JP6946088B2 - 硬化樹脂用組成物、該組成物の硬化物、該組成物および該硬化物の製造方法、ならびに半導体装置 - Google Patents

硬化樹脂用組成物、該組成物の硬化物、該組成物および該硬化物の製造方法、ならびに半導体装置 Download PDF

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JP6946088B2
JP6946088B2 JP2017138507A JP2017138507A JP6946088B2 JP 6946088 B2 JP6946088 B2 JP 6946088B2 JP 2017138507 A JP2017138507 A JP 2017138507A JP 2017138507 A JP2017138507 A JP 2017138507A JP 6946088 B2 JP6946088 B2 JP 6946088B2
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group
composition
cured resin
compound
formula
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JP2019019217A (ja
JP2019019217A5 (enrdf_load_stackoverflow
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谷 佳 典 西
谷 佳 典 西
昌 樹 南
昌 樹 南
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Eneos Corp
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  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2017138507A 2017-07-14 2017-07-14 硬化樹脂用組成物、該組成物の硬化物、該組成物および該硬化物の製造方法、ならびに半導体装置 Active JP6946088B2 (ja)

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JP2019019217A5 JP2019019217A5 (enrdf_load_stackoverflow) 2020-09-10
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JP2022118627A (ja) * 2021-02-02 2022-08-15 Ｅｎｅｏｓ株式会社 硬化樹脂用組成物、該組成物の硬化物、該組成物および該硬化物の製造方法、ならびに半導体装置
TW202519571A (zh) * 2023-10-31 2025-05-16 日商拓自達電線股份有限公司 導電性組成物

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JP2014148562A (ja) * 2013-01-31 2014-08-21 Nippon Zeon Co Ltd 硬化性樹脂組成物、フィルム、プリプレグ、及び硬化物
KR101671877B1 (ko) * 2013-08-23 2016-11-03 엘리트 일렉트로닉 메터리얼 (쿤샨) 컴퍼니 리미티드 수지조성물, 이를 사용한 동박기판 및 인쇄회로
JP2016060809A (ja) * 2014-09-17 2016-04-25 日本ゼオン株式会社 硬化性樹脂組成物、硬化性樹脂成形体、硬化物、積層体、複合体および多層プリント配線板
JP6460899B2 (ja) * 2015-04-24 2019-01-30 積水化学工業株式会社 半導体接合用接着剤
JP6952684B2 (ja) * 2016-04-28 2021-10-20 Ｅｎｅｏｓ株式会社 硬化樹脂用組成物及びその硬化物
JP6849698B2 (ja) * 2016-12-09 2021-03-24 Ｅｎｅｏｓ株式会社 硬化樹脂用組成物、該硬化樹脂用組成物の硬化物及び硬化方法、並びに半導体装置
US11560465B2 (en) * 2017-03-31 2023-01-24 Eneos Corporation Composition for curable resin, cured product of said composition, method of producing said composition and said cured product, and semiconductor device

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