JP6868462B2 - 無線中継装置 - Google Patents
無線中継装置 Download PDFInfo
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- JP6868462B2 JP6868462B2 JP2017093846A JP2017093846A JP6868462B2 JP 6868462 B2 JP6868462 B2 JP 6868462B2 JP 2017093846 A JP2017093846 A JP 2017093846A JP 2017093846 A JP2017093846 A JP 2017093846A JP 6868462 B2 JP6868462 B2 JP 6868462B2
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- wireless
- substrate
- relay device
- antenna
- wireless relay
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- 230000003014 reinforcing effect Effects 0.000 claims description 35
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- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 claims description 8
- 238000004891 communication Methods 0.000 description 21
- 230000005540 biological transmission Effects 0.000 description 15
- 238000005452 bending Methods 0.000 description 11
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- 239000002184 metal Substances 0.000 description 9
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- 239000000463 material Substances 0.000 description 8
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- 239000010949 copper Substances 0.000 description 4
- 230000006870 function Effects 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 230000002787 reinforcement Effects 0.000 description 2
- 108010053070 Glutathione Disulfide Proteins 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
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- YPZRWBKMTBYPTK-BJDJZHNGSA-N glutathione disulfide Chemical compound OC(=O)[C@@H](N)CCC(=O)N[C@H](C(=O)NCC(O)=O)CSSC[C@@H](C(=O)NCC(O)=O)NC(=O)CC[C@H](N)C(O)=O YPZRWBKMTBYPTK-BJDJZHNGSA-N 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
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- 238000000926 separation method Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
- H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
- H01Q1/246—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for base stations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/66—High-frequency adaptations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/29—Combinations of different interacting antenna units for giving a desired directional characteristic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q25/00—Antennas or antenna systems providing at least two radiating patterns
- H01Q25/005—Antennas or antenna systems providing at least two radiating patterns providing two patterns of opposite direction; back to back antennas
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B7/00—Radio transmission systems, i.e. using radiation field
- H04B7/14—Relay systems
- H04B7/15—Active relay systems
- H04B7/155—Ground-based stations
- H04B7/15528—Control of operation parameters of a relay station to exploit the physical medium
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0141—Liquid crystal polymer [LCP]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0154—Polyimide
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
- H05K2201/055—Folded back on itself
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10098—Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Radio Relay Systems (AREA)
- Transceivers (AREA)
- Variable-Direction Aerials And Aerial Arrays (AREA)
Description
図1は、本発明の第1の実施形態に係る無線中継装置201の概略構成を示す平面図及び側面図(当該平面図の下側から上側に見た図)である。図1に示す無線中継装置201は、基板11、受信アンテナ21,22、無線IC31,32、複数の配線41、送信アンテナ51,52、制御IC6、エッジコネクタ7、並びに補強板81〜83を備えている。なお、図示していないが、無線中継装置201は、無線IC31又は無線IC32の周辺に、無線IC31,32を駆動させるために必要な電子部品である、コンデンサ、抵抗、及び水晶発振器などを備えていてもよい。
図3は、本発明の第2の実施形態に係る無線中継装置202の概略構成を示す平面図である。なお、説明の便宜上、先に説明した部材と同じ機能を有する部材については、同じ符号を付記し、その説明を省略する。
図4は、本発明に係る無線中継装置20の使用例を示すイメージ図である。
21、22 受信アンテナ
31、32 無線IC(第1無線IC、第2無線IC)
41、42 配線
51、52 送信アンテナ
81〜83 補強板(第1補強板、第2補強板)
20、201、202 無線中継装置
Claims (5)
- 基板と、
上記基板上に形成された受信アンテナであって、第1電磁波を第1RF信号に変換する受信アンテナと、
前記基板上に形成された第1無線ICであって、前記受信アンテナにて得られた前記第1RF信号をベースバンド信号に変換する第1無線ICと、
前記基板上に形成された第2無線ICであって、前記第1無線ICにて得られた前記ベースバンド信号を第2RF信号に変換する第2無線ICと、
