JP6958582B2 - Ejector type refrigeration cycle device - Google Patents

Description

The present invention relates to an ejector type refrigeration cycle device.

Some conventional ejector-type refrigeration cycle devices include a flow rate adjusting unit that adjusts the flow rate of the refrigerant flowing into the suction unit of the ejector. A solenoid valve or a mechanical valve has been used as the valve mechanism of the flow rate adjusting unit (see, for example, Patent Document 1). In a solenoid valve, the valve body is driven by an electromagnetic actuator. In a mechanical valve, for example, the valve body is driven by a pressure difference between the pressure of the greenhouse and the pressure of the flowing refrigerant and a spring.

JP-A-2009-46054

As described above, a solenoid valve, a mechanical valve, or the like is used in the conventional flow rate adjusting unit. Therefore, the physique of the flow rate adjusting unit is large.

In view of the above points, the present invention is an ejector type refrigeration cycle apparatus capable of reducing the body size of the flow rate adjusting unit as compared with the case where a conventional solenoid valve or a mechanical valve is used as the valve mechanism of the flow rate adjusting unit. The purpose is to provide.

According to the invention according to claim 1 or 2 , in order to achieve the above object.
The ejector type refrigeration cycle device is
A compressor (12) that compresses and discharges the refrigerant,
A radiator (14) that dissipates the refrigerant discharged from the compressor, and
The nozzle portion (16a) for ejecting the refrigerant flowing out of the radiator, the suction portion (16b) for sucking the refrigerant by the flow of the refrigerant ejected from the nozzle portion, and the refrigerant ejected from the nozzle portion and the suction portion sucked. An ejector (16) including a booster (16c) that mixes and boosts the refrigerant, and
And a flow rate adjustment unit which includes a valve part for adjusting the flow rate of refrigerant flowing into the suction unit (X1),
Valve parts
Bases (X11, X121, X13) in which a refrigerant chamber (X19) through which a refrigerant flows, a first refrigerant hole (X16) communicating with the refrigerant chamber, and a second refrigerant hole (X17) communicating with the refrigerant chamber are formed.
Drive units (X123, X124, X125) that displace when their temperature changes,
Amplifying units (X126, X127) that amplify the displacement due to changes in the temperature of the driving unit,
By transmitting the displacement amplified by the amplification unit and moving in the refrigerant chamber, there is a movable portion (X128) that switches between communication and shutoff between the first refrigerant hole and the second refrigerant hole via the refrigerant chamber. death,
When the drive unit is displaced due to a change in temperature, the drive unit biases the amplification unit at the urging position (XP2), so that the amplification unit is displaced with the hinge (XP0) as a fulcrum, and the amplification unit and the movable unit are displaced. The amplification part urges the movable part at the connection position (XP3) of
The distance from the hinge to the connection position is longer than the distance from the hinge to the urging position.
Further, according to the invention of claim 1,
The ejector type refrigeration cycle device is
A branch portion (20) that branches the refrigerant flowing out of the radiator into one refrigerant and the other refrigerant.
The first evaporator (18) that evaporates the refrigerant and
It is equipped with a second evaporator (24) that evaporates the refrigerant.
The branch portion, the ejector, and the first evaporator are connected so that one of the refrigerants flows in the order of the nozzle portion, the boosting portion, and the first evaporator.
The branch part, the flow rate adjusting part, the second evaporator and the ejector are connected so that the other refrigerant flows in the order of the flow rate adjusting part, the second evaporator, and the suction part.
The flow rate adjusting unit (50) adjusts the flow rate of the refrigerant flowing into the second evaporator and reduces the pressure of the refrigerant flowing into the second evaporator.
The flow rate adjusting unit (50) includes a flow path forming component (51, X2) that forms a refrigerant flow path from the refrigerant inlet portion (51a) of the flow rate adjusting unit to the refrigerant outlet portion (51b) of the flow rate adjusting unit.
It has an on-off valve (50a) that opens and closes the refrigerant flow path.
The refrigerant flow path includes a fixed throttle (50b) and a bypass flow path (XV1, XV2, 55a, 55b) for guiding the refrigerant flowing in from the refrigerant inlet portion by bypassing the fixed throttle portion to the refrigerant outlet portion.
The valve component opens and closes the bypass flow path and reduces the pressure of the refrigerant flowing through the bypass flow path when the bypass flow path is open.
Further, according to the invention of claim 2,
The ejector type refrigeration cycle device is
A gas-liquid separator (60) that separates the refrigerant flowing out from the booster into a gas-phase refrigerant and a liquid-phase refrigerant, and allows the separated vapor-phase refrigerant to flow into the compressor.
An evaporator (62) that evaporates the liquid-phase refrigerant separated by the gas-liquid separator and allows the evaporated refrigerant to flow into the suction unit.
It is provided with a bypass flow path (64) that bypasses the ejector and the gas-liquid separator and guides the refrigerant flowing out of the radiator to the evaporator.
The flow rate adjusting unit (68) adjusts the flow rate of the refrigerant flowing through the bypass flow path and reduces the pressure of the refrigerant flowing through the bypass flow path.

According to the inventions of claims 1 and 2 , a valve component is used as the valve mechanism of the flow rate adjusting unit. Valve parts can be made smaller than conventional solenoid valves and mechanical valves. Since the amplification part of the valve component functions as a lever, the amount of displacement corresponding to the temperature change of the drive part is amplified by the lever and transmitted to the moving part. The fact that the displacement amount of the drive unit is amplified by using a lever contributes to miniaturization as compared with a conventional solenoid valve or a mechanical valve that does not use such a lever. Therefore, the body size of the flow rate adjusting unit can be reduced as compared with the case where a conventional solenoid valve or a mechanical valve is used as the valve mechanism of the flow rate adjusting unit.

The reference reference numerals in parentheses attached to each component or the like indicate an example of the correspondence between the component or the like and the specific component or the like described in the embodiment described later.

It is a schematic diagram which shows the structure of the refrigeration cycle apparatus of 1st Embodiment. It is sectional drawing of the valve device of 1st Embodiment. It is a figure which shows the relationship between the energized and de-energized state of the microvalve of 1st Embodiment, and a valve state. It is an exploded perspective view of the micro valve of 1st Embodiment. It is a side view of the micro valve of 1st Embodiment. FIG. 5 is a sectional view taken along line VI-VI of FIG. 5 is a cross-sectional view taken along the line VII-VII of FIGS. 5 and 6. It is sectional drawing of the micro valve at the time of energization corresponding to FIG. FIG. 8 is a cross-sectional view taken along the line IX-IX of FIG. It is sectional drawing of the valve device of the comparative example 1. FIG. It is a schematic diagram which shows the structure of the refrigeration cycle apparatus of 2nd Embodiment. It is sectional drawing of the valve device of 2nd Embodiment. It is a figure which shows the relationship between the duty ratio of the microvalve of 2nd Embodiment, and the opening degree. It is a schematic diagram which shows the structure of the refrigeration cycle apparatus of 3rd Embodiment. It is sectional drawing of the valve device of 3rd Embodiment. It is an enlarged view of the area XVI of FIG. It is a figure which shows the relationship between the total opening degree of the valve device of 3rd Embodiment, and a valve operating state. It is a schematic diagram which shows the structure of the refrigeration cycle apparatus of 4th Embodiment. It is a figure which shows the relationship between the total opening degree of the valve device of 4th Embodiment, and a valve operating state. It is a schematic diagram which shows the structure of the refrigeration cycle apparatus of 5th Embodiment. It is sectional drawing of the valve device of 5th Embodiment. It is sectional drawing of the micro valve of 6th Embodiment, and is the figure corresponding to FIG. It is an enlarged view of the region XXIII in FIG. 22.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In each of the following embodiments, parts that are the same or equal to each other will be described with the same reference numerals.

(First Embodiment)
The refrigeration cycle device 10 of the present embodiment shown in FIG. 1 is an ejector type refrigeration cycle device mounted on a vehicle. The refrigerating cycle device 10 cools the passenger compartment (not shown) and refrigerates a cool box (not shown). A cool box is a refrigerator for vehicles that cools drinks and the like. The cool box has a case. The case forms a space inside the refrigerator in which the object to be cooled is housed, and also houses the components of the refrigeration cycle device 10.

The refrigeration cycle device 10 includes a compressor 12, a radiator 14, an expansion valve 15, an ejector 16, a first evaporator 18, a branch portion 20, a valve device 22, and a second evaporator 24. .. The components of these refrigeration cycle devices 10 are connected to each other so as to constitute a vapor compression refrigeration cycle.

The compressor 12 compresses and discharges the sucked refrigerant. The compressor 12 is driven by the engine of the vehicle. The radiator 14 dissipates heat by exchanging heat between the refrigerant compressed by the compressor 12 and the air outside the passenger compartment. The expansion valve 15 is provided between the branch portion 20 and the upstream side of the refrigerant flow of the ejector 16. The expansion valve 15 decompresses and expands the refrigerant flowing out of the radiator 14. The expansion valve 15 is a temperature type expansion valve, and adjusts the flow rate of the refrigerant passing through the expansion valve 15 according to the degree of superheat of the refrigerant flowing out from the first evaporator 18.

The ejector 16 decompresses the refrigerant flowing out from the expansion valve 15 and causes it to flow out toward the first evaporator 18. The ejector 16 has a nozzle portion 16a, a suction portion 16b, and a boosting portion 16c. The nozzle portion 16a injects the inflowing refrigerant to reduce the pressure and expand the refrigerant. The suction unit 16b sucks the refrigerant by the flow of the refrigerant ejected from the nozzle unit 16a. The boosting unit 16c mixes the refrigerant ejected from the nozzle unit 16a and the refrigerant sucked from the suction unit 16b and boosts the pressure. The booster unit 16c causes the boosted refrigerant to flow out toward the first evaporator 18.

The first evaporator 18 cools the air and evaporates the refrigerant by heat exchange between the refrigerant flowing out from the ejector 16 and the air sent to the inside of the vehicle interior. The branch portion 20 is provided between the refrigerant flow downstream side of the radiator 14 and the refrigerant flow upstream side of the ejector 16. The branching portion 20 branches the refrigerant on the downstream side of the refrigerant flow of the radiator 14 into one and the other. One of the branched refrigerants flows toward the nozzle portion 16a of the ejector 16. The other branched refrigerant flows toward the suction portion 16b of the ejector.

