WO2017199122A1 - Electronic device - Google Patents

Electronic device Download PDF

Info

Publication number
WO2017199122A1
WO2017199122A1 PCT/IB2017/052653 IB2017052653W WO2017199122A1 WO 2017199122 A1 WO2017199122 A1 WO 2017199122A1 IB 2017052653 W IB2017052653 W IB 2017052653W WO 2017199122 A1 WO2017199122 A1 WO 2017199122A1
Authority
WO
WIPO (PCT)
Prior art keywords
display
housing
liquid crystal
display unit
substrate
Prior art date
Application number
PCT/IB2017/052653
Other languages
French (fr)
Japanese (ja)
Inventor
ベリクヴィストヨハン
Original Assignee
株式会社半導体エネルギー研究所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社半導体エネルギー研究所 filed Critical 株式会社半導体エネルギー研究所
Publication of WO2017199122A1 publication Critical patent/WO2017199122A1/en

Links

Images

Classifications

    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/37Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being movable elements
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/40Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character is selected from a number of characters arranged one beside the other, e.g. on a common carrier plate
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00Electroluminescent light sources
    • H05B33/12Light sources with substantially two-dimensional radiating surfaces
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00Electroluminescent light sources
    • H05B33/12Light sources with substantially two-dimensional radiating surfaces
    • H05B33/14Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of the electroluminescent material, or by the simultaneous addition of the electroluminescent material in or onto the light source

