JP6838960B2 - Imaging device - Google Patents

Description

The present invention relates to an imaging device having a runout sensor such as an angular velocity sensor.

Imaging devices such as digital cameras (hereinafter referred to as cameras) have an image shake correction function that detects camera shake with a shake sensor such as an angular velocity sensor (gyro sensor) and reduces image shake caused by the detected camera shake. I have something to have. Patent Document 1 discloses a camera that detects camera shake in the vertical and horizontal directions by two shake sensors arranged along two planes parallel to the optical axis of the photographing lens (two planes orthogonal to each other). ing.

In addition, there is panning as one of the imaging techniques by a camera. Panning is an imaging technique that acquires an image in which a moving subject is stationary and the background is flowing by taking an image while panning the camera following the movement of the subject. In such panning, if there is a difference between the moving speed of the subject and the panning speed, image blurring occurs.

Patent Document 2 discloses a camera that detects a motion vector of a subject from an image acquired when panning is detected by using an output from a runout sensor. In this camera, the correction amount for positioning the subject image determined from the detected motion vector in the center of the image is calculated. Then, the image shake is corrected by shifting the correction lens in the photographing lens with respect to the optical axis according to the correction amount, so that the user can easily take a good panning shot.

Japanese Unexamined Patent Publication No. 2008-08995 Japanese Unexamined Patent Publication No. 2006-317848

However, when a plurality of runout sensors are used as disclosed in Patent Document 1, a large space for arranging them is required, which hinders the miniaturization of the camera. Further, when the runout sensor is arranged in the camera as disclosed in Patent Documents 1 and 2, if the runout sensor and the member fixing the runout sensor are affected by the vibration of the internal unit of the camera, the camera shakes normally. Can no longer be detected. For example, when the camera shake is detected by the shake sensor, the normal camera shake cannot be detected due to the influence of the vibration generated by the motor that drives the shutter unit, which is an internal unit. Further, even when the variable magnification lens or the focus lens in the photographing lens is driven in the optical axis direction, normal camera shake cannot be detected due to the vibration generated from these driving power sources.

The present invention provides a compact imaging device capable of detecting camera shake with high accuracy by a shake sensor.

The image pickup device as one aspect of the present invention has an image pickup element for capturing a subject image, a front surface on the subject side and a back surface on the opposite side, and is located in a central region of the front surface and a peripheral region of an outer edge portion of the central region. It has an image sensor substrate on which an image sensor is mounted, and a runout sensor that detects runout of the image pickup device. The image sensor substrate has a first power supply pattern for supplying power to the image sensor on the back surface, and the first power supply pattern is mounted on the back surface in a peripheral region of the image sensor substrate so as to surround the runout sensor. And is not mounted in the central region of the image sensor substrate, and the runout sensor is not mounted in the peripheral region of the back surface of the image sensor substrate and is mounted in the region of the central region of the back surface that intersects the optical axis. It is characterized by being done.

According to the present invention, it is possible to realize a compact imaging device capable of detecting camera shake with high accuracy by a shake sensor.

The rear view which shows the image sensor substrate mounted on the digital single-lens reflex camera (camera body) which is the Example of this invention. Front side and back side perspective views showing the appearance of the camera body of the embodiment. The block diagram which shows the electrical structure of the camera body of an Example. Front side and back side perspective views showing the camera body (with the exterior cover removed) of the embodiment. An exploded perspective view showing a camera body (with the exterior cover removed) of the embodiment. The figure which shows the relationship between the wiring pattern of the image sensor substrate and the arrangement position of the angular velocity sensor in an Example. The figure which shows the power supply wiring pattern for driving a lens in the control board mounted on the camera body of an Example.

Hereinafter, examples of the present invention will be described with reference to the drawings.

2 (a) and 2 (b) show the appearance of a digital single-lens reflex camera (hereinafter referred to as a camera body) 100 as an imaging device according to an embodiment of the present invention. Further, FIG. 3 shows the electrical configuration inside the camera body 100 of this embodiment.

