JP6915797B2 - Probe pin - Google Patents

Description

The present invention relates to a probe pin, and more particularly to a probe pin capable of stably maintaining contact with an IC electrode, a lithium battery, or the like when used for inspection.

Conventionally, there are many probe pins used for inspecting flash memory and other memory IC circuits and batteries and the like, including Patent Document 1. However, in a conventional device, if the unused period is relatively long, a natural oxide film is formed on the surface of an electrode such as an IC circuit or a battery which is a contact target of a probe pin. In this case, even if the probe pin is brought into contact with the electrode or the like, the probe pin cannot come into contact with the electrode or the like due to the presence of the natural oxide film, and the natural oxide film functions as an insulating film. Even if there is no abnormality in the probe pin, no current may flow through the probe pin, and it may be erroneously determined that the probe pin is abnormal. In order to avoid this, it is necessary to perform a troublesome work of removing the oxide film formed on the electrode or the like by performing an idling process such as contacting the probe pin with the electrode or the like for several tens of minutes when the device is restarted. It becomes.

By the way, in recent years, the miniaturization and high density of IC circuits have been progressing more and more, and the inspection equipment for them is also required to be smaller and have higher density of probe pins. However, the conventional product represented by Patent Document 1 is basically composed of a pair of vertically divided contacts and a coil spring provided so as to surround the outer periphery thereof. In such a configuration, it is necessary to reduce the width of the contact and the diameter of the coil spring in order to increase the density of the probe pins, but it is structurally difficult to significantly reduce the size.

Japanese Unexamined Patent Publication No. 2008-516398

Therefore, the present invention provides a probe pin that can always maintain reliable contact with a target electrode or the like so that an inspection can be performed without idling even if the electrode or the like has a natural oxide film formed on it. The main issue is to provide.

Further, it is a next subject of the present invention to have a configuration capable of increasing the density of probe pins.

In order to solve the above problems, the probe pin according to the present invention is
A folded-back portion (for example, the folded-back portion 12 in FIG. 1) provided at least at one end and in contact with the contact object,
A spring portion that is adjacent to the folded-back portion and is urged when the folded-back portion is brought into contact with the contact target is provided.

Specifically, the probe pin has a first contact provided at one end (for example, the upper contact 10 in FIG. 1) and a second contact provided at the other end (for example, the lower contact 20 in FIG. 1). And a spring portion (for example, the upper spring portion 31 and the upper spring portion 31 in FIG. 1) which are located between the first contact and the second contact and elastically support them so as to be able to expand and contract outward in the axial direction. It is characterized in that it is provided with a lower spring portion 32), and at least the folded-back portion (for example, the folded-back portion 12 in FIG. 1) of the first contact is configured to come into contact with an electrode or the like to be contacted. do.

Therefore, for example, in the second contact, the folded-back portion (for example, the folded-back portion 22 in FIG. 1) may not be formed. Further, the second contact itself may be fixed to the contact target, and only the first contact may be brought into contact with the contact target when a pressing force is applied.

The folded-back portion and the spring portion, that is, the first contact, the second contact, and the spring portion may be integrally formed of a conductive material.

The probe pin may be formed in a flat plate shape such as metal, and the spring portion may be a laterally curved portion formed in an intermediate portion between the first contact and the second contact.

The probe pin may be formed in the shape of a thin wire, for example, and the spring portion may be a coil formed in an intermediate portion between the first contact and the second contact.

The first contact and the second contact are formed of a conductive material, and the first contact has a first conductive relay member extending in the direction of the second contact on the first surface of the base end portion thereof. The second contact includes a second conductive relay member extending in the direction of the first contact on a surface of the base end portion on the same side as the first surface, and the first conductive relay member and the first conductive relay member. The two conductive relay members come into contact with each other due to the contraction motion of the spring portion to conduct conduction between the first contact and the second contact. The first contact, the second contact, the spring portion, the first conductive relay member, and the second conductive relay member are formed in a flat plate shape.

In this configuration, the first conductive relay member may be provided separately from the first contact, and the second conductive relay member may be provided separately or integrally with the second contact.

The probe pin according to the present invention is configured so that it can make contact with a contact target such as a target electrode by at least a folded portion of the first contact or the like, so that the contact position of the first contact with the target electrode or the like can be set. It deviates from the first axis passing through the center of the base of the first contact, so that the probe pin causes an amplitude motion at the tip of the first contact when it comes into contact with the target electrode or the like, and this amplitude motion causes an amplitude motion. It has the effect of removing the natural oxide film that covers the surface of the portion that the first contact, such as the target electrode, comes into contact with. Due to this natural oxide film removing effect, the probe pin according to the present invention can always maintain reliable contact with the target electrode and the like, and the main problem of the present invention can be solved.

