JP6883704B2 - 複数の接地面のサーマルシンク - Google Patents
複数の接地面のサーマルシンク Download PDFInfo
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- JP6883704B2 JP6883704B2 JP2020508606A JP2020508606A JP6883704B2 JP 6883704 B2 JP6883704 B2 JP 6883704B2 JP 2020508606 A JP2020508606 A JP 2020508606A JP 2020508606 A JP2020508606 A JP 2020508606A JP 6883704 B2 JP6883704 B2 JP 6883704B2
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- 239000000758 substrate Substances 0.000 claims description 34
- 239000004020 conductor Substances 0.000 claims description 31
- 229910052758 niobium Inorganic materials 0.000 claims description 6
- 239000010955 niobium Substances 0.000 claims description 6
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 239000000463 material Substances 0.000 description 11
- 238000001816 cooling Methods 0.000 description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 239000011521 glass Substances 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000002470 thermal conductor Substances 0.000 description 1
- 230000032258 transport Effects 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
- H01L23/4334—Auxiliary members in encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3736—Metallic materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
- H01L23/49888—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials the conductive materials containing superconducting material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N69/00—Integrated devices, or assemblies of multiple devices, comprising at least one superconducting element covered by group H10N60/00
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Superconductor Devices And Manufacturing Methods Thereof (AREA)
- Containers, Films, And Cooling For Superconductive Devices (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Description
以下に、上記実施形態から把握できる技術思想を付記として記載する。
[付記1]
モノリシックマイクロ波集積回路(MMIC)であって、
基板の下にあるサーマルシンク層と、
第1の動作温度要件を有する第1の組の超伝導回路に関連する第1の導電性接地面と、
前記第1の導電性接地面を前記基板を介して前記サーマルシンク層に結合する第1の組の熱伝導性ビアと、
前記第1の動作温度要件よりも高い第2の動作温度要件を有する第2の組の超伝導回路に関連する第2の導電性接地面と、
前記第2の導電性接地面を前記基板を介して前記サーマルシンク層に結合する第2の組の熱伝導性ビアとを備え、前記第1の組の熱伝導性ビアは、前記第2の組の超伝導回路よりもより多くの熱を前記第1の組の超伝導回路から除去するために、前記第2の組の熱伝導性ビアよりも大きな体積の熱伝導性材料を有する、モノリシックマイクロ波集積回路。
[付記2]
前記サーマルシンク層、前記第1の組の熱伝導性ビア、および前記第2の組の熱伝導性ビアは、銅で形成される、付記1に記載の回路。
[付記3]
前記第1の導電性接地面はニオブから形成され、前記第2の導電性接地面はアルミニウムから形成される、付記1に記載の回路。
[付記4]
前記第1の導電性接地面および前記第1の組の超伝導回路は、前記基板の上にある第1の誘電体層内に存在し、前記第2の導電性接地面および前記第2の組の超伝導回路は、前記基板の上および前記第1の誘電体層の上および下のいずれか一方にある第2の誘電体層内に存在する、付記1に記載の回路。
[付記5]
前記第1の導電性接地面および前記第1の組の超伝導回路は、前記基板の上にある第1の誘電体層内に存在し、前記第2の導電性接地面および前記第2の組の超伝導回路は、前記第1の誘電体層内において前記第1の導電性接地面および前記第1の組の超伝導回路と隣接し、かつ物理的に分離されている、付記1に記載の回路。
[付記6]
前記第1の組の熱伝導性ビアの各熱伝導性ビアは第1のサイズを有し、前記第2の組の熱伝導性ビアの各熱伝導性ビアは同数の熱伝導性ビアの第2のサイズを有し、前記第1のサイズは、前記第2の組の超伝導回路よりも小さい勾配で熱を前記第1の組の超伝導回路から除去するために、前記第2のサイズよりも大きいサイズである、付記1に記載の回路。
[付記7]
前記第1の組の熱伝導性ビアの各熱伝導性ビアと前記第2の組の熱伝導性ビアの各熱伝導性ビアは、実質的に同じサイズであり、前記第1の組の熱伝導性ビアの数熱伝導性ビアの数は、前記第2の組の超伝導回路よりも小さい勾配で熱を前記第1の組の超伝導回路から除去するために、前記第2の組の熱伝導性ビアの熱伝導性ビアの数よりも多い、付記1に記載の回路。
