JP2018088475A - Electronic apparatus, power supply device, and manufacturing method of electronic apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic apparatus in which an electronic component is suitably sealed by a potting material without increase in the size.SOLUTION: A power supply device 1 which includes mounting substrates 4, 5 arranged so that component mounting surfaces Fa, Fb face each other, and in which a potting material 7 is arranged so as to contact an electronic component 22 mounted on the component mounting surface Fa of the mounting substrate 4 includes a recessed member 6 which is arranged between the mounting substrates 4, 5 in the state where the opening is directed toward the component mounting surface Fb of the mounting substrate 5. The potting material 7 is arranged so as to contact the outer peripheral surface of the recessed member 6. The mounting substrate 5 is arranged so that the electronic component 23 mounted on the component mounting surface Fb is located in recesses 31a, 31b of the recessed member 6.SELECTED DRAWING: Figure 2

Description

  The present invention relates to an electronic device provided with a first electronic component mounting substrate and a second electronic component mounting substrate arranged so that the component mounting surfaces face each other, a power supply device including such an electronic device, and its The present invention relates to an electronic device manufacturing method for manufacturing such an electronic device.

  For example, the following patent document discloses an integrated circuit board built-in power module (hereinafter also simply referred to as “power module”) including two electronic component mounting boards, an insulating metal substrate and an integrated circuit board.

  In this case, the insulating metal substrate has a main circuit wiring pattern formed on one surface of the metal base, and an electronic component such as a power control semiconductor element is formed on the surface (component mounting surface) of the main circuit wiring pattern. Has been implemented. The above integrated circuit board has control circuit wiring patterns formed on both the front and back surfaces of the organic material substrate, and electronic components such as control elements are mounted on both control circuit wiring pattern formation surfaces (component mounting surfaces). Has been.

  Further, in this power module, each of the connection terminal integrated cases (hereinafter also simply referred to as “cases”) in a state where the component mounting surface of the insulating metal substrate and one of both component mounting surfaces of the integrated circuit substrate are opposed to each other. Both substrates are soldered to the connection terminals, respectively, whereby both substrates are positioned with respect to each other via the case.

  Further, in the power module disclosed as the second embodiment in this patent document, an insulating metal substrate is formed by a sealing material formed by potting a potting material (such as epoxy resin or silicon resin) on a metal-based component mounting surface. The electronic parts are sealed against the metal base and formed by potting a potting material on one of the two component mounting surfaces of the organic material substrate (the surface opposite to the insulating metal substrate in the example of the same document) The electronic component of the integrated circuit substrate is sealed with respect to the organic material substrate by the sealing material.

Japanese Patent Laid-Open No. 2004-63604 (page 4-5, FIGS. 1, 5-8)

  However, the power module and the manufacturing method thereof disclosed in the above patent documents have the following problems to be solved.

  Specifically, in the power module described above, the two substrates are positioned with respect to each other through the case in a state where the component mounting surface of the insulating metal substrate faces one of the two component mounting surfaces of the integrated circuit substrate. . In the power module disclosed in the second embodiment of the above-mentioned patent document, the electronic component mounted on the surface of the insulating metal substrate facing the integrated circuit substrate is sealed with respect to the metal base by the sealing material. ing.

  In this case, the power module of the second embodiment pots a potting material on the component mounting surface of the metal base after the insulating metal substrate on which the electronic component has been mounted on the component mounting surface is attached to the case ( After sealing the electronic component (by forming a sealing material) and mounting the integrated circuit board on which the electronic component has been mounted on both component mounting surfaces to the case, one side of the organic material substrate on both component mounting surfaces It is manufactured by potting a potting material (forming a sealing material) on a surface (the surface opposite to the insulating metal substrate) to seal an electronic component.

  Therefore, as shown in FIG. 13, in the power module 1x configured in the same manner as the power module of the second embodiment, a high profile like an electronic component 9x is provided on the surface of the integrated circuit board 5x facing the insulating metal substrate 4x. When the electronic component is to be mounted, the electronic component 9x comes into contact with the sealing material (potting material) 7x formed on the insulating metal substrate 4x as shown in FIG. Therefore, it is necessary to sufficiently separate the integrated circuit substrate 5x from the insulating metal substrate 4x.

  For this reason, when a tall component such as the electronic component 9x is mounted on the integrated circuit board 5x, the height of the power module 1x (insulating metal) is increased by an amount corresponding to an increase in the distance between the insulating metal board 4x and the integrated circuit board 5x. There is a problem in that the size of the power module 1x is increased due to the increase in the size of the substrate 4x and the mounting substrate 5x along the separation direction).

  In this case, by reducing the thickness of the sealing material 7x formed on the insulating metal substrate 4x, the contact of the electronic component 9x against the sealing material 7x is increased without increasing the distance between the insulating metal substrate 4x and the integrated circuit substrate 5x. Contact can be avoided. However, when such a configuration / manufacturing method is adopted, the sealing force of the electronic component by the sealing material 7x formed on the insulating metal substrate 4x may be insufficient.

  The present invention has been made in view of such a problem to be solved, and provides an electronic device, a power supply device, and an electronic device manufacturing method in which an electronic component is suitably sealed with a potting material without causing an increase in size. The main purpose is to do.

