JP6935362B2 - Package for mounting light emitting element - Google Patents

Description

The present invention relates to a light emitting element mounting package for mounting a light emitting element such as a laser diode.

For example, a metal base plate, a metal frame joined on the surface thereof and having a rectangular frame shape in a plan view, and a holder formed on one side wall of the frame and attached to one end of an optical fiber to penetrate the holder. A pair of ceramic substrates arranged on an insertion portion and a pair of side walls adjacent to and facing the one side wall of the frame and individually penetrating the pair of side walls, and a pair of ceramic substrates penetrating each of the ceramic substrates, and formed. A package for optical communication including a plurality of conductor portions made of tungsten or molybdenum along the inner and outer directions of the frame and a plurality of leads individually bonded to the outer end side of the plurality of conductor portions is disclosed. (See, for example, Patent Document 1).

However, when power is applied to the light emitting element via the conductor portion as in the optical communication package, the electric resistance of the conductor portion made of tungsten or the like is high, so that the electric power to be input to the light emitting element is sufficient. Could not be increased to.
Further, since the ceramic substrate having the conductor portion is inserted into the rectangular through hole formed in the side wall of the frame and fixed, the dimensional tolerance between the inner dimension of the through hole and the outer dimension of the ceramic substrate is strict. If not managed, there is a problem that it becomes difficult to insert the ceramic substrate, or an excessive gap is formed between the ceramic substrate and the through hole, and the airtightness inside the package cannot be maintained. ..

On the other hand, in a metal and rectangular parallelepiped box-shaped package, a plurality of relay terminals are individually penetrated in a horizontal posture through a plurality of through holes formed on a pair of facing side surfaces, and a gap between the relay terminal and the through hole is provided. An airtight package structure of a semiconductor laser pump module in which each is sealed with glass solder or the like has also been proposed (see, for example, Patent Document 2).
However, according to the airtight package structure, a complicated process for individually filling the glass solder around the inserted relay terminal is required for each through hole formed on the side surface of the box-shaped package, and the airtightness is stable. There was a problem that it was difficult to maintain sex.

Japanese Unexamined Patent Publication No. 11-126840 (pages 1 to 5, FIGS. 1 to 5) Japanese Unexamined Patent Publication No. 04-88475 (pages 1 to 5, FIGS. 1 to 8)

The present invention solves the problems described in the background technology, and can easily increase the input power to the light emitting element mounted inside the package, and can reliably maintain the airtightness inside the package. The challenge is to provide.

Means for Solving Problems and Effects of Invention

In order to solve the above problems, the present invention provides an insulating member that allows a lead pin to penetrate into a first through hole that penetrates a substrate constituting the package body, supports the lead pin, and electrically insulates the lead pin from the outside. It was created with the idea of joining around one of the openings in the first through hole.
In other words, the light-emitting element mounting package (claim 1) of the present invention, the front surface and a back surface, or and including mounting portion of the light emitting element to the surface, or the mounting portion of the separate on the surface Light emitting with a substrate capable of arranging the In the device mounting package, a first through hole is formed between the front surface and the back surface of the substrate to allow the lead pin to penetrate, and the insulating member penetrates between the facing surface and the facing back surface. The lead pin has a second through hole, and the lead pin has a shaft portion penetrating the first through hole and the second through hole, a flange portion extending radially from the shaft portion, and an axial direction of the shaft portion. includes a head portion provided at one end, the diameter of the flange portion of the lead pin is larger than the diameter of the shaft portion, and the diameter of the head of the lead pin, than the diameter of the front Symbol shank In the lead pin, the flange portion is fixed to the periphery of the opening of the second through hole on the opposite back surface of the insulating member via the brazing material layer, and the lead pin shaft is formed. The portion and the inner peripheral surface of the second through hole face each other without passing through the brazing material layer, and the insulating member is fixed around the opening of the first through hole on the front surface or the back surface of the substrate. It is characterized by being.

