JP6809171B2 - Manufacturing methods for electronic devices, power supplies and electronic devices - Google Patents

Description

The present invention includes an electronic device provided with a first electronic component mounting board and a second electronic component mounting board arranged so that the component mounting surfaces face each other, a power supply device provided with such an electronic device, and a power supply device thereof. It relates to a manufacturing method of an electronic device for manufacturing such an electronic device.

For example, the following patent document discloses an integrated circuit board built-in power module (hereinafter, also simply referred to as “power module”) including two electronic component mounting boards, an insulating metal substrate and an integrated circuit board.

In this case, in the above-mentioned insulating metal substrate, a main circuit wiring pattern is formed on one surface of the metal base, and electronic components such as power control semiconductor elements are formed on the formation surface (component mounting surface) of the main circuit wiring pattern. It is implemented. Further, in the above integrated circuit board, control circuit wiring patterns are formed on both the front and back surfaces of the organic material substrate, and electronic components such as control elements are mounted on the formation surfaces (component mounting surfaces) of both control circuit wiring patterns. Has been done.

Further, in this power module, each of the connection terminal integrated cases (hereinafter, also simply referred to as "cases") is in a state where one of the component mounting surfaces on the insulating metal substrate and one of the two component mounting surfaces on the integrated circuit board are opposed to each other. Both boards are soldered to the connection terminals, whereby both boards are positioned with each other via the case.

Further, in the power module disclosed as the second embodiment in this patent document, an insulating metal substrate is formed by a sealing material formed by potting a potting material (epoxy resin, silicon resin, etc.) on a component mounting surface of a metal base. The electronic components of the above are sealed against the metal base, and the potting material is potted on one of the mounting surfaces of both components of the organic material substrate (in the example of the same document, the surface opposite to the insulating metal substrate). The electronic components of the integrated circuit board are sealed on the organic material substrate by the sealing material.

Japanese Unexamined Patent Publication No. 2004-63604 (pages 4-5, FIGS. 1,5-8)

However, the power module and the method for manufacturing the power module disclosed in the above patent document have the following problems to be solved.

Specifically, in the above power module, both boards are positioned with each other via a case in a state where the component mounting surface of the insulating metal substrate and one of the component mounting surfaces of the integrated circuit board face each other. .. Further, in the power module disclosed in the second embodiment in the above patent document, the electronic component mounted on the surface of the insulating metal substrate facing the integrated circuit board is sealed to the metal base by a sealing material. ing.

In this case, in the power module of the second embodiment, the potting material is potted on the component mounting surface of the metal base after the insulating metal substrate on which the electronic components have been mounted on the component mounting surface is attached to the case ( After mounting the integrated circuit board, which has completed mounting of the electronic components on both component mounting surfaces, to the case while sealing the electronic components (by forming a sealing material), one of the organic component boards on both component mounting surfaces. It is manufactured by potting a potting material (forming a sealing material) on (the surface opposite to the insulating metal substrate) to seal the electronic component.

Therefore, as shown in FIG. 13, in the power module 1x configured in the same manner as the power module of the second embodiment, the height of the integrated circuit board 5x facing the insulating metal substrate 4x is as high as the electronic component 9x. As shown in the figure, the electronic component 9x comes into contact with the sealing material (potting material) 7x formed on the insulating metal substrate 4x when trying to mount the electronic component of the above. Therefore, it is necessary to sufficiently separate the integrated circuit board 5x from the insulating metal substrate 4x.

Therefore, when a tall component such as an electronic component 9x is mounted on the integrated circuit board 5x, the height of the power module 1x (insulating metal) is increased by the amount that increases the separation distance between the insulating metal substrate 4x and the integrated circuit board 5x. The size of the substrate 4x and the mounting substrate 5x along the separation direction) must be increased, which causes a problem that the power module 1x becomes large.

In this case, by making the sealing material 7x formed on the insulating metal substrate 4x thin, the electronic component 9x hits the sealing material 7x without increasing the separation distance between the insulating metal substrate 4x and the integrated circuit board 5x. Contact can be avoided. However, when such a configuration / manufacturing method is adopted, the sealing force of the electronic component by the sealing material 7x formed on the insulating metal substrate 4x may be insufficient.

The present invention has been made in view of the problem to be solved, and provides an electronic device, a power supply device, and a method for manufacturing an electronic device in which electronic components are suitably sealed by a potting material without causing an increase in size. The main purpose is to do.

In order to achieve the above object, the electronic device according to the present invention includes a first electronic component mounting board and a second electronic component mounting board arranged so that the component mounting surfaces face each other, and also includes the first electronic component mounting board. potting material in contact with the first electronic component is arranged which is mounted on the component mounting surface of the electronic component mounting board in a state with its opening in the component mounting surface of the second electronic component mounting board It surrounds the concave member disposed between the first electronic component mounting board and the second electronic component mounting board, and the sides of the first electronic component mounting board and the second electronic component mounting board. The potting material is provided with a casing so as to be in contact with the outer peripheral surface of the concave member, and the second electronic component mounting board is mounted on the component mounting surface of the second electronic component mounting board. The second electronic component is arranged so as to be located in the recess of the concave member , and the first electronic component mounting board and the second electronic component mounting board are each fixed to the casing. In the device, either one of the casing and the concave member is provided with either an engaging portion or an engaged portion, and the engaging portion and the engaging portion are provided on the other of the casing and the concave member. The other side of the joint portion is provided, and the concave member is positioned with respect to the first electronic component mounting substrate by the engagement of the engaging portion with the engaged portion .