  In order to achieve the above object, an electronic apparatus according to the present invention includes a first electronic component mounting board and a second electronic component mounting board arranged so that component mounting surfaces face each other, and the first electronic component mounting board is provided. An electronic device in which a potting material is disposed so as to be in contact with the first electronic component mounted on the component mounting surface of the electronic component mounting substrate, and on the component mounting surface of the second electronic component mounting substrate A concave member disposed between the first electronic component mounting substrate and the second electronic component mounting substrate with the opening facing, wherein the potting material is in contact with an outer peripheral surface of the concave member; The second electronic component mounting board is arranged such that the second electronic component mounted on the component mounting surface of the second electronic component mounting board is positioned in the concave portion of the concave member. Has been placed.

  In addition, an electronic device according to the present invention includes a casing that surrounds sides of the first electronic component mounting board and the second electronic component mounting board, and the first electronic component mounting board and the second electronic device. The component mounting boards are respectively fixed to the casing.

  Furthermore, in the electronic device according to the present invention, either one of the casing and the concave member is provided with either one of the engaging portion and the engaged portion, and the other of the casing and the concave member is engaged. And the other of the engaged parts are provided, and the concave member is positioned with respect to the first electronic component mounting board by the engagement of the engaging part with the engaged part.

  Further, in the electronic device according to the present invention, the first electronic component mounting board and the second electronic component mounting board electrically connect the first electronic component mounting board and the second electronic component mounting board to each other. Are fixed to connection terminals to be connected to each other.

  In the electronic device according to the present invention, the concave member is formed of an insulating resin.

  Furthermore, in the electronic device according to the present invention, the concave member has the first electronic component in a state where the concave member is disposed between the first electronic component mounting substrate and the second electronic component mounting substrate. An extending portion is provided that extends along the component mounting surface of the first electronic component mounting substrate so as to cover at least a part of the portion facing the second electronic component mounting substrate.

  In addition, a power supply device according to the present invention includes any one of the electronic devices described above.

  Moreover, the manufacturing method of the electronic device according to the present invention includes the first electronic component mounting substrate and the second electronic component mounting substrate arranged so that the component mounting surfaces face each other, and the first electronic component An electronic device manufacturing method for manufacturing an electronic device in which a potting material is disposed so as to be in contact with the first electronic component mounted on the component mounting surface of the mounting substrate, the first electronic component mounting substrate A first step of disposing a concave member with the opening facing upward; and a second step of potting the potting material so as to contact the outer peripheral surface of the first electronic component and the outer peripheral surface of the concave member And a third step of disposing the second electronic component mounting substrate so that the second electronic component mounted on the component mounting surface of the second electronic component mounting substrate is positioned in the recess of the concave member. In this order To run.

  Moreover, the manufacturing method of the electronic device according to the present invention includes the first electronic component mounting substrate and the second electronic component mounting substrate arranged so that the component mounting surfaces face each other, and the first electronic component An electronic device manufacturing method for manufacturing an electronic device in which a potting material is disposed so as to be in contact with a first electronic component mounted on the component mounting surface of a mounting board, the outer periphery of the first electronic component A step of potting the potting material in contact with the surface; B step of disposing a concave member on the first electronic component mounting substrate with the opening facing upward so as to contact the potting material; C step of arranging the second electronic component mounting substrate in this order so that the second electronic component mounted on the component mounting surface of the electronic component mounting substrate of 2 is positioned in the recess of the concave member. Execute .

  In the electronic device according to the present invention, the concave shape disposed between the first electronic component mounting substrate and the second electronic component mounting substrate with the opening facing the component mounting surface of the second electronic component mounting substrate. And a second electronic component mounted on the component mounting surface of the second electronic component mounting board is disposed in the concave portion of the concave member. positioned. In addition, a power supply device according to the present invention includes the electronic device described above.

  Therefore, according to the electronic device and the power supply device of the present invention, the potting material is disposed so as to be at least partially buried in the potting material potted to a sufficient thickness without reducing the thickness of the potting material. Since the second electronic component is sufficiently close to the component mounting surface of the first electronic component mounting board by the amount of the second electronic component positioned in the concave portion of the concave member, the first electronic As a result of the sufficiently small distance between the component mounting board and the second electronic component mounting board, it is possible to provide a sufficiently miniaturized electronic device (power supply device). In addition, it is possible to provide an electronic device (power supply device) in which the first electronic component and the like are suitably sealed with a potting material having a sufficient thickness.

  The electronic device according to the present invention further includes a casing that encloses the sides of the first electronic component mounting board and the second electronic component mounting board, and the first electronic component mounting board and the second electronic component mounting board are provided. Each is fixed to the casing. In addition, a power supply device according to the present invention includes the electronic device described above.

  Therefore, according to the electronic device and the power supply device according to the present invention, the first electronic component prior to potting the potting material on the component mounting surface of the first electronic component mounting board when the electronic device (power supply device) is manufactured. By fixing the mounting substrate to the casing, the first electronic component mounting substrate and the casing surrounding the side of the first electronic component mounting substrate constitute a container body having an upper surface opening. As a result, potting material with sufficiently high fluidity can be potted, so that the potting material is spread over the surrounding details such as the first electronic component, and each electronic component is more suitably sealed. It can be.

  Furthermore, in the electronic device according to the present invention, either the casing or the concave member is provided with either the engaging portion or the engaged portion, and the other of the casing and the concave member is the engaging portion and the engaged portion. The other of the parts is provided, and the concave member is positioned with respect to the first electronic component mounting board by the engagement of the engaging part with the engaged part. In addition, a power supply device according to the present invention includes the electronic device described above.

