JP6878659B2 - Display device - Google Patents

Description

The technical field is related to electronic books.

In recent years, with the progress of digitization technology, the provision mode of providing text information and image information of newspapers, magazines, etc. as electronic data has been adopted. This type of electronic data is generally characterized in that its contents can be viewed by being displayed on a display device provided in a PC or the like.

As the display device for displaying the above-mentioned electronic data, there is a portable type display device other than the stationary display device. An electronic book is a typical portable display device. An electronic book usually has a display unit on the front surface of the main body, and a configuration is adopted in which data on the next page or the previous page is displayed on the display unit by operating a page switching key provided on the outer peripheral portion of the main body.

However, electronic books adopting such a configuration are handled very differently from paper media such as newspapers and magazines. In particular, the act of switching pages by key operation is far from the habit of handling paper-based books. For this reason, there is a problem that the efficiency of reading characters, the efficiency of understanding sentences, the efficiency of image recognition, and the like are lowered due to such a difference in handling.

In order to eliminate the difference from the above-mentioned paper medium, an electronic book using a double-sided display device has been proposed (see, for example, Patent Document 1 and Patent Document 2).

Japanese Unexamined Patent Publication No. 2005-38608 Japanese Unexamined Patent Publication No. 2003-58081

One aspect of the disclosed invention is an object of the present invention to provide an electronic book that reduces breakage of a drive circuit when handling a flexible panel. Alternatively, one aspect of the disclosed invention aims to provide an electronic book having a simplified structure.

One aspect of the disclosed invention has a plurality of flexible display panels having a display unit whose display is controlled by a scanning line drive circuit and a signal line drive circuit, and a binding unit for fixing the plurality of display panels. , The binding portion is provided with a signal line drive circuit, and the display panel is provided with a scanning line drive circuit at an end portion in the direction perpendicular to the binding portion.

In one aspect of the disclosed invention, the scanning line drive circuit and the signal line driving circuit may have transistors, and electronic books having different structures of the transistors constituting the scanning line driving circuit and the transistors constituting the signal line driving circuit may be used.

In one aspect of the disclosed invention, the channel layer of the transistor constituting the scanning line drive circuit may be a non-single crystal semiconductor, and the channel layer of the transistor constituting the signal line drive circuit may be an electronic book which is a single crystal semiconductor. ..

In one aspect of the disclosed invention, the non-single crystal semiconductor may be an electronic book that is amorphous silicon, microcrystalline silicon, polysilicon, or an oxide semiconductor.

In one aspect of the disclosed invention, the display unit may be an electronic book in which the display unit has a transistor and the channel layer of the transistor constituting the display unit and the transistor forming the scanning line drive circuit are provided of the same material.

In one aspect of the disclosed invention, the binding portion may be an electronic book having any one of a battery, an antenna, a CPU, and a memory in addition to the signal line drive circuit.

In one aspect of the disclosed invention, the scanning line drive circuit may be an electronic book having a plurality of circuit units, and the plurality of circuit units are provided apart from each other.

In one aspect of the disclosed invention, an electronic book having a stress concentration region between a plurality of circuit units may be used.

In one aspect of the disclosed invention, the plurality of display panels are a first display panel having a first display unit, a second display panel having a second display unit, a first display panel, and a second display panel. A third display panel provided between the display panels of the above, having a third display unit on the first surface and a fourth display unit on the second surface opposite to the first surface. The third display panel may be an electronic book that is more bendable than the first display panel and the second display panel.

In one aspect of the disclosed invention, the first display panel has a first optical sensor that controls the presence or absence of display on the first display unit and the third display unit, and the second display panel has a second display panel. It has a second optical sensor that controls the presence / absence of display of the second display unit and the fourth display unit, and the third display panel has a light-shielding unit in an area overlapping the first optical sensor and the second optical sensor. It may be an electronic book having.

Further, in the present specification and the like, the semiconductor device refers to all devices that can function by utilizing the semiconductor characteristics, and the electro-optical device, the semiconductor circuit, and the electronic device are all included in the semiconductor device.

Further, in the present specification and the like, the display device includes a light emitting device and a liquid crystal display device. The light emitting device includes a light emitting element, and the liquid crystal display device includes a liquid crystal element. The light emitting element includes an element whose brightness is controlled by current or voltage in its category, and specifically, an inorganic EL (Electro L).
There are uminesec) elements, organic EL elements, and the like.

According to one aspect of the disclosed invention, it is possible to reduce the breakage of the drive circuit and provide a durable electronic book.

According to one aspect of the disclosed invention, the structure can be simplified and the cost of the electronic book can be reduced.

It is a figure explaining one form of an electronic book. It is a figure explaining one form of an electronic book. It is a figure explaining one form of an electronic book. It is a figure explaining one form of an electronic book. It is a figure explaining one form of the circuit configured in the binding part of an electronic book. It is a figure explaining one form of an electronic book. It is a figure explaining one form of an electronic book. It is a figure explaining one form of an electronic book. It is a figure explaining one form of an electronic book. It is a figure explaining one form of an electronic book. It is a figure explaining one form of an electronic book. It is a figure explaining one form of an electronic book. It is a figure explaining one form of an electronic book. It is a figure explaining one form of an electronic book. It is a figure explaining one form of an electronic book. It is a figure explaining the block diagram of one form of an electronic book. It is a figure explaining one form of a display panel. It is a figure explaining one form of a display panel. It is a figure explaining one form of a display panel. It is a figure explaining one form of a display panel. It is a figure explaining one form of a transistor applicable to an electronic book. It is a figure explaining one form of a display panel.

Hereinafter, embodiments will be described in detail with reference to the drawings. However, the invention is not limited to the description of the embodiments shown below, and it is obvious to those skilled in the art that the form and details can be variously changed without departing from the spirit of the invention disclosed in the present specification and the like. .. In addition, the configurations according to different embodiments can be combined and implemented as appropriate. In the configuration of the invention described below, the same reference numerals are used for the same parts or parts having similar functions, and the repeated description thereof will be omitted.

The size, layer thickness, or region of each configuration shown in the drawings and the like of each embodiment may be exaggerated for the sake of clarity. Therefore, it is not necessarily limited to that scale.

The terms such as "first", "second", and "third" used in the present specification are added to avoid confusion of the components, and are not limited in number. I will add that.

(Embodiment 1)
In the present embodiment, an example of an electronic book will be described with reference to the drawings.

The electronic book shown in the present embodiment has a plurality of display panels having a display unit whose display is controlled by a scanning line drive circuit and a signal line drive circuit, and a binding unit for fixing the plurality of display panels. A signal line drive circuit is provided inside the binding portion, and a scanning line drive circuit is provided on each of the plurality of display panels.

FIG. 1 shows a case where a binding portion 4308 is provided at an end of two display panels (first display panel 4311 and second display panel 4312) to form a book as an example of an electronic book having a plurality of display panels. Is shown. Hereinafter, an electronic book composed of a first display panel and a second display panel will be specifically described with reference to FIG. Note that FIG. 1A shows a state in which the electronic book is open, FIG. 1B shows a state in which the electronic book is closed, and FIG. 1C shows a state in which the electronic book is half open.

The electronic book shown in FIG. 1 includes a first display panel 4311 having a first display unit 4301, a second display panel 4312 having a second display unit 4307, and a first display panel 4311 and a second display panel 4311. A binding portion 4308 provided at one end of the display panel 4312 and a first display portion 430.
Display of scanning line drive circuits 4321a and 4321b that control the display of 1 and scanning line drive circuits 4322a and 4322b that control the display of the second display unit 4307, and display of the first display unit 4301 and the second display unit 4307. It has a signal line drive circuit 4323 for controlling.

The scan line drive circuits 4321a and 4321b are provided on the first display panel 4311, the scan line drive circuits 4322a and 4322b are provided on the second display panel 4312, and the signal line drive circuit 4323 is provided inside the binding portion 4308. ing.

The first display panel 4311 can be configured to have flexibility. In this case, the pixel circuit constituting the first display unit 4301 and the scanning line drive circuits 4321a and 4321b may be provided on a flexible substrate such as plastic.

The second display panel 4312 can also have a flexible configuration like the first display panel 4311. In this case as well, the pixel circuit constituting the second display unit 4307 and the scanning line drive circuits 4322a and 4322b may be provided on a flexible substrate such as plastic.

The binding portion 4308 includes at least the first display panel 4311 and the second display panel 4312.
It is preferable to have a configuration that is more difficult to bend (high rigidity). As an example, the binding part 430
The housing constituting No. 8 can be made of plastic, metal, or the like thicker than the first display panel 4311 and the second display panel 4312. In this case, the electronic book can be configured to bend (curve) at a portion other than the binding portion 4308.

The place where the binding portion 4308 is provided is not particularly limited, but as an example, the first display panel 43
A binding portion 4308 can be provided along one end of the 11 and the second display panel 4312. For example, as shown in FIG. 1, the first display panel 4311 and the second display panel 431
When 2 is rectangular, the binding portion 430 is aligned along a predetermined side (so that one side is fixed).
8 can be provided. The rectangular shape referred to here includes the case where the corners are rounded.

The signal line drive circuit 4323 is provided inside the binding portion 4308. For example, binding part 430
8 is provided in a columnar or columnar housing having a hollow, and a signal line drive circuit 432 is provided in the hollow portion.
3 can be provided. By providing the signal line drive circuit 4323 inside the binding portion 4308, it is possible to prevent damage to the signal line drive circuit 4323 due to bending of the display panel.

Further, as shown in FIG. 1, it is preferable that the scanning line drive circuits 4321a and 4321b are provided at the end portion of the first display panel 4311 in a direction substantially perpendicular to the binding portion 4308. Similarly, it is preferred that the scanning line drive circuits 4322a, 4322b be provided on the second display panel 4312 at an end approximately perpendicular to the binding portion 4308. As a result, as compared with the case where the scanning line driving circuit and the signal line driving circuit are provided at one place (for example, inside the binding portion 4308), the wiring can be reduced and the structure can be simplified.

Further, by forming the pixel circuits constituting the scanning line driving circuits 4321a and 4321b and the first display unit 4301 on a flexible substrate by the same process, the scanning line driving circuit 432
It is possible to bend 1a and 4321b and reduce the cost. Similarly
By forming the pixel circuits constituting the scanning line driving circuits 4322a and 4322b and the second display unit 4307 on a flexible substrate in the same process, the scanning line driving circuits 4322a,
It is possible to bend 4322b and reduce the cost.

The elements constituting the pixel circuit constituting the first display unit 4301, the pixel circuit constituting the second display unit 4307, and the scanning line drive circuits 4321a, 4321b, 4322a, 4322b can be formed of a thin film transistor or the like. .. On the other hand, a circuit that operates at high speed, such as a signal line drive circuit 4323, is formed by using an IC (Integrated Circuit) formed by using a semiconductor substrate such as silicon or an SOI substrate, and the IC is bound to the binding portion 4.
It can be provided inside the 308.

In this way, an IC in which a circuit for high-speed operation such as a signal line drive circuit is formed is provided inside the binding portion, and a scanning line drive circuit and a pixel circuit constituting the display portion are provided on a flexible substrate such as a thin film. Compared with the case where the signal line drive circuit and the scanning line drive circuit are provided by the IC, the display panel can be easily bent and the IC destruction caused by the bending of the display panel can be suppressed. , Further cost reduction can be achieved. Further, by providing the scanning line drive circuit at the end portion of the display panel in the direction perpendicular to the binding portion, it is possible to suppress the routing of wiring and simplify the structure.

Although FIG. 1 shows a case where the scanning line drive circuit is formed at both ends of the first display panel 4311, only one end portion (either the scanning line driving circuit 4321a or the scanning line driving circuit 4321b) is formed. (Only one) may be provided. Similarly, although the case where the scanning line drive circuit is formed at both ends of the second display panel 4312 is shown, the configuration may be such that it is provided only at one end.

This embodiment can be implemented in combination with the configurations described in other embodiments as appropriate.

(Embodiment 2)
In the present embodiment, the specific configuration of the electronic book shown in FIG. 1 will be described with reference to the drawings. The configuration shown in the present embodiment is common to the first embodiment in many parts. Therefore, in the following, the description of the overlapping parts will be omitted, and the differences will be described in detail.

First, an example of a specific configuration of an electronic book will be described with reference to FIG. In addition, FIG.
A) shows a plan view of the electronic book in a closed state, FIG. 2 (B) shows a cross section between AB of FIG. 2 (A), and FIG. 2 (C) shows a detailed schematic view of the cross section. Shown.

In the electronic book shown in FIG. 2, the binding portion 4308 is formed of a hollow housing, and the signal line drive circuit 4323 is provided inside the housing. Here, the signal line drive circuit 4323 is an IC.
The IC is provided inside the binding portion 4308. The IC can be formed by using a semiconductor substrate such as silicon, an SOI substrate, or the like. Of course, a circuit other than the signal line drive circuit (for example, CPU, memory, etc.) can be provided in the IC.

