JP7003794B2 - ポリイミド、接着剤、フィルム状接着材、接着層、接着シート、樹脂付銅箔、銅張積層板、プリント配線板、並びに多層配線板及びその製造方法 - Google Patents
ポリイミド、接着剤、フィルム状接着材、接着層、接着シート、樹脂付銅箔、銅張積層板、プリント配線板、並びに多層配線板及びその製造方法 Download PDFInfo
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- JP7003794B2 JP7003794B2 JP2018063283A JP2018063283A JP7003794B2 JP 7003794 B2 JP7003794 B2 JP 7003794B2 JP 2018063283 A JP2018063283 A JP 2018063283A JP 2018063283 A JP2018063283 A JP 2018063283A JP 7003794 B2 JP7003794 B2 JP 7003794B2
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1075—Partially aromatic polyimides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
- C08G73/106—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing silicon
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
- C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/28—Metal sheet
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2311/00—Metals, their alloys or their compounds
- B32B2311/12—Copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/10—Presence of inorganic materials
- C09J2400/16—Metal
- C09J2400/163—Metal in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2479/00—Presence of polyamine or polyimide
- C09J2479/08—Presence of polyamine or polyimide polyimide
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Manufacturing & Machinery (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
- Laminated Bodies (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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JP2021197677A JP7044200B2 (ja) | 2017-03-29 | 2021-12-06 | ポリイミド、接着剤、フィルム状接着材、接着層、接着シート、樹脂付銅箔、銅張積層板、プリント配線板、並びに多層配線板及びその製造方法 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017066034 | 2017-03-29 | ||
JP2017066034 | 2017-03-29 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2021197677A Division JP7044200B2 (ja) | 2017-03-29 | 2021-12-06 | ポリイミド、接着剤、フィルム状接着材、接着層、接着シート、樹脂付銅箔、銅張積層板、プリント配線板、並びに多層配線板及びその製造方法 |
Publications (2)
Publication Number | Publication Date |
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JP2018168370A JP2018168370A (ja) | 2018-11-01 |
JP7003794B2 true JP7003794B2 (ja) | 2022-01-21 |
Family
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Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
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JP2018063283A Active JP7003794B2 (ja) | 2017-03-29 | 2018-03-28 | ポリイミド、接着剤、フィルム状接着材、接着層、接着シート、樹脂付銅箔、銅張積層板、プリント配線板、並びに多層配線板及びその製造方法 |
JP2021197677A Active JP7044200B2 (ja) | 2017-03-29 | 2021-12-06 | ポリイミド、接着剤、フィルム状接着材、接着層、接着シート、樹脂付銅箔、銅張積層板、プリント配線板、並びに多層配線板及びその製造方法 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
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JP2021197677A Active JP7044200B2 (ja) | 2017-03-29 | 2021-12-06 | ポリイミド、接着剤、フィルム状接着材、接着層、接着シート、樹脂付銅箔、銅張積層板、プリント配線板、並びに多層配線板及びその製造方法 |
Country Status (4)
Country | Link |
---|---|
JP (2) | JP7003794B2 (zh) |
KR (2) | KR102388938B1 (zh) |
CN (1) | CN108690193B (zh) |
TW (2) | TWI743345B (zh) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI695865B (zh) * | 2019-05-31 | 2020-06-11 | 達邁科技股份有限公司 | 底漆組成物、金屬積層板及其製法 |
CN112048240B (zh) * | 2019-06-06 | 2022-03-01 | 达迈科技股份有限公司 | 底漆组成物、金属积层板及其制法 |
JP7259575B2 (ja) * | 2019-06-17 | 2023-04-18 | 荒川化学工業株式会社 | ポリイミド、接着剤、フィルム状接着剤、接着層、接着シート、樹脂付銅箔、銅張積層板、プリント配線板、並びに多層配線板及びその製造方法 |
CN114207033B (zh) | 2019-08-01 | 2024-04-02 | 株式会社钟化 | 热固性树脂组合物、热固性树脂膜、热固化膜、层叠体、以及印刷电路板及其制造方法 |
TWI730757B (zh) * | 2020-05-11 | 2021-06-11 | 晉一化工股份有限公司 | 熱固性聚醯亞胺樹脂及其製造方法、組成物、預聚物、薄膜、黏著劑、及其用途 |
