JP6888020B2 - 導電性組成物および前記組成物の用途 - Google Patents
導電性組成物および前記組成物の用途 Download PDFInfo
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- JP6888020B2 JP6888020B2 JP2018544245A JP2018544245A JP6888020B2 JP 6888020 B2 JP6888020 B2 JP 6888020B2 JP 2018544245 A JP2018544245 A JP 2018544245A JP 2018544245 A JP2018544245 A JP 2018544245A JP 6888020 B2 JP6888020 B2 JP 6888020B2
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- conductive
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- silver powder
- conductive composition
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- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
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- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
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- H10F10/10—Individual photovoltaic cells, e.g. solar cells having potential barriers
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- H10F10/166—Photovoltaic cells having only PN heterojunction potential barriers comprising heterojunctions with Group IV materials, e.g. ITO/Si or GaAs/SiGe photovoltaic cells the heterojunctions being Group IV-IV heterojunctions, e.g. Si/Ge, SiGe/Si or Si/SiC photovoltaic cells the Group IV-IV heterojunctions being heterojunctions of crystalline and amorphous materials, e.g. silicon heterojunction [SHJ] photovoltaic cells
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- H10F77/00—Constructional details of devices covered by this subclass
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
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- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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| CNPCT/CN2016/074287 | 2016-02-22 | ||
| PCT/CN2016/074287 WO2017143496A1 (en) | 2016-02-22 | 2016-02-22 | Electrically conductive composition and applications for said composition |
| PCT/CN2017/072825 WO2017143901A1 (en) | 2016-02-22 | 2017-02-03 | Electrically conductive composition and applications for said composition |
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| CN108039378A (zh) * | 2017-11-15 | 2018-05-15 | 君泰创新(北京)科技有限公司 | 太阳能电池上电极的制备方法 |
| KR101936229B1 (ko) | 2017-11-29 | 2019-01-08 | 한국생산기술연구원 | 태양 전지 |
| CN112789323B (zh) * | 2018-10-02 | 2024-02-02 | 株式会社力森诺科 | 树脂组合物、固化物及半导体器件 |
| CN110957379A (zh) * | 2019-11-29 | 2020-04-03 | 晋能光伏技术有限责任公司 | 多栅电极结构和具有其的异质结太阳能电池及其制备方法 |
| JP7539988B2 (ja) * | 2019-12-20 | 2024-08-26 | ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェン | 金属結合用の銅合金を含有する銀焼結組成物 |
| CN114517314A (zh) * | 2020-11-20 | 2022-05-20 | 嘉兴阿特斯技术研究院有限公司 | 一种丝网印刷用电镀浆料及其制备方法和应用 |
| CN115206584A (zh) * | 2021-03-27 | 2022-10-18 | 广东金乌新材料科技有限公司 | 一种太阳能异质结电池用低成本银包铜浆料及其制备方法 |
| JP7288133B1 (ja) * | 2021-12-06 | 2023-06-06 | Dowaエレクトロニクス株式会社 | 銀粉及び銀粉の製造方法ならびに導電性ペースト |
| NL2031897B1 (en) | 2022-05-17 | 2023-11-24 | Univ Delft Tech | Localized passivated contacts for Solar Cells |
| CN114999706B (zh) * | 2022-06-28 | 2025-06-20 | 北京中科纳通电子技术有限公司 | 一种纳米压印导电浆料及其制备方法与应用 |
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| US7901885B2 (en) * | 2006-05-09 | 2011-03-08 | Dsm Ip Assets B.V. | Genes and markers in type 2 diabetes and obesity |
| CN102576576B (zh) * | 2009-09-04 | 2014-08-06 | 巴斯夫欧洲公司 | 用于印刷导电迹线的组合物以及制备太阳能电池的方法 |
| CN102054881B (zh) * | 2009-10-29 | 2012-07-18 | 上海宝银电子材料有限公司 | 晶体硅太阳能电池用背面低温可焊导电银浆及制备方法 |
| US8535971B2 (en) * | 2010-02-12 | 2013-09-17 | Heraeus Precious Metals North America Conshohocken Llc | Method for applying full back surface field and silver busbar to solar cell |
| CN101976710A (zh) * | 2010-10-15 | 2011-02-16 | 上海交通大学 | 基于氢化微晶硅薄膜的晶体硅异质结太阳电池的制备方法 |
| US8419981B2 (en) * | 2010-11-15 | 2013-04-16 | Cheil Industries, Inc. | Conductive paste composition and electrode prepared using the same |
| WO2012102304A1 (ja) * | 2011-01-26 | 2012-08-02 | ナミックス株式会社 | 導電性ペースト及びその製造方法 |
| US20130180583A1 (en) * | 2012-01-17 | 2013-07-18 | E I Du Pont De Nemours And Company | Conductive paste for fine-line high-aspect-ratio screen printing in the manufacture of semiconductor devices |
| JP6081231B2 (ja) * | 2012-03-05 | 2017-02-15 | ナミックス株式会社 | 熱伝導性ペースト及びその使用 |
| JP5839574B2 (ja) * | 2012-03-21 | 2016-01-06 | 京都エレックス株式会社 | 加熱硬化型導電性ペースト組成物 |
| GB2504957A (en) * | 2012-08-14 | 2014-02-19 | Henkel Ag & Co Kgaa | Curable compositions comprising composite particles |
| JP5859949B2 (ja) * | 2012-09-27 | 2016-02-16 | 三ツ星ベルト株式会社 | 導電性組成物 |
| JP6233792B2 (ja) * | 2013-01-28 | 2017-11-22 | 国立大学法人群馬大学 | 導電性ペースト |
| WO2015085534A1 (en) * | 2013-12-12 | 2015-06-18 | Ablestik (Shanghai) Limited | Electrically conductive inks |
| JP6134597B2 (ja) * | 2013-07-10 | 2017-05-24 | ナミックス株式会社 | ダイアタッチ剤 |
| JP6362932B2 (ja) * | 2014-06-19 | 2018-07-25 | 株式会社カネカ | 太陽電池モジュール及びその製造方法 |
| CN204144306U (zh) * | 2014-09-16 | 2015-02-04 | 惠州比亚迪实业有限公司 | Led芯片 |
| CN204991760U (zh) * | 2015-09-21 | 2016-01-20 | 茂邦电子有限公司 | 覆晶式发光二极管封装结构 |
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