JP6854726B2 - Tool cutting equipment - Google Patents

Description

The present invention relates to a cutting tool.

A machining method is known in which a bite wheel equipped with a bite tool is fixed to the tip of a spindle, and metal bumps and resin layers on the surface such as WL-CSP (Wafer-level Chip Size Package) are swirled and cut to make the height uniform. (See, for example, Patent Document 1 and Patent Document 2). The tool cutting apparatus shown in Patent Document 1 and Patent Document 2 adjusts the height of the cutting edge of the tool tool with reference to the upper surface of the chuck table, and cuts the workpiece to a desired thickness.

Japanese Unexamined Patent Publication No. 2012-114366 Japanese Unexamined Patent Publication No. 2013-22673

The tool cutting apparatus shown in Patent Document 1 and Patent Document 2 measures the height of the surface of a laminated portion such as metal bumps and resins laminated on a substrate, and cuts the surface of the laminated portion with a tool. A work piece is formed in which a laminated portion having a desired finished thickness remains. However, when the thickness of the laminated portion is not uniform or the thickness of the substrate varies, the thickness of the workpiece to which the laminated portion has a desired finished thickness differs for each workpiece. However, since the cutting tool cutting apparatus shown in Patent Document 1 and Patent Document 2 and the like measures only the height of the surface of the laminated portion, when the thickness of the substrate varies, the laminated portion has a desired finished thickness. There was a problem that it could not be formed.

The present invention has been made in view of such a point, and an object of the present invention is to provide a cutting tool capable of suppressing variation in the thickness of the laminated portion of the workpiece from the finished thickness. provide.

In order to solve the above-mentioned problems and achieve the object, the tool cutting device of the present invention is laminated on the first surface of the substrate including the first surface and the second surface opposite to the first surface. A chuck table for holding the workpiece having the laminated portion on the second surface side and a cutting tool for turning and cutting the surface of the laminated portion of the workpiece held on the chuck table with a tool tool mounted on a spindle. A cutting unit, a cassette mounting area for mounting a cassette accommodating a plurality of workpieces, and a transport unit for carrying the workpiece out of the cassette mounted in the cassette mounting area and carrying the workpiece onto the chuck table. A tool cutting device including a thickness measuring unit for measuring the thickness of the workpiece and a cutting amount calculating unit for calculating the thickness of the laminated portion to be cut by the cutting unit. The transport unit has a transport pad that sucks and holds the first surface of the work piece carried out from the cassette and carries it into the chuck table, and the thickness measuring unit is held by the transport pad. The second surface of the work piece exposed in the state was held by an optical measuring unit for measuring the thickness of the substrate by irradiating the second surface with a wavelength transmitted through the substrate and the chuck table. A contact type measuring unit for measuring the thickness of the work piece by bringing a stylus into contact with the first surface of the work piece is provided, and the cutting amount calculation unit is the contact type measurement unit. From the measured thickness of the workpiece and the thickness of the substrate measured by the optical measuring unit, the laminated portion is cut and removed in order to leave the thickness of the laminated portion and the laminated portion at a predetermined thickness. The thickness of the laminated portion is calculated, and the cutting unit is characterized by cutting and removing the laminated portion by the thickness.

Therefore, the cutting tool of the present invention has the effect of being able to suppress variations in the thickness of the laminated portion of the workpiece from the finished thickness.

FIG. 1 is a perspective view showing a configuration example of a tool cutting device according to the first embodiment. FIG. 2 is a perspective view showing an example of a workpiece of the tool cutting apparatus according to the first embodiment. FIG. 3 is a cross-sectional view of a part of the workpiece shown in FIG. FIG. 4 is a cross-sectional view of a part of another example of the workpiece shown in FIG. FIG. 5 is a side view showing a carry-in unit and an optical measurement unit of the tool cutting device according to the first embodiment. FIG. 6 is a side view showing a chuck table and a contact type measuring unit of the tool cutting apparatus according to the first embodiment. FIG. 7 is a side view showing a chuck table and a cutting unit of the tool cutting apparatus according to the first embodiment. FIG. 8 is a cross-sectional view of a part of an example of a workpiece swirled and cut by the tool cutting device according to the first embodiment. FIG. 9 is a cross-sectional view of a part of another example of the workpiece shown in FIG.