The camera body 100 is covered with an exterior cover 101. On the front surface of the camera body 100, a mount 52 to which an imaging lens unit (interchangeable lens) (not shown) is detachably mounted is provided. A mirror unit 20 arranged in the optical path from the image pickup lens unit is provided behind the mount 52 inside the camera body 100. Behind the mirror unit 20, the shutter unit 64 and the image sensor 60 shown in FIG. 3 are arranged.

When the main power switch 107 is turned on, the camera microcomputer 10 as a controller activates the camera body 100 in a predetermined sequence. When the camera body 100 is activated, the flash unit 103 is stored in the camera body 100.

As shown in FIG. 2B, a finder eyepiece window 112 is provided on the upper part of the back surface of the camera body 100. Further, on the back surface of the camera body 100, a display monitor 110 capable of displaying various setting information, captured images, and the like is provided. Further, on the side surface of the camera body 100, a memory storage unit 113 for storing an external memory (not shown) such as a semiconductor memory for recording a captured image is provided.

When the camera microcomputer 10 shown in FIG. 3 detects that various operation members (105 to 108) have been operated by the operation detection circuit 12, the camera microcomputer 10 performs an operation corresponding to the operation. For example, when the imaging mode dial 108 is operated to select an imaging mode, a program diagram for determining a combination of shutter speed and aperture corresponding to the selected imaging mode is set. Further, when the electronic dial 105 is operated, the exposure compensation and the like are set. Further, when the ISO sensitivity setting button 106 is operated, the ISO sensitivity condition is set.

Further, when the automatic setting mode is selected by operating the image pickup mode dial 108, the camera microcomputer 10 performs the following operations. The camera microcomputer 10 that detects that the release button 104 is half-pressed through the operation detection circuit 12 drives a photometric sensor (not shown) through the image pickup condition control circuit 13 to measure the brightness of the light from the subject. Then, an appropriate shutter speed and aperture value are determined according to the photometric result. The camera microcomputer 10 that determines from the photometric result that the brightness is lower than a predetermined value drives the flash unit 103 to move (pop up) to the light emitting position through the motor control circuit 14.

The camera microcomputer 10 that detects that the release button 104 is fully pressed through the operation detection circuit 12 retracts the mirror unit 20 out of the image pickup optical path through the motor control circuit 14 so that the light from the subject reaches the image pickup element 60. Drive to let. Further, the camera microcomputer 10 causes the flash unit 103 to emit light through the flash control circuit 11 and opens and closes the shutter unit 64 through the motor control circuit 14. At the same time, the camera microcomputer 10 drives the image sensor 60 through the image sensor drive circuit 15 to perform photoelectric conversion (imaging) of the subject image formed by the light from the subject.

The camera microcomputer 10 acquires an image pickup signal from the image pickup element 60 and sends the image pickup signal to the data processing circuit 16. The data processing circuit 16 performs image data processing such as amplification, conversion, and correction on the image pickup signal to generate captured image data. Further, the camera microcomputer 10 causes the recording processing circuit 17 to record the captured image data in the external memory described above.

The camera microcomputer 10 that detects that the user has operated an image reproduction button (not shown) through the operation detection circuit 12 causes the recording processing circuit 17 to read the captured image data in the external memory, and displays the captured image data on the display monitor 110. Is displayed as a playback image.

Next, the internal structure of the camera body 100 will be described with reference to FIGS. 1 and 4 (a) and 4 (b). FIG. 1 shows the image sensor substrate 55 on which the image sensor 60 shown by the broken line is mounted on the front surface of the subject side as viewed from the side opposite to the image sensor 60 (rear side). The image pickup device substrate 55 is arranged so as to have a front surface and a back surface (back surface) orthogonal to the optical axis from the image pickup lens unit to the image pickup element 60. Further, FIGS. 4A and 4B show the camera body 100 from which the exterior cover 101 has been removed as viewed from the front side and the back side. FIG. 5 shows the camera body 100 from which the exterior cover 101 has been removed in an exploded manner.

