JP2018119876A - Probe pin - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a probe pin which can constantly keep an ensured contact with an IC electrode, for example, as a target and allows a high density of the probe pin.SOLUTION: A probe pin 100 includes: a folding part 112 for a first contact 110 in at least one end of the probe pin, the folding part being in contact with a contact target; a folding part 122 for a second contact 120; and a spring part 130 next to the first contact 110, the spring part biasing the first folding part 112 when bringing the first folding part into contact with the contact target.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a probe pin, and more particularly to a probe pin that can stably maintain contact with an IC electrode or the like when used for inspection of an IC electrode or a lithium battery.

  Conventionally, there are many probe pins used for inspection of flash memory and other memory IC circuits, batteries, and the like, including Patent Document 1. However, in the conventional apparatus, if the unused period is relatively long, a natural oxide film is formed on the surface of an electrode such as an IC circuit or a battery that is a contact object of the probe pin. In this case, even if the probe pin is brought into contact with the electrode or the like, the probe pin cannot be brought into contact with the electrode or the like due to the presence of the natural oxide film, and the natural oxide film functions as an insulating film. Even if there is no abnormality, the current may not flow through the probe pin, and it may be erroneously determined to be abnormal. In order to avoid this, when the apparatus is restarted, a troublesome work of removing the oxide film formed on the electrode or the like by performing an idling process, for example, making contact with the probe pin and the electrode for several tens of minutes is necessary. It becomes.

  By the way, in recent years, the miniaturization and high density of IC circuits have been further advanced, and the inspection apparatus targeting them has been required to be miniaturized and high density of probe pins. However, a conventional product represented by Patent Document 1 basically includes a pair of contacts divided vertically and a coil spring provided so as to surround the outer periphery thereof. In such a configuration, in order to increase the density of the probe pins, it is necessary to reduce the width of the contact and the diameter of the coil spring. However, it is difficult to reduce the structure greatly.

JP 2008-516398 A

  Therefore, the present invention provides a probe pin that can always maintain a reliable contact with a target electrode so that an inspection can be performed without performing an idling process even if the electrode has a natural oxide film. The main issue is to provide.

  Another object of the present invention is to make the configuration capable of realizing a high-density probe pin.

In order to solve the above problems, the probe pin according to the present invention is:
A folded portion (for example, the folded portion 12 in FIG. 1) provided at at least one end and in contact with the contact target;
A spring portion that is adjacent to the folded portion and is biased when the folded portion is brought into contact with the contact target.

Specifically, the probe pin includes a first contact (for example, the upper contact 10 in FIG. 1) provided at one end and a second contact (for example, the lower contact 20 in FIG. 1) provided at the other end. And a spring portion (for example, the upper spring portion 31 and FIG. 1 in FIG. 1), which is located between the first contact and the second contact and elastically supports the first contact and the second contact so as to extend and contract in the axially outward direction. A lower spring portion 32), and at least a folded portion of the first contact (for example, the folded portion 12 in FIG. 1) is configured to contact an electrode or the like to be contacted. To do.

  Therefore, for example, in the second contact, the folded portion (for example, the folded portion 22 in FIG. 1) may not be formed. Further, the second contact itself may be fixed to the contact target, and only the first contact may be brought into contact with the contact target when a pressing force is applied.

  The folded portion and the spring portion, that is, the first contact, the second contact, and the spring portion may be integrally formed of a conductive material.

  The probe pin may be formed in a flat plate shape such as a metal, and the spring portion may be a side curved portion formed in an intermediate portion between the first contact and the second contact.

  The probe pin may be formed in a thin wire shape, for example, and the spring portion may be a coil formed at an intermediate portion between the first contact and the second contact.

  The first contact and the second contact are formed of a conductive material, and the first contact has a first conductive relay member extending in a direction of the second contact on a first surface of a base end portion of the first contact. The second contact includes a second conductive relay member extending in a direction of the first contact on a surface of the base end portion on the same side as the first surface, and the first conductive relay member and the first contact The two-conductive relay member is brought into contact with each other and electrically connected between the first contact and the second contact by the contraction movement of the spring portion. The first contact, the second contact, the spring portion, the first conductive relay member, and the second conductive relay member are formed in a flat plate shape.

  In this configuration, the first conductive relay member may be provided separately from the first contact, and the second conductive relay member may be provided separately from the second contact, or may be provided integrally.

