JP6949675B2 - Processing equipment, inspection equipment and processing method - Google Patents

Description

The present invention relates to a processing device that executes a calculation process for calculating the Q value of a measurement target, an inspection method for inspecting the measurement target based on the Q value, and a processing method for executing the calculation process for calculating the Q value of the measurement target. It is a thing.

As a processing device of this type, an impedance measuring device disclosed by the applicant in Patent Document 1 below is known. This impedance measuring device includes a controller, a first measuring means, and a second measuring means, and is configured to be able to calculate the Q value of the inductor element and determine the quality of the inductor element based on the Q value. In this case, the first measuring means measures the DC resistance value Rdc4 of the inductor element by a four-terminal measuring method using a DC signal. The second measuring means measures the DC resistance value Rdc2 of the inductor element by a two-terminal measuring method using a DC signal, and also measures the effective resistance value Rs and the inductance value of the inductor element by a two-terminal measuring method using a high-frequency signal. Measure L. Further, the controller controls the first measuring means and the second measuring means, and determines the quality of the inductor element based on the Q value calculated using each measured value Rdc4, Rdc2, Rs, L. In this impedance measuring device, in order to reduce the influence of the contact resistance value Rc of the measuring probe when the second measuring means performs the measurement by the two-terminal measuring method, the difference value between Rdc2 and Rdc4 is set as the contact resistance value Rc ( Rc = Rdc2-Rdc4), the effective resistance value Rs is corrected by the contact resistance value Rc, and the Q value is calculated using the correction value Rs'(Rs' = Rs-Rc).

Japanese Unexamined Patent Publication No. 2015-125135 (Page 5-8, Fig. 1-2)

However, the above impedance measuring device has the following problems to be improved. Specifically, in the above impedance measuring device, the second measuring means executes the measurement of the DC resistance value Rdc2 only once before or after the measurement of the effective resistance value Rs, and the DC resistance value is measured. The effective resistance value Rs is corrected by the contact resistance value Rc obtained from Rdc2. In this case, when the contact resistance value Rc at the measurement time of the DC resistance value Rdc2 and the contact resistance value Rc at the measurement time of the effective resistance value Rs are different, that is, when the contact resistance value Rc changes between the two measurement times. The effective resistance value Rs is corrected with a contact resistance value Rc different from the actual contact resistance value Rc, and at this time, it becomes difficult to accurately calculate the Q value. In particular, when the contact resistance value Rc at the measurement time of the effective resistance value Rs is smaller than the contact resistance value Rc at the measurement time of the DC resistance value Rdc2, the correction is made more than the actual effective resistance value Rs not including the contact resistance value Rc. As a result, the value Rs'(effective resistance value Rs after correction) becomes smaller and the Q value (ωL / Rs') becomes larger than the actual value, and as a result, when inspecting the inductor element based on the Q value, it is actually May determine a defective inductor element with a small Q value as a good product.

The present invention has been made in view of the problem to be improved, and is a processing device, an inspection device, and a processing method capable of calculating a Q value capable of improving the inspection accuracy in the quality inspection of the measurement target using the Q value. The main purpose is to provide.

In order to achieve the above object, the processing apparatus according to claim 1 has a first measuring unit that executes a first measurement process for measuring a DC resistance value of a measurement target by a four-terminal method, and a DC resistance value of the measurement target of 2. A second measuring unit that executes a second measurement process for measuring by the terminal method and a third measurement process for measuring the AC resistance value and the inductance value of the measurement target by the two-terminal method, and each of the DC resistance values and the AC. A processing device including a processing unit that executes a calculation process for calculating the Q value of the measurement target based on the resistance value and the inductance value, and the second measurement unit performs the second measurement process. 3 Execution before and after the execution of the measurement process, the processing unit performs the minimum DC resistance value among the DC resistance values measured by each of the second measurement processes and the DC measured by the first measurement process. A difference value from the resistance value is obtained, a correction process for correcting the AC resistance value is executed using the difference value, and the calculation process is executed using the correction resistance value corrected by the correction process.

Further, the processing apparatus according to claim 2 is the processing apparatus according to claim 1, wherein the second measuring unit is at least one of before the execution of the third measurement process and after the execution of the third measurement process. 2 Execute the measurement process multiple times.