An embodiment (embodiment) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited to the contents described in the following embodiments. In addition, the components described below include those that can be easily assumed by those skilled in the art and those that are substantially the same. Further, the configurations described below can be combined as appropriate. In addition, various omissions, substitutions or changes of the configuration can be made without departing from the gist of the present invention.

[Embodiment 1]
The tool cutting apparatus according to the first embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view showing a configuration example of a tool cutting device according to the first embodiment. FIG. 2 is a perspective view showing an example of a workpiece of the tool cutting apparatus according to the first embodiment. FIG. 3 is a cross-sectional view of a part of the workpiece shown in FIG. FIG. 4 is a cross-sectional view of a part of another example of the workpiece shown in FIG.

The tool cutting device 1 shown in FIG. 1 according to the first embodiment swivels and cuts the surface of the workpiece 200 shown in FIG. 2 flat. In the first embodiment, the workpiece 200 to be machined by the tool cutting device 1 is a disk-shaped semiconductor wafer or an optical device wafer whose substrate 201 is silicon, sapphire, gallium arsenide, etc., but in the present invention, it is a metal. , A package substrate made of resin, an interposer substrate, or the like may be used. As shown in FIG. 1, the workpiece 200 is formed on a substrate 201 having a front surface 202 which is a first surface and a back surface 203 which is a second surface opposite to the surface 202 and a surface 202 of the substrate 201. It is provided with a laminated laminated portion 210. As shown in FIG. 2, the substrate 201 has devices 205 formed in a plurality of regions partitioned by a plurality of planned division lines 204 intersecting (orthogonally in the first embodiment) of the surfaces 202.

As shown in FIGS. 3 and 4, the laminated portion 210 includes a bump 211 provided on the device 205 and a molded resin layer 212 laminated on the entire surface 202 of the substrate 201. The bump 211 is made of metal and is embedded in the mold resin layer 212 in the state before the turning cutting process in the first embodiment. The mold resin layer 212 is made of a synthetic resin.

Further, in the workpiece 200 before the swivel cutting process, the bumps 211 provided on the device 205 on the surface 202 of the substrate 201 are covered with the mold resin layer 212. The workpiece 200 is subjected to a swirling cutting process by the tool cutting device 1, and is thinned to a finished thickness of 300 (shown in FIGS. 3 and 4) in which the thickness of the laminated portion 210 is a predetermined thickness. , The mold resin layer 212 and the bump 211 are formed flat, and the bump 211 is exposed. In the present invention, the workpiece 200 is not limited to the one shown in FIG. Further, as shown in FIGS. 3 and 4, the workpiece 200 may have different thicknesses 301 of the substrate 201. The thickness 301 of the substrate 201 shown in FIG. 3 is thinner than the thickness 301 of the substrate 201 shown in FIG.

Next, the tool cutting device 1 according to the first embodiment will be described with reference to the drawings. FIG. 5 is a side view showing a carry-in unit and an optical measurement unit of the tool cutting device according to the first embodiment. FIG. 6 is a side view showing a chuck table and a contact type measuring unit of the tool cutting apparatus according to the first embodiment. FIG. 7 is a side view showing a chuck table and a cutting unit of the tool cutting apparatus according to the first embodiment. FIG. 8 is a cross-sectional view of a part of an example of a workpiece swirled and cut by the tool cutting device according to the first embodiment. FIG. 9 is a cross-sectional view of a part of another example of the workpiece shown in FIG.

As shown in FIG. 1, the tool cutting apparatus 1 includes an apparatus base 2, a chuck table 10, a cutting unit 20, a machining feed unit 30, and a cutting feed unit 40.

The chuck table 10 is held on the back surface 203 side of the workpiece 200. The chuck table 10 is a disk-shaped pin chuck table in which a portion constituting the holding surface 11 is formed of a metal pin or the like, and is connected to a vacuum suction source (not shown) via a vacuum suction path (not shown) to hold the holding surface. The workpiece 200 placed on the 11 is held by suction.