The valve device 22 is provided in the suction side flow path 21 in which the refrigerant flows from the branch portion 20 toward the suction portion 16b of the ejector 16. The valve device 22 is a flow rate adjusting unit that adjusts the flow rate of the refrigerant flowing into the second evaporator 24 and reduces the pressure of the refrigerant flowing into the second evaporator 24. The valve device 22 includes a microvalve X1 connected in series and a fixed throttle 23. The valve device 22 is a combination of the micro valve X1 and the fixed throttle 23. Adjusting the flow rate of the refrigerant includes making the flow rate zero. Adjusting the flow rate of the refrigerant flowing through the suction side flow path 21, adjusting the flow rate of the refrigerant flowing into the second evaporator 24, and adjusting the flow rate of the refrigerant flowing into the suction unit 16b are the same. Meaning.

The micro valve X1 opens and closes the suction side flow path 21. The micro valve X1 is used as a switching valve for switching between a state in which the refrigerant flows in the suction side flow path 21 and a state in which the refrigerant does not flow. The fixed diaphragm 23 has a fixed diaphragm opening. That is, the flow path cross-sectional area of the fixed throttle 23 is fixed. The fixed throttle 23 decompresses and expands the refrigerant when the refrigerant is flowing through the suction side flow path 21. The valve device 22 is housed inside the case of the cool box. The configuration of the valve device 22 will be described later.

The second evaporator 24 is provided between the valve device 22 and the suction portion 16b in the suction side flow path 21. The second evaporator 24 is housed inside the case of the cool box. The second evaporator 24 cools the air inside the refrigerator by exchanging heat between the refrigerant and the air inside the cool box, and evaporates the refrigerant.

Next, the operation of the refrigeration cycle device 10 will be described.

When using the cool box, the micro valve X1 is open. By operating the compressor 12, a high-temperature and high-pressure refrigerant is discharged from the compressor 12. The high-temperature and high-pressure refrigerant discharged from the compressor 12 is dissipated by the radiator 14. The refrigerant radiated by the radiator 14 is branched into one refrigerant and the other refrigerant at the branch portion 20.

One of the branched refrigerants is decompressed and expanded by the expansion valve 15 and then flows into the nozzle portion 16a of the ejector 16. The refrigerant that has flowed into the nozzle portion 16a is decompressed and expanded by being injected from the nozzle portion 16a. The refrigerant injected from the nozzle unit 16a flows into the boosting unit 16c together with the refrigerant flowing from the suction unit 16b. The refrigerant that has flowed into the boosting section 16c is boosted and then flows out of the boosting section 16c. The refrigerant flowing out from the booster 16c flows through the first evaporator 18. The air inside the vehicle interior is cooled by evaporating the refrigerant in the first evaporator 18. As a result, the inside of the passenger compartment is cooled. The refrigerant flowing out of the first evaporator 18 is sucked into the compressor 12.

The other branched refrigerant flows into the valve device 22. The refrigerant that has flowed into the valve device 22 is depressurized by the fixed throttle 23 and flows out of the valve device 22. The refrigerant flowing out of the valve device 22 flows into the second evaporator 24. The air inside the cool box is cooled by evaporating the refrigerant in the second evaporator 24. As a result, the cool box is refrigerated. The refrigerant flowing out of the second evaporator 24 flows into the suction unit 16b.

In this way, the branch portion 20, the ejector 16 and the first evaporator 18 are connected so that one of the refrigerants branched at the branch portion 20 flows in the order of the nozzle portion 16a, the booster portion 16c, and the first evaporator 18. ing. The branch 20, the valve device 22, the second evaporator 24 and the ejector 16 are connected so that the other refrigerant branched at the branch 20 flows in the order of the valve device 22, the second evaporator 24, and the suction section 16b. ing.

When the cool box is not used, the micro valve X1 is closed. Therefore, the refrigerant does not flow between the branch portion 20 and the suction portion 16b. Other refrigerant flows are the same as when using the cool box.

Next, the configuration of the valve device 22 will be described. As shown in FIG. 2, the valve device 22 includes a flow path forming member 30 and a valve module X0.

The flow path forming member 30 forms a refrigerant flow path 31 inside. The refrigerant flow path 31 includes a first flow path 32, a second flow path 33, a third flow path 34, and a fixed throttle 23. The first flow path 32 communicates with the refrigerant inlet portion 30a of the flow path forming member 30. The third flow path 34 communicates with the refrigerant outlet portion 30b of the flow path forming member 30. The first flow path 32 and the second flow path 33 do not directly communicate with each other, but communicate with each other via the flow path of the valve module X0. The second flow path 33 and the third flow path 34 communicate with each other via the fixed throttle 23. The fixed throttle 23 is a flow path having a flow path cross-sectional area smaller than that of the second flow path 33 and the third flow path 34, respectively. The channel cross-sectional area is the area of the cross section of the channel. The flow path forming member 30 is a metal member.

[Configuration of valve module X0]
The valve module X0 is connected to the flow path forming member 30. The valve module X0 has a microvalve X1, a valve casing X2, a sealing member X3, two O-rings X4, X5, and two electrical wires X6, X7.

The micro valve X1 is a plate-shaped valve component, and is mainly composed of a semiconductor chip. The microvalve X1 may or may not have parts other than the semiconductor chip. Therefore, the micro valve X1 can be made compact. The length of the microvalve X1 in the thickness direction is, for example, 2 mm, the length in the longitudinal direction orthogonal to the thickness direction is, for example, 10 mm, and the length in the lateral direction orthogonal to both the longitudinal direction and the thickness direction. Is, for example, 5 mm, but is not limited thereto.

As described above, the micro valve X1 functions as an on-off valve. Opening and closing is switched by switching between energization and non-energization of the micro valve X1. Specifically, as shown in FIG. 3, the micro valve X1 is a normally closed valve that opens when energized and closes when not energized.

The electrical wirings X6 and X7 extend from the surface of the two plates on the front and back of the microvalve X1 opposite to the valve casing X2, pass through the sealing member X3 and the valve casing X2, and pass through the valve module. It is connected to a power supply outside X0. As a result, power is supplied from the power source to the micro valve X1 through the electric wires X6 and X7.

The valve casing X2 is a resin casing that houses the microvalve X1. The valve casing X2 is formed by resin molding containing polyphenylene sulfide as a main component. The valve casing X2 is a box body having a bottom wall on one side and an open side on the other side. The bottom wall of the valve casing X2 is interposed between the flow path forming member 30 and the micro valve X1 so that the micro valve X1 and the flow path forming member 30 do not come into direct contact with each other. Then, one surface of the bottom wall is in contact with and fixed to the flow path forming member 30, and the other surface is in contact with and fixed to one of the two plate surfaces of the microvalve X1. That is, the micro valve X1 is provided in the flow path forming member 30 via the valve casing X2. In this way, the valve casing X2 can absorb the difference in the coefficient of linear expansion between the micro valve X1 and the flow path forming member 30. This is because the coefficient of linear expansion of the valve casing X2 is a value between the coefficient of linear expansion of the microvalve X1 and the coefficient of linear expansion of the flow path forming member 30.

Further, the bottom wall of the valve casing X2 has a plate-shaped base portion X20 facing the micro valve X1 and a pillar-shaped first protruding portion X21 and a second protruding portion X21 protruding from the base portion X20 in a direction away from the micro valve X1. It has a part X22.

The first protruding portion X21 is fitted in the first opening 35 formed in the flow path forming member 30. The first opening 35 is connected to the first flow path 32. The first protruding portion X21 is formed with a first communication hole XV1 that penetrates from the end on the side of the microvalve X1 to the end on the side of the first flow path 32. The first communication hole XV1 communicates with the first flow path 32.

The second protruding portion X22 is fitted in the second opening 36 formed in the flow path forming member 30. The second opening 36 communicates with the second flow path 33. The second protruding portion X22 is formed with a second communication hole XV2 that penetrates from the end on the side of the microvalve X1 to the end on the side of the second flow path 33. The second communication hole XV2 communicates with the second flow path 33.

The sealing member X3 is a member made of epoxy resin that seals the other open side of the valve casing X2. The sealing member X3 covers the plate surface of the two plate surfaces on the front and back surfaces of the micro valve X1 on the side opposite to the bottom wall side of the valve casing X2. Further, the sealing member X3 covers the electric wirings X6 and X7 to realize waterproofing and insulation of the electric wirings X6 and X7. The sealing member X3 is formed by resin potting or the like.

The O-ring X4 is attached to the outer periphery of the first protruding portion X21 and seals between the flow path forming member 30 and the first protruding portion X21 to suppress the leakage of the refrigerant to the outside of the valve device 22. The O-ring X5 is attached to the outer periphery of the second protrusion X22 and seals between the flow path forming member 30 and the second protrusion X22 to suppress the leakage of the refrigerant to the outside of the valve device 22.

Here, the configuration of the micro valve X1 will be further described. As shown in FIGS. 4 and 5, the microvalve X1 is a MEMS having a first outer layer X11, an intermediate layer X12, and a second outer layer X13, all of which are semiconductors. MEMS is an abbreviation for Micro Electro Mechanical Systems. The first outer layer X11, the intermediate layer X12, and the second outer layer X13 are rectangular plate-shaped members having the same outer shape, and are laminated in the order of the first outer layer X11, the intermediate layer X12, and the second outer layer X13. That is, the intermediate layer X12 is sandwiched between the first outer layer X11 and the second outer layer X13 from both sides. Of the first outer layer X11, the intermediate layer X12, and the second outer layer X13, the second outer layer X13 is arranged on the side closest to the bottom wall of the valve casing X2. The structures of the first outer layer X11, the intermediate layer X12, and the second outer layer X13, which will be described later, are formed by a semiconductor manufacturing process such as chemical etching.