Claims (11)
- 集積回路であって、
サーマルシンク層と、
第1の動作温度要件を有する第1の組の回路に関連する第1の接地面と、
前記第1の接地面を前記サーマルシンク層に結合する第1の熱伝導性ビアと、
前記第1の動作温度要件よりも高い第2の動作温度要件を有する第2の組の回路に関連する第2の接地面と、
前記第2の接地面を前記サーマルシンク層に結合する第2の熱伝導性ビアとを備え、前記第1の熱伝導性ビアは、前記第2の組の回路よりも小さい勾配で熱を前記第1の組の回路から除去する、集積回路。 - 前記サーマルシンク層、前記第1の熱伝導性ビア、および前記第2の熱伝導性ビアは、銅で形成される、請求項1に記載の回路。
- 前記第1の接地面および前記第1の組の回路は、第1の導電性材料で形成され、前記第2の接地面および前記第2の組の回路は、前記第1の導電性材料とは異なる動作温度要件を有する第2の導電性材料で形成される、請求項1に記載の回路。
- 前記第1の接地面はニオブから形成され、前記第2の接地面はアルミニウムから形成される、請求項3に記載の回路。
- 前記第1の接地面および前記第1の組の回路は、基板の上にある第1の誘電体層内に存在し、前記第2の接地面および前記第2の組の回路は、前記基板の上および前記第1の誘電体層の上および下の一方にある第2の誘電体層内に存在する、請求項3に記載の回路。
- 前記第1の接地面および前記第1の組の回路は、基板の上にある第1の誘電体層内に存在し、前記第2の接地面および前記第2の組の回路は、前記第1の誘電体層内において前記第1の接地面および前記第1の組の回路に隣接し、かつ物理的に分離して存在する、請求項3に記載の回路。
- 前記第1の熱伝導性ビアは、基板を介して前記第1の接地面を前記サーマルシンク層に結合する複数の第1の熱伝導性ビアのうちの1つであり、前記第2の熱伝導性ビアは、前記基板を介して前記第2の接地面を前記サーマルシンク層に結合する複数の第2の熱伝導性ビアのうちの1つである、請求項1に記載の回路。
- 前記複数の第1の熱伝導性ビアの各々は第1のサイズを有し、前記複数の第2の熱伝導性ビアの各々は同数の熱伝導性ビアの第2のサイズを有し、前記第1のサイズは、前記第2の組の回路よりもより多くの熱を前記第1の組の回路から除去するために、前記第2のサイズよりも大きいサイズである、請求項7に記載の回路。
- 前記複数の第1の熱伝導性ビアの各々と前記複数の第2の熱伝導性ビアの各々は同じサイズであり、前記複数の第1の熱伝導性ビアの数は、前記第2の組の回路よりも小さい勾配で前記第1の組の回路から熱を除去するために、前記複数の第2の熱伝導性ビアの数よりも多い、請求項7に記載の回路。
- 前記第1の熱伝導性ビアは、前記第2の熱伝導性ビアよりも大きな体積の熱伝導性材料を有する、請求項1に記載の回路。
- 前記集積回路は、モノリシックマイクロ波集積回路(MMIC)である、請求項1に記載の回路。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US15/704,919 | 2017-09-14 | ||
US15/704,919 US10229864B1 (en) | 2017-09-14 | 2017-09-14 | Cryogenic integrated circuit having a heat sink coupled to separate ground planes through differently sized thermal vias |
PCT/US2018/048590 WO2019055217A1 (en) | 2017-09-14 | 2018-08-29 | THERMAL DISSIPATOR WITH MULTIPLE MASS PLAN |
Publications (3)
Publication Number | Publication Date |
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JP2020530947A JP2020530947A (ja) | 2020-10-29 |
JP2020530947A5 JP2020530947A5 (ja) | 2020-12-10 |
JP6883704B2 true JP6883704B2 (ja) | 2021-06-09 |
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Application Number | Title | Priority Date | Filing Date |
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JP2020508606A Active JP6883704B2 (ja) | 2017-09-14 | 2018-08-29 | 複数の接地面のサーマルシンク |
Country Status (7)
Country | Link |
---|---|
US (2) | US10229864B1 (ja) |
EP (1) | EP3682473B1 (ja) |
JP (1) | JP6883704B2 (ja) |
KR (1) | KR102294538B1 (ja) |
AU (2) | AU2018332720B2 (ja) |
CA (1) | CA3072356A1 (ja) |
WO (1) | WO2019055217A1 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10229864B1 (en) | 2017-09-14 | 2019-03-12 | Northrop Grumman Systems Corporation | Cryogenic integrated circuit having a heat sink coupled to separate ground planes through differently sized thermal vias |
US10629535B2 (en) * | 2017-10-31 | 2020-04-21 | Northrop Grumman Systems Corporation | Thermally isolated ground planes with a superconducting electrical coupler |
US11004763B2 (en) | 2018-12-20 | 2021-05-11 | Northrop Grumman Systems Corporation | Superconducting device with multiple thermal sinks |