  Therefore, according to the electronic device and the power supply device according to the present invention, the first concave member is hardened before the potting material potted on the component mounting surface of the first electronic component mounting board is cured during the manufacture of the electronic device (power supply device). As a result of preferably avoiding movement with respect to the electronic component mounting substrate, a defective product in which the positional relationship between the second electronic component positioned in the concave portion and the concave member has an unexpected positional relationship is manufactured. Therefore, a favorable electronic device (power supply device) can be provided.

  In the electronic device according to the present invention, the first electronic component mounting board and the second electronic component mounting board are respectively fixed to connection terminals that electrically connect the electronic component mounting boards to each other. In addition, a power supply device according to the present invention includes the electronic device described above.

  Therefore, according to the electronic apparatus and the power supply device according to the present invention, both electronic component mountings can be performed simply by performing an operation of electrically connecting the first electronic component mounting substrate and the second electronic component mounting substrate (soldering operation). The fixing of the substrate can be completed.

  In the electronic apparatus according to the present invention, the concave member is formed of an insulating resin. In addition, a power supply device according to the present invention includes the electronic device described above.

  Therefore, according to the electronic device and the power supply device of the present invention, the first electronic component mounted on the first electronic component mounting board and the second electronic positioned near the first electronic component. The insulation between the components can be sufficiently improved.

  Furthermore, in the electronic device according to the present invention, the first electronic component is opposed to the second electronic component mounting board in a state of being disposed between the first electronic component mounting board and the second electronic component mounting board. An extending portion that extends along the component mounting surface of the first electronic component mounting board is provided in the concave member so as to cover at least a part of the portion. In addition, a power supply device according to the present invention includes the electronic device described above.

  Therefore, according to the electronic device and the power supply device according to the present invention, the insulation distance between the first electronic component and the second electronic component is extended by the presence of the extending portion. The insulation between the two electronic components can be further improved.

  In the method for manufacturing an electronic device according to the present invention, a first step of disposing a concave member on the first electronic component mounting substrate with the opening facing upward, an outer peripheral surface of the first electronic component, and The second step of potting the potting material so as to contact the outer peripheral surface of the concave member, and the second electronic component mounted on the component mounting surface of the second electronic component mounting board are positioned in the concave portion of the concave member And the third step of arranging the second electronic component mounting board in this order.

  Therefore, when the concave member is disposed after the potting material is potted, the potting material that is avoided by the concave member may cause a rising portion of the potting material around the concave member. According to the method for manufacturing an electronic device according to the above, by executing the first step prior to the second step, it is possible to suitably avoid a situation in which the above-described swelled portion of the potting material is generated.

  Further, in the method for manufacturing an electronic device according to the present invention, the step A of potting the potting material so as to contact the outer peripheral surface of the first electronic component, and the concave member disposed with the opening facing upward so as to contact the potting material. B step for providing, and C step for arranging the second electronic component mounting substrate so that the second electronic component mounted on the component mounting surface of the second electronic component mounting substrate is positioned in the concave portion of the concave member; Are executed in this order.

  Therefore, according to the method for manufacturing an electronic device according to the present invention, the concave member is not present on the first electronic component mounting substrate when potting material is potted on the component mounting surface of the first electronic component mounting substrate. Therefore, it is possible to suitably avoid a situation where the potting material is accidentally potted in the concave portion of the concave member.

It is a top view of the power supply device 1 in the state which removed the cover body 2b. It is the sectional view on the AA line in FIG. It is the BB sectional view taken on the line in FIG. It is CC sectional view taken on the line in FIG. 3 is an external perspective view of a concave member 6. FIG. FIG. 4 is an external perspective view of a part of a frame body 2a and a concave member 6. FIG. 5 is an explanatory diagram for explaining a method for manufacturing the power supply device 1. FIG. 10 is another explanatory diagram for explaining a method for manufacturing the power supply device 1. FIG. 10 is still another explanatory diagram for describing a method for manufacturing power supply device 1. FIG. 10 is still another explanatory diagram for describing a method for manufacturing power supply device 1. FIG. 2 is a cross-sectional view taken along a line DD in FIG. 1 (an explanatory diagram for explaining insulation between electronic components 22 and 23). It is explanatory drawing for demonstrating the other manufacturing method of the power supply device. It is sectional drawing of the conventional power module 1x.

  Embodiments of an electronic device, a power supply device, and an electronic device manufacturing method will be described below with reference to the accompanying drawings.

  A power supply device (power module) 1 shown in FIGS. 1 to 4 is an example of a “power supply device” configured to include an “electronic device”, and includes a casing 2, connection terminals 3, mounting boards 4 and 5, and a concave member. 6 and a potting material 7.

  As shown in FIGS. 2 to 4, the casing 2 includes a frame body 2 a and a lid body 2 b.

  The frame body 2a is an example of a “casing”, and as shown in FIGS. Is formed. The frame body 2a is formed with a terminal fixing portion 11 to which a plurality of connection terminals 3, 3,. The frame 2a is formed with positioning claws 12 (see FIGS. 1 and 4) for positioning the mounting position of the mounting substrate 4 as described later. Further, as shown in FIGS. 3 and 6, the frame body 2 a is formed with an engaged portion 13 (an example of an “engaged portion”) having an engagement hole H for positioning the concave member 6. Yes. The lid 2b is formed in a square plate shape in plan view with an insulating material such as an insulating resin so that one of both openings in the frame 2a can be closed.