Further, the electronic device according to the present invention includes a first electronic component mounting board and a second electronic component mounting board arranged so that the component mounting surfaces face each other, and also includes the first electronic component mounting board. The potting material is arranged so as to be in contact with the first electronic component mounted on the component mounting surface, and the first electron is in a state where the opening is directed to the component mounting surface of the second electronic component mounting substrate. A concave member is provided between the component mounting board and the second electronic component mounting board, and the potting material is arranged so as to be in contact with the outer peripheral surface of the concave member, and the second electronic component is mounted. The board is an electronic device in which a second electronic component mounted on the component mounting surface of the second electronic component mounting board is arranged so as to be located in a recess of the concave member . The electronic component mounting board 1 and the second electronic component mounting board are fixed to connection terminals that electrically connect the first electronic component mounting board and the second electronic component mounting board to each other. ..

Further, in the electronic device according to the present invention, the concave member is made of an insulating resin.

Further, the electronic device according to the present invention is the first electronic component in a state where the concave member is disposed between the first electronic component mounting board and the second electronic component mounting board. An extension portion extending along the component mounting surface of the first electronic component mounting board is provided so as to cover at least a part of the portion facing the second electronic component mounting board.

Further, the power supply device according to the present invention is configured to include any of the above electronic devices.

Further, the method for manufacturing an electronic component according to the present invention includes a first electronic component mounting board and a second electronic component mounting board arranged so that the component mounting surfaces face each other, and the first electronic component. A method for manufacturing an electronic device in which a potting material is arranged so as to be in contact with a first electronic component mounted on the component mounting surface of the mounting board, wherein the first electronic component mounting board is used. A first step of arranging the concave member with the opening facing upward, and a second step of potting the potting material so as to be in contact with the outer peripheral surface of the first electronic component and the outer peripheral surface of the concave member. The third step of arranging the second electronic component mounting board so that the second electronic component mounted on the component mounting surface of the second electronic component mounting board is located in the recess of the concave member. And the steps of are executed in this order.

Further, the method for manufacturing an electronic component according to the present invention includes a first electronic component mounting board and a second electronic component mounting board arranged so that the component mounting surfaces face each other, and the first electronic component. It is a manufacturing method of an electronic device for manufacturing an electronic device in which a potting material is arranged so as to be in contact with the first electronic component mounted on the component mounting surface of the mounting board, and is an outer circumference of the first electronic component. The A step of potting the potting material so as to be in contact with the surface, the B step of disposing the concave member on the first electronic component mounting substrate with the opening facing upward so as to be in contact with the potting material, and the first step. Step C of arranging the second electronic component mounting board so that the second electronic component mounted on the component mounting surface of the electronic component mounting board 2 is located in the recess of the concave member, in this order. Execute.

In the electronic device according to the present invention, the concave shape is arranged between the first electronic component mounting board and the second electronic component mounting board with the opening facing the component mounting surface of the second electronic component mounting board. A second electronic component mounted on the component mounting surface of the second electronic component mounting substrate is provided in the recess of the concave member while the member is provided and the potting material is arranged so as to be in contact with the outer peripheral surface of the concave member. positioned. Further, the power supply device according to the present invention is configured to include the above-mentioned electronic devices.

Therefore, according to the electronic device and the power supply device according to the present invention, the potting material is arranged so as to be at least partially buried in the potting material potted to a sufficient thickness without thinning the potting material. Since the second electronic component is sufficiently brought closer to the component mounting surface of the first electronic component mounting board by the amount by which the second electronic component is positioned in the recess of the concave member, the first electron As a result of the separation distance between the component mounting board and the second electronic component mounting board becoming sufficiently small, it is possible to provide an electronic device (power supply device) that is sufficiently miniaturized. Further, it is possible to provide an electronic device (power supply device) in which a first electronic component or the like is suitably sealed by a potting material having a sufficient thickness.

Further, in the electronic device according to the present invention, the first electronic component mounting board and the second electronic component mounting board are provided with a casing surrounding the sides of the first electronic component mounting board and the second electronic component mounting board. , Are fixed to the casing respectively. Further, the power supply device according to the present invention is configured to include the above-mentioned electronic devices.

Therefore, according to the electronic device and the power supply device according to the present invention, the first electronic component is placed prior to potting the potting material on the component mounting surface of the first electronic component mounting board in the manufacture of the electronic device (power supply device). By fixing the mounting board to the casing, the container body having an upper surface opening is formed by the first electronic component mounting board and the casing surrounding the side of the first electronic component mounting board. As a result, it is possible to pot a potting material having sufficiently high fluidity, so that the potting material is spread over the surrounding details such as the first electronic component, and each electronic component is more preferably sealed. Can be.

Further, in the electronic device according to the present invention, either one of the casing and the concave member is provided with either the engaging portion and the engaged portion, and the other of the casing and the concave member is provided with the engaging portion and the engaged portion. The other portion is provided, and the concave member is positioned with respect to the first electronic component mounting substrate by the engagement of the engaging portion with the engaged portion. Further, the power supply device according to the present invention is configured to include the above-mentioned electronic devices.

Therefore, according to the electronic device and the power supply device according to the present invention, when the electronic device (power supply device) is manufactured, the concave member is first formed before the potting material potted on the component mounting surface of the first electronic component mounting substrate is cured. As a result of preferably avoiding the movement of the electronic component with respect to the mounting board of the electronic component, a defective product is manufactured in which the positional relationship between the second electronic component located in the concave portion and the concave member becomes an unexpected positional relationship. It is possible to provide a good electronic device (power supply device) because it is not used.

