JP6829665B2 - リードフレーム、半導体装置、及びリードフレームの製造方法 - Google Patents

リードフレーム、半導体装置、及びリードフレームの製造方法 Download PDF

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Publication number
JP6829665B2
JP6829665B2 JP2017134746A JP2017134746A JP6829665B2 JP 6829665 B2 JP6829665 B2 JP 6829665B2 JP 2017134746 A JP2017134746 A JP 2017134746A JP 2017134746 A JP2017134746 A JP 2017134746A JP 6829665 B2 JP6829665 B2 JP 6829665B2
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JP
Japan
Prior art keywords
film
lead frame
silver
metal plate
silver film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2017134746A
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English (en)
Japanese (ja)
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JP2019016740A (ja
JP2019016740A5 (enExample
Inventor
陽子 中林
陽子 中林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2017134746A priority Critical patent/JP6829665B2/ja
Publication of JP2019016740A publication Critical patent/JP2019016740A/ja
Publication of JP2019016740A5 publication Critical patent/JP2019016740A5/ja
Application granted granted Critical
Publication of JP6829665B2 publication Critical patent/JP6829665B2/ja
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP2017134746A 2017-07-10 2017-07-10 リードフレーム、半導体装置、及びリードフレームの製造方法 Active JP6829665B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2017134746A JP6829665B2 (ja) 2017-07-10 2017-07-10 リードフレーム、半導体装置、及びリードフレームの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017134746A JP6829665B2 (ja) 2017-07-10 2017-07-10 リードフレーム、半導体装置、及びリードフレームの製造方法

Publications (3)

Publication Number Publication Date
JP2019016740A JP2019016740A (ja) 2019-01-31
JP2019016740A5 JP2019016740A5 (enExample) 2020-04-09
JP6829665B2 true JP6829665B2 (ja) 2021-02-10

Family

ID=65356567

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017134746A Active JP6829665B2 (ja) 2017-07-10 2017-07-10 リードフレーム、半導体装置、及びリードフレームの製造方法

Country Status (1)

Country Link
JP (1) JP6829665B2 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7293682B2 (ja) * 2018-12-12 2023-06-20 株式会社三洋物産 遊技機
JP2020093053A (ja) * 2018-12-12 2020-06-18 株式会社三洋物産 遊技機
JP2020093052A (ja) * 2018-12-12 2020-06-18 株式会社三洋物産 遊技機
JP2020093050A (ja) * 2018-12-12 2020-06-18 株式会社三洋物産 遊技機
JP2020093049A (ja) * 2018-12-12 2020-06-18 株式会社三洋物産 遊技機

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0613516A (ja) * 1992-05-26 1994-01-21 Nippon Steel Corp リードフレームの製造方法
JP4269595B2 (ja) * 2002-08-23 2009-05-27 トヨタ自動車株式会社 酸化物半導体電極及びその製造方法
US20080318061A1 (en) * 2007-06-20 2008-12-25 Akira Inaba Insulation paste for a metal core substrate and electronic device
TW201250964A (en) * 2011-01-27 2012-12-16 Dainippon Printing Co Ltd Resin-attached lead frame, method for manufacturing same, and lead frame
JP5456209B2 (ja) * 2011-08-01 2014-03-26 株式会社Ｓｔｅｑ 半導体装置及びその製造方法

Also Published As

Publication number Publication date
JP2019016740A (ja) 2019-01-31

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