Definitions

  • One embodiment of the present invention relates to an electronic device including a display device.
  • one embodiment of the present invention is not limited to the above technical field.
  • Technical fields of one embodiment of the present invention disclosed in this specification and the like include semiconductor devices, display devices, light-emitting devices, power storage devices, memory devices, electronic devices, lighting devices, input devices, input / output devices, and driving methods thereof , Or a method for producing them, can be mentioned as an example.
  • electronic devices equipped with display devices have been diversified.
  • electronic devices such as a mobile phone, a smartphone, a tablet terminal, and a wearable device.
  • an electronic book terminal is an electronic device specialized in a function that mainly displays character information.
  • a tablet terminal is equipped with a liquid crystal panel capable of displaying a smooth moving image
  • an electronic book terminal is equipped with electronic paper capable of displaying a still image with low power.
  • Patent Document 1 proposes an active matrix type electronic paper using a transistor as a switching element of a pixel and a binder type electronic book using the same.
  • An object of one embodiment of the present invention is to provide a highly convenient electronic device. Another object of one embodiment of the present invention is to provide an electronic device that can give a user a feeling of operation without feeling uncomfortable. Another object is to provide an electronic device with a feeling of operation similar to that of a book (also referred to as a book, a book, or a book). Another object is to provide an electronic device having a shape similar to a book. Another object of one embodiment of the present invention is to provide an electronic device whose design can be changed in accordance with a user's preference.
  • an object of one embodiment of the present invention is to provide an electronic device in which high visibility is achieved regardless of external light. Another object of one embodiment of the present invention is to provide an electronic device with reduced power consumption. Another object of one embodiment of the present invention is to provide an electronic device that can perform both smooth moving image display and still-eye still image display. Another object is to provide a novel electronic device.
  • One embodiment of the present invention is an electronic device including a first housing and a second housing.
  • the first housing has a first surface and a second surface opposite to the first surface.
  • the second housing has a third surface and a fourth surface opposite to the third surface.
  • the first casing and the second casing are connected to each other side by side, and are folded in such a manner that the first surface and the third surface overlap each other, and the first surface and the second surface It can be deformed into a form that is open so that the third surface is exposed.
  • the first housing has a first display portion on a first surface and a second display portion on a second surface.
  • the second housing has a third display portion on the third surface.
  • the second display unit has a function of holding a still image display without rewriting.
  • the second housing has the fourth display portion on the fourth surface.
  • the fourth display unit has a function of holding a still image display without rewriting.
  • the fifth display unit has a function of holding a still image display without rewriting.
  • the thickness of the first casing is thinner than that of the second casing.
  • the cover preferably includes paper.
  • the second display portion includes a microcapsule, an electrophoretic element, a nematic liquid crystal element, a cholesteric liquid crystal element, a ferroelectric liquid crystal element, an electrowetting element, an electrofluidic element, an electrochromic element, and a MEMS element. It is preferable to include one or more selected.
  • the first display portion and the third display portion are respectively a liquid crystal element, an organic EL element, a microcapsule, an electrophoretic element, an electrowetting element, an electrofluidic element, an electrochromic element, and a MEMS element. It is preferable that one or more selected from is included.
  • the first housing and the second housing each have a display panel in the first display portion or the third display portion.
  • the display panel preferably includes a first substrate, a second substrate, a liquid crystal element, a light emitting element, and an insulating layer.
  • the liquid crystal element is positioned between the second substrate and the insulating layer
  • the light-emitting element is positioned between the first substrate and the insulating layer
  • the liquid crystal element emits light toward the second substrate side.
  • the light-emitting element preferably has a function of reflecting light and emits light toward the second substrate.
  • the first housing and the second housing each have a display panel in the first display portion or the third display portion.
  • the display panel includes a first substrate, a second substrate, a liquid crystal element, a light emitting element, a first transistor, a second transistor, a first insulating layer, and a second insulating layer. It is preferable to have.
  • the first transistor and the second transistor are located between the first insulating layer and the second insulating layer, and the liquid crystal element is located between the second substrate and the second insulating layer.
  • the light emitting element is preferably located between the first substrate and the first insulating layer.
  • the liquid crystal element preferably has a function of being electrically connected to the first transistor and reflecting light toward the second substrate.
  • the light-emitting element preferably has a function of being electrically connected to the second transistor and emitting light to the second substrate side.
  • the first housing or the second housing includes at least one of a battery module, a sensor module, a vibration module, a camera module, an external interface, a communication module, a speaker, a microphone, and a storage device. It is preferable.
  • a highly convenient electronic device can be provided.
  • an electronic device whose design can be changed according to the user's preference can be provided.
  • an electronic device that achieves high visibility regardless of outside light.
  • an electronic device with reduced power consumption can be provided.
  • an electronic device that can display both a smooth moving image and a still image that is easy on the eyes can be provided.
  • a new electronic device can be provided.
  • FIG. 11 is a block diagram of an electronic device according to an embodiment. 3 shows a structure example of a display panel according to an embodiment. The circuit diagram of the display panel based on Embodiment. The circuit diagram of the display panel based on Embodiment. 3 shows a structure example of a display panel according to an embodiment. 3 shows a structure example of a display panel according to an embodiment.
  • FIG. 1A, 1B, and 1C are perspective schematic views of the electronic device 10, respectively.
  • FIG. 1A is a schematic perspective view of the electronic device 10 folded in two
  • FIG. 1B is a schematic perspective view of the electronic device 10 in a state where two housings are opened
  • FIG. 1C is a schematic perspective view of the electronic device 10 when FIG. 1B is viewed from the opposite side.
  • the electronic device 10 includes a housing 11 and a housing 12.
  • the housing 11 and the housing 12 are arranged side by side and connected by a hinge portion 31.
  • the housing 11 and the housing 12 can be relatively rotated around the axis of the hinge portion 31.
  • the housing 11 has a display unit 21, and the housing 12 has a display unit 22.
  • the housing 11 and the housing 12 are folded in two so that the display unit 21 and the display unit 22 face each other, and the display unit 21 and the display unit 22 are visible.
  • the housing 11 and the housing 12 can be reversibly deformed between the opened state.
  • the electronic device 10 has a display unit 23 on the surface of the housing 11 opposite to the display unit 21. As shown in FIG. 1A, the display unit 23 is disposed at a position that can be visually recognized by the user even when the electronic device 10 is folded.
  • the display unit 23 preferably has lower power consumption than the display unit 21 and the display unit 22.
  • a structure including a display element having a memory property is preferable because power consumption can be reduced.
  • a display element having a memory property is a display element having a function of holding a still image display without rewriting.
  • the display element having a memory property includes a display element that can display a still image in a state where power supply is stopped.
  • the display element having a memory property includes a display element that can maintain a still image display with a constant voltage supplied.
  • a display element having a memory property includes a display element in which display can be maintained without performing a refresh operation.
  • the longer the period during which a display element having a memory property can hold a display without refreshing or rewriting is better. For example, it can be maintained for a period of 1 second or longer, preferably 1 minute or longer, more preferably 1 hour or longer, and even more preferably 1 day or longer and 1 year or shorter.
  • the state in which the display is held can be, for example, a state in which the change in luminance is 5% or less, preferably 3% or less, more preferably 1% or less with respect to the luminance dynamic range. .
  • the luminance may be replaced with reflectance.
  • display elements to which various bistable display technologies are applied can be used.
  • a typical example of such a display element is electronic paper.
  • Examples of the electronic paper method include particle movement type elements such as a microcapsule method, an electrophoretic (EPD) method, and an electronic powder fluid (registered trademark) method.
  • a display element using a bistable liquid crystal such as a nematic liquid crystal, a cholesteric liquid crystal, or a ferroelectric liquid crystal element can also be used.
  • an electrowetting (EWD) element an electrofluidic display (EFD) element, an electrochromic (ECD) element, a MEMS (MicroElectrical Display) element, or a MEMS (MicroElectrical Display) element.
  • EWD electrowetting
  • EFD electrofluidic display
  • ECD electrochromic
  • MEMS MicroElectrical Display
  • MEMS MicroElectrical Display
  • Etc. can be used as a display element having a memory property.
  • the MEMS element include a MEMS element using optical interference and a MEMS element using a shutter method.
  • the electronic device 10 when used as an electronic book terminal that mainly displays still images and character information, a display element having the same memory characteristics as the display unit 23 is applied to the display unit 21 and the display unit 22. Can do.
  • an organic EL OLED: Organic Light Emitting Diode
  • LED Light Emitting Diode
  • QLED Quadrature Light Emitting Diode
  • a self-luminous light emitting element such as a -dot Light Emitting Diode
  • a transmissive, reflective, or transflective liquid crystal element may be used.
  • a display panel having a display element using reflected light and a light emitting element it is preferable to apply a reflective liquid crystal element and a transistor for driving the liquid crystal element between a pair of substrates, and a display panel having an organic EL element and a transistor for driving the organic EL element.
  • display is performed with a reflective liquid crystal element when the outside light is bright, so that the display can be driven with excellent visibility and low power consumption. Further, when the outside light is dark, a vivid display can be performed by displaying with the organic EL element.
  • display with both a reflective liquid crystal element and an organic EL element it is possible to perform display that achieves both low power consumption and clear display.
  • the electronic device 10 can execute an application that displays document information such as books on the display unit 21 and the display unit 22, for example. Since the user can read the electronic device 10 in an opened state, the list is excellent. Moreover, since the electronic device 10 can be folded when carrying, it is excellent in portability.
  • the electronic device 10 can be suitably used not only as an electronic book terminal but also for a textbook, for example.
  • different applications may be displayed on the display unit 21 and the display unit 22.
  • an application that displays document information can be displayed on one side, and an application such as an electronic mail can be displayed on the other side.
  • an image functioning as a keyboard or a touch pad can be displayed on any one of the display portions. That is, by making one of the display unit 21 and the display unit 22 function as an input unit and the other function as a main display unit (main display), it can be used like a notebook computer or a game machine.
  • main display main display
  • the display unit 21 and the display unit 22 it is preferable that no display is performed on the display unit 21 and the display unit 22 when the electronic device is closed. Specifically, it is preferable not to drive the pixels of the display unit 21 and the display unit 22. In the case where a display device having a backlight such as a transmissive liquid crystal device is used as the display portion 21 or the display portion 22, it is preferable that the backlight is not driven. By disabling the display portion that is not visible to the user when the electronic device 10 is closed (non-operation), the power consumption can be extremely reduced.
  • a still image displayed on the display unit 23 for example, a still image corresponding to the cover of a book can be suitably displayed.
  • the title, author, publisher name, etc. of the book can be displayed.
  • the title of the document can be shown to the person on the other side of the user. Even if the electronic device 10 is closed while the user has read the document halfway, since the title and the like are displayed on the display unit 23, it is possible to determine what document the user is reading. It is possible to remember without opening the electronic device 10.
  • the display unit 23 is not limited to the above, and various displays can be performed. For example, notification of incoming calls such as e-mails, telephone calls, social networking services (SNS), titles such as e-mails and SNSs, sender names such as e-mails and SNSs, messages, date and time, time of playing voice and music Various information such as information, volume, temperature, remaining battery level, communication status, antenna reception intensity, file download status, and the like can be displayed.
  • the display unit 23 may display icons associated with various applications, icons associated with various functions, operation buttons, or sliders. For example, there is an icon associated with a function for adjusting the volume and a function for fast-forwarding, fast-rewinding, or the like when playing back voice or music. Alternatively, an icon associated with a function for answering or holding a call when a call is received, or a function for canceling a state where the operation of the electronic device 10 is disabled (also referred to as a locked state) may be displayed.
  • the display unit 23 Since the display unit 23 has a display element having a memory property, rewriting of the display only needs to be performed when a change occurs in the displayed image. For example, when performing time display, the power consumption accompanying rewriting can be made extremely small by rewriting the display every minute. In addition, information such as communication status, antenna reception strength, and temperature can be rewritten only when the information changes, so that the frequency of rewriting can be reduced and power consumption can be reduced.
  • document information such as books may be displayed on the display unit 23.
  • the electronic device 10 By using the electronic device 10 in a closed state, it can be suitably used in public places such as trains and buses.
  • a touch panel can be suitably used for the display unit 21 and the display unit 22. Thereby, touch operations such as a tap operation, a swipe operation, and a pinch operation can be performed by touching the display unit 21 and the display unit 22. Further, for example, when document information such as a book is displayed, the page can be switched by a swipe operation or the like, and the document information can be browsed by an operation close to an actual book.
  • a touch panel to the display unit 23. Thereby, it can be used like a tablet terminal etc. in the state which closed the electronic device 10.
  • a driver circuit for the pixels of the display portion 21, the display portion 22, and the display portion 23, a driver circuit, and the like, it is preferable to use a transistor in which an oxide semiconductor is used for a channel formation region and an extremely low off-state current is realized.
  • a transistor including an oxide semiconductor whose band gap is larger than that of silicon can hold charge accumulated in a capacitor connected in series with the transistor for a long time because of the low off-state current.
  • the driver circuit can be stopped while maintaining the gradation of a displayed image even when a display element having a memory property is not applied. As a result, an electronic device with extremely low power consumption can be realized.
  • FIG. 2 shows an example in which the display unit 24 is provided on the back surface of the housing 12 (the surface opposite to the surface on which the display unit 22 is provided).
  • the display unit 24 is preferably provided with a display element having a memory property.
  • a still image corresponding to the back cover of a book can be suitably displayed.
  • an issuer name, an International Standard Book Number (ISBN), or a summary text can be displayed.
  • the title and author of the book may be displayed. By doing so, information similar to an actual book can be displayed on the display unit 23 and the display unit 24.
  • an image corresponding to the back cover of the book can be displayed on the display unit 23, and an image corresponding to the cover of the book can be displayed on the display unit 24.
  • the display unit 23 is on the front cover side and the display unit 24 is on the back cover side.
  • the display unit 24 is on the front cover side and the display unit 23 is on the back cover side.
  • the contents displayed on the display unit 23 and the display unit 24 are appropriately changed according to the type of book data, depending on the application executed by the electronic device 10.
  • the electronic device 10 can be used as an electronic device that allows the user to feel a sense of incongruity.
  • 3A to 3D show an example of the electronic device 10 having a cover 32 that covers the housing 11 and the housing 12.
  • 3A is a schematic perspective view of the electronic device 10 in a closed state
  • FIG. 3B is a schematic perspective view of the electronic device 10 as viewed from the opposite side
  • 3C is a schematic perspective view of the electronic device 10 in an opened state
  • FIG. 3D is a schematic perspective view of FIG. 3C viewed from the opposite side.
  • the cover 32 is a part of the surface of the housing 11 on the side where the display unit 23 is provided, the surface of the housing 12 opposite to the display unit 22, and the side on which the housing 11 and the housing 12 are connected. , Provided to cover each side.
  • the size of the cover 32 is larger than that of the housing 11 and the housing 12 so that the cover 32 protrudes slightly from the housing 11 and the housing 12.
  • the cover 32 preferably has an opening through which light from the display unit 23 is transmitted.
  • an opening may be formed by making a hole in the cover 32, or a part of the cover 32 may be formed of a light-transmitting material.
  • the opening may be smaller than the display unit 23, and the shape is not limited to a rectangle, and the design can be improved by using various shapes such as a circle, an ellipse, or a polygon.
  • the cover 32 is provided so as to cover the connecting portion between the housing 11 and the housing 12, the form of the electronic device 10 can be made closer to an actual book.
  • FIG. 4A shows an example in which the touch area 26a is provided outside the portion of the housing 11 where the display unit 21 is provided. Similarly, the touch region 26b is provided outside the portion of the housing 12 where the display unit 22 is provided.
  • a touch sensor such as a capacitance method, a resistance film method, a surface acoustic wave method, an infrared method, an electromagnetic induction method, an optical method, or a pressure sensitive method can be used.
  • a gesture such as a touch operation, a tap operation, a swipe operation, and a pinch operation can be used as an input operation for the touch area 26a and the touch area 26b.
  • FIG. 4A shows a state where the touch area 26a is tapped.
  • FIG. 4B shows a state where the touch area 26a is swiped.
  • the page is turned from right to left by an operation such as tapping or swiping the touch area 26a, and the touch area 26b is tapped.
  • a function of turning the page from the left to the right by swiping or the like can be realized. Note that it may have a function of turning pages in the opposite direction, and it is preferable that the user can set which page is turned.
  • the housing 11 and the housing 12 have the touch area 26a and the touch area 26b in addition to the display unit 21 and the display unit 22, an operation closer to an actual book can be performed.
  • casing 12 do not need to have the touch area
  • FIG. 4C shows a state where a part of the display unit 21 is swiped.
  • [Modification 2] 5A to 5D are mainly different from the configuration illustrated in each drawing of FIG. 3 in that the display unit 24 and the display unit 25 are provided.
  • the display unit 24 is provided on the surface of the housing 12 opposite to the display unit 22.
  • the display unit 25 includes a display unit 25 a that overlaps the side surface of the housing 11 and a display unit 25 b that overlaps the side surface of the housing 12.
  • a still image corresponding to the spine of a book can be suitably displayed on the display unit 25.
  • the title, author, publisher name, etc. of the book can be displayed. By doing so, the electronic device 10 can be brought closer to an actual book form.
  • the display unit 25a and the display unit 25b may be configured by separate display panels, or may be configured by using a single flexible display panel.
  • the display unit 25 can be provided in the housing 11 or the housing 12 and visible from the opening of the cover 32, similarly to the display unit 23 and the display unit 24.
  • the cover 32 itself may have a display panel constituting the display unit 25.
  • the electronic device 10 shown in FIG. 5A and the like is provided with display portions along the three surfaces of the cover 32, it is possible to display images corresponding to the front cover, the back cover, and the back cover, respectively.
  • the electronic device 10 can be brought close to the form of the book.
  • the design of the electronic device 10 can be freely changed according to the user's preference.
  • an application converts one image into three images for the display unit 23, the display unit 24, and the display unit 25, and displays the images on the respective display units.
  • a texture image in which one image is periodically arranged may be displayed on each display unit.
  • FIGS. 6A, 6B, and 7 show examples of the electronic device 10 that is partially different from the above.
  • 6A is a schematic perspective view in a state where the electronic device 10 is opened
  • FIG. 6B is a schematic perspective view when FIG. 6A is viewed from the opposite side.
  • FIG. 7A is a schematic perspective view of the electronic device 10 in a closed state.
  • the electronic device 10 shown in FIG. 6 (A) and the like has a binding portion 33.
  • the binding portion 33 is a portion having a hinge portion 31 that connects the housing 11 and the housing 12, a part of the cover 32, and a protection portion 34, and the electronic device 10 is opened and closed. This is a portion that does not deform.
  • the protection part 34 is provided one by one at both ends of the hinge part 31, and has a function of protecting the hinge part 31 when the electronic device 10 is closed as shown in FIG. Further, by providing the protection unit 34 so that the surface of the protection unit 34 and the side surfaces of the housing 11 and the housing 12 are located on the same plane, a clean design can be achieved.
  • the binding part 33 is a part corresponding to the spine of a book, and is provided with a display part 25. By providing the display unit 25 in the binding unit 33, it is not necessary to deform the display unit 25, thereby improving reliability.
  • the bent portion 35 is a portion where the cover 32 is easily bent.
  • a groove may be provided in a part of the cover 32 to reduce the thickness.
  • the bent portion 35 may be a portion in which an elastic body such as rubber is applied to a part of the material of the cover 32, or a hinge may be provided on a part of the cover 32.
  • a part of the cover 32 may be divided into two at the bent portion 35.
  • FIG. 7B shows an example in which the display unit 25 is provided across the two surfaces of the binding unit 33. At this time, it is preferable that the display unit 25 is configured by a single display panel having flexibility. Note that the display unit 25 may be provided across the three surfaces of the binding unit 33. Moreover, you may have the display part to which the display panel was applied individually to the 2nd surface or 3rd surface of the binding part 33, respectively.
  • the casing 11 and the casing 12 are shown to have the same thickness, but the casing 11 and the casing 12 may have different thicknesses.
  • FIGS. 3A to 3D are schematic views of the electronic device 10 illustrated in FIGS. 3A to 3D as viewed from the bottom side.
  • FIG. 8A shows a state where the electronic device 10 is opened
  • FIG. 8B shows a state where the electronic device 10 is closed.
  • 8A and 8B the thicknesses of the housing 11 and the housing 12 are approximately the same.
  • FIGS. 8C and 8D show an example in which the thickness of the housing 11 is made thinner than the housing 12 as compared with FIGS. 8A and 8B.
  • the thickness of the electronic device 10 itself can be reduced.
  • the thickness of the housing 11 located on the display side the user can feel the same feeling as when an actual book is opened.
  • the display 32 and the display panel 23 may be incorporated in the cover 32.
  • the display panels constituting the display unit 21 and the display unit 23 can be configured to be driven by a drive circuit provided in the housing 12.
  • the display unit 21 and the display unit 23 may be configured by a single display panel. At this time, it is preferable to apply a display panel capable of double-sided display (also referred to as a dual display) as the display panel.
  • a display panel capable of double-sided display also referred to as a dual display
  • the electronic device 10 has a thickness in a closed state of greater than 0 mm and 10 cm or less, preferably 1 mm or more and 5 cm or less, more preferably 3 mm or more and 3 cm or less, and further preferably 5 mm or more and 3 cm or less.
  • a thickness in a closed state of greater than 0 mm and 10 cm or less, preferably 1 mm or more and 5 cm or less, more preferably 3 mm or more and 3 cm or less, and further preferably 5 mm or more and 3 cm or less.
  • the ratio of the width and height of 1: With 2 0.5 can be brought close to the actual production.
  • FIG. 9 is a block diagram illustrating a configuration example of the electronic device 10.
  • a component may be related to a plurality of functions, or one function may be related to a plurality of components.
  • the configuration of the electronic device 10 illustrated in FIG. 9 is an example, and it is not necessary to include all the components.
  • the electronic device 10 only needs to have necessary constituent elements among the constituent elements illustrated in FIG. 9. Moreover, you may have components other than the component shown in FIG.
  • the electronic device 10 includes a housing 11 and a housing 12.
  • the housing 11 includes a calculation unit (CPU) 61, a touch panel 51, a touch panel 53, a storage device 64, a display controller 71, a touch sensor controller 72, a battery controller 73, a sound controller 76, an audio input unit 77, an audio output unit 78, and communication.
  • a module 81, an antenna 82, an attitude detection unit 83, a shape detection unit 84, an external interface 85, a camera module 86, a vibration module 87, a sensor module 88, and the like are included.
  • the housing 12 includes a touch panel 52, a power receiving unit 74, a battery module 75, and the like.
  • Storage device 64 display controller 71, touch sensor controller 72, battery controller 73, sound controller 76, communication module 81, posture detection unit 83, shape detection unit 84, external interface 85, camera module 86, vibration module 87, sensor module 88 Are connected to the arithmetic unit 61 via a bus line 62, respectively.
  • the touch panel 51 corresponds to a display panel that constitutes the display unit 21.
  • the touch panel 52 corresponds to a display panel that constitutes the display unit 22.
  • the touch panel 53 corresponds to a display panel that constitutes the display unit 23.
  • the touch panel 52, the power receiving unit 74, and the battery module 75 can be operated by signals and power input from the housing 11.
  • an FPC Flexible Printed Circuit
  • the two housings may have terminals that can be electrically connected regardless of their positional relationship.
  • the calculation unit 61 can function as, for example, a central processing unit (CPU).
  • the calculation unit 61 includes, for example, a storage device 64, a display controller 71, a touch sensor controller 72, a battery controller 73, a sound controller 76, a communication module 81, a posture detection unit 83, a shape detection unit 84, an external interface 85, a camera module 86, It has a function of controlling each component such as the vibration module 87 and the sensor module 88.
  • the arithmetic unit 61 has a function of processing a signal input from each component connected via the bus line 62, a function of generating a signal output to each component, and the like.
  • the component can be controlled centrally.
  • a transistor in which an oxide semiconductor is used for a channel formation region and an extremely low off-state current is realized can be used for the arithmetic unit 61, an IC included in another component, or the like. Since the transistor has extremely low off-state current, the use of the transistor as a switch for holding charge (data) flowing into the capacitor functioning as a memory element can ensure a data holding period for a long time. it can. By using this characteristic for the register and cache memory of the arithmetic unit 61, the arithmetic unit 61 is operated only when necessary, and in other cases, the information of the immediately preceding process is saved in the storage element, thereby being normally off. Computing becomes possible, and the power consumption of the electronic device 10 can be reduced.
  • the calculation unit 61 performs various data processing and program control by interpreting and executing instructions from various programs by the processor.
  • a program that can be executed by the processor may be stored in a memory area of the processor, or may be stored in the storage device 64.
  • microprocessors such as a DSP (Digital Signal Processor) and a GPU (Graphics Processing Unit) can be used alone or in combination as well as the CPU. Further, these microprocessors may be realized by PLD (Programmable Logic Device) such as FPGA (Field Programmable Gate Array) and FPAA (Field Programmable Analog Array).
  • PLD Programmable Logic Device
  • FPGA Field Programmable Gate Array
  • FPAA Field Programmable Analog Array
  • the calculation unit 61 may have a main memory.
  • the main memory may include a volatile memory such as a RAM (Random Access Memory) and a nonvolatile memory such as a ROM (Read Only Memory).
  • the RAM provided in the main memory for example, a DRAM (Dynamic Random Access Memory) is used, and a memory space is virtually allocated and used as a work space of the calculation unit 61.
  • the operating system, application programs, program modules, program data, etc. stored in the storage device 64 are loaded into the RAM for execution. These data, programs, and program modules loaded in the RAM are directly accessed and operated by the arithmetic unit 61.
  • characteristic data for calculating the position and orientation of the electronic device 10 and the relative positional relationship of the respective housings from data input from the posture detection unit 83, the shape detection unit 84, the sensor module 88, and the like. Alternatively, it may be read from the storage device 64 as a lookup table and stored in the main memory.
  • BIOS Basic Input / Output System
  • firmware etc. that do not require rewriting can be stored in the ROM.
  • ROM mask ROM, OTPROM (One Time Programmable Read Only Memory), EPROM (Erasable Programmable Read Only Memory), etc. can be used.
  • EPROM include UV-EPROM (Ultra-Violet Erasable Programmable Read Only Memory), EEPROM (Electrically Erasable Programmable Read Only Memory), etc. that can erase stored data by ultraviolet irradiation.
  • a non-volatile storage device such as a flash memory, an MRAM (Magnetorescent Random Access Memory), a PRAM (Phase change RAM), a ReRAM (Resistive RAM), or a FeRAM (Ferroelectric RAM) is applied.
  • a storage device to which a volatile storage element such as DRAM (Dynamic Ram) or SRAM (Static RAM) is applied may be used.
  • a recording medium drive such as a hard disk drive (HDD) or a solid state drive (SSD) may be used.
  • a storage device such as an HDD or an SSD that can be detached from the connector via the external interface 85, or a media drive of a recording medium such as a flash memory, a Blu-ray disc, or a DVD can be used as the storage device 64.
  • the storage device 64 may be used as the storage device 64 without being incorporated in the electronic device 10 and placed outside the electronic device 10. In that case, a configuration may be employed in which data is connected via the external interface 85 or data is exchanged by the communication module 81 by wireless communication.
  • the touch panel 51, the touch panel 52, and the touch panel 53 are connected to a display controller 71 and a touch sensor controller 72, respectively.
  • the display controller 71 and the touch sensor controller 72 are each connected to the calculation unit 61 via the bus line 62.
  • the display controller 71 controls the touch panel 51, the touch panel 52, and the touch panel 53 in accordance with a drawing instruction input from the calculation unit 61 via the bus line 62 to display a predetermined image on these display surfaces.
  • the touch sensor controller 72 controls the touch sensors of the touch panel 51, the touch panel 52, and the touch panel 53 in response to a request from the calculation unit 61 via the bus line 62. In addition, a signal received by the touch sensor is output to the calculation unit 61 via the bus line 62. Note that the touch sensor controller 72 may have a function of calculating information on the touch position from the signal received by the touch sensor, or may be calculated by the calculation unit 61.
  • the touch panel 51, the touch panel 52, and the touch panel 53 can display an image based on a signal supplied from the display controller 71.
  • the touch panel 51, the touch panel 52, and the touch panel 53 detect that a detected object such as a finger or a stylus is approaching or touches based on a signal supplied from the touch sensor controller 72, and the position information is detected by the touch sensor. It can be output to the controller 72.
  • the touch panel 51, the touch panel 52, the touch panel 53, and the touch sensor controller 72 have a function of acquiring the distance in the height direction from the detection surface to the detected object. Moreover, it is preferable to have a function of acquiring the magnitude of pressure applied to the detection surface by the detection object. Moreover, it is preferable that the detected object has a function of acquiring the size of the surface in contact with the detection surface.
  • the touch panel 51, the touch panel 52, and the touch panel 53 can be configured such that a module including a touch sensor is provided on the display surface side of the display panel. At this time, it is preferable that at least a part of the module including the touch sensor has flexibility and can be bent along the display panel.
  • the module including the touch sensor and the display panel can be bonded with an adhesive or the like. Moreover, you may provide a polarizing plate and a buffer material (separator) between these.
  • the thickness of the module including the touch sensor is preferably equal to or less than the thickness of the display panel.
  • the touch panel 51, the touch panel 52, and the touch panel 53 may be a touch panel in which a display panel and a touch sensor are integrated.
  • a touch panel in which a display panel and a touch sensor are integrated.
  • an on-cell touch panel or an in-cell touch panel is preferable.
  • An on-cell or in-cell touch panel can be thin and lightweight. Further, the on-cell or in-cell touch panel can reduce the number of components, and thus can reduce costs.
  • various sensors that detect that a detection target such as a finger approaches or contacts can be applied.
  • a sensor to which a method such as a capacitance method, a resistance film method, a surface acoustic wave method, an infrared method, an electromagnetic induction method, or an optical method is applied can be used.
  • an optical sensor using a photoelectric conversion element, a pressure sensor using a pressure sensitive element, or the like may be used.
  • a capacitive touch sensor includes a pair of conductive layers.
  • a pair of conductive layers is capacitively coupled. Detection can be performed by utilizing the fact that the capacitance of the pair of conductive layers changes due to the object to be detected touching, pressing, or approaching the pair of conductive layers.
  • the capacitance method there are a surface capacitance method, a projection capacitance method, and the like.
  • the projected capacitance method there are a self-capacitance method, a mutual capacitance method, etc. mainly due to a difference in driving method.
  • the mutual capacitance method is preferable because simultaneous multipoint detection is easy.
  • a display panel that does not have a function as a touch sensor may be applied.
  • the flexible touch panel 51, the touch panel 52, the touch panel 53, the display panel, the touch sensor, and the like for example, flexible on a substrate that supports a display element, a circuit that drives the display element, a circuit that constitutes the touch sensor, or the like. This can be realized by using a substrate having a property. It is preferable to apply a flexible substrate to the touch panel 51, the touch panel 52, and the touch panel 53 because the electronic device 10 can be lightened.
  • An organic resin can be typically used as a flexible substrate material.
  • glass, metal, alloy, semiconductor, or the like thin enough to have flexibility can be used.
  • a composite material or a stacked material containing two or more of organic resin, glass, metal, alloy, semiconductor, and the like can be used.
  • the battery controller 73 can manage the charging state of the battery module 75.
  • the battery controller 73 supplies power from the battery module 75 to each component.
  • the power receiving unit 74 has a function of receiving power supplied from the outside and charging the battery module 75.
  • the battery controller 73 can control the operation of the power receiving unit 74 according to the state of charge of the battery module 75.
  • the battery module 75 includes, for example, one or more primary batteries and secondary batteries.
  • Examples of the secondary battery that can be used for the battery module 75 include a lithium ion secondary battery and a lithium ion polymer secondary battery.
  • the battery module 75 may be provided with a protection circuit that prevents overcharge and overdischarge of the battery.
  • an AC power source When used in a house or the like, an AC power source (AC) may be used as an external power source.
  • the battery module 75 that has a large charge / discharge capacity and enables the electronic device 10 to be used for a long time is desirable.
  • a charger that can supply power to the electronic device 10 may be used.
  • charging may be performed by a wired method using a USB (Universal Serial Bus) connector or an AC adapter, or by a wireless power feeding method such as an electric field coupling method, an electromagnetic induction method, an electromagnetic resonance (electromagnetic resonance coupling) method, or the like. It is good also as a structure which charges.
  • the battery controller 73 may have, for example, a battery management unit (BMU).
  • BMU collects battery cell voltage and cell temperature data, monitors overcharge and overdischarge, controls the cell balancer, manages battery deterioration, calculates remaining battery charge (State Of Charge: SOC), controls fault detection, etc. I do.
  • the battery controller 73 performs control for transmitting power from the battery module 75 to each component via a power supply line (not shown).
  • the battery controller 73 can be configured to include, for example, a multi-channel power converter, an inverter, a protection circuit, and the like.
  • the battery module 75 is preferably arranged so as to overlap the touch panel 52. At this time, in the case where the casing (here, the casing 12) in which the battery module 75 is incorporated is flexible and can be bent and used, at least a part of the battery module 75 is also used. It is preferable to have flexibility. Examples of secondary batteries applicable to the battery module 75 include lithium ion secondary batteries and lithium ion polymer secondary batteries. In order to give flexibility to these batteries, a laminate bag may be used for the battery outer container.
  • Films used in laminated bags are metal films (aluminum, stainless steel, nickel steel, etc.), plastic films made of organic materials, hybrid material films containing organic materials (organic resins, fibers, etc.) and inorganic materials (ceramics, etc.), carbon-containing
  • a single layer film selected from inorganic films (carbon film, graphite film, etc.) or a laminated film composed of a plurality of these is used.
  • a metal film is easy to emboss, and when the embossing is performed to form a concave portion or a convex portion, the surface area of the film that comes into contact with the outside air is increased, so that the heat dissipation effect is excellent.
  • the battery controller 73 has a low power consumption function.
  • a low power consumption function it is detected that there is no input for a certain period of time in the electronic device 10, and the clock frequency of the calculation unit 61 is reduced or clock input is stopped, the operation of the calculation unit 61 itself is stopped Examples include stopping the operation of the auxiliary memory and reducing power consumption by reducing power supplied to each component.
  • Such a function can be executed only by the battery controller 73 or in conjunction with the calculation unit 61.
  • the voice input unit 77 has, for example, a microphone and a voice input connector.
  • the audio output unit 78 includes, for example, a speaker and an audio output connector.
  • the audio input unit 77 and the audio output unit 78 are each connected to the sound controller 76 and connected to the arithmetic unit 61 via the bus line 62.
  • the sound data input to the sound input unit 77 is converted into a digital signal by the sound controller 76 and processed by the sound controller 76 and the calculation unit 61.
  • the sound controller 76 generates an analog audio signal audible to the user in response to a command from the calculation unit 61 and outputs the analog audio signal to the audio output unit 78.
  • An audio output connector such as an earphone, a headphone, or a headset can be connected to the audio output connector of the audio output unit 78, and audio generated by the sound controller 76 is output to the device.
  • the communication module 81 can communicate via the antenna 82.
  • a control signal for connecting the electronic device 10 to the computer network is controlled according to a command from the arithmetic unit 61, and the signal is transmitted to the computer network.
  • the Internet, intranet, extranet, PAN (Personal Area Network), LAN (Local Area Network), CAN (Campus Area Network), and MAN (MetroAporeNetwork) are the foundations of the World Wide Web (WWW).
  • Communication can be performed by connecting the electronic device 10 to a computer network such as Wide Area Network) or GAN (Global Area Network).
  • a plurality of antennas 82 may be provided depending on the communication method.
  • the communication module 81 may be provided with, for example, a high frequency circuit (RF circuit) to transmit and receive RF signals.
  • the high-frequency circuit is a circuit for mutually converting an electromagnetic signal and an electric signal in a frequency band determined by the legislation of each country and performing communication with other communication devices wirelessly using the electromagnetic signal. Several tens of kHz to several tens of GHz is generally used as a practical frequency band.
  • the high-frequency circuit connected to the antenna 82 includes a high-frequency circuit unit corresponding to a plurality of frequency bands, and the high-frequency circuit unit includes an amplifier (amplifier), a mixer, a filter, a DSP, an RF transceiver, and the like. Can do.
  • LTE Long Term Evolution
  • GSM Global System for Mobile Communication: registered trademark
  • EDGE Enhanced Data Rates for GSM Evolvement, CDMA Emulsion, CDMA Emulsion
  • Communication standards such as W-CDMA (registered trademark), or specifications standardized by IEEE such as Wi-Fi (registered trademark), Bluetooth (registered trademark), ZigBee (registered trademark) can be used.
  • the communication module 81 may have a function of connecting the electronic device 10 to a telephone line.
  • the communication module 81 controls a connection signal for connecting the electronic device 10 to the telephone line in accordance with a command from the arithmetic unit 61 and transmits the signal to the telephone line. To do.
  • the communication module 81 may include a tuner that generates video signals to be output to the touch panel 51, the touch panel 52, and the touch panel 53 from the broadcast radio wave received by the antenna 82.
  • the tuner can include a demodulation circuit, an A / D conversion circuit (analog-digital conversion circuit), a decoder circuit, and the like.
  • the demodulation circuit has a function of demodulating a signal input from the antenna 82.
  • the A-D conversion circuit has a function of converting the demodulated analog signal into a digital signal.
  • the decoder circuit has a function of decoding video data included in the digital signal and generating a signal to be transmitted to the display controller 71.
  • the decoder may have a configuration including a dividing circuit and a plurality of processors.
  • the dividing circuit has a function of dividing input video data spatially and temporally and outputting the divided data to each processor.
  • the plurality of processors decode the input video data and generate a signal to be transmitted to the display controller 71.
  • video data with an extremely large amount of information can be decoded.
  • the decoder circuit for decoding the compressed data has a processor having extremely high processing speed.
  • the decoder circuit preferably includes a plurality of processors capable of parallel processing of 4 or more, preferably 8 or more, more preferably 16 or more.
  • the decoder may include a circuit that separates a video signal included in the input signal and other signals (character information, program information, authentication information, and the like).
  • Broadcast radio waves that can be received by the antenna 82 include terrestrial waves or radio waves transmitted from satellites. Broadcast radio waves that can be received by the antenna 82 include analog broadcast, digital broadcast, etc., and video and audio, or audio-only broadcast. For example, broadcast radio waves transmitted in a specific frequency band in the UHF band (about 300 MHz to 3 GHz) or the VHF band (30 MHz to 300 MHz) can be received. In addition, for example, by using a plurality of data received in a plurality of frequency bands, the transfer rate can be increased and more information can be obtained. Thereby, an image having a resolution exceeding full high-definition can be displayed on the touch panel 51, the touch panel 52, and the touch panel 53. For example, an image having a resolution of 4K2K, 8K4K, 16K8K, or higher can be displayed.
  • the tuner may be configured to generate a signal to be transmitted to the display controller 71 using broadcast data transmitted by a data transmission technique via a computer network. At this time, when the signal to be received is a digital signal, the tuner may not include the demodulation circuit and the A-D conversion circuit.
  • the attitude detection unit 83 has a function of detecting the tilt and attitude of the electronic device 10.
  • an acceleration sensor an angular velocity sensor, a vibration sensor, a pressure sensor, a gyro sensor, or the like can be used. A combination of a plurality of these sensors may be used.
  • the shape detection unit 84 has a function of detecting two states, a state where the two housings are closed and a state where they are opened.
  • the shape detection unit 84 has a function of outputting the information to the calculation unit 61 via the bus line 62.
  • a physical switch that detects a closed state of the housing 11 and the housing 12 can be used.
  • a method of optically detecting the closed state and the open state of the two housings may be used.
  • a configuration may be adopted in which a light receiving element is arranged in one of two adjacent housings, and detection is performed using the fact that external light is shielded when these are closed.
  • a light receiving element is arranged on one surface of two adjacent housings, and a light source is arranged on the other surface, so that when the light receiving element is in a closed state or an open state, It is good also as a structure which detects using the light from which it enters, or it stops entering. At this time, it is preferable to use infrared rays as light from the light source because it is not visually recognized by the user.
  • the shape detection unit 84 may have a function of detecting a relative angle (position information) between the housing 11 and the housing 12 and outputting the information to the calculation unit 61 via the bus line 62. .
  • a configuration in which a sensor similar to the posture detection unit 83 is disposed in the housing 12 may be employed.
  • the calculation unit 61 detects the case 11 detected by the posture detection unit 83.
  • the relative positional relationship between the housing 11 and the housing 12 can be calculated from the information on the tilt and orientation and the information on the tilt and orientation of the housing 12.
  • the shape detection unit 84 may be configured to detect the relative position of the two housings connected by the hinge unit 31 by detecting the rotation angle of the hinge unit 31 exemplified in the above configuration example. . At this time, it can be set as the structure which detects the rotation angle with respect to each rotating shaft of the hinge part 31 mechanically, optically, magnetically, or electrically.
  • the configuration of the shape detection unit 84 is not limited to this, and any mechanical, electromagnetic, thermal, acoustic, chemical, or chemical can be used as long as the relative positional relationship between two adjacent cases can be detected. Various sensors to which an appropriate means is applied can be used.
  • Examples of the external interface 85 include one or more buttons and switches (also referred to as a housing switch) provided on the housing 11 or the housing 12, and an external port to which other input components can be connected.
  • the external interface 85 is connected to the calculation unit 61 via the bus line 62.
  • Case switches include a switch associated with power on / off, a volume control button, a camera shooting button, and the like.
  • the external port of the external interface 85 can be configured to be connected to an external device such as a computer or printer via a cable.
  • a typical example is a USB terminal.
  • the external port may include a LAN (Local Area Network) connection terminal, a digital broadcast reception terminal, a terminal for connecting an AC adapter, and the like.
  • a configuration may be provided in which a transceiver for optical communication using infrared rays, visible light, ultraviolet rays, or the like is provided.
  • the camera module 86 is connected to the calculation unit 61 via the bus line 62. For example, a still image or a moving image can be taken in conjunction with a switch provided on the housing being pressed or a touch operation on the touch panel 51, the touch panel 52, and the touch panel 53.
  • the camera module 86 may have a light source for photographing.
  • a lamp such as a xenon lamp, a light emitting element such as an LED or an organic EL, or the like can be used.
  • light emitted from the touch panel 51, the touch panel 52, and the touch panel 53 may be used as a light source for photographing. In that case, light of various colors as well as white light may be used as the light source for photographing. Good.
  • the vibration module 87 includes a vibration element that vibrates the electronic device 10 and a vibration controller that controls the vibration element.
  • a vibration element an element that can convert an electric signal or a magnetic signal into vibration, such as a vibration motor (eccentric motor), a resonance actuator, a magnetostrictive element, or a piezoelectric element, can be used.
  • the vibration module 87 can vibrate the electronic device 10 with various vibration patterns by controlling the vibration frequency, amplitude, period of vibration, and the like of the vibration element according to a command from the calculation unit 61. For example, vibration associated with the operation of a housing switch, vibration associated with activation of the electronic device 10, vibration associated with video or audio played by a video playback application, vibration associated with incoming e-mail
  • the vibration module 87 can generate vibrations of various vibration patterns based on operations executed in various applications such as vibrations linked to input operations to the touch panel 51, the touch panel 52, and the touch panel 53.
  • the sensor module 88 has a sensor unit and a sensor controller.
  • the sensor controller supplies power from the battery module 75 or the like to the sensor unit.
  • the sensor controller receives an input from the sensor unit, converts it into a control signal, and outputs the control signal to the arithmetic unit 61 via the bus line 62.
  • error management of the sensor unit may be performed, or calibration processing of the sensor unit may be performed.
  • the sensor controller may include a plurality of controllers that control the sensor unit.
  • the sensor module 88 includes, for example, force, displacement, position, velocity, acceleration, angular velocity, rotation speed, distance, light, liquid, magnetism, temperature, chemical substance, sound, time, hardness, electric field, current, voltage, power, radiation, It is good also as a structure provided with the various sensors which have the function to measure flow volume, humidity, inclination, a vibration, an odor, or infrared rays.
  • FIG. 9 shows an example of a configuration in which the battery module 75 and the power receiving unit 74 are arranged in the casing 12 in addition to the touch panel 52, and other components are collected in the casing 11.
  • the size of the battery module that can be arranged in the housing 12 can be increased, and the frequency of charging the electronic device 10 can be reduced.
  • another battery module may be arranged in the space in the housing 11.
  • a display panel or a touch panel constituting the display unit 24 may be provided in the housing 12. Further, a display panel or a touch panel constituting the display unit 25 may be provided in the housing 11 or the housing 12.
  • FIG 9 illustrates an example in which the touch panel 52, the power receiving unit 74, and the battery module 75 are provided in the housing 12, these may be provided in the housing 11, or the housing 11 and the housing. 12 may be provided in both. Similarly, each component provided in the housing 11 may be provided in the housing 12 or may be provided in both the housing 11 and the housing 12.
  • Display panel Examples of display panels that can be used for the display portion and the like of the electronic device of one embodiment of the present invention are described below.
  • the display panel exemplified below is a display panel that includes both a reflective liquid crystal element and a light-emitting element and can perform both transmission mode and reflection mode displays.
  • FIG. 10A is a block diagram illustrating an example of the structure of the display panel 200.
  • the display panel 200 includes a plurality of pixels 210 arranged in a matrix on the display portion 162.
  • the display panel 200 includes a circuit GD and a circuit SD.
  • a plurality of pixels 210 arranged in the direction R, and a plurality of wirings G1, a plurality of wirings G2, a plurality of wirings ANO, and a plurality of wirings CSCOM electrically connected to the circuit GD are provided.
  • a plurality of pixels 210 arranged in the direction C and a plurality of wirings S1 and a plurality of wirings S2 electrically connected to the circuit SD are provided.
  • the pixel 210 includes a reflective liquid crystal element and a light emitting element.
  • the liquid crystal element and the light-emitting element have portions that overlap each other.
  • FIG. 10B1 illustrates a configuration example of the conductive layer 111b included in the pixel 210.
  • the conductive layer 111b functions as a reflective electrode of the liquid crystal element in the pixel 210.
  • an opening 251 is provided in the conductive layer 111b.
  • the light-emitting element 160 located in a region overlapping with the conductive layer 111b is indicated by a broken line.
  • the light-emitting element 160 is disposed so as to overlap with the opening 251 included in the conductive layer 111b. Thereby, the light emitted from the light emitting element 160 is emitted to the display surface side through the opening 251.
  • the pixels 210 adjacent in the direction R are pixels corresponding to different colors.
  • the plurality of openings 251 may be provided at different positions on the conductive layer 111b so as not to be arranged in a straight line. preferable. Accordingly, the two adjacent light emitting elements 160 can be separated from each other, and a phenomenon (also referred to as crosstalk) in which light emitted from the light emitting elements 160 enters the colored layer of the adjacent pixel 210 can be suppressed. .
  • the two adjacent light emitting elements 160 can be arranged apart from each other, a high-definition display panel can be realized even when the EL layer of the light emitting element 160 is separately formed using a shadow mask or the like.
  • FIG. 10 (B2) an arrangement as shown in FIG. 10 (B2) may be used.
  • the display using the liquid crystal element becomes dark.
  • the display using the light emitting element 160 becomes dark.
  • the area of the opening 251 provided in the conductive layer 111b functioning as a reflective electrode is too small, the efficiency of light that can be extracted from the light emitted from the light emitting element 160 is lowered.
  • the shape of the opening 251 can be, for example, a polygon, a rectangle, an ellipse, a circle, a cross, or the like. Moreover, it is good also as an elongated streak shape, a slit shape, and a checkered shape. Further, the opening 251 may be arranged close to adjacent pixels. Preferably, the opening 251 is arranged close to other pixels that display the same color. Thereby, crosstalk can be suppressed.
  • FIG. 11 is a circuit diagram illustrating a configuration example of the pixel 210. In FIG. 11, two adjacent pixels 210 are shown.
  • the pixel 210 includes a switch SW1, a capacitor element C1, a liquid crystal element 140, a switch SW2, a transistor M, a capacitor element C2, a light emitting element 160, and the like.
  • a wiring G1, a wiring G2, a wiring ANO, a wiring CSCOM, a wiring S1, and a wiring S2 are electrically connected to the pixel 210.
  • a wiring VCOM1 electrically connected to the liquid crystal element 140 and a wiring VCOM2 electrically connected to the light emitting element 160 are illustrated.
  • FIG. 11 shows an example in which transistors are used for the switch SW1 and the switch SW2.
  • the switch SW1 has a gate connected to the wiring G1, a source or drain connected to the wiring S1, and the other source or drain connected to one electrode of the capacitor C1 and one electrode of the liquid crystal element 140. Yes.
  • the other electrode of the capacitor C1 is connected to the wiring CSCOM.
  • the other electrode of the liquid crystal element 140 is connected to the wiring VCOM1.
  • the switch SW2 has a gate connected to the wiring G2, one of the source and the drain connected to the wiring S2, and the other of the source and the drain connected to one electrode of the capacitor C2 and the gate of the transistor M.
  • the other electrode of the capacitor C2 is connected to one of the source and the drain of the transistor M and the wiring ANO.
  • the transistor M the other of the source and the drain is connected to one electrode of the light emitting element 160.
  • the other electrode of the light emitting element 160 is connected to the wiring VCOM2.
  • FIG. 11 shows an example in which the transistor M has two gates sandwiching a semiconductor and these are connected. As a result, the current that can be passed by the transistor M can be increased.
  • electrical_connection state or a non-conduction state can be given to wiring G1.
  • a predetermined potential can be applied to the wiring VCOM1.
  • a signal for controlling the alignment state of the liquid crystal included in the liquid crystal element 140 can be supplied to the wiring S1.
  • a predetermined potential can be applied to the wiring CSCOM.
  • electrical_connection state or a non-conduction state can be given to wiring G2.
  • the wiring VCOM2 and the wiring ANO can each be supplied with a potential at which a potential difference generated by the light emitting element 160 emits light.
  • a signal for controlling the conduction state of the transistor M can be supplied to the wiring S2.
  • the pixel 210 illustrated in FIG. 11 is driven by a signal applied to the wiring G1 and the wiring S1, and can display using optical modulation by the liquid crystal element 140.
  • display can be performed by driving the light-emitting element 160 to emit light by driving the signals to the wiring G2 and the wiring S2.
  • the driving can be performed by signals given to the wiring G1, the wiring G2, the wiring S1, and the wiring S2.
  • FIG. 11 illustrates an example in which one pixel 210 includes one liquid crystal element 140 and one light emitting element 160
  • the present invention is not limited thereto.
  • FIG. 12 illustrates an example in which one pixel 210 includes one liquid crystal element 140 and four light emitting elements 160.
  • a pixel 210 illustrated in FIG. 12 is a pixel capable of full color display with one pixel, unlike FIG.
  • a wiring G3 and a wiring S3 are connected to the pixel 210.
  • the four light emitting elements 160 can be light emitting elements that exhibit red (R), green (G), blue (B), and white (W), respectively.
  • the liquid crystal element 140 a reflective liquid crystal element exhibiting white can be used. Thereby, when displaying in reflection mode, white display with high reflectance can be performed. In addition, when display is performed in the transmissive mode, display with high color rendering properties can be performed with low power.
  • FIG. 13 is a schematic perspective view of the display panel 100 of one embodiment of the present invention.
  • the display panel 100 has a configuration in which a substrate 151 and a substrate 161 are bonded to each other.
  • the substrate 161 is clearly indicated by a broken line.
  • the display panel 100 includes a display unit 162, a circuit 164, a wiring 165, and the like.
  • the substrate 151 is provided with, for example, a circuit 164, a wiring 165, a conductive layer 111b that functions as a pixel electrode, and the like.
  • FIG. 13 shows an example in which an IC 173 and an FPC 172 are mounted on a substrate 151. Therefore, the structure illustrated in FIG. 13 can be said to be a display module including the display panel 100, the FPC 172, and the IC 173.
  • circuit 164 for example, a circuit that functions as a scanning line driver circuit can be used.
  • the wiring 165 has a function of supplying signals and power to the display unit and the circuit 164.
  • the signal and power are input to the wiring 165 from the outside or the IC 173 through the FPC 172.
  • FIG. 13 shows an example in which the IC 173 is provided on the substrate 151 by a COG (Chip On Glass) method or the like.
  • the IC 173 for example, an IC having a function as a scan line driver circuit, a signal line driver circuit, or the like can be used.
  • the display panel 100 includes a circuit that functions as a scanning line driver circuit and a signal line driver circuit, or a circuit that functions as a scanning line driver circuit or a signal line driver circuit is provided outside, the display panel 100 is driven via the FPC 172. In the case of inputting a signal for doing so, the IC 173 may be omitted. Further, the IC 173 may be mounted on the FPC 172 by a COF (Chip On Film) method or the like.
  • COF Chip On Film
  • FIG. 13 shows an enlarged view of a part of the display unit 162.
  • conductive layers 111b included in the plurality of display elements are arranged in a matrix.
  • the conductive layer 111b has a function of reflecting visible light, and functions as a reflective electrode of the liquid crystal element 140 described later.
  • the conductive layer 111b has an opening. Further, the light-emitting element 160 is provided on the substrate 151 side with respect to the conductive layer 111b. Light from the light-emitting element 160 is emitted to the substrate 161 side through the opening of the conductive layer 111b.
  • FIG. 14 illustrates an example of a cross section of the display panel illustrated in FIG. 13 when a part of the region including the FPC 172, a part of the region including the circuit 164, and a part of the region including the display portion 162 are cut. Show.
  • the display panel has an insulating layer 220 between the substrate 151 and the substrate 161.
  • the light-emitting element 160, the transistor 201, the transistor 205, the transistor 206, the coloring layer 134, and the like are provided between the substrate 151 and the insulating layer 220.
  • the liquid crystal element 140, the coloring layer 131, and the like are provided between the insulating layer 220 and the substrate 161.
  • the substrate 161 and the insulating layer 220 are bonded through an adhesive layer 141, and the substrate 151 and the insulating layer 220 are bonded through an adhesive layer 142.
  • the transistor 206 is electrically connected to the liquid crystal element 140, and the transistor 205 is electrically connected to the light emitting element 160. Since both the transistor 205 and the transistor 206 are formed over the surface of the insulating layer 220 on the substrate 151 side, they can be manufactured using the same process.
  • the substrate 161 is provided with a colored layer 131, a light shielding layer 132, an insulating layer 121, a conductive layer 113 functioning as a common electrode of the liquid crystal element 140, an alignment film 133b, an insulating layer 117, and the like.
  • the insulating layer 117 functions as a spacer for maintaining the cell gap of the liquid crystal element 140.
  • the insulating layer 220 is provided with insulating layers such as an insulating layer 211, an insulating layer 212, an insulating layer 213, an insulating layer 214, and an insulating layer 215 on the substrate 151 side.
  • a part of the insulating layer 211 functions as a gate insulating layer of each transistor.
  • the insulating layer 212, the insulating layer 213, and the insulating layer 214 are provided so as to cover each transistor.
  • An insulating layer 215 is provided to cover the insulating layer 214.
  • the insulating layer 214 and the insulating layer 215 function as a planarization layer.
  • the insulating layer covering the transistor and the like has three layers of the insulating layer 212, the insulating layer 213, and the insulating layer 214 is described here, the number of layers is not limited to this, and four or more layers may be used. It may be a layer or two layers.
  • the insulating layer 214 functioning as a planarization layer is not necessarily provided if not necessary.
  • the transistor 201, the transistor 205, and the transistor 206 each include a conductive layer 221 that partially functions as a gate, a conductive layer 222 that partially functions as a source or a drain, and a semiconductor layer 231.
  • the same hatching pattern is given to a plurality of layers obtained by processing the same conductive film.
  • the liquid crystal element 140 is a reflective liquid crystal element.
  • the liquid crystal element 140 has a stacked structure in which a conductive layer 111a, a liquid crystal 112, and a conductive layer 113 are stacked.
  • a conductive layer 111b that reflects visible light is provided in contact with the conductive layer 111a on the substrate 151 side.
  • the conductive layer 111 b has an opening 251.
  • the conductive layer 111a and the conductive layer 113 include a material that transmits visible light.
  • An alignment film 133 a is provided between the liquid crystal 112 and the conductive layer 111 a, and an alignment film 133 b is provided between the liquid crystal 112 and the conductive layer 113.
  • a polarizing plate 130 is provided on the outer surface of the substrate 161.
  • the conductive layer 111b has a function of reflecting visible light
  • the conductive layer 113 has a function of transmitting visible light.
  • Light incident from the substrate 161 side is polarized by the polarizing plate 130, passes through the conductive layer 113 and the liquid crystal 112, and is reflected by the conductive layer 111b. Then, the light passes through the liquid crystal 112 and the conductive layer 113 again and reaches the polarizing plate 130.
  • alignment of liquid crystal can be controlled by a voltage applied between the conductive layer 111b and the conductive layer 113, and optical modulation of light can be controlled. That is, the intensity of light emitted through the polarizing plate 130 can be controlled.
  • light that is not in a specific wavelength region is absorbed by the colored layer 131, so that the extracted light is, for example, red light.
  • the light emitting element 160 is a bottom emission type light emitting element.
  • the light-emitting element 160 has a stacked structure in which a conductive layer 191, an EL layer 192, and a conductive layer 193b are stacked in this order from the insulating layer 220 side.
  • a conductive layer 193a is provided to cover the conductive layer 193b.
  • the conductive layer 193b includes a material that reflects visible light
  • the conductive layer 191 and the conductive layer 193a include a material that transmits visible light. Light emitted from the light-emitting element 160 is emitted to the substrate 161 side through the coloring layer 134, the insulating layer 220, the opening 251, the conductive layer 113, and the like.
  • the opening 251 is preferably provided with a conductive layer 111a that transmits visible light. Accordingly, since the liquid crystal 112 is aligned in the region overlapping with the opening 251 similarly to the other regions, alignment failure of the liquid crystal occurs at the boundary portion between these regions, and unintended light leakage can be suppressed.
  • a linear polarizing plate may be used as the polarizing plate 130 disposed on the outer surface of the substrate 161, but a circular polarizing plate may also be used.
  • a circularly-polarizing plate what laminated
  • a desired contrast may be realized by adjusting a cell gap, an alignment, a driving voltage, and the like of the liquid crystal element used for the liquid crystal element 140 according to the type of the polarizing plate.
  • An insulating layer 217 is provided over the insulating layer 216 that covers the end portion of the conductive layer 191.
  • the insulating layer 217 has a function as a spacer for suppressing the insulating layer 220 and the substrate 151 from approaching more than necessary.
  • the EL layer 192 and the conductive layer 193a may have a function of suppressing contact of the shielding mask with a formation surface. Note that the insulating layer 217 is not necessarily provided if not necessary.
  • One of the source and the drain of the transistor 205 is electrically connected to the conductive layer 191 of the light-emitting element 160 through the conductive layer 224.
  • connection portion 207 is a portion that connects the conductive layers provided on both surfaces of the insulating layer 220 through openings provided in the insulating layer 220.
  • a connecting portion 204 is provided in a region where the substrate 151 and the substrate 161 do not overlap.
  • the connection portion 204 is electrically connected to the FPC 172 through the connection layer 242.
  • the connection unit 204 has the same configuration as the connection unit 207.
  • a conductive layer obtained by processing the same conductive film as the conductive layer 111a is exposed on the upper surface of the connection portion 204. Accordingly, the connection unit 204 and the FPC 172 can be electrically connected via the connection layer 242.
  • connection part 252 is provided in the one part area
  • a conductive layer obtained by processing the same conductive film as the conductive layer 111 a and a part of the conductive layer 113 are electrically connected to each other by a connection body 243. Therefore, a signal or a potential input from the FPC 172 connected to the substrate 151 side can be supplied to the conductive layer 113 formed on the substrate 161 side through the connection portion 252.
  • connection body 243 for example, conductive particles can be used.
  • conductive particles those obtained by coating the surface of particles such as organic resin or silica with a metal material can be used. It is preferable to use nickel or gold as the metal material because the contact resistance can be reduced. In addition, it is preferable to use particles in which two or more kinds of metal materials are coated in layers, such as further coating nickel with gold. Further, it is preferable to use a material that is elastically deformed or plastically deformed as the connection body 243.
  • the connection body 243 which is a conductive particle, may have a shape crushed in the vertical direction as shown in FIG. By doing so, the contact area between the connection body 243 and the conductive layer electrically connected to the connection body 243 can be increased, the contact resistance can be reduced, and the occurrence of problems such as connection failure can be suppressed.
  • connection body 243 is preferably disposed so as to be covered with the adhesive layer 141.
  • connection body 243 may be dispersed in the adhesive layer 141 before curing.
  • FIG. 14 shows an example in which a transistor 201 is provided as an example of the circuit 164.
  • FIG. 14 as an example of the transistor 201 and the transistor 205, a configuration in which a semiconductor layer 231 in which a channel is formed is sandwiched between two gates is applied.
  • One gate is formed of a conductive layer 221, and the other gate is formed of a conductive layer 223 that overlaps with the semiconductor layer 231 with an insulating layer 212 interposed therebetween.
  • the threshold voltage of the transistor can be controlled.
  • the transistor may be driven by connecting two gates and supplying the same signal thereto.
  • Such a transistor can have higher field-effect mobility than other transistors, and can increase on-state current.
  • a circuit that can be driven at high speed can be manufactured.
  • the area occupied by the circuit portion can be reduced.
  • the transistor included in the circuit 164 and the transistor included in the display portion 162 may have the same structure.
  • the plurality of transistors included in the circuit 164 may have the same structure or may be combined with different structures.
  • the plurality of transistors included in the display portion 162 may have the same structure or may be combined with different structures.
  • At least one of the insulating layer 212 and the insulating layer 213 that covers each transistor is preferably made of a material in which impurities such as water and hydrogen hardly diffuse. That is, the insulating layer 212 or the insulating layer 213 can function as a barrier film. With such a structure, it is possible to effectively prevent impurities from diffusing from the outside to the transistor, and a highly reliable display panel can be realized.
  • an insulating layer 121 is provided so as to cover the colored layer 131 and the light shielding layer 132.
  • the insulating layer 121 may function as a planarization layer. Since the surface of the conductive layer 113 can be substantially flattened by the insulating layer 121, the alignment state of the liquid crystal 112 can be made uniform.
  • the conductive layer 111a, the conductive layer 111b, and the insulating layer 220 are formed in this order over a supporting substrate having a separation layer, and after that, the transistor 205, the transistor 206, the light-emitting element 160, and the like are formed, and then the substrate is formed using the adhesive layer 142. 151 and a support substrate are bonded together. Thereafter, the supporting substrate and the peeling layer are removed by peeling at the interfaces of the peeling layer and the insulating layer 220 and between the peeling layer and the conductive layer 111a.
  • a substrate 161 on which a colored layer 131, a light shielding layer 132, a conductive layer 113, and the like are formed in advance is prepared. Then, the liquid crystal 112 is dropped on the substrate 151 or the substrate 161, and the substrate 151 and the substrate 161 are bonded to each other with the adhesive layer 141, whereby the display panel 100 can be manufactured.
  • a material that causes peeling at the interface between the insulating layer 220 and the conductive layer 111a can be appropriately selected.
  • a layer containing a refractory metal material such as tungsten and a layer containing an oxide of the metal material are stacked as the peeling layer, and silicon nitride, silicon oxynitride, or silicon nitride oxide is used as the insulating layer 220 over the peeling layer. It is preferable to use a layer in which a plurality of such layers are stacked.
  • a refractory metal material is used for the separation layer, the formation temperature of a layer formed later can be increased, the impurity concentration is reduced, and a highly reliable display panel can be realized.
  • an oxide or a nitride such as a metal oxide, a metal nitride, or a low-resistance oxide semiconductor is preferably used.
  • an oxide semiconductor a material in which at least one of the concentration of hydrogen, boron, phosphorus, nitrogen, and other impurities, and the amount of oxygen vacancies is higher than that of a semiconductor layer used in a transistor is used. Can be used.
  • a substrate having a flat surface can be used for the substrate included in the display panel.
  • a material that transmits the light is used for the substrate from which light from the display element is extracted.
  • materials such as glass, quartz, ceramic, sapphire, and organic resin can be used.
  • the display panel can be reduced in weight and thickness. Furthermore, a flexible display panel can be realized by using a flexible substrate.
  • the substrate on the side from which light emission is not extracted does not have to be translucent, a metal substrate or the like can be used in addition to the above-described substrates.
  • a metal substrate is preferable because it has high thermal conductivity and can easily conduct heat to the entire substrate, which can suppress a local temperature increase of the display panel.
  • the thickness of the metal substrate is preferably 10 ⁇ m to 200 ⁇ m, and more preferably 20 ⁇ m to 50 ⁇ m.
  • the material constituting the metal substrate is not particularly limited, and for example, a metal such as aluminum, copper, or nickel, an aluminum alloy, an alloy such as stainless steel, or the like can be preferably used.
  • a substrate that has been subjected to insulation treatment by oxidizing the surface of the metal substrate or forming an insulating film on the surface may be used.
  • the insulating film may be formed by using a coating method such as a spin coating method or a dip method, an electrodeposition method, a vapor deposition method, or a sputtering method, or it is left in an oxygen atmosphere or heated, or an anodic oxidation method.
  • a coating method such as a spin coating method or a dip method, an electrodeposition method, a vapor deposition method, or a sputtering method, or it is left in an oxygen atmosphere or heated, or an anodic oxidation method.
  • an oxide film may be formed on the surface of the substrate.
  • Examples of the material having flexibility and transparency to visible light include, for example, glass having a thickness having flexibility, polyester resins such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN), and polyacrylonitrile resin. , Polyimide resin, polymethyl methacrylate resin, polycarbonate (PC) resin, polyethersulfone (PES) resin, polyamide resin, cycloolefin resin, polystyrene resin, polyamideimide resin, polyvinyl chloride resin, polytetrafluoroethylene (PTFE) resin Etc.
  • a material having a low thermal expansion coefficient is preferably used.
  • a polyamideimide resin, a polyimide resin, PET, or the like having a thermal expansion coefficient of 30 ⁇ 10 ⁇ 6 / K or less can be suitably used.
  • a substrate in which glass fiber is impregnated with an organic resin, or a substrate in which an inorganic filler is mixed with an organic resin to reduce the thermal expansion coefficient can be used. Since a substrate using such a material is light in weight, a display panel using the substrate can be lightweight.
  • the fibrous body uses high strength fibers of an organic compound or an inorganic compound.
  • the high-strength fiber specifically refers to a fiber having a high tensile modulus or Young's modulus, and representative examples include polyvinyl alcohol fiber, polyester fiber, polyamide fiber, polyethylene fiber, aramid fiber, Examples include polyparaphenylene benzobisoxazole fibers, glass fibers, and carbon fibers.
  • the glass fiber include glass fibers using E glass, S glass, D glass, Q glass, and the like.
  • a structure obtained by impregnating the fiber body with a resin and curing the resin may be used as a flexible substrate.
  • a structure made of a fibrous body and a resin is used as the flexible substrate, it is preferable because reliability against breakage due to bending or local pressing is improved.
  • glass or metal that is thin enough to be flexible can be used for the substrate.
  • a composite material in which glass and a resin material are bonded to each other with an adhesive layer may be used.
  • a hard coat layer for example, silicon nitride, aluminum oxide
  • a layer of a material that can disperse the pressure for example, aramid resin
  • an insulating film with low water permeability may be stacked over a flexible substrate.
  • an inorganic insulating material such as silicon nitride, silicon oxynitride, silicon nitride oxide, aluminum oxide, or aluminum nitride can be used.
  • the substrate can be used by laminating a plurality of layers.
  • the barrier property against water and oxygen can be improved and a highly reliable display panel can be obtained.
  • the transistor includes a conductive layer that functions as a gate electrode, a semiconductor layer, a conductive layer that functions as a source electrode, a conductive layer that functions as a drain electrode, and an insulating layer that functions as a gate insulating layer.
  • the above shows the case where a bottom-gate transistor is applied.
  • the structure of the transistor included in the display device of one embodiment of the present invention there is no particular limitation on the structure of the transistor included in the display device of one embodiment of the present invention.
  • a planar transistor, a staggered transistor, or an inverted staggered transistor may be used.
  • a top-gate or bottom-gate transistor structure may be employed.
  • gate electrodes may be provided above and below the channel.
  • crystallinity of a semiconductor material used for the transistor there is no particular limitation on the crystallinity of a semiconductor material used for the transistor, and any of an amorphous semiconductor and a semiconductor having crystallinity (a microcrystalline semiconductor, a polycrystalline semiconductor, a single crystal semiconductor, or a semiconductor partially including a crystal region) is used. May be used. It is preferable to use a crystalline semiconductor because deterioration of transistor characteristics can be suppressed.
  • a semiconductor material used for the transistor for example, a group 14 element (silicon, germanium, or the like), a compound semiconductor, or an oxide semiconductor can be used for the semiconductor layer.
  • a semiconductor containing silicon, a semiconductor containing gallium arsenide, an oxide semiconductor containing indium, or the like can be used.
  • the semiconductor layer has a plurality of crystal parts, and the crystal part has a c-axis oriented substantially perpendicular to the formation surface of the semiconductor layer or the top surface of the semiconductor layer, and there is no grain between adjacent crystal parts. It is preferable to use an oxide semiconductor whose boundary cannot be confirmed.
  • Such an oxide semiconductor does not have a crystal grain boundary, cracks in the oxide semiconductor film due to stress when the display panel is bent is suppressed. Therefore, such an oxide semiconductor can be favorably used for a display panel which is flexible and curved.
  • a transistor including an oxide semiconductor having a band gap larger than that of silicon can hold charge accumulated in a capacitor connected in series with the transistor for a long time because of the low off-state current. .
  • the driving circuit can be stopped while maintaining the gradation of each pixel. As a result, a display device with extremely reduced power consumption can be realized.
  • the semiconductor layer is represented by an In-M-Zn-based oxide containing at least indium, zinc, and M (metal such as aluminum, titanium, gallium, germanium, yttrium, zirconium, lanthanum, cerium, tin, neodymium, or hafnium). It is preferable to include a film. In addition, in order to reduce variation in electrical characteristics of the transistor including the oxide semiconductor, a stabilizer is preferably included together with the transistor.
  • Examples of the stabilizer include the metals described in M above, and examples include gallium, tin, hafnium, aluminum, and zirconium.
  • Other stabilizers include lanthanoids such as lanthanum, cerium, praseodymium, neodymium, samarium, europium, gadolinium, terbium, dysprosium, holmium, erbium, thulium, ytterbium, and lutetium.
  • an oxide semiconductor included in the semiconductor layer for example, an In—Ga—Zn-based oxide, an In—Al—Zn-based oxide, an In—Sn—Zn-based oxide, an In—Hf—Zn-based oxide, an In— La-Zn oxide, In-Ce-Zn oxide, In-Pr-Zn oxide, In-Nd-Zn oxide, In-Sm-Zn oxide, In-Eu-Zn oxide In-Gd-Zn-based oxide, In-Tb-Zn-based oxide, In-Dy-Zn-based oxide, In-Ho-Zn-based oxide, In-Er-Zn-based oxide, In-Tm -Zn oxide, In-Yb-Zn oxide, In-Lu-Zn oxide, In-Sn-Ga-Zn oxide, In-Hf-Ga-Zn oxide, In-Al- Ga-Zn-based oxide, In-Sn-Al-Zn-based oxide, In-Sn-Hf-Zn
  • the In—Ga—Zn-based oxide means an oxide containing In, Ga, and Zn as main components, and the ratio of In, Ga, and Zn is not limited. Moreover, metal elements other than In, Ga, and Zn may be contained.
  • the semiconductor layer and the conductive layer may have the same metal element among the above oxides.
  • Manufacturing costs can be reduced by using the same metal element for the semiconductor layer and the conductive layer.
  • the manufacturing cost can be reduced by using metal oxide targets having the same metal composition.
  • an etching gas or an etching solution for processing the semiconductor layer and the conductive layer can be used in common.
  • the semiconductor layer and the conductive layer may have different compositions even if they have the same metal element. For example, a metal element in a film may be detached during a manufacturing process of a transistor and a capacitor to have a different metal composition.
  • the oxide semiconductor constituting the semiconductor layer preferably has an energy gap of 2 eV or more, preferably 2.5 eV or more, more preferably 3 eV or more. In this manner, off-state current of a transistor can be reduced by using an oxide semiconductor with a wide energy gap.
  • the oxide semiconductor included in the semiconductor layer is an In-M-Zn oxide
  • the atomic ratio of the metal elements of the sputtering target used for forming the In-M-Zn oxide is In ⁇ M, Zn ⁇ It is preferable to satisfy M.
  • the atomic ratio of the semiconductor layer to be formed includes a variation of plus or minus 40% of the atomic ratio of the metal element contained in the sputtering target as an error.
  • the semiconductor layer an oxide semiconductor film with low carrier density is used.
  • the semiconductor layer has a carrier density of 1 ⁇ 10 17 / cm 3 or less, preferably 1 ⁇ 10 15 / cm 3 or less, more preferably 1 ⁇ 10 13 / cm 3 or less, more preferably 1 ⁇ 10 11 / cm 3. 3 or less, more preferably less than 1 ⁇ 10 10 / cm 3 , and an oxide semiconductor of 1 ⁇ 10 ⁇ 9 / cm 3 or more can be used.
  • Such an oxide semiconductor is referred to as a highly purified intrinsic or substantially highly purified intrinsic oxide semiconductor. Accordingly, it can be said that the oxide semiconductor has stable characteristics because the impurity concentration is low and the density of defect states is low.
  • a transistor having an appropriate composition may be used depending on required semiconductor characteristics and electrical characteristics (such as field-effect mobility and threshold voltage) of a transistor.
  • the semiconductor layer in order to obtain the required semiconductor characteristics of the transistor, it is preferable that the semiconductor layer have appropriate carrier density, impurity concentration, defect density, atomic ratio of metal element to oxygen, interatomic distance, density, and the like. .
  • the concentration of silicon or carbon in the semiconductor layer is 2 ⁇ 10 18 atoms / cm 3 or less, preferably 2 ⁇ 10 17 atoms / cm 3 or less.
  • the concentration of alkali metal or alkaline earth metal obtained by secondary ion mass spectrometry in the semiconductor layer is set to 1 ⁇ 10 18 atoms / cm 3 or less, preferably 2 ⁇ 10 16 atoms / cm 3 or less.
  • the nitrogen concentration obtained by secondary ion mass spectrometry in the semiconductor layer is 5 ⁇ 10 18 atoms / cm 3 or less.
  • the semiconductor layer may have a non-single crystal structure, for example.
  • the non-single crystal structure is, for example, a CAAC-OS (C-Axis Aligned Crystalline Oxide Semiconductor, C-Axis Aligned and A-B-Plane Annealed Crystalline Oxide Crystal Structure, Amorphous Crystal Structure, Amorphous Crystal Structure, or Amorphous Crystal Structure). Includes structure.
  • the amorphous structure has the highest density of defect states
  • the CAAC-OS has the lowest density of defect states.
  • An amorphous oxide semiconductor film has, for example, disordered atomic arrangement and no crystal component.
  • an amorphous oxide film has, for example, a completely amorphous structure and does not have a crystal part.
  • the semiconductor layer may be a mixed film including two or more of an amorphous structure region, a microcrystalline structure region, a polycrystalline structure region, a CAAC-OS region, and a single crystal structure region.
  • the mixed film may have a single-layer structure or a stacked structure including any two or more of the above-described regions.
  • silicon is preferably used for a semiconductor in which a transistor channel is formed.
  • amorphous silicon may be used as silicon, it is particularly preferable to use silicon having crystallinity.
  • microcrystalline silicon, polycrystalline silicon, single crystal silicon, or the like is preferably used.
  • polycrystalline silicon can be formed at a lower temperature than single crystal silicon, and has higher field effect mobility and higher reliability than amorphous silicon.
  • the bottom-gate transistor exemplified in this embodiment is preferable because the number of manufacturing steps can be reduced.
  • amorphous silicon can be used at a lower temperature than polycrystalline silicon, it is possible to use a material having low heat resistance as a material for wiring, electrodes, and substrates below the semiconductor layer. Can widen the choice of materials. For example, a glass substrate having an extremely large area can be suitably used.
  • a top-gate transistor is preferable because an impurity region can be easily formed in a self-aligned manner and variation in characteristics can be reduced. At this time, it is particularly suitable when polycrystalline silicon, single crystal silicon or the like is used.
  • Conductive layer In addition to the gate, source, and drain of a transistor, materials that can be used for conductive layers such as various wirings and electrodes that constitute a display device include aluminum, titanium, chromium, nickel, copper, yttrium, zirconium, molybdenum, silver, A metal such as tantalum or tungsten, or an alloy containing the same as a main component can be given. A film containing any of these materials can be used as a single layer or a stacked structure.
  • Two-layer structure to stack, two-layer structure to stack copper film on titanium film, two-layer structure to stack copper film on tungsten film, titanium film or titanium nitride film, and aluminum film or copper film on top of it A three-layer structure for forming a titanium film or a titanium nitride film thereon, a molybdenum film or a molybdenum nitride film, and an aluminum film or a copper film stacked thereon, and a molybdenum film or a There is a three-layer structure for forming a molybdenum nitride film.
  • an oxide such as indium oxide, tin oxide, or zinc oxide may be used. Further, it is
  • conductive oxide such as indium oxide, indium tin oxide, indium zinc oxide, zinc oxide, zinc oxide to which gallium is added, or graphene
  • a metal material such as gold, silver, platinum, magnesium, nickel, tungsten, chromium, molybdenum, iron, cobalt, copper, palladium, or titanium, or an alloy material containing the metal material
  • a nitride eg, titanium nitride
  • a metal material or an alloy material (or a nitride thereof) it may be thin enough to have a light-transmitting property.
  • a stacked film of the above materials can be used as a conductive layer.
  • a laminated film of an alloy of silver and magnesium and indium tin oxide because the conductivity can be increased.
  • conductive layers such as various wirings and electrodes constituting the display device and conductive layers (conductive layers functioning as pixel electrodes and common electrodes) included in the display element.
  • Insulating materials that can be used for each insulating layer include, for example, resins such as acrylic and epoxy, resins having a siloxane bond, and inorganic insulation such as silicon oxide, silicon oxynitride, silicon nitride oxide, silicon nitride, and aluminum oxide. Materials can also be used.
  • the light-emitting element is preferably provided between a pair of insulating films with low water permeability. Thereby, impurities such as water can be prevented from entering the light emitting element, and a decrease in reliability of the apparatus can be suppressed.
  • the low water-permeable insulating film examples include a film containing nitrogen and silicon such as a silicon nitride film and a silicon nitride oxide film, and a film containing nitrogen and aluminum such as an aluminum nitride film.
  • a silicon oxide film, a silicon oxynitride film, an aluminum oxide film, or the like may be used.
  • the water vapor transmission rate of an insulating film with low water permeability is 1 ⁇ 10 ⁇ 5 [g / (m 2 ⁇ day)] or less, preferably 1 ⁇ 10 ⁇ 6 [g / (m 2 ⁇ day)] or less, More preferably, it is 1 ⁇ 10 ⁇ 7 [g / (m 2 ⁇ day)] or less, and further preferably 1 ⁇ 10 ⁇ 8 [g / (m 2 ⁇ day)] or less.
  • liquid crystal element for example, a liquid crystal element to which a vertical alignment (VA: Vertical Alignment) mode is applied can be used.
  • VA Vertical Alignment
  • MVA Multi-Domain Vertical Alignment
  • PVA Power Planed Vertical Alignment
  • ASV Advanced Super View
  • liquid crystal elements to which various modes are applied can be used as the liquid crystal elements.
  • VA mode Transmission Nematic
  • IPS In-Plane-Switching
  • FFS Ringe Field Switching
  • ASM Analy Symmetrical Aligned Micro-cell
  • FLC Ferroelectric Liquid Crystal
  • AFLC Antiferroelectric Liquid Crystal
  • the liquid crystal element is an element that controls transmission or non-transmission of light by an optical modulation action of liquid crystal.
  • the optical modulation action of the liquid crystal is controlled by an electric field applied to the liquid crystal (including a horizontal electric field, a vertical electric field, or an oblique electric field).
  • a thermotropic liquid crystal a low molecular liquid crystal, a polymer liquid crystal, a polymer dispersed liquid crystal (PDLC), a ferroelectric liquid crystal, an antiferroelectric liquid crystal, or the like is used.
  • PDLC polymer dispersed liquid crystal
  • ferroelectric liquid crystal an antiferroelectric liquid crystal, or the like
  • These liquid crystal materials exhibit a cholesteric phase, a smectic phase, a cubic phase, a chiral nematic phase, an isotropic phase, and the like depending on conditions.
  • liquid crystal material either a positive type liquid crystal or a negative type liquid crystal may be used, and an optimal liquid crystal material may be used according to the mode and design to be applied.
  • an alignment film can be provided to control the alignment of the liquid crystal.
  • liquid crystal exhibiting a blue phase for which an alignment film is unnecessary may be used.
  • the blue phase is one of the liquid crystal phases.
  • a liquid crystal composition mixed with several percent by weight or more of a chiral agent is used for the liquid crystal layer in order to improve the temperature range.
  • a liquid crystal composition containing a liquid crystal exhibiting a blue phase and a chiral agent has a short response speed and is optically isotropic.
  • a liquid crystal composition including a liquid crystal exhibiting a blue phase and a chiral agent does not require alignment treatment and has a small viewing angle dependency. Further, since it is not necessary to provide an alignment film, a rubbing process is not required, so that electrostatic breakdown caused by the rubbing process can be prevented, and defects or breakage of the liquid crystal display device during the manufacturing process can be reduced. .
  • liquid crystal element a transmissive liquid crystal element, a reflective liquid crystal element, a transflective liquid crystal element, or the like can be used.
  • a reflective liquid crystal element can be used.
  • two polarizing plates are provided so as to sandwich a pair of substrates.
  • a backlight is provided outside the polarizing plate.
  • the backlight may be a direct type backlight or an edge light type backlight. It is preferable to use a direct-type backlight including an LED (Light Emitting Diode) because local dimming is facilitated and contrast can be increased.
  • An edge light type backlight is preferably used because the thickness of the module including the backlight can be reduced. Therefore, it is preferable.
  • a polarizing plate is provided on the display surface side. Separately from this, it is preferable to arrange a light diffusing plate on the display surface side because the visibility can be improved.
  • a front light may be provided outside the polarizing plate.
  • the front light an edge light type front light is preferably used. It is preferable to use a front light including an LED (Light Emitting Diode) because power consumption can be reduced.
  • LED Light Emitting Diode
  • the light-emitting element an element capable of self-emission can be used, and an element whose luminance is controlled by current or voltage is included in its category.
  • an LED, a QLED, an organic EL element, an inorganic EL element, or the like can be used.
  • the light emitting element includes a top emission type, a bottom emission type, and a dual emission type.
  • a conductive film that transmits visible light is used for the electrode from which light is extracted.
  • a conductive film that reflects visible light is preferably used for the electrode from which light is not extracted.
  • a bottom emission type light emitting element can be used in particular.
  • the EL layer has at least a light emitting layer.
  • the EL layer is a layer other than the light-emitting layer, such as a substance having a high hole injection property, a substance having a high hole transport property, a hole blocking material, a substance having a high electron transport property, a substance having a high electron injection property, or a bipolar property.
  • a layer including a substance (a substance having a high electron transporting property and a high hole transporting property) and the like may be further included.
  • the EL layer can use either a low molecular compound or a high molecular compound, and may contain an inorganic compound.
  • the layers constituting the EL layer can be formed by a method such as a vapor deposition method (including a vacuum vapor deposition method), a transfer method, a printing method, an ink jet method, or a coating method.
  • the EL layer includes two or more kinds of light emitting substances.
  • white light emission can be obtained by selecting the light emitting material so that the light emission of each of the two or more light emitting materials has a complementary color relationship.
  • a light emitting material that emits light such as R (red), G (green), B (blue), Y (yellow), and O (orange), or spectral components of two or more colors of R, G, and B It is preferable that 2 or more are included among the luminescent substances which show light emission containing.
  • a light-emitting element whose emission spectrum from the light-emitting element has two or more peaks in a wavelength range of visible light (for example, 350 nm to 750 nm).
  • the emission spectrum of the material having a peak in the yellow wavelength region is preferably a material having spectral components in the green and red wavelength regions.
  • the EL layer preferably has a structure in which a light-emitting layer including a light-emitting material that emits one color and a light-emitting layer including a light-emitting material that emits another color are stacked.
  • the plurality of light emitting layers in the EL layer may be stacked in contact with each other, or may be stacked through a region not including any light emitting material.
  • a region including the same material (for example, a host material or an assist material) as the fluorescent light emitting layer or the phosphorescent light emitting layer and not including any light emitting material is provided between the fluorescent light emitting layer and the phosphorescent light emitting layer. Also good. This facilitates the production of the light emitting element and reduces the driving voltage.
  • the light-emitting element may be a single element having one EL layer or a tandem element in which a plurality of EL layers are stacked with a charge generation layer interposed therebetween.
  • the above-described light-emitting layer and a layer containing a substance having a high hole-injecting property, a substance having a high hole-transporting property, a substance having a high electron-transporting property, a substance having a high electron-injecting property, a bipolar substance may have an inorganic compound such as a quantum dot or a polymer compound (oligomer, dendrimer, polymer, etc.).
  • a quantum dot can be used for a light emitting layer to function as a light emitting material.
  • a colloidal quantum dot material an alloy type quantum dot material, a core / shell type quantum dot material, a core type quantum dot material, or the like can be used.
  • a material including an element group of Group 12 and Group 16, Group 13 and Group 15, or Group 14 and Group 16 may be used.
  • a quantum dot material containing an element such as cadmium, selenium, zinc, sulfur, phosphorus, indium, tellurium, lead, gallium, arsenic, or aluminum may be used.
  • the conductive film that transmits visible light can be formed using, for example, indium oxide, indium tin oxide, indium zinc oxide, zinc oxide, zinc oxide to which gallium is added, or the like.
  • a metal material such as gold, silver, platinum, magnesium, nickel, tungsten, chromium, molybdenum, iron, cobalt, copper, palladium, or titanium, an alloy including these metal materials, or a nitride of these metal materials (for example, Titanium nitride) can also be used by forming it thin enough to have translucency.
  • a stacked film of the above materials can be used as a conductive layer. For example, it is preferable to use a stacked film of an alloy of silver and magnesium and indium tin oxide because the conductivity can be increased. Further, graphene or the like may be used.
  • a metal material such as aluminum, gold, platinum, silver, nickel, tungsten, chromium, molybdenum, iron, cobalt, copper, or palladium, or an alloy including these metal materials is used.
  • lanthanum, neodymium, germanium, or the like may be added to the metal material or alloy.
  • titanium, nickel, or neodymium and an alloy containing aluminum (aluminum alloy) may be used.
  • an alloy containing copper, palladium, or magnesium and silver may be used.
  • An alloy containing silver and copper is preferable because of its high heat resistance.
  • oxidation can be suppressed by stacking a metal film or a metal oxide film in contact with the aluminum film or the aluminum alloy film.
  • materials for such metal films and metal oxide films include titanium and titanium oxide.
  • the conductive film that transmits visible light and a film made of a metal material may be stacked.
  • a laminated film of silver and indium tin oxide, a laminated film of an alloy of silver and magnesium and indium tin oxide, or the like can be used.
  • Each electrode may be formed using a vapor deposition method or a sputtering method.
  • it can be formed using a discharge method such as an inkjet method, a printing method such as a screen printing method, or a plating method.
  • the above-described light-emitting layer and a layer containing a substance having a high hole-injecting property, a substance having a high hole-transporting property, a substance having a high electron-transporting property, a substance having a high electron-injecting property, a bipolar substance may have an inorganic compound such as a quantum dot or a polymer compound (oligomer, dendrimer, polymer, etc.).
  • a quantum dot can be used for a light emitting layer to function as a light emitting material.
  • a colloidal quantum dot material an alloy type quantum dot material, a core / shell type quantum dot material, a core type quantum dot material, or the like can be used.
  • a material including an element group of Group 12 and Group 16, Group 13 and Group 15, or Group 14 and Group 16 may be used.
  • a quantum dot material containing an element such as cadmium, selenium, zinc, sulfur, phosphorus, indium, tellurium, lead, gallium, arsenic, or aluminum may be used.
  • Adhesive layer As the adhesive layer, various curable adhesives such as an ultraviolet curable photocurable adhesive, a reactive curable adhesive, a thermosetting adhesive, and an anaerobic adhesive can be used.
  • these adhesives include epoxy resins, acrylic resins, silicone resins, phenol resins, polyimide resins, imide resins, PVC (polyvinyl chloride) resins, PVB (polyvinyl butyral) resins, EVA (ethylene vinyl acetate) resins, and the like.
  • a material with low moisture permeability such as an epoxy resin is preferable.
  • a two-component mixed resin may be used.
  • an adhesive sheet or the like may be used.
  • the resin may contain a desiccant.
  • a substance that adsorbs moisture by chemical adsorption such as an alkaline earth metal oxide (such as calcium oxide or barium oxide)
  • an alkaline earth metal oxide such as calcium oxide or barium oxide
  • a substance that adsorbs moisture by physical adsorption such as zeolite or silica gel
  • the inclusion of a desiccant is preferable because impurities such as moisture can be prevented from entering the element and the reliability of the display panel is improved.
  • the light extraction efficiency can be improved by mixing a filler having a high refractive index or a light scattering member with the resin.
  • a filler having a high refractive index or a light scattering member for example, titanium oxide, barium oxide, zeolite, zirconium, or the like can be used.
  • connection layer As the connection layer, an anisotropic conductive film (ACF: Anisotropic Conductive Film), an anisotropic conductive paste (ACP: Anisotropic Conductive Paste), or the like can be used.
  • ACF Anisotropic Conductive Film
  • ACP Anisotropic Conductive Paste
  • Examples of materials that can be used for the colored layer include metal materials, resin materials, resin materials containing pigments or dyes, and the like.
  • the material that can be used for the light-shielding layer include carbon black, titanium black, metal, metal oxide, and composite oxide containing a solid solution of a plurality of metal oxides.
  • the light shielding layer may be a film containing a resin material or a thin film of an inorganic material such as a metal.
  • a stacked film of a film containing a material for the colored layer can be used for the light shielding layer.
  • a stacked structure of a film including a material used for a colored layer that transmits light of a certain color and a film including a material used for a colored layer that transmits light of another color can be used. It is preferable to use a common material for the coloring layer and the light-shielding layer because the apparatus can be shared and the process can be simplified.