Further, in the electronic device according to the present invention, the first electronic component mounting board and the second electronic component mounting board are fixed to the connection terminals that electrically connect the two electronic component mounting boards to each other. Further, the power supply device according to the present invention is configured to include the above-mentioned electronic devices.

Therefore, according to the electronic device and the power supply device according to the present invention, both electronic components are mounted only by electrically connecting the first electronic component mounting board and the second electronic component mounting board (soldering work). The fixing of the substrate can be completed.

Further, in the electronic device according to the present invention, the concave member is formed of an insulating resin. Further, the power supply device according to the present invention is configured to include the above-mentioned electronic devices.

Therefore, according to the electronic device and the power supply device according to the present invention, the first electronic component mounted on the first electronic component mounting board and the second electron located in the vicinity of the first electronic component. The insulation between the parts can be sufficiently improved.

Further, in the electronic device according to the present invention, the first electronic component faces the second electronic component mounting board in a state of being disposed between the first electronic component mounting board and the second electronic component mounting board. The concave member is provided with an extending portion extending along the component mounting surface of the first electronic component mounting substrate so as to cover at least a part of the portion. Further, the power supply device according to the present invention is configured to include the above-mentioned electronic devices.

Therefore, according to the electronic device and the power supply device according to the present invention, the insulation distance between the first electronic component and the second electronic component is extended by the presence of the extending portion, so that the first electronic component and the first electronic component and the first electronic component are extended. The insulation between the two electronic components can be further improved.

Further, in the method for manufacturing an electronic component according to the present invention, a first step of arranging a concave member with an opening facing upward on a first electronic component mounting substrate, an outer peripheral surface of the first electronic component, and The second step of potting the potting material so as to be in contact with the outer peripheral surface of the concave member and the second electronic component mounted on the component mounting surface of the second electronic component mounting substrate are located in the recess of the concave member. The third step of arranging the second electronic component mounting substrate is executed in this order.

Therefore, when the concave member is arranged after the potting material is potted, the potting material pushed away by the concave member may cause a raised portion of the potting material around the concave member, whereas the present invention According to the method for manufacturing an electronic device according to the above, by executing the first step prior to the second step, it is possible to preferably avoid the above-mentioned situation where a raised portion of the potting material is generated.

Further, in the method for manufacturing an electronic device according to the present invention, a step A of potting a potting material so as to be in contact with the outer peripheral surface of the first electronic component and a concave member having an opening facing upward so as to be in contact with the potting material are arranged. Step B to install and step C to arrange the second electronic component mounting board so that the second electronic component mounted on the component mounting surface of the second electronic component mounting board is located in the recess of the concave member. Is executed in this order.

Therefore, according to the method for manufacturing an electronic device according to the present invention, the concave member does not exist on the first electronic component mounting board when the potting material is potted on the component mounting surface of the first electronic component mounting board. Therefore, it is possible to preferably avoid a situation in which the potting material is accidentally potted in the recess of the concave member.

It is a top view of the power supply device 1 in the state where the lid body 2b is removed. FIG. 5 is a cross-sectional view taken along the line AA in FIG. It is sectional drawing BB in FIG. FIG. 5 is a cross-sectional view taken along the line CC in FIG. It is an external perspective view of the concave member 6. It is an external perspective view of a part of a frame body 2a and a concave member 6. It is explanatory drawing for demonstrating the manufacturing method of power-source device 1. It is another explanatory drawing for demonstrating the manufacturing method of a power-source device 1. It is still another explanatory diagram for demonstrating the manufacturing method of a power-source device 1. It is still another explanatory diagram for demonstrating the manufacturing method of a power-source device 1. FIG. 1 is a cross-sectional view taken along the line DD in FIG. 1 (an explanatory view for explaining the insulation between the electronic components 22 and 23). It is explanatory drawing for demonstrating another manufacturing method of power-source device 1. It is sectional drawing of the conventional power module 1x.

Hereinafter, embodiments of electronic devices, power supply devices, and methods for manufacturing electronic devices will be described with reference to the accompanying drawings.

The power supply device (power module) 1 shown in FIGS. 1 to 4 is an example of a "power supply device" provided with an "electronic device", and is a casing 2, a connection terminal 3, a mounting board 4, 5, and a concave member. 6 and a potting material 7 are provided.

As shown in FIGS. 2 to 4, the casing 2 includes a frame body 2a and a lid body 2b.

The frame body 2a is an example of a “casing”, and as shown in FIGS. 1 to 4, the frame body 2a is formed into a square frame shape in a plan view by an insulating material such as an insulating resin so as to surround the sides of the mounting substrates 4 and 5. It is formed. The frame body 2a is formed with a terminal fixing portion 11 to which a plurality of connecting terminals 3, 3, ... Are fixed. Further, the frame body 2a is formed with positioning claws 12 (see FIGS. 1 and 4) for positioning the fixed position of the mounting substrate 4 as described later. Further, as shown in FIGS. 3 and 6, the frame body 2a is formed with an engaged portion 13 (an example of the “engaged portion”) having an engaging hole H for positioning the concave member 6. There is. The lid 2b is formed in a square plate shape in a plan view by an insulating material such as an insulating resin so that one of both openings in the frame 2a can be closed.

