JP7002410B2 - 部品冷却装置 - Google Patents

部品冷却装置 Download PDF

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Publication number
JP7002410B2
JP7002410B2 JP2018112301A JP2018112301A JP7002410B2 JP 7002410 B2 JP7002410 B2 JP 7002410B2 JP 2018112301 A JP2018112301 A JP 2018112301A JP 2018112301 A JP2018112301 A JP 2018112301A JP 7002410 B2 JP7002410 B2 JP 7002410B2
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JP
Japan
Prior art keywords
flow path
electronic component
refrigerant
region
fin
Prior art date
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Active
Application number
JP2018112301A
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English (en)
Japanese (ja)
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JP2019216177A (ja
JP2019216177A5 (https=
Inventor
暁琳 郭
浩嗣 朝柄
和哉 竹内
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
Denso Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2018112301A priority Critical patent/JP7002410B2/ja
Application filed by Denso Corp filed Critical Denso Corp
Priority to CN201980023129.5A priority patent/CN111919293B/zh
Priority to PCT/JP2019/007734 priority patent/WO2019198368A1/ja
Priority to CN202410241500.8A priority patent/CN118111257A/zh
Priority to CN202410241577.5A priority patent/CN118129501A/zh
Priority to DE112019001845.0T priority patent/DE112019001845B4/de
Publication of JP2019216177A publication Critical patent/JP2019216177A/ja
Publication of JP2019216177A5 publication Critical patent/JP2019216177A5/ja
Priority to US17/066,589 priority patent/US12074089B2/en
Application granted granted Critical
Publication of JP7002410B2 publication Critical patent/JP7002410B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2018112301A 2018-04-09 2018-06-12 部品冷却装置 Active JP7002410B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2018112301A JP7002410B2 (ja) 2018-06-12 2018-06-12 部品冷却装置
PCT/JP2019/007734 WO2019198368A1 (ja) 2018-04-09 2019-02-28 熱交換器
CN202410241500.8A CN118111257A (zh) 2018-04-09 2019-02-28 热交换器
CN202410241577.5A CN118129501A (zh) 2018-04-09 2019-02-28 热交换器
CN201980023129.5A CN111919293B (zh) 2018-04-09 2019-02-28 热交换器
DE112019001845.0T DE112019001845B4 (de) 2018-04-09 2019-02-28 Wärmetauscher
US17/066,589 US12074089B2 (en) 2018-04-09 2020-10-09 Heat exchanger

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018112301A JP7002410B2 (ja) 2018-06-12 2018-06-12 部品冷却装置

Publications (3)

Publication Number Publication Date
JP2019216177A JP2019216177A (ja) 2019-12-19
JP2019216177A5 JP2019216177A5 (https=) 2020-07-27
JP7002410B2 true JP7002410B2 (ja) 2022-02-04

Family

ID=68918890

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018112301A Active JP7002410B2 (ja) 2018-04-09 2018-06-12 部品冷却装置

Country Status (1)

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JP (1) JP7002410B2 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024164337A (ja) * 2021-10-14 2024-11-27 ニデック株式会社 放熱部材
US12543567B2 (en) * 2021-11-12 2026-02-03 Intel Corporation Tunable stack-up DIMM form factor cold plate with embedded peltier devices for enhanced cooling capability

Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002163041A (ja) 2000-11-28 2002-06-07 Toshiba Corp 携帯型情報機器
JP2005079337A (ja) 2003-08-29 2005-03-24 Toshiba Corp 液冷装置及び液冷システム
JP2007005673A (ja) 2005-06-27 2007-01-11 Toyota Industries Corp パワーモジュール用ヒートシンク
JP2009182313A (ja) 2008-02-01 2009-08-13 Denso Corp 部品冷却構造
JP2009266937A (ja) 2008-04-23 2009-11-12 Denso Corp 積層型冷却器
JP2009266936A (ja) 2008-04-23 2009-11-12 Denso Corp 積層型冷却器
JP2010040757A (ja) 2008-08-05 2010-02-18 Denso Corp 電子部品冷却器
JP2012186344A (ja) 2011-03-07 2012-09-27 Denso Corp 熱交換器
JP2015023044A (ja) 2013-07-16 2015-02-02 株式会社Uacj 冷却器
WO2016067501A1 (ja) 2014-10-28 2016-05-06 株式会社デンソー 熱交換器
JP2016205802A (ja) 2015-04-17 2016-12-08 株式会社デンソー 熱交換器
WO2017094366A1 (ja) 2015-12-04 2017-06-08 三桜工業株式会社 熱交換器用フィン
JP2017143171A (ja) 2016-02-10 2017-08-17 オムロンオートモーティブエレクトロニクス株式会社 冷却器、流路ユニット
JP2018032816A (ja) 2016-08-26 2018-03-01 株式会社デンソー 熱交換器
US20180077818A1 (en) 2016-09-13 2018-03-15 Denso International America, Inc. Cooler and power electronic module having the same

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5031693A (en) * 1990-10-31 1991-07-16 Sundstrand Corporation Jet impingement plate fin heat exchanger

Patent Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002163041A (ja) 2000-11-28 2002-06-07 Toshiba Corp 携帯型情報機器
JP2005079337A (ja) 2003-08-29 2005-03-24 Toshiba Corp 液冷装置及び液冷システム
JP2007005673A (ja) 2005-06-27 2007-01-11 Toyota Industries Corp パワーモジュール用ヒートシンク
JP2009182313A (ja) 2008-02-01 2009-08-13 Denso Corp 部品冷却構造
JP2009266937A (ja) 2008-04-23 2009-11-12 Denso Corp 積層型冷却器
JP2009266936A (ja) 2008-04-23 2009-11-12 Denso Corp 積層型冷却器
JP2010040757A (ja) 2008-08-05 2010-02-18 Denso Corp 電子部品冷却器
JP2012186344A (ja) 2011-03-07 2012-09-27 Denso Corp 熱交換器
JP2015023044A (ja) 2013-07-16 2015-02-02 株式会社Uacj 冷却器
WO2016067501A1 (ja) 2014-10-28 2016-05-06 株式会社デンソー 熱交換器
JP2016205802A (ja) 2015-04-17 2016-12-08 株式会社デンソー 熱交換器
WO2017094366A1 (ja) 2015-12-04 2017-06-08 三桜工業株式会社 熱交換器用フィン
JP2017143171A (ja) 2016-02-10 2017-08-17 オムロンオートモーティブエレクトロニクス株式会社 冷却器、流路ユニット
JP2018032816A (ja) 2016-08-26 2018-03-01 株式会社デンソー 熱交換器
US20180077818A1 (en) 2016-09-13 2018-03-15 Denso International America, Inc. Cooler and power electronic module having the same

Also Published As

Publication number Publication date
JP2019216177A (ja) 2019-12-19

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