper chips and second jumper chips can be selectively connected. become.

Further, in the above-described embodiment, a plurality of LED chips 11 are connected in series on the wiring pattern 16, but a plurality of LED chips 11 may be connected in parallel on the wiring pattern 16, and the pattern shape of the wiring pattern 16 may be formed. It is not limited. That is, in the wiring pattern 16, the connection form between the cathode side and the anode side of the portion connecting between the connection portions 17 is not limited.

(Third embodiment)
FIG. 7 is a plan view showing a connection portion of the substrate 15 of the light emitting device according to the third embodiment. In the third embodiment, the wiring pattern and the common pad pattern are different from those in the first embodiment.

As shown in FIG. 7, the wiring pattern 31 included in the substrate 15 of the light emitting device of the third embodiment has a plurality of connecting portions 32 to which the LED chip 11 and the jumper chip 13 are selectively connected. The connection portion 32 has a common pad pattern 33 to which each common electrode pattern 24 of the LED chip 11 and the jumper chip 13 can be connected. The common pad pattern 33 has a pair of pads 33a as an anode pad and a cathode pad.

In the wiring pattern 31 and the common pad pattern 33, a continuous wiring pattern 31 and each pad 33a connected to both ends of the wiring pattern 31 are formed by one block pattern 34. In other words, the wiring pattern 31 and the common pad pattern 33 are a part of the wiring pattern 31 connecting the cathode pad to which the cathode electrode is connected, the anode pad to which the anode electrode is connected, and the cathode pad and the anode pad. Is formed as one block pattern 34. The one block pattern 34 referred to here is not limited to, for example, a quadrangle, but refers to a single pattern having an elliptical shape or a simple outer shape, and may be extended in a band shape.

According to the third embodiment, the pattern shapes of the wiring pattern 31 and the common pad pattern 33 can be simplified, and the productivity of the substrate 15 and the light emitting device can be increased.

Although embodiments of the present invention have been described, the embodiments are presented as examples and are not intended to limit the scope of the invention. The embodiment can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the gist of the invention. The embodiments and variations thereof are included in the scope and gist of the present invention, as well as in the scope of the invention described in the claims and the equivalent scope thereof.

1 Light emitting device 11 LED chip 12 1st electrode pattern 13 Jumper chip 14 2nd electrode pattern 15 Board 16 Wiring pattern 17 Connection part 18 1st pad pattern 19 2nd pad pattern 24 Common electrode pattern 25 Common pad pattern 34 Block pattern

Claims (3)

With an LED chip having a first electrode pattern;
With a jumper tip having a second electrode pattern;
A substrate having a wiring pattern to which the LED chip and the jumper chip are connected, and a connection portion formed in the wiring pattern to which the LED chip and the jumper chip are selectively connected;
The connection portion includes a pair of first pads to which the first electrode pattern of the LED chip is connected, and a pair of second pads to which the second electrode pattern of the jumper chip is connected. Have and
The pair of first pads are arranged so as to face the connection portion in a direction in which the wiring pattern extends.
The pair of second pads are arranged so as to face each other in a direction intersecting the direction in which the wiring pattern extends.
One pad of the pair of first pads and one pad of the pair of second pads are connected to one end side of the wiring pattern connected to the connection portion.
A light emitting device in which the other pad of the pair of first pads and the other pad of the pair of second pads are connected to the other end side of the wiring pattern connected to the connection portion . The first electrode pattern of the LED chip connected to the connection portion has a pair of first electrodes facing each other in the direction in which the wiring pattern extends.
The second electrode pattern of the jumper chip connected to the connection portion has a pair of second electrodes facing each other in a direction intersecting the direction in which the wiring pattern extends.
The light emitting device according to claim 1. The LED chip emits light having a wavelength of 200 [nm] to 450 [nm].
The light emitting device according to claim 1 or 2 .

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