The first outer layer X11 is a conductive semiconductor member having a non-conductive oxide film on its surface. As shown in FIG. 4, the first outer layer X11 is formed with two through holes X14 and X15 penetrating the front and back surfaces. The microvalve X1 side ends of the electrical wirings X6 and X7 are inserted into the through holes X14 and X15, respectively.

The second outer layer X13 is a conductive semiconductor member having a non-conductive oxide film on its surface. As shown in FIGS. 4, 6 and 7, the second outer layer X13 is formed with a first refrigerant hole X16 and a second refrigerant hole X17 penetrating the front and back surfaces. As shown in FIG. 7, the first refrigerant hole X16 communicates with the first communication hole XV1 of the valve casing X2, and the second refrigerant hole X17 communicates with the second communication hole XV2 of the valve casing X2. The hydraulic diameters of the first refrigerant holes X16 and the second refrigerant holes X17 are, for example, 0.1 mm or more and 3 mm or less, but are not limited thereto.

The intermediate layer X12 is a conductive semiconductor member. Since the intermediate layer X12 comes into contact with the oxide film of the first outer layer X11 and the oxide film of the second outer layer X13, both the first outer layer X11 and the second outer layer X13 are electrically non-conducting. As shown in FIG. 6, the intermediate layer X12 has a first fixed portion X121, a second fixed portion X122, a plurality of first ribs X123, a plurality of second ribs X124, a spine X125, an arm X126, a beam X127, and a movable layer. It has a part X128.

The first fixing portion X121 is a member fixed to the first outer layer X11 and the second outer layer X13. The first fixed portion X121 is formed so as to surround the second fixed portion X122, the first rib X123, the second rib X124, the spine X125, the arm X126, the beam X127, and the movable portion X128 in the same one refrigerant chamber X19. There is. The refrigerant chamber X19 is a chamber surrounded by a first fixing portion X121, a first outer layer X11, and a second outer layer X13. The first fixed portion X121, the first outer layer X11, and the second outer layer X13 correspond to the base portion as a whole. The electrical wirings X6 and X7 are electrical wirings for changing the temperature of the plurality of first ribs X123 and the plurality of second ribs X124 to displace them.

Fixing the first fixing portion X121 to the first outer layer X11 and the second outer layer X13 suppresses the refrigerant from leaking from the refrigerant chamber X19 through the other than the first refrigerant hole X16 and the second refrigerant hole X17. It is done in such a way that it does.

The second fixing portion X122 is fixed to the first outer layer X11 and the second outer layer X13. The second fixed portion X122 is surrounded by the first fixed portion X121 and is arranged away from the first fixed portion X121.

The plurality of first ribs X123, the plurality of second ribs X124, the spine X125, the arm X126, the beam X127, and the movable portion X128 are not fixed to the first outer layer X11 and the second outer layer X13, and are the first. It can be displaced with respect to the outer layer X11 and the second outer layer X13.

The spine X125 has an elongated rod shape extending in the lateral direction in the rectangular shape of the intermediate layer X12. One end of the spine X125 in the longitudinal direction is connected to the beam X127.

The plurality of first ribs X123 are arranged on one side of the spine X125 in a direction orthogonal to the longitudinal direction of the spine X125. The plurality of first ribs X123 are arranged in the longitudinal direction of the spine X125. Each first rib X123 has an elongated rod shape and can be expanded and contracted according to temperature.

Each first rib X123 is connected to the first fixing portion X121 at one end in the longitudinal direction thereof and to the spine X125 at the other end. Each of the first ribs X123 is skewed with respect to the spine X125 so that the closer the first rib X123 is from the first fixed portion X121 side to the spine X125 side, the more the first rib X123 is offset toward the beam X127 side in the longitudinal direction of the spine X125. .. The plurality of first ribs X123 extend parallel to each other.

The plurality of second ribs X124 are arranged on the other side of the spine X125 in a direction orthogonal to the longitudinal direction of the spine X125. The plurality of second ribs X124 are arranged in the longitudinal direction of the spine X125. Each second rib X124 has an elongated rod shape and can be expanded and contracted according to temperature.

Each second rib X124 is connected to the second fixing portion X122 at one end in the longitudinal direction thereof and to the spine X125 at the other end. Each of the second ribs X124 is skewed with respect to the spine X125 so that the closer the second rib X124 is to the spine X125 side, the more the second rib X124 is offset toward the beam X127 side in the longitudinal direction of the spine X125. .. The plurality of second ribs X124 extend in parallel with each other.

The plurality of first ribs X123, the plurality of second ribs X124, and the spine X125 correspond to the drive unit as a whole.

The arm X126 has an elongated rod shape extending non-orthogonally and parallel to the spine X125. One end of the arm X126 in the longitudinal direction is connected to the beam X127, and the other end is connected to the first fixing portion X121.

The beam X127 has an elongated rod shape extending in a direction intersecting the spine X125 and the arm X126 at about 90 °. One end of the beam X127 is connected to the movable portion X128. The arm X126 and the beam X127 correspond to the amplification unit as a whole.

The connection position XP1 of the arm X126 and the beam X127, the connection position XP2 of the spine X125 and the beam X127, and the connection position XP3 of the beam X127 and the movable portion X128 are arranged in this order along the longitudinal direction of the beam X127. Then, assuming that the connection point between the first fixed portion X121 and the arm X126 is the hinge XP0, the connection position from the hinge XP0 is more than the linear distance from the hinge XP0 to the connection position XP2 in the plane parallel to the plate surface of the intermediate layer X12. The straight line distance to XP3 is longer.

The movable portion X128 has a rectangular shape whose outer shape extends in a direction of approximately 90 ° with respect to the longitudinal direction of the beam X127. The movable portion X128 can move integrally with the beam X127 in the refrigerant chamber X19. Then, by moving in this way, the movable portion X128 communicates the first refrigerant hole X16 and the second refrigerant hole X17 through the refrigerant chamber X19 when it is in a certain position, and when it is in another position, it is the first. The refrigerant hole X16 and the second refrigerant hole X17 are shut off in the refrigerant chamber X19. The movable portion X128 has a frame shape surrounding a through hole X120 penetrating the front and back of the intermediate layer X12. Therefore, the through hole X120 also moves integrally with the movable portion X128. The through hole X120 is a part of the refrigerant chamber X19.

Further, at the first application point X129 in the vicinity of the portion of the first fixed portion X121 connected to the plurality of first ribs X123, the electrical wiring X6 passing through the through hole X14 of the first outer layer X11 shown in FIG. The microvalve X1 side end of is connected. Further, the microvalve X1 side end of the electric wiring X7 passing through the through hole X15 of the first outer layer X11 shown in FIG. 4 is connected to the second application point X130 of the second fixing portion X122.

[Operation of valve module X0]
Here, the operation of the valve module X0 will be described. When the micro valve X1 is energized, a voltage is applied from the electrical wirings X6 and X7 to the first application point X129 and the second application point X130. Then, a current flows through the plurality of first ribs X123 and the plurality of second ribs X124. Due to this current, the plurality of first ribs X123 and the plurality of second ribs X124 generate heat and their temperatures rise. As a result, each of the plurality of first ribs X123 and the plurality of second ribs X124 expands in the longitudinal direction thereof.

As a result of such thermal expansion due to the temperature rise, the plurality of first ribs X123 and the plurality of second ribs X124 urge the spine X125 toward the connection position XP2. The urged spine X125 pushes the beam X127 at the connection position XP2. In this way, the connection position XP2 corresponds to the urging position. As a result, the member composed of the beam X127 and the arm X126 integrally changes its posture with the hinge XP0 as a fulcrum and the connection position XP2 as a force point. As a result, the movable portion X128 connected to the end of the beam X127 opposite to the arm X126 also moves in the longitudinal direction to the side where the spine X125 pushes the beam X127. As a result of the movement, the movable portion X128 reaches a position where the tip in the moving direction abuts on the first fixed portion X121 as shown in FIGS. 8 and 9. Hereinafter, this position of the movable portion X128 is referred to as an energized position.

As described above, the beam X127 and the arm X126 function as a lever having the hinge XP0 as a fulcrum, the connection position XP2 as a force point, and the connection position XP3 as an action point. As described above, the linear distance from the hinge XP0 to the connection position XP3 is longer than the linear distance from the hinge XP0 to the connection position XP2 in the plane parallel to the plate surface of the intermediate layer X12. Therefore, the amount of movement of the connection position XP3, which is the point of action, is larger than the amount of movement of the connection position XP2, which is the point of effort. Therefore, the amount of displacement due to thermal expansion is amplified by the lever and transmitted to the movable portion X128.

As shown in FIGS. 8 and 9, when the movable portion X128 is in the energized position, the through hole X120 overlaps with the first refrigerant hole X16 and the second refrigerant hole X17 in the direction orthogonal to the plate surface of the intermediate layer X12. In that case, the first refrigerant hole X16 and the second refrigerant hole X17 communicate with each other through the through hole X120 which is a part of the refrigerant chamber X19. As a result, the refrigerant can flow between the first communication hole XV1 and the second communication hole XV2 through the first refrigerant hole X16, the through hole X120, and the second refrigerant hole X17. That is, the micro valve X1 opens.

At this time, the flow path of the refrigerant in the micro valve X1 has a U-turn structure. Specifically, the refrigerant flows into the micro valve X1 from one surface of the micro valve X1, passes through the micro valve X1, and flows out of the micro valve X1 from the same surface of the micro valve X1. Similarly, the flow path of the refrigerant in the valve module X0 also has a U-turn structure. Specifically, the refrigerant flows into the valve module X0 from one surface of the valve module X0, passes through the valve module X0, and flows out of the valve module X0 from the same side surface of the valve module X0. The direction orthogonal to the plate surface of the intermediate layer X12 is the stacking direction of the first outer layer X11, the intermediate layer X12, and the second outer layer X13.

Further, when the micro valve X1 is not energized, the voltage application from the electrical wirings X6 and X7 to the first application point X129 and the second application point X130 is stopped. Then, the current stops flowing through the plurality of first ribs X123 and the plurality of second ribs X124, and the temperatures of the plurality of first ribs X123 and the plurality of second ribs X124 decrease. As a result, each of the plurality of first ribs X123 and the plurality of second ribs X124 contracts in the longitudinal direction thereof.