US11158781B2 (en) | 2019-11-27 | 2021-10-26 | International Business Machines Corporation | Permanent wafer handlers with through silicon vias for thermalization and qubit modification |
US11522118B2 (en) | 2020-01-09 | 2022-12-06 | Northrop Grumman Systems Corporation | Superconductor structure with normal metal connection to a resistor and method of making the same |
Family Cites Families (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4554567A (en) | 1983-03-21 | 1985-11-19 | Sperry Corporation | Superconductive integrated circuit incorporating a magnetically controlled interferometer |
US5773875A (en) | 1996-02-23 | 1998-06-30 | Trw Inc. | High performance, low thermal loss, bi-temperature superconductive device |
GB2326029A (en) | 1997-06-03 | 1998-12-09 | Marconi Gec Ltd | Cryogenic electronic assembly with stripline connection and adjustment means |
US6058013A (en) * | 1998-07-02 | 2000-05-02 | Motorola Inc. | Molded housing with integral heatsink |
JP3934308B2 (ja) * | 2000-05-24 | 2007-06-20 | 独立行政法人物質・材料研究機構 | クライオスタット |
JP2004158865A (ja) * | 2001-05-30 | 2004-06-03 | Sharp Corp | 半導体装置の製造方法 |
JP2003188307A (ja) * | 2001-12-19 | 2003-07-04 | Tdk Corp | 電力増幅モジュール及び電力増幅モジュール用基板 |
JP2003273520A (ja) * | 2002-03-14 | 2003-09-26 | Tdk Corp | 積層モジュール |
JP3908146B2 (ja) * | 2002-10-28 | 2007-04-25 | シャープ株式会社 | 半導体装置及び積層型半導体装置 |
JP4869546B2 (ja) * | 2003-05-23 | 2012-02-08 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
JP4157449B2 (ja) * | 2003-09-25 | 2008-10-01 | 京セラ株式会社 | 高周波用モジュール |
US7286359B2 (en) | 2004-05-11 | 2007-10-23 | The U.S. Government As Represented By The National Security Agency | Use of thermally conductive vias to extract heat from microelectronic chips and method of manufacturing |
US8022532B2 (en) * | 2005-06-06 | 2011-09-20 | Rohm Co., Ltd. | Interposer and semiconductor device |
WO2006132957A2 (en) | 2005-06-07 | 2006-12-14 | University Of Florida Research Foundation, Inc. | Integrated electronic circuitry and heat sink |
US7863189B2 (en) * | 2007-01-05 | 2011-01-04 | International Business Machines Corporation | Methods for fabricating silicon carriers with conductive through-vias with low stress and low defect density |
US20100328913A1 (en) * | 2007-03-30 | 2010-12-30 | Andreas Kugler | Method for the producing an electronic subassembly, as well as electronic subassembly |
WO2009052621A1 (en) | 2007-10-22 | 2009-04-30 | D-Wave Systems Inc. | Systems, methods, and apparatus for electrical filters and input/output systems |
US10181454B2 (en) * | 2010-03-03 | 2019-01-15 | Ati Technologies Ulc | Dummy TSV to improve process uniformity and heat dissipation |
JP2012009828A (ja) * | 2010-05-26 | 2012-01-12 | Jtekt Corp | 多層回路基板 |
US8492911B2 (en) * | 2010-07-20 | 2013-07-23 | Lsi Corporation | Stacked interconnect heat sink |
US20130258595A1 (en) | 2012-03-27 | 2013-10-03 | Microsoft Corporation | Heat Transfer For Superconducting Integrated Circuits At Millikelvin Temperatures |
US10096534B2 (en) * | 2012-11-09 | 2018-10-09 | Nvidia Corporation | Thermal performance of logic chip in a package-on-package structure |
