JP6917959B2 - Electronic component inspection equipment and electronic component inspection method - Google Patents

Description

The present invention relates to an electronic component inspection device and an electronic component inspection method.

As a conventional inspection device, there is a device that detects a defect by comparing an image of an inspection target pattern on a sample to be inspected with a reference image (see, for example, Patent Document 1). In this device, in order to detect the difference from the non-defective product and judge the quality, all the defects of the sample in the manufacturing process are detected.

Japanese Unexamined Patent Publication No. 2008-286586

If the surface of the stage is abnormal, the sample placed on the surface of the stage may also be defective. In the inspection apparatus described in Patent Document 1, since the defect is detected by comparing the image of the inspection target pattern with the reference image, not only the defect caused by the above stage but also other defects are detected. ..

The inspection apparatus described in Patent Document 1 cannot discriminate between various backside defects generated in the manufacturing process of the electronic component as a sample and defects caused by the stage. Therefore, it is not possible to detect defects on the back surface of the electronic component that are continuously generated due to the stage, and there is a problem that the yield of the electronic component is lowered.

Therefore, an object of the present invention is to provide a technique capable of detecting defects on the back surface of an electronic component that continuously occur due to a stage and suppressing a decrease in the yield of the electronic component.

The electronic component inspection device according to the present invention is an electronic component inspection device mounted on a stage and processed, and includes a back surface imaging camera that captures an image of the back surface of the electronic component conveyed from the stage. An image processing unit that extracts defects on the back surface of each electronic component from images of the back surface of the plurality of electronic components captured by the back surface imaging camera, and a back surface of each electronic component extracted by the image processing unit. A virtual region is provided at the starting point of the defect, and the quality of the surface of the stage is determined based on the number of the electronic components including the starting point of the region where the plurality of virtual regions intersect for the different electronic components in the virtual region. It is provided with a control unit for determining.

According to the present invention, the control unit provides a virtual area at the starting point of defects on the back surface of each electronic component extracted by the image processing unit, and sets the starting point of a region where a plurality of virtual areas intersect for different electronic components as a virtual area. The quality of the surface of the stage is determined based on the number of electronic components contained therein.

Therefore, by determining the quality of the surface of the stage, defects on the back surface of the electronic component that continuously occur due to the stage can be detected, so that a decrease in the yield of the electronic component can be suppressed.

It is an overall block diagram of the inspection apparatus of the electronic component which concerns on Embodiment 1. FIG. It is explanatory drawing for demonstrating the defect of the surface of a stage. It is explanatory drawing for demonstrating the origin of the defect of each electronic component in Embodiment 1. FIG. It is a figure for demonstrating the virtual area provided at the origin of the defect of each electronic component in Embodiment 1. FIG. It is explanatory drawing for demonstrating the starting point of the region where a plurality of virtual regions intersect in Embodiment 1. FIG. It is a flowchart which shows the inspection method of the electronic component which concerns on Embodiment 1. FIG. It is an overall block diagram of the inspection apparatus of the electronic component which concerns on Embodiment 2. FIG. It is a block diagram of a part of the inspection apparatus of the electronic component which concerns on Embodiment 3. FIG. FIG. 5 is a configuration diagram of an automatic replacement device included in the electronic component inspection device according to the third embodiment. It is explanatory drawing for demonstrating the origin of the defect of each electronic component in Embodiment 4. It is explanatory drawing for demonstrating the starting point of the region where a plurality of virtual regions intersect in Embodiment 4. FIG. 5 is an overall configuration diagram of an electronic component inspection device according to a fifth embodiment.

<Embodiment 1>
Embodiment 1 of the present invention will be described below with reference to the drawings. FIG. 1 is an overall configuration diagram of an electronic component inspection device 100 according to a first embodiment.

As shown in FIG. 1, the inspection device 100 is a device that inspects the appearance of the back surface of the electronic component 1 placed on the stage 2 and processed. The inspection device 100 includes a back surface imaging camera 4, an illumination 5, an image processing unit 6, a control unit 7, and a display 8.

The illumination 5 is arranged on the back surface side of the electronic component 1 which is attracted by the suction unit 3 and conveyed from the stage 2, and illuminates the back surface of the electronic component 1. The back surface imaging camera 4 captures an image of the back surface of the electronic component 1 conveyed from the stage 2.

The image processing unit 6 is, for example, a PC (Personal Computer), and extracts defects on the back surface of each electronic component 1 from images on the back surface of a plurality of electronic components 1 captured by the back surface imaging camera 4. The control unit 7 is, for example, a PC, and a virtual area is provided at the starting point of defects on the back surface of each electronic component 1 extracted by the image processing unit 6, and the starting point of an area where a plurality of virtual areas intersect for different electronic components 1. The quality of the surface of the stage 2 is determined based on the number of electronic components 1 including the above in the virtual area.

