JP6896676B2 - 熱交換器 - Google Patents
熱交換器 Download PDFInfo
- Publication number
- JP6896676B2 JP6896676B2 JP2018105121A JP2018105121A JP6896676B2 JP 6896676 B2 JP6896676 B2 JP 6896676B2 JP 2018105121 A JP2018105121 A JP 2018105121A JP 2018105121 A JP2018105121 A JP 2018105121A JP 6896676 B2 JP6896676 B2 JP 6896676B2
- Authority
- JP
- Japan
- Prior art keywords
- flow path
- heat exchanger
- partition member
- communication hole
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018105121A JP6896676B2 (ja) | 2018-05-31 | 2018-05-31 | 熱交換器 |
| DE112019001845.0T DE112019001845B4 (de) | 2018-04-09 | 2019-02-28 | Wärmetauscher |
| CN202410241577.5A CN118129501A (zh) | 2018-04-09 | 2019-02-28 | 热交换器 |
| CN201980023129.5A CN111919293B (zh) | 2018-04-09 | 2019-02-28 | 热交换器 |
| CN202410241500.8A CN118111257A (zh) | 2018-04-09 | 2019-02-28 | 热交换器 |
| PCT/JP2019/007734 WO2019198368A1 (ja) | 2018-04-09 | 2019-02-28 | 熱交換器 |
| US17/066,589 US12074089B2 (en) | 2018-04-09 | 2020-10-09 | Heat exchanger |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018105121A JP6896676B2 (ja) | 2018-05-31 | 2018-05-31 | 熱交換器 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2019211112A JP2019211112A (ja) | 2019-12-12 |
| JP2019211112A5 JP2019211112A5 (enExample) | 2020-06-11 |
| JP6896676B2 true JP6896676B2 (ja) | 2021-06-30 |
Family
ID=68846681
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018105121A Active JP6896676B2 (ja) | 2018-04-09 | 2018-05-31 | 熱交換器 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6896676B2 (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102651402B1 (ko) * | 2020-08-31 | 2024-03-27 | 주식회사 경동나비엔 | 열교환기 조립체 및 이를 구비한 온수기 |
| CA3193432A1 (en) | 2020-08-31 | 2022-03-03 | Kyungdong Navien Co., Ltd. | Heat exchanger assembly and water heater comprising same |
| WO2025198059A1 (ja) * | 2024-03-22 | 2025-09-25 | 三桜工業株式会社 | 冷却器及び組立体 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5031693A (en) * | 1990-10-31 | 1991-07-16 | Sundstrand Corporation | Jet impingement plate fin heat exchanger |
| JPH0637219A (ja) * | 1992-07-16 | 1994-02-10 | Fuji Electric Co Ltd | パワー半導体装置の冷却装置 |
| JP3908705B2 (ja) * | 2003-08-29 | 2007-04-25 | 株式会社東芝 | 液冷装置及び液冷システム |
| JP4881583B2 (ja) * | 2005-06-27 | 2012-02-22 | 株式会社豊田自動織機 | パワーモジュール用ヒートシンク |
| JP4967988B2 (ja) * | 2007-10-25 | 2012-07-04 | 株式会社豊田自動織機 | 半導体冷却装置 |
| JP4941398B2 (ja) * | 2008-04-23 | 2012-05-30 | 株式会社デンソー | 積層型冷却器 |
| JP2009266937A (ja) * | 2008-04-23 | 2009-11-12 | Denso Corp | 積層型冷却器 |
| JP2010040757A (ja) * | 2008-08-05 | 2010-02-18 | Denso Corp | 電子部品冷却器 |
| JP5382185B2 (ja) * | 2012-10-08 | 2014-01-08 | 株式会社デンソー | 積層型冷却器 |
| JP2015023044A (ja) * | 2013-07-16 | 2015-02-02 | 株式会社Uacj | 冷却器 |
| US9955613B2 (en) * | 2016-09-13 | 2018-04-24 | Denso International America, Inc. | Cooler and power electronic module having the same |
| JP6610505B2 (ja) * | 2016-11-01 | 2019-11-27 | 株式会社デンソー | 積層型熱交換器、および積層型熱交換器の製造方法 |
| JP7000777B2 (ja) * | 2017-09-28 | 2022-02-10 | 株式会社デンソー | 熱交換器 |
-
2018
- 2018-05-31 JP JP2018105121A patent/JP6896676B2/ja active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP2019211112A (ja) | 2019-12-12 |
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