JP6849556B2 - Electronic device packages and electronic devices - Google Patents

Description

The present invention relates to an electronic device package and an electronic device having a metal frame to which a lid body is joined.

Terminals for conducting inside and outside the recesses in a package having recesses for accommodating electronic components include an insulating substrate made of an insulating material such as an aluminum oxide sintered body and a wiring conductor provided on the surface of the insulating substrate. Are known. An electrical connection is made between the electronic component and the external electrical circuit via the wiring conductor.

A package having a recess is, for example, a metal housing to which the above-mentioned substrate is joined as an input / output portion. The housing in which the electronic components are housed is sealed by joining a metal lid via a metal frame material (see, for example, Patent Documents 1 and 2).

Japanese Unexamined Patent Publication No. 4-369287 Japanese Unexamined Patent Publication No. 2014-216513

In the above package, since the lids are heated when they are joined, there is a possibility of mechanical destruction such as cracks in the insulating substrate due to thermal stress caused by the difference in the coefficient of thermal expansion between the insulating substrate and the metal housing. was there. In particular, in recent years, an insulating material containing mullite may be used as a material for an insulating substrate in order to improve the transmission characteristics of high-frequency signals in a wiring conductor. Compared to the aluminum oxide sintered body, mullite has a large difference in the coefficient of thermal expansion from the metal housing and has a small mechanical strength, so that the possibility of mechanical destruction increases.

The package for an electronic device according to one aspect of the present invention is joined to a metal housing having a first upper surface including a recess and having an opening in a frame-shaped portion surrounding the recess and the metal housing at the opening. An insulating substrate having a lower surface and side surfaces and a second upper surface having a height position lower than that of the first upper surface of the metal housing, and a wiring board including a wiring conductor located on an exposed surface of the insulating substrate. The main component is a metal material having a yield stress smaller than that of the metal housing, and it is located on the second upper surface of the insulating substrate and has the same height position as the first upper surface of the metal housing. A metal layer having a third upper surface and a metal frame joined to the first upper surface and the third upper surface are provided.

An electronic device according to one aspect of the present invention includes a package for an electronic device having the above configuration and an electronic component housed in the recess of the metal housing.

According to the package for an electronic device according to one aspect of the present invention, since the above configuration is used, the lid is joined onto the metal frame and the recess is airtightly sealed. The thermal stress generated between the metal frame and the insulating substrate in response to the heat applied at the time of joining is effectively alleviated by the deformation of the metal layer interposed between the two. As a result, the possibility of mechanical destruction of the insulating substrate or the like can be effectively reduced. Therefore, it is possible to provide a package for an electronic device that is effective in improving the transmission characteristics of high-frequency signals and that makes it easy to ensure the reliability of airtight sealing.

Further, according to the electronic device according to one aspect of the present invention, since the package for the electronic device having the above configuration is included, it is effective in improving the transmission characteristics of high frequency signals and it is easy to ensure the reliability of airtight sealing. Electronic devices can be provided.

It is a side view which shows an example of the package for an electronic device of embodiment of this invention. FIG. 5 is a perspective view of the electronic device package shown in FIG. 1 as viewed from above. (A) is a plan view showing an example of an electronic device package and an electronic device according to an embodiment of the present invention, and (b) is a cross-sectional view taken along the line AA of (a). (A) is a cross-sectional view taken along the line BB of FIG. 3 (a), and (b) is a cross-sectional view showing a modified example of (a). (A) and (b) are cross-sectional views showing a modification of FIG. 4 (a), respectively.

An electronic device package and an electronic device according to an embodiment of the present invention will be described with reference to the accompanying drawings. It should be noted that the distinction between the upper and lower parts in the following description is for convenience of explanation, and does not limit the upper and lower parts when the electronic device package or the electronic device is actually used. The physical property values such as yield stress and Young's modulus mentioned in the following description are values at so-called normal temperature (about 25 ° C.) and normal pressure (1 atm, 101.3 kPa).