In FIGS. 4 (a), 4 (b) and 5, 50 is a main base (base member) serving as a skeleton of the camera body 100, and is made of resin or metal. Reference numeral 51 denotes a pentaprism 51 arranged above the main base 50, which allows the user to observe the light (subject image) reflected by the mirror unit 20 arranged in the imaging optical path through the finder eyepiece window 112. The mirror unit 20, the mount 52, and the shutter unit 64 are held by a front unit 63 made of resin. The front unit 63 is fixed to the main base 50.

The mount 52 has a mount surface made of a metal such as stainless steel, and positions and holds the image pickup lens unit in the direction perpendicular to the optical axis and the direction perpendicular to the optical axis. The mount 52 is provided with a plurality of contact pins 53 for communicating between the camera body 100 and the image pickup lens unit and supplying power from the camera body 100 to the image pickup lens unit.

A control board 54 is fixed to the main base 50. The control board 54 is electrically connected to the image sensor board 55 by a flexible wiring board 56. The control board 54 is arranged so as to be orthogonal to the optical axis direction, and has a U-shape when viewed from the optical axis direction. A plurality of electric circuits including the camera microcomputer 10 shown in FIG. 3 are mounted on the control board 54. The power source for driving these electric circuits is generated by the power supply board 65. The power supply board 65 and the control board 54 are electrically connected by coupling with the connector 66a provided on the power supply board 65 and the connector 66b provided on the control board 54.

As described above, the image sensor 60 is composed of a CMOS sensor or a CCD sensor that photoelectrically converts a subject image. The image sensor 60 is fixed to the front surface of the image sensor substrate 55 by soldering. Further, conductor portions 61 are exposed at three locations on the back surface of the image sensor 60.

Sensor holding portions 59 for holding the image sensor 60 are provided at three positions of the sensor holding plate 58 as a holding member made of a metal such as stainless steel. These three sensor holding portions 59 are soldered to the three conductor portions 61 provided on the image sensor 60. As a result, the sensor holding plate 58 holds the image sensor 60 and the image sensor substrate 55 on which the image sensor 60 is mounted.

Further, the sensor holding plate 58 is screwed to the plate fixing portions 62 provided at three positions of the front unit 63 via a vibration absorbing spring 57 as an elastic member formed of an elastic material such as a piano wire. It is fixed by (not shown). At this time, the vibration absorbing spring 57 is in a state of being appropriately compressed (not completely compressed). As a result, the sensor holding plate 58 that holds the image sensor substrate 55 is in a floating state with respect to the front unit 63.

The front unit 63 is fixed to the main base 50 by screws (not shown). Therefore, the sensor holding plate 58 which is suspended and held by the vibration absorbing spring 57 with respect to the front unit 63 is also suspended with respect to the main base 50. That is, the image sensor substrate 55 is held in a floating state with respect to the base unit including the front unit 63 and the main base 50. As shown in FIG. 1, an angular velocity sensor 70 as a runout sensor for detecting the runout of the camera body 100 is mounted on the back surface of the image sensor substrate 55. Therefore, due to the floating holding configuration of the image sensor substrate 55 as described above, when the angular velocity sensor 70 detects the shake of the camera body 100 (hereinafter referred to as the camera shake), the angular velocity sensor 70 drives the shutter unit 64. Almost no vibration generated by the motor etc. is transmitted. As a result, the angular velocity sensor 70 can detect camera shake normally (high accuracy).

The angular velocity sensor 70 is held by soldering to the back surface of the image sensor substrate 55 and is electrically connected. The runout detection signal output from the angular velocity sensor 70 is sent from the image sensor board 55 to the control board 54 via the flexible wiring board 56, and is input to the camera microcomputer 10 mounted on the control board 54. The camera microcomputer 10 calculates the amount of shake (angle change amount) of the camera body 100 using the shake detection signal, performs vibration isolation control for correcting image shake from the amount of shake, or pans the camera body 100. It makes a judgment as to whether or not it is.