In this case, in the power supply device 1 of this example, the engaged portion (engagement hole or engagement recess) formed on the upper edge portion (edge portion on the side opposite to the side on which the mounting board 4 is mounted) in the frame body 2a. : Not shown), the frame 2a is fixed to the lid 2b by engaging the engaging portion (engagement claw portion: not shown) formed at the lower edge of the lid 2b. Has been adopted. Although not shown, for example, a "potting material" is arranged on the component mounting surface Fc (the surface opposite to the mounting substrate 4 side) of the mounting board 5, and the component mounting surface Fc is referred to as a "potting material". It is also possible to eliminate the need for the lid 2b by covering with.

The connection terminal 3 is press-fitted and fixed to the terminal fixing portion 11 of the frame body 2a in the casing 2. The connection terminal 3 functions as a connector for connecting each wiring pattern (not shown) of the mounting boards 4 and 5 to an external device (circuit board of the device to which the power supply device 1 is connected: not shown). Further, as will be described later, the connection terminal 3 functions as a fixing member for fixing the mounting board 4 to the frame body 2a by being soldered to the wiring pattern formed on the mounting board 4 (fixed to the terminal fixing portion 11). An example of a configuration in which the mounting board 4 is fixed to the frame body 2a via each of the connected connection terminals 3). Further, the connection terminal 3 functions as a fixing member for fixing the mounting board 5 to the frame body 2a by being soldered to the wiring pattern formed on the mounting board 5 (each connection terminal fixed to the terminal fixing portion 11). An example of a configuration in which the mounting substrate 5 is fixed to the frame body 2a via 3.).

The mounting board 4 is a single-sided mounting board which is an example of the "first electronic component mounting board", and as an example, is on an insulating film (not shown) formed on one surface of a flat plate made of aluminum or the like. A wiring pattern (not shown) is formed in. Further, as shown in FIGS. 2 to 4, various "electronic components" such as the electronic component 21 and the electronic component 22 are mounted on the formation surface (component mounting surface Fa) of the wiring pattern of the mounting board 4.

In each of the drawings referred to in the present specification, in order to facilitate understanding of the configuration of the power supply device 1, the illustration of the layer structure of the mounting substrate 4 and the illustration of electronic components other than the electronic components 21 and 22 are omitted. ing. Further, the mounting substrate 4 is formed with a notch 4a (see FIGS. 1 and 4) with which the positioning claw portion 12 of the frame body 2a in the casing 2 can be engaged.

The mounting board 5 is a double-sided mounting board which is an example of a “second electronic component mounting board”, and as an example, wiring patterns (not shown) are formed on both front and back surfaces of a flat plate made of a glass epoxy material or the like. It is formed. Further, in the mounting board 5, various "electronic components" such as electronic components 23 are mounted on one of the forming surfaces (component mounting surfaces Fb) of both wiring patterns formed on both the front and back surfaces, and are formed on both the front and back surfaces. Various "electronic components" are also mounted on the other forming surface (component mounting surface Fc) of both wiring patterns.

In each of the drawings referred to in the present specification, in order to facilitate understanding of the configuration of the power supply device 1, the illustration of the layer structure of the mounting substrate 5 and the illustration of electronic components other than the electronic component 23 are omitted. ..

In this case, in the power supply device 1 of this example, the component mounting surface Fa on the mounting board 4 and the component mounting surface Fb on the mounting board 5 correspond to the "component mounting surface", respectively, and both component mounting surfaces Fa and Fb face each other. The mounting boards 4 and 5 are arranged so as to. Further, in the power supply device 1 of this example, the electronic component 22 mounted on the component mounting surface Fa of the mounting board 4 corresponds to the “first electronic component”. Further, in the power supply device 1 of this example, the electronic component 23 mounted on the component mounting surface Fb of the mounting board 5 corresponds to the “second electronic component”.

The concave member 6 is an example of a “concave member”, and as shown in FIGS. 5 and 6, the concave member 6 is formed in a concave shape by an insulating material such as an insulating resin. The concave member 6 has a recess 31a (a “recess” in which the main body of the electronic component 23 mounted on the mounting substrate 5 is positioned (inserted: accommodated): see FIGS. 2 and 10) and a recess 31b. An opening (a "recess" where the lead wire 23a of the electronic component 23 mounted on the mounting board 5 is positioned (inserted: accommodated): see FIG. 3) is provided on the component mounting surface Fb of the mounting board 5. It is arranged between the mounting boards 4 and 5 in a facing state.

Further, as shown in FIGS. 5 and 6, the concave member 6 has an engaging portion that can be engaged with the engaged portion 13 of the frame body 2a (insertable into the engaging hole H of the engaged portion 13). 32 (an example of an "engaging portion") is formed. Further, the concave member 6 is formed with an extension portion 33, which is an example of the “extension portion”. The function of the extension portion 33 (effects exerted by the extension portion 33, etc.) will be specifically described later.

The potting material 7 is an example of a “potting material”, and is an “insulating layer” and / or “insulating layer” by potting and curing a fluid resin such as an epoxy resin or a silicone resin on the component mounting surface Fa of the mounting substrate 4. It is formed to function as a component fixing layer (sealing layer). In this case, in the power supply device 1 of this example, as an example, not only the "region near the electronic component 22 on the component mounting surface Fa" but also the entire area of the component mounting surface Fa on the mounting board 4 (excluding the mounting location of the electronic component). A layer of the potting material 7 is formed so as to cover the above. Further, in the power supply device 1 of this example, a layer of the potting material 7 is formed so as to be in contact with a portion (at least a part of the outer peripheral surface) of the concave member 6 near the bottom of the outer peripheral surface.