The light emitting element mounting package has the following effects (1) to (3).
(1) Since the lead pin continuously penetrates the first through hole provided in the substrate and the second through hole provided in the insulating member, the lead pin follows the mounting portion on the surface side of the substrate. An electrical connection with the mounted light emitting element can be directly obtained via a bonding wire or the like. Therefore, it is possible to supply a sufficient current as the electric power to be input to the light emitting element increases.
(2) The lead pin is fixed to the periphery of the opening on the opposite back surface side in the second through hole of the insulating member via the flange portion extending in the radial direction thereof, and the insulating member is attached to the substrate. It is fixed around the first through hole provided. Therefore, the lead pin is provided through two joint surfaces (plane surfaces), that is, a joint surface between the flange portion and the facing back surface of the insulating member, and a joint surface between the facing surface of the insulating member and the front surface or the back surface of the substrate. Since it is supported by the substrate, the airtightness inside the package can be reliably and easily maintained without the conventional strict control of dimensional intersection.
(3) Since the diameter of the head of the lead pin is set to be larger than the diameter of the shaft portion, when an electrical connection with a light emitting element to be mounted on the mounting portion is obtained by a bonding wire or the like, the said Since the connection area of the bonding wire can be made sufficiently large, easy and reliable bonding becomes possible.

The substrate may be provided with a frame to be described later, and in addition to a form in which both the substrate and the frame are joined (brazing, welding, etc.), a metal flat plate is pressed or drawn. It may be an integral product integrally molded by plastic working. Alternatively, a box-shaped frame that is separate from the substrate and has a ceiling surface integrally may be joined after mounting the light emitting element.
Further, examples of the light emitting element include a laser diode (LD) and a light emitting diode (LED).
Further, the mounting portion of the light emitting element is at an arbitrary position on the surface of the substrate surrounded by the inner side surface of the frame, and also includes the upper surface of the main body of the heat radiating body, which will be described later.
Further, the substrate, the lead pin, and the frame described later are, for example, Kovar (Fe-29% Ni-17% Co), so-called 42 alloy (Fe-42% Ni), so-called 194 alloy (Cu-2.3% Fe). It consists of a metal such as −0.03% P).

Further, the surfaces of the substrate, the lead pin, the frame described later, and the lid plate described later are sequentially coated with a gold film having a required thickness via a nickel film having a required thickness.
Further, a plurality of the first through holes are formed in parallel and linearly between the front surface and the back surface of the substrate. The first through hole has a circular or rectangular (square or rectangular) cross section. Alternatively, it may be a single oval or rectangular shape that allows a plurality of lead pins to penetrate and is smaller than the outer shape of the insulating member.
In addition, the insulating member can be made of a ceramic member, a resin member, or a glass member.
That is, the present invention also includes a light emitting element mounting package (claim 2) in which the insulating member is a ceramic member.
Further, when the insulating member is the ceramic member, the ceramic member is made of, for example, a high-temperature fired ceramic such as alumina, aluminum nitride, or mullite, or a low-temperature fired ceramic such as glass-ceramic.
Further, on the opposite back surface of the ceramic member, the same metallized layer surrounding the openings is formed at positions separated from the openings of the plurality of second through holes.
In addition, a plurality of the second through holes are formed in parallel and linearly on the ceramic member, and have a circular or rectangular shape, and the openings for each of the second through holes are formed. , Separated from the metallized layer.

Further, the lead pin is fixed around the opening on the opposite back surface side in the second through hole of the ceramic member via the flange portion extending in the radial direction thereof, and the ceramic member has the metallized layer. It is fixed around the first through hole provided in the substrate. Therefore, the lead pin is provided through two joint surfaces (plane surfaces), that is, a joint surface between the flange portion and the facing back surface of the ceramic member, and a joint surface between the facing surface of the ceramic member and the front surface or the back surface of the substrate. Is joined to the substrate. Therefore, the airtightness inside the package can be reliably and easily maintained without controlling the strict dimensional tolerance as in the conventional case.
Further, when the insulating member is a resin member or a glass member, for example, polyimide or epoxy resin, borosilicate glass, quartz glass or the like is used.
In addition, the lead pin is fixed around the opening on the opposite back surface side in the second through hole of the resin member or the glass member via the flange portion extending in the radial direction thereof, and the resin member or the glass. The member is fixed around the first through hole provided in the substrate via an adhesive. Therefore, the lead pin has two surfaces, one is a joint surface between the flange portion and the opposite back surface of the resin member or the glass member, and the other is a joint surface between the opposite surface of the resin member or the glass member and the front surface or the back surface of the substrate. It is joined to the substrate via a joining surface (flat surface). Therefore, even in such a case, the airtightness inside the package can be reliably and easily maintained without controlling the strict dimensional tolerance as in the conventional case. For example, a resin-based adhesive, a glass-based adhesive, or the like can be applied to the above-mentioned adhesive.

