JP6805012B2 - Ultrasonic bonding device and its horn replacement notification device - Google Patents

Description

The present invention relates to an ultrasonic bonding device and its horn replacement notification device. Specifically, the ultrasonic bonding device and its horn are such that the heat flow from a bonding target portion is monitored by a heat flow sensor to notify the replacement due to deterioration of the horn. Regarding exchange notification device.

The ultrasonic bonding device joins a bonding target portion by applying ultrasonic vibration and a load to the bonding target portion.

Conventionally, as an ultrasonic bonding device that monitors the temperature of a bonding target portion in order to determine the quality of bonding of the bonding target portion by the ultrasonic bonding device, the one disclosed in Patent Document 1 is known.

The ultrasonic bonding apparatus disclosed in Patent Document 1 includes a thermo camera that measures the temperature distribution of an ultrasonically bonded electrode tab, and the temperature between the unbonded region and the ultrasonically bonded region of the electrode tab where the temperature distribution is measured. It has a calculation unit that calculates the ultrasonic bonding region of the electrode tab using the difference, and calculates the ultrasonic bonding region of the electrode tab from the temperature distribution of the ultrasonically bonded electrode tab. It is configured to inspect the bonding condition of.

Further, in Patent Document 1, the temperature distribution of the electrode tab is measured discretely by measuring the temperature of one place of the electrode tab using a temperature sensor composed of a thermocouple instead of the thermo camera, which is simple. There is a description that it is possible to judge the quality of ultrasonic bonding.

By the way, in the conventional ultrasonic bonding device, there is a problem that the bonding property (bonding strength) by the ultrasonic bonding device gradually decreases due to the lauret wear of the tip of the horn. In order to avoid this, conventional products have been used. A method was adopted in which a breaking test (strength measurement) was performed by sampling the ultrasonic vibration, and the set amplitude% of ultrasonic vibration was appropriately increased by human judgment so that the product did not meet the specified required strength. However, this method has a problem that it is very troublesome and unreliable.

Japanese Unexamined Patent Publication No. 2008-14252

Therefore, the present invention provides an ultrasonic bonding device and a horn replacement notification device thereof that can easily and surely notify replacement due to deterioration of a horn by monitoring the heat flow from a bonding target portion with a heat flow sensor. The purpose is to do.

In order to achieve the above object, in the invention of claim 1, a work including a joint target portion is placed on an anvil, a weight is applied to the joint target portion, and ultrasonic vibration is applied from an ultrasonic horn. An ultrasonic joining device for joining a joining target portion, which is provided at a position close to the joining target portion of the anvil, and a heat flow sensor that detects a heat flow from the joining target portion when joining the joining target portion. A peak value detecting means that monitors the detection output of the heat flow sensor and detects a peak heat flow value from the detection output of the heat flow sensor, and a setting of a peak heat flow value in which the peak heat flow value detected by the peak value detecting means is preset. If out of range, the in ultrasonic bonding device you comprising a notification means for notifying the exchange of the ultrasonic horn, and the peak heat flow value detected by the peak value detecting means is below a preset threshold In the case, the setting amplitude correction means for correcting the set amplitude value of the ultrasonic vibration so that the peak heat flow value returns to the initial peak heat flow value is provided, and the notification means is corrected by the set amplitude correction means. When the set amplitude value exceeds a preset upper limit value, the replacement of the ultrasonic horn is notified .

The invention of claim 2 is the invention of claim 1 , wherein the set amplitude correction means is
When the average value of the peak heat flow values for joining a predetermined number of times falls below the threshold value, the above is based on the ratio of the increase in the set amplitude value to the average value of the peak heat flow values increased by the increase in the set amplitude value. A set amplitude value for returning to the initial peak heat flow value is determined, and the set amplitude value is corrected by the determined set amplitude value.

In the invention of claim 1 or 2 , when the peak heat flow value returns to the initial peak heat flow value by the correction of the set amplitude value by the set amplitude correction means, the joining is continued. When the peak heat flow value does not return to the initial peak heat flow value due to the correction of the set amplitude value by the set amplitude correction means, the replacement of the ultrasonic horn is notified by the notification means.

The invention of claim 4 is the invention of any one of claims 1 to 3 , wherein the ultrasonic horn applies lateral ultrasonic vibration parallel to the bonding target portion. ..

The invention of claim 5 is the invention of any one of claims 1 to 3 , wherein the ultrasonic horn applies ultrasonic vibration in a vertical direction perpendicular to the joint target portion. ..