FIG. 1 is a side view showing an example of a package for an electronic device according to an embodiment of the present invention. FIG. 2 is a perspective view of the electronic device package shown in FIG. 1 as viewed from above. The electronic device package 10 is basically composed of the metal housing 1, the wiring board 2, the metal layer 3, and the metal frame 4. The metal housing 1 has a first upper surface 11 including a recess 1a. Further, the metal housing 1 includes a frame-shaped portion 12 surrounding the recess 1a, and the frame-shaped portion 12 has an opening 1b. The opening 1b can be regarded as a notch portion in which the upper portion is partially cut out when the frame-shaped portion 12 is assumed to be a completely frame body. In FIG. 1, a part of the portion included in the electronic device described later is shown by a broken line.

The wiring board 2 includes an insulating board 22 having a lower surface and a side surface joined to the metal housing 1 at the opening 1b. The insulating substrate 22 has a second upper surface 21 whose height position is lower than that of the first upper surface 11 of the housing 1. Further, the wiring board 2 includes a wiring conductor 23 located on the exposed surface of the insulating substrate 22.

The metal layer 3 is formed mainly of a metal material having a yield stress smaller than that of the metal housing 1. The metal layer 3 is located on the second upper surface 21 of the insulating substrate 22. Further, the metal layer 3 has a third upper surface 31 having the same height position as the first upper surface 11 of the metal housing 1. That is, the opening 1b provided in the frame portion 12 of the metal housing 1 is closed by the wiring board 2 below the upper portion of the opening 1b, and the upper portion is further closed by the metal layer 3. In other words, the metal housing 1, the wiring board 2, and the metal layer 3 surround the entire circumference of the recess 1a in which the electronic components are housed.

The metal frame 4 is joined to the first upper surface 11 and the third upper surface 31 described above. As described above, the first upper surface 11 and the third upper surface, which are at the same height as each other, form a frame-shaped joint surface capable of satisfactorily joining the frame-shaped lower surface of the metal frame body 4. The lower surface of the metal frame 4 is joined to this joint surface.

Further, the electronic device 20 as shown in FIGS. 3 and 4, for example, is basically composed of the electronic device package 10 and the electronic component 5 housed in the recess 1a. FIG. 3A is a plan view showing an example of the electronic device package 10 and the electronic device 20 according to the embodiment of the present invention, and FIG. 3B is a cross-sectional view taken along the line AA of FIG. 3A. Is. 4 (a) is a cross-sectional view taken along the line BB of FIG. 3 (a), and FIG. 4 (b) is a cross-sectional view showing a modified example of FIG. 4 (a). In FIGS. 3 and 4, the same parts as those in FIGS. 1 and 2 are designated by the same reference numerals.

For example, as in the example shown in FIG. 3, the electronic component 5 is mounted and fixed to the bottom surface of the recess 1a via a submount 6. Further, in the electronic device 20 of this embodiment, the lid 7 is joined to the upper surface of the metal frame 4 to close the recess 1a. That is, the electronic component 5 is airtightly sealed in the container composed of the recess 1a of the metal housing 1, the wiring board 2, the metal layer 3, the metal frame 4, and the lid 7. In addition, in order to make it easy to see, the lid 7 is omitted in FIG. 3A. Further, in FIG. 3B, the lid 7 is shown separately from the other members.

The electronic component 5 is electrically connected to an external electric circuit by a conductive path such as a wiring conductor 23 of the wiring board 2. This electrical connection makes it possible to send and receive signals between the electronic component 5 and the external electrical circuit city. The transmitted signal is, for example, about 40 GHz or more, and when the accommodated electronic component 5 is for optical communication, it is, for example, about 60 GHz (56 to 64 GHz).

As described above, the metal housing 1 functions as a member forming a part of a container for airtightly accommodating the electronic component 5. The metal housing 1 has, for example, a rectangular block shape (rectangular parallelepiped shape) when viewed from above, and has a recess 1a on the top surface 11. Such a metal housing 1 is formed of, for example, an iron-based alloy material such as an iron-nickel-cobalt alloy or stainless steel, or a metal material such as copper or an alloy material containing copper as a main component.

