JP6930885B2 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- JP6930885B2 JP6930885B2 JP2017181248A JP2017181248A JP6930885B2 JP 6930885 B2 JP6930885 B2 JP 6930885B2 JP 2017181248 A JP2017181248 A JP 2017181248A JP 2017181248 A JP2017181248 A JP 2017181248A JP 6930885 B2 JP6930885 B2 JP 6930885B2
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- 239000004065 semiconductor Substances 0.000 title claims description 100
- 125000004429 atom Chemical group 0.000 claims description 50
- 229910044991 metal oxide Inorganic materials 0.000 claims description 43
- 150000004706 metal oxides Chemical class 0.000 claims description 43
- 229910052751 metal Inorganic materials 0.000 claims description 29
- 239000002184 metal Substances 0.000 claims description 28
- 229910052738 indium Inorganic materials 0.000 claims description 23
- 229910052733 gallium Inorganic materials 0.000 claims description 20
- 239000010936 titanium Substances 0.000 claims description 18
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 16
- 229910052710 silicon Inorganic materials 0.000 claims description 16
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 16
- 125000004430 oxygen atom Chemical group O* 0.000 claims description 13
- 229910052718 tin Inorganic materials 0.000 claims description 13
- 229910052721 tungsten Inorganic materials 0.000 claims description 12
- 229910052719 titanium Inorganic materials 0.000 claims description 10
- 229910052782 aluminium Inorganic materials 0.000 claims description 9
- 229910052732 germanium Inorganic materials 0.000 claims description 9
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims description 7
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 7
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims description 7
- 229910052750 molybdenum Inorganic materials 0.000 claims description 7
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 7
- 239000010937 tungsten Substances 0.000 claims description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 5
- 238000005315 distribution function Methods 0.000 claims description 5
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 5
- 239000010703 silicon Substances 0.000 claims description 5
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 4
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 4
- 239000011733 molybdenum Substances 0.000 claims description 4
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 4
- 229910018516 Al—O Inorganic materials 0.000 claims description 3
- 229910017299 Mo—O Inorganic materials 0.000 claims description 3
- 229910003077 Ti−O Inorganic materials 0.000 claims description 3
- 229910052787 antimony Inorganic materials 0.000 claims description 3
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 claims description 3
- 229910052735 hafnium Inorganic materials 0.000 claims description 3
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 claims description 3
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 claims description 3
- VSZWPYCFIRKVQL-UHFFFAOYSA-N selanylidenegallium;selenium Chemical compound [Se].[Se]=[Ga].[Se]=[Ga] VSZWPYCFIRKVQL-UHFFFAOYSA-N 0.000 claims description 3
- 229910052715 tantalum Inorganic materials 0.000 claims description 3
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims description 3
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 claims description 3
- 239000012212 insulator Substances 0.000 claims description 2
- 239000000203 mixture Substances 0.000 claims description 2
- 239000010408 film Substances 0.000 description 118
- 230000007547 defect Effects 0.000 description 9
- 229910052760 oxygen Inorganic materials 0.000 description 9
- 238000004088 simulation Methods 0.000 description 8
- 239000010409 thin film Substances 0.000 description 7
- 230000006870 function Effects 0.000 description 6
- 230000008878 coupling Effects 0.000 description 5
- 238000010168 coupling process Methods 0.000 description 5
- 238000005859 coupling reaction Methods 0.000 description 5
- 150000002500 ions Chemical class 0.000 description 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 4
- 239000010955 niobium Substances 0.000 description 4
- 239000001301 oxygen Substances 0.000 description 4
- 229910004298 SiO 2 Inorganic materials 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 238000004364 calculation method Methods 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 229910003437 indium oxide Inorganic materials 0.000 description 2
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910052758 niobium Inorganic materials 0.000 description 2
- 229910020286 SiOxNy Inorganic materials 0.000 description 1
- 229910020923 Sn-O Inorganic materials 0.000 description 1
- 238000004138 cluster model Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000013500 data storage Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000329 molecular dynamics simulation Methods 0.000 description 1