Further, the processing apparatus according to claim 3 is the processing apparatus according to claim 1 or 2, and the processing unit obtains the difference value by multiplying the difference value by a predetermined coefficient of 0 or more and 1 or less in the correction processing. The value is subtracted from the AC resistance value to correct the AC resistance value.

Further, the processing apparatus according to claim 4 is the processing apparatus according to any one of claims 1 to 3, wherein the processing unit performs the correction process when the difference value is larger than a preset set value. The calculation process is executed using the corrected resistance value that has been executed and corrected, and when the difference value is equal to or less than the set value, the calculation process is executed using the AC resistance value before the correction process.

The inspection device according to claim 5 includes the processing device according to any one of claims 1 to 4, and an inspection unit that inspects the quality of the measurement target based on the Q value calculated by the processing device. It has.

The processing method according to claim 6 includes a first measurement process for measuring the DC resistance value of the measurement target by the 4-terminal method, a second measurement process for measuring the DC resistance value of the measurement target by the 2-terminal method, and the like. The third measurement process of measuring the AC resistance value and the inductance value of the measurement target by the two-terminal method is executed, and the Q value of the measurement target is calculated based on the DC resistance value, the AC resistance value, and the inductance value. This is a processing method for executing the calculation process, in which the second measurement process is executed before and after the execution of the third measurement process, and the smallest of the DC resistance values measured by each of the second measurement processes. The difference value between the DC resistance value and the DC resistance value measured by the first measurement process is obtained, a correction process for correcting the AC resistance value is executed using the difference value, and the correction corrected by the correction process is performed. The calculation process is executed using the resistance value.

In the processing apparatus according to claim 1, the inspection apparatus according to claim 5, and the processing method according to claim 6, the second measurement process is executed before and after the execution of the third measurement process, and the measurement is performed by each of the second measurement processes. The AC resistance value is corrected using the difference between the smallest DC resistance value among the DC resistance values and the DC resistance value measured by the first measurement process, and the Q value is calculated using the corrected corrected resistance value. calculate. In this case, in the configuration and method of calculating the Q value using the DC resistance value measured by executing the second measurement process only once, when the contact resistance value changes with the passage of time, the one time. When the contact resistance value included in the DC resistance value measured by the second measurement process is larger than the contact resistance value included in the AC resistance value, the corrected resistance value corrected using the DC resistance value is the actual measurement target. The value is smaller than the AC resistance value of, and the calculated Q value calculated using this corrected resistance value is larger than the actual Q value of the measurement target. As a result, the Q value is actually small. There is a risk of erroneously determining the target as a non-defective product. On the other hand, in this processing device, inspection device, and processing method, the smallest DC resistance value among the DC resistance values measured in each of the second measurement processes executed before and after the execution of the third measurement process is used. As a result of avoiding that the corrected corrected resistance value becomes smaller than the actual AC resistance value of the measurement target, the situation where the calculated value of the Q value becomes larger than the actual Q value is surely made. Can be prevented. Therefore, according to this processing device, inspection device, and processing method, it is possible to calculate a Q value that can sufficiently improve the inspection accuracy in the quality inspection of the measurement target using the Q value.

Further, according to the processing device according to claim 2 and the inspection device according to claim 5, the second measurement process is executed a plurality of times before the execution of the third measurement process and after the execution of the third measurement process. Even when the contact resistance value changes irregularly, the number of executions of the second measurement process is increased and the smallest DC resistance value among the DC resistance values measured in each second measurement process is used. It is possible to more reliably prevent a situation in which the calculated value of the Q value becomes larger than the actual Q value.

Further, in the processing apparatus according to claim 3 and the inspection apparatus according to claim 5, in the correction processing, the value obtained by multiplying the difference value by a coefficient of 0 or more and 1 or less is subtracted from the AC resistance value to obtain the AC resistance value. to correct. In this case, the corrected resistance value corrected by the value obtained by multiplying the difference value by the coefficient does not become smaller than the corrected resistance value corrected by the difference value. Therefore, according to this processing device, inspection device, and processing method, it is possible to surely prevent the corrected resistance value from becoming smaller than the actual AC resistance value of the measurement target, and as a result, the calculated value of the Q value. Can be more reliably prevented from becoming a value larger than the actual Q value.