Further, in the present invention, the substrate and the ceramic member are fixed to a metallized layer formed so as to surround the opening of the second through hole on the facing surface of the ceramic member and to be separated from the opening. Also included is a light emitting element mounting package (claim 3) formed via a brazing material layer arranged along the metallized layer.
According to this, since the substrate and the ceramic member are firmly bonded to each other via the metallized layer and the brazing material layer, it is possible to obtain the following effect (4) in addition to the effect (2). It becomes.
(4) Since the metallized layer formed on the facing surface of the ceramic member is separated from the opening of the second through hole that opens on the facing surface, the ceramic member is first placed on the front surface or the back surface of the substrate. When fixing to the periphery of the through hole, a brazing material or the like arranged along the metallized layer is inadvertently contacted with the lead pin, and problems such as a short circuit are less likely to occur.
The metallized layer is made of tungsten (hereinafter, simply referred to as W), molybdenum (hereinafter, simply referred to as Mo), or the like.
Further, as the brazing material layer, silver brazing (for example, Ag—Cu alloy) is exemplified.

Further, in the present invention, the substrate and the mounting portion of the light emitting element are separate bodies, and the mounting portion of the light emitting element is included in a radiator having a higher thermal conductivity than the substrate. Also included is a light emitting element mounting package (claim 4), which has a third through hole penetrating between the front surface and the back surface, and the radiator is inserted and fixed in the third through hole. Is done.
According to this, since the heat radiating body having the mounting portion of the light emitting element has a higher thermal conductivity than the substrate and is inserted and fixed in the third through hole, it is mounted on the mounting portion later. The heat generated by the light emitting element can be effectively dissipated to the outside of the package via the heat radiating body (hereinafter referred to as effect (5)).
The heat radiating body is made of, for example, copper, a copper alloy, an aluminum alloy, or the like.

Further, in the present invention, the third through hole has a rectangular shape, a square shape, or a circular shape in a plan view, and the radiator has a rectangular parallelepiped shape, a cubic shape, or a cylindrical shape, and has a bottom surface thereof. A light emitting element mounting package (claim 5) is also included, which has a flange that enables joining with the periphery of the opening of the third through hole on the back surface of the substrate along the periphery.
According to this, the heat radiating body is joined to the flange integrally held along the periphery of the bottom surface of the main body and the periphery of the opening of the third through hole on the back surface of the substrate via a brazing material or the like. Therefore, the effects (2) and (5) can be surely achieved.

In addition, the present invention also includes a light emitting device mounting package (claim 6) in which the difference in linear expansion coefficient between the substrate and the ceramic member is 5 ppm (K ^{-1) or less.}
According to this, since the difference in the coefficient of linear expansion between the ^{ceramic member and the substrate is relatively small, 5 ppm (K -1} ) or less, the thermal stress applied to the joint between the ceramic member and the substrate is applied. Is alleviated, so that the effect (2) can be obtained more reliably.

The perspective view which shows the package for mounting a light emitting element of one form by this invention with the viewing angle from diagonally above. The perspective view which shows the said package for mounting a light emitting element at a viewing angle from diagonally below. (A) is a perspective view showing the facing back surface side of the ceramic plate used in the package, and (B) is a perspective view showing the facing front surface side of the ceramic plate. The perspective view which shows the radiator used for the package for mounting a light emitting element. A vertical cross-sectional view taken along the line of arrow XX in FIG. The same vertical cross-sectional view as above which shows the package for mounting a light emitting element of a different form. (A) is a perspective view showing a facing back surface side of a ceramic plate having a different form, and (B) is a perspective view showing the facing front surface side of the ceramic plate.

Hereinafter, embodiments for carrying out the present invention will be described.
1 and 2 are perspective views showing one form of the light emitting element mounting package 1a according to the present invention individually at a viewing angle from diagonally above or diagonally below.
As shown in FIGS. 1 and 2, the light emitting element mounting package 1a includes a box-shaped package main body 2 as a whole, a pair of ceramic plates (ceramic member, insulating member) 12 arranged inside the package main body 2, and a pair of ceramic plates (ceramic member, insulating member) 12. A plurality of lead pins 30 which continuously penetrate the ceramic plate 12 and the substrate 3 of the main body 2 and whose upper end (one end) side is located in the cavity 9 inside the package main body 2 are provided.

