JP6888709B2 - 発光装置の製造方法及び発光装置 - Google Patents

発光装置の製造方法及び発光装置 Download PDF

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JP6888709B2
JP6888709B2 JP2020070531A JP2020070531A JP6888709B2 JP 6888709 B2 JP6888709 B2 JP 6888709B2 JP 2020070531 A JP2020070531 A JP 2020070531A JP 2020070531 A JP2020070531 A JP 2020070531A JP 6888709 B2 JP6888709 B2 JP 6888709B2
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light emitting
emitting device
lead frame
resin
lead
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Japanese (ja)
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JP2020127026A (ja
Inventor
博史 市川
博史 市川
林　正樹
林　　正樹
慎平 笹岡
慎平 笹岡
三木　倫英
倫英 三木
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Nichia Corp
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Nichia Corp
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Priority to JP2021084519A priority patent/JP7108221B2/ja
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Priority to JP2022110506A priority patent/JP7252503B2/ja
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JP2020070531A 2020-04-09 2020-04-09 発光装置の製造方法及び発光装置 Active JP6888709B2 (ja)

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Application Number Priority Date Filing Date Title
JP2020070531A JP6888709B2 (ja) 2020-04-09 2020-04-09 発光装置の製造方法及び発光装置
JP2021084519A JP7108221B2 (ja) 2020-04-09 2021-05-19 発光装置の製造方法及び発光装置
JP2022110506A JP7252503B2 (ja) 2020-04-09 2022-07-08 発光装置の製造方法及び発光装置

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JP2020070531A JP6888709B2 (ja) 2020-04-09 2020-04-09 発光装置の製造方法及び発光装置

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JP2018090362A Division JP6797861B2 (ja) 2018-05-09 2018-05-09 発光装置の製造方法及び発光装置

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JP2021084519A Division JP7108221B2 (ja) 2020-04-09 2021-05-19 発光装置の製造方法及び発光装置

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JP6888709B2 true JP6888709B2 (ja) 2021-06-16

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JP2021084519A Active JP7108221B2 (ja) 2020-04-09 2021-05-19 発光装置の製造方法及び発光装置

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20240379926A1 (en) * 2021-09-24 2024-11-14 Stanley Electric Co., Ltd. Light-emitting device, and method for producing light-emitting device

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114566580B (zh) * 2022-03-04 2024-08-02 深圳市聚飞光电股份有限公司 一种led支架、led支架的制造方法和led发光装置
JP2024001800A (ja) * 2022-06-22 2024-01-10 スタンレー電気株式会社 発光装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3217322B2 (ja) 1999-02-18 2001-10-09 日亜化学工業株式会社 チップ部品型発光素子
JP2002314143A (ja) * 2001-04-09 2002-10-25 Toshiba Corp 発光装置
JP3915794B2 (ja) * 2003-04-02 2007-05-16 ヤマハ株式会社 半導体パッケージ、その製造方法、および、これに使用するリードフレーム
JP2006086178A (ja) * 2004-09-14 2006-03-30 Toshiba Corp 樹脂封止型光半導体装置
JP5232369B2 (ja) * 2006-02-03 2013-07-10 日立化成株式会社 光半導体素子搭載用パッケージ基板の製造方法およびこれを用いた光半導体装置の製造方法
JP5057707B2 (ja) * 2006-06-16 2012-10-24 日亜化学工業株式会社 発光装置
JP4872683B2 (ja) * 2007-01-29 2012-02-08 株式会社デンソー モールドパッケージの製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20240379926A1 (en) * 2021-09-24 2024-11-14 Stanley Electric Co., Ltd. Light-emitting device, and method for producing light-emitting device

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JP2021121033A (ja) 2021-08-19
JP2020127026A (ja) 2020-08-20
JP7108221B2 (ja) 2022-07-28

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