Further, the metal housing 1 has a plate-shaped portion 13 which is a bottom portion of the recess 1a at the lower end portion of the frame-shaped portion 12 surrounding the recess 1a. In other words, the frame-shaped portion 12 is located on the outer peripheral portion of the upper surface of the plate-shaped portion 13, and the metal housing 1 including the recess 1a is formed. The metal housing 1 may be one in which the plate-shaped portion 13 and the frame-shaped portion 12 are integrally formed, or may be one in which the plate-shaped portion 13 and the frame-shaped portion 12, which are separate parts, are joined to each other. The metal housing 1 can be manufactured, for example, by subjecting the above-mentioned metal material to a predetermined metal processing such as cutting, searching, and polishing. The plate-shaped portion 13 and the frame-shaped portion 12 when they are separate parts can be integrated by a method of joining via a brazing material such as silver wax.

Further, in the example of this embodiment, a through hole 1c that penetrates the inside and outside of the frame-shaped portion 12 (from the inner side surface to the outer surface) is provided in a part of the frame-shaped portion 12 of the metal housing 1. The through hole 1c functions as, for example, a space for arranging through a member for optical connection between the inside and the outside of the recess 1a. If an optical fiber (not shown) is arranged through the through hole 1c, an optical signal can be transmitted and received inside and outside the recess 1a.

In this case, for example, an optical signal is transmitted to the electronic component 5 via an optical fiber, and the optical signal is converted into an electric signal by the electronic component 5. The electric signal is transmitted to the external electric circuit via the wiring board 2 as described above. The transmission of electrical and optical signals may be in reverse order. Further, by closing the through hole 1c with a holding member such as a ferrule that holds the optical fiber, the electronic component 5 can be hermetically sealed in the recess 1a including the through hole 1c.

The metal housing 1 can be manufactured, for example, by subjecting a metal material such as stainless steel to a process appropriately selected from various metal processes such as cutting, rolling, cutting, polishing and etching. When the plate-shaped portion 13 and the frame-shaped portion 12 are manufactured as separate bodies, the metal housing 1 can be manufactured by a method of joining them by a joining method such as brazing or welding.

The insulating substrate 22 constituting the wiring board 2 has, for example, a rectangular shape (rectangular shape) in a plan view.
A plurality of insulating layers (unsigned), each of which is a rectangular plate or more, are laminated and formed. In the examples shown in FIGS. 1 to 4, three insulating layers are laminated. The insulating substrate 22 closes the lower side of the upper portion (the portion corresponding to the thickness of the metal layer 3) of the opening 1b located on one short side of the rectangular concave portion 1a in a plan view. In a plan view, the insulating layer located at the center of the three insulating layers constituting the insulating substrate 22 is larger than the other insulating layers. Specifically, among the three insulating layers, the one laminated in the center has a larger dimension of the recess 1a in the long side direction than the other insulating layers. Depending on this difference in length, a step is formed at the two short-sided ends of the insulating substrate 22.

The insulating substrate 22 has a function as a substrate for arranging the wiring conductor 23 as a conductive path that electrically connects the electronic component 5 and the external electric circuit. A part of the wiring conductor 23 (for example, both ends in the length direction thereof) is exposed at the above-mentioned step portion. An electronic component 5 or an external electric circuit is electrically connected to the wiring conductor 23 exposed at the step portion via a bonding wire 8 or a conductive connecting material such as solder. As a result, the electronic component 5 and the external electric circuit as described above are electrically connected.

The insulating substrate 22 contains, for example, aluminum oxide and mullite. The content of aluminum oxide in the insulating substrate 22 is, for example, about 10 to 90% by mass, and in addition to this, it contains mullite, and further contains silicon oxide, calcium oxide, magnesium oxide, and an auxiliary material selected as appropriate. ..

When the content of aluminum oxide in the insulating substrate 22 is 90% by mass or less, the relative permittivity of the insulating substrate 22 can be reduced to about 9 or less. As a result, it is possible to effectively reduce the separation of the transmission speed when the high frequency signal is transmitted through the wiring conductor 23. Further, when the content of aluminum oxide in the insulating substrate 22 is about 10% by mass or more, it is effective in ensuring the mechanical strength of the insulating substrate 22. In particular, when the content of aluminum oxide in the insulating substrate 22 is about 40% by mass or more, the mechanical strength of the insulating substrate 22 (three-point bending test) can be as large as about 400 MPa or more.

