JP5878226B2 - Semiconductor light emitting device - Google Patents

Semiconductor light emitting device Download PDF

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JP5878226B2
JP5878226B2 JP2014234280A JP2014234280A JP5878226B2 JP 5878226 B2 JP5878226 B2 JP 5878226B2 JP 2014234280 A JP2014234280 A JP 2014234280A JP 2014234280 A JP2014234280 A JP 2014234280A JP 5878226 B2 JP5878226 B2 JP 5878226B2
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portion
semiconductor light
lead frame
emitting device
direction
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JP2015053516A (en
JP2015053516A5 (en
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小早川 正彦
正彦 小早川
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ローム株式会社
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Description

  The present invention relates to a semiconductor light emitting device including a semiconductor element.

  6 and 7 show an example of a conventional semiconductor light emitting device (see, for example, Patent Document 1). The semiconductor light emitting device X shown in these drawings includes a lead frame 91, an LED chip 92, a case 93, and a translucent resin 94. The lead frame 91 is composed of two belt-like portions having a substantially constant width. The back surface of the lead frame 91 is exposed from the case 93. The LED chip 92 is a light source of the semiconductor light emitting device X, and is bonded to a bonding portion 91 a included in one strip portion of the lead frame 91. The LED chip 92 is connected to the other strip portion of the lead frame 91 by a wire 95.

  In order to increase the brightness of the semiconductor light emitting device X, it is necessary to increase the input power to the LED chip 92. Along with this, the amount of heat generated from the LED chip 92 increases. This heat is preferably released to, for example, a circuit board on which the semiconductor light emitting device X is mounted via the bonding portion 91a. However, in the semiconductor light emitting device X having a long rectangular shape which is relatively small as a whole, there is a problem that when the size of the bonding portion 91a with respect to the case 93 is increased, the lead frame 91 falls out of the case 93.

JP 2005-353914 A

  The present invention has been conceived under the circumstances described above, and an object of the present invention is to provide a semiconductor light emitting device that can be appropriately downsized.

  The semiconductor light emitting device provided by the present invention is bonded to a first lead frame, a second lead frame spaced from the first lead frame in the first direction, and a die bonding portion of the first lead frame. And a semiconductor light emitting element that is electrically connected to the second lead frame, and a frame-shaped portion that surrounds the semiconductor light emitting element in an annular shape so as to be exposed through the opening, and reflects light from the semiconductor light emitting element in the emission direction. A resin case supporting the first lead frame and the second lead frame, wherein the first lead frame is provided integrally with the die bonding portion, and the back surface thereof is emitted from the back surface of the die bonding portion. Located on the direction side and in a second direction perpendicular to the first direction from the die bonding portion in plan view. A first extending portion extending to a region overlapping with the frame-shaped portion and having a width in the first direction smaller than the width in the first direction of the die bonding portion, and the case includes the frame A first holding portion that covers and covers the surface of the first extension portion in close contact with the shape portion, and that covers the back surface of the first extension portion while exposing the back surface of the die bonding portion. Yes.

  According to such a structure, it becomes the appearance which the said case holds the said 1st thin extension part. Thereby, even if the area of the portion of the first lead frame exposed from the case is increased, the first lead frame can be prevented from coming out of the case. Therefore, heat from the semiconductor light emitting device can be appropriately released, and the semiconductor light emitting device can be appropriately downsized.