The cutting unit 20 swivels and cuts the surface of the laminated portion 210 of the workpiece 200 held on the chuck table 10 with the tool tool 22 of the tool wheel 23 mounted on the tip of the spindle 21. The cutting unit 20 includes a motor 24 that is supported by a column 3 erected on a device base 2 via a cutting feed unit 40 and that rotates a spindle 21 around an axis.

The machining feed unit 30 is installed on the apparatus base 2 and relatively moves the chuck table 10 in the Y-axis direction, which is the machining feed direction parallel to the holding surface 11. By moving the support base supporting the chuck table 10 in the Y-axis direction, the machining feed unit 30 extends the chuck table 10 from the loading / unloading position where the cutting unit 20 is separated to the machining position below the cutting unit 20. To move.

The cut feed unit 40 is fixed to a column 3 erected on the apparatus base 2, and moves the cutting unit 20 in the Z axis direction, which is the cut feed direction orthogonal to the holding surface 11. The cutting feed unit 40 lowers the cutting unit 20 to bring the tool tool 22 closer to the workpiece 200 held by the chuck table 10 at the machining position, and raises the cutting unit 20 to raise the cutting tool 22 to the chuck table at the machining position. Keep away from the workpiece 200 held at 10.

The machining feed unit 30 and the cut feed unit 40 include a well-known ball screw 41 rotatably provided around the axis, a well-known pulse motor 42 that rotates the ball screw 41 around the axis, and a chuck table 10 or a cutting unit 20. Is provided with a well-known guide rail 43 that movably supports the ball in the Y-axis direction or the Z-axis direction.

Further, the tool cutting device 1 carries out the workpiece 200 from the cassette mounting area 4 on which the cassettes 8 and 9 are placed, the positioning unit 5, and the cassette 8 mounted on the cassette mounting area 4. A transport unit 50 carried into the chuck table 10, a thickness measuring unit 60 for measuring the thickness of the workpiece 200, a cleaning unit 70 for cleaning the workpiece 200 after swirling cutting, and a control unit 100. Be prepared.

The cassettes 8 and 9 are accommodators for accommodating a plurality of workpieces 200, and are installed at an end portion of the device base 2 near the carry-in / out position. One cassette 8 accommodates the workpiece 200 before the swivel cutting process, and the other cassette 9 accommodates the workpiece 200 after the swivel cutting process. Further, the alignment unit 5 is a table on which the workpiece 200 taken out from the cassette 8 is temporarily placed and the center alignment thereof is performed.

The transport unit 50 includes a carry-in / out unit 51, a carry-in unit 52, and a carry-out unit 53. The carry-in / out unit 51 is, for example, a robot pick including a U-shaped hand 54, and the U-shaped hand 54 sucks and holds the workpiece 200 and conveys it. Specifically, the carry-in / out unit 51 carries out the workpiece 200 before the swivel cutting process from the cassette 8 to the alignment unit 5, and transfers the workpiece 200 after the swivel cutting process from the cleaning unit 70 to the cassette 9. Carry in.

As shown in FIG. 5, the carry-in unit 52 sucks and holds the laminated portion 210 on the surface 202 side of the workpiece 200 before the swivel cutting process, which is aligned with the carry-out alignment unit 5 from the cassette 8, and carries in and out. It has a transport pad 55 that is carried onto the chuck table 10 located at the position. The carry-out unit 53 sucks and holds the laminated portion 210 on the surface 202 side of the workpiece 200 after the swivel cutting process held on the chuck table 10 located at the carry-in / carry-out position, and carries out the carry-out unit 53 to the cleaning unit 70. have.

Further, the tool cutting device 1 includes a Z-direction position detection unit for detecting the position of the cutting unit 20 in the Z-axis direction. The Z-direction position detection unit detects the position of the cutting unit 20 in the Z-axis direction by the pulse of the pulse motor 42. In the first embodiment, the Z-direction position detection unit detects the position of the cutting unit 20 in the Z-axis direction with the position where the tip of the tool tool 22 is on the same plane as the holding surface 11 as a reference position. The Z-direction position detection unit outputs the position of the cutting unit 20 in the Z-axis direction to the control unit 100.