In manufacturing the power supply device 1, first, the connection terminal 3 is press-fitted and fixed to the terminal fixing portion 11 of the frame body 2a of the casing 2. Further, the mounting board 4 is manufactured by mounting electronic components 21 and 22 and the like on the component mounting surface Fa. Further, the electronic component 23 and the like are mounted on the component mounting surfaces Fb and Fc, respectively, to manufacture the mounting board 5.

Next, as shown in FIG. 7, the mounting substrate 4 is positioned at the lower end of the frame body 2a with the component mounting surface Fa facing upward. At this time, as shown in FIG. 4, by engaging each positioning claw portion 12 of the frame body 2a with the notch 4a of the mounting board 4, the mounting position of the mounting board 4 with respect to the frame body 2a (mounting board). The mounting position of the frame body 2a with respect to 4) is positioned. Further, as shown in FIG. 7, various electronic components such as electronic components 21 and 22 mounted on the component mounting surface Fa of the mounting board 4 are located in the frame body 2a.

Subsequently, the lower ends of the connection terminals 3, 3, ... Fixed to the terminal fixing portion 11 of the frame body 2a are soldered to the wiring pattern formed on the component mounting surface Fa of the mounting board 4. As a result, each of the connection terminals 3, 3 ... Is electrically connected to the wiring pattern of the mounting board 4, and the mounting board 4 is framed via the connection terminal 3 fixed to the terminal fixing portion 11. It is fixed to 2a.

In the power supply device 1 of this example, the mounting board 4 is fixed to the frame body 2a by soldering the connection terminal 3 to the wiring pattern formed on the component mounting surface Fa, but instead of such a configuration, (Or, in addition to such a configuration), it is also possible to adopt a configuration in which the mounting substrate 4 is fixed to the frame body 2a by using an adhesive, fixing screws, or the like (not shown).

Next, as shown in FIG. 8, a concave member 6 is arranged in the vicinity of the electronic component 22 on the mounting substrate 4 with the openings of the recesses 31a and 31b facing upward (execution of the "first step"). Specifically, with the openings of the recesses 31a and 31b facing upward, the engaging portion 32 is engaged with the engaging hole H in the engaged portion 13 of the frame body 2a on the mounting substrate 4. The concave member 6 is installed in the. As a result, as shown in the figure, the concave member 6 is arranged in the vicinity of the electronic component 22.

Subsequently, as shown in FIG. 9, the potting material 7 is potted on the component mounting surface Fa of the mounting board 4 (execution of the "second step"). At this time, in the manufacturing method of this example, as an example, the entire area of the component mounting surface Fa on the mounting substrate 4 fixed to the frame body 2a is covered with the potting material 7, and the electronic components 21 and 22 are used. The potting material 7 is potted so that the surface (upper surface) of the tall "electronic component" is exposed from the potting material 7.

As a result, the soldering portion between the connection terminal 3 and the wiring pattern, the soldering portion to the wiring pattern such as the electronic components 21 and 22, and the wiring pattern formed on the component mounting surface Fa are covered with the potting material 7. .. Further, a state in which the potting material 7 is in contact with a part of the outer peripheral surface of the concave member 6 positioned with respect to the frame body 2a by the engagement of the engaging portion 32 with the engaged portion 13 (that is, the concave member 6). A part of it is buried in the potting material 7). As a result, when the potting material 7 is cured, the concave member 6 is fixed to the frame body 2a and the mounting substrate 4 by the potting material 7.

Next, as shown in FIG. 10, the mounting substrate 5 is fixed to the lid 2b with the component mounting surface Fb facing downward (execution of the "third step"). At this time, first, the main body of the electronic component 23 (an example of "an example of" the second electronic component mounted on the second electronic component mounting board ") mounted on the component mounting surface Fb of the mounting board 5 is concave. The mounting board 5 is placed on the terminal fixing portion 11 of the frame body 2a so as to be positioned in the recess 31a of the member 6 and the lead wire 23a of the electronic component 23 to be positioned in the recess 31b of the concave member 6. The "third step" is preferably started in a state where the potting material 7 potted in the "second step" is cured.

Next, the connection terminals 3, 3, ... Fixed to the terminal fixing portion 11 are soldered to the wiring pattern formed on the component mounting surface Fc of the mounting board 5. As a result, the connection terminals 3, 3, ... Are electrically connected to the wiring pattern of the mounting board 5, and the mounting board 5 is connected to the frame 2a via the connection terminals 3 fixed to the terminal fixing portion 11. Both mounting boards 4 and 5 are positioned so that the component mounting surface Fa of the mounting board 4 and the component mounting surface Fb of the mounting board 5 face each other.

Further, in the power supply device 1 of this example, when the "third step" is completed, the upper edge portion of the concave member 6 is in contact with the component mounting surface Fb of the mounting board 5. As a result, the electronic component 23 mounted on the component mounting surface Fb is covered with the concave member 6 and is appropriately insulated from the surroundings. Although the example in which the upper edge portion of the concave member 6 is in contact with the component mounting surface Fb of the mounting substrate 5 when the "third step" is completed has been described, the electronic component 23 is preferably from the surroundings. If it is insulated, it is possible to adopt a configuration in which the upper edge portion of the concave member 6 is not in contact with the component mounting surface of the mounting board 5.

