JP6892339B2 - Resistor - Google Patents

Description

The present invention relates to resistors.

As an example of a conventional chip resistor, a chip-shaped resistor having four electrodes is known (see, for example, Patent Document 1). The chip resistor shown in FIG. 10 of Patent Document 1 is provided with four electrodes (3) separated from each other on one side of an elongated rectangular resistor (1). A cross-shaped insulating film (4) is formed on one side of the resistor, and the four electrodes are provided on a region on one side of the resistor where the insulating film is not formed. In order to manufacture this chip resistor, as shown in FIG. 10 (c) of the same document, a lattice-shaped insulating film (4A) is formed on one side of the plate-shaped resistor material (1A), and the above-mentioned A conductive member (3A), which is the original shape of the electrode, is formed in the remaining region on one side to obtain a plate-shaped resistor assembly. Here, the dimensions of the conductive member to be the electrode are defined by the relationship with the insulating film. Then, by cutting this resistor assembly at the location shown by the virtual line in the figure, a plurality of chip resistors each having four electrodes can be obtained.

In a chip resistor having such four electrodes, for example, the following can be used. Of the four electrodes, two electrodes (for example, two electrodes separated in the longitudinal direction of the resistor) are used as a pair of current electrodes (main electrodes), and the remaining two electrodes are used as a pair of voltage electrodes (secondary electrodes). Used as an electrode). When detecting the current of an electric circuit, the pair of current electrodes are electrically connected to the electric circuit so that the current of the electric circuit flows. A voltmeter is connected to the pair of voltage electrodes. Since the resistance value of the chip resistor is known, when the voltage drop in the resistor of this chip resistor is measured using the above voltmeter, the current flowing through the resistor is applied by applying this measured value to the ohm equation. It becomes possible to know the value of. When using a chip resistor, it is mounted on a circuit board, for example. The chip resistor is mounted, for example, by placing the chip resistor on the four conductive terminals formed on the circuit board so that the four electrodes are located and soldering the chip resistor.

However, in the above-mentioned chip resistor, when the resistor assembly obtained at the time of manufacturing the chip resistor is cut, if the cutting position deviates from a desired position, the four electrodes of the chip resistor obtained by cutting are used. There is an error in the dimensions. For example, if there is an error in the width dimension of each electrode, the resistance value of the resistor sandwiched between the pair of current electrodes and the pair of voltage electrodes does not become the desired value, and is measured using a chip resistor. The value of the current has caused the inconvenience of being inaccurate.

Japanese Unexamined Patent Publication No. 2004-63503

The present invention has been conceived under the above circumstances, and in a chip resistor provided with four electrodes, a chip resistor suitable for eliminating or suppressing an error in resistance value can be efficiently provided. Manufacture is the main issue.

According to the first aspect of the present invention, the step of forming a resistor assembly in which the resistor member is provided with a conductive member including a portion separated in the first direction, and the above-mentioned resistor assembly are punched out. A chip-shaped resistor formed by a part of the resistor member, a pair of main electrodes formed by a part of the conductive member and separated from each other in the first direction, and one of the conductive members. A pair of portions that are formed by the portions and are separated from each other in the first direction and are adjacent to the main electrode with a recess recessed in the first direction in the second direction, each of which is perpendicular to the first direction. A method for manufacturing a chip resistor is provided, which comprises a step of dividing the chip resistor having an auxiliary electrode and the like.

In a preferred embodiment of the invention, the resistor member has at least one resistor length plate extending in one direction, and the conductive member has a plurality of conductive length plates each extending in one direction. Then, in the step of forming the resistor assembly, the plurality of conductive long plates are separated from each other along the lateral direction which is perpendicular to the longitudinal direction which is the extending direction of the conductive long plates. The step of arranging the resistor long plates in the above, the step of arranging the resistor long plates at positions sandwiched between two adjacent conductive long plates, and joining the adjacent resistor long plates and the conductive long plates. It has a process to be performed.

In a preferred embodiment of the present invention, the adjacent resistor length plate and the conductive length plate are joined by welding.

In a preferred embodiment of the present invention, the thickness of the resistor length plate is smaller than the thickness of the conductive length plate.

In a preferred embodiment of the present invention, the resistor member is plate-shaped, and the step of forming the resistor assembly is a step of forming an insulating film extending in one direction on one side of the resistor member. A step of forming the conductive member by plating on a region of the single surface where the insulating film is not formed.

In a preferred embodiment of the present invention, the step of forming the resistor assembly includes a step of preparing a bonded body in which a plate-shaped resistance material and a plate-shaped conductive material are bonded, and one of the above-mentioned conductive materials. The present invention includes a step of forming the conductive member including the portions separated in the first direction by removing the portions.

In a preferred embodiment of the present invention, in the dividing step, the chip resistors are collectively divided into a plurality of chip resistors.

According to the second aspect of the present invention, a chip-shaped resistor, a pair of main electrodes provided on the resistor and separated in the first direction, and a pair of main electrodes provided on the resistor and separated in the first direction are separated. A pair of sub-electrodes that are separated from the main electrode in a second direction, each of which is perpendicular to the first direction, and the main electrode and the sub-electrode that are separated from each other in the second direction. Is adjacent to each other with a recessed recess in the first direction interposed therebetween, and each of the main electrodes is located on the first side of the main electrode located on the outer side of the first direction and on the inner side of the second direction. It is configured to include the second side of the main electrode to be located, and has a main electrode mounting surface facing one of the third directions, which is perpendicular to both the first direction and the second direction, and each of the sub-electrodes has a main electrode mounting surface facing one of the third directions. A sub-electrode mounting that includes a first side of the sub-electrode located on the outer side of the first direction and a second side of the sub-electrode located on the inner side of the second direction, and faces one of the third directions. A first side surface on the main electrode side that has a surface and extends from the first side of the main electrode to the other side in the third direction, and a second side surface on the main electrode side that extends from the second side of the main electrode to the other side in the third direction. , The first curved surface on the main electrode side interposed between the first side surface on the main electrode side and the second side surface on the main electrode side, and the first side surface on the sub-electrode side extending from the first side of the sub-electrode to the other side in the third direction. , The second side surface on the sub-electrode side extending from the second side of the sub-electrode to the other side in the third direction, and the first curved surface on the sub-electrode side interposed between the first side surface on the sub-electrode side and the second side surface on the sub-electrode side. A chip resistor having, is provided.

In a preferred embodiment of the present invention, the main electrode mounting surface is configured to include a third side of the main electrode located outside the second direction, and the third side of the main electrode to the other in the third direction. It has a third side surface on the main electrode side leading to the side, and a second curved surface on the main electrode side interposed between the first side surface on the main electrode side and the third side surface on the main electrode side.

In a preferred embodiment of the present invention, the auxiliary electrode mounting surface is configured to include a third side of the auxiliary electrode located outside the second direction, and the third side of the auxiliary electrode to the other in the third direction. It has a third side surface on the sub-electrode side leading to the side, and a second curved surface on the sub-electrode side interposed between the first side surface on the sub-electrode side and the third side surface on the sub-electrode side.

In a preferred embodiment of the present invention, the dimensions of the main electrode in the second direction are larger than the dimensions of the sub-electrode in the second direction.

In a preferred embodiment of the present invention, the recess is located outward in the first direction from the boundary between the resistor and the adjacent main electrode and sub-electrode in the third direction. ..