Further, in FIG. 2, the IC provided inside the binding portion 4308 is TAB (Tape Out).
FPC (Flexible Print) using the mapped Bonding method
The case of mounting on dCircuit) is shown.

More specifically, the signal line drive circuit 4323a that controls the first display unit 4301 is the FPC4.
The signal line drive circuit 4323b provided on the 324a and controlling the second display unit 4307 is F.
It is provided on the PC4324b, and the signal line drive circuit 4323a and the signal line drive circuit 4323b are electrically connected via the printed circuit board 4325. The FPC4324a is electrically connected to the first display panel 4311 and the printed circuit board 4325, and the FPC4324b is the second.
It is electrically connected to the display panel 4312 and the printed circuit board 4325.

Further, in FIG. 2, the printed circuit board 4325 can be provided in contact with the housing constituting the binding portion 4308. In this case, the first display panel 4311 and the second display panel 4312 are fixed by the binding portion 4308.

As shown in FIG. 2, when the signal line drive circuit is provided on the FPC, the first display panel 4311
It is preferable to provide the stress concentration region 4326 on one or both of the second display panel 4312 and the second display panel 4312. By providing the stress concentration region 4326 on the display panel, the FP is used when the electronic book is opened (when the first display panel 4311 and / or the second display panel 4312 is bent).
It is possible to reduce the stress applied to C and suppress the destruction of the signal line drive circuit provided on the FPC.

The stress concentration region refers to a region where stress is concentrated, which is formed by deformation of a member due to cutting or the like, bending due to sticking of a member, or change in strength with respect to elongation. Specifically, the stress concentration region 4326 can be formed by providing a notch (recess, groove) in the portion of the first display panel 4311 or the second display panel 4312 to be bent.

For example, the first display panel 4311 may be formed by using the element substrate 4331a and the sealing substrate 4332a, and a notch may be provided in one or both of the element substrate 4331a and the sealing substrate 4332a. FIG. 2 shows a case where a stress concentration region 4326 is formed by providing a notch in the sealing substrate 4332a. Further, in the structure shown here, the element substrate 4331a has a pixel circuit for driving the first display unit 4301 and a scanning line drive circuit 4.
321a and 4321b can be formed, and these circuits can be electrically connected to the FPC4324a.

Similarly, the second display panel 4312 may be formed by using the element substrate 4331b and the sealing substrate 4332b, and may be provided with a recessing portion in one or both of the element substrate 4331b and the sealing substrate 4332b. A pixel circuit for driving the second display unit 4307 and scanning line drive circuits 4322a and 4322b are formed on the element substrate 4331b, and these circuits and the FPC are formed.
The 4324b can be electrically connected.

Further, the stress concentration region 4326 includes the first display panel 4311 and the second display panel 4312.
May be provided along the direction in which it is desired to be bent. For example, in FIG. 2A, the binding portion 430
First display panel 4311 and / or second display panel 43 along a direction approximately parallel to 8.
By providing a notch from the upper end to the lower end of 12, the direction in which the display panel is bent can be controlled (the display panel can be selectively bent in the direction perpendicular to the binding portion 4308), and the signal provided on the FPC is provided. It is possible to suppress the destruction of the line drive circuit.

The stress concentration region 4326 can be provided inside or outside the binding portion 4308. For example, when the first display panel 4311 and the second display panel 4312 are closed and the binding portion 4308 is provided so as to be in contact with the first display panel 4311 or the second display panel 4312, the binding portion 4308 is provided. It is preferable to provide the stress concentration region 4326 on the outside (for example, between the binding portion 4308 and the display portion).

In FIG. 2, the signal line drive circuit 4323a for controlling the first display unit 4301 and the second display unit 4
The case where the signal line drive circuit 4323b for controlling 307 is formed by using separate ICs and the signal line drive circuit 4323a and the signal line drive circuit 4323b are electrically connected via the printed circuit board 4325 is shown. Not limited. The signal line drive circuit 4323a and the signal line drive circuit 4323b may be incorporated into one IC.

Next, the configuration of the electronic book different from that of FIG. 2 will be described with reference to FIG. FIG. 3 (A) shows a plan view of the electronic book in a closed state, FIG. 3 (B) shows a cross section between AB of FIG. 3 (A), and FIG. 3 (C) shows a detailed cross section. A schematic diagram is shown.

FIG. 3 shows a case where the IC provided in the binding portion 4308 is mounted on the first display panel 4311 and the second display panel 4312 by using the COG (Chip On Glass) method.

More specifically, the signal line drive circuit 4323a for controlling the first display unit 4301 is provided on the element substrate 4331a constituting the first display panel 4311, and the second display unit 4
The signal line drive circuit 4323b for controlling 307 is provided on the element substrate 4331b constituting the second display panel 4312, and the signal line drive circuit 4323a and the signal line drive circuit 4323b are electrically connected via the FPC 4324a, 4324b and the printed circuit board 4325. Is connected.

As shown in FIG. 3, when the signal line drive circuit is provided on the display panel, the stress concentration region 43 is provided in one or both of the first display panel 4311 and the second display panel 4312, as in FIG.
It is preferable to provide 26. In this case, the stress concentration region 4326 is provided in a region different from the region in which the signal line drive circuit is provided (a region avoiding the region in which the signal line drive circuit is provided).
For example, when opening an electronic book by providing it on the sealing substrate side (first display panel 431).
When the first or second display panel 4312 is bent), the stress applied to the signal line drive circuit can be reduced, and the destruction of the signal line drive circuit can be suppressed.

Next, the configuration of the electronic book different from those in FIGS. 2 and 3 will be described with reference to FIG. FIG. 4 (A
) Shows a plan view of the electronic book in a closed state, FIG. 4 (B) shows a cross section between AB of FIG. 4 (A), and FIG. 4 (C) shows a detailed schematic view of the cross section. ing.

The electronic book shown in FIG. 4 shows a case where an IC in which a circuit such as a signal line drive circuit is formed is provided on a printed circuit board, and the printed circuit board and a display panel are connected by using an FPC.

More specifically, the signal line drive circuit 4323a for controlling the first display unit 4301 is provided on the printed circuit board 4327a, and the signal line drive circuit 4323b for controlling the second display unit 4307 is provided on the printed circuit board 4327b. The signal line drive circuit 4323a and the signal line drive circuit 4323b are electrically connected via the FPC 4329. FPC4329
Is electrically connected to the printed circuit board 4327a and the printed circuit board 4327b, and is FPC432.
4a is electrically connected to the first display panel 4311 and the printed circuit board 4327a, and is FP.
C4324b is electrically connected to the second display panel 4312 and the printed circuit board 4327b.

In FIG. 4, since the display panel can be bent by the FPC 4324a and the FPC 4324b, the first display panel 4311 and the second display panel 4312 can be configured so that the stress concentration region is not provided.

Next, an example of the configuration of the binding portion 4308 and the circuit that can be provided in the binding portion 4308 will be described with reference to FIG.

FIG. 5 describes a case where the display control unit 200 including the signal line drive circuit is built in the binding unit 4308. These circuits can be formed by using an IC formed by using a semiconductor substrate such as silicon or an SOI substrate as described above.

The display control unit 200 includes a CPU 201, a storage unit 203, a power supply unit 205, and a power supply circuit 207.
, The video signal generation circuit 215, the signal line drive circuits 4323a, 4323b, the operation unit 219, and the like can be provided. In addition, each configuration can be connected via an interface or the like. Further, the display control unit 200 is electrically connected to the first display panel 4311 and the second display panel 4312. Here, the case where the operation unit 219 is provided on the binding unit 4308 is shown, but the operation unit 219 can also be provided on the first display panel 4311 and / or the second display panel 4312.

The CPU 201 controls the operation of the entire electronic book.

The data input unit 211 is a first display unit 4301 and / or a second display unit 43 from an external device.
The information to be displayed in 07 is input. The data input unit 211 may have an antenna 216 in order to transmit / receive data to / from an external device. In this case, the data input unit 211 has a function of transferring the data received by the antenna 216 and the data stored in the recording medium (external memory 213) to the internal memory 209.

The storage unit 203 may have an internal memory 209, a data input unit 211, and an external memory 213. Internal memory 209, data input unit 211 and external memory 213
Can record information to be displayed on the first display unit 4301 and the second display unit 4307, a program for operating an electronic book, and the like.

The internal memory 209 is a program for processing a signal output to the video signal generation circuit 215 and / or the power supply circuit 207 based on the signals from the power supply unit 205, the operation unit 219, etc., and the data input unit 211 from the data input unit 211. It has a storage unit for storing data to be transferred and the like. As an example of the internal memory 209, DRAM (Dynamic Random Acc)
ess Memory), SRAM (Static Random Access Me)
Mory), mask ROM (Read Only Memory), PROM (Prog)
It is composed of a ramable Read Only Memory) and the like.

The external memory 213 includes a storage medium such as an IC card and a memory card.

The power feeding unit 205 is composed of a secondary battery, a capacitor, and the like. As the secondary battery, for example, a lithium battery, preferably a lithium polymer battery using a gel-like electrolyte, a lithium ion battery, or the like can be used to reduce the size. Of course, any rechargeable battery will do,
It may be a rechargeable / dischargeable battery such as a nickel hydrogen battery, a nicad battery, an organic radical battery, a lead storage battery, an air secondary battery, a nickel zinc battery, or a silver zinc battery. As a capacitor
Electric double layer capacitors, lithium ion capacitors and other large capacity capacitors can be used. Capacitors are suitable because they are less likely to deteriorate even if the number of times of charging and discharging increases, and they are also excellent in quick charging characteristics. As the shape of the power feeding unit 205, a sheet shape, a columnar shape, a prismatic shape, a plate shape, a coin shape, or the like may be appropriately selected.

Further, the power feeding unit 205 can be configured to be wirelessly supplied with electric power. In this case, the feeding unit 205 may be provided with an antenna.

The power supply circuit 207 is a circuit for controlling the power supply to the display element in order to display or hide the first display panel 4311 and the second display panel 4312 according to the control of the CPU 201. ..

The operation unit 219 can be provided by a keyboard, operation buttons, or the like. In addition, the operation unit 219
When the first display panel 4311 and / or the second display panel 4312 is provided, the first display unit 4301 and / or the second display unit 4307 may be used as a touch display, and the display unit may be used as an operation unit. Can work.

Although FIG. 5 shows a configuration in which the display control unit 200 is built in the binding unit 4308, a so-called power device such as a switching power supply or a DC-DC converter may be further provided.

Further, in the electronic book shown in FIG. 5, power input and display switching can be performed by operating the operation unit 219. Further, the first display unit 4301 and / or the second display unit 43
You may use 07 as a touch display and operate it by touching the first display unit 4301 or the second display unit 4307 with a finger, an input pen, or the like.

By incorporating the display control unit 200 in the binding unit 4308 in this way, the display control unit 200 can be protected by the housing. Moreover, the electronic book can be made thin.

In the first and second embodiments, the scanning line drive circuit 43 is displayed on the first display panel 4311.
21a and 4321b are provided in the vertical direction of the binding portion 4308 and along the first display portion 4301, and in the second display panel 4312, the scanning line drive circuits 4322a and 4322b are provided in the vertical direction of the binding portion 4308. The case where it is provided along the second display unit 4307 has been shown, but the present invention is not limited to this.

For example, as shown in FIG. 6A, in the first display panel 4311, the scanning line drive circuits 4321a and 4321b can be provided so as to be separated from the binding portion 4308 as compared with the first display portion 4301. .. In general, the elements constituting the scanning line drive circuits 4321a and 4321b are collectively provided from the elements constituting the pixel circuit, and therefore the first display panel 43
By not providing the scanning line drive circuits 4321a and 4321b in the portion where 11 is bent, damage to the scanning line drive circuits 4321a and 4321b can be suppressed.

Further, as shown in FIGS. 6B and 6C, the scanning line drive circuits 4321a and 4321b can be provided separately in a plurality of circuit units, and the plurality of circuit units can be provided apart from each other.
As a result, even when the first display panel 4311 is curved, the scanning line drive circuit 4
The stress applied to 321a and 4321b can be reduced, and damage to the scanning line drive circuits 4321a and 4321b can be suppressed. FIG. 6B shows the scanning line drive circuits 4321a and 4321b divided into two circuit sections, respectively, and FIG. 6C shows the scanning line drive circuits 4321a and 43.
Although the case where 21b is divided into four circuit portions and provided is shown, the number of divisions of the scanning line drive circuit is not limited to this.

Further, as shown in FIG. 6D, the first display panel 4311 may be provided at only one end (only one of the scanning line driving circuit 4321a and the scanning line driving circuit 4321b). This makes it possible to narrow the frame of the electronic book.