  In this case, in the power supply device 1 of this example, the engaged portion (engagement hole or engagement recess) formed in the upper edge portion (the edge portion on the opposite side to the side on which the mounting substrate 4 is attached) of the frame 2a. : The frame 2a is fixed to the lid 2b by engaging an engaging portion (engaging claw: not shown) formed on the lower edge of the lid 2b with the lid 2b. Is adopted. Although illustration is omitted, for example, a “potting material” is disposed on a component mounting surface Fc (a surface opposite to the mounting substrate 4 side) of the mounting substrate 5 to be described later, and the component mounting surface Fc is placed on the “potting material”. The cover 2b can be made unnecessary by covering with "".

  The connection terminal 3 is press-fitted and fixed to the terminal fixing portion 11 of the frame 2 a in the casing 2. The connection terminal 3 functions as a connection tool for connecting each wiring pattern (not shown) of the mounting boards 4 and 5 to an external device (circuit board of a device to which the power supply device 1 is connected: not shown). Further, as described later, the connection terminal 3 functions as a fixing member that fixes the mounting substrate 4 to the frame 2a by being soldered to a wiring pattern formed on the mounting substrate 4 (fixed to the terminal fixing portion 11). An example of a configuration in which the mounting substrate 4 is fixed to the frame body 2a through each of the connection terminals 3). Furthermore, the connection terminal 3 functions as a fixing member for fixing the mounting substrate 5 to the frame body 2a by being soldered to a wiring pattern formed on the mounting substrate 5 (each connection terminal fixed to the terminal fixing portion 11). 3 is an example of a configuration in which the mounting substrate 5 is fixed to the frame 2a through 3).

  The mounting substrate 4 is a single-sided mounting substrate that is an example of a “first electronic component mounting substrate”. As an example, the mounting substrate 4 is formed on an insulating film (not shown) formed on one surface of a flat plate made of aluminum or the like. A wiring pattern (not shown) is formed. As shown in FIGS. 2 to 4, various “electronic components” such as the electronic component 21 and the electronic component 22 are mounted on the wiring pattern forming surface (component mounting surface Fa) of the mounting substrate 4.

  In each drawing referred to in this specification, illustration of the layer structure of the mounting substrate 4 and illustration of electronic components other than the electronic components 21 and 22 are omitted for easy understanding of the configuration of the power supply device 1. ing. Further, the mounting substrate 4 is formed with a notch 4a (see FIGS. 1 and 4) in which the positioning claw portion 12 of the frame 2a in the casing 2 can be engaged.

  The mounting substrate 5 is a double-sided mounting substrate that is an example of a “second electronic component mounting substrate”. As an example, wiring patterns (not shown) are provided on both front and back surfaces of a flat plate formed of glass epoxy material or the like. Is formed. In addition, the mounting substrate 5 is formed on both front and back surfaces, on which various “electronic components” such as the electronic component 23 are mounted on one forming surface (component mounting surface Fb) of both wiring patterns formed on both front and back surfaces. Various “electronic components” are also mounted on the other formation surface (component mounting surface Fc) of both wiring patterns.

  In each drawing referred to in this specification, illustration of the layer structure of the mounting substrate 5 and illustration of electronic components other than the electronic component 23 are omitted in order to facilitate understanding of the configuration of the power supply device 1. .

  In this case, in the power supply device 1 of this example, the component mounting surface Fa on the mounting substrate 4 and the component mounting surface Fb on the mounting substrate 5 correspond to “component mounting surfaces”, and both the component mounting surfaces Fa and Fb face each other. Thus, the mounting substrates 4 and 5 are arranged. In the power supply device 1 of this example, the electronic component 22 mounted on the component mounting surface Fa of the mounting substrate 4 corresponds to a “first electronic component”. Furthermore, in the power supply device 1 of this example, the electronic component 23 mounted on the component mounting surface Fb of the mounting substrate 5 corresponds to a “second electronic component”.

  The concave member 6 is an example of a “concave member”, and is formed in a concave shape by an insulating material such as an insulating resin, as shown in FIGS. The concave member 6 includes a concave portion 31a (the main body portion of the electronic component 23 mounted on the mounting substrate 5 is positioned (inserted: accommodated) “recessed portion”: see FIGS. 2 and 10), and the concave portion 31b. An opening portion ("recessed portion": see FIG. 3) in which the lead wire 23a of the electronic component 23 mounted on the mounting substrate 5 is positioned (inserted: accommodated) is formed on the component mounting surface Fb of the mounting substrate 5. It is arranged between the mounting substrates 4 and 5 in the state of being directed.

  As shown in FIGS. 5 and 6, the concave member 6 can be engaged with the engaged portion 13 of the frame 2a (insertable into the engaging hole H of the engaged portion 13). 32 (an example of an “engagement portion”) is formed. Further, the recessed member 6 is formed with an extending portion 33 that is an example of an “extending portion”. Note that the function of the extending portion 33 (effects and the like achieved by the extending portion 33) will be specifically described later.

  The potting material 7 is an example of a “potting material”, and a “insulating layer” and / or a “potting material” is obtained by potting and hardening a fluid resin such as an epoxy resin or a silicon resin on the component mounting surface Fa of the mounting substrate 4. It is formed so as to function as a “component fixing layer (sealing layer)”. In this case, in the power supply device 1 of this example, as an example, not only “the vicinity region of the electronic component 22 on the component mounting surface Fa” but also the entire region of the component mounting surface Fa on the mounting substrate 4 (except for the mounting location of the electronic component). A layer of the potting material 7 is formed so as to cover the surface. Moreover, in the power supply device 1 of this example, the layer of the potting material 7 is formed so that it may contact | connect the site | part (at least one part of an outer peripheral surface) near the bottom part of the outer peripheral surface in the concave member 6. FIG.