- 238000010606 normalization Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- -1 oxygen ions Chemical class 0.000 description 1
- 238000005036 potential barrier Methods 0.000 description 1
- 238000010791 quenching Methods 0.000 description 1
- QHGNHLZPVBIIPX-UHFFFAOYSA-N tin(ii) oxide Chemical class [Sn]=O QHGNHLZPVBIIPX-UHFFFAOYSA-N 0.000 description 1
- 230000005641 tunneling Effects 0.000 description 1
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- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78696—Thin film transistors, i.e. transistors with a channel being at least partly a thin film characterised by the structure of the channel, e.g. multichannel, transverse or longitudinal shape, length or width, doping structure, or the overlap or alignment between the channel and the gate, the source or the drain, or the contacting structure of the channel
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- H01L29/49—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET
- H01L29/51—Insulating materials associated therewith
- H01L29/511—Insulating materials associated therewith with a compositional variation, e.g. multilayer structures
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- H01L29/49—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET
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- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
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- H01L29/78—Field effect transistors with field effect produced by an insulated gate
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- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/7869—Thin film transistors, i.e. transistors with a channel being at least partly a thin film having a semiconductor body comprising an oxide semiconductor material, e.g. zinc oxide, copper aluminium oxide, cadmium stannate
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- H10B43/23—EEPROM devices comprising charge-trapping gate insulators characterised by three-dimensional arrangements, e.g. with cells on different height levels with source and drain on different levels, e.g. with sloping channels
- H10B43/27—EEPROM devices comprising charge-trapping gate insulators characterised by three-dimensional arrangements, e.g. with cells on different height levels with source and drain on different levels, e.g. with sloping channels the channels comprising vertical portions, e.g. U-shaped channels
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Description
図6(a)は、図5に示す半導体装置の模式横断面図であり、図6(b)は、図6(a)におけるA−A断面図である。
Claims (8)
- 制御電極と、
インジウム(In)とスズ(Sn)の少なくともいずれかを含む酸化物半導体層と、
前記制御電極と前記酸化物半導体層との間に設けられた酸化シリコンを含む絶縁膜と、
前記絶縁膜と前記酸化物半導体層との間に設けられ、前記絶縁膜および前記酸化物半導体層に接し、電気伝導性を有する金属酸化膜とを備え、
前記金属酸化膜は、ガリウム(Ga)、タングステン(W)、ゲルマニウム(Ge)、アルミニウム(Al)、モリブデン(Mo)、およびチタン(Ti)からなる群から選択される少なくとも1つを含む金属元素の酸化物であって、Ga−O結合、W−O結合、Ge−O結合、Al−O結合、Mo−O結合、およびTi−O結合からなる群から選択される少なくとも1つを含み、
前記金属酸化膜と前記絶縁膜との界面における前記金属酸化膜の金属原子の配位数が第1値であり、
前記金属酸化膜と前記酸化物半導体層との界面における前記金属酸化膜の金属原子の配位数が第2値であり、
前記第1値と前記第2値とは異なる半導体装置。 - 前記金属酸化膜において、前記金属原子の第一配位における平均配位数は、前記絶縁膜との界面において4以上5未満であり、前記酸化物半導体層との界面において5以上6以下である請求項1記載の半導体装置。
- 前記金属酸化膜において、前記金属原子のイオン半径は39pm以上62pm以下であり、前記金属原子と酸素原子との原子間距離のピーク値が170pm以上190pm以下である請求項1または2に記載の半導体装置。
- 前記金属酸化膜の前記金属原子の動径分布関数において第一近接における半値幅は、前記酸化物半導体層中のIn原子もしくはSn原子の第一近接における半値幅よりも狭く、前記絶縁膜中のSi原子の第一近接における半値幅よりも広い請求項1〜3のいずれか1つに記載の半導体装置。
- 前記酸化物半導体層は、ガリウム(Ga)、シリコン(Si)、ゲルマニウム(Ge)、アルミニウム(Al)、タングステン(W)、チタン(Ti)、タンタル(Ta)、ジルコニウム(Zr)、ハフニウム(Hf)、ニオブ(Nb)、アンチモン(Sb)、および亜鉛(Zn)からなる群から選択され、前記酸化物半導体層中のInもしくはSn原子の組成比より低い少なくとも1つをさらに含む請求項1〜4のいずれか1つに記載の半導体装置。
- 前記酸化物半導体層と前記制御電極との間に、前記金属酸化膜、前記絶縁膜、電荷蓄積膜、およびブロック絶縁膜を備え、
前記電荷蓄積膜は、シリコン窒化膜を含み、
前記ブロック絶縁膜は、シリコン酸化膜を含み、
前記金属酸化膜は、パイプ状の前記酸化物半導体層の周囲を囲み、
前記絶縁膜は、前記金属酸化膜の周囲を囲み、
前記電荷蓄積膜は、前記絶縁膜の周囲を囲み、
前記ブロック絶縁膜は、前記電荷蓄積膜を囲んでいる請求項1〜5のいずれか1つに記載の半導体装置。 - 複数層の前記制御電極が絶縁体を介して積層され、
前記酸化物半導体層、前記金属酸化膜、前記絶縁膜、前記電荷蓄積膜、および前記ブロック絶縁膜を含む柱状部が前記複数層の制御電極を貫通している請求項6記載の半導体装置。 - 前記金属酸化膜の厚さは、前記絶縁膜よりも薄く、前記ブロック絶縁膜よりも薄い請求項6または7に記載の半導体装置。
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KR101019337B1 (ko) | 2004-03-12 | 2011-03-07 | 도꾸리쯔교세이호징 가가꾸 기쥬쯔 신꼬 기꼬 | 아몰퍼스 산화물 및 박막 트랜지스터 |
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KR20110060479A (ko) * | 2009-11-30 | 2011-06-08 | 삼성모바일디스플레이주식회사 | 오믹 콘택층으로 산화물 반도체층을 갖는 박막 트랜지스터 및 그 제조방법 |
TWI575751B (zh) * | 2011-06-16 | 2017-03-21 | 半導體能源研究所股份有限公司 | 半導體裝置及其製造方法 |
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US9577107B2 (en) * | 2013-03-19 | 2017-02-21 | Semiconductor Energy Laboratory Co., Ltd. | Oxide semiconductor film and method for forming oxide semiconductor film |
JP6217196B2 (ja) * | 2013-07-11 | 2017-10-25 | 三菱電機株式会社 | 半導体材料、薄膜トランジスタ、および薄膜トランジスタの製造方法 |
JP6509514B2 (ja) * | 2014-09-17 | 2019-05-08 | 東芝メモリ株式会社 | 不揮発性半導体記憶装置及びその製造方法 |
JP2016225614A (ja) | 2015-05-26 | 2016-12-28 | 株式会社半導体エネルギー研究所 | 半導体装置 |
CN107924822B (zh) * | 2015-07-30 | 2022-10-28 | 出光兴产株式会社 | 晶体氧化物半导体薄膜、晶体氧化物半导体薄膜的制造方法以及薄膜晶体管 |
WO2017115209A1 (ja) * | 2015-12-28 | 2017-07-06 | 株式会社半導体エネルギー研究所 | 酸化物およびその作製方法 |
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