  The probe pin according to the present invention is configured so that at least the folded portion such as the first contact can make contact with the contact target such as the target electrode, so that the contact position of the first contact with the target electrode or the like can be increased. The probe pin deviates from the first axis passing through the center of the base of the first contact, so that the probe pin causes an amplitude motion at the tip of the first contact when contacting the target electrode or the like, This produces an effect of removing the natural oxide film covering the surface of the portion where the first contact such as the target electrode contacts. Due to this natural oxide film removal effect, the probe pin according to the present invention can always maintain a reliable contact with the target electrode and the like, and can solve the main problem of the present invention.

  Further, the probe pin according to the present invention is formed of a thread-like material having conductivity and hardness such that all the constituent members of the first contact, the second contact, and the spring portion are flat or thin wire-like, Since the spring portion is provided between the first contact and the second contact and does not have a double structure in which the outer periphery of the contact is surrounded by a coiled spring portion, it is possible to realize a high-density probe pin. The secondary problem of the present invention can also be solved.

The probe pin of Embodiment 1 of this invention is shown, (a) is a side view, (b) is a front view. The probe pin of Embodiment 2 of this invention is shown, (a) is a front view, (b) is a surface measurement figure, ((c)) is a rear view. It is explanatory drawing which shows a mode that the 1st conductive relay member of the probe pin shown in FIG. 2 and a 2nd conductive relay member are attached to the base end part of a 1st contact, and the base end part of a 2nd contact, respectively. The probe pin of Embodiment 3 of this invention is shown, (a) is a front view, (b) is a surface measurement, ((c)) is a first contact formed integrally with the first conductive relay member, It is explanatory drawing which shows the state before the 2nd contact formed integrally with the 2nd conductive relay member is each bend | folded, and it will be in the state of (a) front view. It is a figure similar to FIG. 1 which shows the probe pin of Embodiment 4 of this invention. It is a reference figure which shows the natural oxide film removal area | region by the probe pin based on this invention which appears on the object electrode surface covered with the natural oxide film.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the present specification, the upper side is described as upper (for example, upper surface, upper side, upper end) and the lower side is described as lower (for example, lower surface, lower side, lower end) with reference to the drawings. Moreover, in each figure, the same code | symbol is attached | subjected to the same part.

(Embodiment 1)
FIG. 1 shows a side view and a front view of the probe pin according to the first embodiment of the present invention as (a) and (b), respectively. In FIG. 1, as is clear from the side view (a), the probe pin 1 has a flat plate shape as a whole and is integrally formed of a conductive material. The upper contact 10, the lower contact 20, and these An upper spring portion 31 and a lower spring portion 32 are provided between the two. Each of the spring portions 31 and 32 has a shape curved to the side, whereby the upper contact 10 and the lower contact 20 are respectively connected to an IC electrode (not shown) to be inspected and a pad (see FIG. It is comprised so that the elasticity which can apply the pressing force of about 10g (for example, 5g-14g) toward (not shown) will be exhibited.

  The probe pin 1 is preferably manufactured by a photo-etching process in order to avoid material deformation such as warpage, distortion, and bending due to processing. In addition, it can also be manufactured by press working or wire electric discharge machining. Moreover, it is preferable to use the metal which has electroconductivity and toughness, such as copper, copper alloys with copper, zinc, nickel, etc. as a raw material. Alternatively, a material having spring properties may be plated with a metal having predetermined conductivity such as copper, silver, palladium, beryllium, or an alloy of these. In any case, it is necessary to use a material having both conductivity and springiness.

  In the illustrated example, each of the upper spring portion 31 and the lower spring portion 32 is one and has a curved shape to the side, but the number and shape are not limited thereto, Each may be configured to have a spring constant capable of applying a predetermined pressing force to the upper contact 10 and the lower contact 20.

  Next, the upper contact 10 and the lower contact 20 will be described. Since both are substantially the same structure, the following description is mainly performed about the upper contact 10. The upper contact 10 has a tip portion 10b that is folded back in the middle in the vertical direction, and the contact between the upper contact 10 and an electrode such as an IC circuit to be inspected is a folded end, that is, the main body 10a and the tip of the upper contact 10 This is performed at the turn-back portion 12 that becomes the boundary with the portion 10b. As shown in the side view (a), this is the folding back of the first axis I passing through the axial center of the body 10a of the side contact 10 and the second axis II passing through the axial center of the tip 10b. It means that the contact with the target electrode is performed in the part 12.