The electronic component 1 includes a semiconductor element. The stage 2 includes an electronic component 1 that comes into contact with the back surface of the electronic component 1, such as a table for performing image inspection, transport, positioning, and measurement of electrical characteristics.

Next, the processing performed by the image processing unit 6 and the control unit 7 will be described. FIG. 2 is an explanatory diagram for explaining the defect 15 on the surface of the stage 2. FIG. 3 is an explanatory diagram for explaining starting points 11a to 11d of defects 10a to 10d of each electronic component 1. FIG. 4 is a diagram for explaining virtual regions 12a to 12d provided at starting points 11a to 11d of defects 10a to 10d of each electronic component 1. FIG. 5 is an explanatory diagram for explaining the starting point 14 of the region 13 where the plurality of virtual regions 12a to 12c intersect.

As shown in FIGS. 2 and 3, defects 10a to 10d occur at positions on the back surface of the electronic component 1 corresponding to the defects 15 on the surface of the stage 2. FIG. 3 shows defects 10a to 10d generated on the back surfaces of the four electronic components 1 in images 9a to 9d obtained by imaging the back surfaces of a plurality of (for example, four) electronic components 1. Hereinafter, a case where the four electronic components 1 are inspected will be described.

As shown in FIG. 3, the image processing unit 6 extracts defects 10a to 10d on the back surface of the electronic component 1 from the images 9a to 9d on the back surface of the electronic component 1. Next, the control unit 7 obtains the starting points 11a to 11d of the defects 10a to 10d on the back surfaces of the four electronic components 1. The starting points 11a to 11d can be obtained, for example, as the center of gravity of the shape of the defects 10a to 10d, the intersection of the diagonal lines of the circumscribed quadrangle, or the midpoint of the diagonal line of the circumscribed quadrangle. These are examples of how to find the starting point, and are not limited to these.

As shown in FIGS. 4 and 5, the control unit 7 provides virtual regions 12a to 12d at the starting points 11a to 11d of the defects 10a to 10d on the back surface of the plurality of electronic components 1 and superimposes them. The virtual regions 12a to 12d have, for example, a circle or a polygon in shape, and the size is the detection accuracy, position accuracy, defect size of the defect 10a to 10d imaged, or the electronic component 1 is mounted on the stage 2. It is the range of variation in the accuracy of the placement position. These are examples of virtual areas 12a to 12d, and are not limited thereto.

When images 9a to 9d, defects 10a to 10d, starting points 11a to 11d, and virtual areas 12a to 12d are not particularly distinguished, they are referred to as images 9, defects 10, starting points 11, and virtual areas 12.

As shown in FIGS. 2 and 5, the starting point 14 of the region 13 where the plurality of virtual regions 12a to 12c intersect and the defect 15 on the surface of the stage 2 coincide with each other. Here, the virtual area 12d is not shown in FIG. 5 because it does not intersect with the other virtual areas 12a to 12c. Next, the control unit 7 totals the number of electronic components 1 including the starting point 14 of the region 13 where the virtual regions 12a to 12c intersect for the different electronic components 1 in the virtual regions 12a to 12c.

Then, the control unit 7 determines the quality of the surface of the stage 2 based on the total number. More specifically, the control unit 7 compares the number of electronic components 1 including the starting point 14 of the region 13 in which the plurality of virtual regions 12a to 12c intersect with each other in the virtual regions 12a to 12c with respect to the threshold value. Then, the quality of the surface of the stage 2 is determined. The threshold value is preset in the control unit 7.

Alternatively, the control unit 7 sets the starting point 14 of the region 13 where a plurality of virtual regions 12a to 12c intersect for different electronic components 1 with respect to the number of all the electronic components 1 from which the image 9 on the back surface is extracted by the image processing unit 6. The quality of the surface of the stage 2 is determined by comparing the ratio of the number of electronic components 1 contained in the virtual regions 12a to 12c with the threshold value. The threshold value is preset in the control unit 7.

Next, the control unit 7 displays the result of the pass / fail judgment on the display 8. The operator sees the display content of the display 8 and stops the transportation of the electronic component 1 to replace the stage 2 with another stage 2. Alternatively, the surface of the stage 2 is polished. As a result, it is possible to suppress a decrease in the yield of the electronic component 1.

Next, an inspection method of the electronic component 1 will be described with reference to FIG. FIG. 6 is a flowchart showing an inspection method of the electronic component 1.