In a preferred embodiment of the present invention, the recess penetrates inward in the first direction from the boundary between the resistor and the adjacent main electrode and sub-electrode in the third direction. There is.

In a preferred embodiment of the present invention, the pair of main electrodes sandwiches the resistor, and the pair of sub-electrodes sandwich the resistor.

In a preferred embodiment of the present invention, the thickness of the resistor is smaller than the thickness of the main electrode and the thickness of the sub-electrode.

In a preferred embodiment of the present invention, the pair of main electrodes and the pair of sub-electrodes are provided on one surface of the resistor facing the third direction.

In a preferred embodiment of the present invention, the first side surface on the main electrode side and the first side surface on the sub-electrode side each have a fracture mark forming surface on which a fracture mark is formed.

In a preferred embodiment of the present invention, the edge extending portion extending outward in the third direction is provided on the outer edge of the third direction of the fracture mark forming surface. ..

In a preferred embodiment of the present invention, the second side surface on the main electrode side and the second side surface on the sub-electrode side are perpendicular to the second direction.

In a preferred embodiment of the present invention, the distance between the second side surface on the main electrode side and the second side surface on the sub-electrode side becomes smaller as the distance from each other increases from the outside in the first direction to the inside in the first direction. ing.

In a preferred embodiment of the present invention, the second side surface on the main electrode side and the second side surface on the sub-electrode side are both curved surfaces.

Other features and advantages of the present invention will become more apparent with the detailed description given below with reference to the accompanying drawings.

It is a perspective view of the chip resistor which concerns on 1st Embodiment of this invention. It is a top view of the chip resistor shown in FIG. It is a front view of the chip resistor shown in FIG. It is a bottom view of the chip resistor shown in FIG. It is sectional drawing which follows the VV line of FIG. It is sectional drawing which follows the VI-VI line of FIG. FIG. 2 is a view taken along the line VII-VII of FIG. It is a VIII-VIII arrow view of FIG. It is a top view which shows one step in the manufacturing method of the chip resistor which concerns on 1st Embodiment of this invention. FIG. 5 is a cross-sectional view taken along the line XX of FIG. It is a top view which shows one step in the manufacturing method of the chip resistor which concerns on 1st Embodiment of this invention. It is sectional drawing which follows the XII-XII line of FIG. It is a top view which shows one step in the manufacturing method of the chip resistor which concerns on 1st Embodiment of this invention. It is sectional drawing which follows the XIV-XIV line of FIG. It is a top view which shows one step which follows the step shown in FIG. It is a top view which shows one step in the modification of the manufacturing method of the chip resistor which concerns on 1st Embodiment of this invention. 16 is a cross-sectional view taken along the line XVII-XVII of FIG. It is a top view which shows the modification of the chip resistor which concerns on 1st Embodiment of this invention. It is a top view which shows the modification of the chip resistor which concerns on 1st Embodiment of this invention. It is a perspective view of the chip resistor which concerns on 2nd Embodiment of this invention. It is a top view of the chip resistor shown in FIG. It is a front view of the chip resistor shown in FIG. It is a bottom view of the chip resistor shown in FIG. FIG. 2 is a cross-sectional view taken along the line XXIV-XXIV of FIG. FIG. 2 is a cross-sectional view taken along the line XXV-XXV of FIG. FIG. 21 is an arrow view of XXVI-XXVI of FIG. FIG. 21 is an arrow view of XXVII-XXVII of FIG. It is a perspective view which shows one step in the manufacturing method of the chip resistor which concerns on 2nd Embodiment of this invention. It is a perspective view which shows one step following the step shown in FIG. 28. It is a perspective view which shows one step which follows the step shown in FIG. It is a perspective view which shows one step which follows the step shown in FIG. It is a top view which shows one step which follows the step shown in FIG. It is a perspective view of the chip resistor which concerns on 3rd Embodiment of this invention. It is a top view of the chip resistor shown in FIG. 33. It is a front view of the chip resistor shown in FIG. 33. It is a bottom view of the chip resistor shown in FIG. 33. FIG. 3 is a cross-sectional view taken along the line XXXVII-XXXVII of FIG. FIG. 3 is a cross-sectional view taken along the line XXXVIII-XXXVIII of FIG. FIG. 34 is a view taken along the line XXXIX-XXXIX in FIG. 34. FIG. 34 is a view taken along the line XL-XL of FIG. 34. It is a perspective view which shows one step in the manufacturing method of the chip resistor which concerns on 3rd Embodiment of this invention. It is a perspective view which shows one step following the step shown in FIG. 41. It is a top view which shows one step which follows the step shown in FIG. 42. It is a perspective view which shows the modification of the chip resistor shown in FIG. FIG. 5 is an enlarged cross-sectional view of a main part showing a modified example of the chip resistor shown in FIG. It is an enlarged plan view of the main part which shows the modification of the concave part of the chip resistor which concerns on this invention. It is an enlarged plan view of the main part which shows the other modification of the concave part of the chip resistor which concerns on this invention.

Hereinafter, preferred embodiments of the present invention will be specifically described with reference to the drawings. For convenience of explanation, the vertical direction will be specified with reference to FIG.

1 to 8 show a chip resistor according to the first embodiment of the present invention. The chip resistor 101 of the present embodiment includes a resistor 1, a pair of main electrodes 2, and a pair of sub-electrodes 3.

The resistor 1 has a chip shape having a constant thickness of each portion and a rectangular shape in a plan view. The resistor 1 is made of a resistance material. Specific materials thereof include, but are not limited to, Fe-Cr alloys, Ni-Cr alloys, Ni-Cu alloys, etc., but are not limited to these, and the size and target resistance value of the chip resistor 101. A metal material having a resistivity suitable for the above may be appropriately selected.

The pair of main electrodes 2 are made of a conductive material. Specific examples of the material include Cu, Ni, and Fe. The pair of main electrodes 2 are separated in the direction X and sandwich the resistor 1. As will be described later, the resistor 1 and the main electrode 2 are joined by welding, for example. The thickness of each part of the main electrode 2 is constant. The thickness of the main electrode 2 is larger than the thickness of the resistor 1.

The pair of main electrodes 2 have side surfaces 21, 22, 23, curved surfaces 24, 25, an upper surface 26, and a lower surface 27, respectively. The side surface 21 faces the direction X. The side surface 22 faces the adjacent auxiliary electrode 3 with the recess 4 described later interposed therebetween. The side surface 23 faces in the direction opposite to the adjacent auxiliary electrode 3. In this embodiment, the sides 22 and 23 face the direction Y, which is perpendicular to the direction X. The upper surface 26 and the lower surface 27 face the direction Z, which is perpendicular to both the direction X and the direction Y. In the present embodiment, the upper surface 26 of the main electrode 2 is flush with the upper surface 11 of the resistor 1, and the lower surface 27 of the main electrode 2 protrudes from the lower surface 12 of the resistor 1. The lower surface 27 of the main electrode 2 is a mounting surface on the mounting object. The lower surface 27 includes a side 271 located outside the direction X, a side 272 located inside the direction Y, and a side 273 located outside the direction Y. The side surface 21 extends from the side 271 to the other side in the direction Z (upper surface 26 side). The side surface 22 extends from the side 272 to the other side in the direction Z (upper surface 26 side). The side surface 23 extends from the side 273 to the other side in the direction Z (upper surface 26 side).