The insulating substrate 22 can be manufactured, for example, as follows. That is, the raw material powders of aluminum oxide and mullite are kneaded with an appropriate additive, an organic binder and an organic solvent to prepare a slurry. This slurry is formed into a sheet by a method such as a doctor blade method and cut to a predetermined size to prepare a plurality of ceramic green sheets in the form of a square sheet. Next, these ceramic green sheets are laminated to prepare a laminated body. After that, the insulating substrate 22 can be manufactured by firing this laminated body at a temperature of about 1350 to 1450 ° C.

The wiring conductor 23 is formed of a metal material appropriately selected from metal materials such as molybdenum, manganese, tungsten, and magnesium. If the wiring conductor 23 is made of, for example, manganese and molybdenum, it can be produced as follows. First, a powder of a metal material containing manganese and molybdenum is kneaded with an organic solvent and a binder to prepare a metal paste. Next, this metal paste is printed in a predetermined pattern on the surface of the insulating substrate 22 or the ceramic green sheet to be the insulating substrate 22 by a method such as a screen printing method. Then, this metal paste is fired at a predetermined temperature and baked on the surface of the insulating substrate 22, or is fired at the same time as the ceramic green sheet. By the above steps, the wiring conductor 23 can be formed on the insulating substrate 22.

The metal frame 4 functions as a metal layer for joining when the lid 7 is joined to the electronic device package 10. The lid 7 can be joined to the metal frame 4 by, for example, a welding method such as resistance welding (seam welding) or a joining method such as a brazing method. For example, in the case of the welding method, it is as follows. First, the lid 7 is aligned and placed on the metal frame 4 so as to close the recess 1a. After that, the roller for resistance welding is moved to the upper surface of the lid 7 along the portion where the metal frame 4 and the lid 7 face each other in a plan view. As a result, the metal frame body 4 and the lid body 7 can be welded and joined to each other.

The metal layer 3 is mainly composed of a metal material having a yield stress smaller than that of the metal housing 1, and has a function of relaxing the thermal stress generated in the insulating substrate 22 or the like when the lid 7 is joined by the above welding method or the like. have. That is, the thermal stress generated when the heat (Joule heat) during resistance welding acts from the metal frame 4 to the wiring substrate 2 (insulating substrate 22) is caused by the metal layer 3 having a relatively small yield stress and being easily deformed. Be absorbed. Therefore, the thermal stress generated between the metal housing 1 and the metal frame 4 is reduced, and the insulating substrate 22 or the insulating substrate 22 and the metal housing 1 and the metal frame 4 (directly the metal layer 3) or the like metal. The possibility of mechanical breakage such as cracks between the portions can be effectively reduced.

The yield stress of the metal housing 1 is about 300 to 400 MPa, for example, in consideration of facilitating the securing of mechanical strength as the package 10 for electronic devices. For example, in the case of the metal housing 1 made of an iron-nickel-cobalt alloy, the yield stress of the metal housing 1 is about 300 MPa. On the other hand, the yield stress of the metal layer 3 is set to about 25 to 70% of the yield stress of the metal housing 1, for example. To give a specific example, when the metal housing 1 is made of an iron-nickel-cobalt alloy, the yield stress of the metal layer 3 is set to about 80 to 200 MPa.
Examples of the metal material forming the metal layer 3 include silver (yield stress is about 60 MPa), copper (yield stress is about 80 MPa, gold (yield stress is about 200 MPa)), and silver-copper eutectic alloy (yield stress is about 200 MPa). A metal material such as (about 200 MPa) can be mentioned.

The yield stress of the metal housing 1 and the metal layer 3 can be obtained by, for example, obtaining a stress-strain curve of the material forming each portion by a tensile test and detecting the yield point. The force applied to the test piece at the yield point corresponds to the yield stress. Specifically, the yield stress can be measured using various commercially available tensile testers. First, test pieces made of the same metal material as the metal housing 1 or the metal layer 3 are prepared, and then these test pieces are tested with a tensile tester to measure the yield point. By obtaining the tensile force applied to the test piece at this yield point, the yield stress of each test piece, that is, the metal housing 1 and the metal layer 3 can be measured.