In the invention of claim 6 , a work including a joining target portion is placed on an anvil, a load is applied to the joining target portion, and ultrasonic vibration is applied from an ultrasonic horn to join the joining target portion. A heat flow sensor and a heat flow sensor, which are horn replacement notification devices of the joining device and are provided at a position close to the joining target portion of the anvil and detect heat flow from the joining target portion when the joining target portion is joined. The peak value detecting means for monitoring the detection output of the above and detecting the peak heat flow value from the detection output of the heat flow sensor and the peak heat flow value detected by the peak value detecting means deviate from the preset peak heat flow value setting range. If the said at horn replacement notification device to that ultrasonic bonding apparatus comprising: a notification means, the notifying the exchange of the ultrasonic horn, a threshold the peak heat flow value preset detected by the peak value detecting means When it falls below the peak heat flow value, the set amplitude correction means for correcting the set amplitude value of the ultrasonic vibration so that the peak heat flow value returns to the initial peak heat flow value is provided, and the notification means is provided with the set amplitude correction means. When the set amplitude value corrected by the above exceeds a preset upper limit value, the replacement of the ultrasonic horn is notified.

According to the present invention, a work including a joint target portion is placed on an anvil, a load is applied to the joint target portion, and ultrasonic vibration is applied from an ultrasonic horn to join the joint target portion. A device, which is provided at a position close to the joining target portion of the anvil, monitors a heat flow sensor that detects heat flow from the joining target portion when joining the joining target portion, and monitors the detection output of the heat flow sensor. When the peak value detecting means for detecting the peak heat flow value from the detection output of the heat flow sensor and the peak heat flow value detected by the peak value detecting means deviate from the preset peak heat flow value setting range, the above When the peak heat flow value detected by the peak value detecting means falls below a preset threshold value in the ultrasonic joining device including the notification means for notifying the replacement of the sound horn, the peak heat flow value is the initial value. A set amplitude correction means for correcting the set amplitude value of the ultrasonic vibration so as to return to the peak heat flow value is provided, and the notification means has a preset upper limit of the set amplitude value corrected by the set amplitude correction means. Since it is configured to notify the replacement of the ultrasonic horn when the value is exceeded, it is possible to easily and surely notify the deterioration of the horn by a simple configuration.

FIG. 1 is a diagram showing an outline of Example 1 of an ultrasonic bonding device according to the present invention. FIG. 2 is a cross-sectional view and a top view showing details of the heat flow sensor fixed structure used in the ultrasonic bonding apparatus shown in FIG. FIG. 3 is a top view showing details of other configurations of the anvil used in the ultrasonic bonding apparatus shown in FIG. 1 and a sectional view thereof AA. FIG. 4 is a front view of the anvil with the second member shown in FIG. 3 removed. FIG. 5 is a diagram illustrating a horn deterioration state of the ultrasonic bonding apparatus shown in FIG. FIG. 6 is a graph showing an output example of the heat flow sensor when the horn is normal and when the knurl is deteriorated. FIG. 7 is a flowchart showing an example of horn replacement notification processing in the ultrasonic bonding apparatus shown in FIG. FIG. 8 is a diagram showing an outline of Example 2 of the ultrasonic bonding device according to the present invention.

Hereinafter, examples for carrying out the present invention will be described in detail with reference to the attached drawings.

FIG. 1 is a diagram showing an outline of Example 1 of an ultrasonic bonding device according to the present invention.

In FIG. 1, in the ultrasonic bonding apparatus 100 of the first embodiment according to the present invention, a work 30 including a bonding target portion 33 is placed on an anvil 20 fixed to a pedestal 10, and the bonding target portion 33 of the work 30 is placed. By applying a load from a weighting device (not shown) and applying ultrasonic vibration from the head 41 at the tip of the ultrasonic horn (hereinafter, simply referred to as a horn) 40, the work 30 is joined to the bonding target portion 33, that is, the work 31. The work 31 and the work 32 are joined at the surface in contact with the work 32.

The horn 40 is connected to an ultrasonic oscillator (hereinafter, simply referred to as an oscillator) 60 via a cone 50, and the ultrasonic vibration of the oscillator 60 is controlled by an ultrasonic oscillator 70. Here, the ultrasonic vibration applied from the head 41 of the horn 40 to the joining target portion 33 of the work 30 is a vibration in the lateral direction X parallel to the joining target portion 33. This ultrasonic bonding using ultrasonic vibration in the lateral direction X is suitable for, for example, metal-to-metal bonding, plastic welding bonding, particularly welding bonding of thin plastic sheets or films.

In the ultrasonic bonding apparatus 100 of the first embodiment, heads 41 are provided at four locations around the tip of the horn 40 in order to facilitate knurling deterioration of the head 41 of the horn 40, which will be described later. By rotating the horn 40 by 90 degrees, it is configured to be able to handle four horn exchanges.

In the ultrasonic bonding apparatus 100 of the first embodiment, the heat flow sensor 83 monitors whether or not the bonding target portion 33 of the work 30 is bonded, and detects knurling deterioration of the head 41 of the horn 40.