Here, the movement of the upper contact 10 when the upper contact 10 contacts the target electrode will be described. Since the contact position of the upper contact 10 with the target electrode or the like is deviated from the first axis I passing through the center of the base portion 10a of the first contact, the probe pin 1 has a spring portion when in contact with the target electrode or the like. 31. The bent portion 12 of the upper contact 10 is bent along the first axis so that the contact between the upper contact 10 and the target electrode or the like is performed on the first axis I in a well-balanced manner. Acts as a force to move to a position on I. In response to this force, the folded portion 12 of the upper contact 10 moves to a position on the first axis I. However, the return portion 12 of the upper contact 10 is immediately returned to the original position by the restoring force of the spring portion 31. The amplitude movement of the folded portion 12 of the upper contact 10 that occurs at the time of contact with the target electrode or the like has an effect of removing the natural oxide film that covers the surface of the portion that contacts the first contact such as the target electrode.

(Embodiment 2)
FIG. 2 shows a front view, a side view, and a rear view of the probe pin according to the second embodiment of the present invention as (a), (b), and (c), respectively. In FIG. 2, as is apparent from the side view (b), the probe pin 100 has a flat plate shape as a whole. The material of the upper contact 110 and the lower contact 120 is preferably a conductive material such as copper, silver, palladium, or an alloy thereof having a required conductivity. The S-shaped spring portion 130 located between the upper contact 110 and the lower contact 120 may be conductive such as metal or non-conductive such as resin. The spring portion 130 applies a pressing force of about 10 g (for example, 5 g to 14 g) so that the upper contact 110 and the lower contact 120 are directed toward the IC electrode to be inspected and a pad (not shown) on the counter substrate, respectively. It is configured to demonstrate the elasticity it can.

  The probe pin 100 is preferably manufactured by a photo-etching process in order to avoid material deformation such as warping, distortion, and bending due to processing. In addition, it can also be manufactured by press working or wire electric discharge machining.

  The upper contact 110 and the lower contact 120 respectively have tip portions 110b and 120b that are folded back in the middle in the vertical direction, and contact between the upper contact 110 and an electrode such as an IC circuit to be inspected and the lower contact 120 The contact with the pad on the opposing substrate is made at each folded end, that is, the folded portion 112 at the boundary between the main body 110a and the tip portion 110b of the upper contact 110, and the folded portion between the main body 120a and the folded portion 120b of the lower contact 120. 122. This is because, as shown in the side view (b) of FIG. 2, the first axis XI passing through the axial center of the main body 110a of the upper contact 110 and the second axis XII passing through the axial center of the tip 110b. And the first electrode XI passing through the axial center of the main body 120a of the lower contact 120 and the second axis XII passing through the axial center of the folded portion 120b. This means that the folded portion 122 makes contact with the pad on the opposing substrate.

  The narrow and narrow upper contact 110 and lower contact 120 have wide base portions 114 and 124 that are expanded to a lateral width that substantially matches the lateral width of the spring portion 130, respectively. These base portions 114 and 124 form conductive relay piece fixing portions to which the first conductive relay piece 140 and the second conductive relay piece 150 are fixed by adhesion or the like, respectively. The first conductive relay piece 140 and the second conductive relay piece 150 have substantially the same width as the base portion 114 of the upper contact 110 and the base portion 124 of the lower contact 120, respectively. The relay pieces 150 extend toward each other. The first conductive relay piece 140 has an extended portion 140a formed in a long and thin protrusion shape at the tip. The second conductive relay piece 150 is formed with an elongated concave portion 150a having a width that corresponds to the extended portion 140a and is slightly widened so that the extended portion 140a can be received.

In FIG. 3, the first conductive relay piece 140 is attached to the base 114 of the upper contact 110.
A state in which the second conductive relay piece 150 is attached to the base portion 124 of the lower contact 120 is shown.

  Here, a path of current flowing from the upper contact 110 to the lower contact 120 in the second embodiment will be described. The spring part 130 may or may not be conductive as described above. Even when the spring part 130 is conductive, the spring part 130 is formed in an S-shaped snake shape, so that the path from the current reaching the lower contact 120 from the upper contact 110 is long and quick inspection can be performed. There is no possibility. However, the first conductive relay piece 140 is attached to the upper contact 110, and the second conductive relay piece 150 is attached to the lower contact 120. For this reason, when the upper contact 110 is pressed by the target electrode and the spring portion 130 is bent at the time of inspection, the extended portion 140a of the first conductive relay piece 140 is fitted into the concave portion 150a of the second conductive relay piece 150. The first conductive relay piece 140 and the second conductive relay piece 150 are in contact with each other, and a current flows smoothly from the upper contact 110 to the lower contact 120, thereby enabling quick inspection.