As a result of such thermal contraction due to the temperature decrease, the plurality of first ribs X123 and the plurality of second ribs X124 urge the spine X125 to the side opposite to the connection position XP2. The urged spine X125 pulls the beam X127 at the connection position XP2. As a result, the member composed of the beam X127 and the arm X126 integrally changes its posture with the hinge XP0 as a fulcrum and the connection position XP2 as a force point. As a result, the movable portion X128 connected to the end of the beam X127 opposite to the arm X126 also moves in the longitudinal direction to the side where the spine X125 pulls the beam X127. As a result of the movement, the movable portion X128 reaches a position where it does not abut on the first fixed portion X121 as shown in FIGS. 6 and 7. Hereinafter, this position of the movable portion X128 is referred to as a non-energized position.

As shown in FIGS. 6 and 7, when the movable portion X128 is in the non-energized position, the through hole X120 overlaps with the first refrigerant hole X16 in the direction orthogonal to the plate surface of the intermediate layer X12, but in that direction. It does not overlap with the second refrigerant hole X17. The second refrigerant hole X17 overlaps the movable portion X128 in the direction orthogonal to the plate surface of the intermediate layer X12. That is, the second refrigerant hole X17 is closed by the movable portion X128. In this case, the first refrigerant hole X16 and the second refrigerant hole X17 are shut off in the refrigerant chamber X19. As a result, the flow of the refrigerant between the first communication hole XV1 and the second communication hole XV2 through the first refrigerant hole X16 and the second refrigerant hole X17 is hindered. That is, the micro valve X1 is closed.

As described above, the micro valve X1 closes when it is not energized and opens when it is energized. The micro valve X1 opens and closes the refrigerant flow path 31 including the fixed throttle 23. As a result, the valve device 22 can adjust the flow rate of the refrigerant flowing through the suction side flow path 21 to one of zero and a larger flow rate. When the micro valve X1 is opened, the refrigerant flows through the fixed throttle 23. As a result, the valve device 22 can reduce the pressure of the refrigerant flowing through the suction side flow path 21.

Next, the effect of this embodiment will be described.

The valve device J22 of Comparative Example 1 shown in FIG. 10 is an example of a conventional valve device. In the valve device J22 of Comparative Example 1, the solenoid valve J22a as an on-off valve and the fixed throttle J22b are integrated. The solenoid valve J22a has a solenoid portion J1 that converts electrical energy into mechanical motion, and a valve portion J2 that opens and closes a flow path. The solenoid unit J1 includes a coil J3 and a piston J4. The valve portion J2 includes a valve body J5 and a valve seat J6.

The fixed throttle J22b and the valve seat J6 are formed on the flow path forming member J30. The flow path forming member J30 forms a refrigerant flow path J31 inside. The refrigerant flow path J31 includes a first flow path J32, a second flow path J33, and a fixed throttle J22b. The first flow path J32 communicates with the refrigerant inlet portion J30a of the flow path forming member J30. The second flow path J33 communicates with the refrigerant outlet portion J30b of the flow path forming member J30. The first flow path J32 and the second flow path 33 communicate with each other via a valve seat opening formed inside the valve seat J6 and a fixed throttle J22b.

The piston J4 moves according to the energized state of the coil J3. The movement of the piston J4 causes the valve body J5 provided at the end of the piston J4 to move. When the valve body J5 comes into contact with the valve seat J6 or the valve body J5 separates from the valve seat J6, the refrigerant flow path J31 is opened and closed.

The valve device J22 of Comparative Example 1 is housed inside a cool box. Since the cool box is installed in the passenger compartment, the overall size of the cool box is limited. Since the solenoid valve J0 has a large body size, the valve device J22 of Comparative Example 1 has a large body size. Therefore, the capacity of the cool box is smaller than the volume of the valve device J22.

On the other hand, according to the present embodiment, the micro valve X1 is used as the valve mechanism of the valve device 22. The micro valve X1 can be easily miniaturized as compared with the solenoid valve J0. One of the reasons is that the microvalve X1 is formed of a semiconductor chip as described above. Further, as described above, the fact that the displacement amount due to thermal expansion is amplified by using a lever also contributes to the miniaturization as compared with the solenoid valve that does not use such a lever.

Therefore, the body size of the valve device 22 can be reduced as compared with the valve device J22 of Comparative Example 1. That is, the volume of the valve device 22 can be reduced as compared with the valve device J22 of Comparative Example 1. The volume reduction of the valve device 22 can be used to increase the capacity of the cool box. Therefore, the capacity of the cool box can be increased.

Further, since the lever is used, the amount of displacement due to thermal expansion can be suppressed from the amount of movement of the movable portion X128. Therefore, the power consumption for driving the movable portion X128 can also be reduced. Since the power consumption of the micro valve X1 is small, the power consumption of the valve device 22 is reduced.

Further, since the impact noise when the solenoid valve is driven can be eliminated, the noise can be reduced. Further, since the micro valve X1 is lightweight, the valve device 22 is reduced in weight.

(Second Embodiment)
As shown in FIG. 11, in the present embodiment, the refrigeration cycle device 10 includes a valve device 40 instead of the valve device 22 of the first embodiment. The other configuration of the refrigeration cycle device 10 is the same as that of the first embodiment.

The valve device 40 includes a micro valve X1. The valve device 40 is a flow rate adjusting unit that adjusts the flow rate of the refrigerant flowing into the second evaporator 24 and reduces the pressure of the refrigerant flowing into the second evaporator 24. Adjusting the flow rate of the refrigerant involves reducing the flow rate to zero.

As shown in FIG. 12, the valve device 40 includes a flow path forming member 41 and a valve module X0.

The flow path forming member 41 forms a refrigerant flow path 42 inside. The refrigerant flow path 42 includes a first flow path 43 and a second flow path 44. The first flow path 43 communicates with the refrigerant inlet portion 41a of the flow path forming member 41. The second flow path 44 communicates with the refrigerant outlet portion 41b of the flow path forming member 41. The first flow path 43 and the second flow path 44 do not directly communicate with each other inside the flow path forming member 41, but communicate with each other via the flow path of the valve module X0. The flow path forming member 41 is a metal member.

The valve module X0 is connected to the flow path forming member 41. The configuration of the valve module X0 is the same as that of the valve module X0 of the first embodiment. The first protruding portion X21 is fitted in the first opening 45 formed in the flow path forming member 41. The first opening 45 communicates with the first flow path 43. Therefore, the first communication hole XV1 communicates with the first flow path 43. The second protruding portion X22 is fitted in the second opening 46 formed in the flow path forming member 41. The second opening 46 communicates with the second flow path 44. Therefore, the second communication hole XV22 communicates with the second flow path 44.

However, in the present embodiment, the voltage applied to the first application point X129 and the second application point X130 in FIG. 8 is PWM controlled. The PWM control is a control that repeatedly switches between energized and de-energized. At this time, the larger the duty ratio, the larger the power supplied. Duty ratio is the ratio of energizing time to a certain period. The larger the electric power, the higher the temperature and the larger the amount of thermal expansion. Therefore, the larger the duty ratio, the larger the amount of movement during energization with respect to the non-energization. Therefore, the position of the movable portion X128 can be continuously changed from the fully closed position to the fully open position by PWM control.

Therefore, as shown in FIG. 13, the micro valve X1 continuously changes the duty ratio between 0% and 100%, thereby increasing the opening degree of the flow path between 0% and 100%. It can be changed linearly. The flow path cross-sectional area when the opening degree of the flow path is larger than 0% is a size that reduces the pressure of the refrigerant. In this way, the micro valve X1 opens and closes the refrigerant flow path, reduces the pressure of the refrigerant flowing through the refrigerant flow path when the refrigerant flow path is open, and reduces the pressure of the refrigerant flow path. It is used as a variable aperture whose opening can be changed. As a result, the valve device 40 can adjust the flow rate of the refrigerant flowing through the suction side flow path 21 to an arbitrary size within a range of 0 to the maximum value, and the refrigerant flowing through the suction side flow path 21. Can be depressurized.

According to this embodiment, the flow rate of the refrigerant flowing through the second evaporator 24 can be adjusted to a desired flow rate by adjusting the flow path opening degree of the micro valve X1. Therefore, the cooling capacity of the second evaporator 24 can be adjusted by adjusting the flow rate of the refrigerant flowing through the second evaporator 24. As a result, the temperature inside the cool box can be set to the target temperature.

(Third Embodiment)
As shown in FIG. 14, in the present embodiment, the refrigeration cycle device 10 includes a valve device 50 instead of the valve device 22 of the first embodiment. The valve device 50 is a flow rate adjusting unit that adjusts the flow rate of the refrigerant flowing into the second evaporator 24 and reduces the pressure of the refrigerant flowing into the second evaporator 24. Adjusting the flow rate of the refrigerant involves reducing the flow rate to zero.

The valve device 50 has a refrigerant inlet portion 51a into which the refrigerant flows in and a refrigerant outlet portion 51b in which the refrigerant flows out. The refrigerant inlet portion 51a is connected to one of the two refrigerant outlet portions of the branch portion 20 on the refrigerant outlet side. The refrigerant outlet portion 51b is connected to the refrigerant inlet side of the second evaporator 24.

The valve device 50 includes one solenoid valve 50a, one fixed throttle 50b, and one microvalve X1. The solenoid valve 50a is an on-off valve that opens and closes the refrigerant flow path from the refrigerant inlet portion 51a of the valve device 50 to the refrigerant outlet portion 51b of the valve device 50. The fixed throttle 50b decompresses and expands the refrigerant flowing in from the refrigerant inlet portion 51a. The micro valve X1 opens and closes a detour flow path that guides the refrigerant flowing in from the refrigerant inlet portion 51a to the refrigerant outlet portion 51b by bypassing the fixed throttle 50b, and the refrigerant flowing through the detour flow path when the detour flow path is in the open state. To reduce the pressure. The other configuration of the refrigeration cycle device 10 is the same as that of the first embodiment.