Further, the metal layer 3 is advantageous for improving long-term reliability, for example, when the metal layer 3 is made of copper and the deformation (strain) in plastic deformation is set to 0.02 or less. is there. That is, when the strain corresponding to the life of 1000 cycles is calculated based on the Coffin-Manson equation for the fatigue life when repeated stress is applied to the metal material, the strain is about 0.02. In the Coffin-Manson equation, Δεp × Nf = C, Δεp is the plastic strain width during the temperature cycle (ratio of deformation of the metal layer 3), Nf is the fatigue life (number of temperature cycles), and C is the fatigue ductility coefficient (copper). About 0.44) for the metal layer 3 made of. Therefore, if the strain (deformation width at the time of plastic deformation of the metal layer 3) is 0.02 or less, it becomes easy to secure the reliability of 1000 cycles or more with respect to the temperature cycle.

The metal layer 3 is bonded to the metal housing 1 and the wiring board 2 (directly, the insulating substrate 22 or the like) by a brazing material 9 such as JIS standard silver brazing (such as one having a silver-copper eutectic composition). Has been done. When the brazing material 9 is bonded to the insulating substrate 22, a metal layer (not shown) for brazing may be provided in advance in the portion of the insulating substrate 22 to which the brazing material 9 is bonded. This metal layer can be formed at a predetermined position on the surface of the insulating substrate 22 by the same method using, for example, the same metal material as the wiring conductor 21.

As described above, the electronic device of the embodiment is basically composed of the electronic device package 10 having the above configuration and the electronic component 5 housed in the recess 1a of the metal housing 1. For example, first, the wiring board 2 is joined to the opening 1b of the metal housing 1 to close the opening 1b. The metal housing 1 and the wiring board 2 are joined by, for example, the same brazing material 9 as described above. In this case, the lower surface and the side surface of the insulating substrate 22 are joined to the metal housing 1 at the opening 1b. The wiring conductor 23 is located on the exposed surface such as the upper surface of the stepped portion of the bonded insulating substrate 22 so as to conduct the inside and outside of the recess 1a.

Next, the metal layer 3 is joined to the upper surface of the insulating substrate 22 by the brazing material 9. At this time, the joining position or the like may be adjusted so that the third upper surface of the metal layer 3 and the first upper surface of the metal housing 1 are at the same height. Further, the electronic component 5 is joined and fixed to the bottom surface of the recess 1a via the sub mount 6. Further, the electronic component 5 and the wiring conductor 23 are electrically connected by a bonding wire 8 or the like. After that, the metal frame 4 is joined from the first upper surface of the metal housing 1 to the third upper surface of the metal layer 3 by a resistance welding method or the like to close the opening at the upper part of the recess 1a. Through the above steps, the electronic device 20 in which the electronic component 5 is sealed in the recess 1a can be manufactured. Further, when the metal housing 1 has the through hole 1c, the through hole 1c may be closed by an optical connection member such as an optical fiber. In this case, the electronic device 20 such as a photoelectric conversion device can send and receive an electric signal to and from the outside through the wiring conductor 23, and can also send and receive an optical signal to and from the outside by an optical connection member. Can be done. The electronic device 20 at this time can be used, for example, as a transceiver mounted on a device for optical communication.

Further, in the example shown in FIG. 4B, the width W1 of the metal layer 3 is smaller than the width W2 of the metal frame body 4. That is, in a plan view, the dimension in the direction orthogonal to the length direction of the metal layer 3 is smaller than the dimension in the direction orthogonal to the length direction of the metal frame body 4. Even in this case, since the yield stress of the metal layer 3 is relatively small, the thermal stress between the metal frame 4 and the insulating substrate 22 can be relaxed by the metal layer 3 interposed between the two.

Further, in this case, since the width W1 of the metal layer 3 is relatively small, it is advantageous in facilitating the deformation of the metal layer 3 due to thermal stress, and the heat between the metal frame 4 and the insulating substrate 22 is obtained. The stress can be effectively relieved by the metal layer 3. That is, since the width W1 of the metal layer 3 is relatively small, the metal frame 4 can be more easily deformed, and the thermal stress generated between the metal frame 4 and the insulating substrate 22 can be effectively reduced. ..