As described above, in this embodiment, the image sensor substrate 55 (sensor holding plate 58) on which the angular velocity sensor 70 is mounted is held in a floating state with respect to the front unit 63 and the main base 50. Therefore, even if unnecessary vibration is generated by driving the shutter unit 64 held by the front unit 63, it is possible to suppress the unnecessary vibration from being transmitted to the angular velocity sensor 70. Therefore, it is possible to prevent unnecessary vibration from affecting the detection of camera shake by the angular velocity sensor 70.

Next, the desirable mounting position of the angular velocity sensor 70 on the image sensor substrate 55 will be described in detail with reference to FIGS. 6 (a) and 6 (b) and FIG. FIG. 6A shows a cross section of the image sensor substrate 55 shown in FIG. 5 along the DD line.

As shown in FIG. 6A, the image sensor substrate 55 is a printed wiring board, and has six conductor layers L1 to L6 and five insulating layers i1 to i5 that insulate between the conductor layers L1 to L6. It is a 6-layer substrate having and. More specifically, the image sensor substrate 55 has a two-layer substrate composed of conductor layers L3 and L4 and an insulating layer i3 as a core, and conductor layers L2 and L1 and conductor layers L5 and L6 as build-up layers on the front and back of the core. This is a 6-layer build-up wiring board having a 2-2-2 configuration in which

In the image sensor substrate 55, the angular velocity sensor 70 is mounted on the back surface opposite to the front surface on which the image sensor 60 is mounted. Further, the angular velocity sensor 70 is mounted in the central region of the back surface of the image sensor substrate 55. The central region referred to here is, for example, the point or two points farthest from each of the four sides when the image sensor substrate 55 is substantially rectangular when viewed from the optical axis direction as shown in FIGS. 1 and 6 (b). This is the area containing the intersections of the diagonal lines of. Further, in this embodiment, the central region of the image sensor substrate 55 is a region including a point on the axis OC passing through the center (optical axis position) of the image sensor 60.

The angular velocity sensor 70 used in this embodiment detects camera shake around three axes orthogonal to each other, the X-axis, the Y-axis, and the Z-axis, and the three planes (XY plane,) formed by these three axes. It is necessary to fix the YZ plane and the ZX plane without tilting. However, in general, when an electric component is mounted on a substrate, the substrate is warped due to a temperature rise to the melting point of the solder, and the warp of the substrate often remains even after the electric component is mounted. Then, the amount of warpage of this substrate increases from the central portion of the substrate toward the peripheral portion.

If the angular velocity sensor 70 is mounted on the peripheral portion of the substrate, the angular velocity sensor 70 will be fixed on a more inclined flat surface, and as a result, the angular velocity sensor 70 may not be able to detect normal camera shake. Therefore, in this embodiment, by mounting the angular velocity sensor 70 in the central region of the image sensor substrate 55, that is, in the region where the warpage is the smallest, the angular velocity sensor 70 is fixed with almost no inclination with respect to the above three planes. There is. Thereby, the reliability of the camera shake detected by the angular velocity sensor 70 can be improved.

FIG. 6B shows a wiring pattern on the back side of the image sensor substrate 55 on which the angular velocity sensor 70 is mounted. The wiring pattern L6c as the first power supply pattern is a power supply pattern for driving the image pickup device 60, and is referred to as an image pickup element power supply pattern L6c in the following description. The image sensor power supply pattern L6c is formed on the back surface of the image sensor substrate 55 in a peripheral region different from the central region (hereinafter, referred to as a mounting region) on which the angular velocity sensor 70 is mounted. As shown by the broken line L5c, even when the power supply pattern is formed in the conductor layers L1 to L5 below the image sensor power supply pattern L6c, the mounting region of the angular velocity sensor 70 is in the substrate thickness direction with such an image sensor power supply pattern ( It is formed in a region that does not overlap in the optical axis direction). This is to prevent the angular velocity sensor 70 from being affected by the vibration generated from the power supply pattern L6c when the image sensor 60 is driven.