In the power supply device 1 of this example, the mounting board 5 is fixed to the frame body 2a by soldering the wiring pattern formed on the component mounting surface Fc to the connection terminal 3, but instead of such a configuration, (Or, in addition to such a configuration), it is also possible to adopt a configuration in which the mounting substrate 5 is fixed to the frame body 2a by using an adhesive, fixing screws, or the like (not shown). After that, the power supply device 1 is completed as shown in FIGS. 1 to 4 by mounting the lid 2b on the frame 2a so as to cover the component mounting surface Fc of the mounting board 5.

In this power supply device 1, as shown in FIG. 11, the main body and lead wires of the electronic component 23 are formed in the recesses 31a and 31b of the concave member 6 arranged in the vicinity of the electronic component 22 between the mounting boards 4 and 5. 23a is located. Further, the concave member 6 covers a part of the upper surface (in the electronic component 22) of the electronic component 22 (one surface facing the component mounting surface Fb of the mounting board 5), and the component mounting surface Fa (that is, the component mounting surface Fa) of the mounting board 4 is covered. The upper surface of the electronic component 22 mounted on the component mounting surface Fa) and the extending portion 33 extending along the component mounting surface Fb of the mounting board 5 are provided.

In this case, in the power supply device 1 of this example in which the electronic component 23 is located in the recesses 31a and 31b of the concave member 6 arranged in the vicinity of the electronic component 22, the separation distance between the electronic components 22 and 23 is very large. It's getting shorter. Therefore, in the power supply device 1 of this example, a configuration is adopted in which the insulating property between the electronic components 22 and 23 is improved by providing the extending portion 33 in the concave member 6 on which the electronic component 23 is located. ..

Specifically, unlike the concave member 6 in the power supply device 1 of this example, when a "concave member" having no extending portion 33 is adopted, the sum of the distance La and the distance Lb shown in FIG. 11 is used. Is the insulation distance between the electronic components 22 and 23. Even when the "concave member" having such a configuration is adopted, the sum of the distance La and the distance Lb is the insulation distance of the electronic components 22 and 23 in the configuration without the "concave member". Although it is longer than the above, sufficient insulation may not be ensured depending on the potential difference between the electronic components 22 and 23.

On the other hand, in the power supply device 1 of this example, since the concave member 6 includes the extending portion 33, the distance L1 and the distance L2 are sufficiently longer than the sum of the distance La and the distance Lb. The sum is the insulation distance of the electronic components 22 and 23. Therefore, the insulating property between the electronic components 22 and 23 is sufficiently improved as compared with the case where the "concave member" having no extending portion 33 is adopted.

As described above, the power supply device 1 includes the concave member 6 arranged between the mounting boards 4 and 5 with the opening facing the component mounting surface Fb of the mounting board 5, and the outer periphery of the concave member 6. The potting material 7 is arranged so as to be in contact with the surface, and the electronic component 23 mounted on the component mounting surface Fb of the mounting substrate 5 is located in the recesses 31a and 31b of the concave member 6.

Therefore, according to the power supply device 1, the concave member 6 is arranged so that at least a part of the potting material 7 is buried in the potting material 7 potted to a sufficient thickness without thinning the potting material 7. Since the electronic component 23 is sufficiently brought closer to the component mounting surface Fa of the mounting board 4 by the amount that the electronic component 23 is positioned in the recesses 31a and 31b, the separation distance between the mounting boards 4 and 5 is sufficient. As a result, it is possible to provide a sufficiently miniaturized power supply device 1. Further, it is possible to provide the power supply device 1 in which the electronic components 21 and 22 and the like are suitably sealed by the potting material 7 having a sufficient thickness.

Further, the power supply device 1 includes a frame body 2a (casing) that surrounds the sides of the mounting boards 4 and 5, and the mounting boards 4 and 5 are fixed to the frame body 2a via the respective connection terminals 3. ..

Therefore, according to the power supply device 1, the mounting board 4 is fixed to the frame body 2a prior to potting the potting material 7 on the component mounting surface Fa of the mounting board 4 when the power supply device 1 is manufactured. The substrate 4 and the frame body 2a surrounding the side of the mounting substrate 4 form a container body having an upper surface opening. As a result, the potting material 7 having sufficiently high fluidity can be potted, so that the potting material 7 is spread over the details around the electronic parts such as the electronic parts 21 and 22, and each electronic component is more preferably used. It can be in a sealed state.

Further, in the power supply device 1, the engaged portion 13 is provided on the frame body 2a, the engaging portion 32 is provided on the concave member 6, and the engaging portion 32 is engaged with the engaged portion 13. The concave member 6 is positioned with respect to the mounting substrate 4 fixed to the frame body 2a.

Therefore, according to the power supply device 1, it is preferable that the concave member 6 moves with respect to the mounting board 4 before the potting material 7 potted on the component mounting surface Fa of the mounting board 4 is cured when the power supply device 1 is manufactured. As a result of avoiding the problem, a defective product in which the positional relationship between the electronic component 23 and the concave member 6 located in the recesses 31a and 31b is unexpectedly not manufactured is not manufactured, so that a good power supply device is used. 1 can be provided.

Further, in the power supply device 1, the concave member 6 is formed of an insulating resin.

Therefore, according to the power supply device 1, the insulation between the electronic component 22 mounted on the mounting board 4 and the electronic component 23 located in the vicinity of the electronic component 22 can be sufficiently improved. ..

Further, in the power supply device 1, the component mounting surface Fa of the mounting board 4 covers at least a part of the electronic component 22 facing the mounting board 5 in a state of being arranged between the mounting boards 4 and 5. An extending portion 33 extending along the line is provided on the concave member 6.