  When manufacturing the power supply device 1, first, the connection terminal 3 is press-fitted and fixed to the terminal fixing portion 11 of the frame 2 a of the casing 2. Further, the mounting substrate 4 is manufactured by mounting the electronic components 21 and 22 on the component mounting surface Fa. Further, the mounting substrate 5 is manufactured by mounting the electronic components 23 and the like on the component mounting surfaces Fb and Fc, respectively.

  Next, as shown in FIG. 7, the mounting board 4 is positioned at the lower end of the frame 2a with the component mounting surface Fa facing upward. At this time, as shown in FIG. 4, the positioning claw portions 12 of the frame body 2a are engaged with the notches 4a of the mounting board 4, thereby mounting the mounting board 4 on the frame body 2a (mounting board). 4), the frame 2a is attached to the frame 2a. As shown in FIG. 7, various electronic components such as the electronic components 21 and 22 mounted on the component mounting surface Fa of the mounting substrate 4 are located in the frame 2a.

  Subsequently, the lower end portions of the connection terminals 3, 3... Fixed to the terminal fixing portion 11 of the frame body 2a are soldered to the wiring pattern formed on the component mounting surface Fa of the mounting substrate 4. As a result, each of the connection terminals 3, 3... Is electrically connected to the wiring pattern of the mounting substrate 4, and the mounting substrate 4 is framed via the connection terminals 3 fixed to the terminal fixing portion 11. It will be in the state fixed to 2a.

  In the power supply device 1 of this example, the mounting substrate 4 is fixed to the frame body 2a by soldering the connection terminals 3 to the wiring pattern formed on the component mounting surface Fa. Alternatively (or in addition to such a configuration), a configuration in which the mounting substrate 4 is fixed to the frame body 2a using an adhesive, a fixing screw, or the like (not shown) may be employed.

  Next, as shown in FIG. 8, the concave member 6 is disposed in the vicinity of the electronic component 22 on the mounting substrate 4 with the openings of the concave portions 31 a and 31 b facing upward (execution of the “first step”). Specifically, with the openings of the recesses 31a and 31b facing upward, the engagement portion 32 is engaged with the engagement hole H in the engaged portion 13 of the frame body 2a so that the top of the mounting substrate 4 can be engaged. The concave member 6 is installed in As a result, the concave member 6 is disposed in the vicinity of the electronic component 22 as shown in FIG.

  Subsequently, as shown in FIG. 9, the potting material 7 is potted on the component mounting surface Fa of the mounting substrate 4 (execution of the “second step”). At this time, in the manufacturing method of this example, as an example, the entire region of the component mounting surface Fa of the mounting substrate 4 fixed to the frame 2a is covered with the potting material 7, and the electronic components 21 and 22 are used. The potting material 7 is potted so that the surface (upper surface) of a high-profile “electronic component” is exposed from the potting material 7.

  Thereby, the soldering part between the connection terminal 3 and the wiring pattern, the soldering part to the wiring pattern such as the electronic components 21 and 22, the wiring pattern formed on the component mounting surface Fa, and the like are covered with the potting material 7. . Further, the potting material 7 is in contact with a part of the outer peripheral surface of the concave member 6 positioned with respect to the frame body 2a by the engagement of the engaging portion 32 with the engaged portion 13 (that is, the concave member 6 A part of which is buried in the potting material 7). Thus, when the potting material 7 is cured, the concave member 6 is fixed to the frame body 2 a and the mounting substrate 4 by the potting material 7.

  Next, as shown in FIG. 10, the mounting board 5 is fixed to the lid 2b with the component mounting surface Fb facing downward (execution of “third step”). In this case, first, the main body of the electronic component 23 (an example of “second electronic component mounted on the second electronic component mounting substrate”) mounted on the component mounting surface Fb of the mounting substrate 5 is concave. The mounting substrate 5 is placed on the terminal fixing portion 11 of the frame 2a so that the lead wire 23a of the electronic component 23 is positioned in the recess 31a of the member 6 and the lead wire 23a of the electronic component 23 is positioned in the recess 31b. The “third step” is preferably started when the potting material 7 potted in the “second step” is cured.

  Next, each of the connection terminals 3, 3... Fixed to the terminal fixing portion 11 is soldered to a wiring pattern formed on the component mounting surface Fc of the mounting substrate 5. As a result, the connection terminals 3, 3... Are electrically connected to the wiring pattern of the mounting substrate 5, and the mounting substrate 5 is attached to the frame 2 a via the connection terminals 3 fixed to the terminal fixing portion 11. The mounting substrates 4 and 5 are positioned in a state where the component mounting surface Fa of the mounting substrate 4 and the component mounting surface Fb of the mounting substrate 5 face each other.

  Further, in the power supply device 1 of this example, when the “third process” is completed, the upper edge portion of the concave member 6 is in contact with the component mounting surface Fb of the mounting substrate 5. Thereby, the electronic component 23 mounted on the component mounting surface Fb is covered with the concave member 6 and is suitably insulated from the surroundings. Although the example in which the upper edge portion of the concave member 6 is in contact with the component mounting surface Fb of the mounting substrate 5 at the time when the “third step” is completed has been described, the electronic component 23 is preferably used from the periphery. A configuration in which the upper edge portion of the concave member 6 is not in contact with the component mounting surface of the mounting substrate 5 may be employed as long as it is insulated.