Abstract

Provided is a highly-convenient electronic device. Further provided is an electronic device capable of providing a user with a sense of usability without a sense of discomfort. Further provided is an electronic device for which the design can be changed to the liking of a user. The electronic device comprises a first casing and a second casing. The first casing has a first surface and a second surface which is on the opposite side from the first surface. The second casing has a third surface and a fourth surface which is on the opposite side from the third surface. The first casing and the second casing are linked to each other side by side, and can deform into a form in which the first surface and the third surface are folded so as to face and overlap each other, and a form in which the first surface and the third surface are open so to be exposed. The first casing has a first display unit on the first surface, and a second display unit on the second surface. The second casing has a third display unit on the third surface. The second display unit has a function of maintaining the display of a still image without carrying out rewriting.

Description

電子機器Electronics
 本発明の一態様は、表示装置を備える電子機器に関する。 One embodiment of the present invention relates to an electronic device including a display device.
 なお、本発明の一態様は、上記の技術分野に限定されない。本明細書等で開示する本発明の一態様の技術分野としては、半導体装置、表示装置、発光装置、蓄電装置、記憶装置、電子機器、照明装置、入力装置、入出力装置、それらの駆動方法、又はそれらの製造方法、を一例として挙げることができる。 Note that one embodiment of the present invention is not limited to the above technical field. Technical fields of one embodiment of the present invention disclosed in this specification and the like include semiconductor devices, display devices, light-emitting devices, power storage devices, memory devices, electronic devices, lighting devices, input devices, input / output devices, and driving methods thereof , Or a method for producing them, can be mentioned as an example.
 近年、表示装置を備える電子機器の多様化が進められている。例えば携帯電話、スマートフォン、タブレット端末、ウェアラブル機器などの電子機器がある。 In recent years, electronic devices equipped with display devices have been diversified. For example, there are electronic devices such as a mobile phone, a smartphone, a tablet terminal, and a wearable device.
 またこのような電子機器の一つに、電子書籍端末がある。電子書籍端末はタブレット端末等とは異なり、主に文字情報を表示する機能に特化した電子機器である。例えばタブレット端末は滑らかな動画表示が可能な液晶パネルなどが搭載されているのに対し、電子書籍端末は低い電力で静止画表示が可能な電子ペーパなどが搭載されているものがある。 One such electronic device is an electronic book terminal. Unlike a tablet terminal or the like, an electronic book terminal is an electronic device specialized in a function that mainly displays character information. For example, while a tablet terminal is equipped with a liquid crystal panel capable of displaying a smooth moving image, an electronic book terminal is equipped with electronic paper capable of displaying a still image with low power.
 例えば、特許文献1には、画素のスイッチング素子としてトランジスタを用いたアクティブマトリクス型の電子ペーパ、及びこれを用いたバインダ型の電子ブックが提案されている。 For example, Patent Document 1 proposes an active matrix type electronic paper using a transistor as a switching element of a pixel and a binder type electronic book using the same.
特開2002−169190号公報JP 2002-169190 A
 本発明の一態様は、利便性の高い電子機器を提供することを課題の一とする。または、本発明の一態様は、使用者に操作の違和感のない使用感を与えることのできる電子機器を提供することを課題の一とする。または、書籍(書物、本、または図書ともいう)と操作感の近い電子機器を提供することを課題の一とする。または、書籍に近い形状を有する電子機器を提供することを課題の一とする。または、本発明の一態様は、使用者の好みに合わせてデザインを変更できる電子機器を提供することを課題の一とする。 An object of one embodiment of the present invention is to provide a highly convenient electronic device. Another object of one embodiment of the present invention is to provide an electronic device that can give a user a feeling of operation without feeling uncomfortable. Another object is to provide an electronic device with a feeling of operation similar to that of a book (also referred to as a book, a book, or a book). Another object is to provide an electronic device having a shape similar to a book. Another object of one embodiment of the present invention is to provide an electronic device whose design can be changed in accordance with a user's preference.
 または、本発明の一態様は、外光によらず高い視認性が実現された電子機器を提供することを課題の一とする。または、本発明の一態様は、消費電力が低減された電子機器を提供することを課題の一とする。または、本発明の一態様は、滑らかな動画の表示と、目に優しい静止画の表示の両方を行うことのできる電子機器を提供することを課題の一とする。または、新規な電子機器を提供することを課題の一とする。 Alternatively, an object of one embodiment of the present invention is to provide an electronic device in which high visibility is achieved regardless of external light. Another object of one embodiment of the present invention is to provide an electronic device with reduced power consumption. Another object of one embodiment of the present invention is to provide an electronic device that can perform both smooth moving image display and still-eye still image display. Another object is to provide a novel electronic device.
 本発明の一態様は、第1の筐体と、第2の筐体と、を有する電子機器である。第1の筐体は、第1の面と、当該第1の面の反対側の第2の面と、を有する。第2の筐体は、第3の面と、当該第3の面の反対側の第4の面と、を有する。第1の筐体と第2の筐体とは、互いに並べて連結されており、第1の面と第3の面とが対向して重なるように折り畳まれた形態と、第1の面と第3の面とが露出するように開いた形態と、に変形可能である。第1の筐体は、第1の面に第1の表示部を有し、且つ第2の面に第2の表示部を有する。第2の筐体は、第3の面に第3の表示部を有する。第2の表示部は、書き換えを行うことなく静止画の表示を保持する機能を有する。 One embodiment of the present invention is an electronic device including a first housing and a second housing. The first housing has a first surface and a second surface opposite to the first surface. The second housing has a third surface and a fourth surface opposite to the third surface. The first casing and the second casing are connected to each other side by side, and are folded in such a manner that the first surface and the third surface overlap each other, and the first surface and the second surface It can be deformed into a form that is open so that the third surface is exposed. The first housing has a first display portion on a first surface and a second display portion on a second surface. The second housing has a third display portion on the third surface. The second display unit has a function of holding a still image display without rewriting.
 また、上記において、第2の筐体は、第4の面に第4の表示部を有することが好ましい。このとき、第4の表示部は、書き換えを行うことなく静止画の表示を保持する機能を有することが好ましい。 Further, in the above, it is preferable that the second housing has the fourth display portion on the fourth surface. At this time, it is preferable that the fourth display unit has a function of holding a still image display without rewriting.
 また、上記において、第1の筐体と第2の筐体とが折り畳まれた形態のとき、第2の面と第4の面の間に、第5の表示部を有することが好ましい。このとき、第5の表示部は、書き換えを行うことなく静止画の表示を保持する機能を有することが好ましい。 Further, in the above, when the first housing and the second housing are folded, it is preferable to have a fifth display portion between the second surface and the fourth surface. At this time, it is preferable that the fifth display unit has a function of holding a still image display without rewriting.
 また、上記において、第1の筐体の厚さが、第2の筐体よりも薄いことが好ましい。 In the above, it is preferable that the thickness of the first casing is thinner than that of the second casing.
 また、上記において、第2の面及び第4の面を覆って設けられ、第2の表示部からの光を透過する機能を有するカバーを有することが好ましい。このとき、カバーは、紙を含むことが好ましい。 Further, in the above, it is preferable to have a cover provided so as to cover the second surface and the fourth surface and having a function of transmitting light from the second display portion. At this time, the cover preferably includes paper.
 また、上記において、第2の表示部は、マイクロカプセル、電気泳動素子、ネマチック液晶素子、コレステリック液晶素子、強誘電性液晶素子、エレクトロウェッティング素子、エレクトロフルイディック素子、エレクトロクロミック素子、MEMS素子から選ばれた一以上を含むことが好ましい。 In the above, the second display portion includes a microcapsule, an electrophoretic element, a nematic liquid crystal element, a cholesteric liquid crystal element, a ferroelectric liquid crystal element, an electrowetting element, an electrofluidic element, an electrochromic element, and a MEMS element. It is preferable to include one or more selected.
 また、上記において、第1の表示部、及び第3の表示部は、それぞれ液晶素子、有機EL素子、マイクロカプセル、電気泳動素子、エレクトロウェッティング素子、エレクトロフルイディック素子、エレクトロクロミック素子、MEMS素子から選ばれた一以上を含むことが好ましい。 In the above, the first display portion and the third display portion are respectively a liquid crystal element, an organic EL element, a microcapsule, an electrophoretic element, an electrowetting element, an electrofluidic element, an electrochromic element, and a MEMS element. It is preferable that one or more selected from is included.
 また上記において、第1の筐体及び第2の筐体は、それぞれ第1の表示部または第3の表示部に表示パネルを有することが好ましい。このとき表示パネルは、第1の基板と、第2の基板と、液晶素子と、発光素子と、絶縁層と、を有することが好ましい。また、このとき液晶素子は、第2の基板と絶縁層の間に位置し、発光素子は、第1の基板と絶縁層の間に位置し、液晶素子は、第2の基板側に光を反射する機能を有し、発光素子は、第2の基板側に光を発する機能を有することが好ましい。 In the above, it is preferable that the first housing and the second housing each have a display panel in the first display portion or the third display portion. At this time, the display panel preferably includes a first substrate, a second substrate, a liquid crystal element, a light emitting element, and an insulating layer. At this time, the liquid crystal element is positioned between the second substrate and the insulating layer, the light-emitting element is positioned between the first substrate and the insulating layer, and the liquid crystal element emits light toward the second substrate side. The light-emitting element preferably has a function of reflecting light and emits light toward the second substrate.
 または、上記において、第1の筐体及び第2の筐体は、それぞれ第1の表示部または第3の表示部に表示パネルを有することが好ましい。また表示パネルは、第1の基板と、第2の基板と、液晶素子と、発光素子と、第1のトランジスタと、第2のトランジスタと、第1の絶縁層と、第2の絶縁層と、を有することが好ましい。また、第1のトランジスタ及び第2のトランジスタは、第1の絶縁層と第2の絶縁層と、の間に位置し、液晶素子は、第2の基板と第2の絶縁層の間に位置し、発光素子は、第1の基板と第1の絶縁層の間に位置することが好ましい。また液晶素子は、第1のトランジスタと電気的に接続し、且つ、第2の基板側に光を反射する機能を有することが好ましい。また発光素子は、第2のトランジスタと電気的に接続し、且つ、第2の基板側に光を発する機能を有することが好ましい。 Alternatively, in the above, it is preferable that the first housing and the second housing each have a display panel in the first display portion or the third display portion. The display panel includes a first substrate, a second substrate, a liquid crystal element, a light emitting element, a first transistor, a second transistor, a first insulating layer, and a second insulating layer. It is preferable to have. The first transistor and the second transistor are located between the first insulating layer and the second insulating layer, and the liquid crystal element is located between the second substrate and the second insulating layer. The light emitting element is preferably located between the first substrate and the first insulating layer. The liquid crystal element preferably has a function of being electrically connected to the first transistor and reflecting light toward the second substrate. The light-emitting element preferably has a function of being electrically connected to the second transistor and emitting light to the second substrate side.
 また、上記において、第1の筐体、または第2の筐体は、バッテリーモジュール、センサモジュール、振動モジュール、カメラモジュール、外部インターフェース、通信モジュール、スピーカ、マイク、及び記憶装置のうち少なくとも一を有することが好ましい。 In the above, the first housing or the second housing includes at least one of a battery module, a sensor module, a vibration module, a camera module, an external interface, a communication module, a speaker, a microphone, and a storage device. It is preferable.
 本発明の一態様によれば、利便性の高い電子機器を提供できる。または、使用者に違和感のない使用感を与えることのできる電子機器を提供できる。または、使用者の好みに合わせてデザインを変更できる電子機器を提供できる。 According to one embodiment of the present invention, a highly convenient electronic device can be provided. Alternatively, it is possible to provide an electronic device that can give the user a feeling of incongruity. Alternatively, an electronic device whose design can be changed according to the user's preference can be provided.
 または、外光によらず高い視認性が実現された電子機器を提供できる。または、消費電力が低減された電子機器を提供できる。または、滑らかな動画の表示と、目に優しい静止画の表示の両方を行うことのできる電子機器を提供できる。または、新規な電子機器を提供できる。 Alternatively, it is possible to provide an electronic device that achieves high visibility regardless of outside light. Alternatively, an electronic device with reduced power consumption can be provided. Alternatively, an electronic device that can display both a smooth moving image and a still image that is easy on the eyes can be provided. Alternatively, a new electronic device can be provided.
実施の形態に係る、電子機器の構成例。4 illustrates a configuration example of an electronic device according to an embodiment. 実施の形態に係る、電子機器の構成例。4 illustrates a configuration example of an electronic device according to an embodiment. 実施の形態に係る、電子機器の構成例。4 illustrates a configuration example of an electronic device according to an embodiment. 実施の形態に係る、電子機器の構成例。4 illustrates a configuration example of an electronic device according to an embodiment. 実施の形態に係る、電子機器の構成例。4 illustrates a configuration example of an electronic device according to an embodiment. 実施の形態に係る、電子機器の構成例。4 illustrates a configuration example of an electronic device according to an embodiment. 実施の形態に係る、電子機器の構成例。4 illustrates a configuration example of an electronic device according to an embodiment. 実施の形態に係る、電子機器の構成例。4 illustrates a configuration example of an electronic device according to an embodiment. 実施の形態に係る、電子機器のブロック図。FIG. 11 is a block diagram of an electronic device according to an embodiment. 実施の形態に係る、表示パネルの構成例。3 shows a structure example of a display panel according to an embodiment. 実施の形態に係る、表示パネルの回路図。The circuit diagram of the display panel based on Embodiment. 実施の形態に係る、表示パネルの回路図。The circuit diagram of the display panel based on Embodiment. 実施の形態に係る、表示パネルの構成例。3 shows a structure example of a display panel according to an embodiment. 実施の形態に係る、表示パネルの構成例。3 shows a structure example of a display panel according to an embodiment.
 実施の形態について、図面を用いて詳細に説明する。但し、本発明は以下の説明に限定されず、本発明の趣旨及びその範囲から逸脱することなくその形態及び詳細を様々に変更し得ることは当業者であれば容易に理解される。従って、本発明は以下に示す実施の形態の記載内容に限定して解釈されるものではない。 Embodiments will be described in detail with reference to the drawings. However, the present invention is not limited to the following description, and it is easily understood by those skilled in the art that modes and details can be variously changed without departing from the spirit and scope of the present invention. Therefore, the present invention should not be construed as being limited to the description of the embodiments below.
 なお、以下に説明する発明の構成において、同一部分又は同様な機能を有する部分には同一の符号を異なる図面間で共通して用い、その繰り返しの説明は省略する。また、同様の機能を指す場合には、ハッチパターンを同じくし、特に符号を付さない場合がある。 Note that in the structures of the invention described below, the same portions or portions having similar functions are denoted by the same reference numerals in different drawings, and description thereof is not repeated. In addition, in the case where the same function is indicated, the hatch pattern is the same, and there is a case where no reference numeral is given.
 なお、本明細書で説明する各図において、各構成の大きさ、層の厚さ、または領域は、明瞭化のために誇張されている場合がある。よって、必ずしもそのスケールに限定されない。 Note that in each drawing described in this specification, the size, the layer thickness, or the region of each component is exaggerated for clarity in some cases. Therefore, it is not necessarily limited to the scale.
 なお、本明細書等における「第1」、「第2」等の序数詞は、構成要素の混同を避けるために付すものであり、数的に限定するものではない。 In addition, ordinal numbers such as “first” and “second” in this specification and the like are attached to avoid confusion between components and are not limited numerically.
(実施の形態1)
 本実施の形態では、本発明の一態様の電子機器について、図面を参照して説明する。
(Embodiment 1)
In this embodiment, electronic devices of one embodiment of the present invention are described with reference to drawings.
[電子機器の構成例]
〔構成例1〕
 図1(A)、(B)、(C)に、それぞれ電子機器10の斜視概略図を示す。図1(A)は、2つに折り畳まれた状態の電子機器10の斜視概略図であり、図1(B)は2つの筐体を開いた状態の電子機器10の斜視概略図であり、図1(C)は図1(B)を反対側から見たときの電子機器10の斜視図概略図である。
[Configuration example of electronic equipment]
[Configuration example 1]
1A, 1B, and 1C are perspective schematic views of the electronic device 10, respectively. FIG. 1A is a schematic perspective view of the electronic device 10 folded in two, and FIG. 1B is a schematic perspective view of the electronic device 10 in a state where two housings are opened. FIG. 1C is a schematic perspective view of the electronic device 10 when FIG. 1B is viewed from the opposite side.
 電子機器10は、筐体11及び筐体12を有する。筐体11と筐体12とは互いに並べて配置され、ヒンジ部31により連結されている。筐体11と筐体12とは、ヒンジ部31の軸を中心に相対的に回転することができる。 The electronic device 10 includes a housing 11 and a housing 12. The housing 11 and the housing 12 are arranged side by side and connected by a hinge portion 31. The housing 11 and the housing 12 can be relatively rotated around the axis of the hinge portion 31.
 図1(B)に示すように、筐体11は表示部21を有し、筐体12は表示部22を有する。電子機器10は、表示部21と表示部22とが互いに対向するように、筐体11と筐体12とが2つに折り畳まれた状態と、表示部21と表示部22が視認可能なように、筐体11と筐体12とが開いた状態と、の間で可逆的に変形することができる。 As shown in FIG. 1B, the housing 11 has a display unit 21, and the housing 12 has a display unit 22. In the electronic device 10, the housing 11 and the housing 12 are folded in two so that the display unit 21 and the display unit 22 face each other, and the display unit 21 and the display unit 22 are visible. In addition, the housing 11 and the housing 12 can be reversibly deformed between the opened state.
 また図1(A)、(C)に示すように、電子機器10は、筐体11の表示部21とは反対側の面に、表示部23を有する。表示部23は、図1(A)に示すように、電子機器10を折り畳んだ状態でも使用者に視認できる位置に配置されている。 As shown in FIGS. 1A and 1C, the electronic device 10 has a display unit 23 on the surface of the housing 11 opposite to the display unit 21. As shown in FIG. 1A, the display unit 23 is disposed at a position that can be visually recognized by the user even when the electronic device 10 is folded.
 ここで、表示部23には、表示部21及び表示部22よりも消費電力が低いことが好ましい。特に、メモリ性を有する表示素子を有する構成とすると、消費電力を低くできるため好ましい。 Here, the display unit 23 preferably has lower power consumption than the display unit 21 and the display unit 22. In particular, a structure including a display element having a memory property is preferable because power consumption can be reduced.
 ここで、メモリ性を有する表示素子は、書き換えを行うことなく静止画の表示を保持する機能を有する表示素子である。メモリ性を有する表示素子には、電源の供給を止めた状態で、静止画の表示が保たれる表示素子が含まれる。または、メモリ性を有する表示素子には、定電圧を供給した状態で、静止画の表示が保たれる表示素子が含まれる。またメモリ性を有する表示素子は、リフレッシュ動作をすることなく、表示が保たれる表示素子も含まれる。 Here, a display element having a memory property is a display element having a function of holding a still image display without rewriting. The display element having a memory property includes a display element that can display a still image in a state where power supply is stopped. Alternatively, the display element having a memory property includes a display element that can maintain a still image display with a constant voltage supplied. In addition, a display element having a memory property includes a display element in which display can be maintained without performing a refresh operation.
 メモリ性を有する表示素子が、リフレッシュや書き換えを行うことなく表示を保持できる期間は、長ければ長いほどよい。例えば1秒以上、好ましくは1分以上、より好ましくは1時間以上、さらに好ましくは1日以上、1年以下の期間中、保持できることが好ましい。ここで、表示が保持されている状態としては、例えば輝度のダイナミックレンジに対して輝度の変化が5%以下、好ましくは3%以下、より好ましくは1%以下である状態などとすることができる。なお反射型の表示素子の場合には、上記輝度を反射率に置き換えればよい。 The longer the period during which a display element having a memory property can hold a display without refreshing or rewriting is better. For example, it can be maintained for a period of 1 second or longer, preferably 1 minute or longer, more preferably 1 hour or longer, and even more preferably 1 day or longer and 1 year or shorter. Here, the state in which the display is held can be, for example, a state in which the change in luminance is 5% or less, preferably 3% or less, more preferably 1% or less with respect to the luminance dynamic range. . Note that in the case of a reflective display element, the luminance may be replaced with reflectance.
 メモリ性を有する表示素子としては、様々な双安定性ディスプレイ技術を適用した表示素子を用いることができる。このような表示素子としては、代表的には、電子ペーパが挙げられる。電子ペーパの方式としては、例えばマイクロカプセル方式、電気泳動(EPD:Electrophoretic Display)方式、電子粉流体(登録商標)方式などの、粒子移動型の素子が挙げられる。また、ネマチック液晶、コレステリック液晶、強誘電性液晶素子などの双安定性液晶を用いた表示素子を用いることもできる。 As the display element having memory properties, display elements to which various bistable display technologies are applied can be used. A typical example of such a display element is electronic paper. Examples of the electronic paper method include particle movement type elements such as a microcapsule method, an electrophoretic (EPD) method, and an electronic powder fluid (registered trademark) method. A display element using a bistable liquid crystal such as a nematic liquid crystal, a cholesteric liquid crystal, or a ferroelectric liquid crystal element can also be used.
 そのほか、メモリ性を有する表示素子として、エレクトロウェッティング(EWD:Electrowetting Display)素子、エレクトロフルイディック(EFD:Electrofluidic Display)素子、エレクトロクロミック(ECD:Electrochromic Display)素子、MEMS(Micro Electro Mechanical Systems)素子等を用いることができる。MEMS素子としては、光干渉を利用したMEMS素子や、シャッター方式を用いたMEMS素子等がある。 In addition, as a display element having a memory property, an electrowetting (EWD) element, an electrofluidic display (EFD) element, an electrochromic (ECD) element, a MEMS (MicroElectrical Display) element, or a MEMS (MicroElectrical Display) element. Etc. can be used. Examples of the MEMS element include a MEMS element using optical interference and a MEMS element using a shutter method.
 表示部23に、このような表示素子を用いることにより、電子機器10を閉じた状態において、表示部23に静止画を極めて低電力で表示したままの状態にすることができる。 By using such a display element for the display unit 23, a still image can be displayed on the display unit 23 with extremely low power when the electronic device 10 is closed.
 一方、表示部21及び表示部22は、電子機器10の用途に応じて様々な方式の表示素子を適用することができる。 Meanwhile, various types of display elements can be applied to the display unit 21 and the display unit 22 in accordance with the use of the electronic device 10.
 例えば電子機器10を、主に静止画や文字情報を表示する電子書籍端末として用いる場合には、表示部21及び表示部22に、表示部23と同様のメモリ性を有する表示素子を適用することができる。 For example, when the electronic device 10 is used as an electronic book terminal that mainly displays still images and character information, a display element having the same memory characteristics as the display unit 23 is applied to the display unit 21 and the display unit 22. Can do.
 また、表示部21及び表示部22に、滑らかな動画の表示が要求される場合には、例えば有機EL(OLED:Organic Light Emitting Diodeともいう)素子、LED(Light Emitting Diode)素子、QLED(Quantum−dot Light Emitting Diode)素子などの自発光性の発光素子を、表示素子に用いることができる。または、透過型、反射型、または半透過型の液晶素子を用いてもよい。 When smooth display of moving images is required for the display unit 21 and the display unit 22, for example, an organic EL (OLED: Organic Light Emitting Diode) element, an LED (Light Emitting Diode) element, or a QLED (Quantum). A self-luminous light emitting element such as a -dot Light Emitting Diode) element can be used for the display element. Alternatively, a transmissive, reflective, or transflective liquid crystal element may be used.
 特に、表示部21及び表示部22に、反射光を利用した表示素子と、発光素子とを有する表示パネルを適用することが好ましい。より具体的な例としては、一対の基板の間に、反射型の液晶素子及びこれを駆動するトランジスタ、ならびに有機EL素子及びこれを駆動するトランジスタを有する表示パネルを適用することが好ましい。このような表示パネルを用いることにより、外光の明るい時には反射型の液晶素子で表示を行うことで、視認性に優れ、且つ低い消費電力で駆動することができる。また外光が暗い時には、有機EL素子で表示を行うことで、鮮やかな表示を行うことができる。さらに、反射型の液晶素子と有機EL素子の両方で表示を行うことにより、低い消費電力と、表示の鮮明さの両方を実現した表示を行うことができる。 In particular, it is preferable to apply a display panel having a display element using reflected light and a light emitting element to the display unit 21 and the display unit 22. As a more specific example, it is preferable to apply a reflective liquid crystal element and a transistor for driving the liquid crystal element between a pair of substrates, and a display panel having an organic EL element and a transistor for driving the organic EL element. By using such a display panel, display is performed with a reflective liquid crystal element when the outside light is bright, so that the display can be driven with excellent visibility and low power consumption. Further, when the outside light is dark, a vivid display can be performed by displaying with the organic EL element. Furthermore, by performing display with both a reflective liquid crystal element and an organic EL element, it is possible to perform display that achieves both low power consumption and clear display.
 電子機器10は、例えば表示部21及び表示部22に書籍等の文書情報を表示するアプリケーションを実行することができる。使用者は、電子機器10を開いた状態で読むことができるため、一覧性に優れる。また持ち運びする際には電子機器10を折り畳むことができるため可搬性に優れる。電子機器10は、電子書籍端末としてだけでなく、例えば教科書などにも好適に用いることができる。 The electronic device 10 can execute an application that displays document information such as books on the display unit 21 and the display unit 22, for example. Since the user can read the electronic device 10 in an opened state, the list is excellent. Moreover, since the electronic device 10 can be folded when carrying, it is excellent in portability. The electronic device 10 can be suitably used not only as an electronic book terminal but also for a textbook, for example.
 また、表示部21と表示部22には、異なるアプリケーションの表示を行ってもよい。例えば、一方に文書情報を表示するアプリケーションの表示を行い、他方に電子メール等のアプリケーションの表示を行うことができる。また、表示部のいずれか一方に、キーボードやタッチパッドとして機能する画像を表示することができる。すなわち、表示部21と表示部22の一方を入力手段として機能させ、他方を主表示部(メインディスプレイ)として機能させることで、ノート型のコンピュータや、ゲーム機のように使用することができる。このように、電子機器10を開いたときに2つの表示部を有することで、従来の電子機器に比べてより様々な機能を実現することができる。 Further, different applications may be displayed on the display unit 21 and the display unit 22. For example, an application that displays document information can be displayed on one side, and an application such as an electronic mail can be displayed on the other side. In addition, an image functioning as a keyboard or a touch pad can be displayed on any one of the display portions. That is, by making one of the display unit 21 and the display unit 22 function as an input unit and the other function as a main display unit (main display), it can be used like a notebook computer or a game machine. Thus, by having two display portions when the electronic device 10 is opened, various functions can be realized as compared with the conventional electronic device.
 また、電子機器を閉じた状態では、表示部21及び表示部22に表示を行わないことが好ましい。具体的には、表示部21と表示部22の画素を駆動させないようにすることが好ましい。また表示部21や表示部22として透過型の液晶装置のようにバックライトを有する表示装置を用いた場合には、当該バックライトを駆動させない構成とすることが好ましい。電子機器10を閉じたときに使用者に見えない表示部を非表示(非動作)とすることで、消費電力を極めて小さくすることができる。 In addition, it is preferable that no display is performed on the display unit 21 and the display unit 22 when the electronic device is closed. Specifically, it is preferable not to drive the pixels of the display unit 21 and the display unit 22. In the case where a display device having a backlight such as a transmissive liquid crystal device is used as the display portion 21 or the display portion 22, it is preferable that the backlight is not driven. By disabling the display portion that is not visible to the user when the electronic device 10 is closed (non-operation), the power consumption can be extremely reduced.
 表示部23に表示する静止画として、例えば書籍の表紙に相当する静止画を好適に表示することができる。例えば、背景に用いる絵に加えて、書籍のタイトル、著者、出版社名などを表示することができる。こうすることで、使用者が電子機器10を開いた状態で文書を読んでいる場合に、その文書のタイトル等を使用者の反対側にいる人に示すことができる。また、使用者が途中まで文書を読んだ状態で電子機器10を閉じたとしても、表示部23にタイトル等が表示されているため、使用者は何の文書を読んでいる途中であるかを、電子機器10を開くことなく思い出すことができる。 As a still image displayed on the display unit 23, for example, a still image corresponding to the cover of a book can be suitably displayed. For example, in addition to the picture used for the background, the title, author, publisher name, etc. of the book can be displayed. In this way, when the user is reading a document with the electronic device 10 opened, the title of the document can be shown to the person on the other side of the user. Even if the electronic device 10 is closed while the user has read the document halfway, since the title and the like are displayed on the display unit 23, it is possible to determine what document the user is reading. It is possible to remember without opening the electronic device 10.
 なお上記に限られず、表示部23には様々な表示を行うことができる。例えばメールや電話、ソーシャル・ネットワーキング・サービス(SNS)などの着信の通知、電子メールやSNSなどの題名、電子メールやSNSなどの送信者名、メッセージ、日時、時刻、再生中の音声や音楽の情報、音量、温度、電池残量、通信状況、アンテナ受信の強度、ファイル等のダウンロード状況など、様々な情報を表示することができる。また、表示部23には、種々のアプリケーションと関連付けられたアイコンや、種々の機能と関連付けられたアイコン、操作ボタン、またはスライダーなどを表示してもよい。例えば、音声や音楽を再生しているときに、音量を調整する機能や、早送り、早戻しなどを行う機能と関連付けられたアイコンなどがある。または、電話の着信時に応答や保留するための機能や、電子機器10の操作が無効にされた状態(ロック状態ともいう)を解除する機能と関連付けられたアイコンなどを表示してもよい。 Note that the display unit 23 is not limited to the above, and various displays can be performed. For example, notification of incoming calls such as e-mails, telephone calls, social networking services (SNS), titles such as e-mails and SNSs, sender names such as e-mails and SNSs, messages, date and time, time of playing voice and music Various information such as information, volume, temperature, remaining battery level, communication status, antenna reception intensity, file download status, and the like can be displayed. The display unit 23 may display icons associated with various applications, icons associated with various functions, operation buttons, or sliders. For example, there is an icon associated with a function for adjusting the volume and a function for fast-forwarding, fast-rewinding, or the like when playing back voice or music. Alternatively, an icon associated with a function for answering or holding a call when a call is received, or a function for canceling a state where the operation of the electronic device 10 is disabled (also referred to as a locked state) may be displayed.
 表示部23は、メモリ性を有する表示素子を有するため、表示の書き換えは表示される画像に変化が生じた場合にのみ行えばよい。例えば時刻表示を行う場合には、1分ごとに表示を書き換えることにより、書き換えに伴う電力消費を極めて小さいものとすることができる。また、通信状況やアンテナ受信の強度、温度などの情報も、その情報が変化したときにのみ表示の書き換えを行うことで、書き換えの頻度を低減することができ、消費電力を低減できる。 Since the display unit 23 has a display element having a memory property, rewriting of the display only needs to be performed when a change occurs in the displayed image. For example, when performing time display, the power consumption accompanying rewriting can be made extremely small by rewriting the display every minute. In addition, information such as communication status, antenna reception strength, and temperature can be rewritten only when the information changes, so that the frequency of rewriting can be reduced and power consumption can be reduced.
 また、表示部23に、書籍等の文書情報を表示してもよい。電子機器10を閉じた状態で使用することで、例えば電車やバスなどの公共の場所でも好適に用いることができる。 Further, document information such as books may be displayed on the display unit 23. By using the electronic device 10 in a closed state, it can be suitably used in public places such as trains and buses.
 表示部21及び表示部22には、タッチパネルを好適に用いることができる。これにより、表示部21及び表示部22を触れるなどして、タップ操作、スワイプ操作、ピンチ操作などの入力操作が可能となる。また例えば、書籍等の文書情報を表示したとき、スワイプ操作などによりページを切り替えることができ、実際の書籍に近い動作で文書情報を閲覧することができる。 A touch panel can be suitably used for the display unit 21 and the display unit 22. Thereby, touch operations such as a tap operation, a swipe operation, and a pinch operation can be performed by touching the display unit 21 and the display unit 22. Further, for example, when document information such as a book is displayed, the page can be switched by a swipe operation or the like, and the document information can be browsed by an operation close to an actual book.
 また、表示部23に、タッチパネルを適用することが好ましい。これにより、電子機器10を閉じた状態で、タブレット端末等のように使用することができる。 In addition, it is preferable to apply a touch panel to the display unit 23. Thereby, it can be used like a tablet terminal etc. in the state which closed the electronic device 10. FIG.
 なお、表示部21、表示部22、及び表示部23の画素や、駆動回路等には、チャネル形成領域に酸化物半導体を用い、極めて低いオフ電流が実現されたトランジスタを利用することが好ましい。シリコンよりもバンドギャップの大きな酸化物半導体を用いたトランジスタは、その低いオフ電流により、トランジスタと直列に接続された容量素子に蓄積した電荷を長期間に亘って保持することが可能である。例えばこのようなトランジスタを画素に適用することで、メモリ性を有する表示素子を適用しない場合であっても、表示した画像の階調を維持しつつ、駆動回路を停止することも可能となる。その結果、極めて消費電力の低減された電子機器を実現できる。 Note that for the pixels of the display portion 21, the display portion 22, and the display portion 23, a driver circuit, and the like, it is preferable to use a transistor in which an oxide semiconductor is used for a channel formation region and an extremely low off-state current is realized. A transistor including an oxide semiconductor whose band gap is larger than that of silicon can hold charge accumulated in a capacitor connected in series with the transistor for a long time because of the low off-state current. For example, by applying such a transistor to a pixel, the driver circuit can be stopped while maintaining the gradation of a displayed image even when a display element having a memory property is not applied. As a result, an electronic device with extremely low power consumption can be realized.
〔変形例1〕
 ここで、図1(A)等では筐体11が2つの表示部を有する例を示したが、筐体12もまた、2つの表示部を有していてもよい。
[Modification 1]
Here, an example in which the housing 11 has two display portions is shown in FIG. 1A and the like, but the housing 12 may also have two display portions.
 図2は、筐体12の背面(表示部22が設けられた面とは反対側の面)に、表示部24を有する例を示している。 FIG. 2 shows an example in which the display unit 24 is provided on the back surface of the housing 12 (the surface opposite to the surface on which the display unit 22 is provided).
 表示部24は、表示部23と同様に、メモリ性を有する表示素子が設けられていることが好ましい。 As in the display unit 23, the display unit 24 is preferably provided with a display element having a memory property.
 表示部24に表示する静止画としては、例えば書籍の裏表紙に相当する静止画等を好適に表示することができる。例えば、背景に用いる絵に加えて、発行者名、国際標準図書番号(ISBN:International Standard Book Number)、または要約の文章などを表示することができる。また書籍のタイトルや著者を表示してもよい。こうすることで、実際の本と同じような情報を表示部23及び表示部24に表示することができる。 As the still image displayed on the display unit 24, for example, a still image corresponding to the back cover of a book can be suitably displayed. For example, in addition to a picture used for the background, an issuer name, an International Standard Book Number (ISBN), or a summary text can be displayed. Also, the title and author of the book may be displayed. By doing so, information similar to an actual book can be displayed on the display unit 23 and the display unit 24.
 なお、表示部23に書籍の裏表紙に相当する画像を、表示部24に書籍の表紙に相当する画像を、それぞれ表示することもできる。例えば図2に示す状態において、例えば英語表記の横書きの本では、表示部23が表紙側、表示部24が裏表紙側となる。一方、例えば日本語表記の縦書きの本では、表示部24が表紙側、表示部23が裏表紙側となる。このように、電子機器10が実行するアプリケーションによって、書籍データの種類に応じて、表示部23及び表示部24に表示される内容が適宜変更されることが好ましい。 Note that an image corresponding to the back cover of the book can be displayed on the display unit 23, and an image corresponding to the cover of the book can be displayed on the display unit 24. For example, in the state shown in FIG. 2, in a horizontally written book written in English, for example, the display unit 23 is on the front cover side and the display unit 24 is on the back cover side. On the other hand, for example, in a vertically written book written in Japanese, the display unit 24 is on the front cover side and the display unit 23 is on the back cover side. Thus, it is preferable that the contents displayed on the display unit 23 and the display unit 24 are appropriately changed according to the type of book data, depending on the application executed by the electronic device 10.
〔構成例2〕
 電子機器10の形態として、より実際の本に近い形態であると、使用者が違和感のない使用感を感じられる電子機器とすることができる。
[Configuration example 2]
If the electronic device 10 has a form closer to an actual book, the electronic device 10 can be used as an electronic device that allows the user to feel a sense of incongruity.
 図3(A)~(D)には、筐体11及び筐体12を覆うカバー32を有する、電子機器10の例を示している。図3(A)は、電子機器10を閉じた状態の斜視概略図であり、図3(B)は、図3(A)を反対側から見たときの斜視概略図である。また図3(C)は、電子機器10を開いた状態の斜視概略図であり、図3(D)は、図3(C)を反対側から見たときの斜視概略図である。 3A to 3D show an example of the electronic device 10 having a cover 32 that covers the housing 11 and the housing 12. 3A is a schematic perspective view of the electronic device 10 in a closed state, and FIG. 3B is a schematic perspective view of the electronic device 10 as viewed from the opposite side. 3C is a schematic perspective view of the electronic device 10 in an opened state, and FIG. 3D is a schematic perspective view of FIG. 3C viewed from the opposite side.
 カバー32は、筐体11の表示部23が設けられる側の面の一部、筐体12の表示部22とは反対側の面、及び筐体11と筐体12とが連結される側の、それぞれの側面を覆って設けられている。 The cover 32 is a part of the surface of the housing 11 on the side where the display unit 23 is provided, the surface of the housing 12 opposite to the display unit 22, and the side on which the housing 11 and the housing 12 are connected. , Provided to cover each side.
 また図3の各図に示すように、カバー32の大きさを筐体11及び筐体12よりも大きくし、カバー32が筐体11及び筐体12よりも少しはみ出るように設けることが好ましい。これにより、電子機器10の形態を実際の本に近づけることができるだけでなく、筐体11及び筐体12をカバー32によって保護することができる。 3, it is preferable that the size of the cover 32 is larger than that of the housing 11 and the housing 12 so that the cover 32 protrudes slightly from the housing 11 and the housing 12. Thereby, not only the form of the electronic device 10 can be brought close to an actual book, but also the housing 11 and the housing 12 can be protected by the cover 32.
 表示部23が設けられる部分において、カバー32は、表示部23からの光が透過する開口を有することが好ましい。ここで、カバー32に孔があけられることで開口が形成されていてもよいし、カバー32の一部が、透光性を有する素材で形成されていてもよい。またこの開口の形状を、表示部23の形状と一致させることで、表示部23全体を使用することができる。また、当該開口は、表示部23よりも小さくてもよく、またその形状は矩形に限られず、円、楕円、または多角形などの様々な形状とすることで、意匠性を高めることができる。 In the portion where the display unit 23 is provided, the cover 32 preferably has an opening through which light from the display unit 23 is transmitted. Here, an opening may be formed by making a hole in the cover 32, or a part of the cover 32 may be formed of a light-transmitting material. Further, by matching the shape of the opening with the shape of the display unit 23, the entire display unit 23 can be used. In addition, the opening may be smaller than the display unit 23, and the shape is not limited to a rectangle, and the design can be improved by using various shapes such as a circle, an ellipse, or a polygon.
 また、カバー32が筐体11と筐体12の連結部を覆うように設けられることで、より電子機器10の形態を実際の本に近づけることができる。 Further, since the cover 32 is provided so as to cover the connecting portion between the housing 11 and the housing 12, the form of the electronic device 10 can be made closer to an actual book.