A specific configuration of the valve device 50 will be described. As shown in FIG. 15, in the valve device 50, the solenoid valve 50a, the fixed throttle 50b, and the micro valve X1 are integrally configured. Specifically, the valve device 50 includes a flow path forming member 51, a solenoid portion 52, a valve body 53, and a valve module X0.

The flow path forming member 51 is a metal member. The flow path forming member 51 forms a refrigerant flow path 511 through which the refrigerant flows. The refrigerant flow path 511 includes a first flow path 512, a second flow path 513, a valve chamber 514, a valve seat flow path 515, and a fixed throttle 50b. The first flow path 512 and the second flow path 513 communicate with each other via the valve chamber 514, the valve seat flow path 515, and the fixed throttle 50b.

The flow path forming member 51 is formed with a refrigerant inlet portion 51a and a refrigerant outlet portion 51b. The first flow path 512 communicates with the refrigerant inlet portion 51a. The second flow path 513 communicates with the refrigerant outlet portion 51b.

A valve body 53 is arranged in the valve chamber 514. The valve seat flow path 515 is a flow path inside the valve seat 516 and is a flow path that is opened and closed by the valve body 53. The fixed throttle 50b is a flow path having a flow path cross-sectional area smaller than that of the first flow path 512 and the second flow path 513, respectively.

The flow path forming member 51 has a valve chamber forming portion 54 forming the valve chamber 514 and a fixed throttle forming portion 55 forming the fixed throttle 50b. The fixed throttle forming portion 55 is located in the valve chamber 514. In addition to the fixed throttle 50b, the fixed throttle forming portion 55 forms a valve seat flow path 515 and a part of the second flow path 513. The end of the fixed throttle forming portion 55 on the valve seat flow path 515 side is the valve seat 516.

The solenoid unit 52 converts electrical energy into mechanical motion. The solenoid unit 52 includes a coil 521 and a piston 522. The piston 522 moves according to the energized state of the coil 521.

The valve body 53 is fixed to the end of the piston 522. The valve body 53 is made of synthetic rubber. Due to the movement of the piston 522, the valve body 53 comes into contact with the valve seat 516 and moves away from the valve seat 516. That is, the valve body 53 opens and closes the valve seat flow path 515. The solenoid portion 52, the valve body 53, and the valve seat 516 constitute a solenoid valve 50a.

As shown in FIG. 16, the fixed throttle forming portion 55 is formed with a first through hole 55a and a second through hole 55b. A third through hole 54a and a fourth through hole 54b are formed in the valve chamber forming portion 54. The first through hole 55a and the third through hole 54a are arranged coaxially. The second through hole 55b and the fourth through hole 54b are arranged coaxially.

The valve module X0 has a micro valve X1, a valve casing X2, a sealing member X3, and two electrical wirings X6 and X7, as in the first embodiment. Unlike the first embodiment, the valve module X0 has four O-rings X4, X5, X8, and X9.

The valve module X0 is provided on the outside of the flow path forming member 51. The first protruding portion X21 of the valve casing X2 is fitted into the first through hole 55a and the third through hole 54a. The tip of the first protruding portion X21 is located inside the first through hole 55a. The first communication hole XV1 communicates with the valve seat flow path 515 on the upstream side of the refrigerant flow of the fixed throttle 50b via the first through hole 55a. The second protruding portion X22 of the valve casing X2 is fitted into the second through hole 55b and the fourth through hole 54b. The tip of the second protrusion X22 is located inside the second through hole 55b. The second communication hole XV2 communicates with the second flow path 513 on the upstream side of the refrigerant flow of the fixed throttle 50b via the second through hole 55b.

In the present embodiment, the flow path forming member 51 and the valve casing X2 correspond to a flow path forming component that forms a refrigerant flow path from the refrigerant inlet portion 51a to the refrigerant outlet portion 51b as a whole. The first through hole 55a, the first communication hole XV1, the second communication hole XV2, and the second through hole 55b make the refrigerant flowing in from the refrigerant inlet portion 51a bypass the fixed throttle 50b and the refrigerant outlet as a whole. Corresponds to the detour flow path leading to the portion 51b. The refrigerant flow path 511, the first through hole 55a, the first communication hole XV1, the second communication hole XV2, and the second through hole 55b are, as a whole, from the refrigerant inlet portion of the flow rate adjusting section to the flow rate adjusting section. Corresponds to the refrigerant flow rate leading to the refrigerant outlet.

When the valve body 53 is separated from the valve seat 516, the solenoid valve 50a is opened. When the solenoid valve 50a is open and the microvalve X1 is closed, the refrigerant flowing out of the radiator 14 is branched at the branch portion 20. One of the branched refrigerants flows through the ejector 16 and the first evaporator 18 in this order. The other branched refrigerant flows into the refrigerant inlet portion 51a of the valve device 50. The refrigerant that has flowed into the refrigerant inlet portion 51a flows in the order of the first flow path 512, the valve seat flow path 515, the fixed throttle 50b, and the second flow path 513, and then flows out from the refrigerant outlet portion 51b. The refrigerant flowing out from the refrigerant outlet portion 51b flows into the suction portion 16b of the ejector 16 after flowing through the second evaporator 24.

Further, when the solenoid valve 50a is opened and the micro valve X1 is opened, a refrigerant flow passing through the micro valve X1 is formed in addition to the above-mentioned refrigerant flow. That is, inside the valve device 50, the refrigerant flow from the refrigerant inlet portion 51a through the fixed throttle 50b to reach the refrigerant outlet portion 51b and the refrigerant inlet portion 51a bypassing the fixed throttle 50b to the refrigerant outlet portion 51b. A reaching refrigerant flow is formed. The minimum flow path cross-sectional area of the micro valve X1 when the valve is opened is set to a size that causes the refrigerant to be decompressed and expanded. Therefore, the refrigerant decompressed and expanded by the micro valve X1 and the refrigerant decompressed and expanded by the fixed throttle 50b merge. The merged refrigerant flows out from the refrigerant outlet portion 51b. The refrigerant flowing out from the refrigerant outlet portion 51b flows into the suction portion 16b of the ejector 16 after flowing through the second evaporator 24.

When the solenoid valve 50a is closed, the refrigerant flowing out of the radiator 14 is not branched at the branch portion 20 and flows through the ejector 16 and the first evaporator 18 in this order. Refrigerant does not flow in the second evaporator 24.

The same effect as that of the first embodiment can be obtained by this embodiment as well. Further, according to the present embodiment, the following effects can be obtained.

As described above, as shown in FIG. 17, the valve device 50 can open and close the flow path and change the opening degree of the flow path in two steps. The opening degree of the flow path of the valve device 50 when both the solenoid valve 50a and the microvalve X1 are open is set to 100%. The flow path opening degree of the valve device 50 when the solenoid valve 50a is closed is set to 0%. In this case, the opening degree when the solenoid valve 50a is opened and the microvalve X1 is closed is an intermediate opening degree A1 between 0% and 100%.

In the present embodiment, the solenoid valve 50a is opened and the microvalve X1 is closed during normal use of the cool box. When increasing the cooling capacity of the second evaporator 24 at the time of rapid cooling of the cool box or the like, the micro valve X1 is opened with the solenoid valve 50a opened. As a result, the flow rate of the refrigerant flowing out of the valve device 50 can be increased as compared with the time when the micro valve X1 is closed, and the flow rate of the refrigerant flowing through the second evaporator 24 can be increased. Therefore, the cooling capacity of the second evaporator 24 can be increased.

(Fourth Embodiment)
As shown in FIG. 18, in the present embodiment, the valve device 50 includes one solenoid valve 50a, one fixed throttle 50b, and two microvalves X1 and Y1. The fixed throttle 50b and each of the two microvalves X1 and Y1 are connected in parallel to each other between the refrigerant inlet portion 51a and the refrigerant outlet portion 51b. The configuration of the micro valve Y1 is the same as that of the micro valve X1. The other configuration of the valve device 50 is the same as that of the third embodiment.

As shown in FIG. 19, the valve device 50 can open and close the flow path and change the opening degree of the flow path in three stages. The opening degree of the flow path of the valve device 50 when all of the solenoid valve 50a and the microvalves X1 and Y1 are open is set to 100%. The flow path opening degree of the valve device 50 when the solenoid valve 50a is closed is set to 0%. In this case, the opening degree when the solenoid valve 50a is opened and the microvalve X1 and the microvalve Y1 are closed is the first intermediate opening degree A2 between 0% and 100%. The opening degree when the solenoid valve 50a is opened, the microvalve X1 is opened, and the microvalve Y1 is closed is the second intermediate opening degree A3 between 0% and 100%. The second intermediate opening degree A3 is larger than the first intermediate opening degree A2.

Also in this embodiment, the same effect as that of the first embodiment can be obtained. Further, according to the present embodiment, the flow rate of the refrigerant flowing through the second evaporator 24 can be adjusted in three stages by opening and closing each of the micro valves X1 and Y1. Thereby, the cooling capacity of the second evaporator 24 can be adjusted.

The fixed throttle 50b and a plurality of three or more microvalves may be connected in parallel to each other between the refrigerant inlet portion 51a and the refrigerant outlet portion 51b. According to this, the flow rate of the refrigerant expanded under reduced pressure can be adjusted in multiple stages by opening and closing each of the plurality of micro valves.

(Fifth Embodiment)
As shown in FIG. 20, the refrigeration cycle device 10A of the present embodiment is an ejector type refrigeration cycle device mounted on a vehicle. The refrigeration cycle device 10A cools the inside of the passenger compartment (not shown).

The refrigeration cycle device 10A includes a compressor 12, a radiator 14, an expansion valve 15, an ejector 16, a gas-liquid separator 60, an evaporator 62, a bypass flow path 64, a check valve 66, and a valve. The device 68 is provided. The components of these refrigeration cycle apparatus 10A constitute a vapor compression refrigeration cycle.

The expansion valve 15 adjusts the flow rate of the refrigerant passing through the expansion valve 15 according to the degree of superheat of the refrigerant flowing out of the evaporator 62.