  In the second embodiment, the upper contact 110 when the upper contact 110 comes into contact with the target electrode moves in the same manner as described in the first embodiment. That is, since the contact position of the upper contact 110 with the target electrode or the like is deviated from the first axis XI passing through the center of the base 110a of the first contact, the probe pin 100 is in contact with the target electrode or the like. The bending is performed under the pressing force of the spring portion 131. This bending causes the tip 112 of the upper contact 110 to be in the first position so that the contact between the upper contact 110 and the target electrode or the like is performed in a balanced manner on the first axis XI. Acts as a force to move to a position on one axis XI. Under this force, the tip 112 of the upper contact 110 moves to a position on the first axis XI. However, the tip 112 of the upper contact 110 is immediately returned to the original position by the restoring force of the spring portion 130. The amplitude movement of the tip 112 of the upper contact 110 that occurs at the time of contact with the target electrode or the like has an effect of removing the natural oxide film that covers the surface of the portion that the first contact such as the target electrode contacts.

(Embodiment 3)
FIG. 4 shows a front view and a side view of a probe pin according to Embodiment 3 of the present invention as (a) and (b), respectively, and (c) is a front view before taking the form of (a). That is, the form before assembly is shown as a development view. In the second embodiment shown in FIGS. 2 and 3, the first conductive relay piece 140 and the second conductive relay piece 150 are made separately from the upper contact 110 and the lower contact 120. Although fixed to the base 114 and the base 124 of the lower contact 120 by adhesion or the like, in the third embodiment, the first conductive relay piece 240 and the second conductive relay piece 250 are the upper contact 210 and the lower contact 220. And made in one.

  Then, as can be seen from the developed view (c) of FIG. 4, the folded portions are folded at the intermediate ff between the upper contact 210 and the lower contact 220 excluding the first conductive relay piece 240 and the second conductive relay piece 250, respectively. As a result, the upper contact 210 and the folded portion 212 of the lower contact 220 are brought into contact with the electrodes such as an IC circuit to be inspected and the pads on the counter substrate and the lower contacts 120 and the pads on the counter substrate. , 222 are formed. The configuration of this part will be described in detail later.

As is clear from the developed view (c), the probe pin 200 has a flat plate shape as a whole. The material of the upper contact 210 including the first conductive relay piece 240 and the lower contact 220 including the second conductive relay piece 250 is a conductive material such as copper, silver, palladium, or an alloy thereof. Those having the following conductivity are preferred. The S-shaped spring portion 230 located between the upper contact 210 and the lower contact 220 may be conductive such as metal or non-conductive such as resin. This spring portion 230 is an elastic that can apply a pressing force of about 10 g (for example, 5 to 14 g) toward the IC electrode to be inspected and a pad (not shown) on the counter substrate, respectively, on the upper contact 210 and the lower contact 220. It is configured to exert its power.

  As in the first and second embodiments, the probe pin 200 is preferably manufactured by photo-etching processing in order to avoid material deformation such as warpage, distortion, and bending due to processing. In addition, it can also be manufactured by press working or wire electric discharge machining.

  Also in the third embodiment, as in the first and second embodiments, the upper contact 210 and the lower contact 220 are each of the first conductive, as can be seen from the front view (a) and the side view (b) of FIG. The portion excluding the relay piece 240 and the second conductive relay piece 250 has tip portions 210b and 220b which are folded back at the intermediate portion in the vertical direction, and the contact between the upper contact 110 and an electrode such as an IC circuit to be inspected and The contact between the lower contact 120 and the pad on the counter substrate is made at each folded end, that is, the folded portion 112 at the boundary between the main body 210a and the tip portion 210b of the upper contact 210, and the main body 220a and the folded portion of the lower contact 220. This is performed at the folding portion 222 at the boundary with 220b. This is because, in the side view (b) of FIG. 4, the folded portion between the first axis XXI passing through the axial center of the main body 210a of the upper contact 210 and the second axis XXII passing through the axial center of the tip 210b. In 212, contact with the target electrode is performed, and at an intermediate point 222 between the first axis XXI passing through the axial center of the main body 220a of the lower contact 220 and the second axis XXII passing through the axial center of the folded portion 220b, It means that contact with the pad on the opposing substrate is made.