 また図4(A)には、筐体11の表示部21が設けられる部分よりも外側に、タッチ領域26aを有する例を示している。また同様に、筐体12の表示部22が設けられる部分よりも外側に、タッチ領域26bを有する。 FIG. 4A shows an example in which the touch area 26a is provided outside the portion of the housing 11 where the display unit 21 is provided. Similarly, the touch region 26b is provided outside the portion of the housing 12 where the display unit 22 is provided.
 タッチ領域26a、及びタッチ領域26bには、種々のタッチセンサを組み込むことができる。例えば、静電容量方式、抵抗膜方式、表面弾性波方式、赤外線方式、電磁誘導方式、光学方式、感圧方式などのタッチセンサを用いることができる。 Various touch sensors can be incorporated in the touch area 26a and the touch area 26b. For example, a touch sensor such as a capacitance method, a resistance film method, a surface acoustic wave method, an infrared method, an electromagnetic induction method, an optical method, or a pressure sensitive method can be used.
 タッチ領域26aやタッチ領域26bに対し、タッチ操作、タップ操作、スワイプ操作、ピンチ操作などのジェスチャーを、入力操作として用いることができる。例えば図4(A)では、タッチ領域26aをタップしている様子を示している。また図4(B)では、タッチ領域26aをスワイプしている様子を示している。 A gesture such as a touch operation, a tap operation, a swipe operation, and a pinch operation can be used as an input operation for the touch area 26a and the touch area 26b. For example, FIG. 4A shows a state where the touch area 26a is tapped. FIG. 4B shows a state where the touch area 26a is swiped.
 例えば、表示部21及び表示部22に文書情報を表示した際に、タッチ領域26aをタップする、スワイプする等の操作により、ページが右から左にかけてページがめくられ、またタッチ領域26bをタップする、またはスワイプする等の操作により、ページが左から右にかけてページがめくられるような機能を実現することができる。なお、これとは逆方向にページがめくられる機能を有していてもよく、どちらにページがめくられるのかをユーザが設定可能であることが好ましい。 For example, when document information is displayed on the display unit 21 and the display unit 22, the page is turned from right to left by an operation such as tapping or swiping the touch area 26a, and the touch area 26b is tapped. A function of turning the page from the left to the right by swiping or the like can be realized. Note that it may have a function of turning pages in the opposite direction, and it is preferable that the user can set which page is turned.
 このように、筐体11及び筐体12が、表示部21及び表示部22とは別にタッチ領域26a及びタッチ領域26bを有することで、より実際の書籍に近い操作が可能となる。 As described above, since the housing 11 and the housing 12 have the touch area 26a and the touch area 26b in addition to the display unit 21 and the display unit 22, an operation closer to an actual book can be performed.
 なお、筐体11及び筐体12が、タッチ領域26a及びタッチ領域26bを有していなくてもよい。その場合には、表示部21及び表示部22の一部(例えば外周側の幅1cm乃至5cm程度の領域)をタップする、またはスワイプする等の操作により、ページがめくられる機能を有していてもよい。図4(C)では、表示部21の一部をスワイプしている様子を示している。 In addition, the housing | casing 11 and the housing | casing 12 do not need to have the touch area | region 26a and the touch area | region 26b. In that case, it has a function of turning a page by an operation such as tapping or swiping a part of the display unit 21 and the display unit 22 (for example, a region having a width of about 1 cm to 5 cm on the outer peripheral side). Also good. FIG. 4C shows a state where a part of the display unit 21 is swiped.
〔変形例2〕
 図5(A)~(D)は、図3の各図で例示した構成と比較して、表示部24及び表示部25を有する点で、主に相違している。
[Modification 2]
5A to 5D are mainly different from the configuration illustrated in each drawing of FIG. 3 in that the display unit 24 and the display unit 25 are provided.
 表示部24は、筐体12の表示部22とは反対側の面に設けられている。また、表示部25は、筐体11の側面と重なる表示部25aと、筐体12の側面と重なる表示部25bと、を有する。 The display unit 24 is provided on the surface of the housing 12 opposite to the display unit 22. In addition, the display unit 25 includes a display unit 25 a that overlaps the side surface of the housing 11 and a display unit 25 b that overlaps the side surface of the housing 12.
 表示部25には、例えば書籍の背表紙に相当する静止画等を好適に表示することができる。例えば、背景に用いる絵に加えて、書籍のタイトル、著者、出版社名などを表示することができる。こうすることで、電子機器10をより実際の本の形態に近づけることができる。 For example, a still image corresponding to the spine of a book can be suitably displayed on the display unit 25. For example, in addition to the picture used for the background, the title, author, publisher name, etc. of the book can be displayed. By doing so, the electronic device 10 can be brought closer to an actual book form.
 表示部25は、表示部25aと表示部25bとが別々の表示パネルにより構成されていてもよいし、可撓性を有する1つの表示パネルを用いて構成されていてもよい。 In the display unit 25, the display unit 25a and the display unit 25b may be configured by separate display panels, or may be configured by using a single flexible display panel.
 また、表示部25は、表示部23や表示部24と同様に、筐体11または筐体12に設けられ、カバー32の開口から視認可能な構成とすることができる。または、カバー32自体が表示部25を構成する表示パネルを有していてもよい。 Further, the display unit 25 can be provided in the housing 11 or the housing 12 and visible from the opening of the cover 32, similarly to the display unit 23 and the display unit 24. Alternatively, the cover 32 itself may have a display panel constituting the display unit 25.
 図5(A)等に示す電子機器10は、カバー32の三面に沿って表示部が設けられているため、それぞれ表紙、裏表紙、背表紙に相当する画像を表示させることにより、より実際の本の形態に電子機器10を近づけることができる。 Since the electronic device 10 shown in FIG. 5A and the like is provided with display portions along the three surfaces of the cover 32, it is possible to display images corresponding to the front cover, the back cover, and the back cover, respectively. The electronic device 10 can be brought close to the form of the book.
 また、カバー32の三面に沿って設けられた表示部に表示する画像を変更することにより、使用者の好みに合わせて電子機器10のデザインを自由に変更することができる。このとき、アプリケーションにより、1つの画像を表示部23、表示部24及び表示部25用の3つの画像に変換し、それぞれの表示部に画像を表示させることが好ましい。または、一つの画像が周期的に配置されたテクスチャ画像を、それぞれの表示部に表示させてもよい。 Further, by changing the image displayed on the display unit provided along the three surfaces of the cover 32, the design of the electronic device 10 can be freely changed according to the user's preference. At this time, it is preferable that an application converts one image into three images for the display unit 23, the display unit 24, and the display unit 25, and displays the images on the respective display units. Alternatively, a texture image in which one image is periodically arranged may be displayed on each display unit.
〔構成例3〕
 図6(A)、(B)、及び図7には、上記とは一部の構成の異なる電子機器10の例を示す。図6(A)は、電子機器10を開いた状態における斜視概略図であり、図6(B)は、図6(A)を反対側から見たときの斜視概略図である。また図7(A)は、電子機器10を閉じた状態における斜視概略図である。
[Configuration example 3]
FIGS. 6A, 6B, and 7 show examples of the electronic device 10 that is partially different from the above. 6A is a schematic perspective view in a state where the electronic device 10 is opened, and FIG. 6B is a schematic perspective view when FIG. 6A is viewed from the opposite side. FIG. 7A is a schematic perspective view of the electronic device 10 in a closed state.
 図6(A)等で示す電子機器10は、綴じ部33を有する。綴じ部33は、筐体11と筐体12を連結するヒンジ部31と、カバー32の一部と、保護部34と、を有する部分であり、電子機器10を開いた状態と、閉じた状態とで、変形しない部分である。 The electronic device 10 shown in FIG. 6 (A) and the like has a binding portion 33. The binding portion 33 is a portion having a hinge portion 31 that connects the housing 11 and the housing 12, a part of the cover 32, and a protection portion 34, and the electronic device 10 is opened and closed. This is a portion that does not deform.
 保護部34は、ヒンジ部31の両端に一つずつ設けられ、図7(A)に示すように、電子機器10を閉じた状態において、ヒンジ部31を保護する機能を有する。また保護部34の表面と、筐体11及び筐体12の側面とが、同一平面に位置するように、保護部34を設けることにより、すっきりとしたデザインとすることができる。 The protection part 34 is provided one by one at both ends of the hinge part 31, and has a function of protecting the hinge part 31 when the electronic device 10 is closed as shown in FIG. Further, by providing the protection unit 34 so that the surface of the protection unit 34 and the side surfaces of the housing 11 and the housing 12 are located on the same plane, a clean design can be achieved.
 綴じ部33は、書籍の背表紙に相当する部分であり、表示部25が設けられている。綴じ部33に表示部25を設けることで、表示部25を変形させる必要がないため、信頼性が向上する。 The binding part 33 is a part corresponding to the spine of a book, and is provided with a display part 25. By providing the display unit 25 in the binding unit 33, it is not necessary to deform the display unit 25, thereby improving reliability.
 また、図7(A)に示すように、カバー32の一部に、折り曲げ部35を有することが好ましい。折り曲げ部35は、カバー32を折り曲げやすくされた部分である。例えば、折り曲げ部35として、カバー32の一部に溝を設け、厚さを薄くした部分とすることができる。または、折り曲げ部35として、カバー32の一部の材質に、例えばゴムなどの弾性体を適用した部分であってもよいし、カバー32の一部にヒンジが設けられていてもよい。またカバー32の一部が、折り曲げ部35で2つに分断されていてもよい。 Further, as shown in FIG. 7A, it is preferable to have a bent portion 35 in a part of the cover 32. The bent portion 35 is a portion where the cover 32 is easily bent. For example, as the bent portion 35, a groove may be provided in a part of the cover 32 to reduce the thickness. Alternatively, the bent portion 35 may be a portion in which an elastic body such as rubber is applied to a part of the material of the cover 32, or a hinge may be provided on a part of the cover 32. A part of the cover 32 may be divided into two at the bent portion 35.
 ここでは、表示部24と、表示部25と、を有する例を示したが、上述のように、これらのいずれか一方、または両方を有さない構成としてもよい。 Here, although the example which has the display part 24 and the display part 25 was shown, as mentioned above, it is good also as a structure which does not have any one or both of these.
 図7(B)は、綴じ部33の二面に亘って、表示部25が設けられている例を示している。このとき、表示部25は、可撓性を有する一枚の表示パネルで構成されていることが好ましい。なお、綴じ部33の三面に亘って、表示部25が設けられていてもよい。また、綴じ部33の二面または三面に、それぞれ個別に表示パネルが適用された表示部を有していていてもよい。 FIG. 7B shows an example in which the display unit 25 is provided across the two surfaces of the binding unit 33. At this time, it is preferable that the display unit 25 is configured by a single display panel having flexibility. Note that the display unit 25 may be provided across the three surfaces of the binding unit 33. Moreover, you may have the display part to which the display panel was applied individually to the 2nd surface or 3rd surface of the binding part 33, respectively.
〔筐体について〕
 上記では、筐体11と筐体12とが、同様の厚さであるように示しているが、筐体11と筐体12が異なる厚さであってもよい。
[About the housing]
In the above, the casing 11 and the casing 12 are shown to have the same thickness, but the casing 11 and the casing 12 may have different thicknesses.
 図8(A)、(B)は、図3(A)~(D)で例示した電子機器10を、底面側から見たときの概略図である。図8(A)には電子機器10を開いた状態を、図8(B)は電子機器10を閉じた状態を、それぞれ示している。図8(A)、(B)において、筐体11と筐体12のそれぞれの厚さは概略一致している。 8A and 8B are schematic views of the electronic device 10 illustrated in FIGS. 3A to 3D as viewed from the bottom side. FIG. 8A shows a state where the electronic device 10 is opened, and FIG. 8B shows a state where the electronic device 10 is closed. 8A and 8B, the thicknesses of the housing 11 and the housing 12 are approximately the same.
 図8(C)、(D)は、図8(A)、(B)と比べて、筐体11の厚さを筐体12よりも薄くした場合の例を示している。このように、一方の筐体の厚さを薄くすることで、電子機器10自体の厚さを薄くすることができる。また、表示側に位置する筐体11の厚さを薄くすることで、実際の本を開いたときと同じような感覚を、使用者に感じさせることができる。 8C and 8D show an example in which the thickness of the housing 11 is made thinner than the housing 12 as compared with FIGS. 8A and 8B. Thus, by reducing the thickness of one housing, the thickness of the electronic device 10 itself can be reduced. Further, by reducing the thickness of the housing 11 located on the display side, the user can feel the same feeling as when an actual book is opened.
 図8(E)、(F)は、筐体11を有さない場合の例である。このとき、カバー32に、表示部21及び表示部23を構成する表示パネルが組み込まれる構成とすればよい。また、表示部21及び表示部23を構成する表示パネルは、それぞれ筐体12内に設けられた駆動回路により駆動される構成とすることができる。 8E and 8F are examples in the case where the housing 11 is not provided. At this time, the display 32 and the display panel 23 may be incorporated in the cover 32. The display panels constituting the display unit 21 and the display unit 23 can be configured to be driven by a drive circuit provided in the housing 12.
 また、図8(E)、(F)に示す構成の時、表示部21と表示部23とは、1枚の表示パネルによって構成されていてもよい。このとき、当該表示パネルとして、両面表示が可能な表示パネル(デュアルディスプレイともいう)を適用することが好ましい。 In the configuration shown in FIGS. 8E and 8F, the display unit 21 and the display unit 23 may be configured by a single display panel. At this time, it is preferable to apply a display panel capable of double-sided display (also referred to as a dual display) as the display panel.
 ここで、電子機器10は、閉じた状態における厚さが、0mmより大きく10cm以下、好ましくは1mm以上5cm以下、より好ましくは3mm以上3cm以下、さらに好ましくは5mm以上3cm以下とすることが好ましい。このような厚さとすることで、電子機器10を実際の本のサイズに近づけることができるため、使用者に違和感のない使用感を与えることができる。 Here, it is preferable that the electronic device 10 has a thickness in a closed state of greater than 0 mm and 10 cm or less, preferably 1 mm or more and 5 cm or less, more preferably 3 mm or more and 3 cm or less, and further preferably 5 mm or more and 3 cm or less. By setting it as such thickness, since the electronic device 10 can be brought close to the size of an actual book, the user can be given a feeling of use without a sense of incongruity.
 また、電子機器10を閉じた状態における、幅と高さの比を1:20.5程度とすることで、実際の本に近づけることができる。例えば、国際規格であるB4サイズ(257mm×364mm)、B5サイズ(182mm×257mm)、B6サイズ(128mm×182mm)や、日本の規格であるA4サイズ(210mm×297mm)、A5サイズ(148mm×210mm)、A6サイズ(105mm×148mm)など、または、国際的な他の規格や、各国独自の規格に準じたサイズとすることが好ましい。 Further, in the closed state of the electronic device 10, the ratio of the width and height of 1: With 2 0.5, can be brought close to the actual production. For example, international standards B4 size (257 mm x 364 mm), B5 size (182 mm x 257 mm), B6 size (128 mm x 182 mm), Japanese standards A4 size (210 mm x 297 mm), A5 size (148 mm x 210 mm) ), A6 size (105 mm × 148 mm) or the like, or a size according to other international standards or standards unique to each country.
[電子機器のハードウェア構成例]
 以下では、電子機器10のハードウェアの構成例について説明する。
[Hardware configuration example of electronic equipment]
Below, the structural example of the hardware of the electronic device 10 is demonstrated.
 図9は、電子機器10の構成例を示すブロック図である。 FIG. 9 is a block diagram illustrating a configuration example of the electronic device 10.
 なお、本明細書に添付した図面では、構成要素を機能ごとに分類し、互いに独立したブロックとしてブロック図を示しているが、実際の構成要素は機能ごとに完全に切り分けることが難しく、一つの構成要素が複数の機能に係わることや、一つの機能が複数の構成要素に係わることもありうる。 In the drawings attached to the present specification, the components are classified by function and the block diagram is shown as an independent block. However, it is difficult to completely separate actual components by function. A component may be related to a plurality of functions, or one function may be related to a plurality of components.
 また、図9で例示する電子機器10の構成は一例であり、全ての構成要素を含む必要はない。電子機器10は、図9に示す構成要素のうち必要な構成要素を有していればよい。また、図9に示す構成要素以外の構成要素を有していてもよい。 Further, the configuration of the electronic device 10 illustrated in FIG. 9 is an example, and it is not necessary to include all the components. The electronic device 10 only needs to have necessary constituent elements among the constituent elements illustrated in FIG. 9. Moreover, you may have components other than the component shown in FIG.
 電子機器10は、筐体11及び筐体12を有する。 The electronic device 10 includes a housing 11 and a housing 12.
 筐体11は、演算部(CPU)61、タッチパネル51、タッチパネル53、記憶装置64、ディスプレイコントローラ71、タッチセンサコントローラ72、バッテリーコントローラ73、サウンドコントローラ76、音声入力部77、音声出力部78、通信モジュール81、アンテナ82、姿勢検出部83、形状検出部84、外部インターフェース85、カメラモジュール86、振動モジュール87、センサモジュール88等を有する。 The housing 11 includes a calculation unit (CPU) 61, a touch panel 51, a touch panel 53, a storage device 64, a display controller 71, a touch sensor controller 72, a battery controller 73, a sound controller 76, an audio input unit 77, an audio output unit 78, and communication. A module 81, an antenna 82, an attitude detection unit 83, a shape detection unit 84, an external interface 85, a camera module 86, a vibration module 87, a sensor module 88, and the like are included.
 筐体12は、タッチパネル52、受電部74、バッテリーモジュール75等を有する。 The housing 12 includes a touch panel 52, a power receiving unit 74, a battery module 75, and the like.
 記憶装置64、ディスプレイコントローラ71、タッチセンサコントローラ72、バッテリーコントローラ73、サウンドコントローラ76、通信モジュール81、姿勢検出部83、形状検出部84、外部インターフェース85、カメラモジュール86、振動モジュール87、センサモジュール88等は、それぞれバスライン62を介して演算部61と接続されている。 Storage device 64, display controller 71, touch sensor controller 72, battery controller 73, sound controller 76, communication module 81, posture detection unit 83, shape detection unit 84, external interface 85, camera module 86, vibration module 87, sensor module 88 Are connected to the arithmetic unit 61 via a bus line 62, respectively.
 タッチパネル51は、上記表示部21を構成する表示パネルに相当する。タッチパネル52は、上記表示部22を構成する表示パネルに相当する。タッチパネル53は、上記表示部23を構成する表示パネルに相当する。 The touch panel 51 corresponds to a display panel that constitutes the display unit 21. The touch panel 52 corresponds to a display panel that constitutes the display unit 22. The touch panel 53 corresponds to a display panel that constitutes the display unit 23.
 タッチパネル52、受電部74、及びバッテリーモジュール75は、筐体11から入力される信号や電力によって動作することができる。2つの筐体間で電力や信号を伝達する方法としては、筐体間を横断するFPC(Flexible Printed Circuit)を用いることが挙げられる。または、2つの筐体が、それらの位置関係によらず電気的な接続が保たれる端子を有していてもよい。または信号や電力を伝達する配線が、ヒンジの内部を介して隣接する2つの筐体内に延在する構成としてもよい。 The touch panel 52, the power receiving unit 74, and the battery module 75 can be operated by signals and power input from the housing 11. As a method for transmitting power and signals between two housings, an FPC (Flexible Printed Circuit) crossing between the housings can be used. Alternatively, the two housings may have terminals that can be electrically connected regardless of their positional relationship. Or it is good also as a structure which the wiring which transmits a signal and electric power extends in two adjacent housings via the inside of a hinge.
 演算部61は、例えば中央演算装置(CPU:Central Processing Unit)として機能することができる。演算部61は、例えば、記憶装置64、ディスプレイコントローラ71、タッチセンサコントローラ72、バッテリーコントローラ73、サウンドコントローラ76、通信モジュール81、姿勢検出部83、形状検出部84、外部インターフェース85、カメラモジュール86、振動モジュール87、センサモジュール88等の各コンポーネントを制御する機能を有する。 The calculation unit 61 can function as, for example, a central processing unit (CPU). The calculation unit 61 includes, for example, a storage device 64, a display controller 71, a touch sensor controller 72, a battery controller 73, a sound controller 76, a communication module 81, a posture detection unit 83, a shape detection unit 84, an external interface 85, a camera module 86, It has a function of controlling each component such as the vibration module 87 and the sensor module 88.
 演算部61と各コンポーネントとは、バスライン62を介して信号の伝達が行われる。演算部61は、バスライン62を介して接続された各コンポーネントから入力される信号を処理する機能、及び各コンポーネントへ出力する信号を生成する機能等を有し、バスライン62に接続された各コンポーネントを統括的に制御することができる。 Signals are transmitted between the arithmetic unit 61 and each component via the bus line 62. The arithmetic unit 61 has a function of processing a signal input from each component connected via the bus line 62, a function of generating a signal output to each component, and the like. The component can be controlled centrally.
 なお、演算部61や、他のコンポーネントが有するIC等に、チャネル形成領域に酸化物半導体を用い、極めて低いオフ電流が実現されたトランジスタを利用することもできる。当該トランジスタは、オフ電流が極めて低いため、当該トランジスタを記憶素子として機能する容量素子に流入した電荷(データ)を保持するためのスイッチとして用いることで、データの保持期間を長期にわたり確保することができる。この特性を演算部61のレジスタやキャッシュメモリに用いることで、必要なときだけ演算部61を動作させ、他の場合には直前の処理の情報を当該記憶素子に待避させることにより、ノーマリーオフコンピューティングが可能となり、電子機器10の低消費電力化を図ることができる。 Note that a transistor in which an oxide semiconductor is used for a channel formation region and an extremely low off-state current is realized can be used for the arithmetic unit 61, an IC included in another component, or the like. Since the transistor has extremely low off-state current, the use of the transistor as a switch for holding charge (data) flowing into the capacitor functioning as a memory element can ensure a data holding period for a long time. it can. By using this characteristic for the register and cache memory of the arithmetic unit 61, the arithmetic unit 61 is operated only when necessary, and in other cases, the information of the immediately preceding process is saved in the storage element, thereby being normally off. Computing becomes possible, and the power consumption of the electronic device 10 can be reduced.
 演算部61は、プロセッサにより種々のプログラムからの命令を解釈し実行することで、各種のデータ処理やプログラム制御を行う。プロセッサにより実行しうるプログラムは、プロセッサが有するメモリ領域に格納されていてもよいし、記憶装置64に格納されていてもよい。 The calculation unit 61 performs various data processing and program control by interpreting and executing instructions from various programs by the processor. A program that can be executed by the processor may be stored in a memory area of the processor, or may be stored in the storage device 64.
 演算部61としては、CPUのほか、DSP(Digital Signal Processor)、GPU(Graphics Processing Unit)等の他のマイクロプロセッサを単独で、または組み合わせて用いることができる。またこれらマイクロプロセッサをFPGA(Field Programmable Gate Array)やFPAA(Field Programmable Analog Array)といったPLD(Programmable Logic Device)によって実現した構成としてもよい。 As the calculation unit 61, other microprocessors such as a DSP (Digital Signal Processor) and a GPU (Graphics Processing Unit) can be used alone or in combination as well as the CPU. Further, these microprocessors may be realized by PLD (Programmable Logic Device) such as FPGA (Field Programmable Gate Array) and FPAA (Field Programmable Analog Array).
 演算部61はメインメモリを有していてもよい。メインメモリは、RAM(Random Access Memory)、などの揮発性メモリや、ROM(Read Only Memory)などの不揮発性メモリを備える構成とすることができる。 The calculation unit 61 may have a main memory. The main memory may include a volatile memory such as a RAM (Random Access Memory) and a nonvolatile memory such as a ROM (Read Only Memory).
 メインメモリに設けられるRAMとしては、例えばDRAM(Dynamic Random Access Memory)が用いられ、演算部61の作業空間として仮想的にメモリ空間が割り当てられ利用される。記憶装置64に格納されたオペレーティングシステム、アプリケーションプログラム、プログラムモジュール、プログラムデータ等は、実行のためにRAMにロードされる。RAMにロードされたこれらのデータやプログラム、プログラムモジュールは、演算部61に直接アクセスされ、操作される。また、姿勢検出部83、形状検出部84、センサモジュール88等から入力されたデータから、電子機器10の位置及び向き、並びに各筐体の相対的な位置関係等を算出するための特性データが、ルックアップテーブルとして記憶装置64から読み出され、メインメモリに格納されていてもよい。 As the RAM provided in the main memory, for example, a DRAM (Dynamic Random Access Memory) is used, and a memory space is virtually allocated and used as a work space of the calculation unit 61. The operating system, application programs, program modules, program data, etc. stored in the storage device 64 are loaded into the RAM for execution. These data, programs, and program modules loaded in the RAM are directly accessed and operated by the arithmetic unit 61. In addition, characteristic data for calculating the position and orientation of the electronic device 10 and the relative positional relationship of the respective housings from data input from the posture detection unit 83, the shape detection unit 84, the sensor module 88, and the like. Alternatively, it may be read from the storage device 64 as a lookup table and stored in the main memory.
 一方、ROMには書き換えを必要としないBIOS(Basic Input/Output System)やファームウェア等を格納することができる。ROMとしては、マスクROMや、OTPROM(One Time Programmable Read Only Memory)、EPROM(Erasable Programmable Read Only Memory)等を用いることができる。EPROMとしては、紫外線照射により記憶データの消去を可能とするUV−EPROM(Ultra−Violet Erasable Programmable Read Only Memory)、EEPROM(Electrically Erasable Programmable Read Only Memory)、フラッシュメモリなどが挙げられる。 On the other hand, BIOS (Basic Input / Output System), firmware, etc. that do not require rewriting can be stored in the ROM. As ROM, mask ROM, OTPROM (One Time Programmable Read Only Memory), EPROM (Erasable Programmable Read Only Memory), etc. can be used. Examples of EPROM include UV-EPROM (Ultra-Violet Erasable Programmable Read Only Memory), EEPROM (Electrically Erasable Programmable Read Only Memory), etc. that can erase stored data by ultraviolet irradiation.
 記憶装置64としては、例えば、フラッシュメモリ、MRAM(Magnetoresistive Random Access Memory)、PRAM(Phase change RAM)、ReRAM(Resistive RAM)、FeRAM(Ferroelectric RAM)などの不揮発性の記憶素子が適用された記憶装置、またはDRAM(Dinamic Ram)やSRAM(Static RAM)などの揮発性の記憶素子が適用された記憶装置等を用いてもよい。また例えばハードディスクドライブ(Hard Disk Drive:HDD)やソリッドステートドライブ(Solid State Drive:SSD)などの記録メディアドライブを用いてもよい。 As the storage device 64, for example, a non-volatile storage device such as a flash memory, an MRAM (Magnetorescent Random Access Memory), a PRAM (Phase change RAM), a ReRAM (Resistive RAM), or a FeRAM (Ferroelectric RAM) is applied. Alternatively, a storage device to which a volatile storage element such as DRAM (Dynamic Ram) or SRAM (Static RAM) is applied may be used. Further, for example, a recording medium drive such as a hard disk drive (HDD) or a solid state drive (SSD) may be used.
 また、外部インターフェース85を介してコネクタより脱着可能なHDDまたはSSDなどの記憶装置や、フラッシュメモリ、ブルーレイディスク、DVDなどの記録媒体のメディアドライブを記憶装置64として用いることもできる。なお、記憶装置64を電子機器10に内蔵せず、電子機器10の外部に置かれる記憶装置を記憶装置64として用いてもよい。その場合、外部インターフェース85を介して接続される、または通信モジュール81よって無線通信でデータのやりとりをする構成であってもよい。 In addition, a storage device such as an HDD or an SSD that can be detached from the connector via the external interface 85, or a media drive of a recording medium such as a flash memory, a Blu-ray disc, or a DVD can be used as the storage device 64. Note that the storage device 64 may be used as the storage device 64 without being incorporated in the electronic device 10 and placed outside the electronic device 10. In that case, a configuration may be employed in which data is connected via the external interface 85 or data is exchanged by the communication module 81 by wireless communication.
 タッチパネル51、タッチパネル52、及びタッチパネル53は、それぞれディスプレイコントローラ71及びタッチセンサコントローラ72と接続されている。ディスプレイコントローラ71及びタッチセンサコントローラ72は、それぞれバスライン62を介して演算部61と接続される。 The touch panel 51, the touch panel 52, and the touch panel 53 are connected to a display controller 71 and a touch sensor controller 72, respectively. The display controller 71 and the touch sensor controller 72 are each connected to the calculation unit 61 via the bus line 62.
 ディスプレイコントローラ71は、バスライン62を介して演算部61から入力される描画指示に応じ、タッチパネル51、タッチパネル52、及びタッチパネル53を制御してこれらの表示面に所定の画像を表示させる。 The display controller 71 controls the touch panel 51, the touch panel 52, and the touch panel 53 in accordance with a drawing instruction input from the calculation unit 61 via the bus line 62 to display a predetermined image on these display surfaces.
 タッチセンサコントローラ72は、バスライン62を介して演算部61からの要求に応じてタッチパネル51、タッチパネル52、及びタッチパネル53のタッチセンサを制御する。また、タッチセンサで受信した信号を、バスライン62を介して演算部61に出力する。なお、タッチセンサで受信した信号からタッチ位置の情報を算出する機能を、タッチセンサコントローラ72が有していてもよいし、演算部61により算出してもよい。 The touch sensor controller 72 controls the touch sensors of the touch panel 51, the touch panel 52, and the touch panel 53 in response to a request from the calculation unit 61 via the bus line 62. In addition, a signal received by the touch sensor is output to the calculation unit 61 via the bus line 62. Note that the touch sensor controller 72 may have a function of calculating information on the touch position from the signal received by the touch sensor, or may be calculated by the calculation unit 61.
 タッチパネル51、タッチパネル52、及びタッチパネル53は、ディスプレイコントローラ71から供給される信号に基づいて、画像を表示することができる。またタッチパネル51、タッチパネル52、及びタッチパネル53はタッチセンサコントローラ72から供給される信号に基づいて、指やスタイラスなどの被検知体が近づくこと、または接触することを検出し、その位置情報をタッチセンサコントローラ72に出力することができる。 The touch panel 51, the touch panel 52, and the touch panel 53 can display an image based on a signal supplied from the display controller 71. The touch panel 51, the touch panel 52, and the touch panel 53 detect that a detected object such as a finger or a stylus is approaching or touches based on a signal supplied from the touch sensor controller 72, and the position information is detected by the touch sensor. It can be output to the controller 72.
 またタッチパネル51、タッチパネル52、及びタッチパネル53、並びにタッチセンサコントローラ72は、その検出面から被検知体までの高さ方向の距離を取得する機能を有していることが好ましい。また被検知体が検出面に与える圧力の大きさを取得する機能を有していることが好ましい。また被検知体が検出面に接触している面の大きさを取得する機能を有していることが好ましい。 Moreover, it is preferable that the touch panel 51, the touch panel 52, the touch panel 53, and the touch sensor controller 72 have a function of acquiring the distance in the height direction from the detection surface to the detected object. Moreover, it is preferable to have a function of acquiring the magnitude of pressure applied to the detection surface by the detection object. Moreover, it is preferable that the detected object has a function of acquiring the size of the surface in contact with the detection surface.
 タッチパネル51、タッチパネル52、及びタッチパネル53は、タッチセンサを備えるモジュールが表示パネルの表示面側に重ねて設けられている構成とすることができる。このとき、タッチセンサを備えるモジュールは、少なくともその一部が可撓性を有し、表示パネルに沿って湾曲可能であることが好ましい。タッチセンサを備えるモジュールと表示パネルとは接着剤等で接着することができる。またこれらの間に偏光板や緩衝材(セパレータ)を設けてもよい。タッチセンサを備えるモジュールの厚さは、表示パネルの厚さ以下とすることが好ましい。 The touch panel 51, the touch panel 52, and the touch panel 53 can be configured such that a module including a touch sensor is provided on the display surface side of the display panel. At this time, it is preferable that at least a part of the module including the touch sensor has flexibility and can be bent along the display panel. The module including the touch sensor and the display panel can be bonded with an adhesive or the like. Moreover, you may provide a polarizing plate and a buffer material (separator) between these. The thickness of the module including the touch sensor is preferably equal to or less than the thickness of the display panel.
 タッチパネル51、タッチパネル52、及びタッチパネル53は表示パネルとタッチセンサが一体となったタッチパネルであってもよい。例えば、オンセル型のタッチパネル、またはインセル型のタッチパネルとすることが好ましい。オンセル型またはインセル型のタッチパネルは、厚さが薄く軽量にすることができる。さらにオンセル型またはインセル型のタッチパネルは、部品点数を削減できるため、コストを削減することができる。 The touch panel 51, the touch panel 52, and the touch panel 53 may be a touch panel in which a display panel and a touch sensor are integrated. For example, an on-cell touch panel or an in-cell touch panel is preferable. An on-cell or in-cell touch panel can be thin and lightweight. Further, the on-cell or in-cell touch panel can reduce the number of components, and thus can reduce costs.
 タッチパネル51、タッチパネル52、及びタッチパネル53が有するタッチセンサには、指等の被検知体が近づくこと、または接触することを検知する様々なセンサを適用できる。例えば、静電容量方式、抵抗膜方式、表面弾性波方式、赤外線方式、電磁誘導方式、光学方式などの方式が適用されたセンサを用いることができる。そのほか、光電変換素子を用いた光学式センサ、感圧素子を用いた感圧センサなどを用いてもよい。また異なる方式のセンサを2種類以上有していてもよいし、同じ方式のセンサを2つ以上有していてもよい。 As the touch sensors included in the touch panel 51, the touch panel 52, and the touch panel 53, various sensors that detect that a detection target such as a finger approaches or contacts can be applied. For example, a sensor to which a method such as a capacitance method, a resistance film method, a surface acoustic wave method, an infrared method, an electromagnetic induction method, or an optical method is applied can be used. In addition, an optical sensor using a photoelectric conversion element, a pressure sensor using a pressure sensitive element, or the like may be used. Moreover, you may have two or more types of sensors of a different system, and may have two or more sensors of the same system.
 例えば静電容量方式のタッチセンサは、一対の導電層を備える。一対の導電層間は容量結合されている。一対の導電層に被検知体が触れる、押圧する、または近づくことなどにより一対の導電層間の容量の大きさが変化することを利用して、検出を行うことができる。 For example, a capacitive touch sensor includes a pair of conductive layers. A pair of conductive layers is capacitively coupled. Detection can be performed by utilizing the fact that the capacitance of the pair of conductive layers changes due to the object to be detected touching, pressing, or approaching the pair of conductive layers.
 静電容量方式としては、表面型静電容量方式、投影型静電容量方式等がある。投影型静電容量方式としては、主に駆動方式の違いから、自己容量方式、相互容量方式などがある。相互容量方式を用いると、同時多点検出が容易であるため好ましい。 As the capacitance method, there are a surface capacitance method, a projection capacitance method, and the like. As the projected capacitance method, there are a self-capacitance method, a mutual capacitance method, etc. mainly due to a difference in driving method. The mutual capacitance method is preferable because simultaneous multipoint detection is easy.
 また、タッチパネル51、タッチパネル52、またはタッチパネル53に代えて、タッチセンサとしての機能を有さない表示パネルを適用してもよい。 Further, instead of the touch panel 51, the touch panel 52, or the touch panel 53, a display panel that does not have a function as a touch sensor may be applied.
 可撓性を有するタッチパネル51、タッチパネル52、及びタッチパネル53、表示パネル、タッチセンサ等としては、例えば表示素子やこれを駆動する回路、またはタッチセンサを構成する回路等を支持する基板に、可撓性を有する基板を用いることで実現できる。タッチパネル51、タッチパネル52、及びタッチパネル53に可撓性を有する基板を適用することで、電子機器10を軽くすることができるため、好ましい。 As the flexible touch panel 51, the touch panel 52, the touch panel 53, the display panel, the touch sensor, and the like, for example, flexible on a substrate that supports a display element, a circuit that drives the display element, a circuit that constitutes the touch sensor, or the like. This can be realized by using a substrate having a property. It is preferable to apply a flexible substrate to the touch panel 51, the touch panel 52, and the touch panel 53 because the electronic device 10 can be lightened.
 可撓性を有する基板の材料としては、代表的には有機樹脂を用いることができる。そのほか、可撓性を有する程度に薄いガラス、金属、合金、半導体等を用いることができる。または、有機樹脂、ガラス、金属、合金、半導体などのうち2以上を含む複合材料または積層材料を用いることができる。 An organic resin can be typically used as a flexible substrate material. In addition, glass, metal, alloy, semiconductor, or the like thin enough to have flexibility can be used. Alternatively, a composite material or a stacked material containing two or more of organic resin, glass, metal, alloy, semiconductor, and the like can be used.
 バッテリーコントローラ73は、バッテリーモジュール75の充電状態を管理することができる。またバッテリーコントローラ73は、バッテリーモジュール75からの電力を各コンポーネントに供給する。受電部74は、外部から供給された電力を受電し、バッテリーモジュール75を充電する機能を有する。バッテリーコントローラ73は、バッテリーモジュール75の充電状態に応じて、受電部74の動作を制御することができる。 The battery controller 73 can manage the charging state of the battery module 75. The battery controller 73 supplies power from the battery module 75 to each component. The power receiving unit 74 has a function of receiving power supplied from the outside and charging the battery module 75. The battery controller 73 can control the operation of the power receiving unit 74 according to the state of charge of the battery module 75.
 バッテリーモジュール75は、例えば1つ以上の一次電池や二次電池を有する。バッテリーモジュール75に用いることのできる二次電池として、例えばリチウムイオン二次電池や、リチウムイオンポリマー二次電池などが挙げられる。また、バッテリーモジュール75はこのような電池に加えて、バッテリーの過充電及び過放電等を防ぐ保護回路が設けられていてもよい。 The battery module 75 includes, for example, one or more primary batteries and secondary batteries. Examples of the secondary battery that can be used for the battery module 75 include a lithium ion secondary battery and a lithium ion polymer secondary battery. In addition to such a battery, the battery module 75 may be provided with a protection circuit that prevents overcharge and overdischarge of the battery.
 家屋内などで使用する場合には、外部電源として交流電源(AC)を用いてもよい。特に電子機器10を外部電源と切り離して使用する場合には、充放電容量が大きく長時間にわたって電子機器10の使用を可能とするバッテリーモジュール75が望ましい。バッテリーモジュール75の充電を行う場合には、電子機器10に電力を供給可能な充電器を用いてもよい。この際、USB(Universal Serial Bus)コネクタやACアダプタ等を用いた有線方式で充電を行ってもよいし、電界結合方式、電磁誘導方式、電磁共鳴(電磁共振結合)方式などの無線給電方式により充電を行う構成としてもよい。 When used in a house or the like, an AC power source (AC) may be used as an external power source. In particular, when the electronic device 10 is used separately from an external power source, the battery module 75 that has a large charge / discharge capacity and enables the electronic device 10 to be used for a long time is desirable. When charging the battery module 75, a charger that can supply power to the electronic device 10 may be used. At this time, charging may be performed by a wired method using a USB (Universal Serial Bus) connector or an AC adapter, or by a wireless power feeding method such as an electric field coupling method, an electromagnetic induction method, an electromagnetic resonance (electromagnetic resonance coupling) method, or the like. It is good also as a structure which charges.
 バッテリーコントローラ73は、例えばバッテリマネジメントユニット(BMU)を有していてもよい。BMUは電池のセル電圧やセル温度データの収集、過充電及び過放電の監視、セルバランサの制御、電池劣化状態の管理、電池残量(State Of Charge:SOC)の算出、故障検出の制御などを行う。 The battery controller 73 may have, for example, a battery management unit (BMU). BMU collects battery cell voltage and cell temperature data, monitors overcharge and overdischarge, controls the cell balancer, manages battery deterioration, calculates remaining battery charge (State Of Charge: SOC), controls fault detection, etc. I do.
 バッテリーコントローラ73は、バッテリーモジュール75から電源供給ライン(図示しない)を介して各コンポーネントに電力を送電するための制御を行う。バッテリーコントローラ73は、例えば複数チャネルの電力コンバータやインバータ、保護回路等を有する構成とすることができる。 The battery controller 73 performs control for transmitting power from the battery module 75 to each component via a power supply line (not shown). The battery controller 73 can be configured to include, for example, a multi-channel power converter, an inverter, a protection circuit, and the like.
 バッテリーモジュール75は、タッチパネル52と重ねて配置する構成とすることが好ましい。このとき、バッテリーモジュール75が組み込まれる筐体(ここでは筐体12)が可撓性を有し、これを曲げて使用することのできる構成の場合には、バッテリーモジュール75の少なくとも一部もまた、可撓性を有することが好ましい。バッテリーモジュール75に適用できる二次電池として、例えばリチウムイオン二次電池や、リチウムイオンポリマー二次電池などが挙げられる。また、これら電池に可撓性を持たせるため、電池の外装容器にラミネート袋を用いるとよい。 The battery module 75 is preferably arranged so as to overlap the touch panel 52. At this time, in the case where the casing (here, the casing 12) in which the battery module 75 is incorporated is flexible and can be bent and used, at least a part of the battery module 75 is also used. It is preferable to have flexibility. Examples of secondary batteries applicable to the battery module 75 include lithium ion secondary batteries and lithium ion polymer secondary batteries. In order to give flexibility to these batteries, a laminate bag may be used for the battery outer container.
 ラミネート袋に用いるフィルムは金属フィルム(アルミニウム、ステンレス、ニッケル鋼など)、有機材料からなるプラスチックフィルム、有機材料(有機樹脂や繊維など)と無機材料(セラミックなど)とを含むハイブリッド材料フィルム、炭素含有無機フィルム(カーボンフィルム、グラファイトフィルムなど)から選ばれる単層フィルムまたはこれら複数からなる積層フィルムを用いる。金属フィルムは、エンボス加工を行いやすく、エンボス加工を行って凹部または凸部を形成すると外気に触れるフィルムの表面積が増大するため、放熱効果に優れている。 Films used in laminated bags are metal films (aluminum, stainless steel, nickel steel, etc.), plastic films made of organic materials, hybrid material films containing organic materials (organic resins, fibers, etc.) and inorganic materials (ceramics, etc.), carbon-containing A single layer film selected from inorganic films (carbon film, graphite film, etc.) or a laminated film composed of a plurality of these is used. A metal film is easy to emboss, and when the embossing is performed to form a concave portion or a convex portion, the surface area of the film that comes into contact with the outside air is increased, so that the heat dissipation effect is excellent.