  In a preferred embodiment of the present invention, the first extending portion is provided so as to extend in the second direction at least in a central region in the first direction of the die bonding portion. In a preferred embodiment of the present invention, the first extension portion is provided so as to extend in the second direction at least in an end region on the second lead frame side in the first direction of the die bonding portion. ing. In a preferred embodiment of the present invention, the first extension portion extends in the second direction at least in an end region opposite to the second lead frame in the first direction of the die bonding portion. Is provided. In preferable embodiment of this invention, the said 1st extension part is provided with two or more. In a preferred embodiment of the present invention, the first extending portion has the surface formed flush with the die bonding portion. In a preferred embodiment of the present invention, the back surface of the die bonding portion is flush with the back surface of the case. In a preferred embodiment of the present invention, the first lead frame has a first terminal portion protruding in the first direction from the case, and the thickness of the portion other than the first terminal portion is the first thickness. The thickness is equal to or less than the thickness of one terminal portion. In a preferred embodiment of the present invention, the second lead frame is provided integrally with a main body portion whose front surface is exposed from the opening of the case and whose rear surface is exposed from the case. The back surface is located on the emission direction side from the back surface of the main body portion, and includes a second extension portion extending from the main body portion to the region overlapping the frame-shaped portion in the second direction in plan view. And the case closely contacts and covers the surface of the second extending portion with the frame-shaped portion, and also closely contacts the back surface of the second extending portion while exposing the back surface of the main body portion. And has a second holding portion that covers it. In a preferred embodiment of the present invention, the second lead frame is provided integrally with the main body portion, and the back surface thereof is located on the emission direction side from the back surface of the main body portion. A third extending portion extending in the first direction from the main body portion is provided, and the case has a third holding portion that covers the back surface of the third extending portion in close contact with each other. In a preferred embodiment of the present invention, the second extending portion and the third extending portion are continuous so as to surround the main body portion. In a preferred embodiment of the present invention, the surfaces of the second extension part and the third extension part are flush with the main body part. In a preferred embodiment of the present invention, the back surface of the main body is flush with the back surface of the case. In a preferred embodiment of the present invention, the second lead frame has a second terminal portion projecting from the case in the first direction, and a thickness of a portion other than the second terminal portion is the first. The thickness is equal to or less than the thickness of the two terminal portions. In a preferred embodiment of the present invention, the first lead frame and the second lead frame are made of lead frames that are not bent. In preferable embodiment of this invention, the front-end | tip part of each said extension part is included in the said case by being located inside the side surface of the said case. In preferable embodiment of this invention, the said back surface of each said extension part has a plane parallel to the said surface of each said extension part. In preferable embodiment of this invention, the said opening of the said frame-shaped part is rectangular shape. In a preferred embodiment of the present invention, the case is made of a white resin. In a preferred embodiment of the present invention, the first extending portion has a width in the first direction smaller than a width in the first direction of the semiconductor light emitting element.

  Other features and advantages of the present invention will become more apparent from the detailed description given below with reference to the accompanying drawings.

It is a principal part top view which shows an example of the semiconductor light-emitting device concerning this invention. It is a bottom view which shows an example of the semiconductor light-emitting device concerning this invention. It is sectional drawing which follows the III-III line of FIG. It is sectional drawing which follows the IV-IV line of FIG. It is sectional drawing which follows the VV line of FIG. It is sectional drawing which shows an example of the conventional semiconductor light-emitting device. It is sectional drawing which follows the VII-VII line of FIG.

  Hereinafter, preferred embodiments of the present invention will be specifically described with reference to the drawings.

  1 to 5 show an example of a semiconductor light emitting device according to the present invention. The semiconductor light emitting device A according to this embodiment includes a lead frame 1, an LED chip 2, a case 3, and a translucent resin 4. The semiconductor light emitting device A has a very small long rectangular shape with a length of about 4 mm, a width of about 1 mm, and a height of about 0.6 mm. In FIG. 1, the translucent resin 4 is omitted for convenience of understanding.

  The lead frame 1 is made of, for example, Cu, Ni, or an alloy thereof and is divided into two parts. As shown in FIG. 2, the back surface of the lead frame 1 is exposed from the case 3. Among these, a relatively long portion (first lead frame) has a bonding portion 11, a plurality of thin extension portions 12, and a plurality of thick extension portions 13.

  The bonding part 11 has a band shape and is a part where the LED chip 2 is bonded to the surface. The thin extension part 12 extends from the bonding part 11. In this embodiment, the thickness of the thin extension part 12 is about half that of the bonding part 11. As shown in FIG. 4, the surface of the thin extension portion 12 is flush with the surface of the bonding portion 11. The back surface of the thin extension portion 11 is located inward of the case 3 with respect to the back surface of the bonding portion 11 and is covered with the case 3. As shown in FIG. 5, the thick extension portion 13 extends from the bonding portion 11, and the thickness thereof is the same as that of the bonding portion 11. The surface of the thick extension portion 13 is flush with the surface of the bonding portion 11, and the back surface of the thick extension portion 13 is exposed from the case 3. In the present embodiment, the plurality of thin extension portions 12 and the plurality of thick extension portions 13 are alternately arranged in the longitudinal direction of the frame 1.

  The LED chip 2 is a light source of the semiconductor light emitting device A and is a semiconductor light emitting element that emits light of a predetermined wavelength. The LED chip 2 is made of a semiconductor material such as GaN, for example, and recombines electrons and holes in an active layer sandwiched between an n-type semiconductor layer and a p-type semiconductor layer, thereby causing blue light, green light, red light. Etc. The LED chip 2 is connected to a relatively short portion (second lead frame) of the lead frame 1 by a wire 5.