The structure shown in FIG. 6 can also be applied to the second display panel 4312.

This embodiment can be implemented in combination with the configurations described in other embodiments as appropriate.

(Embodiment 3)
In the present embodiment, with respect to the case where an electronic book having a plurality of flexible display panels is spread and curved for use, an example of the effects of the above-described embodiment is shown, and FIGS. 7 to 10 are shown. I will explain.

First, FIG. 7A shows a front plan view when the user uses the electronic book in a spread, and FIG. 7B shows a top plan view when the user uses the electronic book in a spread. explain.

The electronic books shown in FIG. 7A include a first display panel 4311 and a second display panel 4312.
It has a binding portion 4308. The first display panel 4311 has a first display unit 4301.
The first display unit 4301 is a scanning line drive circuit 4 that supplies a scanning signal to the first display unit 4301.
The display is controlled by the signal line drive circuit 4323a that supplies the image signal to the 321 and the first display unit 4301. Further, the second display panel 4312 is a second display unit 43.
The second display unit 4307 has 07, and the second display unit 4307 is a scanning line drive circuit 4322 that supplies a scanning signal to the second display unit 4307, and a signal line driving circuit 432 that supplies an image signal to the second display unit 4307.
The display is controlled by 3b. Further, in FIG. 7A, the user's hand 435
The state of grasping the ends of the first display panel 4311 and the second display panel 4312 by 0a and 4350b is also illustrated. Further, in the front plan view shown in FIG. 7 (A),
The line of sight when looking at the top plan view shown in FIG. 7B is also added.

The top plan view shown in FIG. 7B shows the first display panel 4311 and the second display panel 4312.
, The binding portion 4308 is shown. As shown in FIG. 7B, the user has hands 4350a, 43.
When the electronic book is used with the spread spread at 50b, the flexible display panel has a bent portion (hereinafter referred to as a bent portion C) in the range of the arrow shown in C in the figure, and an arrow shown in D in the figure. A non-bent portion (hereinafter referred to as a non-bent portion D) is formed in the range of.

In FIG. 7B, as an example, the first display panel 4311 and the second display panel 431
Regarding the bent portion C and the non-folded portion D of 2, the side close to the binding portion 4308 is referred to as the bent portion C, and the side away from the bound portion 4308 is referred to as the non-folded portion D. The positions of the bent portion C and the non-folded portion D differ depending on the configuration of the binding portion 4308 and the material of the substrate constituting the display panel. Therefore, regarding the bent portion C and the non-folded portion D of the first display panel 4311 and the second display panel 4312, the side away from the binding portion 4308 becomes the bent portion C, and the side close to the binding portion 4308 is non-folded. It may be the song part D.

Since the electronic book has a configuration in which the display panel is fixed by the binding portion 4308, the first display panel 4311 and the first display panel 4311 and the first display panel 4311 are in the direction perpendicular to the extending direction of the binding portion 4308 (middle arrow 7002 in FIG. 7B). A bent portion C and a non-folded portion D are formed on the display panel 4312 of 2. Therefore, the signal line drive circuit 4323a and the signal line drive circuit 4323b have a binding portion 430.
According to 8, damage caused by bending of the display panel can be prevented. Scanning line drive circuit 432
1. By providing the scanning line drive circuit 4322 at the vertical end of the display panel, it is possible to manufacture the circuit in the same process as the display unit, so that the cost can be reduced and the binding unit 43 can be manufactured.
As compared with the case where it is provided in 08, it is possible to reduce the wiring routing to the display unit. A plurality of bent portions C and non-folded portions D may be formed, or may be formed alternately. Further, a stress concentration region may be provided on the display panel to artificially form the bent portion C and the non-bent portion D.

Next, FIGS. 8A to 8C show a front plan view when the electronic book is used with the spread spread, as in FIG. 7A, with respect to the bent portion C and the non-folded portion D. Scan line drive circuit 4321
, The arrangement of the scanning line drive circuit 4322 will be described.

In FIG. 8A, the side close to the binding portion 4308 is referred to as a bent portion C, and the side away from the bound portion 4308 is referred to as a non-bent portion D. Therefore, the scanning line driving circuit 4321 and the scanning line driving circuit 4322 are provided in the non-bent portion D on the side away from the binding portion 4308, respectively. The scanning signal is supplied to the pixel TFT 4352 in the display unit by the scanning line drive circuit 43.
21. The wiring extending from the scanning line drive circuit 4322 may be routed to each scanning line of the display unit. The control signals such as the clock signal for driving the scanning line driving circuit 4321 and the scanning line driving circuit 4322 are supplied through the wiring extending from the video signal generation circuit in the binding portion 4308. The wiring for making an electrical connection between the circuits is formed by fine processing such as a metal film, and the semiconductor film of the transistor constituting the scanning line drive circuit is formed of a semiconductor material such as a silicon film. Compared to semiconductor materials, metal films have excellent ductility and less damage due to bending. Therefore, by arranging the wiring connected to the scanning line drive circuit at the portion corresponding to the bent portion C and arranging the transistor constituting the scanning line drive circuit at the portion corresponding to the non-bent portion D, the transistor due to bending can be arranged. Damage to the semiconductor film can be reduced. As a result, by arranging the scanning line driving circuit 4321 and the scanning line driving circuit 4322 as shown in FIG. 8A, damage to the circuit is suppressed when the user uses the electronic book with the hands 4350a and 4350b in a spread. can do.

FIG. 8B shows a configuration in which the bent portion C and the non-bent portion D are alternately provided from the side close to the binding portion 4308 to the side away from the binding portion 4308. Therefore, the scanning line drive circuit 4321 and the scanning line drive circuit 4322 are arranged so that each drive circuit is divided into a plurality of parts in the non-bent portion D and is provided apart from each other. The scanning signal may be supplied to the pixel TFT 4352 in the display unit by routing the wiring extending from the first scanning line driving circuit 4321 and the second scanning line driving circuit 4322. The control signals such as the clock signal for driving the scanning line driving circuit 4321 and the scanning line driving circuit 4322 are supplied through the wiring extending from the video signal generation circuit in the binding portion 4308. Further, the signal propagating between the pulse signal generation circuits such as the flip-flops constituting the scanning line drive circuit is supplied through the wiring. The wiring for making an electrical connection between the circuits is formed by fine processing such as a metal film, and the semiconductor film of the transistor constituting the scanning line drive circuit is formed of a semiconductor material such as a silicon film. Compared to semiconductor materials, metal films have excellent ductility and less damage due to bending. Therefore, by arranging the wiring connected to the scanning line drive circuit at the portion corresponding to the bent portion C and arranging the transistor constituting the scanning line drive circuit at the portion corresponding to the non-bent portion D, the transistor due to bending can be arranged. Damage to the semiconductor film can be reduced. Further, in FIG. 8B, the drive circuits are divided into a plurality of parts and provided so as to be separated from each other, so that the stress applied to the scanning line drive circuit when curved can be dispersed. As a result, as shown in FIG. 8B, the scanning line drive circuit 432
1. By arranging the scanning line drive circuit 4322, it is possible to more effectively suppress the breakage of the circuit when the user uses the electronic book with the hands 4350a and 4350b in a spread.

In FIG. 8B, the scanning line driving circuit 4321 and the scanning line driving circuit 4322 are placed above and below the display unit, the scanning line driving circuit 4321a, the scanning line driving circuit 4321b, and the scanning line driving circuit 43.
22a may be arranged as a scanning line drive circuit 4322b to make it redundant, or may have a configuration in which the functions for outputting scanning signals are dispersed. 8 (C) is a diagram in which the configurations described in FIG. 8 (B) are arranged above and below the display panel. The scanning signal supplied to the pixel TFT 4352 is transmitted to the scanning line driving circuit 4321a and the scanning line driving circuit 4321b up and down, and the scanning line driving circuit 43.
By arranging the 22a and the scanning line drive circuit 4322b vertically and supplying them, it is possible to reduce the number of pulse signal generation circuits such as flip-flops constituting the scanning line drive circuit. When used with the spread spread, damage to the circuit can be suppressed.

In FIGS. 8B and 8C, by showing a specific example, the scanning line drive circuit is not arranged in the region to be the bent portion C, and the scanning line is driven to the region to be the non-bent portion D. Explains the advantages of arranging circuits. With this configuration, it is possible to disperse the stress applied to the scanning line drive circuit when it is curved, and it is possible to suppress damage to the circuit when the user spreads the electronic book with his / her hands 4350a and 4350b.

Next, as described in FIGS. 8B and 8C, when the drive circuit is divided into a plurality of parts and provided apart from each other, the bent portion C and the non-bent portion D in the display panel are artificially formed. An example of providing a stress concentration region for the purpose will be described with reference to FIGS. 9 and 10.

FIG. 9A shows the first display panel 4311, the binding unit 4308, the first display unit 4301, the scanning line drive circuit 4321, and the signal line drive circuit 4323a. The scanning line drive circuit 4321 is divided into two parts, and is provided so as to be separated from each other via the wiring 920. The stress concentration region 921 is preferably formed so as to overlap with the wiring 920. Figure 9
(B) shows an example of a cross-sectional view in the direction perpendicular to the binding portion 4308, and wiring 920.
In the stress concentration region 921 that overlaps with the above, the notch portion 922a may be provided on the sealing substrate 923, and the notch portion 922b may be provided on the element substrate 924. As shown in FIG. 9C, the notch portion 922a and the notch portion 922b are formed by attaching the reinforcing plate 925 on the scanning line drive circuit 4321 of the 923 to the element substrate 924 and the sealing substrate. May be. The cut portion 922a and the cut portion 922b may be provided parallel to the major axis direction of the binding portion 4308, or may be provided only in a part thereof.

The stress concentration region refers to a region where stress is concentrated, which is formed by deformation of a member due to cutting or the like, bending due to sticking of a member, or change in strength against elongation.

The division of the scanning line drive circuit means a state in which a region in which circuit elements such as TFTs and wiring are mixed to form a repetitive layout is divided by an region allocated for wiring routing.

Further, in FIG. 10 (A), as in FIG. 9 (A), the first display panel 4311 and the binding portion 430
8. The first display unit 4301, the scanning line drive circuit 4321, and the signal line drive circuit 4323a are shown. The scanning line drive circuit 4321 is divided into four, and is provided so as to be separated from each other via the wiring 920. The stress concentration region 921 is preferably formed so as to overlap with the plurality of wirings 920. FIG. 10B shows an example of a cross-sectional view in the direction perpendicular to the binding portion. In the stress concentration region 921 overlapping with the wiring 920, a plurality of cut portions 922a are provided in the sealing substrate 923, and the element substrate 924 is provided. A plurality of notches 922b may be provided in the. As shown in FIG. 10C, the scanning line drive circuit 4 of 923 is attached to the element substrate 924 and the sealing substrate.
By attaching the reinforcing plate 925 on the 321 to form a plurality of cut portions 922a and a plurality of cut portions 922 b, a plurality of cut portions 922a may be formed. The plurality of cut portions 922a and the plurality of cut portions 922b may be provided parallel to the major axis direction of the binding portion 4308, or may be provided only in a part thereof.

The number of divisions of the scanning line drive circuit shown in FIGS. 9 and 10 is an example for explanation, and may be appropriately divided into arbitrary numbers.

As described above, according to the configuration of the present embodiment, it is possible to more effectively suppress damage to the scanning line drive circuit when the user uses the electronic book in a spread. Further, according to the configuration of the present embodiment, it is possible to more effectively suppress damage to the scanning line drive circuit by providing a stress concentration region with a notch or the like in advance on the display panel.

This embodiment can be implemented in combination with the configurations described in other embodiments as appropriate.

(Embodiment 4)
In the present embodiment, in addition to the configuration of the electronic book having the plurality of display panels described in the first embodiment, the double-sided display type second is provided between the first display panel 4311 and the second display panel 4312. An example in which the panel of 3 is mounted will be described. FIG. 11A shows a state in which the electronic book is spread out, and FIG. 11B shows a state in which the electronic book is closed. Further, FIG. 12 is a cross-sectional view of the electronic book in the horizontal direction.

The electronic books shown in FIGS. 11A and 11B have a first display panel 4311 having a first display unit 4301 and a second display panel 43 having an operation unit 4304 and a second display unit 4307.
12, and a third display panel 43 having a third display unit 4302 and a fourth display unit 4310.
It has 13, a first display panel 4311, a second display panel 4312, and a binding portion 4308 provided at one end of the third display panel 4313. Third display panel 4
The 313 is inserted between the first display panel 4311 and the second display panel 4312. The electronic book of FIGS. 11A and 11B has four display screens of a first display unit 4301, a second display unit 4307, a third display unit 4302, and a fourth display unit 4310. There is.

