JP7002014B2 - 静電チャック - Google Patents

静電チャック Download PDF

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Publication number
JP7002014B2
JP7002014B2 JP2019166033A JP2019166033A JP7002014B2 JP 7002014 B2 JP7002014 B2 JP 7002014B2 JP 2019166033 A JP2019166033 A JP 2019166033A JP 2019166033 A JP2019166033 A JP 2019166033A JP 7002014 B2 JP7002014 B2 JP 7002014B2
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JP
Japan
Prior art keywords
porous
porous portion
dielectric substrate
ceramic dielectric
main surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2019166033A
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English (en)
Japanese (ja)
Other versions
JP2020072261A (ja
Inventor
純 白石
修一郎 西願
達哉 森
仁弘 渡邉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toto Ltd
Original Assignee
Toto Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toto Ltd filed Critical Toto Ltd
Priority to US16/576,220 priority Critical patent/US11309204B2/en
Priority to KR1020190117683A priority patent/KR102750908B1/ko
Priority to TW110145168A priority patent/TWI806270B/zh
Priority to TW108136824A priority patent/TWI751444B/zh
Priority to CN202410835027.6A priority patent/CN118737928A/zh
Priority to CN201910976863.5A priority patent/CN111128837B/zh
Publication of JP2020072261A publication Critical patent/JP2020072261A/ja
Priority to JP2021200298A priority patent/JP7424362B2/ja
Application granted granted Critical
Publication of JP7002014B2 publication Critical patent/JP7002014B2/ja
Priority to US17/690,337 priority patent/US12014947B2/en
Priority to KR1020240199674A priority patent/KR102819118B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physical Vapour Deposition (AREA)
  • Chemical Vapour Deposition (AREA)
  • Mechanical Engineering (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
JP2019166033A 2018-10-30 2019-09-12 静電チャック Active JP7002014B2 (ja)

Priority Applications (9)

Application Number Priority Date Filing Date Title
US16/576,220 US11309204B2 (en) 2018-10-30 2019-09-19 Electrostatic chuck
KR1020190117683A KR102750908B1 (ko) 2018-10-30 2019-09-24 정전척
TW108136824A TWI751444B (zh) 2018-10-30 2019-10-14 靜電吸盤
TW110145168A TWI806270B (zh) 2018-10-30 2019-10-14 靜電吸盤
CN202410835027.6A CN118737928A (zh) 2018-10-30 2019-10-15 静电吸盘
CN201910976863.5A CN111128837B (zh) 2018-10-30 2019-10-15 静电吸盘
JP2021200298A JP7424362B2 (ja) 2018-10-30 2021-12-09 静電チャック
US17/690,337 US12014947B2 (en) 2018-10-30 2022-03-09 Electrostatic chuck
KR1020240199674A KR102819118B1 (ko) 2018-10-30 2024-12-30 정전척

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018203749 2018-10-30
JP2018203749 2018-10-30

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2021200298A Division JP7424362B2 (ja) 2018-10-30 2021-12-09 静電チャック

Publications (2)

Publication Number Publication Date
JP2020072261A JP2020072261A (ja) 2020-05-07
JP7002014B2 true JP7002014B2 (ja) 2022-01-20

Family

ID=70549670

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2019166033A Active JP7002014B2 (ja) 2018-10-30 2019-09-12 静電チャック
JP2021200298A Active JP7424362B2 (ja) 2018-10-30 2021-12-09 静電チャック

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2021200298A Active JP7424362B2 (ja) 2018-10-30 2021-12-09 静電チャック

Country Status (5)

Country Link
US (2) US11309204B2 (enExample)
JP (2) JP7002014B2 (enExample)
KR (2) KR102750908B1 (enExample)
CN (1) CN118737928A (enExample)
TW (2) TWI751444B (enExample)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111668150B (zh) * 2019-03-05 2024-06-28 Toto株式会社 静电吸盘及处理装置
JP7433857B2 (ja) * 2019-11-25 2024-02-20 京セラ株式会社 試料保持具
JP7515583B2 (ja) * 2020-05-28 2024-07-12 京セラ株式会社 通気性プラグ、基板支持アセンブリおよびシャワープレート
JP7330139B2 (ja) * 2020-06-18 2023-08-21 日立造船株式会社 加圧用吸着台およびこれを具備する加圧装置
JP7382978B2 (ja) * 2021-02-04 2023-11-17 日本碍子株式会社 半導体製造装置用部材及びプラグ
JP7558886B2 (ja) * 2021-05-17 2024-10-01 日本特殊陶業株式会社 保持装置
CN115732387A (zh) 2021-08-31 2023-03-03 Toto株式会社 静电吸盘以及处理装置
US12341048B2 (en) * 2021-11-29 2025-06-24 Applied Materials, Inc. Porous plug for electrostatic chuck gas delivery
JP7620578B2 (ja) * 2022-01-07 2025-01-23 日本碍子株式会社 半導体製造装置用部材
JP7791723B2 (ja) * 2022-01-20 2025-12-24 新光電気工業株式会社 基板固定装置
JP7569343B2 (ja) * 2022-01-21 2024-10-17 日本碍子株式会社 半導体製造装置用部材
JP7569342B2 (ja) * 2022-01-21 2024-10-17 日本碍子株式会社 半導体製造装置用部材
US11794296B2 (en) * 2022-02-03 2023-10-24 Applied Materials, Inc. Electrostatic chuck with porous plug
CN115632029B (zh) * 2022-12-22 2023-03-17 河北博特半导体设备科技有限公司 一种高精度晶圆承片台的陶瓷旋转台结构
JP7551828B1 (ja) 2023-04-21 2024-09-17 日本特殊陶業株式会社 保持装置