Further, in the probe pin according to the present invention, all the constituent members of the first contact, the second contact, and the spring portion are formed of a thread-like material having conductivity and hardness such as a flat plate or a thin wire. Since the spring portion is provided between the first contact and the second contact and does not have a double structure in which the outer circumference of the contact is surrounded by the coiled spring portion, it is possible to realize a high density of probe pins. It is also possible to solve the secondary problem of the present invention.

The probe pin of Embodiment 1 of this invention is shown, (a) is a side view, (b) is a front view. The probe pin of the second embodiment of the present invention is shown, (a) is a front view, (b) is a survey view, and ((c)) is a rear view. It is explanatory drawing which shows a mode that the 1st conductive relay member and the 2nd conductive relay member of the probe pin shown in FIG. 2 are attached to the base end portion of the 1st contact and the base end portion of the 2nd contact, respectively. The probe pin of the third embodiment of the present invention is shown, (a) is a front view, (b) is a survey view, and ((c)) is a first contact formed integrally with a first conductive relay member. It is explanatory drawing which shows the state before the 2nd contact formed integrally with the 2nd conductive relay member is bent into the state of (a) the front view. It is the same figure as FIG. 1 which shows the probe pin of Embodiment 4 of this invention. It is a reference figure which shows the natural oxide film removal region by the probe pin which concerns on this invention appearing on the surface of the target electrode covered with a natural oxide film.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the present specification, the upper side thereof is described as upper (for example, upper surface, upper side, upper end) and the lower side is described as lower side (for example, lower surface, lower side, lower end) with reference to the drawings. Further, in each figure, the same reference numerals are given to the same parts.

(Embodiment 1)
In FIG. 1, a side view and a front view of the probe pin according to the first embodiment of the present invention are shown as (a) and (b), respectively. In FIG. 1, as is clear from the side view (a), the probe pin 1 has a flat plate shape as a whole and is integrally formed of a conductive material. An upper spring portion 31 and a lower spring portion 32 located between the two are provided. The spring portions 31 and 32 have a shape that is curved sideways, so that the upper contact 10 and the lower contact 20, respectively, are inspected with an IC electrode (not shown) and a pad on a counter substrate (FIG. It is configured to exert an elastic force capable of applying a pressing force of about 10 g (for example, 5 g to 14 g) toward (not shown).

The probe pin 1 is preferably manufactured by photoetching in order to avoid material deformation such as warpage, distortion, and bending due to processing. In addition, it can also be manufactured by press working or wire electric discharge machining. Further, as the material, it is preferable to use a metal having conductivity and toughness such as copper, a copper alloy of copper with zinc, nickel and the like. Alternatively, a springy material may be plated with a metal having a predetermined conductivity such as copper, silver, palladium, beryllium, and an alloy of these. In any case, it is necessary to use a material having both conductivity and springiness.

In the illustrated example, the upper spring portion 31 and the lower spring portion 32 are each one and have a curved shape toward the side, but the number and shape are not limited to this. Each of them may be configured to have a spring constant capable of applying a predetermined pressing force to the upper contact 10 and the lower contact 20.

Next, the upper contact 10 and the lower contact 20 will be described. Since both are configured to be substantially the same, the following description will mainly be given to the upper contact 10. The upper contact 10 has a tip portion 10b folded back in the middle portion in the vertical direction, and the contact between the upper contact 10 and an electrode such as an IC circuit to be inspected is a folded end, that is, the main body 10a of the upper contact 10 and the tip end. This is performed at the folded-back portion 12 which is the boundary with the portion 10b. As shown in the side view (a), this is a folding back of the first axis I passing through the axial center of the main body 10a of the side contact 10 and the second axis II passing through the axial center of the tip portion 10b. This means that the unit 12 makes contact with the target electrode.