 特にラミネート袋として、エンボス加工により凹部と凸部が形成された、金属フィルムを有するラミネート袋を用いると、当該ラミネート袋に加えられた応力によって生じるひずみを緩和することができる。その結果、二次電池を曲げたときにラミネート袋が破れてしまうなどの不具合を効果的に低減できるため好ましい。 Particularly, when a laminate bag having a metal film in which concave portions and convex portions are formed by embossing is used as the laminate bag, strain caused by stress applied to the laminate bag can be reduced. As a result, it is preferable because problems such as the laminate bag being torn when the secondary battery is bent can be effectively reduced.
 また、バッテリーコントローラ73は、低消費電力化機能を有していることが好ましい。例えば低消費電力化機能として、電子機器10に一定時間入力がないことを検出し、演算部61のクロック周波数を低下またはクロックの入力を停止させること、演算部61自体の動作を停止させること、補助メモリの動作を停止させること、各コンポーネントへ供給する電力を減らして電力の消費を削減すること、などが挙げられる。このような機能は、バッテリーコントローラ73のみにより、あるいは演算部61と連動して実行することができる。 Moreover, it is preferable that the battery controller 73 has a low power consumption function. For example, as a low power consumption function, it is detected that there is no input for a certain period of time in the electronic device 10, and the clock frequency of the calculation unit 61 is reduced or clock input is stopped, the operation of the calculation unit 61 itself is stopped Examples include stopping the operation of the auxiliary memory and reducing power consumption by reducing power supplied to each component. Such a function can be executed only by the battery controller 73 or in conjunction with the calculation unit 61.
 音声入力部77は例えばマイクロフォンや音声入力コネクタ等を有する。また音声出力部78は例えばスピーカや音声出力コネクタ等を有する。音声入力部77及び音声出力部78はそれぞれサウンドコントローラ76に接続され、バスライン62を介して演算部61と接続する。音声入力部77に入力された音声データは、サウンドコントローラ76においてデジタル信号に変換され、サウンドコントローラ76や演算部61において処理される。一方、サウンドコントローラ76は、演算部61からの命令に応じて、ユーザが可聴なアナログ音声信号を生成し、音声出力部78に出力する。音声出力部78が有する音声出力コネクタには、イヤフォン、ヘッドフォン、ヘッドセット等の音声出力装置を接続可能で、当該装置にサウンドコントローラ76で生成した音声が出力される。 The voice input unit 77 has, for example, a microphone and a voice input connector. The audio output unit 78 includes, for example, a speaker and an audio output connector. The audio input unit 77 and the audio output unit 78 are each connected to the sound controller 76 and connected to the arithmetic unit 61 via the bus line 62. The sound data input to the sound input unit 77 is converted into a digital signal by the sound controller 76 and processed by the sound controller 76 and the calculation unit 61. On the other hand, the sound controller 76 generates an analog audio signal audible to the user in response to a command from the calculation unit 61 and outputs the analog audio signal to the audio output unit 78. An audio output connector such as an earphone, a headphone, or a headset can be connected to the audio output connector of the audio output unit 78, and audio generated by the sound controller 76 is output to the device.
 通信モジュール81は、アンテナ82を介して通信を行うことができる。例えば演算部61からの命令に応じて電子機器10をコンピュータネットワークに接続するための制御信号を制御し、当該信号をコンピュータネットワークに発信する。これによって、World Wide Web(WWW)の基盤であるインターネット、イントラネット、エクストラネット、PAN(Personal Area Network)、LAN(Local Area Network)、CAN(Campus Area Network)、MAN(Metropolitan Area Network)、WAN(Wide Area Network)、GAN(Global Area Network)等のコンピュータネットワークに電子機器10を接続させ、通信を行うことができる。またその通信方法として複数の方法を用いる場合には、アンテナ82は当該通信方法に応じて複数有していてもよい。 The communication module 81 can communicate via the antenna 82. For example, a control signal for connecting the electronic device 10 to the computer network is controlled according to a command from the arithmetic unit 61, and the signal is transmitted to the computer network. As a result, the Internet, intranet, extranet, PAN (Personal Area Network), LAN (Local Area Network), CAN (Campus Area Network), and MAN (MetroAporeNetwork) are the foundations of the World Wide Web (WWW). Communication can be performed by connecting the electronic device 10 to a computer network such as Wide Area Network) or GAN (Global Area Network). When a plurality of methods are used as the communication method, a plurality of antennas 82 may be provided depending on the communication method.
 通信モジュール81には、例えば高周波回路(RF回路)を設け、RF信号の送受信を行えばよい。高周波回路は、各国法制により定められた周波数帯域の電磁信号と電気信号とを相互に変換し、当該電磁信号を用いて無線で他の通信機器との間で通信を行うための回路である。実用的な周波数帯域として数10kHz~数10GHzが一般に用いられている。アンテナ82と接続される高周波回路には、複数の周波数帯域に対応した高周波回路部を有し、高周波回路部は、増幅器(アンプ)、ミキサ、フィルタ、DSP、RFトランシーバ等を有する構成とすることができる。無線通信を行う場合、通信プロトコル又は通信技術として、LTE(Long Term Evolution)、GSM(Global System for Mobile Communication:登録商標)、EDGE(Enhanced Data Rates for GSM Evolution)、CDMA2000(Code Division Multiple Access 2000)、W−CDMA(登録商標)などの通信規格、またはWi−Fi(登録商標)、Bluetooth(登録商標)、ZigBee(登録商標)等のIEEEにより通信規格化された仕様を用いることができる。 The communication module 81 may be provided with, for example, a high frequency circuit (RF circuit) to transmit and receive RF signals. The high-frequency circuit is a circuit for mutually converting an electromagnetic signal and an electric signal in a frequency band determined by the legislation of each country and performing communication with other communication devices wirelessly using the electromagnetic signal. Several tens of kHz to several tens of GHz is generally used as a practical frequency band. The high-frequency circuit connected to the antenna 82 includes a high-frequency circuit unit corresponding to a plurality of frequency bands, and the high-frequency circuit unit includes an amplifier (amplifier), a mixer, a filter, a DSP, an RF transceiver, and the like. Can do. When performing wireless communication, as communication protocols or communication technologies, LTE (Long Term Evolution), GSM (Global System for Mobile Communication: registered trademark), EDGE (Enhanced Data Rates for GSM Evolvement, CDMA Emulsion, CDMA Emulsion) , Communication standards such as W-CDMA (registered trademark), or specifications standardized by IEEE such as Wi-Fi (registered trademark), Bluetooth (registered trademark), ZigBee (registered trademark) can be used.
 また、通信モジュール81は、電子機器10を電話回線と接続する機能を有していてもよい。電話回線を通じた通話を行う場合には、通信モジュール81は、演算部61からの命令に応じて、電子機器10を電話回線に接続するための接続信号を制御し、当該信号を電話回線に発信する。 Further, the communication module 81 may have a function of connecting the electronic device 10 to a telephone line. When making a call through the telephone line, the communication module 81 controls a connection signal for connecting the electronic device 10 to the telephone line in accordance with a command from the arithmetic unit 61 and transmits the signal to the telephone line. To do.
 通信モジュール81は、アンテナ82により受信した放送電波から、タッチパネル51、タッチパネル52、及びタッチパネル53に出力する映像信号を生成するチューナーを有していてもよい。例えばチューナーは、復調回路と、A−D変換回路(アナログ−デジタル変換回路)と、デコーダ回路等を有する構成とすることができる。復調回路はアンテナ82から入力した信号を復調する機能を有する。またA−D変換回路は、復調されたアナログ信号をデジタル信号に変換する機能を有する。またデコーダ回路は、デジタル信号に含まれる映像データをデコードし、ディスプレイコントローラ71に送信する信号を生成する機能を有する。 The communication module 81 may include a tuner that generates video signals to be output to the touch panel 51, the touch panel 52, and the touch panel 53 from the broadcast radio wave received by the antenna 82. For example, the tuner can include a demodulation circuit, an A / D conversion circuit (analog-digital conversion circuit), a decoder circuit, and the like. The demodulation circuit has a function of demodulating a signal input from the antenna 82. The A-D conversion circuit has a function of converting the demodulated analog signal into a digital signal. The decoder circuit has a function of decoding video data included in the digital signal and generating a signal to be transmitted to the display controller 71.
 またデコーダが分割回路と、複数のプロセッサを有する構成としてもよい。分割回路は、入力された映像のデータを空間的、時間的に分割し、各プロセッサに出力する機能を有する。複数のプロセッサは、入力された映像データをデコードし、ディスプレイコントローラ71に送信する信号を生成する。このように、デコーダとして、複数のプロセッサによりデータを並列処理する構成を適用することで、極めて情報量の多い映像データをデコードすることができる。特にフルハイビジョンを超える解像度を有する映像を表示する場合には、圧縮されたデータをデコードするデコーダ回路が極めて高速な処理能力を有するプロセッサを有していることが好ましい。また、例えばデコーダ回路は、4以上、好ましくは8以上、より好ましくは16以上の並列処理が可能な複数のプロセッサを含む構成とすることが好ましい。またデコーダは、入力された信号に含まれる映像用の信号と、それ以外の信号(文字情報、番組情報、認証情報等)を分離する回路を有していてもよい。 Further, the decoder may have a configuration including a dividing circuit and a plurality of processors. The dividing circuit has a function of dividing input video data spatially and temporally and outputting the divided data to each processor. The plurality of processors decode the input video data and generate a signal to be transmitted to the display controller 71. As described above, by applying a configuration in which data is processed in parallel by a plurality of processors as a decoder, video data with an extremely large amount of information can be decoded. In particular, when displaying video having a resolution exceeding full high-definition, it is preferable that the decoder circuit for decoding the compressed data has a processor having extremely high processing speed. For example, the decoder circuit preferably includes a plurality of processors capable of parallel processing of 4 or more, preferably 8 or more, more preferably 16 or more. The decoder may include a circuit that separates a video signal included in the input signal and other signals (character information, program information, authentication information, and the like).
 アンテナ82により受信できる放送電波としては、地上波、または衛星から送信される電波などが挙げられる。またアンテナ82により受信できる放送電波として、アナログ放送、デジタル放送などがあり、また映像及び音声、または音声のみの放送などがある。例えばUHF帯(約300MHz~3GHz)またはVHF帯(30MHz~300MHz)のうちの特定の周波数帯域で送信される放送電波を受信することができる。また例えば、複数の周波数帯域で受信した複数のデータを用いることで、転送レートを高くすることができ、より多くの情報を得ることができる。これによりフルハイビジョンを超える解像度を有する映像を、タッチパネル51、タッチパネル52、及びタッチパネル53に表示させることができる。例えば、4K2K、8K4K、16K8K、またはそれ以上の解像度を有する映像を表示させることができる。 Broadcast radio waves that can be received by the antenna 82 include terrestrial waves or radio waves transmitted from satellites. Broadcast radio waves that can be received by the antenna 82 include analog broadcast, digital broadcast, etc., and video and audio, or audio-only broadcast. For example, broadcast radio waves transmitted in a specific frequency band in the UHF band (about 300 MHz to 3 GHz) or the VHF band (30 MHz to 300 MHz) can be received. In addition, for example, by using a plurality of data received in a plurality of frequency bands, the transfer rate can be increased and more information can be obtained. Thereby, an image having a resolution exceeding full high-definition can be displayed on the touch panel 51, the touch panel 52, and the touch panel 53. For example, an image having a resolution of 4K2K, 8K4K, 16K8K, or higher can be displayed.
 また、チューナーはコンピュータネットワークを介したデータ伝送技術により送信された放送のデータを用いて、ディスプレイコントローラ71に送信する信号を生成する構成としてもよい。このとき、受信する信号がデジタル信号の場合には、チューナーは復調回路及びA−D変換回路を有していなくてもよい。 Further, the tuner may be configured to generate a signal to be transmitted to the display controller 71 using broadcast data transmitted by a data transmission technique via a computer network. At this time, when the signal to be received is a digital signal, the tuner may not include the demodulation circuit and the A-D conversion circuit.
 姿勢検出部83は、電子機器10の傾きや姿勢等を検出する機能を有する。例えば姿勢検出部83としては、加速度センサ、角速度センサ、振動センサ、圧力センサ、ジャイロセンサ等を用いることができる。また、これらのセンサを複数組み合わせて用いてもよい。 The attitude detection unit 83 has a function of detecting the tilt and attitude of the electronic device 10. For example, as the posture detection unit 83, an acceleration sensor, an angular velocity sensor, a vibration sensor, a pressure sensor, a gyro sensor, or the like can be used. A combination of a plurality of these sensors may be used.
 形状検出部84は、2つの筐体が閉じた状態と、これらが開いた状態と、の2状態を検出する機能を有する。そして形状検出部84は、その情報を演算部61にバスライン62を介して出力する機能を有する。形状検出部84としては、例えば筐体11と筐体12とが閉じた状態を検知する物理スイッチ等を用いることができる。 The shape detection unit 84 has a function of detecting two states, a state where the two housings are closed and a state where they are opened. The shape detection unit 84 has a function of outputting the information to the calculation unit 61 via the bus line 62. As the shape detection unit 84, for example, a physical switch that detects a closed state of the housing 11 and the housing 12 can be used.
 また、2つの筐体が閉じた状態と、開いた状態とを、光学的に検知する方法を用いてもよい。例えば、隣接する2つの筐体のいずれか一方に受光素子を配置し、これらが閉じたときに外光が遮光されることを利用して検出する構成としてもよい。または、隣接する2つの筐体の一方の表面に受光素子を配置し、他方の表面に光源を配置することで、これらが閉じた状態または開いた状態のいずれかのときに、受光素子に光源からの光が入射される、または入射されなくなることを利用して検出する構成としてもよい。この時、光源からの光として赤外線を用いると、使用者に視認されないため好ましい。 Also, a method of optically detecting the closed state and the open state of the two housings may be used. For example, a configuration may be adopted in which a light receiving element is arranged in one of two adjacent housings, and detection is performed using the fact that external light is shielded when these are closed. Alternatively, a light receiving element is arranged on one surface of two adjacent housings, and a light source is arranged on the other surface, so that when the light receiving element is in a closed state or an open state, It is good also as a structure which detects using the light from which it enters, or it stops entering. At this time, it is preferable to use infrared rays as light from the light source because it is not visually recognized by the user.
 また形状検出部84は、筐体11と筐体12の相対的な角度(位置情報)を検知し、その情報を演算部61にバスライン62を介して出力する機能を有していてもよい。 In addition, the shape detection unit 84 may have a function of detecting a relative angle (position information) between the housing 11 and the housing 12 and outputting the information to the calculation unit 61 via the bus line 62. .
 例えば筐体12に姿勢検出部83と同様のセンサを配置する構成としてもよい。形状検出部84で取得された筐体12の傾きや姿勢の情報が、バスライン62を介して演算部61に入力されると、演算部61は姿勢検出部83により検出された筐体11の傾きや姿勢の情報と、筐体12の傾きや姿勢の情報から筐体11と筐体12の相対的な位置関係を算出することができる。 For example, a configuration in which a sensor similar to the posture detection unit 83 is disposed in the housing 12 may be employed. When the information on the inclination and orientation of the casing 12 acquired by the shape detection unit 84 is input to the calculation unit 61 via the bus line 62, the calculation unit 61 detects the case 11 detected by the posture detection unit 83. The relative positional relationship between the housing 11 and the housing 12 can be calculated from the information on the tilt and orientation and the information on the tilt and orientation of the housing 12.
 または、形状検出部84としては、上記構成例で例示したヒンジ部31の回転角を検出することで、ヒンジ部31で接続された2つの筐体の相対的な位置を検出する構成としてもよい。このとき、ヒンジ部31の各回転軸に対する回転角を機械的、光学的、磁気的、または電気的に検出する構成とすることができる。 Alternatively, the shape detection unit 84 may be configured to detect the relative position of the two housings connected by the hinge unit 31 by detecting the rotation angle of the hinge unit 31 exemplified in the above configuration example. . At this time, it can be set as the structure which detects the rotation angle with respect to each rotating shaft of the hinge part 31 mechanically, optically, magnetically, or electrically.
 なお、形状検出部84の構成はこれに限られず、隣接する2つの筐体の相対的な位置関係を検出することができるものであれば、機械的、電磁気的、熱的、音響的、化学的手段を応用した様々なセンサを用いることができる。 The configuration of the shape detection unit 84 is not limited to this, and any mechanical, electromagnetic, thermal, acoustic, chemical, or chemical can be used as long as the relative positional relationship between two adjacent cases can be detected. Various sensors to which an appropriate means is applied can be used.
 外部インターフェース85としては、例えば筐体11または筐体12に設けられた1つ以上のボタンやスイッチ(筐体スイッチともいう)、その他の入力コンポーネントが接続可能な外部ポートなどが挙げられる。外部インターフェース85は、バスライン62を介して演算部61と接続される。筐体スイッチとしては、電源のオン/オフと関連付けられたスイッチ、音量調節のためのボタン、カメラ撮影用ボタンなどがある。 Examples of the external interface 85 include one or more buttons and switches (also referred to as a housing switch) provided on the housing 11 or the housing 12, and an external port to which other input components can be connected. The external interface 85 is connected to the calculation unit 61 via the bus line 62. Case switches include a switch associated with power on / off, a volume control button, a camera shooting button, and the like.
 また外部インターフェース85が有する外部ポートとしては、例えばコンピュータやプリンタなどの外部装置にケーブルを介して接続できる構成とすることができる。代表的には、USB端子などがある。また、外部ポートとして、LAN(Local Area Network)接続用端子、デジタル放送の受信用端子、ACアダプタを接続する端子等を有していてもよい。また、有線だけでなく、赤外線、可視光、紫外線などを用いた光通信用の送受信機を設ける構成としてもよい。 Also, the external port of the external interface 85 can be configured to be connected to an external device such as a computer or printer via a cable. A typical example is a USB terminal. The external port may include a LAN (Local Area Network) connection terminal, a digital broadcast reception terminal, a terminal for connecting an AC adapter, and the like. In addition to a wired connection, a configuration may be provided in which a transceiver for optical communication using infrared rays, visible light, ultraviolet rays, or the like is provided.
 カメラモジュール86は、バスライン62を介して演算部61と接続される。例えば筐体に設けられたスイッチが押されることや、タッチパネル51、タッチパネル52、及びタッチパネル53へのタッチ操作と連動して、静止画または動画を撮影することができる。またカメラモジュール86は、撮影用の光源を有していてもよい。例えばキセノンランプなどのランプ、LEDや有機ELなどの発光素子等を用いることができる。または、撮影用の光源として、タッチパネル51、タッチパネル52、及びタッチパネル53が発する光を利用してもよく、その場合には、白色だけでなく様々な色の光を撮影用の光源として用いてもよい。 The camera module 86 is connected to the calculation unit 61 via the bus line 62. For example, a still image or a moving image can be taken in conjunction with a switch provided on the housing being pressed or a touch operation on the touch panel 51, the touch panel 52, and the touch panel 53. The camera module 86 may have a light source for photographing. For example, a lamp such as a xenon lamp, a light emitting element such as an LED or an organic EL, or the like can be used. Alternatively, light emitted from the touch panel 51, the touch panel 52, and the touch panel 53 may be used as a light source for photographing. In that case, light of various colors as well as white light may be used as the light source for photographing. Good.
 振動モジュール87は、電子機器10を振動させる振動素子と、振動素子を制御する振動コントローラと、を有する。振動素子としては、振動モータ(偏心モータ)、共振アクチュエータ、磁歪素子、圧電素子など、電気信号や磁気信号を振動に変換することのできる素子を用いることができる。 The vibration module 87 includes a vibration element that vibrates the electronic device 10 and a vibration controller that controls the vibration element. As the vibration element, an element that can convert an electric signal or a magnetic signal into vibration, such as a vibration motor (eccentric motor), a resonance actuator, a magnetostrictive element, or a piezoelectric element, can be used.
 振動モジュール87は、演算部61からの命令に応じて、振動素子の振動の振動数、振幅、振動させる期間等を制御することで、様々な振動パターンで電子機器10を振動させることができる。例えば、筐体スイッチ等が操作されることに連動した振動、電子機器10の起動に連動した振動、動画再生用アプリケーションで再生される動画や音声と連動した振動、電子メールの着信に連動した振動、タッチパネル51、タッチパネル52、及びタッチパネル53への入力動作に連動した振動など、各種アプリケーションにおいて実行される動作に基づく様々な振動パターンの振動を、振動モジュール87により発することができる。 The vibration module 87 can vibrate the electronic device 10 with various vibration patterns by controlling the vibration frequency, amplitude, period of vibration, and the like of the vibration element according to a command from the calculation unit 61. For example, vibration associated with the operation of a housing switch, vibration associated with activation of the electronic device 10, vibration associated with video or audio played by a video playback application, vibration associated with incoming e-mail The vibration module 87 can generate vibrations of various vibration patterns based on operations executed in various applications such as vibrations linked to input operations to the touch panel 51, the touch panel 52, and the touch panel 53.
 センサモジュール88は、センサユニットと、センサコントローラとを有する。センサコントローラは、センサユニットにバッテリーモジュール75等からの電力を供給する。またセンサコントローラはセンサユニットからの入力を受け、制御信号に変換してバスライン62を介して演算部61に出力する。センサコントローラにおいて、センサユニットのエラー管理を行ってもよいし、センサユニットの校正処理を行ってもよい。なお、センサコントローラは、センサユニットを制御するコントローラを複数備える構成としてもよい。 The sensor module 88 has a sensor unit and a sensor controller. The sensor controller supplies power from the battery module 75 or the like to the sensor unit. The sensor controller receives an input from the sensor unit, converts it into a control signal, and outputs the control signal to the arithmetic unit 61 via the bus line 62. In the sensor controller, error management of the sensor unit may be performed, or calibration processing of the sensor unit may be performed. The sensor controller may include a plurality of controllers that control the sensor unit.
 センサモジュール88は、例えば力、変位、位置、速度、加速度、角速度、回転数、距離、光、液、磁気、温度、化学物質、音声、時間、硬度、電場、電流、電圧、電力、放射線、流量、湿度、傾度、振動、においまたは赤外線を測定する機能を有する各種センサを備える構成としてもよい。 The sensor module 88 includes, for example, force, displacement, position, velocity, acceleration, angular velocity, rotation speed, distance, light, liquid, magnetism, temperature, chemical substance, sound, time, hardness, electric field, current, voltage, power, radiation, It is good also as a structure provided with the various sensors which have the function to measure flow volume, humidity, inclination, a vibration, an odor, or infrared rays.
 図9では、タッチパネル52以外に、バッテリーモジュール75及び受電部74を筐体12に配置し、他のコンポーネントを筐体11に集約する構成の例を示している。このような構成とすることで、筐体12に配置可能なバッテリーモジュールの大きさを大きくでき、電子機器10の充電の頻度を少なくすることができる。なお、筐体11の空いたスペースに、他のバッテリーモジュールを配置してもよい。 FIG. 9 shows an example of a configuration in which the battery module 75 and the power receiving unit 74 are arranged in the casing 12 in addition to the touch panel 52, and other components are collected in the casing 11. With such a configuration, the size of the battery module that can be arranged in the housing 12 can be increased, and the frequency of charging the electronic device 10 can be reduced. Note that another battery module may be arranged in the space in the housing 11.
 なお、ここでは示さないが、表示部24を構成する表示パネルまたはタッチパネルを、筐体12に設けてもよい。また、表示部25を構成する表示パネルまたはタッチパネルを、筐体11または筐体12に設けてもよい。 Although not shown here, a display panel or a touch panel constituting the display unit 24 may be provided in the housing 12. Further, a display panel or a touch panel constituting the display unit 25 may be provided in the housing 11 or the housing 12.
 また、図8(E)、(F)に示すように、筐体11を有さない場合には、タッチパネル51及びタッチパネル52以外の全てのコンポーネントを筐体12に配置し、タッチパネル51及びタッチパネル52をカバー32に設ければよい。 Further, as shown in FIGS. 8E and 8F, when the housing 11 is not provided, all components other than the touch panel 51 and the touch panel 52 are arranged in the housing 12, and the touch panel 51 and the touch panel 52 are arranged. May be provided on the cover 32.
 なお、図9ではタッチパネル52、受電部74及びバッテリーモジュール75が筐体12に設けられている例を示したが、これらは筐体11に設けられていてもよいし、筐体11と筐体12の両方に設けられていてもよい。また、筐体11に設けられた各コンポーネントも同様に、筐体12に設けられていてもよいし、筐体11と筐体12の両方に設けられていてもよい。 9 illustrates an example in which the touch panel 52, the power receiving unit 74, and the battery module 75 are provided in the housing 12, these may be provided in the housing 11, or the housing 11 and the housing. 12 may be provided in both. Similarly, each component provided in the housing 11 may be provided in the housing 12 or may be provided in both the housing 11 and the housing 12.
 以上が、電子機器10のハードウェア構成の例についての説明である。 The above is an explanation of an example of the hardware configuration of the electronic device 10.
 本実施の形態は、少なくともその一部を本明細書中に記載する他の実施の形態と適宜組み合わせて実施することができる。 Note that at least part of this embodiment can be implemented in combination with any of the other embodiments described in this specification as appropriate.
(実施の形態2)
 以下では、本発明の一態様の電子機器の表示部等に用いることのできる表示パネルの例について説明する。以下で例示する表示パネルは、反射型の液晶素子と、発光素子の両方を有し、透過モードと反射モードの両方の表示を行うことのできる、表示パネルである。
(Embodiment 2)
Examples of display panels that can be used for the display portion and the like of the electronic device of one embodiment of the present invention are described below. The display panel exemplified below is a display panel that includes both a reflective liquid crystal element and a light-emitting element and can perform both transmission mode and reflection mode displays.
[構成例]
 図10(A)は、表示パネル200の構成の一例を示すブロック図である。表示パネル200は、表示部162にマトリクス状に配列した複数の画素210を有する。また表示パネル200は、回路GDと、回路SDを有する。また方向Rに配列した複数の画素210、及び回路GDと電気的に接続する複数の配線G1、複数の配線G2、複数の配線ANO、及び複数の配線CSCOMを有する。また方向Cに配列した複数の画素210、及び回路SDと電気的に接続する複数の配線S1及び複数の配線S2を有する。
[Configuration example]
FIG. 10A is a block diagram illustrating an example of the structure of the display panel 200. The display panel 200 includes a plurality of pixels 210 arranged in a matrix on the display portion 162. The display panel 200 includes a circuit GD and a circuit SD. In addition, a plurality of pixels 210 arranged in the direction R, and a plurality of wirings G1, a plurality of wirings G2, a plurality of wirings ANO, and a plurality of wirings CSCOM electrically connected to the circuit GD are provided. In addition, a plurality of pixels 210 arranged in the direction C and a plurality of wirings S1 and a plurality of wirings S2 electrically connected to the circuit SD are provided.
 画素210は、反射型の液晶素子と、発光素子を有する。画素210において、液晶素子と発光素子とは、互いに重なる部分を有する。 The pixel 210 includes a reflective liquid crystal element and a light emitting element. In the pixel 210, the liquid crystal element and the light-emitting element have portions that overlap each other.
 図10(B1)は、画素210が有する導電層111bの構成例を示す。導電層111bは、画素210における液晶素子の反射電極として機能する。また導電層111bには、開口251が設けられている。 FIG. 10B1 illustrates a configuration example of the conductive layer 111b included in the pixel 210. The conductive layer 111b functions as a reflective electrode of the liquid crystal element in the pixel 210. In addition, an opening 251 is provided in the conductive layer 111b.
 図10(B1)には、導電層111bと重なる領域に位置する発光素子160を破線で示している。発光素子160は、導電層111bが有する開口251と重ねて配置されている。これにより、発光素子160が発する光は、開口251を介して表示面側に射出される。 In FIG. 10B1, the light-emitting element 160 located in a region overlapping with the conductive layer 111b is indicated by a broken line. The light-emitting element 160 is disposed so as to overlap with the opening 251 included in the conductive layer 111b. Thereby, the light emitted from the light emitting element 160 is emitted to the display surface side through the opening 251.
 図10(B1)では、方向Rに隣接する画素210が異なる色に対応する画素である。このとき、図10(B1)に示すように、方向Rに配列する複数の画素において、複数の開口251が一直線上に配列されないように、それぞれ導電層111bの異なる位置に設けられていることが好ましい。これにより、隣接する2つの発光素子160を離すことが可能で、発光素子160が発する光が隣接する画素210が有する着色層に入射してしまう現象(クロストークともいう)を抑制することができる。また、隣接する2つの発光素子160を離して配置することができるため、発光素子160のEL層をシャドウマスク等により作り分ける場合であっても、高い精細度の表示パネルを実現できる。 In FIG. 10 (B1), the pixels 210 adjacent in the direction R are pixels corresponding to different colors. At this time, as shown in FIG. 10B1, in the plurality of pixels arranged in the direction R, the plurality of openings 251 may be provided at different positions on the conductive layer 111b so as not to be arranged in a straight line. preferable. Accordingly, the two adjacent light emitting elements 160 can be separated from each other, and a phenomenon (also referred to as crosstalk) in which light emitted from the light emitting elements 160 enters the colored layer of the adjacent pixel 210 can be suppressed. . In addition, since the two adjacent light emitting elements 160 can be arranged apart from each other, a high-definition display panel can be realized even when the EL layer of the light emitting element 160 is separately formed using a shadow mask or the like.
 また、図10(B2)に示すような配列としてもよい。 Alternatively, an arrangement as shown in FIG. 10 (B2) may be used.
 非開口部の総面積に対する開口251の総面積の比の値が大きすぎると、液晶素子を用いた表示が暗くなってしまう。また、非開口部の総面積に対する開口251の総面積の比の値が小さすぎると、発光素子160を用いた表示が暗くなってしまう。 If the ratio of the total area of the opening 251 to the total area of the non-opening is too large, the display using the liquid crystal element becomes dark. In addition, if the value of the ratio of the total area of the opening 251 to the total area of the non-opening is too small, the display using the light emitting element 160 becomes dark.
 また、反射電極として機能する導電層111bに設ける開口251の面積が小さすぎると、発光素子160が射出する光から取り出せる光の効率が低下してしまう。 If the area of the opening 251 provided in the conductive layer 111b functioning as a reflective electrode is too small, the efficiency of light that can be extracted from the light emitted from the light emitting element 160 is lowered.
 開口251の形状は、例えば多角形、四角形、楕円形、円形または十字等の形状とすることができる。また、細長い筋状、スリット状、市松模様状の形状としてもよい。また、開口251を隣接する画素に寄せて配置してもよい。好ましくは、開口251を同じ色を表示する他の画素に寄せて配置する。これにより、クロストークを抑制できる。 The shape of the opening 251 can be, for example, a polygon, a rectangle, an ellipse, a circle, a cross, or the like. Moreover, it is good also as an elongated streak shape, a slit shape, and a checkered shape. Further, the opening 251 may be arranged close to adjacent pixels. Preferably, the opening 251 is arranged close to other pixels that display the same color. Thereby, crosstalk can be suppressed.
[回路構成例]
 図11は、画素210の構成例を示す回路図である。図11では、隣接する2つの画素210を示している。
[Circuit configuration example]
FIG. 11 is a circuit diagram illustrating a configuration example of the pixel 210. In FIG. 11, two adjacent pixels 210 are shown.
 画素210は、スイッチSW1、容量素子C1、液晶素子140、スイッチSW2、トランジスタM、容量素子C2、及び発光素子160等を有する。また、画素210には、配線G1、配線G2、配線ANO、配線CSCOM、配線S1、及び配線S2が電気的に接続されている。また、図11では、液晶素子140と電気的に接続する配線VCOM1、及び発光素子160と電気的に接続する配線VCOM2を示している。 The pixel 210 includes a switch SW1, a capacitor element C1, a liquid crystal element 140, a switch SW2, a transistor M, a capacitor element C2, a light emitting element 160, and the like. In addition, a wiring G1, a wiring G2, a wiring ANO, a wiring CSCOM, a wiring S1, and a wiring S2 are electrically connected to the pixel 210. In FIG. 11, a wiring VCOM1 electrically connected to the liquid crystal element 140 and a wiring VCOM2 electrically connected to the light emitting element 160 are illustrated.
 図11では、スイッチSW1及びスイッチSW2に、トランジスタを用いた場合の例を示している。 FIG. 11 shows an example in which transistors are used for the switch SW1 and the switch SW2.
 スイッチSW1は、ゲートが配線G1と接続され、ソース又はドレインの一方が配線S1と接続され、ソース又はドレインの他方が容量素子C1の一方の電極、及び液晶素子140の一方の電極と接続されている。容量素子C1は、他方の電極が配線CSCOMと接続されている。液晶素子140は、他方の電極が配線VCOM1と接続されている。 The switch SW1 has a gate connected to the wiring G1, a source or drain connected to the wiring S1, and the other source or drain connected to one electrode of the capacitor C1 and one electrode of the liquid crystal element 140. Yes. The other electrode of the capacitor C1 is connected to the wiring CSCOM. The other electrode of the liquid crystal element 140 is connected to the wiring VCOM1.
 またスイッチSW2は、ゲートが配線G2と接続され、ソース又はドレインの一方が配線S2と接続され、ソース又はドレインの他方が、容量素子C2の一方の電極、トランジスタMのゲートと接続されている。容量素子C2は、他方の電極がトランジスタMのソース又はドレインの一方、及び配線ANOと接続されている。トランジスタMは、ソース又はドレインの他方が発光素子160の一方の電極と接続されている。発光素子160は、他方の電極が配線VCOM2と接続されている。 The switch SW2 has a gate connected to the wiring G2, one of the source and the drain connected to the wiring S2, and the other of the source and the drain connected to one electrode of the capacitor C2 and the gate of the transistor M. The other electrode of the capacitor C2 is connected to one of the source and the drain of the transistor M and the wiring ANO. In the transistor M, the other of the source and the drain is connected to one electrode of the light emitting element 160. The other electrode of the light emitting element 160 is connected to the wiring VCOM2.
 図11では、トランジスタMが半導体を挟む2つのゲートを有し、これらが接続されている例を示している。これにより、トランジスタMが流すことのできる電流を増大させることができる。 FIG. 11 shows an example in which the transistor M has two gates sandwiching a semiconductor and these are connected. As a result, the current that can be passed by the transistor M can be increased.
 配線G1には、スイッチSW1を導通状態または非導通状態に制御する信号を与えることができる。配線VCOM1には、所定の電位を与えることができる。配線S1には、液晶素子140が有する液晶の配向状態を制御する信号を与えることができる。配線CSCOMには、所定の電位を与えることができる。 The signal which controls switch SW1 to a conduction | electrical_connection state or a non-conduction state can be given to wiring G1. A predetermined potential can be applied to the wiring VCOM1. A signal for controlling the alignment state of the liquid crystal included in the liquid crystal element 140 can be supplied to the wiring S1. A predetermined potential can be applied to the wiring CSCOM.
 配線G2には、スイッチSW2を導通状態または非導通状態に制御する信号を与えることができる。配線VCOM2及び配線ANOには、発光素子160が発光する電位差が生じる電位をそれぞれ与えることができる。配線S2には、トランジスタMの導通状態を制御する信号を与えることができる。 The signal which controls switch SW2 to a conduction | electrical_connection state or a non-conduction state can be given to wiring G2. The wiring VCOM2 and the wiring ANO can each be supplied with a potential at which a potential difference generated by the light emitting element 160 emits light. A signal for controlling the conduction state of the transistor M can be supplied to the wiring S2.
 図11に示す画素210は、例えば反射モードの表示を行う場合には、配線G1及び配線S1に与える信号により駆動し、液晶素子140による光学変調を利用して表示することができる。また、透過モードで表示を行う場合には、配線G2及び配線S2に与える信号により駆動し、発光素子160を発光させて表示することができる。また両方のモードで駆動する場合には、配線G1、配線G2、配線S1及び配線S2のそれぞれに与える信号により駆動することができる。 For example, when performing display in a reflection mode, the pixel 210 illustrated in FIG. 11 is driven by a signal applied to the wiring G1 and the wiring S1, and can display using optical modulation by the liquid crystal element 140. In the case where display is performed in the transmissive mode, display can be performed by driving the light-emitting element 160 to emit light by driving the signals to the wiring G2 and the wiring S2. In the case of driving in both modes, the driving can be performed by signals given to the wiring G1, the wiring G2, the wiring S1, and the wiring S2.
 なお、図11では一つの画素210に、一つの液晶素子140と一つの発光素子160とを有する例を示したが、これに限られない。図12は、一つの画素210に一つの液晶素子140と4つの発光素子160を有する例を示している。図12に示す画素210は、図11とは異なり、1つの画素でフルカラーの表示が可能な画素である。 Note that although FIG. 11 illustrates an example in which one pixel 210 includes one liquid crystal element 140 and one light emitting element 160, the present invention is not limited thereto. FIG. 12 illustrates an example in which one pixel 210 includes one liquid crystal element 140 and four light emitting elements 160. A pixel 210 illustrated in FIG. 12 is a pixel capable of full color display with one pixel, unlike FIG.
 図12では図11の例に加えて、画素210に配線G3及び配線S3が接続されている。 12, in addition to the example of FIG. 11, a wiring G3 and a wiring S3 are connected to the pixel 210.
 図12に示す例では、例えば4つの発光素子160を、それぞれ赤色(R)、緑色(G)、青色(B)、及び白色(W)を呈する発光素子を用いることができる。また液晶素子140として、白色を呈する反射型の液晶素子を用いることができる。これにより、反射モードの表示を行う場合には、反射率の高い白色の表示を行うことができる。また透過モードで表示を行う場合には、演色性の高い表示を低い電力で行うことができる。 In the example shown in FIG. 12, for example, the four light emitting elements 160 can be light emitting elements that exhibit red (R), green (G), blue (B), and white (W), respectively. As the liquid crystal element 140, a reflective liquid crystal element exhibiting white can be used. Thereby, when displaying in reflection mode, white display with high reflectance can be performed. In addition, when display is performed in the transmissive mode, display with high color rendering properties can be performed with low power.
[表示パネルの構成例]
 図13は、本発明の一態様の表示パネル100の斜視概略図である。表示パネル100は、基板151と基板161とが貼り合わされた構成を有する。図13では、基板161を破線で明示している。
[Display panel configuration example]
FIG. 13 is a schematic perspective view of the display panel 100 of one embodiment of the present invention. The display panel 100 has a configuration in which a substrate 151 and a substrate 161 are bonded to each other. In FIG. 13, the substrate 161 is clearly indicated by a broken line.
 表示パネル100は、表示部162、回路164、配線165等を有する。基板151には、例えば回路164、配線165、及び画素電極として機能する導電層111b等が設けられる。また図13では基板151上にIC173とFPC172が実装されている例を示している。そのため、図13に示す構成は、表示パネル100とFPC172及びIC173を有する表示モジュールと言うこともできる。 The display panel 100 includes a display unit 162, a circuit 164, a wiring 165, and the like. The substrate 151 is provided with, for example, a circuit 164, a wiring 165, a conductive layer 111b that functions as a pixel electrode, and the like. FIG. 13 shows an example in which an IC 173 and an FPC 172 are mounted on a substrate 151. Therefore, the structure illustrated in FIG. 13 can be said to be a display module including the display panel 100, the FPC 172, and the IC 173.
 回路164は、例えば走査線駆動回路として機能する回路を用いることができる。 As the circuit 164, for example, a circuit that functions as a scanning line driver circuit can be used.
 配線165は、表示部や回路164に信号や電力を供給する機能を有する。当該信号や電力は、FPC172を介して外部、またはIC173から配線165に入力される。 The wiring 165 has a function of supplying signals and power to the display unit and the circuit 164. The signal and power are input to the wiring 165 from the outside or the IC 173 through the FPC 172.
 また、図13では、COG(Chip On Glass)方式等により、基板151にIC173が設けられている例を示している。IC173は、例えば走査線駆動回路、または信号線駆動回路などとしての機能を有するICを適用できる。なお表示パネル100が走査線駆動回路及び信号線駆動回路として機能する回路を備える場合や、走査線駆動回路や信号線駆動回路として機能する回路を外部に設け、FPC172を介して表示パネル100を駆動するための信号を入力する場合などでは、IC173を設けない構成としてもよい。また、IC173を、COF(Chip On Film)方式等により、FPC172に実装してもよい。 FIG. 13 shows an example in which the IC 173 is provided on the substrate 151 by a COG (Chip On Glass) method or the like. As the IC 173, for example, an IC having a function as a scan line driver circuit, a signal line driver circuit, or the like can be used. Note that when the display panel 100 includes a circuit that functions as a scanning line driver circuit and a signal line driver circuit, or a circuit that functions as a scanning line driver circuit or a signal line driver circuit is provided outside, the display panel 100 is driven via the FPC 172. In the case of inputting a signal for doing so, the IC 173 may be omitted. Further, the IC 173 may be mounted on the FPC 172 by a COF (Chip On Film) method or the like.
 図13には、表示部162の一部の拡大図を示している。表示部162には、複数の表示素子が有する導電層111bがマトリクス状に配置されている。導電層111bは、可視光を反射する機能を有し、後述する液晶素子140の反射電極として機能する。 FIG. 13 shows an enlarged view of a part of the display unit 162. In the display portion 162, conductive layers 111b included in the plurality of display elements are arranged in a matrix. The conductive layer 111b has a function of reflecting visible light, and functions as a reflective electrode of the liquid crystal element 140 described later.