Therefore, according to the power supply device 1, the insulation distance between the electronic components 22 and 23 is extended by the presence of the extending portion 33, so that the insulating property between the electronic components 22 and 23 can be further improved.

Further, in the method of manufacturing the power supply device 1, the "first step" of disposing the concave member 6 on the mounting substrate 4 with the opening facing upward, the outer peripheral surface of the electronic component 22, and the outer periphery of the concave member 6. The "second step" of potting the potting material 7 so as to be in contact with the surface, and the "third step" of arranging the mounting board 5 so that the electronic component 23 mounted on the mounting board 5 is located in the recess 31a of the concave member 6. Steps "and are executed in this order.

Therefore, when the concave member 6 is arranged after the potting material 7 is potted, the potting material 7 pushed away by the concave member 6 may cause a raised portion of the potting material 7 around the concave member 6. On the other hand, according to the manufacturing method of the power supply device 1, by executing the "first step" prior to the "second step", the raised portion of the potting material 7 as described above is generated. It can be preferably avoided.

The "electronic device", the "power supply device" configuration, and the "electronic device manufacturing method" are not limited to the above-mentioned configuration of the power supply device 1 and the example of the manufacturing method of the power supply device 1. For example, manufacturing that executes the "first step" of attaching the concave member 6 to the frame body 2a to which the mounting substrate 4 is fixed prior to the "second step" of potting the potting material 7 on the component mounting surface Fa. Although the method has been described, the power supply device 1 described above can also be manufactured according to the following manufacturing method.

First, in the same manner as in the above-described manufacturing method, the mounting board 4 is fixed to the frame body 2a as shown in FIG. 7, and then the potting material 7 is potted on the component mounting surface Fa of the mounting board 4 as shown in FIG. (Implementation of "Step A").

In this case, as an example, the entire area of the component mounting surface Fa on the mounting substrate 4 fixed to the frame 2a is covered with the potting material 7, and a tall "electronic component" such as electronic components 21 and 22 is used. The potting material 7 is potted so that the surface (upper surface) of the "part" is exposed from the potting material 7. Further, in consideration of the presence of the concave member 6 to be disposed later, the amount of the potting material 7 to be potted at the arrangement position of the concave member 6 is set to be slightly small. As a result, the soldering portion between the connection terminal 3 and the wiring pattern, the soldering portion to the wiring pattern such as the electronic components 21 and 22, and the wiring pattern formed on the component mounting surface Fa are covered with the potting material 7. It becomes a state.

Next, prior to the curing of the potting material 7, as shown in FIG. 9, a concave member 6 is arranged in the vicinity of the electronic component 22 on the mounting substrate 4 with the openings of the recesses 31a and 31b facing upward (““ Execution of "Step B"). Specifically, with the openings of the recesses 31a and 31b facing upward, the engaging portion 32 is engaged with the engaging hole H in the engaged portion 13 of the frame body 2a on the mounting substrate 4. The concave member 6 is installed in the. As a result, as shown in the figure, the concave member 6 is arranged in the vicinity of the electronic component 22, and the potting material 7 is in contact with a part of the outer peripheral surface of the concave member 6 (that is, in the potting material 7). A part of the concave member 6 is buried), and the concave member 6 is fixed to the frame 2a and the mounting substrate 4 by the potting material 7.

Subsequently, as shown in FIG. 10, the mounting substrate 5 is fixed to the lid 2b with the component mounting surface Fb facing downward (execution of the "C step"). Since each step after the "C step" is the same as each step after the "third step" in the above-mentioned manufacturing method, detailed description thereof will be omitted. As a result, as shown in FIGS. 1 to 4, the power supply device 1 is completed.

As described above, in the above-mentioned manufacturing method of the power supply device 1, the "step A" of potting the potting material 7 so as to be in contact with the outer peripheral surface of the electronic component 22 and the electron with the opening facing upward so as to be in contact with the potting material 7. "Step B" in which the concave member 6 is arranged in the vicinity of the component 22, and the mounting board 5 is arranged so that the electronic component 23 mounted on the component mounting surface Fb of the mounting board 5 is located in the recess 31a of the concave member 6. The "C step" to be performed is executed in this order.

Therefore, according to the manufacturing method of the power supply device 1, when the potting material 7 is potted on the component mounting surface Fa of the mounting board 4, the concave member 6 does not exist on the mounting board 4, so that the recess 31a, It is possible to preferably avoid the situation where the potting material 7 is potted in the 31b.

On the other hand, an example in which the potting material 7 is arranged over the entire area of the component mounting surface Fa on the mounting substrate 4 has been described, but the region where the potting material 7 is potted is not limited to this, and the electrons as the "first electronic component" The potting material 7 may be arranged only in a part of the component mounting surface Fa so as to be in contact with the component 22.

Further, the engaged portion 13 is formed on the frame body 2a (casing), the engaging portion 32 is formed on the concave member 6, and the concave member 6 is positioned by engaging the engaging portion 32 with the engaged portion 13. Although the above-mentioned configuration has been described as an example, instead of such a configuration, an “engaged portion” is formed in the “casing” and an “engaged portion” is formed in the “concave member”. It is also possible to adopt a configuration in which the "concave member" is positioned by engaging the "engaged portion" with the "engaged portion" (not shown). Further, instead of the configuration in which the "concave member" is positioned with respect to the "casing", a configuration in which the "concave member" is positioned with respect to the "first electronic component mounting board" can be adopted (not shown). ).