The package main body 2 is erected from a flat plate substrate 3 having a front surface 4 and a back surface 5 facing vertically and a periphery on the surface 4 side of the substrate 3, and has a rectangular (square or rectangular) shape in a plan view. It is composed of a frame (frame body) 6 having a side surface 7 and an outer surface 8. The surface 4 of the substrate 3 surrounded by the inner side surface 7 of the frame 6 contains a mounting portion of a light emitting element (not shown). Alternatively, the mounting portion is included in a heat radiating body described later.
The substrate 3 and the frame 6 are made of, for example, Kovar, and are joined to each other by brazing or the like to form the package body 2, and the entire surface of the package body 2 is provided with a required thickness. The nickel film and the gold film are sequentially coated. Further, a cavity 9 having a rectangular parallelepiped shape is formed inside the substrate 3 surrounded by the surface 4 and the inner side surface 7 of the frame 6.

In the substrate 3, three first through holes 11 are horizontally aligned and penetrate between the front surface 4 and the back surface 5 in parallel with each other along each pair of opposite sides in a plan view. ..
Further, in the substrate 3, on the rear (back) side of FIGS. 1 and 2, a third through hole 19 having a rectangular plan view is formed between the substrate 3 and the side wall of the frame 6, and the third through hole 19 is formed. The main body 21 of the radiator 20 is inserted and fixed in the hole 19 from the back surface 5 side of the substrate 3.
The heat radiating body 20 is made of, for example, a metal such as copper having a thermal conductivity higher than that of the substrate 3, and includes a rectangular parallelepiped main body 21 and a mounting portion of a light emitting element as a part thereof, as shown in FIG. It is composed of an upper surface 22 of the main body 21 and a flange 23 projecting outward along the periphery of the bottom surface of the main body 21, and the flange 23 is joined to the back surface 5 of the substrate 3 via a brazing material (not shown). ..
Further, in the frame 6, in order to allow light such as a laser to pass between the inner side surface 7 and the outer side surface 8 of the side wall located on the front side in FIGS. 1 and 2, or to insert an optical fiber (not shown). The through hole 10 is bored.

On the other hand, the ceramic plate (ceramic member) 12 is made of, for example, a ceramic such as alumina, and as shown in FIGS. It has a facing back surface 14 facing the facing surface 13 and three second through holes 15 penetrating between them and having a round cross section.
On the facing back surface 14, as shown in FIG. 3A, a ring-shaped separating portion 17 in which the surface of alumina is exposed around the opening of each of the second through holes 15 and each of the separating portions 17 are individually separated. A plurality of metallized layers 16 having a rectangular shape and made of W or Mo are formed. Further, as shown in FIG. 3B, the facing surface 13 has the same separating portion 17 located around the opening of each of the second through holes 15 and the facing surface excluding the separating portion 17. A metallized layer 16 arranged on almost the entire surface of 13 is formed. That is, each of the metallized layers 16 is formed so as to be separated from the opening of each of the second through holes 15, and the metallized layer 16 is also formed between the adjacent second through holes 15. There is.
The difference in linear expansion coefficient between the alumina constituting the ceramic plate 12 and the Kovar constituting the substrate 3 and the frame 6 is 5 ppm (K ^-1 ) or less.

Further, the lead pin 30 is made of, for example, Kovar, and has a round bar-shaped shaft portion 31 and a hemispherical-shaped tip portion 32 located at the lower end of the shaft portion 31, as shown in FIGS. 1, 2, and 5. A cylindrical head 33 provided at the upper end (one end) of the shaft portion 31 and a disk-shaped flange portion 34 extending in the radial direction from the shaft portion 31 adjacent to the head portion 33 are integrally provided. doing. As shown in FIG. 5, in the lead pin 30, the diameter D3 of the flange portion 34 is larger than the diameter D1 of the shaft portion 31, and the diameter D2 of the head portion 33 is also larger than the diameter D1 of the shaft portion 31. Is also set large.
The surface of the lead pin 30 is also sequentially coated with the same nickel film and gold film.