JP6881664B1 (ja) * | 2020-10-15 | 2021-06-02 | 荒川化学工業株式会社 | ポリイミド樹脂組成物、接着剤組成物、フィルム状接着材、接着シート、樹脂付銅箔、銅張積層板、プリント配線板及びポリイミドフィルム |
JP2022078861A (ja) | 2020-11-13 | 2022-05-25 | 信越化学工業株式会社 | ポリウレタン、ポリウレタンの製造方法、導電性ペースト組成物、導電配線および導電配線の製造方法 |
TWI748898B (zh) | 2021-03-15 | 2021-12-01 | 晉一化工股份有限公司 | 熱固性樹脂組成物、難燃樹脂組成物、液態封裝材及其用途、薄膜及其用途 |
JPWO2022202769A1 (zh) * | 2021-03-23 | 2022-09-29 | ||
CN113563584A (zh) * | 2021-07-07 | 2021-10-29 | 北京科技大学 | 低介电共聚聚酰亚胺薄膜及其制备方法 |
JP7150962B1 (ja) | 2021-10-15 | 2022-10-11 | 信越化学工業株式会社 | ポリウレタン、ポリウレタンの製造方法、導電性ペースト組成物、導電配線および導電配線の製造方法 |
TW202346527A (zh) * | 2022-03-03 | 2023-12-01 | 日商東洋紡Mc股份有限公司 | 黏接劑組成物、以及含有其之黏接片、疊層體及印刷配線板 |
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JP2001316621A (ja) | 2000-05-11 | 2001-11-16 | Jsr Corp | 膜形成用組成物および絶縁膜形成用材料 |
JP2013032501A (ja) | 2011-07-01 | 2013-02-14 | Jnc Corp | 熱硬化性インク組成物およびその用途 |
JP2013199645A (ja) | 2012-02-24 | 2013-10-03 | Arakawa Chem Ind Co Ltd | ポリイミド系接着剤組成物、硬化物、接着シート、積層体、フレキシブルプリント基板 |
JP2014051673A (ja) | 2013-11-01 | 2014-03-20 | Nippon Steel & Sumikin Chemical Co Ltd | ポリイミド樹脂組成物 |
WO2014208644A1 (ja) | 2013-06-28 | 2014-12-31 | 新日鉄住金化学株式会社 | ポリイミド、樹脂フィルム及び金属張積層体 |
JP2016189392A (ja) | 2015-03-30 | 2016-11-04 | 新日鉄住金化学株式会社 | カバーレイフィルム |
JP2016191049A (ja) | 2015-03-30 | 2016-11-10 | 荒川化学工業株式会社 | ポリイミド系接着剤、フィルム状接着材、接着層、接着シート、銅張積層板及びプリント配線板、並びに多層配線板及びその製造方法 |
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TWI493007B (zh) * | 2012-02-24 | 2015-07-21 | Arakawa Chem Ind | A polyimide-based adhesive composition, a hardened product, an adhesive sheet, a laminate, and a flexible printed substrate |
JP6262691B2 (ja) * | 2015-07-08 | 2018-01-17 | 新日鉄住金化学株式会社 | 溶剤可溶性ポリイミド樹脂 |
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2018
- 2018-03-28 JP JP2018063283A patent/JP7003794B2/ja active Active
- 2018-03-29 CN CN201810272940.4A patent/CN108690193B/zh active Active
- 2018-03-29 KR KR1020180036266A patent/KR102388938B1/ko active IP Right Grant
- 2018-03-29 TW TW107110960A patent/TWI743345B/zh active
- 2018-03-29 TW TW110144133A patent/TWI780992B/zh active
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2021
- 2021-12-06 JP JP2021197677A patent/JP7044200B2/ja active Active
-
2022
- 2022-04-13 KR KR1020220045437A patent/KR102485693B1/ko active IP Right Grant
Patent Citations (7)
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JP2001316621A (ja) | 2000-05-11 | 2001-11-16 | Jsr Corp | 膜形成用組成物および絶縁膜形成用材料 |
JP2013032501A (ja) | 2011-07-01 | 2013-02-14 | Jnc Corp | 熱硬化性インク組成物およびその用途 |
JP2013199645A (ja) | 2012-02-24 | 2013-10-03 | Arakawa Chem Ind Co Ltd | ポリイミド系接着剤組成物、硬化物、接着シート、積層体、フレキシブルプリント基板 |
WO2014208644A1 (ja) | 2013-06-28 | 2014-12-31 | 新日鉄住金化学株式会社 | ポリイミド、樹脂フィルム及び金属張積層体 |
JP2014051673A (ja) | 2013-11-01 | 2014-03-20 | Nippon Steel & Sumikin Chemical Co Ltd | ポリイミド樹脂組成物 |
JP2016189392A (ja) | 2015-03-30 | 2016-11-04 | 新日鉄住金化学株式会社 | カバーレイフィルム |
JP2016191049A (ja) | 2015-03-30 | 2016-11-10 | 荒川化学工業株式会社 | ポリイミド系接着剤、フィルム状接着材、接着層、接着シート、銅張積層板及びプリント配線板、並びに多層配線板及びその製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JP7044200B2 (ja) | 2022-03-30 |
KR102485693B1 (ko) | 2023-01-06 |
TWI780992B (zh) | 2022-10-11 |
TW201840650A (zh) | 2018-11-16 |
KR20180110632A (ko) | 2018-10-10 |
KR20220050860A (ko) | 2022-04-25 |
JP2022033144A (ja) | 2022-02-28 |
CN108690193B (zh) | 2022-09-09 |
TWI743345B (zh) | 2021-10-21 |
KR102388938B1 (ko) | 2022-04-20 |
CN108690193A (zh) | 2018-10-23 |
TW202219124A (zh) | 2022-05-16 |
JP2018168370A (ja) | 2018-11-01 |
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