Here, the movement of the upper contact 10 when the upper contact 10 comes into contact with the target electrode will be described. Since the contact position of the upper contact 10 with the target electrode or the like is deviated from the first axis I passing through the center of the base portion 10a of the first contact, the probe pin 1 is spring-loaded when contacting the target electrode or the like. It bends in response to the pressing force of 31, but this bending causes the folded-back portion 12 of the upper contact 10 to form the first axis so that the contact between the upper contact 10 and the target electrode or the like is performed on the first axis I in a well-balanced manner. It acts as a force to move it to a position on I. In response to this force, the folded-back portion 12 of the upper contact 10 moves to a position on the first axis I. However, due to the returning force of the spring portion 31, the folded portion 12 of the upper contact 10 is immediately returned to the original position. The amplitude movement of the folded-back portion 12 of the upper contact 10 that occurs at the time of contact with the target electrode or the like has the effect of removing the natural oxide film that covers the surface of the portion that the first contact of the target electrode or the like contacts.

(Embodiment 2)
In FIG. 2, a front view, a side view, and a rear view of the probe pin according to the second embodiment of the present invention are shown as (a), (b), and (c), respectively. In FIG. 2, as is clear from the side view (b), the probe pin 100 has a flat flat plate shape as a whole. As the material, the upper contact 110 and the lower contact 120 are preferably a conductive material, for example, copper, silver, palladium, an alloy thereof, or the like having the required conductivity. The S-shaped snake-shaped spring portion 130 located between the upper contact 110 and the lower contact 120 may be a conductive one such as metal or a non-conductive one such as resin. The spring portion 130 applies a pressing force of about 10 g (for example, 5 g to 14 g) toward the IC electrode to be inspected and the pad (not shown) on the counter substrate, respectively, for the upper contact 110 and the lower contact 120. It is configured to exert the resilience that can be achieved.

The probe pin 100 is preferably manufactured by photoetching in order to avoid material deformation such as warpage, distortion, and bending due to processing. In addition, it can also be manufactured by press working or wire electric discharge machining.

The upper contact 110 and the lower contact 120 have tip portions 110b and 120b folded back at the intermediate portion in the vertical direction, respectively, and the contact between the upper contact 110 and an electrode such as an IC circuit to be inspected and the lower contact 120. The contact with the pad on the counter substrate is the folded end, that is, the folded portion 112 at the boundary between the main body 110a and the tip 110b of the upper contact 110, and the folded portion between the main body 120a and the folded portion 120b of the lower contact 120. It is done with 122. As shown in the side view (b) of FIG. 2, this means that the first axis XI passes through the axial center of the main body 110a of the upper contact 110 and the second axis XII passes through the axial center of the tip 110b. The first axis XI that passes through the axial center of the main body 120a of the lower contact 120 and the second axis XII that passes through the axial center of the folded portion 120b are brought into contact with the target electrode at the folded-back portion 112. It means that the folded-back portion 122 makes contact with the pad on the counter substrate.

The narrow and narrow upper contact 110 and the lower contact 120 have wide bases 114 and 124 expanded to a width substantially matching the width of the spring 130, respectively. These bases 114 and 124 form a conductive relay piece fixing portion to which the first conductive relay piece 140 and the second conductive relay piece 150 are fixed by adhesion or the like, respectively. The first conductive relay piece 140 and the second conductive relay piece 150 have substantially the same width as the base 114 of the upper contact 110 and the base 124 of the lower contact 120, respectively, and the first conductive relay piece 140 and the second conductive relay piece 140 and the second conductive relay piece 150, respectively. The relay pieces 150 extend toward each other. The first conductive relay piece 140 has an extending portion 140a formed in an elongated protrusion shape at the tip thereof. The tip of the second conductive relay piece 150 is slightly widened to accommodate the extension portion 140a, and an elongated recess 150a having a width corresponding to the extension portion 140a is formed.

In FIG. 3, the first conductive relay piece 140 is attached to the base 114 of the upper contact 110.
It shows how the second conductive relay piece 150 is attached to the base 124 of the lower contact 120.

Here, the path of the current flowing from the upper contact 110 to the lower contact 120 in the second embodiment will be described. The spring portion 130 may or may not be conductive as described above. Even if the spring portion 130 is conductive, since the spring portion 130 is formed in an S-shaped snake shape, the path from the current reaching the upper contact 110 to the lower contact 120 is long, and quick inspection can be performed. May not be. However, the first conductive relay piece 140 is attached to the upper contact 110, and the second conductive relay piece 150 is attached to the lower contact 120. Therefore, when the upper contact 110 is pressed against the target electrode and the spring portion 130 bends during the inspection, the extending portion 140a of the first conductive relay piece 140 fits into the recess 150a of the second conductive relay piece 150. The first conductive relay piece 140 and the second conductive relay piece 150 come into contact with each other, and a current flows smoothly from the upper contact 110 to the lower contact 120, enabling quick inspection.