First display panel 4311, second display panel 4312, and third display panel 4313
Is flexible and easy to bend. Further, if a plastic substrate is used for the first display panel 4311 and the second display panel 4312 and a thin film is used for the third display panel 4313, a thin electronic book can be obtained. That is, when a cross-sectional view of the electronic book in the horizontal direction is shown as an example in FIG. 12, the third display panel 4313 can be an electronic book that is more bendable than the first display panel 4311 and the second display panel 4312. .. Therefore, by making the display panel outside the third display panel 4313 hard, it can be handled like a book, and damage to the third display panel 4313 can be suppressed.

The third display panel 4313 is a double-sided display type panel having a third display unit 4302 and a fourth display unit 4310. As the third display panel 4313, a double-sided injection type display panel may be used, or a single-sided injection type display panel may be attached and used. Further, two liquid crystal display panels having a backlight (preferably a thin EL light emitting panel) sandwiched between them may be used.

Further, the electronic books shown in FIGS. 11A and 11B have a scanning line drive circuit (not shown) that controls the display of the first display unit 4301 and a scanning that controls the display of the second display unit 4307. Line drive circuit 4
322a, 4322b, a scanning line drive circuit (not shown) that controls the display of the third display unit 4302 and / or the fourth display unit 4310, the first display unit 4301, and the second display unit 43.
It has 07, a third display unit 4302, and / or a signal line drive circuit 4323 that controls the display of the fourth display unit 4310. The scanning line drive circuits 4321a and 4321b are the first.
The scanning line drive circuits 4322a and 4322b are provided on the display panel 4311 of the above, the scanning line drive circuits 4322a and 4322b are provided on the second display panel 4312, and the signal line drive circuit 4323 is provided inside the binding portion 4308.

Further, in the electronic books shown in FIGS. 11A and 11B, the second display panel 4312 has an operation unit 4304, and each function such as a power input switch and a display changeover switch can be associated with each other.

Further, the input operation of the electronic book shown in FIGS. 11A and 11B can be performed by touching the first display unit 4301 or the second display unit 4307 with a finger or an input pen, or by operating the operation unit 4304. It is said. In addition, in FIG. 11A, the display button 4309 displayed on the second display unit 4307
Is shown in the figure, and input can be performed by touching with a finger or the like.

Further, as an example of how to use the electronic book in which the third display panel 4313 shown in FIGS. 11 (A) and 11 (B) is inserted, a sentence is read by the first display unit 4301 and the fourth display unit 4310, and the second display unit 4301 is used. It is convenient to refer to the figure on the display unit 4307 and the third display unit 4302. At this time, the third
Since the display panel 4313 cannot display the third display unit 4302 and the fourth display unit 4310 at the same time, when the page is started to be turned, the display of the third display unit 4302 to the fourth display unit It shall be switched to the display of 4310.

Further, when the first display unit 4301 to the third display unit 4302 are read and the next page, the third display panel 4313, is started to be turned, the fourth display unit 4310 and the second display unit 4310 and the second display unit are at a certain angle. The 4307 displays the next page, and the fourth display unit 4310 and the second display unit 4
When 307 is finished and the third display panel 4313 is turned over, the third display unit 4302 and the first display unit 4301 display the next page at a certain angle. As a result, it is possible to make the screen switching invisible and suppress visual discomfort and the like.

Then the first display panel 4311, the second display panel 4312, and the third display panel 4
An example of a specific configuration of an electronic book having 313 is described in the same manner as in FIGS. 2A and 2B.
This will be described with reference to FIGS. 13 (A) and 13 (B). Note that FIG. 13 (A) shows a plan view of the electronic book in a closed state, and FIG. 13 (B) shows a cross section between AB of FIG. 13 (A).

In the electronic book shown in FIG. 13, the binding portion 4308 is formed of a hollow housing, and the signal line drive circuit 4323 is provided inside the housing. Here, the signal line drive circuit 4323 is I.
It is formed of C, and the IC is provided inside the binding portion 4308. The IC can be formed by using a semiconductor substrate such as silicon, an SOI substrate, or the like. Of course, a circuit other than the signal line drive circuit (for example, CPU, memory, etc.) can be provided in the IC.

Further, in FIG. 13, the IC provided inside the binding portion 4308 is TAB (Tape Au).
FPC (Flexible Print) using the synchronized Bonding method
The case where it is implemented in ed Circuit) is shown.

More specifically, an IC on which the signal line drive circuit 4323 for controlling the first display unit 4301 is formed is provided on the FPC 4324, and the signal line drive circuit 4323 for controlling the second display unit 4307 is also formed. The IC is provided on the FPC4324, and the IC on which the signal line drive circuit 4323 for controlling the third display unit 4302 and the fourth display unit 4310 is formed is the FPC4.
Provided on the 324, the signal line drive circuit 4323 is electrically connected via the printed circuit board 4325. The FPC 4324 has a first display panel 4311 and a second display panel 431.
2. It is electrically connected to the printed circuit board 4325.

Further, in FIG. 13, the printed circuit board 4325 can be provided so as to be adhered to the housing constituting the binding portion 4308.

As shown in FIG. 13, when the signal line drive circuit is provided on the FPC, stress concentration is concentrated on one or both of the first display panel 4311 and the second display panel 4312 as described in FIG. 2 (C) above. It is preferable to provide region 4326. By providing the stress concentration region 4326 on the display panel, the stress applied to the FPC 4324 when the electronic book is opened (when the first display panel 4311 and / or the second display panel 4312 is bent) is reduced, and the stress applied to the FPC 4324 is reduced.
It is possible to suppress the destruction of the signal line drive circuit 4323 provided above. The third display panel 4313 is formed of a thin film, has sufficient flexibility when the electronic book is spread and used, and can be handled like a book.

Next, the configuration of the electronic book different from that of FIG. 13 will be described with reference to FIG. FIG. 14 (A
) Shows a plan view of the electronic book in a closed state, and FIG. 14 (B) shows a cross section between AB of FIG. 14 (A).

In the electronic book shown in FIG. 14, the IC provided in the binding portion 4308 is used as a COG (Chip On).
The case of mounting on the first display panel 4311 and the second display panel 4312 by using the Glass) method is shown.

More specifically, an IC on which the signal line drive circuit 4323 for controlling the first display unit 4301 is formed is provided on the element substrate constituting the first display panel 4311, and similarly, the second display unit 4307 is provided. The IC on which the signal line drive circuit 4323 that controls the above is formed is the second display panel 431.
An IC provided on the element substrate constituting No. 2 and having a signal line drive circuit 4323 for controlling the third display unit 4302 and the fourth display unit 4310 is formed on the element substrate constituting the third display panel 4313. The signal line drive circuit 4323 is provided in the FPC 4324 and the printed circuit board 4.
It is electrically connected via 325.

Next, the configuration of the electronic book different from those in FIGS. 13 and 14 will be described with reference to FIG. FIG. 15 (A) shows a plan view of the electronic book in a closed state, and FIG. 15 (B) shows A of FIG. 15 (A).
The cross section between −B is shown.

The electronic book shown in FIG. 15 shows a case where an IC in which a circuit such as a signal line drive circuit is formed is provided on a printed circuit board, and the printed circuit board and a display panel are connected by using an FPC.

More specifically, an IC on which the signal line drive circuit 4323 for controlling the first display unit 4301 is formed is provided on the printed circuit board 4325, and the signal line drive circuit 4323 for controlling the second display unit 4307 is also provided. The IC on which the is formed is provided on the printed circuit board, and the third display unit 430 is provided.
The IC on which the signal line drive circuit 4323 that controls the second and fourth display units 4310 is formed is the third IC.
The signal line drive circuit 4323 is provided on the element substrate constituting the display panel 4313 of FP.
It is electrically connected via C4324. Each FPC4324 has a printed circuit board 4
It is electrically connected to 325.

In FIG. 15, since the display panel can be bent by the FPC 4324, the configuration can be such that the bent portion is not provided.

Next, the configuration and function of an electronic book in which a double-sided display type third panel is mounted between the first display panel 4311 and the second display panel 4312 will be described with reference to a block diagram and the like. The electronic book in the present embodiment is particularly suitable as a display element used for a display panel in the case of a self-luminous light emitting element, a liquid crystal element for controlling light transmission such as a backlight, or the like. It should be added that the electronic book can be applied to other display elements such as an electrophoresis element as the display element.

FIG. 16 shows a block diagram of an electronic book described in this embodiment. The electronic books shown in FIG. 16 include a first display panel 701, a second display panel 702, and a third display panel 703.
It has a fourth display panel 704 and a display control unit 705. The first display panel 701 has a scanning line drive circuit 706A and a first display unit 707A. The second display panel 702 includes a scanning line drive circuit 706B and a second display unit 707B. The third display panel 703 includes a scanning line drive circuit 706C and a third display unit 707C. The fourth display panel 704 includes a scanning line drive circuit 706D and a fourth display unit 707D.

As described in the above embodiment, the first display panel 701 to the fourth display panel 704 each have flexibility, and the display control unit including the signal line drive circuit described in the above embodiment. The 705 is fixed by a binding portion provided internally.

The third display panel 703 and the fourth display panel 704 have a third display unit 707C and a fourth display unit 707D by using a double-sided injection type display panel. The display panel 703 can be used, and the thickness and cost of the electronic book can be reduced.

The first display unit 707A to the fourth display unit 707D each have a plurality of pixels 708, and each of the plurality of pixels 708 has a pixel circuit 710 for controlling a display element.
The pixel circuit 710 includes a thin film transistor and the like, and if they are formed collectively, the cost can be reduced. Further, the first display unit 707A has an optical sensor 709A, the second display unit 707B has an optical sensor 709B, and the third display unit 707C has an optical sensor 709C.
The fourth display unit 707D has an optical sensor 709D.

The scanning line driving circuit 706A to the scanning line driving circuit 706D supply a scanning signal to the pixel circuit 710 in the pixel 708.

As described in the above-described embodiment, the optical sensors 709A to 709D are in a state of visually recognizing the first display panel 701 and the third display panel 703, or the second display panel 702.
It also has a function of detecting a state in which the fourth display panel 704 is visually recognized. Therefore, it is also possible to realize the function described in the present embodiment by an inclination detecting unit or another opening / closing detecting means on the display panel or the like.

The optical sensor 709C and / or the optical sensor 709D is the optical sensor 709A and / or.
Alternatively, it can be omitted by increasing the accuracy of the illuminance of the optical sensor 709B. By arranging a light-shielding portion instead of the optical sensor 709C and / or the optical sensor 709D, the accuracy of the illuminance of the optical sensor 709A and / or the optical sensor 709B can be improved, and a translucent substrate can be used. Even when it is used, it can be detected by an optical sensor, which is preferable.

The optical sensors 709A to 709D may be formed as a photosensor using a photodiode, a phototransistor, or the like on the substrate on which the thin film transistor of the pixel circuit 710 is formed. By forming the optical sensors 709A to 709D together with the thin film transistor, the cost of the electronic book can be reduced.

The display control unit 705 located in the binding unit 4308 includes a light intensity comparison circuit 711 and a CPU 712.
, Internal memory 713, video signal generation circuit 714, power supply circuit 715, signal transmitter / receiver 71
6. Power supply unit 717, operation unit 718, signal line drive circuit 714A to signal line drive circuit 714D
Each configuration is connected via an interface or the like. Signal transmitter / receiver 716
May be configured to include an antenna unit 719 for transmitting and receiving data to and from an external device.

The light intensity comparison circuit 711 detects signals from the light sensors 709A to 709D and detects the signals.
It is a circuit that compares the signal intensities according to the illuminance. The light intensity comparison circuit 711 encodes a signal corresponding to the intensity of each obtained optical sensor. Then, the optical sensor 709A and / or the optical sensor 709C included in the first display panel 701 and / or the third display panel 703, and the second display panel 701 and / or the optical sensor 709C.
The signals according to the illuminance are compared with the optical sensor 709B and / or the optical sensor 709D included in the display panel 702 and / or the fourth display panel 704. The signal of the comparison result is C
It is sent to the PU 712, and the CPU 712 performs processing according to the signal. In addition, C
The PU 712 also performs processing according to the operation of the operation unit 718.

The signal transmission / reception unit 716 has a function of transferring the data received by the antenna unit 719 or the data stored in the recording medium to the internal memory 713. Data is stored in the internal memory 713 via an interface or the like. Internal memory 713 from the signal transmitter / receiver 716
As the data to be transferred to, in addition to the video signal to be displayed on the display panel, information such as a user ID may be stored.

The internal memory 713 is a program for the CPU 712 to process a signal output to the video signal generation circuit 714 and / or the power supply circuit 715 based on the signals from the light intensity comparison circuit 711, the power supply unit 717, the operation unit 718, and the like. It also has a storage unit that stores data transferred from the signal transmission / reception unit 716. As an example, the internal memory 713 is a ROM (Read).
It is composed of Only Memory) and RAM (Random Access Memory).