 また、図13に示すように、導電層111bは開口を有する。さらに導電層111bよりも基板151側に、発光素子160を有する。発光素子160からの光は、導電層111bの開口を介して基板161側に射出される。 Further, as shown in FIG. 13, the conductive layer 111b has an opening. Further, the light-emitting element 160 is provided on the substrate 151 side with respect to the conductive layer 111b. Light from the light-emitting element 160 is emitted to the substrate 161 side through the opening of the conductive layer 111b.
[断面構成例]
 図14に、図13で例示した表示パネルの、FPC172を含む領域の一部、回路164を含む領域の一部、及び表示部162を含む領域の一部をそれぞれ切断したときの断面の一例を示す。
[Section configuration example]
FIG. 14 illustrates an example of a cross section of the display panel illustrated in FIG. 13 when a part of the region including the FPC 172, a part of the region including the circuit 164, and a part of the region including the display portion 162 are cut. Show.
 表示パネルは、基板151と基板161の間に、絶縁層220を有する。また基板151と絶縁層220の間に、発光素子160、トランジスタ201、トランジスタ205、トランジスタ206、着色層134等を有する。また絶縁層220と基板161の間に、液晶素子140、着色層131等を有する。また基板161と絶縁層220は接着層141を介して接着され、基板151と絶縁層220は接着層142を介して接着されている。 The display panel has an insulating layer 220 between the substrate 151 and the substrate 161. In addition, the light-emitting element 160, the transistor 201, the transistor 205, the transistor 206, the coloring layer 134, and the like are provided between the substrate 151 and the insulating layer 220. In addition, the liquid crystal element 140, the coloring layer 131, and the like are provided between the insulating layer 220 and the substrate 161. The substrate 161 and the insulating layer 220 are bonded through an adhesive layer 141, and the substrate 151 and the insulating layer 220 are bonded through an adhesive layer 142.
 トランジスタ206は、液晶素子140と電気的に接続し、トランジスタ205は、発光素子160と電気的に接続する。トランジスタ205とトランジスタ206は、いずれも絶縁層220の基板151側の面上に形成されているため、これらを同一の工程を用いて作製することができる。 The transistor 206 is electrically connected to the liquid crystal element 140, and the transistor 205 is electrically connected to the light emitting element 160. Since both the transistor 205 and the transistor 206 are formed over the surface of the insulating layer 220 on the substrate 151 side, they can be manufactured using the same process.
 基板161には、着色層131、遮光層132、絶縁層121、及び液晶素子140の共通電極として機能する導電層113、配向膜133b、絶縁層117等が設けられている。絶縁層117は、液晶素子140のセルギャップを保持するためのスペーサとして機能する。 The substrate 161 is provided with a colored layer 131, a light shielding layer 132, an insulating layer 121, a conductive layer 113 functioning as a common electrode of the liquid crystal element 140, an alignment film 133b, an insulating layer 117, and the like. The insulating layer 117 functions as a spacer for maintaining the cell gap of the liquid crystal element 140.
 絶縁層220の基板151側には、絶縁層211、絶縁層212、絶縁層213、絶縁層214、絶縁層215等の絶縁層が設けられている。絶縁層211は、その一部が各トランジスタのゲート絶縁層として機能する。絶縁層212、絶縁層213、及び絶縁層214は、各トランジスタを覆って設けられている。また絶縁層214を覆って絶縁層215が設けられている。絶縁層214及び絶縁層215は、平坦化層としての機能を有する。なお、ここではトランジスタ等を覆う絶縁層として、絶縁層212、絶縁層213、絶縁層214の3層を有する場合について示しているが、これに限られず4層以上であってもよいし、単層、または2層であってもよい。また平坦化層として機能する絶縁層214は、不要であれば設けなくてもよい。 The insulating layer 220 is provided with insulating layers such as an insulating layer 211, an insulating layer 212, an insulating layer 213, an insulating layer 214, and an insulating layer 215 on the substrate 151 side. A part of the insulating layer 211 functions as a gate insulating layer of each transistor. The insulating layer 212, the insulating layer 213, and the insulating layer 214 are provided so as to cover each transistor. An insulating layer 215 is provided to cover the insulating layer 214. The insulating layer 214 and the insulating layer 215 function as a planarization layer. Note that although the case where the insulating layer covering the transistor and the like has three layers of the insulating layer 212, the insulating layer 213, and the insulating layer 214 is described here, the number of layers is not limited to this, and four or more layers may be used. It may be a layer or two layers. The insulating layer 214 functioning as a planarization layer is not necessarily provided if not necessary.
 また、トランジスタ201、トランジスタ205、及びトランジスタ206は、一部がゲートとして機能する導電層221、一部がソース又はドレインとして機能する導電層222、半導体層231を有する。ここでは、同一の導電膜を加工して得られる複数の層に、同じハッチングパターンを付している。 The transistor 201, the transistor 205, and the transistor 206 each include a conductive layer 221 that partially functions as a gate, a conductive layer 222 that partially functions as a source or a drain, and a semiconductor layer 231. Here, the same hatching pattern is given to a plurality of layers obtained by processing the same conductive film.
 液晶素子140は反射型の液晶素子である。液晶素子140は、導電層111a、液晶112、導電層113が積層された積層構造を有する。また導電層111aの基板151側に接して、可視光を反射する導電層111bが設けられている。導電層111bは開口251を有する。また導電層111a及び導電層113は可視光を透過する材料を含む。また液晶112と導電層111aの間に配向膜133aが設けられ、液晶112と導電層113の間に配向膜133bが設けられている。また、基板161の外側の面には、偏光板130を有する。 The liquid crystal element 140 is a reflective liquid crystal element. The liquid crystal element 140 has a stacked structure in which a conductive layer 111a, a liquid crystal 112, and a conductive layer 113 are stacked. In addition, a conductive layer 111b that reflects visible light is provided in contact with the conductive layer 111a on the substrate 151 side. The conductive layer 111 b has an opening 251. The conductive layer 111a and the conductive layer 113 include a material that transmits visible light. An alignment film 133 a is provided between the liquid crystal 112 and the conductive layer 111 a, and an alignment film 133 b is provided between the liquid crystal 112 and the conductive layer 113. In addition, a polarizing plate 130 is provided on the outer surface of the substrate 161.
 液晶素子140において、導電層111bは可視光を反射する機能を有し、導電層113は可視光を透過する機能を有する。基板161側から入射した光は、偏光板130により偏光され、導電層113、液晶112を透過し、導電層111bで反射する。そして液晶112及び導電層113を再度透過して、偏光板130に達する。このとき、導電層111bと導電層113の間に与える電圧によって液晶の配向を制御し、光の光学変調を制御することができる。すなわち、偏光板130を介して射出される光の強度を制御することができる。また光は着色層131によって特定の波長領域以外の光が吸収されることにより、取り出される光は、例えば赤色を呈する光となる。 In the liquid crystal element 140, the conductive layer 111b has a function of reflecting visible light, and the conductive layer 113 has a function of transmitting visible light. Light incident from the substrate 161 side is polarized by the polarizing plate 130, passes through the conductive layer 113 and the liquid crystal 112, and is reflected by the conductive layer 111b. Then, the light passes through the liquid crystal 112 and the conductive layer 113 again and reaches the polarizing plate 130. At this time, alignment of liquid crystal can be controlled by a voltage applied between the conductive layer 111b and the conductive layer 113, and optical modulation of light can be controlled. That is, the intensity of light emitted through the polarizing plate 130 can be controlled. In addition, light that is not in a specific wavelength region is absorbed by the colored layer 131, so that the extracted light is, for example, red light.
 発光素子160は、ボトムエミッション型の発光素子である。発光素子160は、絶縁層220側から導電層191、EL層192、及び導電層193bの順に積層された積層構造を有する。また導電層193bを覆って導電層193aが設けられている。導電層193bは可視光を反射する材料を含み、導電層191及び導電層193aは可視光を透過する材料を含む。発光素子160が発する光は、着色層134、絶縁層220、開口251、導電層113等を介して、基板161側に射出される。 The light emitting element 160 is a bottom emission type light emitting element. The light-emitting element 160 has a stacked structure in which a conductive layer 191, an EL layer 192, and a conductive layer 193b are stacked in this order from the insulating layer 220 side. A conductive layer 193a is provided to cover the conductive layer 193b. The conductive layer 193b includes a material that reflects visible light, and the conductive layer 191 and the conductive layer 193a include a material that transmits visible light. Light emitted from the light-emitting element 160 is emitted to the substrate 161 side through the coloring layer 134, the insulating layer 220, the opening 251, the conductive layer 113, and the like.
 ここで、図14に示すように、開口251には可視光を透過する導電層111aが設けられていることが好ましい。これにより、開口251と重なる領域においてもそれ以外の領域と同様に液晶112が配向するため、これらの領域の境界部で液晶の配向不良が生じ、意図しない光が漏れてしまうことを抑制できる。 Here, as shown in FIG. 14, the opening 251 is preferably provided with a conductive layer 111a that transmits visible light. Accordingly, since the liquid crystal 112 is aligned in the region overlapping with the opening 251 similarly to the other regions, alignment failure of the liquid crystal occurs at the boundary portion between these regions, and unintended light leakage can be suppressed.
 ここで、基板161の外側の面に配置する偏光板130として直線偏光板を用いてもよいが、円偏光板を用いることもできる。円偏光板としては、例えば直線偏光板と1/4波長位相差板を積層したものを用いることができる。これにより、外光反射を抑制することができる。また、偏光板の種類に応じて、液晶素子140に用いる液晶素子のセルギャップ、配向、駆動電圧等を調整することで、所望のコントラストが実現されるようにすればよい。 Here, a linear polarizing plate may be used as the polarizing plate 130 disposed on the outer surface of the substrate 161, but a circular polarizing plate may also be used. As a circularly-polarizing plate, what laminated | stacked the linearly-polarizing plate and the quarter wavelength phase difference plate, for example can be used. Thereby, external light reflection can be suppressed. In addition, a desired contrast may be realized by adjusting a cell gap, an alignment, a driving voltage, and the like of the liquid crystal element used for the liquid crystal element 140 according to the type of the polarizing plate.
 また導電層191の端部を覆う絶縁層216上には、絶縁層217が設けられている。絶縁層217は、絶縁層220と基板151が必要以上に接近することを抑制するスペーサとしての機能を有する。またEL層192や導電層193aを遮蔽マスク(メタルマスク)を用いて形成する場合には、当該遮蔽マスクが被形成面に接触することを抑制する機能を有していてもよい。なお、絶縁層217は不要であれば設けなくてもよい。 An insulating layer 217 is provided over the insulating layer 216 that covers the end portion of the conductive layer 191. The insulating layer 217 has a function as a spacer for suppressing the insulating layer 220 and the substrate 151 from approaching more than necessary. In the case where the EL layer 192 and the conductive layer 193a are formed using a shielding mask (metal mask), the EL layer 192 and the conductive layer 193a may have a function of suppressing contact of the shielding mask with a formation surface. Note that the insulating layer 217 is not necessarily provided if not necessary.
 トランジスタ205のソース又はドレインの一方は、導電層224を介して発光素子160の導電層191と電気的に接続されている。 One of the source and the drain of the transistor 205 is electrically connected to the conductive layer 191 of the light-emitting element 160 through the conductive layer 224.
 トランジスタ206のソース又はドレインの一方は、接続部207を介して導電層111bと電気的に接続されている。導電層111bと導電層111aは接して設けられ、これらは電気的に接続されている。ここで、接続部207は、絶縁層220に設けられた開口を介して、絶縁層220の両面に設けられる導電層同士を接続する部分である。 One of the source and the drain of the transistor 206 is electrically connected to the conductive layer 111b through the connection portion 207. The conductive layer 111b and the conductive layer 111a are provided in contact with each other and are electrically connected. Here, the connection portion 207 is a portion that connects the conductive layers provided on both surfaces of the insulating layer 220 through openings provided in the insulating layer 220.
 基板151と基板161とが重ならない領域には、接続部204が設けられている。接続部204は、接続層242を介してFPC172と電気的に接続されている。接続部204は接続部207と同様の構成を有している。接続部204の上面は、導電層111aと同一の導電膜を加工して得られた導電層が露出している。これにより、接続部204とFPC172とを接続層242を介して電気的に接続することができる。 A connecting portion 204 is provided in a region where the substrate 151 and the substrate 161 do not overlap. The connection portion 204 is electrically connected to the FPC 172 through the connection layer 242. The connection unit 204 has the same configuration as the connection unit 207. A conductive layer obtained by processing the same conductive film as the conductive layer 111a is exposed on the upper surface of the connection portion 204. Accordingly, the connection unit 204 and the FPC 172 can be electrically connected via the connection layer 242.
 接着層141が設けられる一部の領域には、接続部252が設けられている。接続部252において、導電層111aと同一の導電膜を加工して得られた導電層と、導電層113の一部が、接続体243により電気的に接続されている。したがって、基板161側に形成された導電層113に、基板151側に接続されたFPC172から入力される信号または電位を、接続部252を介して供給することができる。 The connection part 252 is provided in the one part area | region in which the contact bonding layer 141 is provided. In the connection portion 252, a conductive layer obtained by processing the same conductive film as the conductive layer 111 a and a part of the conductive layer 113 are electrically connected to each other by a connection body 243. Therefore, a signal or a potential input from the FPC 172 connected to the substrate 151 side can be supplied to the conductive layer 113 formed on the substrate 161 side through the connection portion 252.
 接続体243としては、例えば導電性の粒子を用いることができる。導電性の粒子としては、有機樹脂またはシリカなどの粒子の表面を金属材料で被覆したものを用いることができる。金属材料としてニッケルや金を用いると接触抵抗を低減できるため好ましい。またニッケルをさらに金で被覆するなど、2種類以上の金属材料を層状に被覆させた粒子を用いることが好ましい。また接続体243として、弾性変形、または塑性変形する材料を用いることが好ましい。このとき導電性の粒子である接続体243は、図14に示すように上下方向に潰れた形状となる場合がある。こうすることで、接続体243と、これと電気的に接続する導電層との接触面積が増大し、接触抵抗を低減できるほか、接続不良などの不具合の発生を抑制することができる。 As the connection body 243, for example, conductive particles can be used. As the conductive particles, those obtained by coating the surface of particles such as organic resin or silica with a metal material can be used. It is preferable to use nickel or gold as the metal material because the contact resistance can be reduced. In addition, it is preferable to use particles in which two or more kinds of metal materials are coated in layers, such as further coating nickel with gold. Further, it is preferable to use a material that is elastically deformed or plastically deformed as the connection body 243. At this time, the connection body 243, which is a conductive particle, may have a shape crushed in the vertical direction as shown in FIG. By doing so, the contact area between the connection body 243 and the conductive layer electrically connected to the connection body 243 can be increased, the contact resistance can be reduced, and the occurrence of problems such as connection failure can be suppressed.
 接続体243は、接着層141に覆われるように配置することが好ましい。例えば例えば、硬化前の接着層141に接続体243を分散させておけばよい。 The connection body 243 is preferably disposed so as to be covered with the adhesive layer 141. For example, the connection body 243 may be dispersed in the adhesive layer 141 before curing.
 図14では、回路164の例としてトランジスタ201が設けられている例を示している。 FIG. 14 shows an example in which a transistor 201 is provided as an example of the circuit 164.
 図14では、トランジスタ201及びトランジスタ205の例として、チャネルが形成される半導体層231を2つのゲートで挟持する構成が適用されている。一方のゲートは導電層221により、他方のゲートは絶縁層212を介して半導体層231と重なる導電層223により構成されている。このような構成とすることで、トランジスタのしきい値電圧を制御することができる。このとき、2つのゲートを接続し、これらに同一の信号を供給することによりトランジスタを駆動してもよい。このようなトランジスタは他のトランジスタと比較して電界効果移動度を高めることが可能であり、オン電流を増大させることができる。その結果、高速駆動が可能な回路を作製することができる。さらには、回路部の占有面積を縮小することが可能となる。オン電流の大きなトランジスタを適用することで、表示パネルを大型化、または高精細化したときに配線数が増大したとしても、各配線における信号遅延を低減することが可能であり、表示ムラを抑制することができる。 In FIG. 14, as an example of the transistor 201 and the transistor 205, a configuration in which a semiconductor layer 231 in which a channel is formed is sandwiched between two gates is applied. One gate is formed of a conductive layer 221, and the other gate is formed of a conductive layer 223 that overlaps with the semiconductor layer 231 with an insulating layer 212 interposed therebetween. With such a structure, the threshold voltage of the transistor can be controlled. At this time, the transistor may be driven by connecting two gates and supplying the same signal thereto. Such a transistor can have higher field-effect mobility than other transistors, and can increase on-state current. As a result, a circuit that can be driven at high speed can be manufactured. Furthermore, the area occupied by the circuit portion can be reduced. By applying a transistor with a large on-state current, signal delay in each wiring can be reduced and display unevenness can be suppressed even if the number of wirings increases when the display panel is increased in size or definition. can do.
 なお、回路164が有するトランジスタと、表示部162が有するトランジスタは、同じ構造であってもよい。また回路164が有する複数のトランジスタは、全て同じ構造であってもよいし、異なる構造のトランジスタを組み合わせて用いてもよい。また、表示部162が有する複数のトランジスタは、全て同じ構造であってもよいし、異なる構造のトランジスタを組み合わせて用いてもよい。 Note that the transistor included in the circuit 164 and the transistor included in the display portion 162 may have the same structure. In addition, the plurality of transistors included in the circuit 164 may have the same structure or may be combined with different structures. In addition, the plurality of transistors included in the display portion 162 may have the same structure or may be combined with different structures.
 各トランジスタを覆う絶縁層212、絶縁層213のうち少なくとも一方は、水や水素などの不純物が拡散しにくい材料を用いることが好ましい。すなわち、絶縁層212または絶縁層213はバリア膜として機能させることができる。このような構成とすることで、トランジスタに対して外部から不純物が拡散することを効果的に抑制することが可能となり、信頼性の高い表示パネルを実現できる。 At least one of the insulating layer 212 and the insulating layer 213 that covers each transistor is preferably made of a material in which impurities such as water and hydrogen hardly diffuse. That is, the insulating layer 212 or the insulating layer 213 can function as a barrier film. With such a structure, it is possible to effectively prevent impurities from diffusing from the outside to the transistor, and a highly reliable display panel can be realized.
 基板161側において、着色層131、遮光層132を覆って絶縁層121が設けられている。絶縁層121は、平坦化層としての機能を有していてもよい。絶縁層121により、導電層113の表面を概略平坦にできるため、液晶112の配向状態を均一にできる。 On the substrate 161 side, an insulating layer 121 is provided so as to cover the colored layer 131 and the light shielding layer 132. The insulating layer 121 may function as a planarization layer. Since the surface of the conductive layer 113 can be substantially flattened by the insulating layer 121, the alignment state of the liquid crystal 112 can be made uniform.
 表示パネル100を作製する方法の一例について説明する。例えば剥離層を有する支持基板上に、導電層111a、導電層111b、絶縁層220を順に形成し、その後、トランジスタ205、トランジスタ206、発光素子160等を形成した後、接着層142を用いて基板151と支持基板を貼り合せる。その後、剥離層と絶縁層220、及び剥離層と導電層111aのそれぞれの界面で剥離することにより、支持基板及び剥離層を除去する。またこれとは別に、着色層131、遮光層132、導電層113等をあらかじめ形成した基板161を準備する。そして基板151または基板161に液晶112を滴下し、接着層141により基板151と基板161を貼り合せることで、表示パネル100を作製することができる。 An example of a method for manufacturing the display panel 100 will be described. For example, the conductive layer 111a, the conductive layer 111b, and the insulating layer 220 are formed in this order over a supporting substrate having a separation layer, and after that, the transistor 205, the transistor 206, the light-emitting element 160, and the like are formed, and then the substrate is formed using the adhesive layer 142. 151 and a support substrate are bonded together. Thereafter, the supporting substrate and the peeling layer are removed by peeling at the interfaces of the peeling layer and the insulating layer 220 and between the peeling layer and the conductive layer 111a. Separately, a substrate 161 on which a colored layer 131, a light shielding layer 132, a conductive layer 113, and the like are formed in advance is prepared. Then, the liquid crystal 112 is dropped on the substrate 151 or the substrate 161, and the substrate 151 and the substrate 161 are bonded to each other with the adhesive layer 141, whereby the display panel 100 can be manufactured.
 剥離層としては、絶縁層220及び導電層111aとの界面で剥離が生じる材料を適宜選択することができる。特に、剥離層としてタングステンなどの高融点金属材料を含む層と当該金属材料の酸化物を含む層を積層して用い、剥離層上の絶縁層220として、窒化シリコンや酸化窒化シリコン、窒化酸化シリコン等を複数積層した層を用いることが好ましい。剥離層に高融点金属材料を用いると、これよりも後に形成する層の形成温度を高めることが可能で、不純物の濃度が低減され、信頼性の高い表示パネルを実現できる。 As the peeling layer, a material that causes peeling at the interface between the insulating layer 220 and the conductive layer 111a can be appropriately selected. In particular, a layer containing a refractory metal material such as tungsten and a layer containing an oxide of the metal material are stacked as the peeling layer, and silicon nitride, silicon oxynitride, or silicon nitride oxide is used as the insulating layer 220 over the peeling layer. It is preferable to use a layer in which a plurality of such layers are stacked. When a refractory metal material is used for the separation layer, the formation temperature of a layer formed later can be increased, the impurity concentration is reduced, and a highly reliable display panel can be realized.
 導電層111aとしては、金属酸化物、金属窒化物、または低抵抗化された酸化物半導体等の酸化物または窒化物を用いることが好ましい。酸化物半導体を用いる場合には、水素、ボロン、リン、窒素、及びその他の不純物の濃度、並びに酸素欠損量の少なくとも一が、トランジスタに用いる半導体層に比べて高められた材料を、導電層111aに用いればよい。 As the conductive layer 111a, an oxide or a nitride such as a metal oxide, a metal nitride, or a low-resistance oxide semiconductor is preferably used. In the case of using an oxide semiconductor, a material in which at least one of the concentration of hydrogen, boron, phosphorus, nitrogen, and other impurities, and the amount of oxygen vacancies is higher than that of a semiconductor layer used in a transistor is used. Can be used.
[各構成要素について]
 以下では、上記に示す各構成要素について説明する。
[About each component]
Below, each component shown above is demonstrated.
〔基板〕
 表示パネルが有する基板には、平坦面を有する材料を用いることができる。表示素子からの光を取り出す側の基板には、該光を透過する材料を用いる。例えば、ガラス、石英、セラミック、サファイヤ、有機樹脂などの材料を用いることができる。
〔substrate〕
A substrate having a flat surface can be used for the substrate included in the display panel. For the substrate from which light from the display element is extracted, a material that transmits the light is used. For example, materials such as glass, quartz, ceramic, sapphire, and organic resin can be used.
 厚さの薄い基板を用いることで、表示パネルの軽量化、薄型化を図ることができる。さらに、可撓性を有する程度の厚さの基板を用いることで、可撓性を有する表示パネルを実現できる。 By using a thin substrate, the display panel can be reduced in weight and thickness. Furthermore, a flexible display panel can be realized by using a flexible substrate.
 また、発光を取り出さない側の基板は、透光性を有していなくてもよいため、上記に挙げた基板の他に、金属基板等を用いることもできる。金属基板は熱伝導性が高く、基板全体に熱を容易に伝導できるため、表示パネルの局所的な温度上昇を抑制することができ、好ましい。可撓性や曲げ性を得るためには、金属基板の厚さは、10μm以上200μm以下が好ましく、20μm以上50μm以下であることがより好ましい。 Further, since the substrate on the side from which light emission is not extracted does not have to be translucent, a metal substrate or the like can be used in addition to the above-described substrates. A metal substrate is preferable because it has high thermal conductivity and can easily conduct heat to the entire substrate, which can suppress a local temperature increase of the display panel. In order to obtain flexibility and bendability, the thickness of the metal substrate is preferably 10 μm to 200 μm, and more preferably 20 μm to 50 μm.
 金属基板を構成する材料としては、特に限定はないが、例えば、アルミニウム、銅、ニッケル等の金属、もしくはアルミニウム合金またはステンレス等の合金などを好適に用いることができる。 The material constituting the metal substrate is not particularly limited, and for example, a metal such as aluminum, copper, or nickel, an aluminum alloy, an alloy such as stainless steel, or the like can be preferably used.
 また、金属基板の表面を酸化する、又は表面に絶縁膜を形成するなどにより、絶縁処理が施された基板を用いてもよい。例えば、スピンコート法やディップ法などの塗布法、電着法、蒸着法、又はスパッタリング法などを用いて絶縁膜を形成してもよいし、酸素雰囲気で放置する又は加熱するほか、陽極酸化法などによって、基板の表面に酸化膜を形成してもよい。 Alternatively, a substrate that has been subjected to insulation treatment by oxidizing the surface of the metal substrate or forming an insulating film on the surface may be used. For example, the insulating film may be formed by using a coating method such as a spin coating method or a dip method, an electrodeposition method, a vapor deposition method, or a sputtering method, or it is left in an oxygen atmosphere or heated, or an anodic oxidation method. For example, an oxide film may be formed on the surface of the substrate.
 可撓性及び可視光に対する透過性を有する材料としては、例えば、可撓性を有する程度の厚さのガラスや、ポリエチレンテレフタレート(PET)、ポリエチレンナフタレート(PEN)等のポリエステル樹脂、ポリアクリロニトリル樹脂、ポリイミド樹脂、ポリメチルメタクリレート樹脂、ポリカーボネート(PC)樹脂、ポリエーテルスルホン(PES)樹脂、ポリアミド樹脂、シクロオレフィン樹脂、ポリスチレン樹脂、ポリアミドイミド樹脂、ポリ塩化ビニル樹脂、ポリテトラフルオロエチレン(PTFE)樹脂等が挙げられる。特に、熱膨張係数の低い材料を用いることが好ましく、例えば、熱膨張係数が30×10−6/K以下であるポリアミドイミド樹脂、ポリイミド樹脂、PET等を好適に用いることができる。また、ガラス繊維に有機樹脂を含浸した基板や、無機フィラーを有機樹脂に混ぜて熱膨張係数を下げた基板を使用することもできる。このような材料を用いた基板は、重量が軽いため、該基板を用いた表示パネルも軽量にすることができる。 Examples of the material having flexibility and transparency to visible light include, for example, glass having a thickness having flexibility, polyester resins such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN), and polyacrylonitrile resin. , Polyimide resin, polymethyl methacrylate resin, polycarbonate (PC) resin, polyethersulfone (PES) resin, polyamide resin, cycloolefin resin, polystyrene resin, polyamideimide resin, polyvinyl chloride resin, polytetrafluoroethylene (PTFE) resin Etc. In particular, a material having a low thermal expansion coefficient is preferably used. For example, a polyamideimide resin, a polyimide resin, PET, or the like having a thermal expansion coefficient of 30 × 10 −6 / K or less can be suitably used. Further, a substrate in which glass fiber is impregnated with an organic resin, or a substrate in which an inorganic filler is mixed with an organic resin to reduce the thermal expansion coefficient can be used. Since a substrate using such a material is light in weight, a display panel using the substrate can be lightweight.
 上記材料中に繊維体が含まれている場合、繊維体は有機化合物または無機化合物の高強度繊維を用いる。高強度繊維とは、具体的には引張弾性率またはヤング率の高い繊維のことを言い、代表例としては、ポリビニルアルコール系繊維、ポリエステル系繊維、ポリアミド系繊維、ポリエチレン系繊維、アラミド系繊維、ポリパラフェニレンベンゾビスオキサゾール繊維、ガラス繊維、または炭素繊維が挙げられる。ガラス繊維としては、Eガラス、Sガラス、Dガラス、Qガラス等を用いたガラス繊維が挙げられる。これらは、織布または不織布の状態で用い、この繊維体に樹脂を含浸させ樹脂を硬化させた構造物を、可撓性を有する基板として用いてもよい。可撓性を有する基板として、繊維体と樹脂からなる構造物を用いると、曲げや局所的押圧による破損に対する信頼性が向上するため、好ましい。 When the above material contains a fibrous body, the fibrous body uses high strength fibers of an organic compound or an inorganic compound. The high-strength fiber specifically refers to a fiber having a high tensile modulus or Young's modulus, and representative examples include polyvinyl alcohol fiber, polyester fiber, polyamide fiber, polyethylene fiber, aramid fiber, Examples include polyparaphenylene benzobisoxazole fibers, glass fibers, and carbon fibers. Examples of the glass fiber include glass fibers using E glass, S glass, D glass, Q glass, and the like. These may be used in the form of a woven fabric or a non-woven fabric, and a structure obtained by impregnating the fiber body with a resin and curing the resin may be used as a flexible substrate. When a structure made of a fibrous body and a resin is used as the flexible substrate, it is preferable because reliability against breakage due to bending or local pressing is improved.
 または、可撓性を有する程度に薄いガラス、金属などを基板に用いることもできる。または、ガラスと樹脂材料とが接着層により貼り合わされた複合材料を用いてもよい。 Alternatively, glass or metal that is thin enough to be flexible can be used for the substrate. Alternatively, a composite material in which glass and a resin material are bonded to each other with an adhesive layer may be used.
 可撓性を有する基板に、表示パネルの表面を傷などから保護するハードコート層(例えば、窒化シリコン、酸化アルミニウムなど)や、押圧を分散可能な材質の層(例えば、アラミド樹脂など)等が積層されていてもよい。また、水分等による表示素子の寿命の低下等を抑制するために、可撓性を有する基板に透水性の低い絶縁膜が積層されていてもよい。例えば、窒化シリコン、酸化窒化シリコン、窒化酸化シリコン、酸化アルミニウム、窒化アルミニウム等の無機絶縁材料を用いることができる。 A hard coat layer (for example, silicon nitride, aluminum oxide) that protects the surface of the display panel from scratches, a layer of a material that can disperse the pressure (for example, aramid resin), etc. on a flexible substrate It may be laminated. In order to suppress a decrease in the lifetime of the display element due to moisture or the like, an insulating film with low water permeability may be stacked over a flexible substrate. For example, an inorganic insulating material such as silicon nitride, silicon oxynitride, silicon nitride oxide, aluminum oxide, or aluminum nitride can be used.
 基板は、複数の層を積層して用いることもできる。特に、ガラス層を有する構成とすると、水や酸素に対するバリア性を向上させ、信頼性の高い表示パネルとすることができる。 The substrate can be used by laminating a plurality of layers. In particular, when the glass layer is used, the barrier property against water and oxygen can be improved and a highly reliable display panel can be obtained.
〔トランジスタ〕
 トランジスタは、ゲート電極として機能する導電層と、半導体層と、ソース電極として機能する導電層と、ドレイン電極として機能する導電層と、ゲート絶縁層として機能する絶縁層と、を有する。上記では、ボトムゲート構造のトランジスタを適用した場合を示している。
[Transistor]
The transistor includes a conductive layer that functions as a gate electrode, a semiconductor layer, a conductive layer that functions as a source electrode, a conductive layer that functions as a drain electrode, and an insulating layer that functions as a gate insulating layer. The above shows the case where a bottom-gate transistor is applied.
 なお、本発明の一態様の表示装置が有するトランジスタの構造は特に限定されない。例えば、プレーナ型のトランジスタとしてもよいし、スタガ型のトランジスタとしてもよいし、逆スタガ型のトランジスタとしてもよい。また、トップゲート型又はボトムゲート型のいずれのトランジスタ構造としてもよい。または、チャネルの上下にゲート電極が設けられていてもよい。 Note that there is no particular limitation on the structure of the transistor included in the display device of one embodiment of the present invention. For example, a planar transistor, a staggered transistor, or an inverted staggered transistor may be used. Further, a top-gate or bottom-gate transistor structure may be employed. Alternatively, gate electrodes may be provided above and below the channel.
 トランジスタに用いる半導体材料の結晶性についても特に限定されず、非晶質半導体、結晶性を有する半導体(微結晶半導体、多結晶半導体、単結晶半導体、又は一部に結晶領域を有する半導体)のいずれを用いてもよい。結晶性を有する半導体を用いると、トランジスタ特性の劣化を抑制できるため好ましい。 There is no particular limitation on the crystallinity of a semiconductor material used for the transistor, and any of an amorphous semiconductor and a semiconductor having crystallinity (a microcrystalline semiconductor, a polycrystalline semiconductor, a single crystal semiconductor, or a semiconductor partially including a crystal region) is used. May be used. It is preferable to use a crystalline semiconductor because deterioration of transistor characteristics can be suppressed.
 また、トランジスタに用いる半導体材料としては、例えば、第14族の元素(シリコン、ゲルマニウム等)、化合物半導体又は酸化物半導体を半導体層に用いることができる。代表的には、シリコンを含む半導体、ガリウムヒ素を含む半導体又はインジウムを含む酸化物半導体などを適用できる。 In addition, as a semiconductor material used for the transistor, for example, a group 14 element (silicon, germanium, or the like), a compound semiconductor, or an oxide semiconductor can be used for the semiconductor layer. Typically, a semiconductor containing silicon, a semiconductor containing gallium arsenide, an oxide semiconductor containing indium, or the like can be used.
 特にシリコンよりもバンドギャップが広く、且つキャリア密度の小さい半導体材料を用いると、トランジスタのオフ状態における電流を低減できるため好ましい。 In particular, it is preferable to use a semiconductor material having a wider band gap and lower carrier density than silicon because current in the off-state of the transistor can be reduced.
 特に、半導体層として、複数の結晶部を有し、当該結晶部はc軸が半導体層の被形成面、または半導体層の上面に対し概略垂直に配向し、且つ隣接する結晶部間には粒界が確認できない酸化物半導体を用いることが好ましい。 In particular, the semiconductor layer has a plurality of crystal parts, and the crystal part has a c-axis oriented substantially perpendicular to the formation surface of the semiconductor layer or the top surface of the semiconductor layer, and there is no grain between adjacent crystal parts. It is preferable to use an oxide semiconductor whose boundary cannot be confirmed.
 このような酸化物半導体は、結晶粒界を有さないために表示パネルを湾曲させたときの応力によって酸化物半導体膜にクラックが生じてしまうことが抑制される。したがって、可撓性を有し、湾曲させて用いる表示パネルなどに、このような酸化物半導体を好適に用いることができる。 Since such an oxide semiconductor does not have a crystal grain boundary, cracks in the oxide semiconductor film due to stress when the display panel is bent is suppressed. Therefore, such an oxide semiconductor can be favorably used for a display panel which is flexible and curved.
 また半導体層としてこのような結晶性を有する酸化物半導体を用いることで、電気特性の変動が抑制され、信頼性の高いトランジスタを実現できる。 In addition, by using an oxide semiconductor having such crystallinity as the semiconductor layer, a change in electrical characteristics is suppressed and a highly reliable transistor can be realized.
 また、シリコンよりもバンドギャップの大きな酸化物半導体を用いたトランジスタは、その低いオフ電流により、トランジスタと直列に接続された容量素子に蓄積した電荷を長期間に亘って保持することが可能である。このようなトランジスタを画素に適用することで、各画素の階調を維持しつつ、駆動回路を停止することも可能となる。その結果、極めて消費電力の低減された表示装置を実現できる。 In addition, a transistor including an oxide semiconductor having a band gap larger than that of silicon can hold charge accumulated in a capacitor connected in series with the transistor for a long time because of the low off-state current. . By applying such a transistor to a pixel, the driving circuit can be stopped while maintaining the gradation of each pixel. As a result, a display device with extremely reduced power consumption can be realized.
 半導体層は、例えば少なくともインジウム、亜鉛及びM(アルミニウム、チタン、ガリウム、ゲルマニウム、イットリウム、ジルコニウム、ランタン、セリウム、スズ、ネオジムまたはハフニウム等の金属)を含むIn−M−Zn系酸化物で表記される膜を含むことが好ましい。また、該酸化物半導体を用いたトランジスタの電気特性のばらつきを減らすため、それらと共に、スタビライザーを含むことが好ましい。 The semiconductor layer is represented by an In-M-Zn-based oxide containing at least indium, zinc, and M (metal such as aluminum, titanium, gallium, germanium, yttrium, zirconium, lanthanum, cerium, tin, neodymium, or hafnium). It is preferable to include a film. In addition, in order to reduce variation in electrical characteristics of the transistor including the oxide semiconductor, a stabilizer is preferably included together with the transistor.
 スタビライザーとしては、上記Mで記載の金属を含め、例えば、ガリウム、スズ、ハフニウム、アルミニウム、またはジルコニウム等がある。また、他のスタビライザーとしては、ランタノイドである、ランタン、セリウム、プラセオジム、ネオジム、サマリウム、ユウロピウム、ガドリニウム、テルビウム、ジスプロシウム、ホルミウム、エルビウム、ツリウム、イッテルビウム、ルテチウム等がある。 Examples of the stabilizer include the metals described in M above, and examples include gallium, tin, hafnium, aluminum, and zirconium. Other stabilizers include lanthanoids such as lanthanum, cerium, praseodymium, neodymium, samarium, europium, gadolinium, terbium, dysprosium, holmium, erbium, thulium, ytterbium, and lutetium.
 半導体層を構成する酸化物半導体として、例えば、In−Ga−Zn系酸化物、In−Al−Zn系酸化物、In−Sn−Zn系酸化物、In−Hf−Zn系酸化物、In−La−Zn系酸化物、In−Ce−Zn系酸化物、In−Pr−Zn系酸化物、In−Nd−Zn系酸化物、In−Sm−Zn系酸化物、In−Eu−Zn系酸化物、In−Gd−Zn系酸化物、In−Tb−Zn系酸化物、In−Dy−Zn系酸化物、In−Ho−Zn系酸化物、In−Er−Zn系酸化物、In−Tm−Zn系酸化物、In−Yb−Zn系酸化物、In−Lu−Zn系酸化物、In−Sn−Ga−Zn系酸化物、In−Hf−Ga−Zn系酸化物、In−Al−Ga−Zn系酸化物、In−Sn−Al−Zn系酸化物、In−Sn−Hf−Zn系酸化物、In−Hf−Al−Zn系酸化物を用いることができる。 As an oxide semiconductor included in the semiconductor layer, for example, an In—Ga—Zn-based oxide, an In—Al—Zn-based oxide, an In—Sn—Zn-based oxide, an In—Hf—Zn-based oxide, an In— La-Zn oxide, In-Ce-Zn oxide, In-Pr-Zn oxide, In-Nd-Zn oxide, In-Sm-Zn oxide, In-Eu-Zn oxide In-Gd-Zn-based oxide, In-Tb-Zn-based oxide, In-Dy-Zn-based oxide, In-Ho-Zn-based oxide, In-Er-Zn-based oxide, In-Tm -Zn oxide, In-Yb-Zn oxide, In-Lu-Zn oxide, In-Sn-Ga-Zn oxide, In-Hf-Ga-Zn oxide, In-Al- Ga-Zn-based oxide, In-Sn-Al-Zn-based oxide, In-Sn-Hf-Zn Oxide, can be used In-Hf-Al-Zn-based oxide.
 なお、ここで、In−Ga−Zn系酸化物とは、InとGaとZnを主成分として有する酸化物という意味であり、InとGaとZnの比率は問わない。また、InとGaとZn以外の金属元素が入っていてもよい。 Note that here, the In—Ga—Zn-based oxide means an oxide containing In, Ga, and Zn as main components, and the ratio of In, Ga, and Zn is not limited. Moreover, metal elements other than In, Ga, and Zn may be contained.
 また、半導体層と導電層は、上記酸化物のうち同一の金属元素を有していてもよい。半導体層と導電層を同一の金属元素とすることで、製造コストを低減させることができる。例えば、同一の金属組成の金属酸化物ターゲットを用いることで、製造コストを低減させることができる。また半導体層と導電層を加工する際のエッチングガスまたはエッチング液を共通して用いることができる。ただし、半導体層と導電層は、同一の金属元素を有していても、組成が異なる場合がある。例えば、トランジスタ及び容量素子の作製工程中に、膜中の金属元素が脱離し、異なる金属組成となる場合がある。 Further, the semiconductor layer and the conductive layer may have the same metal element among the above oxides. Manufacturing costs can be reduced by using the same metal element for the semiconductor layer and the conductive layer. For example, the manufacturing cost can be reduced by using metal oxide targets having the same metal composition. Further, an etching gas or an etching solution for processing the semiconductor layer and the conductive layer can be used in common. However, the semiconductor layer and the conductive layer may have different compositions even if they have the same metal element. For example, a metal element in a film may be detached during a manufacturing process of a transistor and a capacitor to have a different metal composition.
 半導体層を構成する酸化物半導体は、エネルギーギャップが2eV以上、好ましくは2.5eV以上、より好ましくは3eV以上であることが好ましい。このように、エネルギーギャップの広い酸化物半導体を用いることで、トランジスタのオフ電流を低減することができる。 The oxide semiconductor constituting the semiconductor layer preferably has an energy gap of 2 eV or more, preferably 2.5 eV or more, more preferably 3 eV or more. In this manner, off-state current of a transistor can be reduced by using an oxide semiconductor with a wide energy gap.
 半導体層を構成する酸化物半導体がIn−M−Zn酸化物の場合、In−M−Zn酸化物を成膜するために用いるスパッタリングターゲットの金属元素の原子数比は、In≧M、Zn≧Mを満たすことが好ましい。このようなスパッタリングターゲットの金属元素の原子数比として、In:M:Zn=1:1:1、In:M:Zn=1:1:1.2、In:M:Zn=3:1:2、4:2:3、4:2:4.1等が好ましい。なお、成膜される半導体層の原子数比はそれぞれ、誤差として上記のスパッタリングターゲットに含まれる金属元素の原子数比のプラスマイナス40%の変動を含む。 In the case where the oxide semiconductor included in the semiconductor layer is an In-M-Zn oxide, the atomic ratio of the metal elements of the sputtering target used for forming the In-M-Zn oxide is In ≧ M, Zn ≧ It is preferable to satisfy M. As the atomic ratio of the metal elements of such a sputtering target, In: M: Zn = 1: 1: 1, In: M: Zn = 1: 1: 1.2, In: M: Zn = 3: 1: 2, 4: 2: 3, 4: 2: 4.1, and the like are preferable. Note that the atomic ratio of the semiconductor layer to be formed includes a variation of plus or minus 40% of the atomic ratio of the metal element contained in the sputtering target as an error.
