JP6896676B2 - 熱交換器 - Google Patents

熱交換器 Download PDF

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Publication number
JP6896676B2
JP6896676B2 JP2018105121A JP2018105121A JP6896676B2 JP 6896676 B2 JP6896676 B2 JP 6896676B2 JP 2018105121 A JP2018105121 A JP 2018105121A JP 2018105121 A JP2018105121 A JP 2018105121A JP 6896676 B2 JP6896676 B2 JP 6896676B2
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JP
Japan
Prior art keywords
flow path
heat exchanger
partition member
communication hole
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2018105121A
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English (en)
Japanese (ja)
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JP2019211112A5 (enExample
JP2019211112A (ja
Inventor
暁琳 郭
暁琳 郭
浩嗣 朝柄
浩嗣 朝柄
和哉 竹内
和哉 竹内
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
Denso Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2018105121A priority Critical patent/JP6896676B2/ja
Application filed by Denso Corp filed Critical Denso Corp
Priority to CN202410241500.8A priority patent/CN118111257A/zh
Priority to DE112019001845.0T priority patent/DE112019001845B4/de
Priority to CN202410241577.5A priority patent/CN118129501A/zh
Priority to CN201980023129.5A priority patent/CN111919293B/zh
Priority to PCT/JP2019/007734 priority patent/WO2019198368A1/ja
Publication of JP2019211112A publication Critical patent/JP2019211112A/ja
Publication of JP2019211112A5 publication Critical patent/JP2019211112A5/ja
Priority to US17/066,589 priority patent/US12074089B2/en
Application granted granted Critical
Publication of JP6896676B2 publication Critical patent/JP6896676B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2018105121A 2018-04-09 2018-05-31 熱交換器 Active JP6896676B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2018105121A JP6896676B2 (ja) 2018-05-31 2018-05-31 熱交換器
DE112019001845.0T DE112019001845B4 (de) 2018-04-09 2019-02-28 Wärmetauscher
CN202410241577.5A CN118129501A (zh) 2018-04-09 2019-02-28 热交换器
CN201980023129.5A CN111919293B (zh) 2018-04-09 2019-02-28 热交换器
CN202410241500.8A CN118111257A (zh) 2018-04-09 2019-02-28 热交换器
PCT/JP2019/007734 WO2019198368A1 (ja) 2018-04-09 2019-02-28 熱交換器
US17/066,589 US12074089B2 (en) 2018-04-09 2020-10-09 Heat exchanger

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018105121A JP6896676B2 (ja) 2018-05-31 2018-05-31 熱交換器

Publications (3)

Publication Number Publication Date
JP2019211112A JP2019211112A (ja) 2019-12-12
JP2019211112A5 JP2019211112A5 (enExample) 2020-06-11
JP6896676B2 true JP6896676B2 (ja) 2021-06-30

Family

ID=68846681

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018105121A Active JP6896676B2 (ja) 2018-04-09 2018-05-31 熱交換器

Country Status (1)

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JP (1) JP6896676B2 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102651402B1 (ko) * 2020-08-31 2024-03-27 주식회사 경동나비엔 열교환기 조립체 및 이를 구비한 온수기
CA3193432A1 (en) 2020-08-31 2022-03-03 Kyungdong Navien Co., Ltd. Heat exchanger assembly and water heater comprising same
WO2025198059A1 (ja) * 2024-03-22 2025-09-25 三桜工業株式会社 冷却器及び組立体

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5031693A (en) * 1990-10-31 1991-07-16 Sundstrand Corporation Jet impingement plate fin heat exchanger
JPH0637219A (ja) * 1992-07-16 1994-02-10 Fuji Electric Co Ltd パワー半導体装置の冷却装置
JP3908705B2 (ja) * 2003-08-29 2007-04-25 株式会社東芝 液冷装置及び液冷システム
JP4881583B2 (ja) * 2005-06-27 2012-02-22 株式会社豊田自動織機 パワーモジュール用ヒートシンク
JP4967988B2 (ja) * 2007-10-25 2012-07-04 株式会社豊田自動織機 半導体冷却装置
JP4941398B2 (ja) * 2008-04-23 2012-05-30 株式会社デンソー 積層型冷却器
JP2009266937A (ja) * 2008-04-23 2009-11-12 Denso Corp 積層型冷却器
JP2010040757A (ja) * 2008-08-05 2010-02-18 Denso Corp 電子部品冷却器
JP5382185B2 (ja) * 2012-10-08 2014-01-08 株式会社デンソー 積層型冷却器
JP2015023044A (ja) * 2013-07-16 2015-02-02 株式会社Uacj 冷却器
US9955613B2 (en) * 2016-09-13 2018-04-24 Denso International America, Inc. Cooler and power electronic module having the same
JP6610505B2 (ja) * 2016-11-01 2019-11-27 株式会社デンソー 積層型熱交換器、および積層型熱交換器の製造方法
JP7000777B2 (ja) * 2017-09-28 2022-02-10 株式会社デンソー 熱交換器

Also Published As

Publication number Publication date
JP2019211112A (ja) 2019-12-12

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