Further, in the processing apparatus according to claim 4 and the inspection apparatus according to claim 5, when the difference value is larger than the preset set value, the correction process is executed and the corrected resistance value is used to correct the Q value. Is calculated, and when the difference value is equal to or less than the set value, the Q value is calculated using the AC resistance value before the correction processing. Therefore, according to this processing device, inspection device, and processing method, for example, by setting the upper limit value of the contact resistance value that normally occurs when a probe in a good state is used as a set value, the difference value becomes a set value. The correction process should be performed only when it is larger than the set value and the need to correct the AC resistance value is high, and when the difference value is less than or equal to the set value and the need to correct the AC resistance value is low, the correction process should not be performed. Therefore, it is possible to more reliably prevent a situation in which a calculated value larger than the actual Q value is calculated by a correction that is less necessary.

It is a block diagram which shows the structure of inspection apparatus 1. It is explanatory drawing explaining the 1st measurement process. It is explanatory drawing explaining the 2nd measurement process and the 3rd measurement process. It is a flowchart of inspection process 50. It is a flowchart of the calculation process 70. It is explanatory drawing which explains the calculation process 70.

Hereinafter, embodiments of a processing apparatus, an inspection apparatus, and a processing method will be described with reference to the accompanying drawings.

First, the configuration of the inspection device 1 shown in FIG. 1 will be described. The inspection device 1 is an example of an inspection device, and is configured to be able to calculate the Q value of the inductor element 100 as an example of the measurement target and to inspect the quality of the inductor element 100 based on the calculated Q value Qc. ing. Specifically, as shown in the figure, the inspection device 1 includes a first measurement unit 11, a second measurement unit 12, an operation unit 13, a storage unit 14, a display unit 15, a transport mechanism 16, and a processing unit 17. It is composed of. In this case, the processing device is configured by a portion of the inspection device 1 excluding the inspection function described later.

The first measuring unit 11 includes a moving mechanism (not shown) for moving the probes 31a to 31d, a current output unit 11a, and a voltage detecting unit 11b (see FIG. 2), and is an inductor under the control of the processing unit 17. The first measurement process of measuring the DC resistance value Rd1 of the element 100 by the four-terminal method is executed. Specifically, in the first measurement process, as shown in the figure, the moving mechanism of the first measurement unit 11 brings the probes 31a and 31c into contact with the terminals 101a of the inductor element 100 conveyed to the measurement position P1. The probes 31b and 31d are brought into contact with the terminal 101b of the inductor element 100, the current output unit 11a outputs a direct current and supplies it to the inductor element 100 via the probes 31a and 31b, and the voltage detection unit 11b is the terminal 101a. , The voltage value between 101b is detected via the probes 31c and 31d. Further, the first measuring unit 11 measures the DC resistance value Rd1 based on the detected voltage value and the current value of the supplied DC current.

The second measuring unit 12 includes a moving mechanism (not shown) for moving the probes 32a and 32b, a current output unit 12a and a voltage detecting unit 12b (see FIG. 3), and an inductor is controlled by the processing unit 17. The second measurement process for measuring the DC resistance value Rd2 of the element 100 by the two-terminal method, and the third measurement process for measuring the AC resistance value Ra (effective resistance value) and the inductance value L of the inductor element 100 by the two-terminal method, respectively. Run. Specifically, in the second measurement process, the moving mechanism of the second measurement unit 12 connects the probes 32a and 32b to the terminals 101a and 101b of the inductor element 100 conveyed to the measurement position P2, respectively, as shown in the figure. Upon contact, the current output unit 12a outputs a direct current and supplies it to the inductor element 100 via the probes 32a and 32b, and the voltage detection unit 11b transfers the voltage value between the terminals 101a and 101b via the probes 32a and 32b. To detect. Further, the second measuring unit 12 measures the DC resistance value Rd2 based on the detected voltage value and the current value of the supplied DC current.

Further, in the third measurement process, the moving mechanism of the second measurement unit 12 maintains a state in which the probes 32a and 32b are in contact with the terminals 101a and 101b of the inductor element 100, respectively (see FIG. 3), and the current output unit 12a Outputs an AC current and supplies it to the inductor element 100 via the probes 32a and 32b, and the voltage detection unit 12b detects the AC voltage value between the terminals 101a and 101b via the probes 32a and 32b. Further, the second measuring unit 12 sets the AC resistance value based on the AC voltage value (effective voltage value), the AC current value of the supplied AC current (effective current value), and the phase difference between the AC voltage and the AC current. Ra and the inductance value L are measured.

The operation unit 13 is configured to include various buttons and keys, and outputs an operation signal when these are operated.