The curved surface 24 is interposed between the side surface 21 and the side surface 22. The curved surface 25 is interposed between the side surface 21 and the side surface 23. As will be described later, these curved surfaces 24 and 25 are formed corresponding to the shape of the punching die when the chip resistor 101 is divided by punching. The curved surfaces 24 and 25 are actually minute curved surfaces having a small radius of curvature, but are exaggerated in the drawings.

As shown in FIG. 3, the side surface 21 has a fracture mark forming surface 211. A fracture mark is formed on the fracture mark forming surface 211. The fracture mark is an uneven shape formed when the metal is torn off. In the present embodiment, the fracture mark forming surface 211 is located closer to the upper surface 26.

As shown in FIG. 5, similarly to the side surface 21, the side surface 22 has a fracture mark forming surface 221. As shown in FIG. 7, similarly to the side surface 21, the side surface 23 has a fracture mark forming surface 231. Since the fracture mark forming surface 221 on the side surface 22 and the fracture mark forming surface 221 on the side surface 23 are the same as the fracture mark forming surface 211 on the side surface 21, the description thereof will be omitted.

The pair of auxiliary electrodes 3 are made of a conductive material. Specific examples of the material include Cu, Ni, and Fe. The pair of auxiliary electrodes 3 are separated in the direction X and sandwich the resistor 1. The sub-electrode 3 is separated from the main electrode 2 in the direction Y. The main electrode 2 and the sub-electrode 3 that are separated from each other in the direction Y are adjacent to each other with a recess 4 recessed in the direction X. As a result, the recesses 4 form a pair in the direction X. In the present embodiment, the paired recesses 4 have the same positions in the direction Y and face each other. As will be described later, the resistor 1 and the auxiliary electrode 3 are joined by welding, for example. The thickness of each part of the auxiliary electrode 3 is constant. The thickness of the auxiliary electrode 3 is larger than the thickness of the resistor 1. In the present embodiment, the dimension of the sub-electrode 3 in the direction Y is smaller than the dimension of the main electrode 2 in the direction Y. Further, in the present embodiment, the recess 4 is located outside in the direction X with respect to the boundary between the resistor 1 and the adjacent main electrode 2 and the sub electrode 3 in the direction Z view. As a result, the adjacent main electrode 2 and the sub-electrode 3 are connected to the recess 4 at the inner portion in the direction X.

The pair of auxiliary electrodes 3 have side surfaces 31, 32, 33, curved surfaces 34, 35, an upper surface 36, and a lower surface 37, respectively. The side surface 31 faces the direction X. The side surface 32 faces the main electrode 2 adjacent to each other with the recess 4 interposed therebetween. The side surface 33 faces in the direction opposite to the adjacent main electrode 2. In this embodiment, the side surfaces 32 and 33 face the direction Y. The upper surface 36 and the lower surface 37 face the direction Z. In the present embodiment, the upper surface 36 of the sub-electrode 3 is flush with the upper surface 11 of the resistor 1, and the lower surface 37 of the sub-electrode 3 protrudes from the lower surface 12 of the resistor 1. The lower surface 37 of the auxiliary electrode 3 is a mounting surface on the mounting object. The lower surface 37 includes a side 371 located outside the direction X, a side 372 located inside the direction Y, and a side 373 located outside the direction Y. The side surface 31 extends from the side 371 to the other side in the direction Z (upper surface 36 side). The side surface 32 extends from the side 372 to the other side in the direction Z (upper surface 36 side). The side surface 33 extends from the side 373 to the other side in the direction Z (upper surface 36 side).

The curved surface 34 is interposed between the side surface 31 and the side surface 32. The curved surface 35 is interposed between the side surface 31 and the side surface 33. As will be described later, these curved surfaces 34 and 35 are formed corresponding to the shape of the punching die when the chip resistor 101 is divided by punching. The curved surfaces 34 and 35 are actually minute curved surfaces having a small radius of curvature, but are exaggerated in the drawings.

As shown in FIG. 3, the side surface 31 has a fracture mark forming surface 311. A fracture mark is formed on the fracture mark forming surface 311. The fracture mark is an uneven shape formed when the metal is torn off. In the present embodiment, the fracture mark forming surface 311 is located closer to the upper surface 36.

As shown in FIG. 6, similarly to the side surface 31, the side surface 32 has a fracture mark forming surface 321. As shown in FIG. 8, similarly to the side surface 31, the side surface 33 has a fracture mark forming surface 331. Since the fracture mark forming surface 321 on the side surface 32 and the fracture mark forming surface 321 on the side surface 33 are the same as the fracture mark forming surface 311 on the side surface 31, description thereof will be omitted.

To give an example of the dimensions of each part described above, the thickness of the resistor 1 is about 0.1 to 5 mm, the thickness of the main electrode 2 and the thickness of the sub-electrode 3 are about 0.1 to 10 mm, respectively, and the resistor 1 The dimension in the direction X is about 1 to 50 mm, and the dimension of the resistor 1 in the direction Y is about 1 to 50 mm. Further, the chip resistor 101 is configured to have a low resistance of, for example, about 0.1 to 50 mΩ.

Next, a method of manufacturing the chip resistor 101 will be described.

First, as shown in FIGS. 9 and 10, the conductive member 701 is prepared. In the present embodiment, the conductive member 701 is a lead frame and has a plurality of conductive elongated plates 711. In this embodiment, the conductive member 701 has six conductive long plates 711. Each of the plurality of conductive strips 711 extends in one direction. In the conductive member 701, the plurality of conductive elongated plates 711 are arranged in a state of being separated from each other in the lateral direction which is perpendicular to the longitudinal direction which is the extending direction of the conductive elongated plate 711. As shown in FIG. 10, each conductive elongated plate 711 has an elongated cross-sectional shape. In this embodiment, by forming the conductive member 701, a plurality of conductive long plates 711 are arranged in a state of being separated from each other.

Similarly, as shown in FIGS. 11 and 12, the resistor member 702 is prepared. In this embodiment, the resistor member 702 is a resistor frame and has at least one resistor length plate 721. In the present embodiment, the resistor member 702 has five (plural) resistor length plates 721. Each of the plurality of resistor length plates 721 extends in one direction. In the resistor member 702, the plurality of resistor length plates 721 are arranged in a state of being separated from each other in the lateral direction which is perpendicular to the extending longitudinal direction of the plurality of resistor length plates 721. As shown in FIG. 12, each resistor length plate 721 has an oblong rectangular cross section. The thickness of each resistor length plate 712 is smaller than the thickness of the conductive length plate 711. In FIG. 11, the resistor member 702 is hatched for convenience of understanding. The same applies to the plan views of FIGS. 11 and 11 onward. Unlike the present embodiment, the resistor member 702 may be a large flat plate corresponding to the size of the plurality of conductive elongated plates 711 in a plan view.

Next, as shown in FIGS. 13 and 14, a resistor assembly 703 is formed. To form the resistor assembly 703, the resistor member 702 is joined to the conductive elongated plate 711 of the conductive member 701. In the present embodiment, each of the plurality of resistor length plates 721 is joined to any two of the plurality of conductive length plates 711 adjacent to each other. At this time, the plurality of resistor length plates 721 are arranged at positions sandwiched between any two of the plurality of conductive long plates 711 adjacent to each other.