First, the operator places the electronic component 1 on the stage 2 (step S1). The back surface imaging camera 4 captures an image 9 on the back surface of the electronic component 1 (step S2).

Next, the image processing unit 6 analyzes the image 9 on the back surface of the electronic component 1 (step S3). The control unit 7 extracts the defect 10 on the back surface of the electronic component 1 (step S4) and obtains the starting point 11 of the defect 10 (step S5). The control unit 7 draws a virtual area 12 at the starting point 11 of the defect 10 (step S6), and obtains the coordinates of the starting point 14 of the area 13 where the virtual areas 12 intersect (step S7). The control unit 7 totals the number of electronic components 1 including the starting point 14 of the region 13 where the virtual regions 12 intersect for different electronic components 1 in the virtual region 12 (step S8).

Next, the control unit 7 determines the quality of the surface of the stage 2 based on the number of electronic components 1 including the starting point 14 of the region 13 where the plurality of virtual regions 12 intersect for the different electronic components 1 in the virtual region 12. do. Specifically, the control unit 7 compares the number of electronic components 1 including the starting point 14 of the region 13 where the plurality of virtual regions 12 intersect with each other in the virtual region 12 and the threshold value, and sets the stage 2. The quality of the surface of the above is determined (step S9). Alternatively, the control unit 7 sets the starting point 14 of the region where the plurality of virtual regions 12 intersect for the different electronic components 1 with respect to the number of all the electronic components 1 from which the image 9 on the back surface is extracted by the image processing unit 6 as the virtual region 12. The quality of the surface of the stage 2 is determined by comparing the ratio of the number of electronic components 1 contained therein with the threshold value.

When the number of electronic components 1 including the starting point 14 of the region 13 where the plurality of virtual regions 12 intersect for different electronic components 1 in the virtual region 12 is less than the threshold value (No in step S9), that is, the surface of the stage 2 is defective. If there is no electronic component 1 to be inspected next (Yes in step S10), the process returns to step S1 until the next electronic component 1 is placed on the stage 2 and the electronic component 1 to be input is exhausted. Repeat the process of. When there is no electronic component 1 to be inspected next (No in step S10), the process ends.

On the other hand, when the number of electronic components 1 including the starting point 14 of the region where the plurality of virtual regions 12 intersect for different electronic components 1 in the virtual region 12 is equal to or greater than the threshold value (Yes in step S9), that is, on the surface of the stage 2. If there is a defect, the operator replaces the stage 2 with another stage 2 (step S11), and the process proceeds to step S10.

As described above, in the inspection device 100 according to the first embodiment, the control unit 7 is different in that the virtual area 12 is provided at the starting point 11 of the defect 10 on the back surface of each electronic component 1 extracted by the image processing unit 6. Regarding the electronic component 1, the quality of the surface of the stage 2 is determined based on the number of the electronic components 1 including the starting point 14 of the region 13 where the plurality of virtual regions 12 intersect in the virtual region 12.

Therefore, by determining the quality of the front surface of the stage 2, defects 10 on the back surface of the electronic component 1 that continuously occur due to the stage 2 can be detected, so that a decrease in the yield of the electronic component 1 is suppressed. be able to.

When determining the quality of the surface of the stage 2, the control unit 7 determines the number and threshold of the electronic components 1 including the starting point 14 of the region 13 where the plurality of virtual regions 12 intersect for the different electronic components 1 in the virtual region 12. To compare. Alternatively, the control unit 7 sets the starting point 14 of the region 13 where the plurality of virtual regions 12 intersect for the different electronic components 1 with respect to the number of all the electronic components 1 from which the image 9 on the back surface is extracted by the image processing unit 6 as a virtual area. The ratio of the number of electronic components 1 included in 12 is compared with the threshold value.

Therefore, various methods can be adopted as a method for determining the quality of the surface of the stage 2.

<Embodiment 2>
Next, the electronic component inspection device 100A according to the second embodiment will be described. FIG. 7 is an overall configuration diagram of the electronic component inspection device 100A according to the second embodiment. In the second embodiment, the same components as those described in the first embodiment are designated by the same reference numerals, and the description thereof will be omitted.

As shown in FIG. 7, in the second embodiment, the inspection device 100A includes a plurality of back surface imaging cameras 4, illuminations 5, and an image processing unit 6. Further, there are a plurality of stages 2 and suction portions 3.

Each back surface imaging camera 4, each image processing unit 6, and suction unit 3 are provided corresponding to each stage 2. In the example shown in FIG. 7, the back surface imaging camera 4, the image processing unit 6, the stage 2, and the suction unit 3 are provided by two each, but the present invention is not limited to these, and three or more are provided. Is also good.