As shown in FIGS. 1, 2, and 5, a pair of ceramic plates 12 are opposed to each other around the openings on the surface 4 side of the three left and right first through holes 11 on the substrate 3. The metallized layer 16 formed on the 13 and the brazing material layer 28 arranged along the upper surface (lower side in the drawing) of the metallized layer 16 are individually fixed by being joined. ..
Further, as shown in FIG. 5, the flange portion 34 of the lead pin 30 is made of the ceramic so that the shaft portion 31 of the lead pin 30 penetrates through the central portion of each of the second through holes 15 of the ceramic plate 12. The metallized layer 16 formed with the separating portion 17 interposed therebetween and the brazing material layer 28 arranged along the metallized layer 16 around each opening of the second through hole 15 of the plate 12. It is joined to and fixed to the facing back surface 14 of the ceramic plate 12 via.
The brazing material layer 28 is made of, for example, silver brazing (Ag—Cu alloy).

As a result, the plurality of lead pins 30 continuously penetrate the central portion of each of the first through holes 11 of the substrate 3 and the central portion of each of the second through holes 15 of the ceramic plate 12. It is supported by the substrate 3 via each ceramic plate 12.
As shown in FIGS. 1, 2, and 5, the main body 21 of the heat radiating body 20 is inserted into the third through hole 19 provided in the board 3 from the back surface 5 side of the board 3, and the heat radiating body 20 is inserted. The heat radiating body 20 is fixed to the substrate 3 or the like via a similar brazing material (not shown) arranged between the flange 23 and the back surface 5 of the substrate 3.

Further, as shown in FIG. 5, the upper surface 22 of the main body 21 of the heating element 20 includes a mounting portion of a laser diode (light emitting element) 25 to be mounted later, and the laser diode mounted on the mounting portion. The 25 is electrically connected to each lead pin 30 via a bonding wire 29 between a plurality of external electrodes (not shown) having an upper surface thereof and heads 33 of the plurality of lead pins 30.
Then, by joining a lid plate 35 made of Kovar or the like to the upper opening of the frame 6 by brazing or the like, the inside of the cavity 9 of the package body 2 including the mounted laser diode 25 is sealed from the outside. can do.

FIG. 6 is a vertical cross-sectional view similar to that of FIG. 5, showing a light emitting element mounting package 1b having a form different from that of the package 1a.
As shown in FIG. 6, the light emitting element mounting package 1b includes a plurality of package main bodies 2 including the same substrate 3 and frame 6 and a plurality of packages 1b penetrating between the front surface 4 and the back surface 5 of the substrate 3 in the same manner. The first through hole 11 of the above, a pair of ceramic plates 12 joined in the same manner around the opening on the back surface 5 side of the substrate 3 of the first through hole 11, and a plurality of ceramic plates 12 formed for each of the ceramic plates 12. A plurality of lead pins 30 that continuously and individually penetrate the central portion of the second through hole 15 and the central portion of each of the first through holes 11 are provided.

As shown in FIG. 6, the lead pin 30 has the same shaft portion 31, the tip portion 32, and the head portion 33, and the same collar portion 34 is integrally formed in the middle of the shaft portion 31 in the axial direction. Have.
As shown in FIG. 6, a pair of ceramic plates 12 are formed on the facing surface 13 of the metallize around the openings on the back surface 5 side of a plurality of left and right first through holes 11 in the substrate 3. The layer 16 and the brazing material layer 28 arranged along the metallized layer 16 are joined and fixed individually.

Further, as shown in FIG. 6, the flange portion 34 of the lead pin 30 is made of the ceramic so that the shaft portion 31 of the lead pin 30 penetrates through the central portion of each of the second through holes 15 of the ceramic plate 12. Along the metallized layer 16 formed with the separating portion 17 interposed therebetween and above (lower side in the drawing) of the metallized layer 16 around each opening of the second through hole 15 on the facing back surface 14 of the plate 12. It is joined and fixed to the facing back surface 14 of the ceramic plate 12 via the brazing material layer 28 arranged therein.
As a result, the plurality of lead pins 30 continuously penetrate the central portion of each of the first through holes 11 of the substrate 3 and the central portion of each of the second through holes 15 of the ceramic plate 12. It is supported by the substrate 3 via each ceramic plate 12.
Further, as shown in FIG. 6, the main body 21 of the heat radiating body 20 is inserted into the third through hole 19 provided in the board 3, and between the flange 23 of the heat radiating body 20 and the back surface 5 of the board 3. The heat radiating body 20 is fixed to the substrate 3 or the like via the same brazing material arranged in the above.