In the second embodiment, when the upper contact 110 comes into contact with the target electrode, the upper contact 110 behaves in the same manner as in the case described with respect to the first embodiment. That is, since the contact position of the upper contact 110 with the target electrode or the like is deviated from the first axis XI passing through the center of the base 110a of the first contact, the probe pin 100 is displaced from the first axis XI when it comes into contact with the target electrode or the like. It bends in response to the pressing force of the spring portion 131, and this bending causes the tip 112 of the upper contact 110 to be abdicated so that the contact between the upper contact 110 and the target electrode or the like is performed on the first axis XI in a well-balanced manner. It acts as a force to move to a position on the uniaxial line XI. In response to this force, the tip 112 of the upper contact 110 moves to a position on the first axis XI. However, due to the returning force of the spring portion 130, the tip 112 of the upper contact 110 is immediately returned to the original position. The amplitude movement of the tip 112 of the upper contact 110 that occurs at the time of contact with the target electrode or the like has the effect of removing the natural oxide film that covers the surface of the portion that the first contact such as the target electrode comes into contact with.

(Embodiment 3)
4A and 4B show a front view and a side view of the probe pin according to the third embodiment of the present invention as (a) and (b), respectively, and FIG. 4C shows the front view (a) before taking the form. That is, the form before assembly is shown as a developed view. In the second embodiment shown in FIGS. 2 and 3, the first conductive relay piece 140 and the second conductive relay piece 150 are made separately from the upper contact 110 and the lower contact 120, respectively, of the upper contact 110. The base 114 and the base 124 of the lower contact 120 were fixed by adhesion or the like, but in the third embodiment, the first conductive relay piece 240 and the second conductive relay piece 250 are the upper contact 210 and the lower contact 220. It is made integrally with.

Then, as can be seen from the developed view (c) of FIG. 4, the upper contact 210 and the lower contact 220 are folded back at the intermediate ff of the portion excluding the first conductive relay piece 240 and the second conductive relay piece 250, respectively. As a result, the folded-back portion 212 of the upper contact 210 and the lower contact 220 where the electrode of the IC circuit or the like to be inspected and the pad on the counter substrate are contacted and the lower contact 120 and the pad on the counter substrate are contacted. 222 is formed. The configuration of this part will be described in detail later.

As is clear from the developed view (c), the probe pin 200 has a flat plate shape as a whole. As for the material, the upper contact 210 including the first conductive relay piece 240 and the lower contact 220 including the second conductive relay piece 250 are required to be a conductive material such as copper, silver, palladium, or an alloy thereof. It is preferable that the material has the conductivity of. The S-shaped snake-shaped spring portion 230 located between the upper contact 210 and the lower contact 220 may be a conductive material such as metal or a non-conductive material such as resin. The spring portion 230 is a bullet capable of applying a pressing force of about 10 g (for example, 5 g to 14 g) toward the IC electrode to be inspected and the pad (not shown) on the counter substrate, respectively, for the upper contact 210 and the lower contact 220. It is configured to exert its power.

Similar to the first and second embodiments, the probe pin 200 is preferably manufactured by photoetching in order to avoid material deformation such as warpage, distortion, and bending due to processing. In addition, it can also be manufactured by press working or wire electric discharge machining.

In the third embodiment as well, as in the first and second embodiments, the upper contact 210 and the lower contact 220 are each of the first conductive as can be seen from the front view (a) and the side view (b) of FIG. The portion excluding the relay piece 240 and the second conductive relay piece 250 has tip portions 210b and 220b folded back at the intermediate portion in the vertical direction, and the contact between the upper contact 110 and the electrode of the IC circuit or the like to be inspected and The contact between the lower contact 120 and the pad on the counter substrate is the folded end, that is, the folded portion 112 at the boundary between the main body 210a and the tip portion 210b of the upper contact 210, and the main body 220a and the folded portion of the lower contact 220. This is done at the folded-back portion 222 at the boundary with 220b. This means that in the side view (b) of FIG. 4, the folded portion of the first axis XXI passing through the axial center of the main body 210a of the upper contact 210 and the second axis XXII passing through the axial center of the tip portion 210b. Contact with the target electrode is made at 212, and at the midpoint 222 between the first axis XXI passing through the axial center of the main body 220a of the lower contact 220 and the second axis XXII passing through the axial center of the folded portion 220b. It means that contact with the pad on the counter substrate is made.