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008117850A (ja) 2006-11-01 2008-05-22 Hitachi High-Technologies Corp ウエハ載置用電極
JP2009158917A (ja) 2007-09-28 2009-07-16 Intevac Inc 静電チャック装置
JP2014209615A (ja) 2013-03-29 2014-11-06 Toto株式会社 静電チャック
JP2016012733A (ja) 2014-03-27 2016-01-21 Toto株式会社 静電チャック
JP2018101773A (ja) 2016-12-16 2018-06-28 日本特殊陶業株式会社 保持装置
JP6489277B1 (ja) 2018-03-14 2019-03-27 Toto株式会社 静電チャック
JP2019519927A (ja) 2016-06-07 2019-07-11 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ ガス孔に開口縮小プラグを有する大電力静電チャック

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW561515B (en) * 2001-11-30 2003-11-11 Tokyo Electron Ltd Processing device, and gas discharge suppressing member
KR100505035B1 (ko) * 2003-11-17 2005-07-29 삼성전자주식회사 기판을 지지하기 위한 정전척
JP4390629B2 (ja) 2004-06-01 2009-12-24 Ｎｅｃエレクトロニクス株式会社 静電吸着装置およびプラズマ処理装置
JP4557814B2 (ja) 2005-06-09 2010-10-06 パナソニック株式会社 プラズマ処理装置
JP5331519B2 (ja) * 2008-03-11 2013-10-30 日本碍子株式会社 静電チャック
US8336891B2 (en) * 2008-03-11 2012-12-25 Ngk Insulators, Ltd. Electrostatic chuck
JP5449750B2 (ja) 2008-11-19 2014-03-19 株式会社日本セラテック 静電チャックおよびその製造方法
JP5198226B2 (ja) * 2008-11-20 2013-05-15 東京エレクトロン株式会社 基板載置台および基板処理装置
JP6005579B2 (ja) * 2012-04-27 2016-10-12 日本碍子株式会社 半導体製造装置用部材
US9805963B2 (en) * 2015-10-05 2017-10-31 Lam Research Corporation Electrostatic chuck with thermal choke
JP6634315B2 (ja) 2016-03-03 2020-01-22 日本特殊陶業株式会社 保持装置および保持装置の製造方法
JP6722518B2 (ja) * 2016-06-09 2020-07-15 新光電気工業株式会社 焼結体及びその製造方法と静電チャック

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008117850A (ja) 2006-11-01 2008-05-22 Hitachi High-Technologies Corp ウエハ載置用電極
JP2009158917A (ja) 2007-09-28 2009-07-16 Intevac Inc 静電チャック装置
JP2014209615A (ja) 2013-03-29 2014-11-06 Toto株式会社 静電チャック
JP2016012733A (ja) 2014-03-27 2016-01-21 Toto株式会社 静電チャック
JP2019519927A (ja) 2016-06-07 2019-07-11 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ ガス孔に開口縮小プラグを有する大電力静電チャック
JP2018101773A (ja) 2016-12-16 2018-06-28 日本特殊陶業株式会社 保持装置
JP6489277B1 (ja) 2018-03-14 2019-03-27 Toto株式会社 静電チャック

Also Published As

Publication number Publication date
US11309204B2 (en) 2022-04-19
KR102750908B1 (ko) 2025-01-09
JP2020072261A (ja) 2020-05-07
US20200135528A1 (en) 2020-04-30
KR102819118B1 (ko) 2025-06-12
KR20200049511A (ko) 2020-05-08
TW202213613A (zh) 2022-04-01
US20220199452A1 (en) 2022-06-23
TW202017095A (zh) 2020-05-01
US12014947B2 (en) 2024-06-18
TWI806270B (zh) 2023-06-21
TWI751444B (zh) 2022-01-01
KR20250007482A (ko) 2025-01-14
JP7424362B2 (ja) 2024-01-30
CN118737928A (zh) 2024-10-01
JP2022031333A (ja) 2022-02-18

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