Further, as shown in FIG. 6, the upper surface 22 of the main body 21 of the radiator 20 includes a mounting portion of the laser diode 25 to be mounted later, and the laser diode 25 mounted on the mounting portion includes the mounting portion. A plurality of external electrodes provided on the upper surface and heads 33 of the plurality of lead pins 30 are electrically connected to each lead pin 30 via a bonding wire 29.
Then, by joining a lid plate 35 made of Kovar or the like to the upper opening of the frame 6 by brazing or the like, the inside of the cavity 9 of the package body 2 including the mounted laser diode 25 is sealed from the outside. can do.

In the light emitting element mounting packages 1a and 1b as described above, the lead pin 30 continuously penetrates the first through hole 11 provided in the substrate 3 and the second through hole 15 provided in the ceramic plate 12. Therefore, an electrical connection with the laser diode 25 to be mounted on the mounting portion included in the upper surface 22 of the radiator 20 located on the surface 4 side of the substrate 3 is directly obtained via the bonding wire 29. be able to. Therefore, a sufficient current can be supplied as the power to be input to the laser diode 25 increases.
Further, the lead pin 30 is fixed to the periphery of the opening on the opposite back surface 14 side in the second through hole 15 of the ceramic plate 12 via the flange portion 34, and the ceramic plate 12 is the metallized layer. It is fixed to the periphery of the first through hole 11 provided in the substrate 3 via the 16 and the brazing material layer 28. Therefore, the lead pin 30 is referred to as a joint surface between the flange portion 34 and the facing back surface 14 of the ceramic plate 12, and a joint surface between the facing surface 13 of the ceramic plate 12 and the front surface 4 or the back surface 5 of the substrate 3. Since it is supported by the substrate via the two joint surfaces (planes), the airtightness inside the package body 2 can be reliably and easily maintained without having to manage the strict dimensional intersection as in the conventional case.

Further, since the metallized layer 16 formed on the facing surface 13 of the ceramic plate 12 is separated from the opening of the second through hole 15 opening in the facing surface 13 via the separating portion 17, the ceramic plate 12 is further separated from the opening. When fixing the 12 to the periphery of the first through 11 hole on the front surface 4 or the back surface 5 of the substrate 3, the brazing material layer 28 arranged along the metallized layer 16 carelessly attaches to the lead pin 30. Contact is made less likely to cause problems such as short circuits.
Further, since the heat radiating body 20 having the mounting portion of the laser diode 25 has a higher thermal conductivity than the substrate 3 and is inserted and fixed in the third through hole 19, it will be mounted on the mounting portion later. The heat generated by the mounted laser diode 25 can be effectively dissipated to the outside through the radiator body 20.

Further, since the difference in linear expansion coefficient between the ceramic plate 12 and the substrate 3 and the frame 6 ^{is relatively small at 5 ppm (K -1} ) or less, the joint portion between the ceramic plate 12 and the substrate 3 is relatively small. Since the applied thermal stress is relaxed and careless gaps are less likely to occur, the airtightness in the packages a1 and 1b can be reliably and easily maintained.
In addition, since the diameter D2 of the head 33 of the lead pin 30 is set to be larger than the diameter D1 of the shaft portion 31, the electrical connection with the light emitting element 25 to be mounted after the mounting portion 22 is made. When obtained with a bonding wire 29 or the like, the connection region of the bonding wire 29 can be made sufficiently large, and easy and reliable bonding becomes possible.
Therefore, according to the light emitting element mounting packages 1a and 1b, the above effects (1) to (5) can be surely achieved.
Further, according to the light emitting element mounting package 1a, since the ceramic plate 12 is arranged in the cavity 9, the present embodiment in which the ceramic plate 12 and the substrate 3 are joined by a surface to ensure airtightness. Also, the height of the package 1a can be reduced.

7 (A) and 7 (B) are perspective views showing different forms of the ceramic plate (ceramic member) 12a from the facing back surface 14 side or the facing surface 13 side.
The ceramic plate 12a is made of the same alumina or the like, and as shown in FIGS. 7A and 7B, the facing surface 13 used to face the surface 4 of the substrate 3 and the facing surface 13 facing the facing surface 13. It has an opposing back surface 14 and three second through holes 15a penetrating between them. The second through hole 15a has a rectangular shape in a plan view.
On the facing back surface 14, as shown in FIG. 7A, a rectangular frame-shaped separating portion 17 in which the surface of alumina is exposed around the opening of each of the second through holes 15a, and each of the separating portions 17 are provided. A metallizing layer 16 having a rectangular shape and made of W or Mo is formed. Further, as shown in FIG. 7B, the facing surface 13 has the same separating portion 17 located around the opening of each second through hole 15a and the facing surface excluding the separating portion 17. A metallized layer 16 arranged on almost the entire surface of 13 is formed.