The power supply unit 717 has a function of supplying electric power wirelessly or by wire, or supplying electric power by a storage means such as a battery or a capacitor. Further, the operation unit 718 has a means for encoding the operation by the user based on the touch panel, the operation buttons capable of operating the movable unit, and the like, and transferring the operation to the CPU 712.

The video signal generation circuit 714 starts, a clock signal for driving the scanning line drive circuit in order to display or hide the first display panel 701 to the fourth display panel 704 according to the control of the CPU 712. Each scan line drive circuit 706A to scan line drive circuit 706 for pulses, etc.
A circuit for supplying a clock signal, a start pulse, a video signal, etc. for driving a signal line drive circuit provided in the binding portion to D, to each signal line drive circuit 714A to signal line drive circuit 714D. is there.

The signal line drive circuit 714A to the signal line drive circuit 714D supplies an image signal to the pixel circuit 710 of the pixel 708 via the signal line.

The power supply circuit 715 is the first display panel 701 to the fourth according to the control of the CPU 712.
This is a circuit for controlling the power supply to the display element in order to display or hide the display panel 704. In FIG. 16, for the sake of explanation, the first display unit 707A is provided in the power supply circuit 715.
Power supply circuit 715A that supplies power to the second display unit 707B, power supply circuit 715B that supplies power to the second display unit 707B, power supply circuit 715C that supplies power to the third display unit 707C, and power supply to the fourth display unit 707D. The power supply circuit 715D, which supplies power, is shown.

The operation of the electronic book shown in FIG. 16 will be described with an example. First, the illuminance of the display surface of each display panel obtained by the optical sensors 709A to 709D is compared by the light intensity comparison circuit 711. The CPU 712 determines which display panel the user is viewing based on the result of comparison by the light intensity comparison circuit 711 or the signal from the operation unit 718. For example, the illuminance of the optical sensor 709A and / or the optical sensor 709C is compared with the illuminance of the optical sensor 709B and / or the optical sensor 709D, and the illuminance of the optical sensor 709A and / or the optical sensor 709C is the optical sensor 709B and / or the light. If it is greater than the illuminance of sensor 709D, the user is the first
It is determined that the display unit 707A and / or the third display unit 707C of the above is visually recognized. CPU
The video signal generation circuit 7 is determined by determining which display panel the user is viewing on the 712.
The video signal and control signal that 14 supplies to the first display panel 701 to the fourth display panel 704, and / or the power supply that the power supply circuit 715 supplies to the first display panel 701 to the fourth display panel 704. To control. Specifically, by stopping the power supply to the second display panel 702 and the fourth display panel 704 including the second display unit 707B and the fourth display unit 707D that are not visually recognized by the user, the power supply is stopped. It is possible to reduce power consumption and extend the life of the display panel.

In the electronic book shown in FIG. 16, the page viewed by the user is determined by an optical sensor and a light intensity comparison circuit to selectively switch the image signal supply to the display panel, power supply, and the like. Can be done. Therefore, it is possible to provide an electronic book that realizes low power consumption and long life of the display panel.

This embodiment can be implemented in combination with the configurations described in other embodiments as appropriate.

(Embodiment 5)
In this embodiment, an example of a display panel provided on an electronic book is shown. As the display panel, a display panel having various display elements can be applied, and it may be a passive matrix type or an active matrix type.

As the display panel, an electronic paper, a light emitting display panel (EL (electroluminescence) panel), a liquid crystal display panel, or the like can be used. The display panel is a panel in which the display element is sealed, and is a connector, for example, an FPC (Flexible pri).
nted cycle) or TAB (Tape Automated Bond)
ing) Tape or TCP (Tape Carrier Package) is attached and electrically connected to an external circuit including a signal line drive circuit. An IC, which is a signal line drive circuit, may be directly mounted on a display panel by a COG (Chip On Glass) method.

As the display panel, a double-sided display type that displays on both sides or a single-sided display panel that displays on only one side may be used.

In the fourth embodiment, the third display panel 4313 is a double-sided display panel having a third display unit 4302 and a fourth display unit 4310. As the third display panel 4313, a double-sided injection type display panel may be used, or a single-sided injection type display panel may be attached and used. Further, two liquid crystal display panels with a backlight (preferably a thin EL panel) sandwiched between them may be used.

An example of a double-sided display panel is shown in FIGS. 17A to 17C using a third display panel 4313. In FIGS. 17A to 17C, the arrows indicate the light emission directions.

FIG. 17A shows a third display panel 4313 in which the display element 102 is sandwiched between the substrate 100 and the substrate 101, the third display unit 4302 on the substrate 100 side, and the fourth display unit 4 on the substrate 101 side.
310 is provided. Since the display element 102 displays the third display unit 4302 and the fourth display unit 4310, the substrate 100 and the substrate 101 are translucent. As the display element 102, it is preferable to use an EL element which is a self-luminous light emitting element. When the light incident on the third display panel 4313 is used, a liquid crystal display element or an electrophoresis display element can be used as the display element 102.

FIG. 17B shows a third layer in which a single-sided display panel including a display element 114 sandwiched between a substrate 110 and a substrate 112 and a single-sided display panel including a display element 115 sandwiched between the substrate 111 and the substrate 113 are laminated. Display panel 4313, the third display unit 4302, on the substrate 110 side,
A fourth display unit 4310 is provided on the substrate 111 side. Since the display element 114 displays the third display unit 4302 and the display element 115 displays the fourth display unit 4310, the substrate 110 and the substrate 111 are translucent. On the other hand, the substrate 112 and the substrate 113 do not have to have translucency, and may have reflectivity. The single-sided display panels may be bonded to each other by adhering the substrate 112 and the substrate 113 with an adhesive layer. In addition, the substrate 11
Only one of 2 and the substrate 113 may be used.

As the display element 114 and the display element 115, it is preferable to use an EL element. When the light incident on the third display panel 4313 is used, a liquid crystal display element or an electrophoresis display element can be used as the display element 114 and the display element 115. In order to improve the light extraction efficiency, it is preferable to use a reflective display panel as the single-sided display panel.

A backlight may be provided between the translucent liquid crystal display panels to form a third display panel 4313. FIG. 17C shows a translucent liquid crystal display panel including the display element 124 sandwiched between the substrate 120 and the substrate 122, and a translucent liquid crystal display panel including the display element 125 sandwiched between the substrate 121 and the substrate 123. Is a third display panel 4313 laminated via a backlight 126 as a light source, and a third display unit 4302 is provided on the substrate 120 side and a fourth display unit 4310 is provided on the substrate 121 side. The light of the backlight 126 and the display element 124 display the third display unit 4302, and the light of the backlight 126 and the display element 125 display the fourth display unit 4310. Therefore, the substrate 120, the substrate 121, the substrate 122, and the substrate 122 The substrate 123 is translucent.

The single-sided display panel and the backlight may be adhered and bonded by an adhesive layer. Further, only one of the substrate 122 and the substrate 123 may be used. As the backlight 126, it is preferable to use a thin EL panel because the third display panel 4313 can be made thinner.

In the case of a single-sided display type panel, it is preferable to provide a non-transmissive or reflective housing on the surface on which the display unit is not provided because the strength of the display panel can be improved.

One form of the display panel will be described with reference to FIGS. 18 to 20. 18 to 20 correspond to the cross-sectional views taken along the line MN of FIG. 4 (A). 18 to 20 and 22 are examples in which the FPC 4324 is attached to the first display unit 4301 having a pixel circuit and the first display panel 4311 having the scanning line drive circuit 4322a, and are mounted on the element substrate 4331a. The first display unit 4301 and the scanning line drive circuit 4322a provided are sealed by the sealing material 4005 on the sealing substrate 4332a.

As shown in FIGS. 18 to 20 and 22, the first display panel 4311 has a connection terminal electrode 4015 and a terminal electrode 4016, and the connection terminal electrode 4015 and the terminal electrode 401
Reference numeral 6 is electrically connected to the terminal of the FPC4324 via the anisotropic conductive film 4019.

The connection terminal electrode 4015 is formed of the same conductive film as the first electrode layer 4030, and the terminal electrode 4
016 is formed of the same conductive film as the source electrode layer and drain electrode layer of the thin film transistors 4010 and 4011.

Further, as shown in FIG. 4, the signal line drive circuit 4323a formed of the single crystal semiconductor film or the polycrystalline semiconductor film on the separately prepared substrate is mounted by the FPC and provided in the binding portion 4308. .. Various signals and potentials given to the signal line drive circuit 4323a, the scanning line drive circuit 4322a, and the first display unit 4301 are supplied from the FPC 4324.

The connection method of the signal line drive circuit 4323a is not particularly limited, and a COG method, a wire bonding method, a TAB method, or the like can be used.

Further, the first display unit 4301 provided on the element substrate 4331a and the scanning line drive circuit 432
1a has a plurality of thin film transistors, and in FIGS. 18 to 20, the first display unit 430
The thin film transistor 4010 included in 1 and the thin film transistor 4011 included in the scanning line drive circuit 4321a are illustrated. Insulating layers 4020 and 4021 are provided on the thin film transistors 4010 and 4011. The insulating film 4023 is an insulating film that functions as a base film.

The thin film transistors 4010 and 4011 are not particularly limited, and various thin film transistors can be applied. In FIGS. 18 to 20, the thin film transistors 4010 and 4011 are designated as thin film transistors 4010 and 4011.
An example of using an inverted staggered thin film transistor having a bottom gate structure is shown. Thin film transistor 40
Although 10 and 4011 show a channel etch type, a channel protection type reverse staggered thin film transistor having a channel protection film provided on the semiconductor layer may be used.

The thin film transistor 4010 provided in the first display unit 4301 is electrically connected to the display element to form a display panel. The display element is not particularly limited as long as it can display, and various display elements can be used.

Electronic paper can be used as the display panel. In electronic paper, there are many methods in various combinations such as the use of electric field, magnetic field, light, or heat as the image writing means, the use of shape and position changes for changes in the display medium, and the use of physical changes. For example, a twist ball method, an electrophoresis method, a powder method (also called a toner display), a liquid crystal method, and the like can be mentioned.

18 and 22 show an example in which an active matrix type electronic paper is used as the first display panel 4311. Electronic paper has the advantages of being as easy to read as paper, having lower power consumption than other display panels, and being able to have a thin and light shape.

18 (A) and 22 (B) show an active matrix type electronic paper as an example of a display panel.

The electronic paper of FIG. 18A is an example of a display device using the twist ball display method.
The twist ball display method is to control the orientation of spherical particles by arranging spherical particles painted in black and white between the electrode layers used for the display element and creating a potential difference between the electrode layers.
This is a method of displaying.

A black region 4615a and a white region 4615b are provided between the first electrode layer 4030 connected to the thin film transistor 4010 and the second electrode layer 4031 provided on the sealing substrate 4332a, and the periphery is filled with a liquid. Spherical particles 4613 including the cavity 4612 are provided, and the periphery of the spherical particles 4613 is filled with a filler 4614 such as a resin. The second electrode layer 4031 corresponds to a common electrode (counter electrode). The second electrode layer 4031 is electrically connected to the common potential line.

It is also possible to use an electrophoretic element instead of the twist ball. An example of using an electrophoresis element as a display element is shown in FIG. 18 (B). A microcapsule 4713 having a diameter of about 10 μm to 200 μm, which encloses a transparent liquid 4712, negatively charged black fine particles 4715a as first particles, and positively charged white fine particles 4715b as second particles, is used.

Microcapsules 47 provided between the first electrode layer 4030 and the second electrode layer 4031
13 is when an electric field is applied by the first electrode layer 4030 and the second electrode layer 4031.
The white fine particles 4715b and the black fine particles 4715a move in opposite directions, and white or black can be displayed. A display element to which this principle is applied is an electrophoresis display element. Since the electrophoresis display element has high reflectance, an auxiliary light is unnecessary, power consumption is low, and the display unit can be recognized even in a dim place. In addition, even when power is not supplied to the display unit, the image once displayed can be retained, so the displayed image can be saved even when the display panel is moved away from the radio wave transmission source. It becomes possible to keep it.

The first particle and the second particle contain a dye and do not move in the absence of an electric field. Further, the colors of the first particle and the second particle are different (including colorless).

The microcapsules dispersed in a solvent are called electronic inks, and the electronic inks can be printed on the surface of glass, plastic, cloth, paper, or the like. In addition, color display is also possible by using a color filter or particles having a dye.

The first particles and the second particles in the microcapsules are a conductor material, an insulator material, and the like.
A semiconductor material, a magnetic material, a liquid crystal material, a ferroelectric material, an electroluminescent material, an electrochromic material, a kind of material selected from a magnetic migration material, or a composite material thereof may be used.