The storage unit 14 stores the DC resistance value Rd1 measured by the first measuring unit 11, and also stores the DC resistance value Rd2, the AC resistance value Ra, and the inductance value L measured by the second measuring unit 12. Further, the storage unit 14 stores the calculated Q value Qc of the Q value calculated in the inspection process 50, which will be described later, which is executed by the processing unit 17. Further, the storage unit 14 stores the reference value Qr of the Q value used in the inspection process 50, the set value Rr used in the calculation process 70 executed in the inspection process 50, and the coefficient Kc.

The display unit 15 displays the calculated Q value Qc calculated in the inspection process 50 executed by the processing unit 17 and the inspection result of the quality of the inductor element 100 inspected in the inspection process 50 under the control of the processing unit 17. indicate.

The transport mechanism 16 is a supply position where the inductor element 100 is supplied by a supply device (not shown) under the control of the processing unit 17, and a measurement position P1 where the first measurement process is executed by the first measurement unit 11 (see FIG. 2). , The measurement position P2 (see FIG. 3) where the second measurement process and the third measurement process are executed by the second measurement unit 12, and the inductor element 100 for which each measurement process and inspection have been completed are carried out by an carry-out device (not shown). The inductor element 100 is conveyed to the carry-out position.

The processing unit 17 controls each component constituting the inspection device 1 according to an operation signal output from the operation unit 13. Further, the processing unit 17 executes the calculation process 70 shown in FIG. 5 to calculate the Q value of the inductor element 100 based on the DC resistance values Rd1 and Rd2, the AC resistance value Ra, and the inductance value L. Further, the processing unit 17 functions as an inspection unit, executes the inspection process 50 shown in FIG. 4, and has an inspection function of inspecting the quality of the inductor element 100 based on the calculated Q value Qc.

Next, refer to the drawings for a processing method for calculating the Q value of the inductor element 100 as a measurement target using the inspection device 1 and an inspection method for inspecting the quality of the inductor element 100 based on the calculated value Qc of the Q value. I will explain.

First, the operation unit 13 is operated to instruct the start of the inspection. At this time, the operation unit 13 outputs an operation signal, and the processing unit 17 executes the inspection process 50 shown in FIG. 4 according to the operation signal. In this inspection process 50, the processing unit 17 controls the transport mechanism 16 to transport the inductor element 100 supplied to the supply position by the supply device (not shown) to the measurement position P1 shown in FIG. 2 (step 51).

Next, the processing unit 17 controls the first measurement unit 11 to execute the first measurement process (step 52). In this first measurement process, the first measurement unit 11 operates a movement mechanism (not shown) to move the probes 31a to 31d, and as shown in FIG. 2, the terminal of the inductor element 100 conveyed to the measurement position P1. The probes 31a and 31c are brought into contact with 101a, and the probes 31b and 31d are brought into contact with the terminal 101b of the inductor element 100.

Subsequently, the current output unit 11a of the first measurement unit 11 outputs a direct current and supplies it to the inductor element 100 via the probes 31a and 31b. Next, the voltage detection unit 11b of the first measurement unit 11 detects the voltage value between the terminals 101a and 101b via the probes 31c and 31d. Subsequently, the first measuring unit 11 measures the DC resistance value Rd1 of the inductor element 100 based on the detected voltage value and the current value of the supplied DC current. Next, the processing unit 17 stores the measured DC resistance value Rd1 in the storage unit 14.

In this case, in the resistance measurement by the four-terminal method using the four probes 31a to 31d as described above, the influence of the contact resistance generated at the contact portion between the probes 31a to 31d and the terminals 101a and 101b can be sufficiently suppressed. It is possible to measure the DC resistance value Rd1 in which the contact resistance value (hereinafter, also referred to as “contact resistance value Rc”) is not included (or is almost not included).

Subsequently, the processing unit 17 controls the transport mechanism 16 to transport the inductor element 100 from the measurement position P1 to the measurement position P2 shown in FIG. 3 (step 53).

Next, the processing unit 17 controls the second measurement unit 12 to execute the second measurement process (the second measurement process before the execution of the third measurement process) (step 54). In this second measurement process, the second measurement unit 12 operates a movement mechanism (not shown) to move the probes 32a and 32b, and as shown in FIG. 3, the terminal of the inductor element 100 conveyed to the measurement position P2. The probes 32a and 32b are brought into contact with the 101a and 101b, respectively.