TWI509758B (zh) | 2012-12-26 | 2015-11-21 | Univ Nat Chiao Tung | 三維積體電路 |
AU2014405910B2 (en) * | 2014-09-10 | 2018-05-17 | Northrop Grumman Systems Corporation | Ground grid for superconducting circuits |
WO2016048676A1 (en) * | 2014-09-24 | 2016-03-31 | Hiq Solar, Inc. | Transistor thermal and emi management solution for fast edge rate environment |
US9836699B1 (en) | 2015-04-27 | 2017-12-05 | Rigetti & Co. | Microwave integrated quantum circuits with interposer |
JP6791621B2 (ja) * | 2015-09-11 | 2020-11-25 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
US10586909B2 (en) * | 2016-10-11 | 2020-03-10 | Massachusetts Institute Of Technology | Cryogenic electronic packages and assemblies |
US10141493B2 (en) | 2017-04-11 | 2018-11-27 | Microsoft Technology Licensing, Llc | Thermal management for superconducting interconnects |
US10290676B2 (en) | 2017-08-15 | 2019-05-14 | Northrop Grumman Systems Corporation | Superconducting device with thermally conductive heat sink |
US10229864B1 (en) | 2017-09-14 | 2019-03-12 | Northrop Grumman Systems Corporation | Cryogenic integrated circuit having a heat sink coupled to separate ground planes through differently sized thermal vias |
US10390434B2 (en) * | 2017-10-13 | 2019-08-20 | Qorvo Us, Inc. | Laminate-based package with internal overmold |
US10629535B2 (en) * | 2017-10-31 | 2020-04-21 | Northrop Grumman Systems Corporation | Thermally isolated ground planes with a superconducting electrical coupler |
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2017
- 2017-09-14 US US15/704,919 patent/US10229864B1/en active Active
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2018
- 2018-08-29 JP JP2020508606A patent/JP6883704B2/ja active Active
- 2018-08-29 KR KR1020207007653A patent/KR102294538B1/ko active IP Right Grant
- 2018-08-29 CA CA3072356A patent/CA3072356A1/en not_active Abandoned
- 2018-08-29 AU AU2018332720A patent/AU2018332720B2/en active Active
- 2018-08-29 EP EP18766531.0A patent/EP3682473B1/en active Active
- 2018-08-29 WO PCT/US2018/048590 patent/WO2019055217A1/en unknown
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2019
- 2019-01-07 US US16/241,629 patent/US10727162B2/en active Active
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2020
- 2020-12-21 AU AU2020294174A patent/AU2020294174B2/en active Active
Also Published As
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US20190157184A1 (en) | 2019-05-23 |
AU2020294174A1 (en) | 2021-01-28 |
WO2019055217A1 (en) | 2019-03-21 |
KR102294538B1 (ko) | 2021-08-30 |
JP2020530947A (ja) | 2020-10-29 |
AU2018332720B2 (en) | 2020-09-24 |
US10229864B1 (en) | 2019-03-12 |
EP3682473A1 (en) | 2020-07-22 |
KR20200041951A (ko) | 2020-04-22 |
EP3682473B1 (en) | 2021-07-21 |
US20190080983A1 (en) | 2019-03-14 |
AU2020294174B2 (en) | 2022-02-24 |
CA3072356A1 (en) | 2019-03-21 |
US10727162B2 (en) | 2020-07-28 |
AU2018332720A1 (en) | 2020-02-27 |
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