It is also possible to use an electronic powder fluid (registered trademark) as the powder system method. FIG. 22 shows an example in which an electron powder fluid is used as the display element. First electrode layer 4030, second electrode layer 403
In the space 4812 separated by 1 and the rib 4814, a positively charged black powder or granular material 4815a
And the negatively charged white powder or granular material 4815b are filled. The space 4812 is air.

When an electric field is applied by the first electrode layer 4030 and the second electrode layer 4031, the black powder particles 4815a and the white powder particles 4815b move in opposite directions, and white or black can be displayed. .. Color powders such as red, yellow, and blue may be used as the powder or granular material.

Further, as the display element, a light emitting element (EL element) utilizing electroluminescence may be used. A light emitting element that utilizes electroluminescence is distinguished by whether the light emitting material is an organic compound or an inorganic compound, and the former is generally called an organic EL element and the latter is called an inorganic EL element.

In the organic EL element, by applying a voltage to the light emitting element, electrons and holes are injected into the layer containing the luminescent organic compound from the pair of electrodes, respectively, and a current flows. Then, when those carriers (electrons and holes) are recombined, the luminescent organic compound forms an excited state, and when the excited state returns to the ground state, it emits light. From such a mechanism, such a light emitting element is called a current excitation type light emitting element.

The inorganic EL element is classified into a dispersed inorganic EL element and a thin film type inorganic EL element according to the element configuration. The dispersed inorganic EL element has a light emitting layer in which particles of a light emitting material are dispersed in a binder, and the light emitting mechanism is donor-acceptor recombination type light emission utilizing a donor level and an acceptor level. In the thin film type inorganic EL element, the light emitting layer is sandwiched between the dielectric layers, and the light emitting layer is sandwiched between the dielectric layers.
Furthermore, it has a structure in which it is sandwiched between electrodes, and the light emission mechanism is localized light emission that utilizes the inner-shell electron transition of metal ions. Here, an organic EL element will be used as the light emitting element.

The light emitting element may have at least one of a pair of electrodes transparent in order to extract light. Then, a thin film transistor and a light emitting element are formed on the substrate, and top surface injection that extracts light emission from the surface opposite to the substrate, bottom surface injection that extracts light emission from the surface on the substrate side, and a surface on the substrate side and the surface opposite to the substrate. There is a light emitting element having a double-sided injection structure that extracts light from the light emitting device, and any light emitting element having an injection structure can be applied.

FIG. 19 shows an example in which a light emitting display panel (EL panel) is used as the first display panel 4311. The light emitting element 4513, which is a display element, is electrically connected to the thin film transistor 4010 provided in the display unit 4301. The configuration of the light emitting element 4513 is the first electrode layer 403.
0, The electroluminescent layer 4511 and the second electrode layer 4031 have a laminated structure, but the configuration is not limited to the one shown. The configuration of the light emitting element 4513 can be appropriately changed according to the direction of the light extracted from the light emitting element 4513 and the like.

The partition wall 4510 is formed by using an organic resin film, an inorganic insulating film, or an organic polysiloxane.
In particular, it is preferable to use a photosensitive material to form an opening on the first electrode layer 4030 so that the side wall of the opening becomes an inclined surface formed with a continuous curvature.

The electroluminescent layer 4511 may be composed of a single layer or may be configured such that a plurality of layers are laminated.

A protective film may be formed on the second electrode layer 4031 and the partition wall 4510 so that oxygen, hydrogen, water, carbon dioxide, etc. do not enter the light emitting element 4513. As a protective film, a silicon nitride film,
A silicon nitride film, a DLC film, or the like can be formed. Further, a filler 4514 is provided and sealed in the space sealed by the element substrate 4331a, the sealing substrate 4332a, and the sealing material 4005. As described above, it is preferable to package (enclose) with a protective film (bonded film, ultraviolet curable resin film, etc.) or a covering material having high airtightness and little degassing so as not to be exposed to the outside air.

As the filler 4514, in addition to an inert gas such as nitrogen or argon, an ultraviolet curable resin or a thermosetting resin can be used, and PVC (polyvinyl chloride), acrylic, polyimide, epoxy resin, silicone resin, PVB (polyvinyl) can be used. Butyral) or EVA (ethylene vinyl acetate) can be used. For example, nitrogen may be used as the filler.

If necessary, a polarizing plate or a circular polarizing plate (including an elliptical polarizing plate) is provided on the ejection surface of the light emitting element.
An optical film such as a retardation plate (λ / 4 plate, λ / 2 plate) or a color filter may be appropriately provided. Further, an antireflection film may be provided on the polarizing plate or the circular polarizing plate. For example, it is possible to apply an anti-glare treatment that can diffuse the reflected light due to the unevenness of the surface and reduce the reflection.

FIG. 20 shows an example in which a liquid crystal display panel is used as the first display panel 4311. In FIG. 20, the liquid crystal element 4013, which is a display element, has a first electrode layer 4030 and a second electrode layer 403.
1 and the liquid crystal layer 4008 are included. Insulating films 4032 and 4033 that function as alignment films are provided so as to sandwich the liquid crystal layer 4008. The second electrode layer 4031 is a sealing substrate 4
The first electrode layer 4030 and the second electrode layer 4031 are provided on the 332a side, and the liquid crystal layer 400 is provided.
It is configured to be laminated via 8.

Further, 4035 is a columnar spacer obtained by selectively etching the insulating film.
It is provided to control the film thickness (cell gap) of the liquid crystal layer 4008. A spherical spacer may be used.

Further, although not shown in the liquid crystal display device of FIG. 20, an optical member (optical substrate) such as a color filter (colored layer), a black matrix (light-shielding layer), a polarizing member, a retardation member, and an antireflection member.
Etc. will be provided as appropriate. For example, circularly polarized light using a polarizing substrate and a retardation substrate may be used. Further, a backlight, a side light or the like may be used as the light source. E as a backlight
It is preferable to use an L panel because it can be made thinner.

Further, a liquid crystal showing a blue phase without using an alignment film may be used. The blue phase is one of the liquid crystal phases, and is a phase that appears immediately before the transition from the cholesteric phase to the isotropic phase when the temperature of the cholesteric liquid crystal is raised. Since the blue phase is expressed only in a narrow temperature range, a liquid crystal composition mixed with 5% by weight or more of a chiral agent is used for the liquid crystal layer 4008 in order to improve the temperature range. A liquid crystal composition containing a liquid crystal exhibiting a blue phase and a chiral agent has a response speed of 10 μs or more.
Since it is as short as 100 μs and is optically isotropic, no orientation treatment is required and the viewing angle dependence is small.

Although FIG. 20 shows an example of a transmissive liquid crystal display panel, it can be applied to both a reflective liquid crystal display panel and a semi-transmissive liquid crystal display panel.

In addition, in FIGS. 18 to 20, and FIG. 22, the element substrate 4331a and the sealing substrate 4332 are shown.
As a, a translucent plastic or the like can be used. As plastic, FRP (Fiberglass-Reinforced Plastics) plate,
PVF (polyvinyl fluoride) film, polyester film, polyester film or acrylic resin film can be used. Also, P the aluminum foil
A sheet having a structure sandwiched between VF films and polyester films can also be used.

The insulating layer 4020 functions as a protective film for the thin film transistor.

The protective film is for preventing the invasion of pollutant impurities such as organic substances, metal substances, and water vapor suspended in the atmosphere, and a dense film is preferable. The protective film is a single layer of a silicon oxide film, a silicon nitride film, a silicon nitride film, a silicon nitride film, an aluminum oxide film, an aluminum nitride film, an aluminum nitride film, or an aluminum nitride film, using a sputtering method. Alternatively, it may be formed by laminating.

Further, as the insulating layer 4021 that functions as a flattening insulating film, an organic material having heat resistance such as polyimide, acrylic, benzocyclobutene, polyamide, and epoxy can be used. In addition to the above organic materials, low dielectric constant materials (low-k materials), siloxane-based resins, and PS
G (phosphorus glass), BPSG (phosphorus glass) and the like can be used. An insulating layer may be formed by laminating a plurality of insulating films formed of these materials.

The method for forming the insulating layer 4020 and the insulating layer 4021 is not particularly limited, and depending on the material, a sputtering method, an SOG method, a spin coating, a dip, a spray coating, and a droplet ejection method (inkjet method, screen printing, offset printing). Etc.), doctor knife, roll coater, curtain coater, knife coater, etc. can be used. When the insulating layer is formed by using the material liquid, the semiconductor layer may be annealed (200 ° C. to 400 ° C.) at the same time in the baking step. By combining the firing process of the insulating layer and the annealing of the semiconductor layer, it is possible to efficiently manufacture the display panel.

The display panel transmits light from a light source or a display element to perform display. Therefore, all thin films such as the substrate, other insulating film, and conductive film provided on the display unit through which light is transmitted are made translucent with respect to light in the wavelength region of visible light.

In the first electrode layer 4030 and the second electrode layer 4031 (also referred to as a pixel electrode layer, a common electrode layer, a counter electrode layer, etc.) that apply a voltage to the display element, the direction of the light to be taken out and the place where the electrode layer is provided. , And the translucency and the reflectivity may be selected according to the pattern structure of the electrode layer.

The first electrode layer 4030 and the second electrode layer 4031 are an indium oxide containing tungsten oxide, an indium zinc oxide containing tungsten oxide, an indium oxide containing titanium oxide, an indium tin oxide containing titanium oxide, and indium. Tin oxide (hereinafter referred to as ITO).
), Indium zinc oxide, indium tin oxide to which silicon oxide is added, and other conductive materials having translucency can be used.

Further, the first electrode layer 4030 and the second electrode layer 4031 are tungsten (W), molybdenum (Mo), zirconium (Zr), hafnium (Hf), vanadium (V), niobium (N).
b), Tantalum (Ta), Chromium (Cr), Cobalt (Co), Nickel (Ni), Titanium (Ti), Platinum (Pt), Aluminum (Al), Copper (Cu), Silver (Ag) and other metals ,
Or it can be formed from the alloy thereof or the metal nitride thereof using one or more kinds.

Further, the first electrode layer 4030 and the second electrode layer 4031 can be formed by using a conductive composition containing a conductive polymer (also referred to as a conductive polymer). As the conductive polymer, a so-called π-electron conjugated conductive polymer can be used. For example, polyaniline or a derivative thereof, polypyrrole or a derivative thereof, polythiophene or a derivative thereof, or a copolymer of two or more kinds thereof can be mentioned.

Further, since the thin film transistor is easily destroyed by static electricity or the like, it is preferable to provide a protection circuit for protecting the drive circuit. The protection circuit is preferably configured by using a non-linear element.

This embodiment can be implemented in combination with the configurations described in other embodiments as appropriate.

(Embodiment 6)
In the present embodiment, examples of materials and element structures constituting the electronic book will be described in detail.

Since the signal line drive circuit is provided at the binding portion, it does not need to be particularly flexible. Therefore,
As the signal line drive circuit, it is preferable to use a semiconductor integrated circuit chip (IC) using a semiconductor substrate (semiconductor wafer) capable of high-speed operation. A single crystal semiconductor substrate and a polycrystalline semiconductor substrate can be used as the semiconductor substrate, and semiconductor wafers such as silicon wafers and germanium wafers and compound semiconductor wafers such as gallium arsenic and indium phosphorus are applied.

Further, a substrate having an SOI structure in which a single crystal semiconductor layer is provided on an insulating surface in a signal line drive circuit (
SOI substrate) may be used. The SOI substrate is SIMOX (Separation by).
It can be formed by using the IMplated Oxygen) method or the Smart-Cut method. In the SIMOX method, oxygen ions are injected into a single crystal silicon substrate to form an oxygen-containing layer at a predetermined depth, and then heat treatment is performed to form an embedded insulating layer at a constant depth from the surface to form an embedded insulating layer. This is a method of forming a single crystal silicon layer on the layer. Further, in the Smart-Cut method, hydrogen ions are injected into an oxidized single crystal silicon substrate to form a hydrogen-containing layer at a position corresponding to a desired depth, and another semiconductor substrate (oxidation for bonding to the surface) is formed. The single crystal silicon substrate is divided by the hydrogen-containing layer by bonding with a single crystal silicon substrate having a silicon film (such as a single crystal silicon substrate) and heat-treating, and a laminate of the silicon oxide film and the single crystal silicon layer is formed on the semiconductor substrate. How to do it.

As semiconductor elements provided in the circuit section of electronic books, not only field effect transistors but also memory (memory) elements using a semiconductor layer can be applied, and semiconductor integrated circuits that satisfy the functions required for various purposes can be applied. Can be provided.