  In the power supply device 1 of the present example, the mounting substrate 5 is fixed to the frame body 2a by soldering the wiring pattern formed on the component mounting surface Fc to the connection terminal 3. Alternatively (or in addition to such a configuration), a configuration in which the mounting substrate 5 is fixed to the frame body 2a using an adhesive, a fixing screw, or the like (not shown) may be employed. Thereafter, the cover 2b is attached to the frame 2a so as to cover the component mounting surface Fc of the mounting substrate 5, thereby completing the power supply device 1 as shown in FIGS.

  In the power supply device 1, as shown in FIG. 11, the main body portion and the lead wire of the electronic component 23 are provided in the concave portions 31 a and 31 b of the concave member 6 disposed in the vicinity of the electronic component 22 between the mounting substrates 4 and 5. 23a is located. In addition, the concave member 6 covers the component mounting surface Fa (that is, one surface facing the component mounting surface Fb of the mounting substrate 5) of the electronic component 22 (in the electronic component 22) (that is, the surface facing the component mounting surface Fb). The upper surface of the electronic component 22 mounted on the component mounting surface Fa) and an extending portion 33 extended along the component mounting surface Fb of the mounting substrate 5 are provided.

  In this case, in the power supply device 1 of this example in which the electronic component 23 is located in the concave portions 31a and 31b of the concave member 6 disposed in the vicinity of the electronic component 22, the separation distance between the electronic components 22 and 23 is very large. It is getting shorter. For this reason, in the power supply device 1 of this example, the structure which improves the insulation between the electronic components 22 and 23 is provided by providing the extension part 33 in the concave member 6 in which the electronic component 23 is located. .

  Specifically, unlike the concave member 6 in the power supply device 1 of this example, when a “concave member” that does not include the extending portion 33 is adopted, the sum of the distance La and the distance Lb shown in FIG. Is the insulation distance between the electronic components 22 and 23. Even when the “concave member” having such a configuration is employed, the distance L0, which is the insulation distance of the electronic components 22 and 23 in the configuration not including the “concave member”, is the sum of the distance La and the distance Lb. However, depending on the potential difference generated between the electronic components 22 and 23, sufficient insulation may not be ensured.

  On the other hand, in the power supply device 1 of the present example, since the concave member 6 includes the extending portion 33, the distance L1 and the distance L2 that are sufficiently longer than the sum of the distance La and the distance Lb are provided. The sum is the insulation distance of the electronic components 22 and 23. Therefore, the insulation between the electronic components 22 and 23 is sufficiently improved as compared with the case where a “concave member” that does not include the extending portion 33 is employed.

  As described above, the power supply device 1 includes the concave member 6 disposed between the mounting substrates 4 and 5 with the opening facing the component mounting surface Fb of the mounting substrate 5, and the outer periphery of the concave member 6. The potting material 7 is disposed so as to be in contact with the surface, and the electronic component 23 mounted on the component mounting surface Fb of the mounting substrate 5 is located in the recesses 31 a and 31 b of the recessed member 6.

  Therefore, according to the power supply device 1, the concave member 6 disposed so as to be at least partially buried in the potting material 7 potted to a sufficient thickness without reducing the thickness of the potting material 7. Since the electronic component 23 is sufficiently brought close to the component mounting surface Fa of the mounting substrate 4 by the amount of the electronic component 23 positioned in the recesses 31a and 31b, the separation distance between the mounting substrates 4 and 5 is sufficient. As a result, the power supply device 1 that is sufficiently miniaturized can be provided. Further, it is possible to provide the power supply device 1 in which the electronic components 21 and 22 are suitably sealed by the potting material 7 having a sufficient thickness.

  In addition, the power supply device 1 includes a frame body 2a (casing) that surrounds the sides of the mounting boards 4 and 5, and the mounting boards 4 and 5 are fixed to the frame body 2a via the connection terminals 3, respectively. .

  Therefore, according to the power supply device 1, the mounting substrate 4 is fixed to the frame body 2 a prior to potting the potting material 7 on the component mounting surface Fa of the mounting substrate 4 when the power supply device 1 is manufactured. A container body having an upper surface opening is configured by the substrate 4 and the frame body 2 a surrounding the side of the mounting substrate 4. Thereby, since the potting material 7 with sufficiently high fluidity can be potted, the potting material 7 is distributed over the details around the electronic components such as the electronic components 21 and 22 and each electronic component is more suitably used. It can be set as the sealed state.

  Furthermore, in this power supply device 1, the engaged portion 13 is provided on the frame body 2 a, and the engaging portion 32 is provided on the concave member 6, and the engagement of the engaging portion 32 with the engaged portion 13 allows The concave member 6 is positioned with respect to the mounting substrate 4 fixed to the frame 2a.

  Therefore, according to the power supply device 1, it is preferable that the concave member 6 moves with respect to the mounting substrate 4 before the potting material 7 potted on the component mounting surface Fa of the mounting substrate 4 is cured at the time of manufacturing the power supply device 1. As a result, a defective product in which the positional relationship between the electronic component 23 positioned in the recesses 31a and 31b and the recessed member 6 has an unexpected positional relationship is not manufactured. 1 can be provided.