  The narrower and narrower upper contact 210 and lower contact 220 have wide base portions 214 and 224 that are expanded to a lateral width that substantially matches the lateral width of the spring portion 230. These base portions 214 and 224 are each fixed with a conductive relay piece in which the first conductive relay piece 140 and the second conductive relay piece 250, which are folded back at ff in the developed view (c) of FIG. Part. The first conductive relay piece 240 and the second conductive relay element 250 have substantially the same width as the base 214 of the upper contact 210 and the base 224 of the lower contact 220, respectively. The relay piece 250 extends toward each other. The first conductive relay 240 has an extended portion 240a formed in the shape of an elongated protrusion at the tip. The second conductive relay piece 250 has a tip that is slightly expanded so as to receive the extension 240a, and an elongated recess 250a having a width corresponding to the extension 240a is formed.

  The path of the current flowing from the upper contact 210 to the lower contact 220 in the third embodiment is the same as in the third embodiment. That is, the spring portion 230 may or may not be conductive. When the spring portion 230 is not conductive, current does not flow from the upper contact 210 to the lower contact 220 via the spring portion 230, and even when the spring portion 230 is conductive, the spring portion 230 has an S-shaped snake. Since it is formed in a shape, there is a possibility that the path from the current reaching the lower contact 220 from the upper contact 210 is long and rapid inspection cannot be performed. However, the first conductive relay piece 240 is attached to the upper contact 210, and the second conductive relay piece 250 is attached to the lower contact 220. For this reason, when the upper contact 210 is pressed by the target electrode and the spring portion 230 is bent at the time of inspection, the extended portion 240a of the first conductive relay piece 240 fits into the concave portion 250a of the second conductive relay piece 250. The first conductive relay piece 240 and the second conductive relay piece 250 are in contact with each other, and a current flows smoothly from the upper contact 210 to the lower contact 220, thereby enabling quick inspection.

In the third embodiment, the upper contact 210 when the upper contact 210 comes into contact with the target electrode performs the same movement as that described in the first embodiment. That is, as can be seen from the side view (b) of FIG. 4, the contact position of the upper contact 210 with the target electrode or the like is deviated from the first axis XXI passing through the center of the main body 210a of the first contact. Therefore, at the time of contact with the target electrode or the like, the probe pin 200 receives the pressing force of the spring portion 231 and bends. As is done in FIG. 5, this acts as a force that moves the folded portion 212 of the upper contact 210 to a position on the first axis XXI. In response to this force, the folded portion 212 of the upper contact 210 moves to a position on the first axis XXI. However, the return portion 212 of the upper contact 210 is immediately returned to the original position by the restoring force of the spring portion 230. The amplitude movement of the folded portion 212 of the upper contact 210 that occurs at the time of contact with the target electrode or the like has the effect of removing the natural oxide film that covers the surface of the portion that contacts the first contact such as the target electrode.

(Embodiment 4)
FIG. 5 shows a side view and a front view of the probe pin according to the fourth embodiment of the present invention as (a) and (b), respectively. In the fourth embodiment, the material of the probe pin 1 that is integrally formed of the planar flat plate-like conductive material in the first embodiment is made of a rigid thread-like material having conductivity like a thin wire shape. An example replaced with a conductive material is shown. In FIG. 4, as is clear from the side view (a), the probe pin 300 has a thin rod shape as a whole and is integrally formed of a conductive material, and the upper contact 310, the lower contact 320, and between them. The spring part 330 located in is provided. The spring portion 330 has a coil shape, so that the upper contact 310 and the lower contact 320 are respectively directed to an IC electrode (not shown) to be inspected and a pad (not shown) on a counter substrate (around 10 g) ( For example, it is comprised so that the elasticity which can apply the pressing force of 5g-14g) is exhibited.

  The material of the probe pin 300 is preferably a conductive and tough metal such as copper, a copper alloy of copper and zinc, nickel, or the like. Alternatively, a material having spring properties may be plated with a metal having predetermined conductivity such as copper, silver, palladium, beryllium, or an alloy of these. In any case, it is necessary to use a material having both conductivity and springiness.