The narrow and narrow upper contact 210 and the lower contact 220 each have a wide base 214 and 224 expanded to a width substantially matching the width of the spring 230. These bases 214 and 224 are fixed to the conductive relay piece in which the first conductive relay piece 140 and the second conductive relay piece 250 folded back at ff in the developed view (c) of FIG. 4 are fixed by adhesion or the like. Make a part. The first conductive relay piece 240 and the second conductive relay piece 250 have substantially the same width as the base 214 of the upper contact 210 and the base 224 of the lower contact 220, respectively, and the first conductive relay piece 240 and the second conductive relay piece 240 and the second conductive relay piece 240 have substantially the same width as the base portion 224 of the lower contact 220. It extends toward each other with the relay piece 250. The first conductive repeater 240 has an extending portion 240a formed in an elongated protrusion shape at the tip thereof. The tip of the second conductive relay piece 250 is slightly widened to accommodate the extension portion 240a, and an elongated recess 250a having a width corresponding to the extension portion 240a is formed.

The path of the current flowing from the upper contact 210 to the lower contact 220 in the third embodiment is the same as that of the third embodiment. That is, the spring portion 230 may or may not be conductive. If the spring portion 230 is not conductive, no current will flow from the upper contact 210 to the lower contact 220 via the spring portion 230, and even if the spring portion 230 is conductive, the spring portion 230 will be an S-shaped snake. Since it is formed in a shape, the path from the upper contact 210 to the lower contact 220 of the current is long, and there is a possibility that a quick inspection cannot be performed. However, the first conductive relay piece 240 is attached to the upper contact 210, and the second conductive relay piece 250 is attached to the lower contact 220. Therefore, at the time of inspection, when the upper contact 210 is pressed against the target electrode and the spring portion 230 bends, the extending portion 240a of the first conductive relay piece 240 fits into the recess 250a of the second conductive relay piece 250. The 1 conductive relay piece 240 and the 2nd conductive relay piece 250 come into contact with each other, and a current flows smoothly from the upper contact 210 to the lower contact 220, enabling quick inspection.

When the upper contact 210 in contact with the target electrode in the third embodiment, the upper contact 210 behaves in the same manner as in the case described with respect to the first embodiment. That is, as can be seen from the side view (b) of FIG. 4, the contact position of the upper contact 210 with the target electrode and the like is deviated from the first axis XXI passing through the center of the main body portion 210a of the first contact. Therefore, when the probe pin 200 comes into contact with the target electrode or the like, the probe pin 200 bends due to the pressing force of the spring portion 231. This bending causes the contact between the upper contact 210 and the target electrode or the like to be well-balanced on the first axis XXI. Acts as a force to move the folded-back portion 212 of the upper contact 210 to a position on the first axis XXI, as performed in. In response to this force, the folded-back portion 212 of the upper contact 210 moves to a position on the first axis XXI. However, due to the returning force of the spring portion 230, the folded portion 212 of the upper contact 210 is immediately returned to the original position. The amplitude movement of the folded-back portion 212 of the upper contact 210 that occurs at the time of contact with the target electrode or the like has the effect of removing the natural oxide film that covers the surface of the portion that the first contact of the target electrode or the like contacts.

(Embodiment 4)
In FIG. 5, a side view and a front view of the probe pin according to the fourth embodiment of the present invention are shown as (a) and (b), respectively. In the fourth embodiment, the material of the probe pin 1 integrally formed of the substantially flat plate-shaped conductive material according to the first embodiment is formed into a hard thread-like material having conductivity like a thin wire. An example of replacing the conductive material is shown. In FIG. 4, as is clear from the side view (a), the probe pin 300 has a thin rod shape as a whole and is integrally formed of a conductive material, and is formed between the upper contact 310 and the lower contact 320, and between the two. It is provided with a spring portion 330 located at. Since the spring portion 330 has a coil shape, the upper contact 310 and the lower contact 320 are directed toward the IC electrode (not shown) to be inspected and the pad (not shown) on the counter substrate, respectively, by about 10 g (not shown). For example, it is configured to exert an elastic force capable of applying a pressing force of 5 g to 14 g).

As the material of the probe pin 300, it is preferable to use a metal having conductivity and toughness such as copper, a copper alloy of copper with zinc, nickel and the like. Alternatively, a springy material may be plated with a metal having a predetermined conductivity such as copper, silver, palladium, beryllium, and an alloy of these. In any case, it is necessary to use a material having both conductivity and springiness.

