JP6920024B2 - 基板検査装置、検査治具、及びその基板検査方法 - Google Patents

基板検査装置、検査治具、及びその基板検査方法 Download PDF

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JP6920024B2
JP6920024B2 JP2020149552A JP2020149552A JP6920024B2 JP 6920024 B2 JP6920024 B2 JP 6920024B2 JP 2020149552 A JP2020149552 A JP 2020149552A JP 2020149552 A JP2020149552 A JP 2020149552A JP 6920024 B2 JP6920024 B2 JP 6920024B2
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inspection
jig
substrate
inspection jig
camera
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JP2020201283A (ja
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秀雄 西川
秀雄 西川
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JP2020149552A 2018-08-30 2020-09-07 基板検査装置、検査治具、及びその基板検査方法 Active JP6920024B2 (ja)

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JP2020149552A JP6920024B2 (ja) 2018-08-30 2020-09-07 基板検査装置、検査治具、及びその基板検査方法

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JP2018161175A JP6847495B2 (ja) 2018-08-30 2018-08-30 基板検査装置、検査治具、及びその基板検査方法
JP2020149552A JP6920024B2 (ja) 2018-08-30 2020-09-07 基板検査装置、検査治具、及びその基板検査方法

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026071794A1 (ko) * 2024-09-26 2026-04-02 주식회사 테크윙 전자부품 테스트용 핸들러

Families Citing this family (1)

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JP7375078B2 (ja) * 2022-03-23 2023-11-07 秀雄 西川 基板両面検査装置、及びその基板検査方法

Family Cites Families (6)

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JP3021392B2 (ja) * 1997-05-30 2000-03-15 ユーエイチティー株式会社 Ｂ・ｇ・ａのｉｃパッケージ用基板の導通検査方法
JP3313085B2 (ja) * 1998-06-02 2002-08-12 日本電産リード株式会社 基板検査装置及び基板検査装置における基板と検査ヘッドとの相対位置調整方法
JP3065612B1 (ja) * 1999-06-01 2000-07-17 日本電産リード株式会社 基板検査装置
JP5464468B2 (ja) * 2008-12-26 2014-04-09 日本電産リード株式会社 基板検査装置及び検査治具
JP2013164381A (ja) * 2012-02-13 2013-08-22 Nidec-Read Corp 基板検査装置のアライメント方法及び基板検査装置
JP6112896B2 (ja) * 2013-02-19 2017-04-12 日置電機株式会社 基板検査装置および補正情報取得方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026071794A1 (ko) * 2024-09-26 2026-04-02 주식회사 테크윙 전자부품 테스트용 핸들러

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