JP6809973B2 - 精密集積回路用の低電力温度調節回路 - Google Patents

精密集積回路用の低電力温度調節回路 Download PDF

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Publication number
JP6809973B2
JP6809973B2 JP2017078206A JP2017078206A JP6809973B2 JP 6809973 B2 JP6809973 B2 JP 6809973B2 JP 2017078206 A JP2017078206 A JP 2017078206A JP 2017078206 A JP2017078206 A JP 2017078206A JP 6809973 B2 JP6809973 B2 JP 6809973B2
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wafer
heater
frame
controller
semiconductor die
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Japanese (ja)
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JP2017191102A5 (cg-RX-API-DMAC10.html
JP2017191102A (ja
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ウイリアム・ジェイ・ブリッツ
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Fluke Corp
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Fluke Corp
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    • H10W72/071—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D89/00—Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
    • H10D89/60—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD]
    • H10W40/10—
    • H10W70/093—
    • H10W70/635—
    • H10W72/60—
    • H10W76/15—
    • H10W76/40—
    • H10W78/00—
    • H10W90/701—
    • H10W70/09—
    • H10W70/60—
    • H10W72/9413—

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Pressure Sensors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Automation & Control Theory (AREA)
  • Ceramic Engineering (AREA)
JP2017078206A 2016-04-14 2017-04-11 精密集積回路用の低電力温度調節回路 Active JP6809973B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US15/099,341 US9607913B1 (en) 2016-04-14 2016-04-14 Low power, temperature regulated circuit for precision integrated circuits
US15/099,341 2016-04-14

Publications (3)

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JP2017191102A JP2017191102A (ja) 2017-10-19
JP2017191102A5 JP2017191102A5 (cg-RX-API-DMAC10.html) 2020-05-14
JP6809973B2 true JP6809973B2 (ja) 2021-01-06

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JP2017078206A Active JP6809973B2 (ja) 2016-04-14 2017-04-11 精密集積回路用の低電力温度調節回路

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US (1) US9607913B1 (cg-RX-API-DMAC10.html)
EP (1) EP3232745B1 (cg-RX-API-DMAC10.html)
JP (1) JP6809973B2 (cg-RX-API-DMAC10.html)
CN (1) CN107301985B (cg-RX-API-DMAC10.html)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102019125963A1 (de) * 2019-09-26 2021-04-01 Schott Ag Hermetisch verschlossene Glasumhäusung
US12500133B2 (en) * 2022-04-01 2025-12-16 Fluke Corporation Structure, system and method for a temperature regulated electrical device

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4340583A1 (de) * 1993-11-29 1995-06-01 Krautkraemer Gmbh Temperaturstabilisierter Hybridschaltkreis
DE19748005A1 (de) * 1997-10-30 1999-05-20 Siemens Ag Anordnung zum Übertragen von elektrischen Signalen zwischen einem auf einer Trägerplatte thermisch isoliertem Modul und angrenzenden Nachbarmodulen
US7484411B2 (en) * 2007-01-30 2009-02-03 Hewlett-Packard Development Company, L.P. Three phase capacitance-based sensing and actuation
US8049326B2 (en) * 2007-06-07 2011-11-01 The Regents Of The University Of Michigan Environment-resistant module, micropackage and methods of manufacturing same
US7821346B2 (en) * 2007-08-24 2010-10-26 Cts Corporation Ovenized oscillator
US20100180681A1 (en) * 2009-01-22 2010-07-22 Honeywell International Inc. System and method for increased flux density d'arsonval mems accelerometer

Also Published As

Publication number Publication date
US9607913B1 (en) 2017-03-28
EP3232745A1 (en) 2017-10-18
CN107301985A (zh) 2017-10-27
EP3232745B1 (en) 2020-06-24
CN107301985B (zh) 2022-08-30
JP2017191102A (ja) 2017-10-19

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