  The case 3 is made of white resin, for example, and has a long rectangular frame shape as a whole. As shown in FIGS. 3 to 5, the inner surface of the case 3 is a tapered reflector 3 a. The reflector 3a is for reflecting upward the light emitted from the LED chip 2 to the side. As shown in FIG. 4, the case 3 is dressed so as to hold the thin extension portion 12. Further, as shown in FIG. 2, the case 3, the plurality of thin extension portions 12, and the plurality of thick extension portions 13 have a relationship of entering each other.

  The translucent resin 4 is made of, for example, a transparent epoxy resin, and is filled in a space surrounded by the case 3. The translucent resin 4 covers the LED chip 2 and transmits light from the LED chip 2 while protecting the LED chip 2.

  Next, the operation of the semiconductor light emitting device A will be described.

  According to the present embodiment, the case 3 is configured to hold the thin extension portion 12. Thereby, the holding force of the lead frame 1 by the case 3 can be increased. Thereby, it is possible to prevent the lead frame 1 from coming out of the case 3. As a result, as shown in FIG. 2, the semiconductor light emitting device A can increase the area of the lead frame 1 exposed from the case 3 in spite of the very narrow width of about 1 mm. . Therefore, heat from the LED chip 2 can be appropriately released, and the semiconductor light emitting device A can be reduced in size and brightness.

  By alternately arranging the thin extension portions 12 and the thick extension portions 13, the thin extension portions 12 are held in the case 3, and only the thick extension portions 13 exposed from the case 3 lead. It is possible to enlarge the exposed area of the frame 1. This is suitable for reducing the size and the brightness of the semiconductor light emitting device A.

  The semiconductor light emitting device according to the present invention is not limited to the above-described embodiment. The specific configuration of each part of the semiconductor light emitting device according to the present invention can be varied in design in various ways.

A Semiconductor light emitting device 1 Lead frame 2 LED chip (semiconductor light emitting element)
3 Case 4 Translucent resin 5 Wire 11 Bonding part 12 Thin extension part 13 Thick extension part

Claims (22)

