JP6882721B2 - 高分岐高分子及び金属微粒子を含む無電解めっき下地剤 - Google Patents

高分岐高分子及び金属微粒子を含む無電解めっき下地剤 Download PDF

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Publication number
JP6882721B2
JP6882721B2 JP2018504520A JP2018504520A JP6882721B2 JP 6882721 B2 JP6882721 B2 JP 6882721B2 JP 2018504520 A JP2018504520 A JP 2018504520A JP 2018504520 A JP2018504520 A JP 2018504520A JP 6882721 B2 JP6882721 B2 JP 6882721B2
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group
base material
metal
fine particles
photosensitive
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Japanese (ja)
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JPWO2017154919A1 (ja
Inventor
小島　圭介
圭介 小島
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Nissan Chemical Corp
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Nissan Chemical Corp
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F12/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
    • C08F12/02—Monomers containing only one unsaturated aliphatic radical
    • C08F12/04—Monomers containing only one unsaturated aliphatic radical containing one ring
    • C08F12/14—Monomers containing only one unsaturated aliphatic radical containing one ring substituted by hetero atoms or groups containing heteroatoms
    • C08F12/26—Nitrogen
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Polymers & Plastics (AREA)
  • Physics & Mathematics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials For Photolithography (AREA)
  • Chemically Coating (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Paints Or Removers (AREA)
JP2018504520A 2016-03-09 2017-03-07 高分岐高分子及び金属微粒子を含む無電解めっき下地剤 Active JP6882721B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2016045544 2016-03-09
JP2016045544 2016-03-09
PCT/JP2017/009042 WO2017154919A1 (fr) 2016-03-09 2017-03-07 Agent de sous-couche de dépôt autocatalytique comprenant des microparticules métalliques et un polymère hyper-ramifié

Publications (2)

Publication Number Publication Date
JPWO2017154919A1 JPWO2017154919A1 (ja) 2019-01-10
JP6882721B2 true JP6882721B2 (ja) 2021-06-02

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ID=59789366

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018504520A Active JP6882721B2 (ja) 2016-03-09 2017-03-07 高分岐高分子及び金属微粒子を含む無電解めっき下地剤

Country Status (3)

Country Link
JP (1) JP6882721B2 (fr)
TW (1) TWI709664B (fr)
WO (1) WO2017154919A1 (fr)

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4247235B2 (ja) * 2001-05-16 2009-04-02 パナソニック株式会社 固体撮像装置およびその駆動方法
KR101009733B1 (ko) * 2007-05-15 2011-01-20 주식회사 엘지화학 전자파 차폐층 제조시 무전해도금에 대한 촉매 전구체수지조성물, 이를 이용한 금속패턴 형성방법 및 이에 따라제조된 금속패턴
US8722562B2 (en) * 2008-08-22 2014-05-13 Nissan Chemical Industries, Ltd. Metal fine particle dispersant containing branched polymer compound having ammonium group
US9650534B2 (en) * 2011-04-12 2017-05-16 Nissan Chemical Industries, Ltd. Primer for electroless plating comprising hyperbranched polymer and metal fine particles
WO2012141216A1 (fr) * 2011-04-12 2012-10-18 国立大学法人九州大学 Primaire pour dépôt autocatalytique comprenant un polymère hyperramifié, des microparticules métalliques et un acide organique
GB2499663A (en) * 2012-02-27 2013-08-28 Conductive Inkjet Tech Ltd Protective coatings for photo-resists that are separately applied with different solvents but removed together using same solvent
WO2014042215A1 (fr) * 2012-09-13 2014-03-20 日産化学工業株式会社 Agent de base pour dépôt autocatalytique
JP6631806B2 (ja) * 2014-07-30 2020-01-15 日産化学株式会社 ハイパーブランチポリマー、金属微粒子及び樹脂プライマーを含む無電解めっき下地剤
EP3190463A4 (fr) * 2014-09-05 2018-05-30 Nissan Chemical Industries, Ltd. Agent de sous-couche de placage autocatalytique photosensible
EP3190207B1 (fr) * 2014-09-05 2019-05-08 Nissan Chemical Corporation Couche primaire pour dépôt autocatalytique photodurcissable
CN107532302B (zh) * 2015-03-31 2019-10-08 日产化学工业株式会社 感光性非电解镀基底剂

Also Published As

Publication number Publication date
TW201805480A (zh) 2018-02-16
JPWO2017154919A1 (ja) 2019-01-10
WO2017154919A1 (fr) 2017-09-14
TWI709664B (zh) 2020-11-11

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