The thickness measuring unit 60 includes an optical measuring unit 61 and a contact measuring unit 62. The optical measurement unit 61 is installed on the device base 2 and is arranged below the transport pad 55 of the carry-in unit 52 during transport. As shown in FIG. 5, the optical measurement unit 61 has a wavelength of measurement light transmitted through the substrate 201 on the back surface 203 of the substrate 201 of the workpiece 200 exposed while being held by the transport pad 55 of the carry-in unit 52. The thickness 301 of the substrate 201 is measured by irradiating 63. In the first embodiment, the optical measurement unit 61 irradiates infrared rays having a wavelength transmitted through the substrate 201 as the measurement light 63, receives the reflected light from the back surface 203 and the front surface 202 of the infrared substrate 201, and receives the reflected light from the substrate 201. Thickness 301 is measured. The optical measurement unit 61 outputs the measurement result, the thickness 301 of the substrate 201, to the control unit 100.

The contact type measuring unit 62 is installed on a support column 6 provided between the loading / unloading position and the machining position of the device base 2, and as shown in FIG. 6, between the loading / unloading position and the machining position. It is arranged above the moving chuck table 10. The contact-type measuring unit 62 brings the stylus 64 into contact with the surface of the laminated portion 210 on the surface 202 side of the workpiece 200 held on the chuck table 10 to bring the laminated portion 210 of the workpiece 200 and the substrate 201 together. The combined thickness 302 is measured. In the first embodiment, the contact type measuring unit 62 includes a main body portion 65 attached to a support column 6 and a stylus 64 that can move forward and backward from the main body portion 65, and the tip of the stylus 64 is the surface of the workpiece 200. It is brought into contact with the surface of the laminated portion 210 on the 202 side, and the distance in the Z-axis direction from the reference position of the tip of the stylus 64 is measured as the combined thickness 302 of the laminated portion 210 of the workpiece 200 and the substrate 201. Then, the thickness 302 of the laminated portion 210 of the workpiece 200 and the substrate 201, which is the measurement result, is output to the control unit 100.

The control unit 100 controls each of the above-mentioned components constituting the cutting tool 1. That is, the control unit 100 causes the tool cutting device 1 to perform a machining operation on the workpiece 200. The control unit 100 includes a cutting amount calculation unit 101.

The cutting amount calculation unit 101 stacks the workpiece 200 to be machined from the thickness 302 of the workpiece 200 measured by the contact measuring unit 62 and the thickness 301 of the substrate 201 measured by the optical measuring unit 61. The thickness 303 (shown in FIGS. 3 and 4) of the portion 210 is calculated. The cutting amount calculation unit 101 sets the laminated portion 210 from the finished thickness 300, which is a predetermined thickness of the laminated portion 210 registered by the operator as processing content information, and the calculated thickness 303 of the laminated portion 210. The thickness 304 of the laminated portion 210 (shown in FIGS. 3 and 4 and corresponding to the thickness of the laminated portion 210 to be cut by the cutting unit 20) to be cut and removed by the cutting unit 20 in order to leave 300 minutes. Calculate and memorize.

The cutting amount calculation unit 101 thins the thickness 302 of the workpiece 200 measured by the contact measuring unit 62 and the thickness 304 of the laminated portion 210 cut and removed by the cutting unit 20 to a finished thickness of 300. The distance 305 (shown in FIG. 7) in the Z-axis direction from the reference position of the surface 202 of the laminated portion 210 is calculated. The control unit 100 has a Z from the reference position of the surface 202 of the laminated portion 210 in which the distance in the Z-axis direction from the reference position of the tip of the tool tool 22 detected by the Z-direction position detection unit is finished and thinned to a thickness of 300. The position of the cutting unit 20 is adjusted by the cutting feed unit 40 so that the distance in the axial direction is 305.