  1. A first lead frame;
    A second lead frame spaced from the first lead frame in the first direction;
    A semiconductor light emitting device bonded to the die bonding portion of the first lead frame and conducting to the second lead frame;
    The semiconductor light emitting element is annularly surrounded so as to be exposed through the opening, has a frame-like portion for reflecting the light of the semiconductor light emitting element in the emission direction, and supports the first lead frame and the second lead frame. A resin case,
    With
    The first lead frame is provided integrally with the die bonding portion, and the back surface thereof is located on the emission direction side from the back surface of the die bonding portion, and from the die bonding portion to the first direction in a plan view. Extending to a region overlapping with the frame-shaped portion in a second direction orthogonal to each other, and having a first extending portion having a width in the first direction smaller than a width in the first direction of the die bonding portion,
    The case is configured to cover and cover the surface of the first extension part in close contact with the frame-shaped part, and to cover the back surface of the first extension part in close contact with the back surface of the die bonding part. While having a holding part ,
    The first lead frame includes a first terminal portion, and a thickness of a portion other than the first terminal portion is equal to or less than a thickness of the first terminal portion .
  2. A first lead frame;
    A second lead frame spaced from the first lead frame in the first direction;
    A semiconductor light emitting device bonded to the die bonding portion of the first lead frame and conducting to the second lead frame;
    The semiconductor light emitting element is annularly surrounded so as to be exposed through the opening, has a frame-like portion for reflecting the light of the semiconductor light emitting element in the emission direction, and supports the first lead frame and the second lead frame. A resin case,
    With
    The first lead frame is provided integrally with the die bonding portion, and the back surface thereof is located on the emission direction side from the back surface of the die bonding portion, and from the die bonding portion to the first direction in a plan view. Extending to a region overlapping with the frame-shaped portion in a second direction orthogonal to each other, and having a first extending portion having a width in the first direction smaller than a width in the first direction of the die bonding portion,
    The case is configured to cover and cover the surface of the first extension part in close contact with the frame-shaped part, and to cover the back surface of the first extension part in close contact with the back surface of the die bonding part. While having a holding part ,
    The second lead frame includes a second terminal portion, and a thickness of a portion other than the second terminal portion is equal to or less than a thickness of the second terminal portion .
  3. 3. The semiconductor light emitting device according to claim 1, wherein the first extending portion is provided so as to extend in a second direction at least in a central region in the first direction of the die bonding portion.
  4. The first extending portion, at an end region of the second lead frame side in the first direction of at least the die bonding portion is provided so as to extend in the second direction, one of the claims 1 to 3 the semiconductor light emitting device according to any.
  5. The first extending portion is provided so as to extend in the second direction in at least the die bonding portion of the end region opposite to the second lead frame in the first direction, claims 1 4 A semiconductor light-emitting device according to any one of the above.
  6. The first extending portion is provided in plurality, the semiconductor light-emitting device according to any one of claims 1 to 5.
  7. The first extending portion, the said surface is formed on the die bonding portion flush, the semiconductor light-emitting device according to any one of claims 1 to 6.
  8. The back surface of the die bonding portion is a back flush of the case, the semiconductor light-emitting device according to any one of claims 1 to 7.
  9. The second lead frame is provided integrally with the main body part, the main surface part of which the front surface is exposed from the opening of the case and the back surface is exposed from the case, and the back surface is formed from the back surface of the main body part. It is located on the emission direction side, and has a second extension portion that extends from the main body portion to the region overlapping the frame-like portion in the second direction in plan view,
    The case is configured to closely cover the surface of the second extending portion with the frame-shaped portion and to cover the back surface of the second extending portion while exposing the back surface of the main body portion. The semiconductor light-emitting device according to claim 1, which has two holding portions.
  10. The second lead frame is provided integrally with the main body, and a back surface thereof is located on the emission direction side from the back surface of the main body, and extends from the main body in the first direction in plan view. A third extending portion is provided,
    The semiconductor light-emitting device according to claim 9, wherein the case has a third holding portion that covers the back surface of the third extending portion in close contact.
  11.   The semiconductor light emitting device according to claim 10, wherein the second extending portion and the third extending portion are continuous so as to surround the main body portion.
  12.   The semiconductor light emitting device according to claim 11, wherein surfaces of the second extending portion and the third extending portion are flush with a surface of the main body portion.
  13.   The semiconductor light emitting device according to claim 9, wherein the back surface of the main body is flush with the back surface of the case.
  14. The first lead frame and the second lead frame consists of a lead frame which has not been bent, the semiconductor light-emitting device according to any one of claims 1 to 13.
  15. The distal end of the respective extending portions are included in the case by located inside the side surface of the case, the semiconductor light-emitting device according to any one of claims 1 to 14.
  16. Above said backside of each of the extension portions has the above a plane parallel to the surface of the respective extending portions, the semiconductor light-emitting device according to any one of claims 1 to 15.
  17. The opening of the frame-shaped portion has a rectangular shape, the semiconductor light-emitting device according to any one of claims 1 to 16.
  18. The case is made of white resin, the semiconductor light-emitting device according to any one of claims 1 to 17.
  19. The first extending portion having the first direction of the smaller the first width than the width of the semiconductor light-emitting element, a semiconductor light emitting device according to any one of claims 1 to 18.
  20. The first extending portion, in the second direction on both sides of the die bonding portion is formed by at least one of each, the semiconductor light-emitting device according to any one of claims 1 to 19.
  21. The first extending portion, in the second direction one side of the die bonding portion, including those formed with a plurality, the semiconductor light-emitting device according to claim 20.
  22. The semiconductor light emitting device according to claim 20 or 21 , wherein the plurality of first extending portions have the same length extending in the second direction .
JP2014234280A 2014-11-19 2014-11-19 Semiconductor light emitting device Active JP5878226B2 (en)

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JP2014234280A JP5878226B2 (en) 2014-11-19 2014-11-19 Semiconductor light emitting device

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JP2014234280A JP5878226B2 (en) 2014-11-19 2014-11-19 Semiconductor light emitting device

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016042605A (en) * 2015-12-24 2016-03-31 ローム株式会社 Semiconductor light-emitting device

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10131698A1 (en) * 2001-06-29 2003-01-30 Osram Opto Semiconductors Gmbh Surface mount radiation-emitting component and process for its preparation
JP3910171B2 (en) * 2003-02-18 2007-04-25 シャープ株式会社 Semiconductor light emitting device, method for manufacturing the same, and electronic imaging device
JP4359195B2 (en) * 2004-06-11 2009-11-04 株式会社東芝 Semiconductor light emitting device, manufacturing method thereof, and semiconductor light emitting unit
JP5352938B2 (en) * 2005-08-25 2013-11-27 東芝ライテック株式会社 Light emitting diode device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016042605A (en) * 2015-12-24 2016-03-31 ローム株式会社 Semiconductor light-emitting device

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