  Since the upper contact 310 and the lower contact 320 are configured to be substantially the same, the following description will be mainly given with respect to the upper contact 10. The upper contact 310 has a front end portion 310b that is folded back in the middle in the vertical direction, and the contact between the upper contact 310 and an electrode such as an IC circuit to be inspected is a folded end, that is, the main body 310a and the front end of the upper contact 310. This is performed by the folding unit 312 with the unit 310b. As shown in the side view (a) of FIG. 4, this means that the first axis XXXI passing through the axial center of the main body 310a of the upper contact 310 and the second axis XXXII passing through the axial center of the tip 310b. This means that contact with the target electrode is performed at the folded portion 312.

  The movement of the upper contact 310 when the upper contact 310 contacts the target electrode will be described above. Since the contact position of the upper contact 310 with the target electrode or the like is deviated from the first axis XXXI passing through the center of the base portion 310a of the upper contact 310, the probe pin 300 has the spring portion 330 at the time of contact with the target electrode or the like. The tip 312 of the upper contact 310 is moved on the first axis XXXI so that the contact between the upper contact 310 and the target electrode or the like is performed on the first axis XXXI in a balanced manner. Acts as a force to move to the position. In response to this force, the tip 312 of the upper contact 310 moves to a position on the first axis XXXI. However, the tip 312 of the upper contact 310 is immediately returned to the original position by the restoring force of the spring portion 330. The amplitude movement of the tip 312 of the upper contact 10 that occurs at the time of contact with the target electrode or the like has the effect of removing the natural oxide film that covers the surface of the part that the first contact such as the target electrode contacts.

FIG. 6A shows the solder surface when the upper contacts 10, 110, 210 of the flat probe pins 10, 100, 200 in the first, second, and third embodiments contact the target electrode, for example, the solder 60 in FIG. A region 70 of the removed portion of the natural oxide film is shown. Moreover, (b) shows the region 80 of the removed portion of the natural oxide film covering the solder surface when the upper contact 310 of the wire-like probe pin 300 in Embodiment 4 contacts the solder 80 of the target electrode, for example. As shown in (a), the rectangular natural oxide film removal region 70 is exposed on the surface of the solder 60 by using the flat probe pins 10, 100, and 200. Further, as shown in (b), by using the wire-like probe pin 300, the linear natural oxide film removal region 90 is exposed on the surface of the solder 80.

  The probe pin according to the present invention can be widely used in various probe units.

100, 200, 300 Probe pins 10, 110, 210, 310 First contacts 10a, 110a, 210a, 310a First contact bodies 10b, 110b, 210b, 310b First contact tips 12, 112, 212, 312 First contact folding portions 20, 120, 220, 320 Second contacts 20a, 120a, 220a, 320a Second contact bodies 20b, 120b, 220b, 320b Second contact tip portions 22, 122, 222, 322 Second contact folding portions 31, 32, 130, 230, 330, spring portions 140, 240 First conductive relay piece 150, 250 Second conductive relay piece I, XI, XXI, XXXXI First axis
II, XII, XXII, XXXII Second axis

Claims (10)

A folded portion that is provided at least at one end and contacts the contact object;
A probe pin comprising: a spring portion that is adjacent to the folded portion and is biased when the folded portion is brought into contact with the contact target.   The probe pin according to claim 1, wherein the folded portion and the spring portion are integrally formed of a conductive material.   The probe pin according to claim 2, wherein the probe pin has a flat plate shape having conductivity.   The probe pin according to claim 3, wherein the spring portion is a side curved portion.   The probe pin according to claim 2, wherein the conductive material is in the form of a hard thread.   The probe pin according to claim 5, wherein the spring portion is a coil spring.   The folded portion is formed of a conductive material, and the folded portion includes a first conductive relay member extending on a first surface of a base end portion thereof in a direction of a contact located at the other end different from the one end. Comprises a second conductive relay member extending in the extending direction of the folded portion on the same side of the base end as the first surface, and the first conductive relay member and the second conductive relay member are The probe pins according to claim 1, which contact each other by contraction movement of the spring portions.   The probe pin according to claim 7, wherein the folded portion, the contact, the spring portion, the first conductive relay member, and the second conductive relay member have a flat plate shape.   The probe pin according to claim 8, wherein the first conductive relay member is provided separately from the folded portion, and the first conductive relay member is provided separately from the folded portion. The probe pin according to claim 8, wherein the first conductive relay member is integrally formed with the folded portion, and the first conductive relay member is integrally formed with the folded portion.

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