When the width W1 of the metal layer 3 is made smaller than the width W2 of the metal frame body 4, the width W1 of the metal layer 3 should be set to about 30 to 70% of the width W2 of the metal frame body 4. Just do it. When the width W1 of the metal layer 3 is 70% or less of the width W2 of the metal frame body 4, the ease of deformation of the metal layer 3 is improved, and the effect of relaxing the thermal stress can be enhanced. If the width W1 of the metal layer 3 is 30% or more of the width W2 of the metal frame 4, the joint area between the metal layer 3 and the metal frame 4 is secured, and the joint strength between the two is increased. It can be secured effectively. The metal layer 3 having a relatively small width W1 can be manufactured by adjusting the processing dimensions to a predetermined value (small width W1) in the metal processing for manufacturing the metal layer 3.

Therefore, when the width W1 of the metal layer 3 is smaller than the width W2 of the metal frame 4, the strength and reliability of the bond between the insulating substrate 22 and the metal frame 4 via the metal layer 3 are effectively enhanced. be able to. As a result, the electronic device 20 can be easily manufactured with the reliability of the airtight sealing of the electronic component 5 effectively enhanced, and the package 10 for the electronic device can be obtained. Further, the insulating substrate 22 and the metal frame 4 are firmly bonded to each other via the metal layer 3, and it is advantageous for relaxing the thermal stress between the edge substrate 22 and the metal frame 4, and the electronic component 5 The electronic device 20 can be an electronic device 20 in which the reliability of the airtight sealing is effectively enhanced.

Further, in the electronic device package 10 and the electronic device 20 of the embodiment, the positions of the outer circumference and the inner circumference of the metal layer 3 and the positions of the outer circumference and the inner circumference of the metal frame 4 are different from each other in a plan view. There may be. FIG. 4B shows an example of the electronic device package 10 of this form. If the electronic component 5 is hermetically sealed in the electronic device package 10, the electronic device 20 of the above-described form is obtained.

As described above, when the positions of the outer circumference and the inner circumference of the metal layer 3 and the positions of the outer circumference and the inner circumference of the metal frame 4 are different from each other in a plan view, stress can be concentrated on both the outer circumference and the inner circumference. The sex can be effectively reduced. Therefore, it is possible to obtain the electronic device package 10 which is easy to manufacture the electronic device 20 having high reliability of airtight sealing. Further, the electronic device 20 can be used, which is advantageous for improving the reliability of the airtight sealing.

In this case, for example, the metal layer 3 having a width W1 which is about 30 to 70% of the width W2 of the metal frame 4 may be located at the central portion of the metal frame 4 in the width direction in a plan view. .. In other words, the distance between the outer circumference of the metal frame 4 and the outer circumference of the metal layer 3 and the distance between the inner circumference of the metal frame 4 and the inner circumference of the metal layer 3 may be about the same. .. In this case, the effect of relaxing the thermal stress can be enhanced to the same extent on the inner peripheral side and the outer peripheral side of the metal layer 3 and the metal frame 4. Therefore, when the same degree of thermal stress is generated on the inner peripheral side and the outer peripheral side of the metal layer 3 and the metal frame 4, both of these stresses can be effectively relieved.

It should be noted that the distance between the outer circumference of the metal frame 4 and the outer circumference of the metal layer 3 and the distance between the inner circumference of the metal frame 4 and the inner circumference of the metal layer 3 are the same as each other. This includes cases where the distances are the same as each other, and further includes cases where the ratio of these distances is about 0.9 or more.

In the electronic device package 10 and the electronic device 20 having each of the above configurations, when the metal layer 3 is made of a metal material containing copper as a main component, the following effects can be obtained. That is, in this case, as described above, the yield stress of copper is relatively small, about 80 MPa, and the Young's modulus of copper is relatively small, about 120 GPa. Therefore, the thermal stress is relaxed by the metal layer 3. The effect can be enhanced. Similarly, the possibility of migration is smaller than that of silver, which has a small Young's modulus. Therefore, when the metal layer 3 is made of a metal material containing copper as a main component, it is advantageous for improving the reliability of the airtight sealing of the electronic component 5, and is also advantageous in terms of the reliability of electrical operation for electronic devices. It can be package 10 and electronic device 20. Further, when the metal layer 3 is made of a metal material containing copper as a main component, it is economically advantageous as compared with the case where the metal layer 3 is made of silver, gold, a silver-copper alloy or the like. Further, when the metal layer 3 is made of a metal material containing copper as a main component, the wettability of the brazing material 9 such as silver brazing is better than that of the case where the metal layer 3 is made of aluminum, and the metal of the metal layer 3 is made of metal. It is also advantageous in terms of economy through the housing 1 and the metal frame brazing material 9.