Subsequently, the current output unit 12a of the second measurement unit 12 outputs a direct current and supplies it to the inductor element 100 via the probes 32a and 32b. Next, the voltage detection unit 12b of the current output unit 12a detects the voltage value between the terminals 101a and 101b via the probes 32a and 32b. Subsequently, the second measuring unit 12 measures the DC resistance value Rd2 of the inductor element 100 based on the detected voltage value and the current value of the supplied DC current. Next, the processing unit 17 stores the measured DC resistance value Rd2 in the storage unit 14.

In this case, as described above, in the resistance measurement by the two-terminal method using the two probes 32a and 32b, the influence of the contact resistance generated at the contact portion between the probes 32a and 32b and the terminals 101a and 101b cannot be suppressed, so that direct current is used. The resistance value Rd2 includes a contact resistance value Rc.

Subsequently, the processing unit 17 controls the second measurement unit 12 to execute the second measurement process a plurality of times (for example, three times) at predetermined time intervals, and the measurement is performed in each second measurement process. Each DC resistance value Rd2 is stored in the storage unit 14.

Next, the processing unit 17 controls the second measurement unit 12 to execute the third measurement process (step 55). In this third measurement process, as shown in FIG. 3, the second measurement unit 12 causes the current output unit 12a to make an alternating current in a state where the probes 32a and 32b are in contact with the terminals 101a and 101b of the inductor element 100, respectively. Is output and supplied to the inductor element 100 via the probes 32a and 32b. Subsequently, the voltage detection unit 12b detects the AC voltage value between the terminals 101a and 101b via the probes 32a and 32b. Next, the second measuring unit 12 determines the inductor element 100 based on the AC voltage value (effective voltage value), the AC current value of the supplied AC current (effective current value), and the phase difference between the AC voltage and the AC current. The AC resistance value Ra and the inductance value L are measured. Subsequently, the processing unit 17 stores the measured AC resistance value Ra and the inductance value L in the storage unit 14.

Next, the processing unit 17 controls the second measurement unit 12 to execute the above-mentioned second measurement process (second measurement process after the execution of the third measurement process) (step 56). In this case, the processing unit 17 executes the second measurement process a plurality of times (for example, three times) at predetermined time intervals, and stores each DC resistance value Rd2 measured in each second measurement process in the storage unit 14. To memorize.

Subsequently, the processing unit 17 executes the calculation process 70 (step 57). In this calculation process 70, as shown in FIG. 5, the processing unit 17 reads out each DC resistance value Rd2 stored in the storage unit 14, and from among them, the minimum DC resistance value Rd2 (hereinafter, the minimum DC resistance). The value Rd2 is also referred to as “DC resistance value Rd2s”) (step 71).

Next, the processing unit 17 reads out the DC resistance value Rd1 stored in the storage unit 14 and calculates the difference value Rm (Rd2s-Rd1) between the DC resistance value Rd2s and the DC resistance value Rd1 (step 72). In this case, as described above, since the DC resistance value Rd2s includes the contact resistance value Rc and the DC resistance value Rd1 does not include the contact resistance value Rc, the difference value Rm corresponds to the contact resistance value Rc. do.

Subsequently, the processing unit 17 reads the set value Rr stored in the storage unit 14 and determines whether or not the difference value Rm is larger than the set value Rr (step 73). In this case, the upper limit of the contact resistance value Rc that normally occurs when the probes 32a and 32b in a good state in which the tip portion is not worn or oxidized is used is preset as the set value Rr.

When the processing unit 17 determines in step 73 that the difference value Rm is larger than the set value Rr, the processing unit 17 reads out the coefficient Kc stored in the storage unit 14 and multiplies the difference value Rm by the coefficient Kc to obtain the correction value Rm. '(Rm × Kc) is calculated (step 74). In this case, the coefficient Kc is arbitrarily defined in the range of 0 or more and 1 or less. By defining the coefficient Kc to 1 (that is, letting the correction value Rm'be the difference value Rm), the AC resistance value Ra described later can be corrected by using the difference value Rm as it is, and the coefficient Kc can be set. By defining it as 0 (that is, setting the correction value Rm'to 0), it is possible not to correct the AC resistance value Ra.