Since the upper contact 310 and the lower contact 320 are configured to be substantially the same, the following description will be given mainly to the upper contact 10. The upper contact 310 has a tip portion 310b that is folded back at an intermediate portion in the vertical direction, and contact between the upper contact 310 and an electrode such as an IC circuit to be inspected is at the folded end, that is, the main body 310a and the tip of the upper contact 310. This is done at the folding section 312 with the section 310b. This means that, as shown in the side view (a) of FIG. 4, the first axis XXXI passing through the axial center of the main body 310a of the upper contact 310 and the second axis XXXII passing through the axial center of the tip 310b. It means that the contact with the target electrode is performed at the folded-back portion 312.

In the above, the movement of the upper contact 310 when the upper contact 310 comes into contact with the target electrode will be described. Since the contact position of the upper contact 310 with the target electrode or the like is deviated from the first axis XXXI passing through the center of the base portion 310a of the upper contact 310, the probe pin 300 has a spring portion 330 when it comes into contact with the target electrode or the like. The tip 312 of the upper contact 310 is placed on the first axis XXXI so that the contact between the upper contact 310 and the target electrode or the like is performed on the first axis XXXI in a well-balanced manner. It acts as a force to move to the position of. In response to this force, the tip 312 of the upper contact 310 moves to a position on the first axis XXXI. However, due to the returning force of the spring portion 330, the tip 312 of the upper contact 310 is immediately returned to the original position. The amplitude movement of the tip 312 of the upper contact 10 that occurs at the time of contact with the target electrode or the like has the effect of removing the natural oxide film that covers the surface of the portion that the first contact such as the target electrode comes into contact with.

FIG. 6 shows the solder surface when the upper contacts 10, 110, 210 of the flat plate-shaped probe pins 10, 100, 200 in the first, second, and third embodiments in the first, second, and third embodiments come into contact with, for example, the solder 60 of the target electrode. The region 70 of the removed portion of the covering natural oxide film is shown. Further, (b) shows a region 80 of a portion where the natural oxide film covering the solder surface is removed when the upper contact 310 of the wire-shaped probe pin 300 in the fourth embodiment comes into contact with, for example, the solder 80 of the target electrode. As shown in (a), by using the flat plate-shaped probe pins 10, 100, and 200, the rectangular natural oxide film removing region 70 is exposed on the surface of the solder 60. Further, as shown in (b), the linear natural oxide film removing region 90 is exposed on the surface of the solder 80 by using the wire-shaped probe pin 300.

The probe pin according to the present invention can be widely used in various probe units.

100, 200, 300 Probe pins 10, 110, 210, 310 First contact 10a, 110a, 210a, 310a First contact body 10b, 110b, 210b, 310b First contact tip 12, 112, 212, 312 First contact folded-back portions 20, 120, 220, 320 Second contacts 20a, 120a, 220a, 320a Second contact bodies 20b, 120b, 220b, 320b Second contact tips 22, 122, 222 322 Folded portion 31, 32, 130, 230, 330 of the second contact, spring portion 140, 240 1st conductive relay piece 150, 250 2nd conductive relay piece I, XI, XXXI, XXXI 1st axis
II, XII, XXXI, XXXI 2nd axis

Claims (6)

Folded parts that are provided at at least one end of the contacts located at both ends and come into contact with the contact target,
A flat plate-shaped probe pin that is adjacent to the folded-back portion and includes an S-shaped spring portion that is urged when the folded-back portion is brought into contact with the contact target.
The folded portion is formed of a conductive material, and the folded portion is provided with a first conductive relay member extending in the direction of a contact located at the other end different from the one end on the first surface of the base end portion thereof. Is provided with a second conductive relay member extending in the extending direction of the folded-back portion on a surface of the base end portion on the same side as the first surface, and the first conductive relay member and the second conductive relay member are , Contact each other by the contraction motion of the spring part,
A flat plate-shaped probe pin having a two-layer structure consisting of a layer composed of the base end portion and the spring portion, and a layer composed of the first conductive relay member and the second conductive relay member. The probe pin according to claim 1, wherein the spring portion is integrally formed of a conductive material together with the folded portion. The probe pin according to claim 1, wherein the conductive material is a rigid filament. The probe pin according to claim 1, wherein the folded portion, the contact, the spring portion, the first conductive relay member, and the second conductive relay member have a flat plate shape. It said first conductive relay member and the folded portion, the probe pin according to claim 1, wherein each of which is provided separately. The probe pin according to claim 1, wherein the first conductive relay member formed integrally with the folded portion.

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