The joint between the conductive long plate 711 and the resistor member 702 can be performed by, for example, welding. Preferably, high energy beam welding can be used as the welding. Examples of high-energy beam welding include electron beam welding and laser beam welding. When performing high-energy beam welding, as shown in FIG. 14, a high-energy beam 881 (electron beam or laser beam) is applied to, for example, the conductive long plate 711 or the resistor long plate 721 along the direction Z. After receiving the energy of the high energy beam 881 to melt the conductive long plate 711 or the resistor long plate 721, the conductive long plate 711 and the resistor long plate 721 are joined. Unlike the present embodiment, in order to join the conductive long plate 711 and the resistor member 702, brazing using solder, silver paste, or the like may be used. Alternatively, ultrasonic bonding may be used to bond the conductive long plate 711 and the resistor member 702.

Next, as shown in FIG. 15, the resistor assembly 703 is collectively divided into a plurality of chip resistors 101 by punching. In FIG. 15, the region to be the chip resistor 101 in the resistor assembly 703 is shown by a chain double-dashed line. For example, several tens of chip resistors 101 can be obtained from one resistor assembly 703. In order to divide the resistor assembly 703 into a plurality of chip resistors 101, a punching die (not shown) having a shape corresponding to the shape of the chip resistor 101 shown by the two-point chain point in FIG. 15 is used. The punching die is formed with a recess having a shape corresponding to the recess 4 of the chip resistor 101. A punching die is punched from the resistor assembly 703 toward the back of the paper in FIG. Here, the corners of the punching die are appropriately rounded. The reason for this roundness is to improve the durability when the punching work is repeated. By punching out the resistor assembly 703, the curved surfaces 24 and 25 of the main electrode 2 and the curved surfaces 34 and 35 of the sub-electrode 3 are formed. These curved surfaces 24, 25, 34, 35 are formed corresponding to the roundness of the corners of the punching die. Further, by punching out the resistor assembly 703, the side surfaces 21,22,23,31,32,33 having the fracture mark forming surfaces 211,221,231,311,321,331 in the main electrode 2 and the sub-electrode 3 are formed. Is formed. As described above, a plurality of chip resistors 101 can be manufactured.

Next, the action and effect of this embodiment will be described.

In the present embodiment, when the chip resistor 101 is manufactured, the resistor assembly 703 is divided into a chip resistor 101 having four electrodes (a pair of main electrodes 2 and a pair of sub-electrodes 3) by punching. .. By the punching, the concave portion 4 recessed in the direction X is sandwiched from the conductive long plate 711 (conductive member 701) extending in the longitudinal direction (direction Y), and the main electrode 2 and the sub-electrode 3 adjacent to each other are formed in the direction Y. Will be done. Since the chip resistor 101 is manufactured by punching in this way, the dimensional accuracy of the chip resistor 101 in a plan view is defined by the dimensional accuracy of the shape of the punching die. According to the method according to the present embodiment, when punching the resistor assembly 703, a punching die in which each part has a desired dimensional accuracy can be used. By using such a punching die having a recess corresponding to the recess 4 of the chip resistor 101, it is possible to further reduce the dimensional error in the directions X and Y of the main electrode 2 and the sub electrode 3. It becomes. If the dimensional error in the directions X and Y of the main electrode 2 and the sub-electrode 3 can be reduced, the resistance value of the resistor 1 sandwiched between the pair of main electrodes 2 and the pair of sub-electrodes 3 is desired. The chip resistor 101 which is the value can be obtained.

When the resistance value of the chip resistor 101 is a desired value, it is possible to save the trouble of performing trimming for finely adjusting the resistance value of the chip resistor 101. Therefore, the number of chip resistors 101 to be trimmed can be reduced. This is suitable for improving the efficiency of manufacturing the chip resistor 101.

In this embodiment, a lead frame is used as the conductive member 701, and a resistor frame is used as the resistor member 702. Therefore, it is not necessary to separately hold the plurality of conductive long plates 711 and the plurality of resistor long plates 721, and it is easy to handle.

The chip resistor 101 of this embodiment can be used, for example, to detect a current in an electric circuit. In order to detect the current in an electric circuit, for example, a pair of main electrodes 2 are used as current electrodes, and a pair of sub-electrodes 3 are used as voltage electrodes. When detecting the current of an electric circuit, the pair of main electrodes 2 (current electrodes) are electrically connected to the electric circuit so that the current of the electric circuit flows. A voltmeter is connected to the pair of sub-electrodes 3 (voltage electrodes). Since the resistance value of the chip resistor 101 is known, when the voltage drop in the resistor 1 of the chip resistor 101 is measured using the above voltmeter, the resistor is obtained by applying this measured value to the ohm equation. It becomes possible to know the value of the current flowing through 1. In the chip resistor 101 of the present embodiment, as described above, the resistance value of the resistor 1 sandwiched between the pair of main electrodes 2 and the pair of sub-electrodes 3 is a desired value. Therefore, if the chip resistor 101 is used, the current of the electric circuit can be accurately detected.

When the current of an electric circuit is detected by using the chip resistor 101, the chip resistor 101 is mounted on a circuit board. To mount the chip resistor 101, for example, the chip resistor 101 is mounted so that four electrodes (a pair of main electrodes 2 and a pair of sub-electrodes 3) are located on four conductive terminals formed on a circuit board. This is done by placing and soldering. The terminal portion of the circuit board has a shape corresponding to the electrode. In the present embodiment, the dimension of the pair of main electrodes 2 in the Y direction is larger than the dimension of the pair of sub-electrodes 3 in the direction Y. When the dimension of the main electrode 2 in the Y direction is increased, the dimension between the main electrode 2 and the terminal portion and the main electrode are compared with the case where the dimension in the direction Y of the main electrode 2 and the dimension in the direction Y of the sub-electrode 3 are the same. A current easily flows between the 2 and the resistor 1. Therefore, it is possible to suppress the amount of heat generated when the current is detected by using the chip resistor 101.

In the present embodiment, the main electrode 2 and the sub-electrode 3 adjacent to each other in the direction Y are separated from each other with a recess 4 recessed in the direction X. Therefore, in the chip resistor 101, the formation positions of the four electrodes are clarified in a plan view, and when these four electrodes are placed on the four terminal portions of the circuit board, misalignment and the like are suppressed. Can be mounted properly. Further, according to the configuration in which the main electrode 2 and the sub-electrode 3 are located so as to sandwich the recess 4, the solder adheres improperly so as to straddle the main electrode 2 and the sub-electrode 3 when soldering to the terminal portion. Such inconvenience can be suppressed. Further, even when the dimension of the main electrode 2 in the direction Y and the dimension of the sub-electrode 3 in the direction Y are different, the main electrode 2 and the sub-electrode 3 are located so as to sandwich the recess 4, so that the main electrode 2 and the sub-electrode 3 The difference in dimensions of the electrodes 3 can be easily confirmed in a plan view. This is preferable in order to properly mount the main electrode 2 and the sub electrode 3 on the terminal portion.

In the method for manufacturing the chip resistor 101 described above, the lead frame is used as the conductive member 701, but the lead frame may not be used. As shown in FIGS. 16 and 17, as the conductive member 701, a plurality of conductive long plates 711 in a state of being separated from each other may be arranged on the pallet 882. Similarly, the resistor frame may not be used as the resistor member 702. As shown in FIGS. 16 and 17, the resistor length plate 721 may be arranged in the gap between the conductive length plates 711 arranged on the pallet 882. Then, after arranging the conductive long plate 711 and the resistor long plate 721 on the pallet 882, the conductive long plate 711 and the resistor long plate 721 may be joined.