As described above, the inspection device 100A according to the second embodiment includes a plurality of backside imaging cameras 4 and an image processing unit 6, has a plurality of stages 2, and each backside imaging camera 4 and each image processing unit 6 have a plurality of stages 2. It is provided corresponding to each stage 2.

Therefore, the time required for detection can be shortened by detecting the defects 10 on the surface of a plurality of stages 2 at once instead of detecting the defects 10 on the surface of the stage 2 one by one. In addition, when the defects 10 on the surface of a plurality of stages 2 are detected in parallel, the information on the detected defects 10 and the information on the number of the stage 2 in which the defects 10 are generated are used, and the defects 10 of the plurality of stages 2 are detected. Since the stage 2 having an abnormality on the surface can be detected from the inside, it is possible to save the trouble of searching for the stage 2 having an abnormality from the plurality of stages 2. From the above, the time required for maintenance and replacement of the stage 2 can be shortened. Further, since the down time of the inspection device 100A can be shortened, the productivity of the electronic component 1 is improved.

<Embodiment 3>
Next, the electronic component inspection device 100B according to the third embodiment will be described. FIG. 8 is an overall configuration diagram of the electronic component inspection device 100B according to the third embodiment. FIG. 9 is a configuration diagram of an automatic switching device 50 included in the inspection device 100B. In the third embodiment, the same components as those described in the first and second embodiments are designated by the same reference numerals and the description thereof will be omitted.

As shown in FIGS. 8 and 9, in the third embodiment, the inspection device 100B further includes an automatic switching device 50.

The automatic switching device 50 is a replacement unit that replaces the stage 2 with another replacement stage 2A when the control unit 7 determines that the surface of the stage 2 is defective. The automatic exchange device 50 includes a suction unit 21, an exchange stage storage rack 22, a pusher 23, and a delivery stand 24.

When the control unit 7 determines that the surface of the stage 2 has a defect 10, a signal for exchanging the stage 2 is transmitted from the control unit 7 to the automatic exchange device 50. The suction unit 21 sucks the stage 2 having a defect 10 on its surface and conveys it to a predetermined storage position. The replacement stage 2A is stored in the partition of the replacement stage storage rack 22. When the replacement stage storage rack 22 descends in the Z direction and the sensor (not shown) detects the position where the replacement stage 2A is arranged, the replacement stage storage rack 22 stops. The pusher 23 pushes the replacement stage 2A in the X direction and moves to the delivery table 24. The camera (not shown) recognizes the replacement stage 2A, and the suction unit 21 sucks the replacement stage 2A and conveys the replacement stage 2A to a position where the replacement stage 2A is arranged. As a result, the stage 2 having the defect 10 on the surface is replaced with the replacement stage 2A.

As described above, the inspection device 100B according to the third embodiment is an automatic replacement device 50 that replaces the stage 2 with another replacement stage 2A when the control unit 7 determines that the surface of the stage 2 is defective. Further prepare.

Therefore, since the inspection device 100B can be automatically replaced with another replacement stage 2A without stopping, it is possible to improve the yield of the electronic component 1 and the productivity of the electronic component 1 at the same time. ..

<Embodiment 4>
Next, the electronic component inspection apparatus according to the fourth embodiment will be described. FIG. 10 is an explanatory diagram for explaining starting points 11a to 11c of defects 10a to 10c of each electronic component 1 in the fourth embodiment. FIG. 11 is an explanatory diagram for explaining the starting point 14 of the region 13 where the plurality of virtual regions 12a to 12c intersect in the fourth embodiment. In the fourth embodiment, the same components as those described in the first to third embodiments are designated by the same reference numerals, and the description thereof will be omitted.

As shown in FIGS. 10 and 11, in the fourth embodiment, the control unit 7 performs each virtual according to the size of the defects 10a, 10b, and 10c on the back surface of each electronic component 1 extracted by the image processing unit 6. Multiply the regions 12a, 12b, 12c by the ratio.

This will be specifically described. When imaging with a 5 million pixel camera, the resolution is about 7 μm / pixel. When the size of the defect 10a is 70 μm square, the area is 100 pixels. Similarly, when the size of the defect 10b is 140 μm square, the area is 400 pixels. The area of the defect 10b is four times the area of the defect 10a, and the size ratio of the defect 10b is 4. When the number of pixels in the virtual area 12a of the defect 10a is a circle with a diameter of 200 pixels, the virtual area 12b of the defect 10b is multiplied by the ratio 4 to become a circle of 800 pixels.

