JP6905105B2 - 窒素雰囲気レーザーボンディング装置 - Google Patents

窒素雰囲気レーザーボンディング装置 Download PDF

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Publication number
JP6905105B2
JP6905105B2 JP2020012475A JP2020012475A JP6905105B2 JP 6905105 B2 JP6905105 B2 JP 6905105B2 JP 2020012475 A JP2020012475 A JP 2020012475A JP 2020012475 A JP2020012475 A JP 2020012475A JP 6905105 B2 JP6905105 B2 JP 6905105B2
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Japan
Prior art keywords
nitrogen
target
semiconductor chip
gas
nitrogen atmosphere
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Active
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JP2020012475A
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English (en)
Japanese (ja)
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JP2020123722A (ja
Inventor
ヨン スン コ
ヨン スン コ
グン シク アン
グン シク アン
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Protec Co Ltd Korea
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Protec Co Ltd Korea
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Publication of JP2020123722A publication Critical patent/JP2020123722A/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/1462—Nozzles; Features related to nozzles
    • B23K26/1464—Supply to, or discharge from, nozzles of media, e.g. gas, powder, wire
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H01L33/0093—Wafer bonding; Removal of the growth substrate

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
  • Laser Beam Processing (AREA)
JP2020012475A 2019-01-29 2020-01-29 窒素雰囲気レーザーボンディング装置 Active JP6905105B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2019-0011289 2019-01-29
KR1020190011289A KR102208069B1 (ko) 2019-01-29 2019-01-29 질소 분위기 레이저 본딩 장치

Publications (2)

Publication Number Publication Date
JP2020123722A JP2020123722A (ja) 2020-08-13
JP6905105B2 true JP6905105B2 (ja) 2021-07-21

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ID=71992983

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JP2020012475A Active JP6905105B2 (ja) 2019-01-29 2020-01-29 窒素雰囲気レーザーボンディング装置

Country Status (3)

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JP (1) JP6905105B2 (ko)
KR (1) KR102208069B1 (ko)
TW (1) TWI711143B (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102470931B1 (ko) * 2020-12-30 2022-11-29 주식회사 비아트론 레이저 본딩용 마스크 모듈 및 이를 포함하는 레이저 본딩 장치

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4278867A (en) * 1978-12-29 1981-07-14 International Business Machines Corporation System for chip joining by short wavelength radiation
JPS5850743A (ja) * 1981-09-21 1983-03-25 Mitsubishi Electric Corp ボンデイング治具
US5227604A (en) * 1991-06-28 1993-07-13 Digital Equipment Corporation Atmospheric pressure gaseous-flux-assisted laser reflow soldering
JPH09206926A (ja) * 1996-01-29 1997-08-12 Oki Electric Ind Co Ltd 不活性雰囲気作成装置
JPH10200251A (ja) * 1997-01-09 1998-07-31 Taiyo Yuden Co Ltd 回路モジュールの製造方法
JP2009166065A (ja) * 2008-01-15 2009-07-30 Nippon Densan Corp レーザ加工方法、軸受装置、スピンドルモータ、およびディスク駆動装置
TWI413195B (zh) * 2011-01-20 2013-10-21 Walton Advanced Eng Inc 減少模封膠體內氣泡之壓縮模封方法與裝置
EP2671251A2 (de) * 2011-02-02 2013-12-11 Pac Tech - Packaging Technologies GmbH Verfahren und vorrichtung zur elektrischen kontaktierung von anschlussflächen zweier substrate
JP5912264B2 (ja) * 2011-02-28 2016-04-27 日本発條株式会社 レーザー加工方法及び装置
TW201240542A (en) * 2011-03-24 2012-10-01 Valley Lane Electronics Co Ltd Die bonding system and method of bonding dies
JP5849606B2 (ja) * 2011-10-21 2016-01-27 株式会社Ihi スクライブ装置
US9916989B2 (en) * 2016-04-15 2018-03-13 Amkor Technology, Inc. System and method for laser assisted bonding of semiconductor die
JP6419256B1 (ja) * 2017-04-28 2018-11-07 株式会社 後島精工 ボンディング装置の不活性ガスフローシステム

Also Published As

Publication number Publication date
TWI711143B (zh) 2020-11-21
TW202032741A (zh) 2020-09-01
KR102208069B1 (ko) 2021-01-27
JP2020123722A (ja) 2020-08-13
KR20200093936A (ko) 2020-08-06

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