18 and 19 show a modification of the chip resistor 101 described above. The chip resistor 101A shown in FIG. 18 has a depth of the recess 4 in the direction X deeper than that of the chip resistor 101. The recess 4 penetrates inward in the direction X from the boundary between the resistor 1 and the adjacent main electrode 2 and the sub-electrode 3 in the direction Z view. The chip resistor 101A can be obtained by punching out a resistor assembly in the same manner as the chip resistor 101 described above. According to such a chip resistor 101A, the resistance value of the resistor 1 is set to a desired value by appropriately adjusting the dimension of the recess 4 that enters the resistor 1, that is, the dimension that partially cuts the resistor 1. Can be adjusted to. The dimensional error of the cut portion of the resistor 1 can be made smaller by punching. Therefore, in the chip resistor 101A having such a configuration, the resistance value of the resistor 1 can be accurately adjusted to a desired value.

In the chip resistor 101B shown in FIG. 18, the pair of main electrodes 2 and the pair of sub-electrodes 3 are positioned so as to be offset from each other in the direction Y, and are arranged in a cross-shaped manner. As a result, the positions of the paired recesses 4 are also displaced in the direction Y. In the chip resistor 101B having such a configuration, the same effect as described above can be enjoyed with respect to the chip resistor 101.

Other embodiments of the present invention are shown below. In the figures referred to in these embodiments, the same or similar elements as those in the above-described embodiments are designated by the same reference numerals as those in the above-described embodiments.

Next, the second embodiment of the present invention will be described.

20 to 27 show the chip resistor according to the second embodiment of the present invention. The chip resistor 102 of the present embodiment is a chip in that the main electrode 2 and the sub-electrode 3 are provided on the lower surface 12 (the surface facing the direction Z) of the resistor 1 and the insulating films 5 and 6 are provided. Mainly different from the resistor 101. The resistor 1 has a size similar to the plane size of the chip resistor 102.

The resistor 1 has side surfaces 121, 122, 123, 131, 132, 133 and curved surfaces 124, 125, 134, 135. The side surfaces 121 and 131 face the direction X. The sides 122 and 132 face inward in the direction Y. The sides 123 and 133 face outward in the direction Y. The side surfaces 121, 122, and 123 are connected to the side surfaces 21, 22, and 23 of the main electrode 2, and the curved surface 124 is interposed between the side surface 121 and the side surface 122. The curved surface 125 is interposed between the side surface 121 and the side surface 123. The curved surfaces 124 and 125 are connected to the curved surfaces 24 and 25 of the main electrode 2, respectively. As will be described later, these curved surfaces 124 and 125 are formed corresponding to the shape of the punching die when the chip resistor 102 is divided by punching. The side surfaces 131, 132, and 133 are connected to the side surfaces 31, 32, and 33 of the auxiliary electrode 3, and the curved surface 134 is interposed between the side surface 131 and the side surface 132. The curved surface 135 is interposed between the side surface 131 and the side surface 133. The curved surfaces 134 and 135 are connected to the curved surfaces 34 and 35 of the auxiliary electrode 3, respectively. As will be described later, these curved surfaces 134 and 135 are formed corresponding to the shape of the punching die when the chip resistor 102 is divided by punching.

As shown in FIG. 22, the side surfaces 121 and 131 have fracture mark forming surfaces 141 and 151. As shown in FIG. 24, the side surface 122 has a fracture mark forming surface 142. As shown in FIG. 26, the side surface 123 has a fracture mark forming surface 143. As shown in FIG. 25, the side surface 132 has a fracture mark forming surface 152. As shown in FIG. 27, the side surface 133 has a fracture mark forming surface 153.

The insulating film 5 is provided so as to cover the entire upper surface 11 of the resistor 1. The insulating film 5 is formed by thick film printing, and is, for example, an epoxy resin-based resin film.

As shown in FIG. 45, the edge extension portion 160 is formed on the fracture mark forming surfaces 141, 142, 143, 151, 152, 153. The edge extending portion 160 is a portion formed by extending the upper ends of the fracture mark forming surfaces 141, 142, 143, 151, 152, 153 in the manufacturing method described later. According to the manufacturing method described later, the edge extending portion 160 has a shape surrounding the insulating film 5.

The insulating film 6 is provided at an intermediate portion in the direction X of the lower surface 12 of the resistor 1. The insulating film 6 is provided in the region between the pair of main electrodes 2 and between the pair of sub-electrodes 3. The insulating film 6 is made of the same material as the insulating film 5, and is formed by thick film printing like the insulating film 5.

The pair of main electrodes 2 are separated from each other in the direction X with the insulating film 6 interposed therebetween. As will be described later, the pair of main electrodes 2 are formed by, for example, applying Cu plating to the resistor 1. The pair of auxiliary electrodes 3 are separated from each other in the direction X with the insulating film 6 interposed therebetween. As will be described later, the pair of auxiliary electrodes 3 are formed by, for example, applying Cu plating to the resistor 1. As shown in FIG. 44, a solder layer 60 for improving solderability may be laminated on the lower surfaces of the main electrode 2 and the sub-electrode 3.

Next, a method of manufacturing the chip resistor 102 will be described.

First, as shown in FIG. 28, a resistor member 704 is prepared. The resistor member 704 has a plate shape having a vertical and horizontal size capable of taking a plurality of resistors 1, and the thickness is made uniform throughout. Next, as shown in FIG. 29, the insulating film 705 is formed on the entire upward single surface 704a of the resistor member 704. The insulating film 705 is formed by printing a solid thick film of the resin that is the material of the insulating film 705. Next, a resistor assembly is formed. To form a resistor assembly, first, as shown in FIG. 30, the resistor member 704 is turned upside down, and then a plurality of insulating films 706 are striped on the upward facing surface 704b of the resistor member 704. Form so as to line up in a shape. The plurality of insulating films 706 are formed by thick film printing using the same resin and apparatus used for forming the insulating film 705.

Next, as shown in FIG. 31, the conductive member 707 is formed in the region of the surface 704b of the resistor member 704 in which the insulating film 706 is not formed between the plurality of insulating films 706. The conductive member 707 is formed by, for example, Cu plating. According to this plating treatment, it is possible to uniformly form the conductive member 707 in the region between the adjacent insulating films 706 without forming a gap between the conductive member 707 and the insulating film 706. .. In this way, the resistor assembly 708 is formed.

Next, as shown in FIG. 32, the resistor assembly 708 is collectively divided into a plurality of chip resistors 102 by punching. In FIG. 32, the regions to be the chip resistors 102 in the resistor assembly 703 are shown by alternate long and short dash lines. For example, several tens of chip resistors 102 can be obtained from one resistor assembly 708. In order to divide the resistor assembly 708 into a plurality of chip resistors 102, a punching die (not shown) having a shape corresponding to the shape of the chip resistor 102 shown by the two-point chain point in FIG. 32 is used. The punching die is formed with a recess having a shape corresponding to the recess 4 of the chip resistor 102. A punching die is punched from the back to the front of the paper surface in FIG. 32 with respect to the resistor assembly 708. Here, the corners of the punching die are appropriately rounded. By punching out the resistor assembly 708, the curved surfaces 24 and 25 of the main electrode 2, the curved surfaces 34 and 35 of the sub-electrode 3, and the curved surfaces 124, 125, 134 and 135 of the resistor 1 are formed. These curved surfaces 24, 25, 34, 35, 124, 125, 134, 135 are formed corresponding to the roundness of the corners of the punching die. Further, by punching out the resistor assembly 708, the side surfaces 121, 122, 123, 131, 132, 133 having the fracture mark forming surfaces 141, 142, 143, 151, 152, 153 are formed in the resistor 1. .. As described above, a plurality of chip resistors 102 can be manufactured. Further, when the fracture mark forming surfaces 141, 142, 143, 151, 152, 153 are formed, the fractured portion of the resistor 1 is extended in the punching direction of the punching die. As a result, the edge extension portion 160 shown in FIG. 45 is formed.