The gas-liquid separator 60 separates the refrigerant flowing out of the ejector 16 into a gas-phase refrigerant and a liquid-phase refrigerant. The outlet side of the gas-phase refrigerant of the gas-liquid separator 60 is connected to the refrigerant suction side of the compressor 12. The outlet side of the liquid phase refrigerant of the gas-liquid separator 60 is connected to the refrigerant inlet side of the evaporator 62. As a result, the gas-liquid separator 60 causes the separated gas-phase refrigerant to flow into the compressor 12, and the separated liquid-phase refrigerant flows into the evaporator 62.

The evaporator 62 cools the air and evaporates the refrigerant by heat exchange between the liquid phase refrigerant flowing out of the gas-liquid separator 60 and the air sent to the inside of the vehicle interior. The refrigerant outlet side of the evaporator 62 is connected to the suction portion 16b of the ejector 16. As a result, the evaporator 62 causes the evaporated refrigerant to flow into the suction unit 16b.

The bypass flow path 64 is a flow path that guides the refrigerant flowing out of the radiator 14 to the evaporator 62 by bypassing the ejector 16 and the gas-liquid separator 60. One end of the bypass flow path 64 is connected to a first connection portion 63 located between the radiator 14 and the expansion valve 15 in the refrigerant flow path. The other end of the bypass flow path 64 is connected to a second connection portion 65 located between the gas-liquid separator 60 and the upstream side of the evaporator 62 in the refrigerant flow path. In the present embodiment, the bypass flow path 64 and the refrigerant flow path from the second connection portion 65 to the suction portion 16b correspond to the suction side flow path in which the refrigerant flows toward the suction portion 16b as a whole.

The check valve 66 is provided in the middle of the refrigerant flow path connecting the liquid-phase refrigerant side of the gas-liquid separator 60 and the second connection portion 65. The check valve 66 allows the refrigerant flow from the liquid-phase refrigerant outlet of the gas-liquid separator 60 toward the second connection portion 65, and the refrigerant flow from the second connection portion 65 toward the liquid-phase refrigerant outlet of the gas-liquid separator 60. To prevent.

The valve device 68 is provided in the bypass flow path 64. The valve device 68 includes a microvalve X1. The valve device 68 is a flow rate adjusting unit that adjusts the flow rate of the refrigerant flowing through the bypass flow path 64 and reduces the pressure of the refrigerant flowing through the bypass flow path 64. Adjusting the flow rate of the refrigerant includes setting the flow rate of the refrigerant to 0.

As shown in FIG. 21, the valve device 68 includes a valve module X0 and a block body 70. The valve module X0 is connected to the block body 70. The configuration of the valve module X0 is the same as that of the first embodiment.

The block body 70 is a connecting member that connects the valve module X0, the first pipe 71, and the second pipe 72. The first pipe 71 constitutes a part of the bypass flow path 64. The second pipe 72 constitutes another part of the bypass flow path 64.

A first flow path 73 and a second flow path 74 are formed inside the block body 70. Inside the block body 70, the first flow path 73 and the second flow path 74 do not communicate with each other. The block body 70 is formed with a first opening 73a and a second opening 73b communicating with the first flow path 73. The block body 70 is formed with a third opening 74a and a fourth opening 74b communicating with the second flow path 74. The third opening 74a is arranged next to the first opening 73a. The first protruding portion X21 and the second protruding portion X22 of the valve module X0 are fitted into the first opening 73a and the third opening 74a, respectively. The first pipe 71 is inserted into the second opening 73b. The second pipe 72 is inserted into the fourth opening 74b. As a result, the flow path 71a inside the first pipe 71 communicates with the first communication hole XV1 via the first flow path 73. The flow path 72a inside the second pipe 72 communicates with the second communication hole XV2 via the second flow path 74.

When the micro valve X1 is open, the first communication hole XV1 and the second communication hole XV2 communicate with each other. As a result, the internal flow path 71a of the first pipe 71 and the internal flow path 72a of the second pipe 72 communicate with each other. When the micro valve X1 is closed, the first communication hole XV1 and the second communication hole XV2 do not communicate with each other. As a result, the internal flow path 71a of the first pipe 71 and the internal flow path 72a of the second pipe 72 communicate with each other. In this way, the micro valve X1 opens and closes the bypass flow path 64.

Further, as in the second embodiment, the micro valve X1 can reduce the pressure of the refrigerant when the bypass flow path 64 is in the open state, and can change the opening degree of the flow path when the refrigerant is reduced in pressure. In this way, the valve device 68 can adjust the flow rate of the refrigerant flowing through the bypass flow path 64 to an arbitrary size between 0 and the maximum value, and reduces the pressure of the refrigerant flowing through the bypass flow path 64. Can be done.

Next, the operation of the refrigeration cycle device 10A will be described.

When the flow rate of the refrigerant flowing into the nozzle portion 16a of the ejector 16 is larger than the predetermined flow rate, the micro valve X1 is closed. The case where the flow rate of the refrigerant flowing into the nozzle portion 16a of the ejector 16 is larger than the predetermined flow rate is, for example, the case where the rotation speed of the compressor 12 is larger than the predetermined rotation speed.

In this case, the operation of the compressor 12 causes the high-temperature and high-pressure refrigerant to be discharged from the compressor 12. The high-temperature and high-pressure refrigerant discharged from the compressor 12 is dissipated by the radiator 14. The refrigerant radiated by the radiator 14 is decompressed and expanded by the expansion valve 15 and then flows into the nozzle portion 16a of the ejector 16. The refrigerant that has flowed into the nozzle portion 16a is decompressed and expanded by being injected from the nozzle portion 16a. The refrigerant injected from the nozzle unit 16a flows into the boosting unit 16c together with the refrigerant flowing from the suction unit 16b. The refrigerant that has flowed into the boosting section 16c is boosted and then flows out of the boosting section 16c. The refrigerant flowing out from the booster 16c flows into the gas-liquid separator 60.

The refrigerant flowing into the gas-liquid separator 60 is separated into a gas-phase refrigerant and a liquid-phase refrigerant. The separated vapor phase refrigerant is sucked into the compressor 12. The separated liquid phase refrigerant flows into the evaporator 62. By evaporating the refrigerant in the evaporator 62, the air inside the vehicle interior is cooled. As a result, the inside of the passenger compartment is cooled. The refrigerant flowing out of the evaporator 62 flows into the suction unit 16b.

Here, the flow rate of the refrigerant flowing through the evaporator 62 depends on the amount of boosting of the refrigerant in the boosting unit 16c. This boost amount depends on the flow rate of the refrigerant flowing through the ejector 16. Therefore, under the condition that the flow rate of the refrigerant flowing through the ejector 16 is small, the amount of boosting is small, and the refrigerant may not flow through the evaporator 62. Specifically, when the boosted amount is the same as the pressure loss amount of the refrigerant due to the flow through the pipe, the refrigerant flow from the gas-liquid separator 60 to the suction portion 16b does not occur.

Therefore, when the flow rate of the refrigerant flowing into the nozzle portion 16a is smaller than the predetermined flow rate, the micro valve X1 is opened. The case where the flow rate of the refrigerant flowing into the nozzle portion 16a is smaller than the predetermined flow rate is, for example, the case where the rotation speed of the compressor 12 is smaller than the predetermined rotation speed. This predetermined rotation speed is set based on the rotation speed of the compressor 12 when the refrigerant does not flow to the evaporator 62 when the valve device 68 is in the closed state.

When the micro valve X1 is opened, the refrigerant flowing out of the radiator 14 flows through the bypass flow path 64 due to the action of the compressor 12. At this time, the refrigerant is depressurized by passing the refrigerant through the micro valve X1. The decompressed refrigerant flows into the evaporator 62. The refrigerant evaporated in the evaporator 62 is sucked into the compressor 12 via the suction unit 16b and the gas-liquid separator 60.

As described above, when the flow rate of the refrigerant flowing through the cycle is smaller than the predetermined flow rate, the micro valve X1 is opened. As a result, it is possible to prevent the refrigerant from flowing to the evaporator 62 under the condition that the flow rate of the refrigerant is low.

Conventionally, as a valve for opening and closing the bypass flow path 64, a mechanical valve utilizing the pressure difference between the greenhouse and the flowing refrigerant has been used. On the other hand, in the present embodiment, the micro valve X1 is used as the valve mechanism of the valve device 68. The micro valve X1 can be easily miniaturized as compared with such a conventional mechanical valve. Therefore, the valve device 68 can be miniaturized as compared with the case where a conventional mechanical valve is used as the valve mechanism of the valve device 68.

Further, in the present embodiment, the opening degree of the micro valve X1 can be adjusted to adjust the flow rate of the refrigerant flowing through the evaporator 62. Therefore, the flow rate of the refrigerant flowing through the evaporator 62 can be adjusted to an appropriate flow rate according to the cooling load.

In other words, when the flow path cross-sectional area of the valve device 68 is fixed, the flow path cross-sectional area is set so that the flow rate of the refrigerant flowing through the evaporator 62 becomes an appropriate flow rate under predetermined conditions. .. On the other hand, according to the present embodiment, the flow path cross-sectional area of the valve device 68 can be changed so that the flow rate of the refrigerant flowing through the evaporator 62 becomes an appropriate flow rate under a wide range of conditions.

In this embodiment, the flow path opening degree of the micro valve X1 can be changed to an arbitrary size. However, the micro valve X1 may only open and close.

Further, in the present embodiment, when the flow rate of the refrigerant is smaller than the predetermined flow rate, the valve device 68 is opened. However, under other conditions, the valve device 68 may be open.

(Sixth Embodiment)
In this embodiment, the micro valve X1 of the first embodiment is modified to have a failure detection function. Specifically, the micro valve X1 includes a failure detection unit X50 as shown in FIGS. 22 and 23, in addition to the same configuration as that of the first embodiment.

The failure detection unit X50 includes a bridge circuit formed on the arm X126 of the intermediate layer X12. The bridge circuit includes four gauge resistors connected as shown in FIG. That is, the failure detection unit X50 is a bridge circuit whose resistance changes according to the distortion of the arm X126 corresponding to the diaphragm. That is, the failure detection unit X50 is a semiconductor piezo resistance type distortion sensor. The failure detection unit X50 may be connected to the arm X126 via an electrical insulating film so as not to be electrically connected to the arm X126.