As described above, in the inspection device according to the fourth embodiment, the control unit 7 has the control unit 7 each virtual area according to the size of the defects 10a, 10b, 10c on the back surface of each electronic component 1 extracted by the image processing unit 6. Multiply 12a, 12b, 12c by the ratio. Therefore, the larger the defect 10 on the back surface of the electronic component 1, the larger the intersecting region 13 in the virtual region 12, so that the accuracy of detecting the defect 15 on the front surface of the stage 2 which has a great influence on the electronic component 1 can be improved. Can be done.

<Embodiment 5>
Next, the electronic component inspection device 100C according to the fifth embodiment will be described. FIG. 12 is an overall configuration diagram of the electronic component inspection device 100C according to the fifth embodiment. In the fifth embodiment, the same components as those described in the first to fourth embodiments are designated by the same reference numerals and the description thereof will be omitted.

As shown in FIG. 12, in the fifth embodiment, the inspection device 100C further includes a stage imaging camera 19 that captures an image 9 of the surface of the stage 2. When the control unit 7 determines that the surface of the stage 2 is defective, the control unit 7 moves the stage imaging camera 19 to a position corresponding to the starting point 14 of the region 13 where the plurality of virtual regions 12 intersect on the surface of the stage 2. , An image of a position corresponding to the starting point 14 on the surface of the stage 2 is taken. When the stage imaging camera 19 detects a defect 15 on the surface of the stage 2, the operator replaces the stage 2 with another stage 2.

As described above, the inspection device 100C according to the fifth embodiment further includes a stage imaging camera 19 that captures an image of the surface of the stage 2. Therefore, since the surface of the stage 2 can be inspected with high accuracy in a short time, the yield of the electronic component 1 can be further improved.

In the present invention, each embodiment can be freely combined, and each embodiment can be appropriately modified or omitted within the scope of the invention.

1 Electronic component, 2 stage, 2A replacement stage, 4 backside imaging camera, 6 image processing unit, 7 control unit, 19 stage imaging camera, 50 automatic replacement device, 100, 100A, 100B, 100C inspection device.

Claims (8)

An inspection device for electronic components placed on a stage and processed.
A camera for backside imaging that captures an image of the backside of the electronic component conveyed from the stage, and a camera for backside imaging.
An image processing unit that extracts defects on the back surface of each of the electronic components from images of the back surface of the plurality of electronic components captured by the back surface imaging camera.
A virtual region is provided at the starting point of a defect on the back surface of each of the electronic components extracted by the image processing unit, and the electron including the starting point of a region where a plurality of the virtual regions intersect for different electronic components is included in the virtual region. A control unit that determines the quality of the surface of the stage based on the number of parts,
An electronic component inspection device. The control unit determines the quality of the surface of the stage by comparing the number of the electronic components including the starting point of the region where the plurality of virtual regions intersect with each other in the virtual region and the threshold value. , The electronic component inspection apparatus according to claim 1. The control unit includes, in the virtual region, the starting point of a region where a plurality of the virtual regions intersect for different electronic components with respect to the number of all the electronic components from which the image on the back surface has been extracted by the image processing unit. The electronic component inspection device according to claim 1, wherein the quality of the surface of the stage is determined by comparing the ratio of the number of electronic components with the threshold value. A plurality of the back surface imaging camera and the image processing unit are provided.
There are multiple stages,
The electronic component inspection device according to any one of claims 1 to 3, wherein each of the back surface imaging cameras and each of the image processing units is provided corresponding to each of the stages. The electronic component according to any one of claims 1 to 4, further comprising a replacement unit for replacing the stage with another stage when the control unit determines that the surface of the stage is defective. Inspection equipment. The control unit multiplies each of the virtual areas by a ratio according to the size of a defect on the back surface of each of the electronic components extracted by the image processing unit, according to any one of claims 1 to 5. The described electronic component inspection device. The electronic component inspection apparatus according to any one of claims 1 to 6, further comprising a stage imaging camera that captures an image of the surface of the stage. It is an inspection method for electronic components placed on the stage and processed.
(A) A step of capturing an image of the back surface of the electronic component conveyed from the stage, and
(B) A step of extracting defects on the back surface of each of the electronic components from the images of the back surface of the plurality of electronic components taken.
(C) A virtual region is provided at the starting point of a defect on the back surface of each of the extracted electronic components, and the starting point of a region where a plurality of the virtual regions intersect for different electronic components is included in the virtual region. A step of determining the quality of the surface of the stage based on the number of the stage,
A method of inspecting electronic components.

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