In the present embodiment, when the chip resistor 102 is manufactured, the resistor assembly 708 is divided into a chip resistor 102 having four electrodes (a pair of main electrodes 2 and a pair of sub-electrodes 3) by punching. .. By the punching, the main electrode 2 and the sub-electrode 3 adjacent to each other are formed from the plate-shaped resistor assembly 708 by sandwiching the recess 4 recessed in the direction X. Since the chip resistor 102 is manufactured by punching in this way, the dimensional accuracy of the chip resistor 102 in a plan view is defined by the dimensional accuracy of the shape of the punching die. According to the method according to the present embodiment, when punching the resistor assembly 708, a punching die in which each part has a desired dimensional accuracy can be used. By using such a punching die having a recess corresponding to the recess 4 of the chip resistor 102, it is possible to further reduce the dimensional error in the directions X and Y of the main electrode 2 and the sub electrode 3. It becomes. If the dimensional error in the directions X and Y of the main electrode 2 and the sub-electrode 3 can be reduced, the resistance value of the resistor 1 sandwiched between the pair of main electrodes 2 and the pair of sub-electrodes 3 is desired. The chip resistor 102 which is the value can be obtained.

In the chip resistor 102 of the present embodiment, the same effect as described above can be enjoyed with respect to the chip resistor 101 of the above embodiment.

Next, a third embodiment of the present invention will be described.

33 to 40 show a chip resistor according to a third embodiment of the present invention. The chip resistor 103 of the present embodiment is mainly different from the chip resistor 101 in that the main electrode 2 and the sub-electrode 3 are provided on the lower surface 12 (the surface facing the direction Z) of the resistor 1. The resistor 1 has a size similar to the plane size of the chip resistor 103.

The resistor 1 has side surfaces 121, 122, 123, 131, 132, 133 and curved surfaces 124, 125, 134, 135. The side surfaces 121 and 131 face the direction X. The sides 122 and 132 face inward in the direction Y. The sides 123 and 133 face outward in the direction Y. The side surfaces 121, 122, and 123 are connected to the side surfaces 21, 22, and 23 of the main electrode 2, and the curved surface 124 is interposed between the side surface 121 and the side surface 122. The curved surface 125 is interposed between the side surface 121 and the side surface 123. The curved surfaces 124 and 125 are connected to the curved surfaces 24 and 25 of the main electrode 2, respectively. As will be described later, these curved surfaces 124 and 125 are formed corresponding to the shape of the punching die when the chip resistor 103 is divided by punching. The side surfaces 131, 132, and 133 are connected to the side surfaces 31, 32, and 33 of the auxiliary electrode 3, and the curved surface 134 is interposed between the side surface 131 and the side surface 132. The curved surface 135 is interposed between the side surface 131 and the side surface 133. The curved surfaces 134 and 135 are connected to the curved surfaces 34 and 35 of the auxiliary electrode 3, respectively. As will be described later, these curved surfaces 134 and 135 are formed corresponding to the shape of the punching die when the chip resistor 103 is divided by punching.

As shown in FIG. 35, the side surfaces 121 and 131 have fracture mark forming surfaces 141 and 151. As shown in FIG. 37, the side surface 122 has a fracture mark forming surface 142. As shown in FIG. 39, the side surface 123 has a fracture mark forming surface 143. As shown in FIG. 38, the side surface 132 has a fracture mark forming surface 152. As shown in FIG. 40, the side surface 133 has a fracture mark forming surface 153.

Next, a method of manufacturing the chip resistor 103 will be described.

First, as shown in FIG. 41, a clad material 730 (bonded body) in which a plate-shaped resistance material 731 and a plate-shaped conductive material 732 are bonded is prepared. The clad material 730 is an oblong rectangular plate material having a vertical and horizontal size capable of taking a plurality of resistors 1. Next, as shown in FIG. 42, a part of the conductive material 732 is removed in the shape of a groove having a rectangular cross section extending in the longitudinal direction. The conductive material 732 is removed from a plurality of locations of the clad material 730 at regular intervals in the lateral direction. As a result, a resistor assembly 734 having conductive members 733 separated in one direction is formed.

Next, as shown in FIG. 43, the resistor assembly 734 is collectively divided into a plurality of chip resistors 103 by punching. In FIG. 43, the region to be the chip resistor 103 in the resistor assembly 734 is shown by a chain double-dashed line. For example, several tens of chip resistors 103 can be obtained from one resistor assembly 734. In order to divide the resistor assembly 734 into a plurality of chip resistors 103, a punching die (not shown) having a shape corresponding to the shape of the chip resistor 103 shown by the two-point chain point in FIG. 43 is used. The punching die is formed with a recess having a shape corresponding to the recess 4 of the chip resistor 103. A punching die is punched from the back to the front of the paper surface in FIG. 43 with respect to the resistor assembly 734. Here, the corners of the punching die are appropriately rounded. By punching out the resistor assembly 734, the curved surfaces 24 and 25 of the main electrode 2, the curved surfaces 34 and 35 of the sub-electrode 3, and the curved surfaces 124, 125, 134 and 135 of the resistor 1 are formed. These curved surfaces 24, 25, 34, 35, 124, 125, 134, 135 are formed corresponding to the roundness of the corners of the punching die. Further, by punching the resistor assembly 734, the side surfaces 121, 122, 123, 131, 132, 133 having the fracture mark forming surfaces 141, 142, 143, 151, 152, 153 are formed in the resistor 1. .. As described above, a plurality of chip resistors 103 can be manufactured.

In the present embodiment, when manufacturing the chip resistor 103, the resistor assembly 734 is divided into a chip resistor 103 having four electrodes (a pair of main electrodes 2 and a pair of sub-electrodes 3) by punching. .. By the punching, the main electrode 2 and the sub-electrode 3 adjacent to each other are formed from the plate-shaped resistor assembly 734 by sandwiching the recess 4 recessed in the direction X. Since the chip resistor 103 is manufactured by punching in this way, the dimensional accuracy of the chip resistor 103 in a plan view is defined by the dimensional accuracy of the shape of the punching die. According to the method according to the present embodiment, when punching the resistor assembly 734, a punching die in which each part has a desired dimensional accuracy can be used. By using such a punching die having a recess corresponding to the recess 4 of the chip resistor 103, it is possible to further reduce the dimensional error in the directions X and Y of the main electrode 2 and the sub electrode 3. It becomes. If the dimensional error in the directions X and Y of the main electrode 2 and the sub-electrode 3 can be reduced, the resistance value of the resistor 1 sandwiched between the pair of main electrodes 2 and the pair of sub-electrodes 3 is desired. The chip resistor 103 that is the value can be obtained.

In the chip resistor 103 of the present embodiment, the same effect as described above can be enjoyed with respect to the chip resistor 101 of the above embodiment.