Wiring X51 and X52 are connected to two input terminals on the diagonal of this bridge circuit. Then, a voltage for generating a constant current is applied from the wirings X51 and X52 to the input terminal. The wirings X51 and X52 branch from the voltage applied to the microvalve X1 (that is, the microvalve driving voltage) via the electrical wirings X6 and X7 and extend to the above two input terminals.

Further, the wirings X53 and X54 are connected to two output terminals on different diagonals of the bridge circuit. Then, a voltage signal at a level corresponding to the amount of distortion of the arm X126 is output from the wirings X53 and X54. As will be described later, this voltage signal is used as information for determining whether or not the microvalve X1 is operating normally. The voltage signals output from the wirings X53 and X54 are input to the control device X55 outside the microvalve X1.

The control device X55 may be, for example, an air conditioner ECU that controls the operation of a compressor, a blower, an air mix door, an inside / outside air switching door, or the like in a vehicle air conditioner. Alternatively, the control device X55 may be a meter ECU that displays the vehicle speed, the remaining fuel amount, the remaining battery amount, and the like in the vehicle.

When the control device X55 acquires a voltage signal corresponding to the amount of distortion of the arm X126 via the wirings X53 and X54, the control device X55 detects the presence or absence of failure of the microvalve X1 according to the voltage signal. Examples of the failure to be detected include a failure in which the arm X126 breaks, a failure in which a minute foreign substance is caught between the movable portion X128 and the first outer layer X11 or the second outer layer X13, and the movable portion X128 becomes immobile.

When the beam X127 and the movable portion X128 are displaced according to the expansion and contraction of the plurality of first ribs X123 and the plurality of second ribs X124, the amount of strain of the arm X126 changes. Therefore, the position of the movable portion X128 can be estimated from the voltage signal corresponding to the amount of distortion of the arm X126. On the other hand, if the micro valve X1 is normal, there is also a correlation between the amount of electricity supplied from the electrical wirings X6 and X7 to the micro valve X1 and the position of the movable portion X128. This energized amount is a controlled amount for controlling the micro valve X1.

The control device X55 utilizes this to detect the presence or absence of a failure of the micro valve X1. That is, the control device X55 calculates the position of the movable portion X128 from the voltage signals from the wirings X53 and X54 based on the predetermined first map. Then, based on the second map determined in advance, the power supplied from the electric wirings X6 and X7 required to realize the position in the normal state to the micro valve X1 is calculated from the position of the movable portion X128. These first map and second map are recorded in the non-volatile memory of the control device X55. Non-volatile memory is a non-transitional substantive storage medium. The correspondence between the level and the position of the voltage signal in the first map may be determined in advance by an experiment or the like. Further, the correspondence relationship between the position and the supplied power in the second map may be determined in advance by an experiment or the like.

Then, the control device X55 compares the calculated electric power with the electric power actually supplied from the electric wirings X6 and X7 to the microvalve X1. Then, the control device X55 determines that the micro valve X1 is out of order if the absolute value of the difference between the former power and the latter power exceeds the permissible value, and if it does not exceed the permissible value, the micro valve It is determined that X1 is normal. Then, when it is determined that the micro valve X1 is out of order, the control device X55 performs predetermined failure notification control.

In this failure notification control, the control device X55 operates a notification device X56 that notifies a person in the vehicle. For example, the control device X55 may turn on the warning lamp. Further, the control device X55 may cause the image display device to display an image indicating that a failure has occurred in the micro valve X1. As a result, the occupant of the vehicle can notice the failure of the micro valve X1.

Further, in this failure notification control, the control device X55 may record information indicating that a failure has occurred in the micro valve X1 in the storage device in the vehicle. This storage device is a non-transitional substantive storage medium. As a result, the failure of the micro valve X1 can be recorded.

Further, when the control device X55 determines that the micro valve X1 is out of order, the control device X55 performs energization stop control. In the energization stop control, the control device X55 stops the energization from the electric wires X6 and X7 to the micro valve X1. In this way, by stopping the energization of the micro valve X1 when the micro valve X1 fails, the safety of the micro valve X1 at the time of failure can be enhanced.

As described above, the failure detection unit X50 outputs a voltage signal for determining whether or not the microvalve X1 is operating normally, so that the control device X55 can easily determine whether or not the microvalve X1 has a failure. Can be determined.

Further, this voltage signal is a signal corresponding to the amount of distortion of the arm X126. Therefore, it is possible to easily determine whether or not the microvalve X1 has a failure based on the relationship between the amount of electricity supplied from the electrical wirings X6 and X7 to the microvalve X1 and this voltage signal.

In the present embodiment, it is determined whether or not the microvalve X1 is out of order based on the change in the resistance constituting the bridge circuit. However, as another method, it may be determined whether or not the microvalve X1 has failed based on the change in capacitance. In this case, a plurality of electrodes forming a capacitive component are formed on the arm X126 instead of the bridge circuit. There is a correlation between the amount of strain in the arm X126 and the capacitance between the plurality of electrodes. Therefore, the control device can determine whether or not the microvalve X1 has failed based on the change in capacitance between the plurality of electrodes.

(Other embodiments)
(1) In the first embodiment, the refrigerant flow path 31 of the flow path forming member 30 includes a fixed throttle 23. However, the refrigerant flow path 31 may not include the fixed throttle 23. In this case, the flow path of the micro valve X1, for example, the first refrigerant hole X16 and the second refrigerant hole X17 function as a fixed throttle.

(2) In the first embodiment or the like, when the energization from the electrical wirings X6 and X7 to the microvalve X1 is stopped, the microvalve X1 is closed. However, this does not necessarily have to be the case. For example, when the energization of the electric wires X6 and X7 to the microvalve X1 is stopped, the microvalve X1 may be opened.

(3) In each of the above embodiments, the plurality of first ribs X123 and the plurality of second ribs X124 are made of a semiconductor material. However, these members may be made of other materials such as a metal material that generates heat when energized and expands when its own temperature rises due to the heat generation. Further, these members may be made of a shape memory material that deforms when the temperature changes. In this case, the drive unit is displaced due to its thermal deformation.

(4) In each of the above embodiments, the refrigeration cycle devices 10 and 10A include an expansion valve 15. However, the refrigeration cycle devices 10 and 10A do not have to include the expansion valve 15. In this case, the refrigerant is decompressed and expanded by the nozzle portion 16a of the ejector 16.

(5) The shape and size of the micro valve X1 are not limited to those shown in the above embodiment. The micro valve X1 may have a first refrigerant hole X16 and a second refrigerant hole X17 having a hydraulic diameter that can control a very small flow rate and do not clog minute dust existing in the flow path.

(6) The present invention is not limited to the above-described embodiment, and can be appropriately modified within the scope of claims, and includes various modifications and modifications within an equal range. Further, the above-described embodiments are not unrelated to each other, and can be appropriately combined unless the combination is clearly impossible. Further, in each of the above embodiments, it goes without saying that the elements constituting the embodiment are not necessarily essential except when it is clearly stated that they are essential and when they are clearly considered to be essential in principle. stomach. Further, in each of the above embodiments, when numerical values such as the number, numerical values, quantities, and ranges of the constituent elements of the embodiment are mentioned, when it is clearly stated that they are particularly essential, and in principle, the number is clearly limited to a specific number. It is not limited to the specific number except when it is done. Further, in each of the above embodiments, when referring to the material, shape, positional relationship, etc. of the constituent elements, etc., except when specifically specified or when the material, shape, positional relationship, etc. are limited to a specific material, shape, positional relationship, etc. in principle. , The material, shape, positional relationship, etc. are not limited.

(summary)
According to the first aspect shown in a part or all of the above embodiments, the ejector type refrigerating cycle apparatus includes a compressor that compresses and discharges the refrigerant and heat dissipation that dissipates the refrigerant discharged from the compressor. The container, the nozzle part that ejects the refrigerant flowing out of the radiator, the suction part that sucks the refrigerant by the flow of the refrigerant ejected from the nozzle part, and the refrigerant ejected from the nozzle part and the refrigerant sucked from the suction part. It includes an ejector including a boosting unit that mixes and boosts pressure, and a flow rate adjusting unit that includes a valve component that adjusts the flow rate of the refrigerant flowing into the suction unit.

The valve parts include a refrigerant chamber through which the refrigerant flows, a first refrigerant hole communicating with the refrigerant chamber, a base forming a second refrigerant hole communicating with the refrigerant chamber, and a drive unit that displaces when its own temperature changes. The amplification unit that amplifies the displacement due to the change in the temperature of the drive unit and the displacement amplified by the amplification unit are transmitted and move in the refrigerant chamber, so that they are between the first refrigerant hole and the second refrigerant hole via the refrigerant chamber. It has a movable part that switches between communication and interruption. When the drive unit is displaced due to a change in temperature, the drive unit biases the amplification unit at the urging position, so that the amplification unit is displaced with the hinge as the fulcrum, and the amplification unit is displaced at the connection position between the amplification unit and the movable unit. Bounces the moving parts. The distance from the hinge to the connection position is longer than the distance from the hinge to the urging position.

Further, according to the second viewpoint, the ejector type refrigerating cycle device includes a branch portion for branching the refrigerant flowing out from the radiator into one refrigerant and the other refrigerant, a first evaporator for evaporating the refrigerant, and a refrigerant. It is provided with a second evaporator for evaporating. The branch portion, the ejector, and the first evaporator are connected so that one of the refrigerants flows in the order of the nozzle portion, the boosting portion, and the first evaporator. The branch portion, the flow rate adjusting portion, the second evaporator, and the ejector are connected so that the other refrigerant flows in the order of the flow rate adjusting portion, the second evaporator, and the suction portion. The flow rate adjusting unit adjusts the flow rate of the refrigerant flowing into the second evaporator and reduces the pressure of the refrigerant flowing into the second evaporator. As described above, the configuration of the second viewpoint can be adopted as the specific configuration of the first viewpoint.