Next, the processing unit 17 reads the AC resistance value Ra stored in the storage unit 14 and executes a correction process of subtracting the correction value Rm'from the AC resistance value Ra to calculate the corrected correction resistance value Ra'. (Step 75). In this case, since the correction value Rm'is a value obtained by multiplying the difference value Rm corresponding to the contact resistance value Rc by the coefficient Kc as described above, the correction value Rm'is subtracted from the AC resistance value Ra. The resistance value corresponding to the contact resistance value Rc or the resistance value smaller than the contact resistance value Rc can be excluded from the AC resistance value Ra.

Subsequently, the processing unit 17 calculates the Q value of the inductor element 100 using the correction resistance value Ra'(step 76). In this case, if the calculated value of the Q value is Qc, the angular frequency of the alternating current in the third measurement process is ω, and the inductance value of the inductor element 100 is L, then Qc = ωL / Ra'.

Here, for example, as shown in FIG. 6, the contact resistance value Rc changes with the passage of time due to the electrical characteristics of the inductor element 100 and the inspection device 1, the measurement environment, and the like (in the example of the figure). , Decreases with the passage of time), the time when the AC resistance value Ra is measured (the time when the third measurement process is executed) and the time when the DC resistance value Rd2 is measured (the time when the second measurement process is executed). Therefore, the contact resistance value Rc included in the DC resistance value Rd2 and the contact resistance value Rc included in the AC resistance value Ra are different. In this case, the DC resistance value Rd2 including the contact resistance value Rc larger than the contact resistance value Rc included in the AC resistance value Ra (in the example of the figure, the measurement was performed by the second measurement process executed before the third measurement process. When the AC resistance value Ra is corrected by the correction value Rm'based on the difference value Rm between the DC resistance value Rd2) and the DC resistance value Rd1, the corrected correction resistance value Ra'does not include the contact resistance value Rc. The value may be smaller than the actual AC resistance value Ra of 100, and the calculated Q value Qc of the Q value calculated using such a correction resistance value Ra'is larger than the actual Q value of the inductor element 100. It becomes a value. Therefore, in the configuration and method using the DC resistance value Rd2 measured by executing the second measurement process only once, the contact resistance value Rc included in the DC resistance value Rd2 is included in the AC resistance value Ra. When it is larger than Rc, the calculated value Qc of the Q value becomes a value larger than the actual Q value of the inductor element 100, and there is a possibility that the defective inductor element 100 having a small Q value is erroneously determined as a good product.

On the other hand, in this inspection device 1, as described above, the second measurement process is executed before and after the execution of the third measurement process, and the minimum of the DC resistance values Rd2 measured in each second measurement process is the smallest. The AC resistance value Ra is corrected by the correction value Rm'based on the difference value Rm between the DC resistance value Rd2 and the DC resistance value Rd1. Therefore, in this inspection device 1, the correction resistance value Ra'is smaller than the actual AC resistance value Ra of the inductor element 100, and the calculated Q value Qc is larger than the actual Q value of the inductor element 100. It is possible to reliably prevent a situation in which a defective inductor element 100, which has a large value and a small Q value, is erroneously determined to be a good product.

On the other hand, when the processing unit 17 determines in step 73 that the difference value Rm is equal to or less than the set value Rr, the inductor element uses the AC resistance value Ra before the correction processing without executing steps 74 and 75. A Q value of 100 is calculated (step 76). That is, in this inspection device 1, the difference value Rm is larger than the set value Rr, which is the contact resistance value Rc when the probes 32a and 32b in good condition are used, and it is necessary to correct the AC resistance value Ra. A configuration and method are adopted in which the correction process is performed when the value is high, and the correction process is not performed when the difference value Rm is equal to or less than the set value Rr and the need for correcting the AC resistance value Ra is low.

Next, the processing unit 17 stores the calculated Q value Qc in the storage unit 14, displays it on the display unit 15, ends the calculation process 70, and then performs step 58 of the inspection process 50 shown in FIG. Run. In this step 58, the processing unit 17 reads out the calculated value Qc and the reference value Qr stored in the storage unit 14, and compares the calculated value Qc with the reference value Qr. In this case, the processing unit 17 determines that the inductor element 100 is a non-defective product when the calculated value Qc is equal to or greater than the reference value Qr, and determines that the inductor element 100 is a defective product when the calculated value Qc is less than the reference value Qr. Next, the processing unit 17 causes the display unit 15 to display the inspection result (determination result).