FIG. 46 shows a modified example of the shape of the recess 4 in the chip resistors 101, 101A, 101B, 102, 103. In this modification, the recess 4 has a substantially triangular shape. The side surface 22 and the side surface 32 are inclined to each other, and the distance between the side surface 22 and the side surface 32 becomes smaller from the outside in the Y direction (right side in the figure) to the inside side in the Y direction (left side in the figure). The above-mentioned effects can be expected even with such a modified example.

FIG. 47 shows a modified example of the shape of the recess 4 in the chip resistors 101, 101A, 101B, 102, 103. In this modification, the recess 4 has a substantially semi-elliptical shape or a substantially semi-circular shape. Both the side surface 22 and the side surface 32 are curved surfaces, and the distance between them decreases from the outside in the Y direction (right side in the figure) to the inside side in the Y direction (left side in the figure). ing. The above-mentioned effects can be expected even with such a modified example.

The scope of the present invention is not limited to the above-described embodiments. The specific configuration of each part of the present invention can be freely redesigned.

In the above embodiment, the case where the resistor assembly is collectively divided into a plurality of chip resistors by punching has been described, but the punching method is not limited to this. For example, a punching die having a shape corresponding to one chip resistor may be used to divide the resistor assembly into individual chip resistors by repeating the punching operation.

101, 101A, 101B, 102, 103 Chip resistor 1 Resistor 12 Bottom surface (one side of the resistor facing the third direction)
121 Side surface (first side surface on the main electrode side)
122 Side surface (second side surface on the main electrode side)
123 side surface (third side surface on the main electrode side)
124 curved surface (first curved surface on the main electrode side)
125 curved surface (second curved surface on the main electrode side)
131 side surface (first side surface on the auxiliary electrode side)
132 Side surface (second side surface on the secondary electrode side)
133 side surface (third side surface on the secondary electrode side)
134 Curved surface (first curved surface on the secondary electrode side)
135 curved surface (second curved surface on the secondary electrode side)
141, 151 Fracture mark forming surface 160 Edge extension part 2 Main electrode 21 side surface (main electrode side first side surface)
211 Fracture mark forming surface 22 Side surface (second side surface on the main electrode side)
23 Side surface (third side surface on the main electrode side)
24 curved surface (first curved surface on the main electrode side)
25 curved surface (second curved surface on the main electrode side)
27 Bottom surface (main electrode mounting surface)
271 side (first side of main electrode)
272 sides (second side of main electrode)
273 sides (3rd side of main electrode)
3 Sub-electrode 31 side surface (sub-electrode side first side surface)
311 Fracture mark forming surface 32 side surface (second side surface on the auxiliary electrode side)
33 Side surface (third side surface on the secondary electrode side)
34 Curved surface (first curved surface on the secondary electrode side)
35 curved surface (second curved surface on the secondary electrode side)
37 Bottom surface (secondary electrode mounting surface)
371 sides (first side of the auxiliary electrode)
372 sides (second side of auxiliary electrode)
373 sides (third side of auxiliary electrode)
4 Recesses 5, 6 Insulation film 60 Soldier layer 701 Conductive member 702 Resistor member 703 Resistor assembly 704 Resistor member 706 Insulation film 707 Conductive member 708 Resistor assembly 711 Conductive long plate 721 Resistor long plate 730 Clad Material (joint)
731 Resistor material 732 Conductive material 733 Conductive member 734 Resistor assembly

Claims (12)