Further, a configuration in which the "first electronic component mounting board" and the "second electronic component mounting board" are fixed to the "casing" (in the above example, the connection terminal 3 fixed to the terminal fixing portion 11 of the casing 2 is connected. Although the configuration of fixing to the casing 2 via the casing 2) has been described as an example, the “first electronic component mounting board” and the “second electronic component mounting board” regardless of whether or not the “casing” is provided. By fixing both boards to "connection terminals" that electrically connect the two boards to each other, it is possible to adopt a configuration in which the "component mounting surfaces" are positioned so as to face each other. By adopting such a configuration, both boards can be fixed only by electrically connecting the "first electronic component mounting board" and the "second electronic component mounting board" (soldering work). Can be completed.

Further, although the power supply device 1 provided with the concave member 6 having the extending portion 33, which is an example of the “extending portion”, has been described as an example, the “concave member” having no “extending portion” will be described. It is also possible to configure an "electronic device (power supply device)" in preparation for it. In addition, the "electronic device" is not limited to the "power supply device" such as the power supply device 1, and various electronic devices provided with two or more electronic component mounting boards arranged so that the component mounting surfaces face each other. In the device, a configuration in which the "concave member" is provided in the same manner as in the power supply device 1 described above can be adopted.

1 Power supply 2 Casing 2a Frame 2b Lid 3 Connection terminal 4, 5 Mounting board 6 Concave member 7 Potting material 11 Terminal fixing part 13 Engagement part 22, 23 Electronic component 23a Lead wire 31a, 31b Recession 32 Engagement part 33 Extensions Fa, Fb Component mounting surface L1, L2, La, Lb Distance H Engagement hole

Claims (7)

A first electronic component mounting board and a second electronic component mounting board arranged so that the component mounting surfaces face each other are provided, and a first mounted on the component mounting surface of the first electronic component mounting board. The potting material is arranged so as to be in contact with the electronic parts of the
A concave member arranged between the first electronic component mounting board and the second electronic component mounting board with the opening facing the component mounting surface of the second electronic component mounting board .
The first electronic component mounting board and the casing surrounding the side of the second electronic component mounting board are provided.
The potting material is arranged so as to be in contact with the outer peripheral surface of the concave member.
The second electronic component mounting board is arranged so that the second electronic component mounted on the component mounting surface of the second electronic component mounting board is located in the recess of the concave member .
The first electronic component mounting board and the second electronic component mounting board are electronic devices fixed to the casing, respectively.
Either one of the engaging portion and the engaged portion is provided on either one of the casing and the concave member, and the engaging portion and the other of the engaged portion are provided on the other of the casing and the concave member. An electronic device that is provided and the concave member is positioned with respect to the first electronic component mounting substrate by engaging the engaging portion with the engaged portion . A first electronic component mounting board and a second electronic component mounting board arranged so that the component mounting surfaces face each other are provided, and a first mounted on the component mounting surface of the first electronic component mounting board. The potting material is arranged so as to be in contact with the electronic parts of the
A concave member arranged between the first electronic component mounting board and the second electronic component mounting board is provided with an opening facing the component mounting surface of the second electronic component mounting board.
The potting material is arranged so as to be in contact with the outer peripheral surface of the concave member.
In the second electronic component mounting board, the second electronic component mounted on the component mounting surface of the second electronic component mounting board is arranged so that the second electronic component is located in the recess of the concave member. It ’s a device ,
The first electronic component mounting board and the second electronic component mounting board are fixed to connection terminals that electrically connect the first electronic component mounting board and the second electronic component mounting board to each other. and are electronic devices. The electronic device according to claim 1 or 2 , wherein the concave member is made of an insulating resin. The concave member faces the second electronic component mounting board of the first electronic component in a state of being disposed between the first electronic component mounting board and the second electronic component mounting board. The electronic device according to claim 3 , wherein an extending portion extending along the component mounting surface of the first electronic component mounting substrate is provided so as to cover at least a part of the portion. A power supply device including the electronic device according to any one of claims 1 to 4 . A first electronic component mounting board and a second electronic component mounting board arranged so that the component mounting surfaces face each other are provided, and a first mounted on the component mounting surface of the first electronic component mounting board. It is a manufacturing method of an electronic device that manufactures an electronic device in which a potting material is arranged so as to be in contact with the electronic component of the above.
The first step of arranging the concave member on the first electronic component mounting substrate with the opening facing upward, and
A second step of potting the potting material so as to be in contact with the outer peripheral surface of the first electronic component and the outer peripheral surface of the concave member.
A third step of arranging the second electronic component mounting board so that the second electronic component mounted on the component mounting surface of the second electronic component mounting board is located in the recess of the concave member. A method of manufacturing electronic components that performs in this order. A first electronic component mounting board and a second electronic component mounting board arranged so that the component mounting surfaces face each other are provided, and a first mounted on the component mounting surface of the first electronic component mounting board. It is a manufacturing method of an electronic device that manufactures an electronic device in which a potting material is arranged so as to be in contact with the electronic component of the above.
Step A in which the potting material is potted so as to be in contact with the outer peripheral surface of the first electronic component, and
Step B in which the concave member is arranged on the first electronic component mounting substrate with the opening facing upward so as to be in contact with the potting material, and
The C step of arranging the second electronic component mounting board so that the second electronic component mounted on the component mounting surface of the second electronic component mounting board is located in the recess of the concave member is described in this step. A method of manufacturing electronic components that is executed in sequence.

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