  Moreover, in this power supply device 1, the concave member 6 is formed of an insulating resin.

  Therefore, according to the power supply device 1, it is possible to sufficiently improve the insulation between the electronic component 22 mounted on the mounting substrate 4 and the electronic component 23 positioned in the vicinity of the electronic component 22. .

  Further, in the power supply device 1, the component mounting surface Fa of the mounting substrate 4 is covered so as to cover at least a part of the facing portion of the electronic component 22 facing the mounting substrate 5 in a state of being disposed between the mounting substrates 4 and 5. An extending portion 33 extending along the concave member 6 is provided.

  Therefore, according to the power supply device 1, since the insulation distance between the electronic components 22 and 23 is extended due to the presence of the extending portion 33, the insulation between the electronic components 22 and 23 can be further improved.

  Further, in the method for manufacturing the power supply device 1, the “first step” in which the concave member 6 is disposed on the mounting substrate 4 with the opening portion facing upward, the outer peripheral surface of the electronic component 22, and the outer periphery of the concave member 6. A “second step” in which the potting material 7 is potted so as to be in contact with the surface, and the mounting substrate 5 is disposed so that the electronic component 23 mounted on the mounting substrate 5 is positioned in the concave portion 31a of the concave member 6 Are performed in this order.

  Therefore, when the concave member 6 is disposed after the potting material 7 is potted, the potting material 7 that is avoided by the concave member 6 may cause a raised portion of the potting material 7 around the concave member 6. On the other hand, according to the method for manufacturing the power supply device 1, when the “first step” is performed prior to the “second step”, the above-described bulging portion of the potting material 7 is generated. It can be suitably avoided.

  The configuration of “electronic device”, “power supply device”, and “method for manufacturing electronic device” are not limited to the configuration of power supply device 1 and the method for manufacturing power supply device 1 described above. For example, prior to the “second step” in which the potting material 7 is potted on the component mounting surface Fa, the manufacturing is performed to perform the “first step” in which the concave member 6 is attached to the frame 2a to which the mounting substrate 4 is fixed. Although the method has been described, the power supply device 1 can also be manufactured according to the following manufacturing method.

  First, the mounting substrate 4 is fixed to the frame 2a as shown in FIG. 7 in the same manner as the above-described manufacturing method, and then the potting material 7 is potted on the component mounting surface Fa of the mounting substrate 4 as shown in FIG. (Execution of “step A”).

  In this case, as an example, the entire area of the component mounting surface Fa of the mounting board 4 fixed to the frame 2a is covered with the potting material 7, and a high-profile “electronic” such as the electronic components 21 and 22 is used. The potting material 7 is potted so that the surface (upper surface) of the “part” is exposed from the potting material 7. Further, in consideration of the presence of the concave member 6 to be disposed later, the amount of the potting material 7 to be potted at the position where the concave member 6 is disposed is slightly reduced. As a result, the soldering part between the connection terminal 3 and the wiring pattern, the soldering part to the wiring pattern such as the electronic components 21 and 22, the wiring pattern formed on the component mounting surface Fa, and the like are covered with the potting material 7. It becomes the state.

  Next, before the potting material 7 is cured, as shown in FIG. 9, the concave member 6 is disposed in the vicinity of the electronic component 22 on the mounting substrate 4 with the openings of the concave portions 31a and 31b facing upward (“ Execution of “B process”). Specifically, with the openings of the recesses 31a and 31b facing upward, the engagement portion 32 is engaged with the engagement hole H in the engaged portion 13 of the frame body 2a so that the top of the mounting substrate 4 can be engaged. The concave member 6 is installed in As a result, as shown in the figure, the concave member 6 is disposed in the vicinity of the electronic component 22, and the potting material 7 is in contact with a part of the outer peripheral surface of the concave member 6 (that is, in the potting material 7). The concave member 6 is fixed to the frame body 2 a and the mounting substrate 4 by the potting material 7.

  Subsequently, as shown in FIG. 10, the mounting board 5 is fixed to the lid 2 b with the component mounting surface Fb facing downward (execution of “C process”). In addition, since each process after this "C process" is the same as each process after the "3rd process" in the above-mentioned manufacturing method, detailed description is abbreviate | omitted. Thereby, as shown in FIGS. 1-4, the power supply device 1 is completed.

  As described above, in the method of manufacturing the power supply device 1 described above, the “step A” in which the potting material 7 is potted so as to be in contact with the outer peripheral surface of the electronic component 22, The mounting substrate 5 is arranged so that the electronic component 23 mounted on the component mounting surface Fb of the mounting substrate 5 is positioned in the concave portion 31a of the concave member 6 and the “B process” in which the concave member 6 is disposed in the vicinity of the component 22 The “C process” is performed in this order.

  Therefore, according to the method for manufacturing the power supply device 1, since the concave member 6 does not exist on the mounting substrate 4 when potting the potting material 7 on the component mounting surface Fa of the mounting substrate 4, the concave portions 31 a, The situation where the potting material 7 is potted in 31b can be suitably avoided.

  On the other hand, the example in which the potting material 7 is provided over the entire area of the component mounting surface Fa of the mounting substrate 4 has been described. However, the region where the potting material 7 is potted is not limited to this, and the electronic as “first electronic component” The potting material 7 can be disposed only in a partial region of the component mounting surface Fa so as to contact the component 22.