Further, according to the third aspect, the flow rate adjusting unit has a flow path forming member for forming a refrigerant flow path including a fixed throttle. The valve component opens and closes the refrigerant flow path. As described above, the configuration of the third viewpoint can be adopted as the specific configuration of the second viewpoint.

Further, according to the fourth aspect, the flow rate adjusting unit has a flow path forming member for forming a refrigerant flow path. The valve component can open and close the refrigerant flow path, reduce the pressure of the refrigerant flowing through the refrigerant flow path when the refrigerant flow path is open, and change the opening degree of the flow path when the refrigerant is reduced in pressure. ..

As described above, the configuration of the fourth viewpoint can be adopted as the specific configuration of the second viewpoint. According to this, by changing the opening degree of the flow path when the valve component depressurizes the refrigerant, the flow rate of the refrigerant flowing into the second evaporator can be set to an arbitrary size within a range of 0 to the maximum value. It can be adjusted.

Further, according to the fifth viewpoint, the flow rate adjusting unit opens and closes the flow path forming component forming the refrigerant flow path from the refrigerant inlet portion of the flow rate adjusting section to the refrigerant outlet portion of the flow rate adjusting section, and the refrigerant flow path. It has an on-off valve. The refrigerant flow path includes a fixed throttle and a bypass flow path for guiding the refrigerant flowing from the refrigerant inlet portion by bypassing the fixed throttle portion to the refrigerant outlet portion. The valve component opens and closes the bypass flow path and reduces the pressure of the refrigerant flowing through the bypass flow path when the bypass flow path is open.

As a specific configuration of the second viewpoint, the configuration of the fourth viewpoint can be adopted. According to this, the flow rate of the refrigerant flowing into the second evaporator can be adjusted stepwise at a flow rate larger than 0 by opening and closing the bypass flow path of the valve component.

Further, according to the sixth viewpoint, the ejector type refrigerating cycle apparatus separates the refrigerant flowing out from the boosting unit into the gas phase refrigerant and the liquid phase refrigerant, and causes the separated vapor phase refrigerant to flow into the compressor. The ejector and the gas-liquid separator are bypassed by the evaporator that evaporates the liquid-phase refrigerant separated by the gas-liquid separator and causes the evaporated refrigerant to flow into the suction unit, and the refrigerant that flows out from the radiator. , A bypass flow path leading to an evaporator is provided. The flow rate adjusting unit adjusts the flow rate of the refrigerant flowing through the bypass flow path and reduces the pressure of the refrigerant flowing through the bypass flow path. As described above, the configuration of the sixth viewpoint can be adopted as the specific configuration of the first viewpoint.

Further, according to the seventh aspect, the valve component includes a failure detection unit that outputs a signal for determining whether the valve component is operating normally or failing. When the valve component outputs such a signal, it is possible to easily determine whether or not the valve component has a failure.

Further, according to the eighth viewpoint, the signal is a signal corresponding to the amount of distortion of the amplification unit. In this way, it is possible to determine the presence or absence of a failure of the valve device based on the relationship between this signal and the control amount for controlling the valve component.

Further, according to the ninth viewpoint, the drive unit generates heat when energized. The failure detection unit outputs a signal to a device that stops energization of the valve component when the valve component is out of order. In this way, by stopping the energization when the valve component fails, the safety at the time of failure can be enhanced.

Further, according to the tenth viewpoint, the failure detection unit outputs a signal to a device that operates a notification device that notifies a person when a valve component is out of order. Thereby, a person can know the failure of the valve component.

Further, according to the eleventh viewpoint, the valve component is composed of a semiconductor chip. Therefore, the valve component can be made compact.

12 Compressor 14 Dissipator 16 Ejector 16b Suction part 22 Valve device 40 Valve device 50 Valve device 68 Valve device X1 Micro valve

Claims (7)

It is an ejector type refrigeration cycle device.
A compressor (12) that compresses and discharges the refrigerant,
A radiator (14) that dissipates heat from the refrigerant discharged from the compressor, and
A nozzle portion (16a) for ejecting the refrigerant flowing out of the radiator, a suction portion (16b) for sucking the refrigerant by the flow of the refrigerant ejected from the nozzle portion, and a refrigerant ejected from the nozzle portion and the suction portion. An ejector (16) including a booster (16c) that mixes and boosts the refrigerant sucked from the
A flow rate adjusting unit (50 ) including a valve component (X1) for adjusting the flow rate of the refrigerant flowing into the suction unit is provided.
The valve parts
Bases (X11, X121, X13) in which a refrigerant chamber (X19) through which a refrigerant flows, a first refrigerant hole (X16) communicating with the refrigerant chamber, and a second refrigerant hole (X17) communicating with the refrigerant chamber are formed. When,
Drive units (X123, X124, X125) that displace when their temperature changes,
Amplifying units (X126, X127) that amplify the displacement due to changes in the temperature of the driving unit, and
A movable unit (X128) that switches communication and interruption between the first refrigerant hole and the second refrigerant hole via the refrigerant chamber by transmitting the displacement amplified by the amplification unit and moving in the refrigerant chamber. ) And,
When the drive unit is displaced due to a change in temperature, the drive unit biases the amplification unit at the urging position (XP2), so that the amplification unit is displaced with the hinge (XP0) as a fulcrum and the above. The amplification unit urges the movable portion at the connection position (XP3) between the amplification unit and the movable portion.
Than the distance from the hinge to the urging position, towards the distance from the hinge to the connecting position is rather long,
The ejector type refrigeration cycle device is
A branch portion (20) that branches the refrigerant flowing out of the radiator into one refrigerant and the other refrigerant.
The first evaporator (18) that evaporates the refrigerant and
It is equipped with a second evaporator (24) that evaporates the refrigerant.
The branch portion, the ejector, and the first evaporator are connected so that one of the refrigerants flows in the order of the nozzle portion, the boosting portion, and the first evaporator.
The branch portion, the flow rate adjusting portion, the second evaporator, and the ejector are connected so that the other refrigerant flows in the order of the flow rate adjusting unit, the second evaporator, and the suction unit.
The flow rate adjusting unit (50) adjusts the flow rate of the refrigerant flowing into the second evaporator and reduces the pressure of the refrigerant flowing into the second evaporator.
The flow rate adjusting unit (50) includes a flow path forming component (51, X2) that forms a refrigerant flow path from the refrigerant inlet portion (51a) of the flow rate adjusting unit to the refrigerant outlet portion (51b) of the flow rate adjusting unit. ,
It has an on-off valve (50a) that opens and closes the refrigerant flow path.
The refrigerant flow path includes a fixed throttle (50b) and a bypass flow path (XV1, XV2, 55a, 55b) for guiding the refrigerant flowing from the refrigerant inlet portion to the refrigerant outlet portion by bypassing the fixed throttle portion. Including
The valve component is an ejector type refrigeration cycle device that opens and closes the bypass flow path and reduces the pressure of the refrigerant flowing through the bypass flow path when the bypass flow path is open. It is an ejector type refrigeration cycle device.
A compressor (12) that compresses and discharges the refrigerant,
A radiator (14) that dissipates heat from the refrigerant discharged from the compressor, and
A nozzle portion (16a) for ejecting the refrigerant flowing out of the radiator, a suction portion (16b) for sucking the refrigerant by the flow of the refrigerant ejected from the nozzle portion, and a refrigerant ejected from the nozzle portion and the suction portion. An ejector (16) including a booster (16c) that mixes and boosts the refrigerant sucked from the
A flow rate adjusting unit (68 ) including a valve component (X1) for adjusting the flow rate of the refrigerant flowing into the suction unit is provided.
The valve parts
Bases (X11, X121, X13) in which a refrigerant chamber (X19) through which a refrigerant flows, a first refrigerant hole (X16) communicating with the refrigerant chamber, and a second refrigerant hole (X17) communicating with the refrigerant chamber are formed. When,
Drive units (X123, X124, X125) that displace when their temperature changes,
Amplifying units (X126, X127) that amplify the displacement due to changes in the temperature of the driving unit, and
A movable unit (X128) that switches communication and interruption between the first refrigerant hole and the second refrigerant hole via the refrigerant chamber by transmitting the displacement amplified by the amplification unit and moving in the refrigerant chamber. ) And,
When the drive unit is displaced due to a change in temperature, the drive unit biases the amplification unit at the urging position (XP2), so that the amplification unit is displaced with the hinge (XP0) as a fulcrum and the above. The amplification unit urges the movable portion at the connection position (XP3) between the amplification unit and the movable portion.
Than the distance from the hinge to the urging position, towards the distance from the hinge to the connecting position is rather long,
The ejector type refrigeration cycle device is
A gas-liquid separator (60) that separates the refrigerant flowing out from the booster into a gas-phase refrigerant and a liquid-phase refrigerant, and causes the separated vapor-phase refrigerant to flow into the compressor.
An evaporator (62) that evaporates the liquid-phase refrigerant separated by the gas-liquid separator and causes the evaporated refrigerant to flow into the suction unit.
A bypass flow path (64) for bypassing the ejector and the gas-liquid separator and guiding the refrigerant flowing out of the radiator to the evaporator is provided.
The flow rate adjusting unit (68) is an ejector type refrigeration cycle device that adjusts the flow rate of the refrigerant flowing through the bypass flow path and reduces the pressure of the refrigerant flowing through the bypass flow path. The ejector-type refrigeration according to claim 1 or 2 , wherein the valve component includes a failure detection unit (X50) that outputs a signal for determining whether the valve component is operating normally or has failed. Cycle device. The ejector type refrigeration cycle apparatus according to claim 3 , wherein the signal is a signal corresponding to the amount of distortion of the amplification unit. The drive unit generates heat when energized and generates heat.
The ejector type refrigeration cycle device according to claim 3 or 4 , wherein the failure detection unit outputs the signal to a device (X55) that stops energization of the valve component when the valve component is out of order. The third or fourth aspect of the present invention, wherein the failure detection unit outputs the signal to a device (X55) that operates a notification device (X56) that notifies a person when the valve component is out of order. Ejector type refrigeration cycle device. The ejector type refrigeration cycle apparatus according to any one of claims 1 to 6 , wherein the valve component is composed of a semiconductor chip.

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