JP2019216177A5 - - Google Patents
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- Publication number
- JP2019216177A5 JP2019216177A5 JP2018112301A JP2018112301A JP2019216177A5 JP 2019216177 A5 JP2019216177 A5 JP 2019216177A5 JP 2018112301 A JP2018112301 A JP 2018112301A JP 2018112301 A JP2018112301 A JP 2018112301A JP 2019216177 A5 JP2019216177 A5 JP 2019216177A5
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- component
- cooling device
- downstream
- upstream
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001816 cooling Methods 0.000 claims description 30
- 238000011144 upstream manufacturing Methods 0.000 claims description 23
- 239000003507 refrigerant Substances 0.000 claims description 16
- 238000000638 solvent extraction Methods 0.000 claims description 3
- 239000002826 coolant Substances 0.000 claims 5
- 238000009792 diffusion process Methods 0.000 claims 4
- 239000012530 fluid Substances 0.000 claims 4
Priority Applications (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018112301A JP7002410B2 (ja) | 2018-06-12 | 2018-06-12 | 部品冷却装置 |
| PCT/JP2019/007734 WO2019198368A1 (ja) | 2018-04-09 | 2019-02-28 | 熱交換器 |
| CN202410241500.8A CN118111257A (zh) | 2018-04-09 | 2019-02-28 | 热交换器 |
| CN202410241577.5A CN118129501A (zh) | 2018-04-09 | 2019-02-28 | 热交换器 |
| CN201980023129.5A CN111919293B (zh) | 2018-04-09 | 2019-02-28 | 热交换器 |
| DE112019001845.0T DE112019001845B4 (de) | 2018-04-09 | 2019-02-28 | Wärmetauscher |
| US17/066,589 US12074089B2 (en) | 2018-04-09 | 2020-10-09 | Heat exchanger |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018112301A JP7002410B2 (ja) | 2018-06-12 | 2018-06-12 | 部品冷却装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2019216177A JP2019216177A (ja) | 2019-12-19 |
| JP2019216177A5 true JP2019216177A5 (https=) | 2020-07-27 |
| JP7002410B2 JP7002410B2 (ja) | 2022-02-04 |
Family
ID=68918890
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018112301A Active JP7002410B2 (ja) | 2018-04-09 | 2018-06-12 | 部品冷却装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP7002410B2 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2024164337A (ja) * | 2021-10-14 | 2024-11-27 | ニデック株式会社 | 放熱部材 |
| US12543567B2 (en) * | 2021-11-12 | 2026-02-03 | Intel Corporation | Tunable stack-up DIMM form factor cold plate with embedded peltier devices for enhanced cooling capability |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5031693A (en) * | 1990-10-31 | 1991-07-16 | Sundstrand Corporation | Jet impingement plate fin heat exchanger |
| JP2002163041A (ja) * | 2000-11-28 | 2002-06-07 | Toshiba Corp | 携帯型情報機器 |
| JP3908705B2 (ja) * | 2003-08-29 | 2007-04-25 | 株式会社東芝 | 液冷装置及び液冷システム |
| JP4881583B2 (ja) * | 2005-06-27 | 2012-02-22 | 株式会社豊田自動織機 | パワーモジュール用ヒートシンク |
| JP5145981B2 (ja) * | 2008-02-01 | 2013-02-20 | 株式会社デンソー | 部品冷却構造 |
| JP2009266937A (ja) * | 2008-04-23 | 2009-11-12 | Denso Corp | 積層型冷却器 |
| JP4941398B2 (ja) * | 2008-04-23 | 2012-05-30 | 株式会社デンソー | 積層型冷却器 |
| JP2010040757A (ja) * | 2008-08-05 | 2010-02-18 | Denso Corp | 電子部品冷却器 |
| JP2012186344A (ja) * | 2011-03-07 | 2012-09-27 | Denso Corp | 熱交換器 |
| JP2015023044A (ja) * | 2013-07-16 | 2015-02-02 | 株式会社Uacj | 冷却器 |
| JP6256295B2 (ja) * | 2014-10-28 | 2018-01-10 | 株式会社デンソー | 熱交換器 |
| JP6327271B2 (ja) * | 2015-04-17 | 2018-05-23 | 株式会社デンソー | 熱交換器 |
| JP2017101904A (ja) * | 2015-12-04 | 2017-06-08 | 三桜工業株式会社 | 熱交換器用フィン |
| JP6593214B2 (ja) * | 2016-02-10 | 2019-10-23 | オムロン株式会社 | 冷却器、流路ユニット |
| JP6614068B2 (ja) * | 2016-08-26 | 2019-12-04 | 株式会社デンソー | 熱交換器 |
| US9955613B2 (en) * | 2016-09-13 | 2018-04-24 | Denso International America, Inc. | Cooler and power electronic module having the same |
-
2018
- 2018-06-12 JP JP2018112301A patent/JP7002410B2/ja active Active
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