JP6869717B2 - 撮像装置および撮像装置の製造方法、並びに、電子機器 - Google Patents

撮像装置および撮像装置の製造方法、並びに、電子機器 Download PDF

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Publication number
JP6869717B2
JP6869717B2 JP2016256829A JP2016256829A JP6869717B2 JP 6869717 B2 JP6869717 B2 JP 6869717B2 JP 2016256829 A JP2016256829 A JP 2016256829A JP 2016256829 A JP2016256829 A JP 2016256829A JP 6869717 B2 JP6869717 B2 JP 6869717B2
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Japan
Prior art keywords
image sensor
state image
solid
circuit board
csp
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JP2016256829A
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English (en)
Japanese (ja)
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JP2018110302A (ja
JP2018110302A5 (https=
Inventor
勝治 木村
勝治 木村
大一 関
大一 関
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Sony Semiconductor Solutions Corp
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Sony Semiconductor Solutions Corp
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Priority to JP2016256829A priority Critical patent/JP6869717B2/ja
Application filed by Sony Semiconductor Solutions Corp filed Critical Sony Semiconductor Solutions Corp
Priority to PCT/JP2017/045041 priority patent/WO2018123643A1/en
Priority to US16/471,929 priority patent/US20200098810A1/en
Priority to KR1020197018115A priority patent/KR20190097064A/ko
Priority to EP17823236.9A priority patent/EP3563414B1/en
Priority to CN201780068936.XA priority patent/CN109952648B/zh
Publication of JP2018110302A publication Critical patent/JP2018110302A/ja
Publication of JP2018110302A5 publication Critical patent/JP2018110302A5/ja
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Publication of JP6869717B2 publication Critical patent/JP6869717B2/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/805—Coatings
    • H10F39/8057—Optical shielding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/129—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed forming a chip-scale package [CSP]

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  • Solid State Image Pick-Up Elements (AREA)
  • Studio Devices (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
JP2016256829A 2016-12-28 2016-12-28 撮像装置および撮像装置の製造方法、並びに、電子機器 Active JP6869717B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2016256829A JP6869717B2 (ja) 2016-12-28 2016-12-28 撮像装置および撮像装置の製造方法、並びに、電子機器
US16/471,929 US20200098810A1 (en) 2016-12-28 2017-12-15 Camera module, method for producing camera module, and electronic apparatus
KR1020197018115A KR20190097064A (ko) 2016-12-28 2017-12-15 카메라 모듈, 카메라 모듈의 제조 방법 및 전자기기
EP17823236.9A EP3563414B1 (en) 2016-12-28 2017-12-15 Camera module, method for producing camera module,and electronic apparatus
PCT/JP2017/045041 WO2018123643A1 (en) 2016-12-28 2017-12-15 Camera module, method for producing camera module,and electronic apparatus
CN201780068936.XA CN109952648B (zh) 2016-12-28 2017-12-15 相机模块、相机模块的制造方法和电子设备

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016256829A JP6869717B2 (ja) 2016-12-28 2016-12-28 撮像装置および撮像装置の製造方法、並びに、電子機器

Publications (3)

Publication Number Publication Date
JP2018110302A JP2018110302A (ja) 2018-07-12
JP2018110302A5 JP2018110302A5 (https=) 2020-01-30
JP6869717B2 true JP6869717B2 (ja) 2021-05-12

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JP2016256829A Active JP6869717B2 (ja) 2016-12-28 2016-12-28 撮像装置および撮像装置の製造方法、並びに、電子機器

Country Status (6)

Country Link
US (1) US20200098810A1 (https=)
EP (1) EP3563414B1 (https=)
JP (1) JP6869717B2 (https=)
KR (1) KR20190097064A (https=)
CN (1) CN109952648B (https=)
WO (1) WO2018123643A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6976751B2 (ja) * 2017-07-06 2021-12-08 ソニーセミコンダクタソリューションズ株式会社 撮像装置および撮像装置の製造方法、並びに、電子機器
JP2019066422A (ja) 2017-10-04 2019-04-25 ソニーセミコンダクタソリューションズ株式会社 検査装置、および検査方法、並びに、プログラム
JP2020068302A (ja) * 2018-10-24 2020-04-30 ソニーセミコンダクタソリューションズ株式会社 撮像装置
KR20230157536A (ko) * 2019-03-08 2023-11-16 데쿠세리아루즈 가부시키가이샤 접속 구조체의 제조 방법, 및 접속 구조체, 그리고 필름 구조체, 및 필름 구조체의 제조 방법
JP7334675B2 (ja) * 2020-05-25 2023-08-29 株式会社デンソー 車載カメラ及び車両制御システム

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3971087B2 (ja) * 2000-06-26 2007-09-05 株式会社リコー 固体撮像装置
JP2009003073A (ja) * 2007-06-20 2009-01-08 Hitachi Maxell Ltd カメラモジュール、台座マウント及び撮像装置
JP4932745B2 (ja) * 2008-01-10 2012-05-16 シャープ株式会社 固体撮像装置およびそれを備えた電子機器
WO2010050184A1 (ja) * 2008-10-28 2010-05-06 パナソニック株式会社 撮像ユニット
JP2011238667A (ja) * 2010-05-06 2011-11-24 Shinko Electric Ind Co Ltd 固体撮像装置の製造方法および固体撮像装置
JP5595786B2 (ja) * 2010-05-11 2014-09-24 シャープ株式会社 カメラモジュールおよびそれを備えた電子機器
JP2012018993A (ja) * 2010-07-06 2012-01-26 Toshiba Corp カメラモジュールおよびその製造方法
JP5031876B2 (ja) * 2010-09-24 2012-09-26 シャープ株式会社 カメラモジュールおよび撮像装置
JP2012222546A (ja) * 2011-04-07 2012-11-12 Sony Corp 固体撮像装置及びその製造方法、並びに電子機器
CN202120913U (zh) * 2011-06-08 2012-01-18 旭丽电子(广州)有限公司 薄型化图像撷取模块
US9007520B2 (en) * 2012-08-10 2015-04-14 Nanchang O-Film Optoelectronics Technology Ltd Camera module with EMI shield
KR102055840B1 (ko) * 2014-02-20 2019-12-17 삼성전자 주식회사 이미지 센서 패키지
JP6254680B2 (ja) * 2014-04-04 2018-01-10 シャープ株式会社 レンズ素子および撮像装置
WO2016056510A1 (ja) 2014-10-06 2016-04-14 東洋製罐グループホールディングス株式会社 塗装金属板及び有機樹脂被覆塗装金属板
US9997554B2 (en) * 2014-12-24 2018-06-12 Stmicroelectronics Pte Ltd Chip scale package camera module with glass interposer having lateral conductive traces between a first and second glass layer and method for making the same
CN107209342B (zh) * 2015-01-23 2020-03-27 夏普株式会社 相机模块的制造方法、像面侧组透镜、像面侧组透镜的制造方法和摄像元件

Also Published As

Publication number Publication date
EP3563414B1 (en) 2021-11-24
JP2018110302A (ja) 2018-07-12
WO2018123643A1 (en) 2018-07-05
US20200098810A1 (en) 2020-03-26
CN109952648A (zh) 2019-06-28
CN109952648B (zh) 2023-07-14
KR20190097064A (ko) 2019-08-20
EP3563414A1 (en) 2019-11-06

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