Further, the power supply pattern L6c is different from the lens driving power supply pattern as the second power supply pattern used when driving the image pickup lens unit. The power supply for driving the lens is generated by the power supply board 65 and supplied to the control board 54. As shown in FIG. 7, the control board 54 is provided with a power supply pattern 80 for receiving the power supply for driving the lens and further supplying the power supply to the image pickup lens unit. The power supply pattern 80 supplies the lens driving power supply to the contact pin 53 described above without passing through the image pickup device substrate 55, and enables the power supply to the image pickup lens unit.

FIG. 7 shows a case where the power supply pattern 80 is formed on the surface layer of the control board 54, but it may be formed on the inner layer of the control board 54.

With the above configuration, it is possible to suppress the influence of vibration and noise generated by the supply of the lens driving power supply on the angular velocity sensor 70 via the image sensor power supply pattern L6c.

As described above, in the present embodiment, since the angle sensor 70 is held in the camera body 100 in a floating state with respect to an internal unit that generates vibration such as a shutter unit, it is not easily affected by the vibration. .. Further, since the angular velocity sensor 70 is arranged in the central region of the image sensor substrate 55, it is not easily affected by the warp of the image sensor substrate 55. Further, since the angular velocity sensor 70 is also separated from the power supply pattern for the image sensor and the power supply pattern for driving the lens, it is not easily affected by the vibration generated from these power supply patterns. In addition, since the image sensor board 55 and the control board 54 held by the base unit are connected via the flexible wiring board 56, the vibration generated in the internal unit on the base unit side is caused by the image sensor board 55, that is, the base unit. It is difficult to transmit to the angular velocity sensor 70. As a result, the angular velocity sensor 70 can detect camera shake with high accuracy.

In the above embodiment, the case where the angular velocity sensor 70 is mounted in the central region of the back surface of the image sensor substrate 55 has been described, but it does not necessarily have to be mounted in the central region. That is, it suffices that it is mounted in a region on the back surface of the image sensor substrate 55 that is closer to the center than the peripheral region in which the image sensor power supply pattern is arranged.

Each of the above-described examples is only a representative example, and various modifications and changes can be made to each of the examples in carrying out the present invention.

55 Image sensor substrate 60 Image sensor 70 Angular velocity sensor 100 Image sensor (camera body)

Claims (7)

An image pickup device having an image pickup device that captures a subject image.
An image sensor substrate having a front surface on the subject side and a back surface on the opposite side, and on which the image sensor is mounted over a central region of the front surface and a peripheral region of an outer edge portion of the central region.
It has a runout sensor that detects the runout of the image pickup device.
The image pickup device substrate has a first power supply pattern for supplying power to the image pickup device on the back surface.
The first power supply pattern is mounted on the back surface in a peripheral region of the image sensor substrate so as to surround the runout sensor, and is not mounted in the central region of the image sensor substrate.
The image pickup device is characterized in that the runout sensor is not mounted in the peripheral region of the back surface of the image pickup device substrate, but is mounted in a region of the central region of the back surface that intersects with the optical axis . The image pickup device substrate further has a second power supply pattern,
The shake sensor, imaging of claim 1, characterized in that it is implemented in a region which does not overlap in the substrate thickness direction with respect to the first and second power supply pattern of the back surface of the image pickup device substrate apparatus. It has a holding member that holds the image sensor substrate and a base unit that holds the holding member.
The imaging device according to claim 1 or 2 , wherein the holding member is held by the base unit via an elastic member. It has a control board on which a controller that controls the image pickup apparatus using the output of the runout sensor is mounted.
The control board is held by the base unit and is held by the base unit.
The image pickup apparatus according to claim 3 , wherein the control board and the image pickup device board are connected by a flexible wiring board. The imaging device according to claim 1 to 4 , wherein the runout sensor detects the runout around three axes orthogonal to each other. The imaging device according to any one of claims 1 to 5 , wherein the runout sensor is an angular velocity sensor. The image pickup apparatus according to claim 4, wherein the control board has a third power source pattern for supplying power to an image pickup lens unit forming the subject image.