The difference in linear expansion coefficient between the alumina constituting the ceramic plate 12a and the Kovar constituting the substrate 3 and the frame 6 is 5 ppm (K ^-1 ) or less.
The ceramic plate 12a as described above can be replaced with the ceramic plate 12 and applied to the light emitting element mounting packages 1a and 1b in the same manner as described above, and the above packages 1a and 1b using the ceramic plate 12a can be used. Also, the effects (1) to (5) can be achieved.

The present invention is not limited to each of the forms described above.
For example, the substrate 3, the frame 6, the lead pin 30, and the lid plate 35 may be made of 42 alloy or 194 alloy.
Further, the ceramic plates 12 and 12a may be made of any one of aluminum nitride, mullite, or glass-ceramic, or may be made of a resin plate (resin member) or a glass plate (glass member). good. When the resin plate or glass plate is used, the metallize layer 16 is omitted. When the resin plate or the glass plate is used, the frame 6 or the lead pin 30 is joined by using a resin adhesive or a glass adhesive.
Further, in the light emitting element mounting packages 1a and 1b, the first through hole to be formed in the substrate 3 may be a single one having a rectangular cross section having a shape similar to the outer shape of the ceramic plates 12 and 12a. ..
Further, the frame 6 may be a part of a box-shaped body that is integrated with the lid plate 35 in advance and has an opening that surrounds the surface 4 of the substrate 3 on the bottom surface side thereof.

Further, the light emitting element may be a light emitting diode or the like.
Further, a cylindrical holder for holding an optical fiber having the same inner diameter as the inner diameter of the through hole 10 may be provided on the outer surface 8 side of the through hole 10 of the frame 6.
Further, the third through hole may have a circular shape, an elliptical shape, or an oval shape in a plan view, and the main body of the heat radiating body 20 may also have a shape similar to the circular shape in a plan view.
Further, the flange portion 34 of the lead pin 30 may have a rectangular shape in a plan view.
In addition, any of alumina, silicic acid, boron oxide, zinc oxide, lead oxide, calcia, palladium, platinum, copper, gold, or carbon may be used for the brazing material (bonding material) layer.

Further, the diameter D2 of the head 33 of the lead pin 30 may be set smaller than the diameter D3 of the collar portion 34. That is, the diameter D3 of the flange portion 34 of the lead pin 30 may be set to be the largest. As a result, the area of the flange portion 34 can be sufficiently increased, so that the joint between the flange portion 34 and the ceramic plate 12 can be sufficiently secured, and the airtight seal can be more reliably performed. ..
Further, the diameter D2 of the head 33 of the lead pin 30 may be set larger than the diameter D3 of the collar 34. That is, the diameter D3 of the head 33 of the lead pin 30 may be set to be the largest. According to this, since the area of the head 33 can be sufficiently increased, the bonding wire 29 and the like can be easily joined when the light emitting element 25 and the lead pin 30 to be mounted later are electrically connected.

Further, in the light emitting element mounting package 1b, a recess equal to or larger than the thickness of the ceramic plate 12 is formed on the back surface 5 side of the substrate 3, and the ceramic plate 12 is joined in the recess to form a recess with the ceramic plate 12. When the substrate 3 is joined to the substrate 3 on a surface to ensure airtightness, the height of the package 1b can be reduced. Moreover, since the ceramic plate 12 and the substrate 3 are joined by a surface, the opening width of the recess can be formed sufficiently larger than the width (length) of the ceramic plate 12, and the dimensional accuracy of the recess can be increased. There is no need to strictly control.

Further, in the above-described embodiment, the ceramic member is a plate-shaped ceramic plate 12, but the ceramic member may have a structure having at least a plate-shaped portion that can be joined to the substrate 3 in a plane. For example, it may be a ceramic member that is erected from the facing surface 13 of the ceramic plate 12 and has a tubular portion formed so as to surround the opening on the facing surface 13 side. According to such a form, the cylindrical portion is inserted into the first through hole 11 formed in the substrate 3, and the plate-shaped portion of the ceramic member is joined to the substrate 3 in a surface manner, thereby forming the inside of the package. The airtightness can be ensured, and a short circuit due to contact between the inner wall surface forming the first through hole 11 and the lead pin penetrating the first through hole 11 can be prevented.