The metal material containing copper as a main component means a metal material containing about 80% by mass or more of copper. This metallic material may be so-called pure copper or oxygen-free copper containing 99.99% by mass or more of copper.

5 (a) and 5 (b) are cross-sectional views showing a modified example of FIG. 4 (a), respectively. In FIG. 5, the same parts as those in FIG. 4 are designated by the same reference numerals. In the examples shown in FIGS. 5A and 5B, the shape or position of the metal layer 3 is different from that in FIG. 4, and other matters are the same as those in FIG. Descriptions of these similar matters will be omitted.

In the example shown in FIG. 5A, the width of the metal layer 3 is smaller than the width of the metal frame body 4. Further, the metal layer 3 having a relatively small width is located unevenly on the inner peripheral side (recessed portion 1a side) of the metal frame body 4. In this example, the inner surface of the metal layer 3 and the inner surface of the metal frame 4 are located on substantially the same plane (so-called flush with each other). In this case as well, for example, as in the example shown in FIG. 4B, the metal layer 3 having a relatively small width can be easily deformed, so that the thermal stress can be effectively relieved.

Further, in the example shown in FIG. 5A, since the inner side surface of the metal layer 3 and the inner side surface of the metal frame body 4 are substantially flush with each other, the metal layer 3 and the metal frame body 4 are joined at the time of joining. It can also facilitate the alignment work.

In the example shown in FIG. 5B, the side surface of the metal layer 3 is inclined. That is, the metal layer 3 has a trapezoidal shape in a vertical cross-sectional view in the width direction thereof. In this case, the positions of the edges of the metal layer 3 in a plan view are different between the upper surface side and the lower surface side of the metal layer 3. Therefore, the positions of the edges where stress is likely to be concentrated can be shifted from each other on the upper surface side and the lower surface side of the metal layer 3 in a plan view. As a result, stress is suppressed from being concentrated on the metal layer 3 at the same position in a plan view. Further, the stress acting on the wiring board 2 located below the metal layer 3 can be dispersed. Therefore, the possibility of mechanical destruction of the insulating substrate 22 or the like of the wiring board 2 can be effectively reduced.

1 ... Metal housing 1a ... Recess 1b ... Opening 1c ... Through hole
11 ・ ・ ・ First upper surface
12 ・ ・ ・ Frame-shaped part
13 ... Plate-shaped part 2 ... Wiring board
21 ... 2nd upper surface
22 ・ ・ ・ Insulated substrate
23 ... Wiring conductor 3 ... Metal layer
31 ... Third upper surface 4 ... Metal frame 5 ... Electronic components 6 ... Submount 7 ... Lid 8 ... Bonding wire 9 ... Wax material
10 ・ ・ ・ Package for electronic devices
20 ... Electronic device W1 ... Width of metal layer W2 ... Width of metal frame

Claims (5)

A metal housing having a first upper surface including a recess and an opening in a frame-shaped portion surrounding the recess.
Located on an insulating substrate having a lower surface and side surfaces joined to the metal housing at the opening and having a second upper surface having a height position lower than that of the first upper surface of the metal housing and an exposed surface of the insulating substrate. Wiring board containing the wiring conductor to be used
It is mainly composed of a metal material having a yield stress smaller than that of the metal housing, and is located on the second upper surface of the insulating substrate and has the same height position as the first upper surface of the metal housing. A metal layer having a third upper surface and
A package for an electronic device including the first upper surface and a metal frame joined to the third upper surface. The electronic device package according to claim 1, wherein the width of the metal layer is smaller than the width of the metal frame in a plan view. The electronic device package according to claim 2, wherein the positions of the outer circumference and the inner circumference of the metal layer and the positions of the outer circumference and the inner circumference of the metal frame are different from each other in a plan view. The electronic device package according to any one of claims 1 to 3, wherein the metal layer is made of a metal material containing copper as a main component. The electronic device package according to any one of claims 1 to 4.
An electronic device including an electronic component housed in the recess of the metal housing.

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