The control unit 100 includes an arithmetic processing device having a microcomputer such as a CPU (central processing unit), a storage device having a memory such as a ROM (read only memory) or a RAM (random access memory), and an input / output interface device. It is a computer that has and can execute computer programs. The arithmetic processing unit of the control unit 100 executes a computer program stored in the ROM on the RAM to generate a control signal for controlling the bite cutting device 1. The arithmetic processing unit of the control unit 100 outputs the generated control signal to each component of the tool cutting device 1 via the input / output interface device. Further, the control unit 100 is connected to a display means (not shown) composed of a liquid crystal display device for displaying a processing operation state, an image, or the like, or an input means used by an operator when registering processing content information or the like. .. The input means is composed of at least one of a touch panel provided on the display means, a keyboard, and the like.

The function of the cutting amount calculation unit 101 of the control unit 100 is that the arithmetic processing unit executes a computer program stored in the ROM on the RAM to calculate the thickness 303 of the laminated portion 210 of the workpiece 200 and the cutting unit. The storage device records the thickness 304 of the laminated portion 210 to be cut and removed by 20 and the distance 305 in the Z-axis direction from the reference position of the surface 202 of the laminated portion 210 thinned to a finished thickness of 300. Is realized by.

Next, an example of the machining operation of the tool cutting device will be described. First, the operator attaches the cassette 8 containing the workpiece 200 before the swivel cutting process and the cassette 9 not accommodating the workpiece 200 to the apparatus base 2, and registers the machining content information in the control unit 100. .. The tool cutting device 1 starts the machining operation when instructed to start the machining operation.

In the machining operation, the control unit 100 of the tool cutting device 1 causes the carry-in / out unit 51 to take out the workpiece 200 from the cassette 8 and carry it out to the alignment unit 5. The control unit 100 of the tool cutting device 1 causes the alignment unit 5 to align the center of the workpiece 200, and the workpiece 200 aligned with the loading unit 52 is placed on the chuck table 10 located at the loading / unloading position. To bring it in. When the carry-in unit 52 carries in the workpiece 200, the control unit 100 of the cutting tool 1 causes the optical measuring unit 61 to measure the thickness 301 of the substrate 201 as shown in FIG. 5, and obtains the measurement result. Remember. The control unit 100 of the tool cutting device 1 holds the workpiece 200 on the chuck table 10 and conveys the workpiece 200 to the machining position on the machining feed unit 30.

As shown in FIG. 6, the control unit 100 of the tool cutting device 1 measures the contact type measuring unit 62 on the surface 202 of the laminated portion 210 on the surface 202 side of the workpiece 200 transported from the loading / unloading position to the machining position. The child 64 is brought into contact with each other, and the contact type measuring unit 62 is used to measure the thickness 302 of the workpiece 200, and the measurement result is stored. Then, the cutting amount calculation unit 101 of the control unit 100 of the tool cutting device 1 has a thickness 303 of the laminated portion 210 of the workpiece 200 to be machined and a thickness of the laminated portion 210 cut and removed by the cutting unit 20. The 304 and the distance 305 in the Z-axis direction from the reference position of the surface 202 of the laminated portion 210 thinned to a finished thickness of 300 are calculated in order.

As shown in FIG. 7, the control unit 100 of the tool cutting device 1 rotates the tool wheel 23, and the distance in the Z-axis direction from the reference position is the surface 202 of the laminated portion 210 whose finished thickness is reduced to 300. The tip of the tool tool 22 is positioned at a position at a distance of 305 in the Z-axis direction from the reference position. The control unit 100 of the tool cutting device 1 moves the chuck table 10 toward the machining position, cuts the tool tool 22 into the surface of the workpiece 200 at the machining position, and performs swivel cutting on the workpiece 200. The surface of the workpiece 200 is formed flat, and the bumps 211 are exposed as shown in FIGS. 8 and 9.

