JP6860023B2 - 積層アンテナ及び積層アンテナの製造方法 - Google Patents
積層アンテナ及び積層アンテナの製造方法 Download PDFInfo
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- JP6860023B2 JP6860023B2 JP2019002057A JP2019002057A JP6860023B2 JP 6860023 B2 JP6860023 B2 JP 6860023B2 JP 2019002057 A JP2019002057 A JP 2019002057A JP 2019002057 A JP2019002057 A JP 2019002057A JP 6860023 B2 JP6860023 B2 JP 6860023B2
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Images
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- Parts Printed On Printed Circuit Boards (AREA)
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Description
(A)ポリエステル樹脂
(B)板状無機フィラー
(C)フュームドシリカ
(D)ゴム相
(E)エポキシ樹脂
(A)ポリエステル樹脂、
(B)板状無機フィラー、
(C)フュームドシリカ、
(D)ゴム相
(E)エポキシ樹脂
上記の接着層用組成物を厚さ10μmのフィルム状に成型し、幅10mm、長さ10mmに切断した試験片について、300℃過熱水蒸気雰囲気下、10分間加熱し、加熱後の加熱減量を測定し、(加熱前の重量−加熱後の重量)/加熱前の重量×100で算出した。加熱減量は1.8重量%であった。
絶縁コート剤として表2に示すコート剤1を用いて、次の手順で絶縁基体の片面上に4ターンの平面コイルを4層積層し、2層ずつ直列に接続されたアンテナが2組積層された構造の積層アンテナを製造した。
絶縁コート剤として表2に示す種々のコート剤を用いた。実施例1と同様にして得た接着層を設けた絶縁基体上に、実施例1と同様の手段で4ターンの平面コイルを4層積層し、4層全てが直列に接続された構造の積層アンテナを得た。
あらかじめNi−Zn−Cuフェライト粉末(戸田工業(株)製FRX−950)をグリーンシート法により920℃で2時間焼結した厚さ150μmで格子状に切れ目を入れた焼結フェライトシートを得た。絶縁コート剤として表2に示すコート剤1を用いて、実施例2と同様にアンテナ配線パターンを積層し、前記焼結フェライトシートに厚み10μmの両面テープで貼り付けて積層アンテナを得た。
厚み35μmの銅箔を厚み25μmのPETに厚み20μmの接着層を介して積層したFCCLを使用して、実施例1、2で積層した配線パターンの4倍の面積を持つアンテナを通常のフォトレジストを用いたエッチング工程により形成した。
表3に示す種々の組成の絶縁コート剤を用いて、実施例2と同様に実施した。
積層アンテナの片面にICチップ(NXP社製ICチップI CODE SLI)を実装し、共振周波数調整用のコンデンサを並列に接続して、共振周波数を13.56MHzになるよう調整した状態で、リーダライタ(タカヤ製TR3−C201)で交信距離を比較評価した。その結果を表4〜表6に示す。
交信できた積層アンテナ各100個をJIS規格(JIS C 60068−2−14)に基づいて温度サイクル試験を実施した。
実施例1の積層アンテナについて、独立したアンテナにそれぞれ、計2個のICチップを実装した場合、2つのICを同時に読み取ることが確認された。
11、21 絶縁基体
31 絶縁基体(樹脂フィルム)
12、22、32 接着層
13、23、33 配線パターン
14、24、34 絶縁コート層
15、25、35 スルーホール
16、17、26、36 アンテナコイル
38 磁性体
39 両面テープ
Claims (11)
- 絶縁基体上の片面に、導電ペーストで形成した複数の配線パターンがスルーホールを有する絶縁コート層を挟んで積層されており、配線パターンがスルーホールを介して接続されている積層アンテナであって、絶縁コート層は、下記(A)〜(E)を含有する樹脂の硬化物であることを特徴とする積層アンテナ。
(A)ポリエステル樹脂
(B)板状無機フィラー
(C)フュームドシリカ
(D)ゴム相
(E)エポキシ樹脂 - ポリエステル樹脂の酸価が樹脂1トン当たり800〜2500当量である請求項1に記載の積層アンテナ。
- 導電ペーストが導電粒子とバインダー樹脂と溶剤とを含有し、当該導電粒子が銅又は銅を主成分とするものである請求項1または2に記載の積層アンテナ。
- 配線パターンが平面渦巻き状のコイルパターンであり、コイルパターンがスルーホールを介して接続されてアンテナコイルを形成している請求項1〜3のいずれかに記載の積層アンテナ。
- 絶縁基体が磁性体である請求項1〜4のいずれかに記載の積層アンテナ。
- 絶縁基体が樹脂フィルムである請求項1〜4のいずれかに記載の積層アンテナ。
- 絶縁基体上に接着層を介して配線パターンが形成されている請求項1〜6のいずれかに記載の積層アンテナ。
- 接着層の硬化後の加熱減量が、300℃過熱水蒸気雰囲気下10分で、25重量%以下である請求項1〜7のいずれかに記載の積層アンテナ。
- 絶縁基体上の片面に導電ペーストの印刷により配線パターンを形成し、下記(A)〜(E)を含有する絶縁コート剤の印刷により前記配線パターン上にスルーホールとなる開口部を有する絶縁コート層のパターンを形成し、前記絶縁コート層上に導電ペーストの印刷によりスルーホールの充填を含む配線パターンの形成を行うことを特徴とする積層アンテナの製造方法。
(A)ポリエステル樹脂
(B)板状無機フィラー
(C)フュームドシリカ
(D)ゴム相
(E)エポキシ樹脂 - 導電ペーストを130℃以上で熱処理して配線パターンとする請求項9に記載の積層アンテナの製造方法。
- 絶縁コート剤を120℃以上の熱処理で硬化して絶縁コート層とする請求項9または10に記載の積層アンテナの製造方法。
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