 半導体層としては、キャリア密度の低い酸化物半導体膜を用いる。例えば、半導体層は、キャリア密度が1×1017/cm以下、好ましくは1×1015/cm以下、さらに好ましくは1×1013/cm以下、より好ましくは1×1011/cm以下、さらに好ましくは1×1010/cm未満であり、1×10−9/cm以上の酸化物半導体を用いることができる。そのような酸化物半導体を、高純度真性または実質的に高純度真性な酸化物半導体と呼ぶ。これにより不純物濃度が低く、欠陥準位密度が低いため、安定な特性を有する酸化物半導体であるといえる。 As the semiconductor layer, an oxide semiconductor film with low carrier density is used. For example, the semiconductor layer has a carrier density of 1 × 10 17 / cm 3 or less, preferably 1 × 10 15 / cm 3 or less, more preferably 1 × 10 13 / cm 3 or less, more preferably 1 × 10 11 / cm 3. 3 or less, more preferably less than 1 × 10 10 / cm 3 , and an oxide semiconductor of 1 × 10 −9 / cm 3 or more can be used. Such an oxide semiconductor is referred to as a highly purified intrinsic or substantially highly purified intrinsic oxide semiconductor. Accordingly, it can be said that the oxide semiconductor has stable characteristics because the impurity concentration is low and the density of defect states is low.
 なお、これらに限られず、必要とするトランジスタの半導体特性及び電気特性(電界効果移動度、しきい値電圧等)に応じて適切な組成のものを用いればよい。また、必要とするトランジスタの半導体特性を得るために、半導体層のキャリア密度や不純物濃度、欠陥密度、金属元素と酸素の原子数比、原子間距離、密度等を適切なものとすることが好ましい。 Note that, without limitation thereto, a transistor having an appropriate composition may be used depending on required semiconductor characteristics and electrical characteristics (such as field-effect mobility and threshold voltage) of a transistor. In addition, in order to obtain the required semiconductor characteristics of the transistor, it is preferable that the semiconductor layer have appropriate carrier density, impurity concentration, defect density, atomic ratio of metal element to oxygen, interatomic distance, density, and the like. .
 半導体層を構成する酸化物半導体において、第14族元素の一つであるシリコンや炭素が含まれると、半導体層において酸素欠損が増加し、n型化してしまう。このため、半導体層におけるシリコンや炭素の濃度(二次イオン質量分析法により得られる濃度)を、2×1018atoms/cm以下、好ましくは2×1017atoms/cm以下とする。 If an oxide semiconductor included in the semiconductor layer contains silicon or carbon which is one of Group 14 elements, oxygen vacancies increase in the semiconductor layer and the semiconductor layer becomes n-type. Therefore, the concentration of silicon or carbon in the semiconductor layer (concentration obtained by secondary ion mass spectrometry) is 2 × 10 18 atoms / cm 3 or less, preferably 2 × 10 17 atoms / cm 3 or less.
 また、アルカリ金属及びアルカリ土類金属は、酸化物半導体と結合するとキャリアを生成する場合があり、トランジスタのオフ電流が増大してしまうことがある。このため半導体層における二次イオン質量分析法により得られるアルカリ金属またはアルカリ土類金属の濃度を、1×1018atoms/cm以下、好ましくは2×1016atoms/cm以下にする。 Further, when alkali metal and alkaline earth metal are combined with an oxide semiconductor, carriers may be generated, which may increase off-state current of the transistor. Therefore, the concentration of alkali metal or alkaline earth metal obtained by secondary ion mass spectrometry in the semiconductor layer is set to 1 × 10 18 atoms / cm 3 or less, preferably 2 × 10 16 atoms / cm 3 or less.
 また、半導体層を構成する酸化物半導体に窒素が含まれていると、キャリアである電子が生じ、キャリア密度が増加し、n型化しやすい。この結果、窒素が含まれている酸化物半導体を用いたトランジスタはノーマリーオン特性となりやすい。このため半導体層における二次イオン質量分析法により得られる窒素濃度は、5×1018atoms/cm以下にすることが好ましい。 In addition, when nitrogen is contained in the oxide semiconductor included in the semiconductor layer, electrons serving as carriers are generated, the carrier density is increased, and the oxide semiconductor is likely to be n-type. As a result, a transistor including an oxide semiconductor containing nitrogen is likely to be normally on. For this reason, it is preferable that the nitrogen concentration obtained by secondary ion mass spectrometry in the semiconductor layer is 5 × 10 18 atoms / cm 3 or less.
 また、半導体層は、例えば非単結晶構造でもよい。非単結晶構造は、例えば、CAAC−OS(C−Axis Aligned Crystalline Oxide Semiconductor、または、C−Axis Aligned and A−B−plane Anchored Crystalline Oxide Semiconductor)、多結晶構造、微結晶構造、または非晶質構造を含む。非単結晶構造において、非晶質構造は最も欠陥準位密度が高く、CAAC−OSは最も欠陥準位密度が低い。 Further, the semiconductor layer may have a non-single crystal structure, for example. The non-single crystal structure is, for example, a CAAC-OS (C-Axis Aligned Crystalline Oxide Semiconductor, C-Axis Aligned and A-B-Plane Annealed Crystalline Oxide Crystal Structure, Amorphous Crystal Structure, Amorphous Crystal Structure, or Amorphous Crystal Structure). Includes structure. In the non-single-crystal structure, the amorphous structure has the highest density of defect states, and the CAAC-OS has the lowest density of defect states.
 非晶質構造の酸化物半導体膜は、例えば、原子配列が無秩序であり、結晶成分を有さない。または、非晶質構造の酸化物膜は、例えば、完全な非晶質構造であり、結晶部を有さない。 An amorphous oxide semiconductor film has, for example, disordered atomic arrangement and no crystal component. Alternatively, an amorphous oxide film has, for example, a completely amorphous structure and does not have a crystal part.
 なお、半導体層が、非晶質構造の領域、微結晶構造の領域、多結晶構造の領域、CAAC−OSの領域、単結晶構造の領域のうち、二種以上を有する混合膜であってもよい。混合膜は、例えば上述した領域のうち、いずれか二種以上の領域を含む単層構造、または積層構造を有する場合がある。 Note that the semiconductor layer may be a mixed film including two or more of an amorphous structure region, a microcrystalline structure region, a polycrystalline structure region, a CAAC-OS region, and a single crystal structure region. Good. For example, the mixed film may have a single-layer structure or a stacked structure including any two or more of the above-described regions.
 または、トランジスタのチャネルが形成される半導体に、シリコンを用いることが好ましい。シリコンとしてアモルファスシリコンを用いてもよいが、特に結晶性を有するシリコンを用いることが好ましい。例えば、微結晶シリコン、多結晶シリコン、単結晶シリコンなどを用いることが好ましい。特に、多結晶シリコンは、単結晶シリコンに比べて低温で形成でき、且つアモルファスシリコンに比べて高い電界効果移動度と高い信頼性を備える。このような多結晶半導体を画素に適用することで画素の開口率を向上させることができる。また極めて高精細な表示部とする場合であっても、ゲート駆動回路とソース駆動回路を画素と同一基板上に形成することが可能となり、電子機器を構成する部品数を低減することができる。 Alternatively, silicon is preferably used for a semiconductor in which a transistor channel is formed. Although amorphous silicon may be used as silicon, it is particularly preferable to use silicon having crystallinity. For example, microcrystalline silicon, polycrystalline silicon, single crystal silicon, or the like is preferably used. In particular, polycrystalline silicon can be formed at a lower temperature than single crystal silicon, and has higher field effect mobility and higher reliability than amorphous silicon. By applying such a polycrystalline semiconductor to a pixel, the aperture ratio of the pixel can be improved. Even in the case of a display portion with extremely high definition, the gate driver circuit and the source driver circuit can be formed over the same substrate as the pixel, and the number of components included in the electronic device can be reduced.
 本実施の形態で例示したボトムゲート構造のトランジスタは、作製工程を削減できるため好ましい。またこのときアモルファスシリコンを用いることで、多結晶シリコンよりも低温で形成できるため、半導体層よりも下層の配線や電極の材料、基板の材料として、耐熱性の低い材料を用いることが可能なため、材料の選択の幅を広げることができる。例えば、極めて大面積のガラス基板などを好適に用いることができる。一方、トップゲート型のトランジスタは、自己整合的に不純物領域を形成しやすいため、特性のばらつきなどを低減することができるため好ましい。このとき特に、多結晶シリコンや単結晶シリコンなどを用いる場合に適している。 The bottom-gate transistor exemplified in this embodiment is preferable because the number of manufacturing steps can be reduced. At this time, since amorphous silicon can be used at a lower temperature than polycrystalline silicon, it is possible to use a material having low heat resistance as a material for wiring, electrodes, and substrates below the semiconductor layer. Can widen the choice of materials. For example, a glass substrate having an extremely large area can be suitably used. On the other hand, a top-gate transistor is preferable because an impurity region can be easily formed in a self-aligned manner and variation in characteristics can be reduced. At this time, it is particularly suitable when polycrystalline silicon, single crystal silicon or the like is used.
〔導電層〕
 トランジスタのゲート、ソースおよびドレインのほか、表示装置を構成する各種配線および電極などの導電層に用いることのできる材料としては、アルミニウム、チタン、クロム、ニッケル、銅、イットリウム、ジルコニウム、モリブデン、銀、タンタル、またはタングステンなどの金属、またはこれを主成分とする合金などが挙げられる。またこれらの材料を含む膜を単層で、または積層構造として用いることができる。例えば、シリコンを含むアルミニウム膜の単層構造、チタン膜上にアルミニウム膜を積層する二層構造、タングステン膜上にアルミニウム膜を積層する二層構造、銅−マグネシウム−アルミニウム合金膜上に銅膜を積層する二層構造、チタン膜上に銅膜を積層する二層構造、タングステン膜上に銅膜を積層する二層構造、チタン膜または窒化チタン膜と、その上に重ねてアルミニウム膜または銅膜を積層し、さらにその上にチタン膜または窒化チタン膜を形成する三層構造、モリブデン膜または窒化モリブデン膜と、その上に重ねてアルミニウム膜または銅膜を積層し、さらにその上にモリブデン膜または窒化モリブデン膜を形成する三層構造等がある。なお、酸化インジウム、酸化錫または酸化亜鉛等の酸化物を用いてもよい。また、マンガンを含む銅を用いると、エッチングによる形状の制御性が高まるため好ましい。
[Conductive layer]
In addition to the gate, source, and drain of a transistor, materials that can be used for conductive layers such as various wirings and electrodes that constitute a display device include aluminum, titanium, chromium, nickel, copper, yttrium, zirconium, molybdenum, silver, A metal such as tantalum or tungsten, or an alloy containing the same as a main component can be given. A film containing any of these materials can be used as a single layer or a stacked structure. For example, a single layer structure of an aluminum film containing silicon, a two layer structure in which an aluminum film is stacked on a titanium film, a two layer structure in which an aluminum film is stacked on a tungsten film, and a copper film on a copper-magnesium-aluminum alloy film Two-layer structure to stack, two-layer structure to stack copper film on titanium film, two-layer structure to stack copper film on tungsten film, titanium film or titanium nitride film, and aluminum film or copper film on top of it A three-layer structure for forming a titanium film or a titanium nitride film thereon, a molybdenum film or a molybdenum nitride film, and an aluminum film or a copper film stacked thereon, and a molybdenum film or a There is a three-layer structure for forming a molybdenum nitride film. Note that an oxide such as indium oxide, tin oxide, or zinc oxide may be used. Further, it is preferable to use copper containing manganese because the controllability of the shape by etching is increased.
 また、透光性を有する導電性材料としては、酸化インジウム、インジウム錫酸化物、インジウム亜鉛酸化物、酸化亜鉛、ガリウムを添加した酸化亜鉛などの導電性酸化物またはグラフェンを用いることができる。または、金、銀、白金、マグネシウム、ニッケル、タングステン、クロム、モリブデン、鉄、コバルト、銅、パラジウム、またはチタンなどの金属材料や、該金属材料を含む合金材料を用いることができる。または、該金属材料の窒化物(例えば、窒化チタン)などを用いてもよい。なお、金属材料、合金材料(またはそれらの窒化物)を用いる場合には、透光性を有する程度に薄くすればよい。また、上記材料の積層膜を導電層として用いることができる。例えば、銀とマグネシウムの合金とインジウムスズ酸化物の積層膜などを用いると、導電性を高めることができるため好ましい。これらは、表示装置を構成する各種配線および電極などの導電層や、表示素子が有する導電層(画素電極や共通電極として機能する導電層)にも用いることができる。 Further, as the light-transmitting conductive material, conductive oxide such as indium oxide, indium tin oxide, indium zinc oxide, zinc oxide, zinc oxide to which gallium is added, or graphene can be used. Alternatively, a metal material such as gold, silver, platinum, magnesium, nickel, tungsten, chromium, molybdenum, iron, cobalt, copper, palladium, or titanium, or an alloy material containing the metal material can be used. Alternatively, a nitride (eg, titanium nitride) of the metal material may be used. Note that in the case where a metal material or an alloy material (or a nitride thereof) is used, it may be thin enough to have a light-transmitting property. In addition, a stacked film of the above materials can be used as a conductive layer. For example, it is preferable to use a laminated film of an alloy of silver and magnesium and indium tin oxide because the conductivity can be increased. These can also be used for conductive layers such as various wirings and electrodes constituting the display device and conductive layers (conductive layers functioning as pixel electrodes and common electrodes) included in the display element.
〔絶縁層〕
 各絶縁層に用いることのできる絶縁材料としては、例えば、アクリル、エポキシなどの樹脂、シロキサン結合を有する樹脂の他、酸化シリコン、酸化窒化シリコン、窒化酸化シリコン、窒化シリコン、酸化アルミニウムなどの無機絶縁材料を用いることもできる。
[Insulating layer]
Insulating materials that can be used for each insulating layer include, for example, resins such as acrylic and epoxy, resins having a siloxane bond, and inorganic insulation such as silicon oxide, silicon oxynitride, silicon nitride oxide, silicon nitride, and aluminum oxide. Materials can also be used.
 また発光素子は、一対の透水性の低い絶縁膜の間に設けられていることが好ましい。これにより、発光素子に水等の不純物が侵入することを抑制でき、装置の信頼性の低下を抑制できる。 The light-emitting element is preferably provided between a pair of insulating films with low water permeability. Thereby, impurities such as water can be prevented from entering the light emitting element, and a decrease in reliability of the apparatus can be suppressed.
 透水性の低い絶縁膜としては、窒化シリコン膜、窒化酸化シリコン膜等の窒素と珪素を含む膜や、窒化アルミニウム膜等の窒素とアルミニウムを含む膜等が挙げられる。また、酸化シリコン膜、酸化窒化シリコン膜、酸化アルミニウム膜等を用いてもよい。 Examples of the low water-permeable insulating film include a film containing nitrogen and silicon such as a silicon nitride film and a silicon nitride oxide film, and a film containing nitrogen and aluminum such as an aluminum nitride film. Alternatively, a silicon oxide film, a silicon oxynitride film, an aluminum oxide film, or the like may be used.
 例えば、透水性の低い絶縁膜の水蒸気透過量は、1×10−5[g/(m・day)]以下、好ましくは1×10−6[g/(m・day)]以下、より好ましくは1×10−7[g/(m・day)]以下、さらに好ましくは1×10−8[g/(m・day)]以下とする。 For example, the water vapor transmission rate of an insulating film with low water permeability is 1 × 10 −5 [g / (m 2 · day)] or less, preferably 1 × 10 −6 [g / (m 2 · day)] or less, More preferably, it is 1 × 10 −7 [g / (m 2 · day)] or less, and further preferably 1 × 10 −8 [g / (m 2 · day)] or less.
〔液晶素子〕
 液晶素子としては、例えば垂直配向(VA:Vertical Alignment)モードが適用された液晶素子を用いることができる。垂直配向モードとしては、MVA(Multi−Domain Vertical Alignment)モード、PVA(Patterned Vertical Alignment)モード、ASV(Advanced Super View)モードなどを用いることができる。
[Liquid crystal element]
As the liquid crystal element, for example, a liquid crystal element to which a vertical alignment (VA: Vertical Alignment) mode is applied can be used. As the vertical alignment mode, an MVA (Multi-Domain Vertical Alignment) mode, a PVA (Patterned Vertical Alignment) mode, an ASV (Advanced Super View) mode, or the like can be used.
 また、液晶素子には、様々なモードが適用された液晶素子を用いることができる。例えばVAモードのほかに、TN(Twisted Nematic)モード、IPS(In−Plane−Switching)モード、FFS(Fringe Field Switching)モード、ASM(Axially Symmetric aligned Micro−cell)モード、OCB(Optically Compensated Birefringence)モード、FLC(Ferroelectric Liquid Crystal)モード、AFLC(AntiFerroelectric Liquid Crystal)モード等が適用された液晶素子を用いることができる。 Further, liquid crystal elements to which various modes are applied can be used as the liquid crystal elements. For example, in addition to the VA mode, TN (Twisted Nematic) mode, IPS (In-Plane-Switching) mode, FFS (Fringe Field Switching) mode, ASM (Axially Symmetrical Aligned Micro-cell) mode A liquid crystal element to which an FLC (Ferroelectric Liquid Crystal) mode, an AFLC (Antiferroelectric Liquid Crystal) mode, or the like is applied can be used.
 なお、液晶素子は、液晶の光学的変調作用によって光の透過または非透過を制御する素子である。なお、液晶の光学的変調作用は、液晶にかかる電界(横方向の電界、縦方向の電界又は斜め方向の電界を含む)によって制御される。なお、液晶素子に用いる液晶としては、サーモトロピック液晶、低分子液晶、高分子液晶、高分子分散型液晶(PDLC:Polymer Dispersed Liquid Crystal)、強誘電性液晶、反強誘電性液晶等を用いることができる。これらの液晶材料は、条件により、コレステリック相、スメクチック相、キュービック相、カイラルネマチック相、等方相等を示す。 The liquid crystal element is an element that controls transmission or non-transmission of light by an optical modulation action of liquid crystal. Note that the optical modulation action of the liquid crystal is controlled by an electric field applied to the liquid crystal (including a horizontal electric field, a vertical electric field, or an oblique electric field). As the liquid crystal used in the liquid crystal element, a thermotropic liquid crystal, a low molecular liquid crystal, a polymer liquid crystal, a polymer dispersed liquid crystal (PDLC), a ferroelectric liquid crystal, an antiferroelectric liquid crystal, or the like is used. Can do. These liquid crystal materials exhibit a cholesteric phase, a smectic phase, a cubic phase, a chiral nematic phase, an isotropic phase, and the like depending on conditions.
 また、液晶材料としては、ポジ型の液晶、またはネガ型の液晶のいずれを用いてもよく、適用するモードや設計に応じて最適な液晶材料を用いればよい。 Also, as the liquid crystal material, either a positive type liquid crystal or a negative type liquid crystal may be used, and an optimal liquid crystal material may be used according to the mode and design to be applied.
 また、液晶の配向を制御するため、配向膜を設けることができる。なお、横電界方式を採用する場合、配向膜を用いないブルー相を示す液晶を用いてもよい。ブルー相は液晶相の一つであり、コレステリック液晶を昇温していくと、コレステリック相から等方相へ転移する直前に発現する相である。ブルー相は狭い温度範囲でしか発現しないため、温度範囲を改善するために数重量%以上のカイラル剤を混合させた液晶組成物を液晶層に用いる。ブルー相を示す液晶とカイラル剤とを含む液晶組成物は、応答速度が短く、光学的等方性である。また、ブルー相を示す液晶とカイラル剤とを含む液晶組成物は、配向処理が不要であり、視野角依存性が小さい。また配向膜を設けなくてもよいのでラビング処理も不要となるため、ラビング処理によって引き起こされる静電破壊を防止することができ、作製工程中の液晶表示装置の不良や破損を軽減することができる。 Also, an alignment film can be provided to control the alignment of the liquid crystal. Note that in the case of employing a horizontal electric field mode, liquid crystal exhibiting a blue phase for which an alignment film is unnecessary may be used. The blue phase is one of the liquid crystal phases. When the temperature of the cholesteric liquid crystal is increased, the blue phase appears immediately before the transition from the cholesteric phase to the isotropic phase. Since the blue phase appears only in a narrow temperature range, a liquid crystal composition mixed with several percent by weight or more of a chiral agent is used for the liquid crystal layer in order to improve the temperature range. A liquid crystal composition containing a liquid crystal exhibiting a blue phase and a chiral agent has a short response speed and is optically isotropic. In addition, a liquid crystal composition including a liquid crystal exhibiting a blue phase and a chiral agent does not require alignment treatment and has a small viewing angle dependency. Further, since it is not necessary to provide an alignment film, a rubbing process is not required, so that electrostatic breakdown caused by the rubbing process can be prevented, and defects or breakage of the liquid crystal display device during the manufacturing process can be reduced. .
 また、液晶素子として、透過型の液晶素子、反射型の液晶素子、または半透過型の液晶素子などを用いることができる。 As the liquid crystal element, a transmissive liquid crystal element, a reflective liquid crystal element, a transflective liquid crystal element, or the like can be used.
 本発明の一態様では、特に反射型の液晶素子を用いることができる。 In one embodiment of the present invention, a reflective liquid crystal element can be used.
 透過型または半透過型の液晶素子を用いる場合、一対の基板を挟むように、2つの偏光板を設ける。また偏光板よりも外側に、バックライトを設ける。バックライトとしては、直下型のバックライトであってもよいし、エッジライト型のバックライトであってもよい。LED(Light Emitting Diode)を備える直下型のバックライトを用いると、ローカルディミングが容易となり、コントラストを高めることができるため好ましい。また、エッジライト型のバックライトを用いると、バックライトを含めたモジュールの厚さを低減できるため好ましい。
め好ましい。
In the case of using a transmissive or transflective liquid crystal element, two polarizing plates are provided so as to sandwich a pair of substrates. A backlight is provided outside the polarizing plate. The backlight may be a direct type backlight or an edge light type backlight. It is preferable to use a direct-type backlight including an LED (Light Emitting Diode) because local dimming is facilitated and contrast can be increased. An edge light type backlight is preferably used because the thickness of the module including the backlight can be reduced.
Therefore, it is preferable.
 反射型の液晶素子を用いる場合には、表示面側に偏光板を設ける。またこれとは別に、表示面側に光拡散板を配置すると、視認性を向上させられるため好ましい。 When a reflective liquid crystal element is used, a polarizing plate is provided on the display surface side. Separately from this, it is preferable to arrange a light diffusing plate on the display surface side because the visibility can be improved.
 また、反射型、または半透過型の液晶素子を用いる場合、偏光板よりも外側に、フロントライトを設けてもよい。フロントライトとしては、エッジライト型のフロントライトを用いることが好ましい。LED(Light Emitting Diode)を備えるフロントライトを用いると、消費電力を低減できるため好ましい。 In the case of using a reflective or transflective liquid crystal element, a front light may be provided outside the polarizing plate. As the front light, an edge light type front light is preferably used. It is preferable to use a front light including an LED (Light Emitting Diode) because power consumption can be reduced.
〔発光素子〕
 発光素子としては、自発光が可能な素子を用いることができ、電流又は電圧によって輝度が制御される素子をその範疇に含んでいる。例えば、LED、QLED、有機EL素子、無機EL素子等を用いることができる。
[Light emitting element]
As the light-emitting element, an element capable of self-emission can be used, and an element whose luminance is controlled by current or voltage is included in its category. For example, an LED, a QLED, an organic EL element, an inorganic EL element, or the like can be used.
 発光素子は、トップエミッション型、ボトムエミッション型、デュアルエミッション型などがある。光を取り出す側の電極には、可視光を透過する導電膜を用いる。また、光を取り出さない側の電極には、可視光を反射する導電膜を用いることが好ましい。 The light emitting element includes a top emission type, a bottom emission type, and a dual emission type. A conductive film that transmits visible light is used for the electrode from which light is extracted. In addition, a conductive film that reflects visible light is preferably used for the electrode from which light is not extracted.
 本発明の一態様では、特にボトムエミッション型の発光素子を用いることができる。 In one embodiment of the present invention, a bottom emission type light emitting element can be used in particular.
 EL層は少なくとも発光層を有する。EL層は、発光層以外の層として、正孔注入性の高い物質、正孔輸送性の高い物質、正孔ブロック材料、電子輸送性の高い物質、電子注入性の高い物質、又はバイポーラ性の物質(電子輸送性及び正孔輸送性が高い物質)等を含む層をさらに有していてもよい。 The EL layer has at least a light emitting layer. The EL layer is a layer other than the light-emitting layer, such as a substance having a high hole injection property, a substance having a high hole transport property, a hole blocking material, a substance having a high electron transport property, a substance having a high electron injection property, or a bipolar property. A layer including a substance (a substance having a high electron transporting property and a high hole transporting property) and the like may be further included.
 EL層には低分子系化合物及び高分子系化合物のいずれを用いることもでき、無機化合物を含んでいてもよい。EL層を構成する層は、それぞれ、蒸着法(真空蒸着法を含む)、転写法、印刷法、インクジェット法、塗布法等の方法で形成することができる。 The EL layer can use either a low molecular compound or a high molecular compound, and may contain an inorganic compound. The layers constituting the EL layer can be formed by a method such as a vapor deposition method (including a vacuum vapor deposition method), a transfer method, a printing method, an ink jet method, or a coating method.
 陰極と陽極の間に、発光素子の閾値電圧より高い電圧を印加すると、EL層に陽極側から正孔が注入され、陰極側から電子が注入される。注入された電子と正孔はEL層において再結合し、EL層に含まれる発光物質が発光する。 When a voltage higher than the threshold voltage of the light emitting element is applied between the cathode and the anode, holes are injected into the EL layer from the anode side, and electrons are injected from the cathode side. The injected electrons and holes are recombined in the EL layer, and the light-emitting substance contained in the EL layer emits light.
 発光素子として、白色発光の発光素子を適用する場合には、EL層に2種類以上の発光物質を含む構成とすることが好ましい。例えば2以上の発光物質の各々の発光が補色の関係となるように、発光物質を選択することにより白色発光を得ることができる。例えば、それぞれR(赤)、G(緑)、B(青)、Y(黄)、O(橙)等の発光を示す発光物質、またはR、G、Bのうち2以上の色のスペクトル成分を含む発光を示す発光物質のうち、2以上を含むことが好ましい。また、発光素子からの発光のスペクトルが、可視光領域の波長(例えば350nm~750nm)の範囲内に2以上のピークを有する発光素子を適用することが好ましい。また、黄色の波長領域にピークを有する材料の発光スペクトルは、緑色及び赤色の波長領域にもスペクトル成分を有する材料であることが好ましい。 When a white light emitting element is applied as the light emitting element, it is preferable that the EL layer includes two or more kinds of light emitting substances. For example, white light emission can be obtained by selecting the light emitting material so that the light emission of each of the two or more light emitting materials has a complementary color relationship. For example, a light emitting material that emits light such as R (red), G (green), B (blue), Y (yellow), and O (orange), or spectral components of two or more colors of R, G, and B It is preferable that 2 or more are included among the luminescent substances which show light emission containing. In addition, it is preferable to apply a light-emitting element whose emission spectrum from the light-emitting element has two or more peaks in a wavelength range of visible light (for example, 350 nm to 750 nm). The emission spectrum of the material having a peak in the yellow wavelength region is preferably a material having spectral components in the green and red wavelength regions.
 EL層は、一の色を発光する発光材料を含む発光層と、他の色を発光する発光材料を含む発光層とが積層された構成とすることが好ましい。例えば、EL層における複数の発光層は、互いに接して積層されていてもよいし、いずれの発光材料も含まない領域を介して積層されていてもよい。例えば、蛍光発光層と燐光発光層との間に、当該蛍光発光層または燐光発光層と同一の材料(例えばホスト材料、アシスト材料)を含み、且ついずれの発光材料も含まない領域を設ける構成としてもよい。これにより、発光素子の作製が容易になり、また、駆動電圧が低減される。 The EL layer preferably has a structure in which a light-emitting layer including a light-emitting material that emits one color and a light-emitting layer including a light-emitting material that emits another color are stacked. For example, the plurality of light emitting layers in the EL layer may be stacked in contact with each other, or may be stacked through a region not including any light emitting material. For example, a region including the same material (for example, a host material or an assist material) as the fluorescent light emitting layer or the phosphorescent light emitting layer and not including any light emitting material is provided between the fluorescent light emitting layer and the phosphorescent light emitting layer. Also good. This facilitates the production of the light emitting element and reduces the driving voltage.
 また、発光素子は、EL層を1つ有するシングル素子であってもよいし、複数のEL層が電荷発生層を介して積層されたタンデム素子であってもよい。 The light-emitting element may be a single element having one EL layer or a tandem element in which a plurality of EL layers are stacked with a charge generation layer interposed therebetween.
なお、上述した、発光層、ならびに正孔注入性の高い物質、正孔輸送性の高い物質、電子輸送性の高い物質、及び電子注入性の高い物質、バイポーラ性の物質等を含む層は、それぞれ量子ドットなどの無機化合物や、高分子化合物(オリゴマー、デンドリマー、ポリマー等)を有していてもよい。例えば、量子ドットを発光層に用いることで、発光材料として機能させることもできる。 Note that the above-described light-emitting layer and a layer containing a substance having a high hole-injecting property, a substance having a high hole-transporting property, a substance having a high electron-transporting property, a substance having a high electron-injecting property, a bipolar substance, Each may have an inorganic compound such as a quantum dot or a polymer compound (oligomer, dendrimer, polymer, etc.). For example, a quantum dot can be used for a light emitting layer to function as a light emitting material.
 なお、量子ドット材料としては、コロイド状量子ドット材料、合金型量子ドット材料、コア・シェル型量子ドット材料、コア型量子ドット材料などを用いることができる。また、12族と16族、13族と15族、または14族と16族の元素グループを含む材料を用いてもよい。または、カドミウム、セレン、亜鉛、硫黄、リン、インジウム、テルル、鉛、ガリウム、ヒ素、アルミニウム等の元素を含む量子ドット材料を用いてもよい。 As the quantum dot material, a colloidal quantum dot material, an alloy type quantum dot material, a core / shell type quantum dot material, a core type quantum dot material, or the like can be used. Alternatively, a material including an element group of Group 12 and Group 16, Group 13 and Group 15, or Group 14 and Group 16 may be used. Alternatively, a quantum dot material containing an element such as cadmium, selenium, zinc, sulfur, phosphorus, indium, tellurium, lead, gallium, arsenic, or aluminum may be used.
 可視光を透過する導電膜は、例えば、酸化インジウム、インジウム錫酸化物、インジウム亜鉛酸化物、酸化亜鉛、ガリウムを添加した酸化亜鉛などを用いて形成することができる。また、金、銀、白金、マグネシウム、ニッケル、タングステン、クロム、モリブデン、鉄、コバルト、銅、パラジウム、もしくはチタン等の金属材料、これら金属材料を含む合金、又はこれら金属材料の窒化物(例えば、窒化チタン)等も、透光性を有する程度に薄く形成することで用いることができる。また、上記材料の積層膜を導電層として用いることができる。例えば、銀とマグネシウムの合金とインジウム錫酸化物の積層膜などを用いると、導電性を高めることができるため好ましい。また、グラフェン等を用いてもよい。 The conductive film that transmits visible light can be formed using, for example, indium oxide, indium tin oxide, indium zinc oxide, zinc oxide, zinc oxide to which gallium is added, or the like. In addition, a metal material such as gold, silver, platinum, magnesium, nickel, tungsten, chromium, molybdenum, iron, cobalt, copper, palladium, or titanium, an alloy including these metal materials, or a nitride of these metal materials (for example, Titanium nitride) can also be used by forming it thin enough to have translucency. In addition, a stacked film of the above materials can be used as a conductive layer. For example, it is preferable to use a stacked film of an alloy of silver and magnesium and indium tin oxide because the conductivity can be increased. Further, graphene or the like may be used.
 可視光を反射する導電膜は、例えば、アルミニウム、金、白金、銀、ニッケル、タングステン、クロム、モリブデン、鉄、コバルト、銅、もしくはパラジウム等の金属材料、又はこれら金属材料を含む合金を用いることができる。また、上記金属材料や合金に、ランタン、ネオジム、又はゲルマニウム等が添加されていてもよい。また、チタン、ニッケル、またはネオジムと、アルミニウムを含む合金(アルミニウム合金)を用いてもよい。また銅、パラジウム、またはマグネシウムと、銀を含む合金を用いてもよい。銀と銅を含む合金は、耐熱性が高いため好ましい。さらに、アルミニウム膜またはアルミニウム合金膜に接して金属膜又は金属酸化物膜を積層することで、酸化を抑制することができる。このような金属膜、金属酸化物膜の材料としては、チタンや酸化チタンなどが挙げられる。また、上記可視光を透過する導電膜と金属材料からなる膜とを積層してもよい。例えば、銀とインジウム錫酸化物の積層膜、銀とマグネシウムの合金とインジウム錫酸化物の積層膜などを用いることができる。 For the conductive film that reflects visible light, for example, a metal material such as aluminum, gold, platinum, silver, nickel, tungsten, chromium, molybdenum, iron, cobalt, copper, or palladium, or an alloy including these metal materials is used. Can do. In addition, lanthanum, neodymium, germanium, or the like may be added to the metal material or alloy. Alternatively, titanium, nickel, or neodymium and an alloy containing aluminum (aluminum alloy) may be used. Alternatively, an alloy containing copper, palladium, or magnesium and silver may be used. An alloy containing silver and copper is preferable because of its high heat resistance. Furthermore, oxidation can be suppressed by stacking a metal film or a metal oxide film in contact with the aluminum film or the aluminum alloy film. Examples of materials for such metal films and metal oxide films include titanium and titanium oxide. Alternatively, the conductive film that transmits visible light and a film made of a metal material may be stacked. For example, a laminated film of silver and indium tin oxide, a laminated film of an alloy of silver and magnesium and indium tin oxide, or the like can be used.
 電極は、それぞれ、蒸着法やスパッタリング法を用いて形成すればよい。そのほか、インクジェット法などの吐出法、スクリーン印刷法などの印刷法、又はメッキ法を用いて形成することができる。 Each electrode may be formed using a vapor deposition method or a sputtering method. In addition, it can be formed using a discharge method such as an inkjet method, a printing method such as a screen printing method, or a plating method.
 なお、上述した、発光層、ならびに正孔注入性の高い物質、正孔輸送性の高い物質、電子輸送性の高い物質、及び電子注入性の高い物質、バイポーラ性の物質等を含む層は、それぞれ量子ドットなどの無機化合物や、高分子化合物(オリゴマー、デンドリマー、ポリマー等)を有していてもよい。例えば、量子ドットを発光層に用いることで、発光材料として機能させることもできる。 Note that the above-described light-emitting layer and a layer containing a substance having a high hole-injecting property, a substance having a high hole-transporting property, a substance having a high electron-transporting property, a substance having a high electron-injecting property, a bipolar substance, Each may have an inorganic compound such as a quantum dot or a polymer compound (oligomer, dendrimer, polymer, etc.). For example, a quantum dot can be used for a light emitting layer to function as a light emitting material.
 なお、量子ドット材料としては、コロイド状量子ドット材料、合金型量子ドット材料、コア・シェル型量子ドット材料、コア型量子ドット材料などを用いることができる。また、12族と16族、13族と15族、または14族と16族の元素グループを含む材料を用いてもよい。または、カドミウム、セレン、亜鉛、硫黄、リン、インジウム、テルル、鉛、ガリウム、ヒ素、アルミニウム等の元素を含む量子ドット材料を用いてもよい。 As the quantum dot material, a colloidal quantum dot material, an alloy type quantum dot material, a core / shell type quantum dot material, a core type quantum dot material, or the like can be used. Alternatively, a material including an element group of Group 12 and Group 16, Group 13 and Group 15, or Group 14 and Group 16 may be used. Alternatively, a quantum dot material containing an element such as cadmium, selenium, zinc, sulfur, phosphorus, indium, tellurium, lead, gallium, arsenic, or aluminum may be used.
〔接着層〕
 接着層としては、紫外線硬化型等の光硬化型接着剤、反応硬化型接着剤、熱硬化型接着剤、嫌気型接着剤などの各種硬化型接着剤を用いることができる。これら接着剤としてはエポキシ樹脂、アクリル樹脂、シリコーン樹脂、フェノール樹脂、ポリイミド樹脂、イミド樹脂、PVC(ポリビニルクロライド)樹脂、PVB(ポリビニルブチラル)樹脂、EVA(エチレンビニルアセテート)樹脂等が挙げられる。特に、エポキシ樹脂等の透湿性が低い材料が好ましい。また、二液混合型の樹脂を用いてもよい。また、接着シート等を用いてもよい。
[Adhesive layer]
As the adhesive layer, various curable adhesives such as an ultraviolet curable photocurable adhesive, a reactive curable adhesive, a thermosetting adhesive, and an anaerobic adhesive can be used. Examples of these adhesives include epoxy resins, acrylic resins, silicone resins, phenol resins, polyimide resins, imide resins, PVC (polyvinyl chloride) resins, PVB (polyvinyl butyral) resins, EVA (ethylene vinyl acetate) resins, and the like. In particular, a material with low moisture permeability such as an epoxy resin is preferable. Alternatively, a two-component mixed resin may be used. Further, an adhesive sheet or the like may be used.
 また、上記樹脂に乾燥剤を含んでいてもよい。例えば、アルカリ土類金属の酸化物(酸化カルシウムや酸化バリウム等)のように、化学吸着によって水分を吸着する物質を用いることができる。または、ゼオライトやシリカゲル等のように、物理吸着によって水分を吸着する物質を用いてもよい。乾燥剤が含まれていると、水分などの不純物が素子に侵入することを抑制でき、表示パネルの信頼性が向上するため好ましい。 Further, the resin may contain a desiccant. For example, a substance that adsorbs moisture by chemical adsorption, such as an alkaline earth metal oxide (such as calcium oxide or barium oxide), can be used. Alternatively, a substance that adsorbs moisture by physical adsorption, such as zeolite or silica gel, may be used. The inclusion of a desiccant is preferable because impurities such as moisture can be prevented from entering the element and the reliability of the display panel is improved.
 また、上記樹脂に屈折率の高いフィラーや光散乱部材を混合することにより、光取り出し効率を向上させることができる。例えば、酸化チタン、酸化バリウム、ゼオライト、ジルコニウム等を用いることができる。 Also, the light extraction efficiency can be improved by mixing a filler having a high refractive index or a light scattering member with the resin. For example, titanium oxide, barium oxide, zeolite, zirconium, or the like can be used.
〔接続層〕
 接続層としては、異方性導電フィルム(ACF:Anisotropic Conductive Film)や、異方性導電ペースト(ACP:Anisotropic Conductive Paste)などを用いることができる。
(Connection layer)
As the connection layer, an anisotropic conductive film (ACF: Anisotropic Conductive Film), an anisotropic conductive paste (ACP: Anisotropic Conductive Paste), or the like can be used.
〔着色層〕
 着色層に用いることのできる材料としては、金属材料、樹脂材料、顔料または染料が含まれた樹脂材料などが挙げられる。
(Colored layer)
Examples of materials that can be used for the colored layer include metal materials, resin materials, resin materials containing pigments or dyes, and the like.
〔遮光層〕
 遮光層として用いることのできる材料としては、カーボンブラック、チタンブラック、金属、金属酸化物、複数の金属酸化物の固溶体を含む複合酸化物等が挙げられる。遮光層は、樹脂材料を含む膜であってもよいし、金属などの無機材料の薄膜であってもよい。また、遮光層に、着色層の材料を含む膜の積層膜を用いることもできる。例えば、ある色の光を透過する着色層に用いる材料を含む膜と、他の色の光を透過する着色層に用いる材料を含む膜との積層構造を用いることができる。着色層と遮光層の材料を共通化することで、装置を共通化できるほか工程を簡略化できるため好ましい。
[Light shielding layer]
Examples of the material that can be used for the light-shielding layer include carbon black, titanium black, metal, metal oxide, and composite oxide containing a solid solution of a plurality of metal oxides. The light shielding layer may be a film containing a resin material or a thin film of an inorganic material such as a metal. Alternatively, a stacked film of a film containing a material for the colored layer can be used for the light shielding layer. For example, a stacked structure of a film including a material used for a colored layer that transmits light of a certain color and a film including a material used for a colored layer that transmits light of another color can be used. It is preferable to use a common material for the coloring layer and the light-shielding layer because the apparatus can be shared and the process can be simplified.
 以上が各構成要素についての説明である。 The above is an explanation of each component.
 本実施の形態は、少なくともその一部を本明細書中に記載する他の実施の形態と適宜組み合わせて実施することができる。 Note that at least part of this embodiment can be implemented in combination with any of the other embodiments described in this specification as appropriate.
10  電子機器
11  筐体
12  筐体
21  表示部
22  表示部
23  表示部
24  表示部
25  表示部
25a  表示部
25b  表示部
31  ヒンジ部
32  カバー
33  綴じ部
34  保護部
35  折り曲げ部
51  タッチパネル
52  タッチパネル
53  タッチパネル
61  演算部
62  バスライン
64  記憶装置
71  ディスプレイコントローラ
72  タッチセンサコントローラ
73  バッテリーコントローラ
74  受電部
75  バッテリーモジュール
76  サウンドコントローラ
77  音声入力部
78  音声出力部
81  通信モジュール
82  アンテナ
83  姿勢検出部
84  形状検出部
85  外部インターフェース
86  カメラモジュール
87  振動モジュール
88  センサモジュール
100  表示パネル
111a  導電層
111b  導電層
112  液晶
113  導電層
117  絶縁層
121  絶縁層
130  偏光板
131  着色層
132  遮光層
133a  配向膜
133b  配向膜
134  着色層
140  液晶素子
141  接着層
142  接着層
151  基板
160  発光素子
161  基板
162  表示部
164  回路
165  配線
172  FPC
173  IC
191  導電層
192  EL層
193a  導電層
193b  導電層
200  表示パネル
201  トランジスタ
204  接続部
205  トランジスタ
206  トランジスタ
207  接続部
210  画素
211  絶縁層
212  絶縁層
213  絶縁層
214  絶縁層
215  絶縁層
216  絶縁層
217  絶縁層
220  絶縁層
221  導電層
222  導電層
223  導電層
224  導電層
231  半導体層
242  接続層
243  接続体
251  開口
252  接続部
DESCRIPTION OF SYMBOLS 10 Electronic device 11 Case 12 Case 21 Display part 22 Display part 23 Display part 24 Display part 25 Display part 25a Display part 25b Display part 31 Hinge part 32 Cover 33 Binding part 34 Protection part 35 Bending part 51 Touch panel 52 Touch panel 53 Touch panel 61 arithmetic unit 62 bus line 64 storage device 71 display controller 72 touch sensor controller 73 battery controller 74 power receiving unit 75 battery module 76 sound controller 77 audio input unit 78 audio output unit 81 communication module 82 antenna 83 posture detection unit 84 shape detection unit 85 External interface 86 Camera module 87 Vibration module 88 Sensor module 100 Display panel 111a Conductive layer 111b Conductive layer 112 Liquid crystal 113 Electrical layer 117 Insulating layer 121 Insulating layer 130 Polarizing plate 131 Colored layer 132 Light shielding layer 133a Aligned film 133b Aligned film 134 Colored layer 140 Liquid crystal element 141 Adhesive layer 142 Adhesive layer 151 Substrate 160 Light emitting element 161 Substrate 162 Display portion 164 Circuit 165 Wiring 172 FPC
173 IC
191 conductive layer 192 EL layer 193a conductive layer 193b conductive layer 200 display panel 201 transistor 204 connecting portion 205 transistor 206 transistor 207 connecting portion 210 pixel 211 insulating layer 212 insulating layer 213 insulating layer 214 insulating layer 215 insulating layer 216 insulating layer 217 insulating layer 220 Insulating layer 221 Conductive layer 222 Conductive layer 223 Conductive layer 224 Conductive layer 231 Semiconductor layer 242 Connection layer 243 Connection body 251 Opening 252 Connection portion