The method is not particularly limited as long as the scanning line drive circuit and the display unit are provided on the flexible substrate of the display panel. The scanning line drive circuit and the display unit may be formed directly on the flexible substrate, or may be formed on another fabrication substrate, and then only the element layer is transferred from the fabrication substrate to the flexible substrate by a peeling method. May be provided. For example, the scanning line drive circuit and the display unit can be formed on the manufacturing substrate in the same process, and the scanning line drive circuit and the display unit can be transposed and provided on the flexible substrate of the display panel. In this case, since the scanning line drive circuit and the display unit are formed in the same process, it is preferable to use transistors having the same structure and material because the cost can be reduced. Therefore, the channel layer of the transistor constituting the scanning line drive circuit and the display unit is provided with the same material.

Further, it may be transferred from the manufactured substrate to the flexible support substrate, and the flexible support substrate may be adhered to the substrate of the display panel. For example, a plurality of scanning line drive circuits are formed on a fabrication substrate, transferred to a flexible support substrate, and then divided into individual scan line drive circuits together with the flexible support substrate, which is necessary for one display panel. A scanning line drive circuit provided on a flexible support substrate may be bonded and provided. In this case, since the scanning line drive circuit and the display unit are manufactured in separate processes, transistors having various configurations and materials can be selected.

Further, the above-mentioned transfer method and the direct formation method may be combined. For example, using a printing method, etc.
Wiring that electrically connects the display unit, the scanning line drive circuit unit, the FPC, and the like may be formed directly on the flexible substrate of the display panel.

As the manufacturing substrate, the manufacturing substrate may be appropriately selected according to the manufacturing process of the element layer. For example, as the fabrication substrate, a glass substrate, a quartz substrate, a sapphire substrate, a ceramic substrate, a metal substrate having an insulating layer formed on the surface, or the like can be used. Further, a plastic substrate having heat resistance that can withstand the processing temperature may be used.

As the flexible substrate, aramid resin, polyethylene naphthalate (PEN) resin, polyether sulfone (PES) resin, polyphenylene sulfide (PPS) resin, polyimide (PI) resin and the like can be used. Further, a prepreg which is a structure in which fibers are impregnated with an organic resin may be used.

The method of transposing the element layer from the manufactured substrate to another substrate is not particularly limited, and various methods can be used. For example, a release layer may be formed between the fabrication substrate and the element layer.

In the present specification, the element layer includes not only a semiconductor element layer provided on the element substrate side but also a counter electrode layer provided on the opposite substrate side. Therefore, the peeling step can be used on both the element base side and the sealing substrate side. Further, in consideration of the simplicity of the process, after the production substrate is transferred to the flexible substrate, the flexible substrate may be temporarily adhered to a glass substrate or the like in the production process to proceed with the production process.

The release layer can be made of tungsten (W), molybdenum (Mo), titanium (Ti), tantalum (Ta), niobium (Nb), etc. by a sputtering method, plasma CVD method, coating method, printing method, etc.
From nickel (Ni), cobalt (Co), zirconium (Zr), zinc (Zn), ruthenium (Ru), rhodium (Rh), palladium (Pd), osmium (Os), iridium (Ir), silicon (Si) A layer composed of the selected element, an alloy material containing the element as a main component, or a compound material containing the element as a main component is formed as a single layer or laminated. The crystal structure of the layer containing silicon may be amorphous, microcrystal, or polycrystalline. Here, the coating method includes a spin coating method, a droplet ejection method, and a dispensing method.

When the release layer has a single layer structure, a tungsten layer, a molybdenum layer, or a layer containing a mixture of tungsten and molybdenum is preferably formed. Alternatively, a layer containing an oxide or nitride of tungsten, a layer containing an oxide or nitride of molybdenum, or a layer containing an oxide or nitride of a mixture of tungsten and molybdenum is formed. The mixture of tungsten and molybdenum corresponds to, for example, an alloy of tungsten and molybdenum.

When the release layer has a laminated structure, preferably, a tungsten layer, a molybdenum layer, or a layer containing a mixture of tungsten and molybdenum is formed as the first layer, and tungsten, as the second layer,
Molybdenum or a mixture of tungsten and molybdenum forms oxides, nitrides, oxide nitrides or oxides.

When forming a laminated structure of a layer containing tungsten and a layer containing an oxide of tungsten as a release layer, a layer containing tungsten is formed, and an insulating layer formed of an oxide is formed on the upper layer to form tungsten. It may be utilized that a layer containing a tungsten oxide is formed at the interface between the layer and the insulating layer. Furthermore, the surface of the layer containing tungsten is thermally oxidized.
A layer containing an oxide of tungsten may be formed by performing an oxygen plasma treatment, a treatment with a solution having a strong oxidizing power such as ozone water, or the like. Further, the plasma treatment and the heat treatment may be carried out in the atmosphere of oxygen, nitrogen, nitrous oxide alone, or a mixed gas atmosphere of the gas and other gases. This also applies to the case of forming a layer containing a tungsten nitride, an oxide nitride and a nitride oxide. After forming a layer containing tungsten, a silicon nitride layer, a silicon oxide layer and a silicon nitride oxide are formed on the layer. It is good to form a layer.

In the transfer step to another substrate, a release layer is formed between the substrate and the element layer, a metal oxide film is provided between the release layer and the element layer, and the metal oxide film is fragile by crystallization. By providing a method of peeling off the element layer, providing an amorphous silicon film containing hydrogen between the highly heat-resistant substrate and the element layer, and removing the amorphous silicon film by irradiation or etching with laser light. A method of peeling the element layer, a release layer is formed between the substrate and the element layer, and a metal oxide film is provided between the release layer and the element layer.
The metal oxide film is fragile by crystallization, and a part of the release layer is made into a solution, NF ₃ , BrF ₃ , Cl.
After removal of the etching by a halogen fluoride gas F _3, etc., mechanically delete, the substrate on which the element layer is formed to peel the metal oxide film which is weakened or solution or NF _3, BrF
_3. A method of removing by etching with a halogen gas such as ClF _{3 or the like can be appropriately used.} Further, a film containing nitrogen, oxygen, hydrogen, etc. (for example, an amorphous silicon film containing hydrogen, a hydrogen-containing alloy film, an oxygen-containing alloy film, etc.) is used as the release layer, and the release layer is irradiated with laser light for release. A method of releasing nitrogen, oxygen or hydrogen contained in the layer as a gas to promote the separation between the element layer and the substrate may be used.

By combining the above peeling methods, the transposition step can be performed more easily. In other words, after irradiating the peeling layer with laser light, etching the peeling layer with a gas or solution, and mechanically removing it with a sharp knife or scalpel to make the peeling layer and the element layer easy to peel off, physical force is applied. It can also be peeled off (by a machine or the like).

Further, the element layer may be separated from the substrate by infiltrating the liquid into the interface between the release layer and the element layer. Water or the like can be used as the liquid.

The transistor included in the electronic book disclosed in the present specification is not particularly limited. Therefore, various transistor structures and semiconductor materials can be used.

An example of the structure of the thin film transistor will be described with reference to FIG. FIG. 21 is an example of a thin film transistor that can be used for the thin film transistor 4010 according to the fifth embodiment.

In FIGS. 21 (A) to 21 (D), the insulating film 4023 is formed on the element substrate 4331a.
Thin film transistors 4010a, 4010b, 4010c, 4010d on the insulating film 4023
Is provided. Thin film transistors 4010a, 4010b, 4010c, 4010d
An insulating layer 4020 and an insulating layer 4021 are formed on the thin film transistors 4010a and 401.
A first electrode layer 4030 that electrically connects to 0b, 4010c, and 4010d is provided.

The thin film transistor 4010a has a configuration in which the wiring layers 405a and 405b functioning as the source electrode layer and the drain electrode layer and the semiconductor layer 403 are in contact with each other without the ^{n + layer in the thin film transistor 4010 in FIGS. 18 to 20.}

The thin film transistor 4010a is an inverted staggered thin film transistor, and is used as a gate electrode layer 401, a gate insulating layer 402, a semiconductor layer 403, a source electrode layer or a drain electrode layer on an element substrate 4331a and an insulating film 4023, which are substrates having an insulating surface. Functional wiring layer 40
Includes 5a and 405b. The n ⁺ layers 404a and 404b are semiconductor layers having lower resistance than the semiconductor layer 403.

The thin film transistor 4010b is a bottom gate type thin film transistor, and is a wiring layer that functions as a gate electrode layer 401, a gate insulating layer 402, a source electrode layer, or a drain electrode layer on the element substrate 4331a and the insulating film 4023, which are substrates having an insulating surface. 405a, 405
^{b, including n +} layers 404a, 404b, which function as a source or drain region, and a semiconductor layer 403. Further, an insulating layer 4020 that covers the thin film transistor 4010b and is in contact with the semiconductor layer 403 is provided.

The n ⁺ layers 404a and 404b may be provided between the gate insulating layer 402 and the wiring layers 405a and 405b. Further, the n ⁺ layers 404a and 404b may be provided both between the gate insulating layer and the wiring layer and between the wiring layer and the semiconductor layer.

In the thin film transistor 4010b, the gate insulating layer 402 is present in the entire region including the thin film transistor 4010b, and the gate electrode layer 401 is provided between the gate insulating layer 402 and the element substrate 4331a which is a substrate having an insulating surface. Wiring layers 405a and 405b and n ⁺ layers 404a and 404b are provided on the gate insulating layer 402. A semiconductor layer 403 is provided on the gate insulating layer 402, the wiring layers 405a and 405b, and the n ^{+ layers 404a and 404b.} Although not shown, the wiring layer 40 is placed on the gate insulating layer 402.
It has a wiring layer in addition to 5a and 405b, and the wiring layer extends outward from the outer peripheral portion of the semiconductor layer 403.

The thin film transistor 4010c has a configuration in which the source electrode layer, the drain electrode layer, and the semiconductor layer are in contact with each other without ^{the n + layer in the thin film transistor 4010b.}

In the thin film transistor 4010c, the gate insulating layer 402 is present in the entire region including the thin film transistor 4010c, and the gate electrode layer 401 is provided between the gate insulating layer 402 and the element substrate 4331a which is a substrate having an insulating surface. Wiring layers 405a and 405b are provided on the gate insulating layer 402. Then, the gate insulating layer 402 and the wiring layer 405a
, 405b is provided with a semiconductor layer 403. Although not shown, the gate insulating layer 4
On 02, a wiring layer is provided in addition to the wiring layers 405a and 405b, and the wiring layer is a semiconductor layer 403.
It extends to the outside of the outer circumference of the.

The thin film transistor 4010d is a top gate type thin film transistor. The thin film transistor 4010d is an example of a planar type thin film transistor. A gate insulating layer 402 is formed on the semiconductor layer 403 and the semiconductor layer 403 including ^{the n +} layers 404a and 404b that function as a source region or a drain region on the element substrate 4331a and the insulating film 4023, which are substrates having an insulating surface. A gate electrode layer 401 is formed on the gate insulating layer 402. Further, ^{wiring layers 405a and 405b that are in contact with the n +} layers 404a and 404b and function as a source electrode layer or a drain electrode layer are formed. n ⁺ layers 404a and 404b are semiconductor layers 403.
It is a semiconductor region with lower resistance.

As the thin film transistor, a top gate type forward staggered thin film transistor may be used.

In the present embodiment, the single gate structure has been described, but a multi-gate structure such as a double gate structure may be used. In this case, a structure in which gate electrode layers are provided above and below the semiconductor layer may be used, or a structure in which a plurality of gate electrode layers are provided only on one side (upper or lower) of the semiconductor layer may be used.

The semiconductor material used for the semiconductor layer is not particularly limited. An example of a material that can be used for the semiconductor layer of a thin film transistor will be described.

The material that forms the semiconductor layer of the semiconductor element is an amorphous (amorphous, hereinafter also referred to as "AS") semiconductor produced by a vapor phase growth method or a sputtering method using a semiconductor material gas typified by silane or Germanan. , Polycrystalline semiconductors obtained by crystallizing the amorphous semiconductors using light energy or thermal energy, microcrystals (also referred to as semi-amorphous or microcrystals; hereinafter also referred to as “SAS”) semiconductors, and the like can be used. .. The semiconductor layer can be formed by a sputtering method, an LPCVD method, a plasma CVD method, or the like.

The microcrystalline semiconductor film belongs to a metastable state intermediate between amorphous and single crystal in consideration of the free energy of Gibbs. That is, it is a semiconductor having a third state that is stable in free energy, has short-range order, and has lattice distortion. Columnar or acicular crystals grow in the normal direction with respect to the substrate surface. Microcrystalline silicon, which is a typical example of microcrystalline semiconductor, has its Raman spectrum shifted to a lower wavenumber side than ^{520 cm -1, which indicates single crystal silicon.} That is, 520 cm ^-1 indicating single crystal silicon and 480 cm indicating amorphous silicon.
There is a peak in the Raman spectrum of microcrystalline silicon between ^-1. It also contains at least 1 atomic% or more of hydrogen or halogen to terminate unbonded hands (dangling bonds). Further, by adding a rare gas element such as helium, argon, krypton, or neon to further promote the lattice strain, the stability is increased and a good polycrystalline semiconductor film can be obtained.