Further, in the above-described embodiment, the difference in the coefficient of linear expansion between the ceramic member and the substrate 3 is set to 5 ppm (K ^-1 ) or less, but as long as the airtightness is ensured at the joint between the ceramic member and the substrate 3. In, it is not limited to this. For example, when the maximum linear length at the joint between the ceramic member and the substrate 3 is 5 mm or less, the airtightness is maintained even if ^{the difference in the coefficient of linear expansion is larger than 5 ppm (K -1).} Secured joining is possible.
Further, when joining the ceramic member and the substrate 3 on the surface, the difference in the coefficient of linear expansion is made larger than ^{5 ppm (K -1) by interposing a member that relieves stress between the members.} However, it is possible to join with ensured airtightness.

According to the present invention, it is possible to reliably provide a package for mounting a light emitting element, which can easily increase the input power to the light emitting element mounted inside the package and can surely maintain the airtightness inside the package.

1a, 1b ... Package for mounting a light emitting element 3 …………………… Substrate 4 …………………… Front side 5 …………………… Back side 11 ……………… First through hole 12, 12a …… Ceramic plate (ceramic member, insulating member)
13 ……………… Facing front surface 14 ……………… Facing back surface 15, 15a …… Second through hole 16 ……………… Metallized layer 17 ……………… Separation part 19 ………… …… Third through hole 20 ……………… Heat radiator 22 ……………… Top surface (mounting part)
23 ……………… Flange 28 ……………… Row material layer 30 ……………… Lead pin 33 ……………… Head 34 ……………… Flange part D1 to D3 ………… diameter

Claims (6)

Front surface and a back surface, or and including mounting portion of the light emitting element to the surface, or the substrate which enables disposing the mounting portion of the separate on the surface side, and a lead pin which is supported on the substrate, A package for mounting a light emitting element, comprising a facing surface facing either the front surface or the back surface of the substrate and an insulating member having a facing back surface facing the facing surface.
A first through hole is formed between the front surface and the back surface of the substrate to allow the lead pin to pass through.
The insulating member has a second through hole penetrating between the facing front surface and the facing back surface.
The lead pin includes a shaft portion penetrating the first through hole and the second through hole, a flange portion extending radially from the shaft portion, and a head portion provided at one end of the shaft portion in the axial direction. Have,
The diameter of the flange portion of the lead pin is larger than the diameter of the shaft portion, and the diameter of the head of the lead pin is larger than the diameter of the front Symbol shaft portion,
In the lead pin, the flange portion is fixed to the periphery of the opening of the second through hole on the opposite back surface of the insulating member via the brazing material layer, and the lead pin is fixed.
The shaft portion of the lead pin and the inner peripheral surface of the second through hole face each other without the brazing material layer.
The insulating member is fixed around the opening of the first through hole on the front surface or the back surface of the substrate.
A package for mounting a light emitting element. The insulating member is a ceramic member.
The package for mounting a light emitting element according to claim 1. The substrate and the ceramic member are fixed on a metallized layer formed so as to surround the opening of the second through hole on the facing surface of the ceramic member and separated from the opening, and the metallized layer. It is formed through a brazing material layer arranged along the line.
The package for mounting a light emitting element according to claim 2. The substrate and the mounting portion of the light emitting element are separate bodies, the mounting portion of the light emitting element is included in a heat radiating body having a higher thermal conductivity than the substrate, and the substrate is formed by the front surface and the back surface. It has a third through hole that penetrates between them, and the radiator is inserted and fixed in the third through hole.
The package for mounting a light emitting element according to any one of claims 1 to 3, wherein the package for mounting a light emitting element. The third through hole has a rectangular shape, a square shape, or a circular shape in a plan view, and the radiator has a rectangular parallelepiped shape, a cube shape, or a cylindrical shape, and the substrate is formed along the periphery of the bottom surface thereof. Has a flange that allows joining with the periphery of the opening of the third through hole on the back surface of the
The package for mounting a light emitting element according to claim 4. The difference in the coefficient of linear expansion between the substrate and the ceramic member is 5 ppm (K ^-1 ) or less.
The package for mounting a light emitting element according to any one of claims 2 to 5, wherein the package for mounting a light emitting element.

Images