前記基板上に形成された送信アンテナであって、前記第2無線ICにて得られた前記第2RF信号を第2電磁波に変換する送信アンテナと、を備えており、
前記第1無線ICと前記第2無線ICとは、前記基板上に形成された配線であって、前記ベースバンド信号を伝送するための配線で接続されており、
前記基板は、フレキシブル基板であり、前記受信アンテナと前記送信アンテナとが互いに異なる方向を向くように折り曲げられている、
ことを特徴とする無線中継装置。 - 前記基板において前記受信アンテナ及び前記第1無線ICが配置された領域を補強する第1補強板と、前記基板において前記送信アンテナ及び前記第2無線ICが配置された領域を補強する第2補強板と、を更に備えており、
前記基板は、前記第1補強板と前記第2補強板との間が稜線となるように折り曲げられている、
ことを特徴とする請求項1に記載の無線中継装置。 - 前記受信アンテナ及び前記送信アンテナのそれぞれは、互いに最大利得方向の異なる指向性アンテナである、
ことを特徴とする請求項1又は2に記載の無線中継装置。 - 前記受信アンテナ及び前記送信アンテナのそれぞれは、最大利得方向が可変である指向性アンテナである、
ことを特徴とする請求項1又は2に記載の無線中継装置。 - 前記基板は、液晶ポリマーを基材とする基板である、
ことを特徴とする請求項1〜4の何れか1項に記載の無線中継装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017093846A JP6868462B2 (ja) | 2017-05-10 | 2017-05-10 | 無線中継装置 |
CA3061698A CA3061698A1 (en) | 2017-05-10 | 2018-04-02 | Wireless relay device |
US16/607,428 US20200136238A1 (en) | 2017-05-10 | 2018-04-02 | Wireless relay device |
EP18798920.7A EP3624354A4 (en) | 2017-05-10 | 2018-04-02 | WIRELESS RELAY DEVICE |
PCT/JP2018/014115 WO2018207500A1 (ja) | 2017-05-10 | 2018-04-02 | 無線中継装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017093846A JP6868462B2 (ja) | 2017-05-10 | 2017-05-10 | 無線中継装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018191215A JP2018191215A (ja) | 2018-11-29 |
JP6868462B2 true JP6868462B2 (ja) | 2021-05-12 |
Family
ID=64104467
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017093846A Active JP6868462B2 (ja) | 2017-05-10 | 2017-05-10 | 無線中継装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20200136238A1 (ja) |
EP (1) | EP3624354A4 (ja) |
JP (1) | JP6868462B2 (ja) |
CA (1) | CA3061698A1 (ja) |
WO (1) | WO2018207500A1 (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2019232086A1 (en) | 2018-05-29 | 2019-12-05 | Pax Labs, Inc. | Vaporizer device with cartridge |
TWI681594B (zh) * | 2018-09-04 | 2020-01-01 | 明泰科技股份有限公司 | 陣列天線及可變感測方向的天線系統 |
US11545733B2 (en) * | 2019-02-20 | 2023-01-03 | Samsung Electronics Co., Ltd. | Antenna module including flexible printed circuit board and electronic device including the antenna module |
KR102137093B1 (ko) | 2019-08-05 | 2020-07-23 | 삼성전기주식회사 | 안테나 모듈 및 이를 포함하는 전자기기 |
WO2021049826A1 (ko) * | 2019-09-11 | 2021-03-18 | 동우화인켐 주식회사 | 안테나 소자 및 이를 포함하는 디스플레이 장치 |
US11594824B2 (en) | 2019-10-17 | 2023-02-28 | Qualcomm Incorporated | Integrated antenna module |
US11495873B2 (en) * | 2020-03-05 | 2022-11-08 | Qualcomm Incorporated | Device comprising multi-directional antennas in substrates coupled through flexible interconnects |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AUPP278998A0 (en) * | 1998-04-03 | 1998-04-30 | Telstra Corporation Limited | A transmission system for a mobile communications signal |
JP2002185381A (ja) | 2000-12-13 | 2002-06-28 | Takao Sugimoto | 無線中継装置 |
JP2003324383A (ja) * | 2002-05-07 | 2003-11-14 | Kddi Corp | 無線システム用リピータ装置 |
JP2005101986A (ja) | 2003-09-25 | 2005-04-14 | Matsushita Electric Works Ltd | 無線中継装置 |
KR100879335B1 (ko) * | 2007-02-23 | 2009-01-19 | (주)에어포인트 | 전치 왜곡 기능을 구비한 귀환간섭신호 제거 중계 시스템및 그 방법 |
US20100033393A1 (en) * | 2008-08-07 | 2010-02-11 | Wilocity, Ltd. | Techniques for Mounting a Millimeter Wave Antenna and a Radio Frequency Integrated Circuit Onto a PCB |
US20100234071A1 (en) * | 2009-03-12 | 2010-09-16 | Comsys Communication & Signal Processing Ltd. | Vehicle integrated communications system |
JP5375738B2 (ja) * | 2010-05-18 | 2013-12-25 | ソニー株式会社 | 信号伝送システム |
-
2017
- 2017-05-10 JP JP2017093846A patent/JP6868462B2/ja active Active
-
2018
- 2018-04-02 CA CA3061698A patent/CA3061698A1/en not_active Abandoned
- 2018-04-02 US US16/607,428 patent/US20200136238A1/en not_active Abandoned
- 2018-04-02 EP EP18798920.7A patent/EP3624354A4/en not_active Withdrawn
- 2018-04-02 WO PCT/JP2018/014115 patent/WO2018207500A1/ja unknown
Also Published As
Publication number | Publication date |
---|---|
WO2018207500A1 (ja) | 2018-11-15 |
CA3061698A1 (en) | 2019-10-28 |
JP2018191215A (ja) | 2018-11-29 |
EP3624354A1 (en) | 2020-03-18 |
EP3624354A4 (en) | 2021-01-20 |
US20200136238A1 (en) | 2020-04-30 |
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