Resistors with front and back surfaces and
A first electrode having a front surface and a back surface and connected to one end in the first direction of the resistor.
A second electrode having a front surface and a back surface and connected to the other end in the first direction of the resistor.
With
The surface of the first electrode, the surface of the resistor, and the surface of the second electrode are flush with each other.
The thickness of the resistor is thinner than the thickness of either the first electrode and the second electrode.
On the side surfaces of the first electrode and the resistor facing the second direction, which are perpendicular to the first direction, a concavo-convex first fracture mark forming surface located on the surface side is continuously formed. ,
On the side surfaces of the second electrode and the resistor facing the second direction, uneven second fracture mark forming surfaces located on the surface side are continuously formed.
The first fracture mark forming surface extends to a side surface of the first electrode located on the opposite side of the resistor in the first direction.
The second fracture mark forming surface extends to a side surface of the second electrode located on the opposite side of the resistor in the first direction.
A third electrode having a front surface and a back surface, which is connected to one end of the resistor in the first direction at a distance from the first electrode in the second direction.
A fourth electrode having a front surface and a back surface, which is connected to the other end of the resistor in the first direction at a distance from the second electrode in the second direction.
With
Concavo-convex third fracture mark forming surfaces located on the surface side are continuously formed on the side surfaces of the third electrode and the resistor located on the side opposite to the second electrode in the first direction. And
Concavo-convex fourth fracture mark forming surfaces located on the surface side are continuously formed on the side surfaces of the fourth electrode and the resistor located on the side opposite to the first electrode in the first direction. And
On the side surface of the resistor located on the side opposite to the second electrode in the first direction, a first recess including a part of the first fracture mark forming surface and a part of the third fracture mark forming surface is formed. Has been formed and
On the side surface of the resistor located on the side opposite to the first electrode in the first direction, a second recess including a part of the second fracture mark forming surface and a part of the fourth fracture mark forming surface is formed. Has been formed and
A first curved surface that is interposed between the side surface of the first electrode facing the first direction and the first recess and has a convex shape in a third direction, which is perpendicular to the first direction and the second direction. When,
A second curved surface interposed between the side surface of the second electrode facing the first direction and the second concave portion and having a convex shape in the third direction view.
A third curved surface interposed between the side surface of the third electrode located on the opposite side of the fourth electrode in the first direction and the first concave portion and having a convex shape in the third direction view.
A fourth curved surface interposed between the side surface of the fourth electrode located on the opposite side of the third electrode in the first direction and the second concave portion and having a convex shape in the third direction view.
Equipped with a,
The side surface of the first electrode, the first recess, and the first curved surface are smoothly connected to each other.
The side surface of the second electrode, the second recess, and the second curved surface are smoothly connected to each other.
The side surface of the third electrode, the first recess, and the third curved surface are smoothly connected to each other.
A resistor characterized in that the side surface of the fourth electrode, the second recess, and the fourth curved surface are smoothly connected to each other. A fifth curved surface that is interposed between the side surface of the first electrode that faces the first direction and the side surface that faces the first concave portion and the opposite side in the second direction and is convex in the third direction. When,
A sixth curved surface that is interposed between the side surface of the second electrode that faces the first direction and the side surface that faces the second concave portion and the opposite side in the second direction and is convex in the third direction. When,
A seventh curved surface interposed between the side surface of the third electrode facing the first direction and the side surface facing the first concave portion and the opposite side in the second direction and having a convex shape in the third direction view. ,
An eighth curved surface that is interposed between the side surface of the fourth electrode that faces the first direction and the side surface that faces the second concave portion and the opposite side in the second direction and is convex in the third direction. The resistor according to claim 1, further comprising. The resistor according to claim 1 or 2, wherein the first recess and the second recess have a substantially triangular shape having two sides in which the distance between the first recess and the second recess becomes smaller from the outside to the inside in the first direction. .. The first recess and the second recess are substantially semi-elliptical or substantially semi-circular with two curved sides whose distance from each other decreases from the outside to the inside in the first direction. Item 2. The resistor according to Item 1 or 2. Resistors with front and back surfaces and
A first electrode having a front surface and a back surface and connected to one end in the first direction of the resistor.
A second electrode having a front surface and a back surface and connected to the other end in the first direction of the resistor.
With
The surface of the first electrode, the surface of the resistor, and the surface of the second electrode are flush with each other.
The thickness of the resistor is thinner than the thickness of either the first electrode and the second electrode.
On the side surfaces of the first electrode and the resistor facing the second direction, which are perpendicular to the first direction, a concavo-convex first fracture mark forming surface located on the surface side is continuously formed. ,
On the side surfaces of the second electrode and the resistor facing the second direction, uneven second fracture mark forming surfaces located on the surface side are continuously formed.
The first fracture mark forming surface extends to a side surface of the first electrode located on the opposite side of the resistor in the first direction.
The second fracture mark forming surface extends to a side surface of the second electrode located on the opposite side of the resistor in the first direction.
The first electrode has a first protruding portion and a second protruding portion, each of which projects in the first direction and is separated in the second direction.
The second electrode has a third protruding portion and a fourth protruding portion, each of which protrudes in the first direction and is separated in the second direction.
The first fracture mark forming surface is continuously formed over the first protruding portion and the second protruding portion.
The second fracture mark forming surface is continuously formed over the third protrusion and the fourth protrusion.
The first electrode has a first recess located between the first protrusion and the second protrusion and extending the first fracture mark forming surface.
The second electrode may have a second recess positioned to and the second fracture pattern surface between the third projection and the fourth protruding portion extends,
The first is a convex shape in interposed and third viewing directions are perpendicular to the first direction and the second direction between the first the first facing direction side and front Symbol first recess protrusions Curved surface and
A second curved surface convex shape in interposed and the third direction when viewed between said second said first direction toward the side surface and the front Symbol first recess protrusions,
A third curved surface is a convex shape in interposed and the third direction as viewed between the third first direction toward the side surface and the front Stories second recess protrusions,
And a fourth curved surface is a convex shape in interposed and the third direction as viewed between the fourth said first facing direction side and front Stories second recess protrusions,
Equipped with a,
The side surface of the first protrusion, the first recess, and the first curved surface are smoothly connected to each other.
The side surface of the second protrusion, the first recess, and the second curved surface are smoothly connected to each other.
The side surface of the third protrusion, the second recess, and the third curved surface are smoothly connected to each other.
A resistor characterized in that the side surface of the fourth protrusion, the second recess, and the fourth curved surface are smoothly connected to each other. A fifth portion of the first protruding portion that is interposed between the side surface facing the first direction and the side surface facing the first concave portion and the opposite side in the second direction and has a convex shape in the third direction view. Curved surface and
A sixth portion of the second protruding portion that is interposed between the side surface facing the first direction and the side surface facing the first concave portion and the opposite side in the second direction and has a convex shape in the third direction view. Curved surface and
A seventh curved surface that is interposed between the side surface of the third protruding portion that faces the first direction and the side surface that faces the second concave portion and the opposite side in the second direction and has a convex shape in the third direction view. When,
An eighth curved surface that is interposed between the side surface of the fourth protruding portion that faces the first direction and the side surface that faces the second concave portion and the opposite side in the second direction and has a convex shape in the third direction view. The resistor according to claim 5, further comprising. The second-direction dimension of the first protrusion is larger than the second-direction dimension of the second protrusion.
The second-direction dimension of the third protrusion is larger than the second-direction dimension of the fourth protrusion.
The resistor according to claim 5 or 6, wherein the first protrusion and the third protrusion are provided on the same side in the second direction. The second recess of the first recess and the second electrode of the first electrode, the distance therebetween increases toward the inside from the first outwardly is substantially triangular shape having two sides becomes smaller, The resistor according to any one of claims 5 to 7. Wherein the second recess of the first recess and the second electrode of the first electrode is substantially semi-oval with a curved two sides distance therebetween as it goes inward from the first outward becomes small The resistor according to any one of claims 5 to 7, which has a shape or a substantially semicircular shape. The resistor according to any one of claims 1 to 9, wherein an edge extending portion projecting to the side facing the surface is formed on the first fracture mark forming surface and the second fracture mark forming surface. A step of forming a resistor assembly in which a first conductive member and a second conductive member separated from each other in the first direction are provided on the resistor member.
A method for manufacturing a resistor, which comprises a step of forming a resistor by punching out the above-mentioned resistor assembly.
In the step of forming the resistor,
The first side and the second side, which are separated from each other in the first direction and extend in the second direction which is perpendicular to the first direction, and the second side which is separated from the first side and described above. Positions between the third side extending in the second direction, the fourth side separated from the second side in the second direction and extending in the second direction, and the first side and the third side. And the first recess that is recessed in the first direction,
A second recess located between the second side and the fourth side and recessed in the first direction, and interposed between the first side and the first recess, and the first direction and the first recess. A first curve that is convex in the third direction, which is perpendicular to the two directions, and a second curve that is interposed between the second side and the second recess and is convex in the third direction. A third curve that is interposed between the third side and the first recess and has a convex shape in the third direction, and the third curve that is interposed between the fourth side and the second recess. Using a punching mold having a fourth curve that is convex in three directions,
The first side, the first recess, and the first curve are smoothly connected to each other.
The second side, the second recess, and the second curve are smoothly connected to each other.
The third side, the first recess, and the third curve are smoothly connected to each other.
The fourth side, the second recess, and the fourth curve are smoothly connected to each other.
The first side, the third side, the first curve, and the third curve overlap the first conductive member in the third direction view, and the first recess is the third in the third direction view. 1 The conductive member and the resistor member are overlapped, and the second side, the fourth side, the second curve and the fourth curve are overlapped with the second conductive member in the third direction view, and the second side is overlapped with the second conductive member. A method for manufacturing a resistor, in which the resistor assembly is punched out by the punching mold so that the two recesses overlap the second conductive member and the resistor member in the third direction view. A step of forming a resistor assembly in which a first conductive member and a second conductive member separated from each other in the first direction are provided on the resistor member.
A method for manufacturing a resistor, which includes a step of forming a resistor by punching out the resistor assembly, and a method of manufacturing the resistor.
In the step of forming the resistor,
The first side and the second side, which are separated from each other in the second direction perpendicular to the first direction and extend in the second direction, and the first side and the first side are separated from each other. Positions between the third side extending in the second direction, the fourth side extending in the first direction and extending in the second direction with respect to the second side, and the first side and the second side. A first recess that is recessed in the first direction, a second recess that is located between the third side and the fourth side and is recessed in the first direction, and the first side and the first recess. A first curve having a convex shape in a third direction, which is perpendicular to the first direction and the second direction, and between the second side and the first concave portion. A second curve having a convex shape in the third direction, a third curve intervening between the third side and the second concave portion and having a convex shape in the third direction, and the fourth side. A punching mold having a fourth curve interposed between the second recess and having a convex shape in the third direction is used.
The first side, the first recess, and the first curve are smoothly connected to each other.
The second side, the first recess, and the second curve are smoothly connected to each other.
The third side, the second recess, and the third curve are smoothly connected to each other.
The fourth side, the second recess, and the fourth curve are smoothly connected to each other.
The first side, the second side, the first recess, the first curve and the second curve overlap with the first conductive member in the third direction view, and the third side and the fourth side The resistor assembly is punched out by the punching mold so that the second recess, the third curve, and the fourth curve overlap the second conductive member in the third direction. Production method.

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