This microcrystalline semiconductor film can be formed by a high-frequency plasma CVD method having a frequency of several tens of MHz to several hundreds of MHz, or a microwave plasma CVD apparatus having a frequency of 1 GHz or more. Typically, SiH ₄ , Si ₂ H ₆ , SiH ₂ Cl ₂ , SiHCl ₃ , SiCl ₄ , S.
The silicon hydride such as iF ₄ can be formed by dilution with hydrogen. Further, in addition to silicon hydride and hydrogen, it can be diluted with one or more rare gas elements selected from helium, argon, krypton, and neon to form a microcrystalline semiconductor film. At these times, the flow rate ratio of hydrogen to silicon hydride is 5 times or more and 200 times or less, preferably 50 times or more and 150 times or less.
More preferably, it is 100 times.

Typical examples of amorphous semiconductors include hydrogenated amorphous silicon, and typical examples of crystalline semiconductors include polysilicon. The main material of polysilicon (polycrystalline silicon) is so-called high-temperature polysilicon, which uses polysilicon formed at a process temperature of 800 ° C or higher as the main material, or polysilicon formed at a process temperature of 600 ° C or lower. It contains so-called low-temperature polysilicon used as, and polysilicon obtained by crystallizing amorphous silicon using an element that promotes crystallization. Of course, as described above, a microcrystalline semiconductor or a semiconductor containing a crystal phase in a part of the semiconductor layer can also be used.

Further, as the material of the semiconductor, not only a simple substance such as silicon (Si) and germanium (Ge) but also a compound semiconductor such as GaAs, InP, SiC, ZnSe, GaN and SiGe can be used.

When a crystalline semiconductor film is used for the semiconductor layer, the method for producing the crystalline semiconductor film is various methods (laser crystallization method, thermal crystallization method, or heat using an element that promotes crystallization such as nickel. A crystallization method or the like) may be used. Further, it is also possible to improve the crystallinity by irradiating a microcrystalline semiconductor which is SAS with a laser to crystallize it. When the element that promotes crystallization is not introduced, the hydrogen concentration of the amorphous silicon film is reduced by 1 × by heating the amorphous silicon film at 500 ° C. for 1 hour before irradiating the amorphous silicon film with laser light. Release to 10 ²⁰ amorphous / cm ³ or less.
This is because when the amorphous silicon film containing a large amount of hydrogen is irradiated with a laser beam, the amorphous silicon film is destroyed.

The method of introducing the metal element into the amorphous semiconductor film is not particularly limited as long as the metal element can be present on the surface of the amorphous semiconductor film or inside the amorphous semiconductor film, and is not particularly limited, for example, a sputtering method or CVD.
A method, a plasma treatment method (including a plasma CVD method), an adsorption method, and a method of applying a solution of a metal salt can be used. Of these, the method using a solution is convenient in that the concentration of the metal element can be easily adjusted. At this time, in order to improve the wettability of the surface of the amorphous semiconductor film and spread the aqueous solution over the entire surface of the amorphous semiconductor film, UV light irradiation in an oxygen atmosphere, thermal oxidation method, and hydroxyl radical are applied. It is desirable to form an oxide film by treatment with ozone water containing ozone or hydrogen peroxide.

Further, in the crystallization step of crystallizing an amorphous semiconductor film to form a crystalline semiconductor film, an element (also referred to as a catalyst element or a metal element) that promotes crystallization is added to the amorphous semiconductor film and heat treatment (also referred to as a catalyst element or a metal element) is performed. 550
Crystallization may be carried out at ° C. to 750 ° C. for 3 minutes to 24 hours). Elements that promote (promote) crystallization include iron (Fe), nickel (Ni), cobalt (Co), and ruthenium (Ru).
), Rhodium (Rh), Palladium (Pd), Osmium (Os), Iridium (Ir)
, Platinum (Pt), copper (Cu) and gold (Au).

In order to remove or reduce the elements that promote crystallization from the crystalline semiconductor film, a semiconductor film containing an impurity element is formed in contact with the crystalline semiconductor film to function as a gettering sink. As the impurity element, an impurity element that imparts n-type, an impurity element that imparts p-type, a rare gas element, or the like can be used, and for example, phosphorus (P), nitrogen (N), arsenic (As), antimony (
One or more species selected from Sb), bismuth (Bi), boron (B), helium (He), neon (Ne), argon (Ar), Kr (krypton), and Xe (xenon) can be used. .. A semiconductor film containing a rare gas element is formed on a crystalline semiconductor film containing an element that promotes crystallization, and heat treatment (3 minutes to 24 hours at 550 ° C to 750 ° C) is performed. The element that promotes crystallization contained in the crystalline semiconductor film moves into the semiconductor film containing the noble gas element, and the element that promotes crystallization in the crystalline semiconductor film is removed or reduced. Then, the semiconductor film containing the noble gas element that has become the gettering sink is removed.

Crystallization of the amorphous semiconductor film may be a combination of heat treatment and crystallization by laser irradiation.
Heat treatment or laser light irradiation may be performed independently or multiple times.

Further, the crystalline semiconductor film may be formed directly on the substrate by the plasma method. Further, the crystalline semiconductor film may be selectively formed on the substrate by using the plasma method.

Further, an oxide semiconductor may be used for the semiconductor layer. For example, zinc oxide (ZnO), tin oxide (SnO ₂ ) and the like can also be used. When ZnO is used as a semiconductor layer, the gate insulating layer is Y ₂ O ₃ , Al ₂ O ₃ , TiO ₂ , or a laminate thereof, and the gate electrode layer, the source electrode layer, and the drain electrode layer are ITO, Au, etc. Ti or the like can be used. Also,
In and Ga can also be added to ZnO.

As the oxide semiconductor, _{a thin film represented by InMO 3} (ZnO) _m (m> 0) can be used. In addition, M is gallium (Ga), iron (Fe), nickel (Ni), manganese (M).
n) and one metal element selected from cobalt (Co) or a plurality of metal elements are shown. For example, M may be Ga, or may contain the above metal elements other than Ga, such as Ga and Ni or Ga and Fe. In addition to the metal element contained as M, some of the oxide semiconductors contain Fe, Ni or other transition metal elements, or oxides of the transition metal as impurity elements. For example, an In-Ga-Zn-O-based non-single crystal film can be used as the oxide semiconductor layer.

Instead of the oxide semiconductor layer _{(InMO 3 (ZnO) m (} m> 0) film) as the In-Ga-ZnO-based non-single-crystal film, InMO ₃ for the M and another metal element _(ZnO) m ( m> 0) A film may be used. In addition to the above, In addition to the above, In
-Sn-Zn-O system, In-Al-Zn-O system, Sn-Ga-Zn-O system, Al-Ga-
Zn-O system, Sn-Al-Zn-O system, In-Zn-O system, Sn-Zn-O system, Al-Z
An n—O system, an In—O system, a Sn—O system, and a Zn—O system oxide semiconductor can be applied.

This embodiment can be implemented in combination with the configurations described in other embodiments as appropriate.

100 Board 101 Board 102 Display element 110 Board 111 Board 112 Board 113 Board 114 Display element 115 Display element 120 Board 121 Board 122 Board 123 Board 124 Display element 125 Display element 126 Backlight 200 Display control unit 201 CPU
203 Storage unit 205 Power supply unit 207 Power supply circuit 209 Internal memory 211 Data input unit 213 External memory 215 Video signal generation circuit 216 Antenna 219 Operation unit 401 Gate electrode layer 402 Gate insulation layer 403 Semiconductor layer 404an ⁺ layer 405a Wiring layer 407 Insulation Film 421 Thin film 701 First display panel 702 Second display panel 703 Third display panel 704 Fourth display panel 705 Display control unit 706A Scan line drive circuit 706B Scan line drive circuit 706C Scan line drive circuit 706D Scan line drive Circuit 707A 1st display 707B 2nd display 707C 3rd display 707D 4th display 708 pixel 709A optical sensor 709B optical sensor 709C optical sensor 709D optical sensor 710 pixel circuit 711 optical intensity comparison circuit 712 CPU
713 Internal memory 714 Video signal generation circuit 714A Signal line drive circuit 714B Signal line drive circuit 714C Signal line drive circuit 714D Signal line drive circuit 715 Power supply circuit 715A Power supply circuit 715B Power supply circuit 715C Power supply circuit 715D Power supply circuit 716 Signal Transmission / reception part 717 Power supply part 718 Operation part 719 Antenna part 920 Wiring 921 Stress concentration area 922a Cut part 922b Cut part 923 Sealing substrate 924 Element substrate 925 Reinforcing plate 4005 Sealing material 4008 Liquid crystal layer 4010 Thin film 4011 Thin film 4013 Liquid crystal element 4015 Connection terminal electrode 4016 Terminal electrode 4019 Anisotropic conductive film 4020 Insulation layer 4021 Insulation layer 4023 Insulation film 4030 Electrode layer 4031 Electrode layer 4032 Insulation film 4301 First display unit 4302 Third display unit 4304 Operation unit 4307 Second display unit 4308 Binding Unit 4309 Display button 4310 Fourth display unit 4311 First display panel 4312 Second display panel 4313 Third display panel 4321 Scan line drive circuit 4322 Scan line drive circuit 4323 Signal line drive circuit 4324 FPC
4325 Printed circuit board 4326 Stress concentration area 4329 FPC
4352 pixel TFT
4507 Display 4510 Partition 4511 Electroluminescent layer 4513 Light emitting element 4514 Filling material 4612 Cavity 4613 Spherical particle 4614 Filling material 4712 Liquid 4713 Microcapsule 4812 Space 4814 Rib 7002 Arrow 4010a Thin film transistor 4010b Thin film transistor 4010c Thin film transistor 4010d Thin film transistor 4321b Scanning line drive circuit 4321b Drive circuit 4322a Scanning line drive circuit 4322b Scanning line drive circuit 4323a Signal line drive circuit 4323b Signal line drive circuit 4324a FPC
4324b FPC
4327a Printed circuit board 4327b Printed circuit board 4331a Element substrate 4331b Element substrate 4332a Encapsulation substrate 4332b Encapsulation substrate 4350a Hand 4350b Hand 4615a Black region 4615b White region 4715a Fine particles 4715b Fine particles 4815a Powder granules 4815b

Claims (3)

The first resin layer, the second resin layer, and
A display unit arranged on the first resin layer and arranged between the first resin layer and the second resin layer.
The signal line drive circuit arranged on the first resin layer and
A display device having a first plate and a second plate attached to the first resin layer on a surface of the first resin layer opposite to the second resin layer side. hand,
The first plate and the second plate are arranged apart from each other.
The first resin layer overlaps the first region that overlaps with the signal line drive circuit, the second region that overlaps with the first plate, and overlaps with the display unit, and the second plate. It also has a third area that overlaps with the display unit.
The first resin layer has a function of bending in a region between the first region and the second region.
The first resin layer is a display device having a function of bending in a region between the second region and the third region. The first resin layer, the second resin layer, and
A display unit and a scanning line drive circuit arranged on the first resin layer and between the first resin layer and the second resin layer.
The signal line drive circuit arranged on the first resin layer and
A display device having a first plate and a second plate attached to the first resin layer on a surface of the first resin layer opposite to the second resin layer side. hand,
The first plate and the second plate are arranged apart from each other.
The first resin layer overlaps the first region that overlaps with the signal line drive circuit, the second region that overlaps with the first plate, and overlaps with the display unit, and the second plate. It also has a third area that overlaps with the display unit.
The first resin layer has a function of bending in a region between the first region and the second region.
The first resin layer has a function of bending in a region between the second region and the third region.
The scanning line drive circuit is a display device that does not overlap the region between the first region and the second region. The first resin layer, the second resin layer, and
A display unit arranged on the first resin layer and arranged between the first resin layer and the second resin layer.
The signal line drive circuit arranged on the first resin layer and
A display device having a first plate and a second plate attached to the first resin layer on a surface of the first resin layer opposite to the second resin layer side. hand,
The first plate and the second plate are arranged apart from each other.
The first resin layer overlaps the first region that overlaps with the signal line drive circuit, the second region that overlaps with the first plate, and overlaps with the display unit, and the second plate. It also has a third area that overlaps with the display unit.
The first resin layer has a function of bending in a region between the first region and the second region.
The first resin layer has a function of bending in a region between the second region and the third region.
In a state where the first resin layer is not bent in the region between the first region and the second region, the second resin layer is a display device that does not overlap with the signal line drive circuit. ..

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