  Further, the engaged portion 13 is formed in the frame 2 a (casing), the engaging portion 32 is formed in the recessed member 6, and the recessed member 6 is positioned by the engagement of the engaging portion 32 with the engaged portion 13. However, instead of such a configuration, an “engaging portion” is formed in the “casing” and an “engaged portion” is formed in the “concave member”. It is also possible to employ a configuration in which the “concave member” is positioned by engaging the “engaging portion” with the “engaged portion” (not shown). Furthermore, instead of the configuration in which the “concave member” is positioned with respect to the “casing”, a configuration in which the “concave member” is positioned with respect to the “first electronic component mounting board” may be employed (not shown). ).

  In addition, a configuration in which the “first electronic component mounting substrate” and the “second electronic component mounting substrate” are fixed to the “casing” (in the above example, the connection terminal 3 fixed to the terminal fixing portion 11 of the casing 2 is The configuration is fixed to the casing 2 via the above example), but the “first electronic component mounting substrate” and the “second electronic component mounting substrate” are used regardless of whether or not the “casing” is provided. It is also possible to employ a configuration in which the “component mounting surfaces” are positioned facing each other by fixing both substrates to “connection terminals” that electrically connect the two to each other. By adopting such a configuration, both substrates can be fixed simply by performing an operation of electrically connecting the “first electronic component mounting substrate” and the “second electronic component mounting substrate” (soldering operation). Can be completed.

  Furthermore, although the power supply device 1 including the concave member 6 having the extending portion 33 which is an example of the “extending portion” has been described as an example, the “concave member” having no “extending portion” is described. It is also possible to configure an “electronic device (power supply device)”. In addition, the “electronic device” is not limited to the “power supply device” such as the power supply device 1, and various electronic devices including two or more electronic component mounting boards arranged so that the component mounting surfaces face each other. In the device, a configuration in which a “concave member” is provided in the same manner as the power supply device 1 described above can be employed.

DESCRIPTION OF SYMBOLS 1 Power supply device 2 Casing 2a Frame 2b Cover 3 Connection terminal 4,5 Mounting board 6 Concave member 7 Potting material 11 Terminal fixing part 13 Engaged part 22, 23 Electronic component 23a Lead wire 31a, 31b Recess 32 Engagement part 33 Extension part Fa, Fb Component mounting surface L1, L2, La, Lb Distance H Engagement hole

Claims (9)

A first electronic component mounting board and a second electronic component mounting board arranged so that the component mounting surfaces face each other, and the first electronic component mounting board mounted on the component mounting surface of the first electronic component mounting board An electronic device in which a potting material is disposed so as to be in contact with the electronic component of
A concave member disposed between the first electronic component mounting board and the second electronic component mounting board in a state in which an opening is directed to the component mounting surface of the second electronic component mounting board;
The potting material is disposed so as to contact the outer peripheral surface of the concave member,
The second electronic component mounting board is arranged such that the second electronic component mounted on the component mounting surface of the second electronic component mounting board is positioned in the concave portion of the concave member. machine. A casing that encloses the sides of the first electronic component mounting substrate and the second electronic component mounting substrate;
The electronic device according to claim 1, wherein the first electronic component mounting board and the second electronic component mounting board are respectively fixed to the casing.   Either one of the casing and the concave member is provided with one of an engaging portion and an engaged portion, and the other of the casing and the concave member is the other of the engaging portion and the engaged portion. The electronic apparatus according to claim 2, wherein the concave member is positioned with respect to the first electronic component mounting substrate by being provided and engaging the engaging portion with the engaged portion.   The first electronic component mounting board and the second electronic component mounting board are respectively fixed to connection terminals that electrically connect the first electronic component mounting board and the second electronic component mounting board to each other. The electronic device according to claim 1.   The electronic device according to claim 1, wherein the concave member is made of an insulating resin.   The concave member is opposed to the second electronic component mounting board of the first electronic component in a state of being disposed between the first electronic component mounting board and the second electronic component mounting board. The electronic device according to claim 5, wherein an extending portion is provided to extend along the component mounting surface of the first electronic component mounting substrate so as to cover at least a part of the portion.   The power supply device comprised including the electronic device in any one of Claim 1 to 6. A first electronic component mounting board and a second electronic component mounting board arranged so that the component mounting surfaces face each other, and the first electronic component mounting board mounted on the component mounting surface of the first electronic component mounting board An electronic device manufacturing method for manufacturing an electronic device in which a potting material is disposed so as to be in contact with the electronic component,
A first step of disposing a concave member with the opening facing upward on the first electronic component mounting substrate;
A second step of potting the potting material in contact with the outer peripheral surface of the first electronic component and the outer peripheral surface of the concave member;
A third step of disposing the second electronic component mounting substrate so that the second electronic component mounted on the component mounting surface of the second electronic component mounting substrate is positioned in the recess of the concave member; The manufacturing method of the electronic device which performs this in this order. A first electronic component mounting board and a second electronic component mounting board arranged so that the component mounting surfaces face each other, and the first electronic component mounting board mounted on the component mounting surface of the first electronic component mounting board An electronic device manufacturing method for manufacturing an electronic device in which a potting material is disposed so as to be in contact with the electronic component,
A step of potting the potting material in contact with the outer peripheral surface of the first electronic component;
B step of disposing a concave member on the first electronic component mounting substrate with the opening facing upward so as to contact the potting material;
C step of arranging the second electronic component mounting substrate so that the second electronic component mounted on the component mounting surface of the second electronic component mounting substrate is located in the recess of the concave member. The manufacturing method of the electronic device performed in order.

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