Claims (12)

  1.  第1の筐体と、第2の筐体と、を有する電子機器であって、
     前記第1の筐体は、第1の面と、当該第1の面の反対側の第2の面と、を有し、
     前記第2の筐体は、第3の面と、当該第3の面の反対側の第4の面と、を有し、
     前記第1の筐体と前記第2の筐体とは、互いに並べて連結されており、
     前記第1の筐体と前記第2の筐体とは、前記第1の面と前記第3の面とが対向して重なるように折り畳まれた形態と、前記第1の面と前記第3の面とが露出するように開いた形態と、に変形可能であり、
     前記第1の筐体は、前記第1の面に第1の表示部を有し、且つ前記第2の面に第2の表示部を有し、
     前記第2の筐体は、前記第3の面に第3の表示部を有し、
     前記第2の表示部は、書き換えを行うことなく静止画の表示を保持する機能を有する、
     電子機器。
    An electronic device having a first housing and a second housing,
    The first housing has a first surface and a second surface opposite to the first surface,
    The second housing has a third surface and a fourth surface opposite to the third surface,
    The first housing and the second housing are connected side by side,
    The first housing and the second housing are folded so that the first surface and the third surface face each other and overlap each other, and the first surface and the third surface And can be transformed into an open form so that the surface of
    The first housing has a first display unit on the first surface and a second display unit on the second surface;
    The second casing has a third display portion on the third surface,
    The second display unit has a function of holding a still image display without rewriting.
    Electronics.
  2.  請求項1において、
     前記第2の筐体は、前記第4の面に第4の表示部を有し、
     前記第4の表示部は、書き換えを行うことなく静止画の表示を保持する機能を有する、
     電子機器。
    In claim 1,
    The second casing has a fourth display portion on the fourth surface,
    The fourth display unit has a function of holding a still image display without rewriting.
    Electronics.
  3.  請求項1において、
     前記第1の筐体と前記第2の筐体とが折り畳まれた形態のとき、前記第2の面と前記第4の面の間に、第5の表示部を有し、
     前記第5の表示部は、書き換えを行うことなく静止画の表示を保持する機能を有する、
     電子機器。
    In claim 1,
    When the first housing and the second housing are folded, a fifth display portion is provided between the second surface and the fourth surface,
    The fifth display unit has a function of holding a still image display without rewriting.
    Electronics.
  4.  請求項1において、
     前記第1の筐体の厚さが、前記第2の筐体よりも薄い、
     電子機器。
    In claim 1,
    The first casing is thinner than the second casing;
    Electronics.
  5.  請求項1において、
     前記第1の筐体と前記第2の筐体とが折り畳まれた形態において、
     厚さが0mmより大きく、10cm以下である、
     電子機器。
    In claim 1,
    In the form in which the first casing and the second casing are folded,
    The thickness is greater than 0 mm and 10 cm or less,
    Electronics.
  6.  請求項1において、
     カバーを有し、
     前記カバーは、前記第2の面及び前記第4の面を覆って設けられ、
     前記カバーは、前記第2の表示部からの光を透過する機能を有する、
     電子機器。
    In claim 1,
    Has a cover,
    The cover is provided to cover the second surface and the fourth surface,
    The cover has a function of transmitting light from the second display unit.
    Electronics.
  7.  請求項6において、
     前記カバーは、紙を含むことを特徴とする、
     電子機器。
    In claim 6,
    The cover includes paper,
    Electronics.
  8.  請求項1において、
     前記第2の表示部は、マイクロカプセル、電気泳動素子、ネマチック液晶素子、コレステリック液晶素子、強誘電性液晶素子、エレクトロウェッティング素子、エレクトロフルイディック素子、エレクトロクロミック素子、MEMS素子から選ばれた一以上を含む、
     電子機器。
    In claim 1,
    The second display unit is one selected from a microcapsule, an electrophoretic element, a nematic liquid crystal element, a cholesteric liquid crystal element, a ferroelectric liquid crystal element, an electrowetting element, an electrofluidic element, an electrochromic element, and a MEMS element. Including the above,
    Electronics.
  9.  請求項1において、
     前記第1の表示部、及び前記第3の表示部は、それぞれ液晶素子、有機EL素子、マイクロカプセル、電気泳動素子、エレクトロウェッティング素子、エレクトロフルイディック素子、エレクトロクロミック素子、MEMS素子から選ばれた一以上を含む、
     電子機器。
    In claim 1,
    The first display unit and the third display unit are each selected from a liquid crystal element, an organic EL element, a microcapsule, an electrophoretic element, an electrowetting element, an electrofluidic element, an electrochromic element, and a MEMS element. Including one or more,
    Electronics.
  10.  請求項1において、
     前記第1の筐体及び前記第2の筐体は、それぞれ前記第1の表示部または前記第3の表示部に表示パネルを有し、
     前記表示パネルは、第1の基板と、第2の基板と、液晶素子と、発光素子と、絶縁層と、を有し、
     前記液晶素子は、前記第2の基板と前記絶縁層の間に位置し、
     前記発光素子は、前記第1の基板と前記絶縁層の間に位置し、
     前記液晶素子は、前記第2の基板側に光を反射する機能を有し、
     前記発光素子は、前記第2の基板側に光を発する機能を有する、
     電子機器。
    In claim 1,
    Each of the first casing and the second casing has a display panel in the first display section or the third display section,
    The display panel includes a first substrate, a second substrate, a liquid crystal element, a light emitting element, and an insulating layer.
    The liquid crystal element is located between the second substrate and the insulating layer;
    The light emitting element is located between the first substrate and the insulating layer,
    The liquid crystal element has a function of reflecting light to the second substrate side,
    The light emitting element has a function of emitting light to the second substrate side.
    Electronics.
  11.  請求項1において、
     前記第1の筐体及び前記第2の筐体は、それぞれ前記第1の表示部または前記第3の表示部に表示パネルを有し、
     前記表示パネルは、第1の基板と、第2の基板と、液晶素子と、発光素子と、第1のトランジスタと、第2のトランジスタと、第1の絶縁層と、第2の絶縁層と、を有し、
     前記第1のトランジスタ及び前記第2のトランジスタは、前記第1の絶縁層と前記第2の絶縁層と、の間に位置し、
     前記液晶素子は、前記第2の基板と前記第2の絶縁層の間に位置し、
     前記発光素子は、前記第1の基板と前記第1の絶縁層の間に位置し、
     前記液晶素子は、前記第1のトランジスタと電気的に接続し、且つ、前記第2の基板側に光を反射する機能を有し、
     前記発光素子は、前記第2のトランジスタと電気的に接続し、且つ、前記第2の基板側に光を発する機能を有する、
     電子機器。
    In claim 1,
    Each of the first casing and the second casing has a display panel in the first display section or the third display section,
    The display panel includes a first substrate, a second substrate, a liquid crystal element, a light emitting element, a first transistor, a second transistor, a first insulating layer, and a second insulating layer. Have
    The first transistor and the second transistor are located between the first insulating layer and the second insulating layer,
    The liquid crystal element is located between the second substrate and the second insulating layer,
    The light emitting element is located between the first substrate and the first insulating layer,
    The liquid crystal element is electrically connected to the first transistor and has a function of reflecting light toward the second substrate;
    The light-emitting element is electrically connected to the second transistor and has a function of emitting light to the second substrate side.
    Electronics.
  12.  請求項1において、
     前記第1の筐体、または前記第2の筐体は、バッテリーモジュール、センサモジュール、振動モジュール、カメラモジュール、外部インターフェース、通信モジュール、スピーカ、マイク、CPU、及び記憶装置のうち少なくとも一を有する、
     電子機器。
    In claim 1,
    The first casing or the second casing includes at least one of a battery module, a sensor module, a vibration module, a camera module, an external interface, a communication module, a speaker, a microphone, a CPU, and a storage device.
    Electronics.
PCT/IB2017/052653 2016-05-18 2017-05-08 Electronic device WO2017199122A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016-099273 2016-05-18
JP2016099273 2016-05-18

Publications (1)

Publication Number Publication Date
WO2017199122A1 true WO2017199122A1 (en) 2017-11-23

Family

ID=60324929

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2017/052653 WO2017199122A1 (en) 2016-05-18 2017-05-08 Electronic device

Country Status (1)

Country Link
WO (1) WO2017199122A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110535211A (en) * 2019-09-18 2019-12-03 努比亚技术有限公司 Charge control method, terminal and computer readable storage medium

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002108254A (en) * 2000-09-27 2002-04-10 Ricoh Co Ltd Portable electronic equipment
JP2003076302A (en) * 2001-09-06 2003-03-14 Sharp Corp Display device
WO2004053819A1 (en) * 2002-12-06 2004-06-24 Citizen Watch Co., Ltd. Liquid crystal display
JP2005274691A (en) * 2004-03-23 2005-10-06 Seiko Epson Corp Electronic display device
US20100171905A1 (en) * 2009-01-08 2010-07-08 Jung-Yen Huang Transflective display panel
JP2010282181A (en) * 2009-05-02 2010-12-16 Semiconductor Energy Lab Co Ltd Electronic book
JP2011053672A (en) * 2009-08-07 2011-03-17 Semiconductor Energy Lab Co Ltd Display panel and electronic book
JP2011107895A (en) * 2009-11-16 2011-06-02 Interlink:Kk Electronic book
JP2013068877A (en) * 2011-09-26 2013-04-18 Nec Casio Mobile Communications Ltd Display device, display method, and program
JP2016038490A (en) * 2014-08-08 2016-03-22 株式会社半導体エネルギー研究所 Display panel, display module, and electronic apparatus

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002108254A (en) * 2000-09-27 2002-04-10 Ricoh Co Ltd Portable electronic equipment
JP2003076302A (en) * 2001-09-06 2003-03-14 Sharp Corp Display device
WO2004053819A1 (en) * 2002-12-06 2004-06-24 Citizen Watch Co., Ltd. Liquid crystal display
JP2005274691A (en) * 2004-03-23 2005-10-06 Seiko Epson Corp Electronic display device
US20100171905A1 (en) * 2009-01-08 2010-07-08 Jung-Yen Huang Transflective display panel
JP2010282181A (en) * 2009-05-02 2010-12-16 Semiconductor Energy Lab Co Ltd Electronic book
JP2011053672A (en) * 2009-08-07 2011-03-17 Semiconductor Energy Lab Co Ltd Display panel and electronic book
JP2011107895A (en) * 2009-11-16 2011-06-02 Interlink:Kk Electronic book
JP2013068877A (en) * 2011-09-26 2013-04-18 Nec Casio Mobile Communications Ltd Display device, display method, and program
JP2016038490A (en) * 2014-08-08 2016-03-22 株式会社半導体エネルギー研究所 Display panel, display module, and electronic apparatus

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110535211A (en) * 2019-09-18 2019-12-03 努比亚技术有限公司 Charge control method, terminal and computer readable storage medium
CN110535211B (en) * 2019-09-18 2023-01-24 努比亚技术有限公司 Charging control method, terminal and computer readable storage medium

Similar Documents

Publication Publication Date Title
US11789497B2 (en) Display device, electronic device, and system
JP7094408B2 (en) Electronics
KR102556794B1 (en) Touch panel
JP7138263B1 (en) Display device
JP2017227857A (en) Display device, electronic device, and system
JP2018022890A (en) Semiconductor device and semiconductor device manufacturing method
JP2018032397A (en) Touch input pen, electronic device, and method for input to electronic device with touch input pen
WO2017199122A1 (en) Electronic device
JP2018205557A (en) Display device, and method for driving display device
CN114609885B (en) Electronic equipment
WO2018185588A1 (en) Display device and driving method for display device
JP2018072462A (en) Display device
JP2018049208A (en) Display divice

Legal Events

Date Code Title Description
NENP Non-entry into the national phase

Ref country code: DE

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 17798836

Country of ref document: EP

Kind code of ref document: A1

122 Ep: pct application non-entry in european phase

Ref document number: 17798836

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: JP