In this way, the cutting unit 20 of the tool cutting device 1 removes the laminated portion 210 of the workpiece 200 by cutting the laminated portion 210 with the cutting unit 20 for a thickness of 304 minutes. The control unit 100 of the tool cutting device 1 conveys the workpiece 200 subjected to the swivel cutting process to the carry-in / out position, conveys it to the carry-out unit 53 to the cleaning unit 70, causes the cleaning unit 70 to clean it, and then carries it in / out. The unit 51 accommodates the workpiece 200 in the cassette 9. The control unit 100 of the tool cutting device 1 takes out the next workpiece 200 from the cassette 8 and performs a turning cutting process. The control unit 100 of the tool cutting device 1 ends the machining operation when all the workpieces 200 in the cassette 8 are subjected to swivel cutting.

As described above, the tool cutting device 1 according to the first embodiment measures the thickness 301 of the substrate 201 from the back surface 203 while holding the laminated portion 210 side on the front surface 202 of the substrate 201 by the carry-in unit 52 of the transport unit 50. The thickness 302 of the workpiece 200 including the laminated portion 210 held on the chuck table 10 is measured between the loading / unloading position and the machining position by measuring with the light 63. In this way, the cutting amount calculation unit 101 of the cutting tool 1 cuts and removes the thickness 303 of the laminated portion 210 and the laminated portion 210 from the thickness 301 and the like of the substrate 201 in order to leave the finished thickness 300. In order to calculate the thickness 304 and the like of 210, the cutting unit 20 leaves the laminated portion 210 with a finished thickness of 300 even if the thickness 301 of the substrate 201 and the thickness 303 of the laminated portion 210 before turning cutting vary. Therefore, the thickness of the laminated portion 210 to be removed by cutting can be removed by 304 minutes. As a result, as shown in FIGS. 8 and 9, the tool cutting device 1 can suppress variations in the thickness of the laminated portion 210 of the workpiece 200 after swivel cutting from the finished thickness 300. Play. The thickness 301 of the substrate 201 shown in FIG. 8 is thinner than the thickness 301 of the substrate 201 shown in FIG.

The present invention is not limited to the above embodiment. That is, it can be modified in various ways without departing from the gist of the present invention.

1 Tool cutting device 4 Cassette mounting area 8, 9 Cassette 10 Chuck table 20 Cutting unit 21 Spindle 22 Tool tool 50 Transfer unit 55 Transfer pad 60 Thickness measurement unit 61 Optical measurement unit 62 Contact measurement unit 63 Measurement light 64 Measurement Child 101 Cutting amount calculation unit 200 Work piece 201 Substrate 202 Surface (first surface)
203 Back side (second side)
210 Laminated part 300 Finished thickness (predetermined thickness)
301 Substrate thickness 302 Work piece thickness 303 Laminated part thickness 304 Laminated part thickness to be removed by cutting (thickness of laminated part to be cut)

Claims (1)

A chuck table that holds a workpiece having a laminated portion laminated on the first surface of a substrate having a first surface and a second surface opposite to the first surface on the second surface side. A cutting unit that swirls and cuts the surface of the work piece held on the chuck table with a tool tool mounted on a spindle, a cassette mounting area on which a cassette accommodating a plurality of work pieces is placed, and a cassette mounting area. A transport unit that carries out the work piece from the cassette placed in the cassette mounting area and carries it into the chuck table, a thickness measurement unit that measures the thickness of the work piece, and the cutting unit. A tool cutting device including a cutting amount calculation unit for calculating the thickness of the laminated portion to be cut.
The transport unit is
It has a transport pad that sucks and holds the first surface of the work piece carried out from the cassette and carries it into the chuck table.
The thickness measuring unit is
An optical measuring unit that measures the thickness of the substrate by irradiating the second surface of the workpiece exposed while being held by the transport pad with measurement light having a wavelength transmitted through the substrate.
A contact-type measuring unit for measuring the thickness of the workpiece by bringing a stylus into contact with the first surface of the workpiece held on the chuck table is provided.
The cutting amount calculation unit
From the thickness of the workpiece measured by the contact measuring unit and the thickness of the substrate measured by the optical measuring unit, cutting is performed to leave the thickness of the laminated portion and the laminated portion at a predetermined thickness. The cutting unit calculates the thickness of the laminated portion to be removed, and the cutting unit cuts and removes the laminated portion by the thickness of the laminated portion.

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