Subsequently, the processing unit 17 controls the transport mechanism 16 to transport the inductor element 100 from the measurement position P2 to the carry-out position (step 59), and ends the inspection process 50.

As described above, in this processing device, the inspection device 1, and the processing method, the second measurement process is executed before and after the execution of the third measurement process, and the most of the DC resistance values Rd2 measured by each of the second measurement processes. The AC resistance value Ra is corrected by using the difference value between the small DC resistance value Rd2 and the DC resistance value Rd1 measured by the first measurement process, and the Q value is calculated by using the corrected corrected resistance value Ra'. In this case, in the configuration and method of calculating the Q value using the DC resistance value Rd2 measured by executing the second measurement process only once, the DC resistance value Rc changes with the passage of time. When the contact resistance value Rc included in the resistance value Rd2 is larger than the contact resistance value Rc included in the AC resistance value Ra, the corrected resistance value Ra'corrected using the DC resistance value Rd2 is the actual correction resistance value Ra'of the inductor element 100. The value is smaller than the AC resistance value Ra, and the calculated Q value Qc calculated using this correction resistance value Ra'is larger than the actual Q value of the inductor element 100. As a result, the Q value is actually There is a risk that a small defective inductor element 100 may be erroneously determined as a non-defective product. On the other hand, in this processing device, the inspection device 1, and the processing method, the minimum DC resistance value Rd2 among the DC resistance values Rd2 measured in each of the second measurement processes executed before and after the execution of the third measurement process is set. Therefore, it is possible to prevent the corrected correction resistance value Ra'being smaller than the actual AC resistance value Ra of the inductor element 100, and as a result, the calculated value Qc of the Q value is larger than the actual Q value. It is possible to surely prevent a situation that becomes a value. Therefore, according to the processing device, the inspection device 1, and the processing method, it is possible to calculate the Q value that can sufficiently improve the inspection accuracy in the quality inspection of the inductor element 100 using the Q value.

Further, according to the processing device, the inspection device 1, and the processing method, the contact resistance value Rc is increased by executing the second measurement process a plurality of times before the execution of the third measurement process and after the execution of the third measurement process. Even in the case of irregular changes, the Q value can be calculated by increasing the number of executions of the second measurement process and using the smallest DC resistance value Rd2 among the DC resistance values Rd2 measured in each second measurement process. It is possible to more reliably prevent a situation in which the calculated value Qc becomes a value larger than the actual Q value.

Further, in this processing device, the inspection device 1, and the processing method, in the correction processing, the correction value Rm'obtained by multiplying the difference value Rm by a coefficient Kc of 0 or more and 1 or less is subtracted from the AC resistance value Ra to obtain the AC resistance value Ra. To correct. In this case, the correction resistance value Ra'corrected by the correction value Rm'is not smaller than the correction resistance value Ra'corrected by the difference value Rm. Therefore, according to the processing device, the inspection device 1, and the processing method, it is possible to surely prevent the correction resistance value Ra'being smaller than the actual AC resistance value Ra of the inductor element 100. It is possible to more reliably prevent a situation in which the calculated value Qc of the Q value becomes a value larger than the actual Q value.

Further, in this processing device, the inspection device 1, and the processing method, when the difference value Rm is larger than the preset set value Rr, the correction process is executed and the corrected resistance value Ra'is used to calculate the Q value. Then, when the difference value Rm is equal to or less than the set value Rr, the Q value is calculated using the AC resistance value Ra before the correction process. Therefore, according to the processing device, the inspection device 1, and the processing method, for example, by setting the upper limit value of the contact resistance value Rc that normally occurs when the probes 32a and 32b in good condition are used as the set value Rr. , The correction process is performed only when the difference value Rm is larger than the set value Rr and it is highly necessary to correct the AC resistance value Ra, and when the difference value Rm is equal to or less than the set value Rr, it is necessary to correct the AC resistance value Ra. When it is low, it is possible to prevent the correction process from being performed, so that it is possible to more reliably prevent a situation in which a calculated value Qc larger than the actual Q value is calculated by a correction that is less necessary.

The processing device, the inspection device 1, and the processing method are not limited to the above configurations and methods. For example, the example in which the second measurement process is executed a plurality of times before and after the execution of the third measurement process has been described above, but the second measurement process is performed either before the execution of the third measurement process or after the execution of the third measurement process. It is also possible to adopt a configuration and method in which the above is executed a plurality of times and the other is executed once. Further, it is also possible to adopt a configuration and method in which the second measurement process is executed only once before and after the execution of the third measurement process.

Further, in the calculation process 70, the correction value Rm'is calculated by multiplying the difference value Rm by the coefficient Kc, and the AC resistance value Ra is corrected by the correction value Rm'. It is also possible to adopt a configuration and a method of correcting the AC resistance value Ra by using the difference value Rm as it is.

Further, in the calculation process 70, the configuration and method of determining whether or not the difference value Rm is larger than the set value Rr and executing the correction process only when the difference value Rm is larger than the set value Rr have been described above. It is also possible to adopt a configuration and method in which the correction process is always executed without performing the determination process.

Further, although the example applied to the inspection device 1 provided with the conveying mechanism 16 and automatically conveying the inductor element 100 has been described above, the inspection device for inspecting the inductor element 100 manually conveyed without the conveying mechanism 16 It can also be applied. Further, an example in which the first measuring unit 11 and the second measuring unit 12 are provided with a moving mechanism and the probes 31a to 31d and the probes 32a and 32b are brought into contact with the terminals 101a and 101b of the inductor element 100 by the moving mechanism has been described above. It is also possible to adopt a configuration and method in which the probes 31a to 31d and the probes 32a and 32b are manually brought into contact with the terminals 101a and 101b.

Further, although the example applied to the inspection device 1 that inspects the inductor element 100 based on the Q value has been described above, it can also be applied to a processing device that does not have an inspection function (has only a function of calculating the Q value). can.

Further, the measurement target is not limited to the above-mentioned inductor element 100, and various electronic components that use the Q value for the quality inspection can be the measurement target.

1 Inspection device 11 1st measurement unit 12 2nd measurement unit 17 Processing unit 100 Inductor element Kc coefficient L Inductance value Qc Calculated value Ra AC resistance value Ra'Correction resistance value Rd1 DC resistance value Rd2 DC resistance value Rd2s DC resistance value Rm Difference Value Rr set value

Claims (6)

The first measuring unit that executes the first measurement process that measures the DC resistance value of the measurement target by the 4-terminal method, the second measurement process that measures the DC resistance value of the measurement target by the 2-terminal method, and the measurement target The second measuring unit that executes the third measurement process that measures the AC resistance value and the inductance value by the two-terminal method, and the Q value of the measurement target based on each of the DC resistance values, the AC resistance value, and the inductance value. It is a processing device provided with a processing unit that executes a calculation process for calculating.
The second measurement unit executes the second measurement process before and after the execution of the third measurement process.
The processing unit obtains a difference value between the minimum DC resistance value among the DC resistance values measured by each of the second measurement processes and the DC resistance value measured by the first measurement process. A processing device that executes a correction process for correcting the AC resistance value using the difference value, and executes the calculation process using the correction resistance value corrected by the correction process. The processing apparatus according to claim 1, wherein the second measurement unit executes the second measurement process a plurality of times before the execution of the third measurement process and at least one after the execution of the third measurement process. Claim 1 or 2 in which the processing unit corrects the AC resistance value by subtracting a value obtained by multiplying the difference value by a predetermined coefficient of 0 or more and 1 or less from the AC resistance value in the correction processing. The processing device described. The processing unit executes the calculation process using the correction resistance value corrected by executing the correction process when the difference value is larger than the preset set value, and the difference value is the set value. The processing apparatus according to any one of claims 1 to 3, which executes the calculation process using the AC resistance value before the correction process in the following cases. An inspection device including the processing device according to any one of claims 1 to 4 and an inspection unit that inspects the quality of the measurement target based on the Q value calculated by the processing device. The first measurement process for measuring the DC resistance value of the measurement target by the 4-terminal method, the second measurement process for measuring the DC resistance value of the measurement target by the 2-terminal method, and the AC resistance value and inductance value of the measurement target, respectively. It is a processing method that executes a third measurement process that measures by the two-terminal method, and executes a calculation process that calculates the Q value of the measurement target based on the DC resistance value, the AC resistance value, and the inductance value. ,
The second measurement process is executed before and after the execution of the third measurement process.
The difference value between the minimum DC resistance value among the DC resistance values measured by each of the second measurement processes and the DC resistance value measured by the first measurement process is obtained, and the difference value is used. A processing method in which a correction process for correcting an AC resistance value is executed, and the calculation process is executed using the correction resistance value corrected by the correction process.

Images