The heat flow sensor 83 is a sensor that detects the flow rate and direction of thermal energy, and has significantly higher sensitivity to temperature changes than thermocouples widely used in conventional product development and evaluation, and dissipates heat and absorbs heat. It is possible to detect the heat flow in the direction of.

The heat flow sensor 83 is a well-known semiconductor heat flow sensor that outputs a voltage signal corresponding to the heat energy passing through the unit area per unit time, and the polarity of the voltage signal corresponds to the direction in which the heat energy passes, for example. , Bismus-Teruru heat flow sensor can be used.

In the ultrasonic bonding apparatus 100 of the first embodiment, the heat flow generated from the bonding target portion 33 at the time of bonding the bonding target portion 33 of the work 30 is a heat flow sensor fixed structure 80 embedded in the anvil 20 and shown in detail in FIG. It is monitored by the heat flow sensor 83 fixed by.

As shown in FIG. 2A, the heat flow sensor fixed structure 80 has a heat flow sensor 83 between the thin first high thermal conductivity material 81 and the thick second high thermal conductivity material 82. It has a structure that is fixed by sandwiching.

The heat flow sensor fixed structure 80 is arranged in a portion of the anvil 20 close to the joint target portion 33 of the work 30, and is a thin first high thermal conductivity material having a first step portion 81a on the peripheral edge. A second step extending from the first step 81a to the periphery of the 81, the heat flow sensor 83, and the portion of the first high thermal conductivity material 81 excluding the first step portion 81a. A plate-thick second high thermal conductivity material body 82 having a portion 82a and a second step portion 82a of the second high thermal conductivity material body 82 are provided on the peripheral edge of the first high thermal conductivity material body 81. The heat flow sensor 83 is subjected to the first high heat by screwing the heat insulating material body 84 to the second step portion 82a of the second high thermal conductivity material body 82 with the screw 85. It has a structure fixed between the conductive material body 81 and the second high thermal conductive material body 82.

Here, FIG. 2A shows the space between the heat insulating material body 84 and the heat flow sensor 83 and between the heat insulating material body 84 and the upright surface of the first step portion 81a of the first high thermal conductivity material body 81. As shown in, a gap is provided. This void is provided to reduce the heat diffusion to the heat insulating material body 84 as much as possible.

The first high thermal conductivity material body 81 and the second high thermal conductivity material body 82 can be formed by using a high thermal conductivity material body such as copper, aluminum, and graphite, and the heat insulating material body 84 is a resin. It can be formed using the heat insulating material of the system.

Further, as shown in FIG. 2B, the screws 85 are provided at the four corners of the heat flow sensor fixed structure 80, and the heat flow sensor 83 is made of a heat insulating material by the four screws 85 provided at the four corners. It is sandwiched and fixed between the first high thermal conductivity material body 81 and the second high thermal conductivity material body 82 via 84. The terminal 83a is for extracting the voltage signal output from the heat flow sensor 83.

According to such a configuration, the heat flow sensor 83 is sandwiched and fixed between the thin first high thermal conductivity material 81 and the thick second high thermal conductivity material 82, and the first one. Since the high thermal conductivity material body 81 and the second high thermal conductivity material body 82 are insulated by the heat insulating material body 84,
Damage due to pressurization from the outside of the heat flow sensor 83 can be prevented, and the heat flow from the first high thermal conductivity material 81 side can be detected with high accuracy.

The heat flow sensor fixed structure 80 having the above configuration can increase the temperature difference between the front and back surfaces of the heat flow sensor 83 and increase the detected value of the heat flow rate Q (W / m2) detected by the heat flow sensor 83. ..

That is, since the first high thermal conductivity material 81 of the heat flow sensor fixed structure 80 has a small volume and a small thickness, the heat generated at the joint target portion 33 does not diffuse to the surroundings, and the heat flow sensor 83 Heat can be efficiently collected on the surface. Further, since the second high thermal conductivity material body 82 has a large volume and a large thickness, the amount of heat that has passed through the heat flow sensor 83 is immediately radiated and diffused to the surroundings to prevent the temperature rise on the back surface side of the heat flow sensor 83. It works.

FIG. 3 is a top view showing details of other configurations of the anvil used in the ultrasonic bonding apparatus shown in FIG. 1 and a sectional view thereof AA. Further, FIG. 4 is a front view of the anvil 20 with the second member 22 shown in FIG. 3 removed.

In FIGS. 3 and 4, the anvil 20 in this case is composed of a first member 21 and a second member 22, and has a knurled work mounting surface 21a on the upper surface of the first member 21. The work mounting block 21b is detachably attached. Here, the work mounting block 21b is replaced when the knurled portion of the work mounting surface 21a deteriorates.

Further, the heat flow sensor 83 is mounted on the mounting surface of the first member 21 in the vicinity of the work mounting surface 21a and perpendicular to the work mounting surface 21a. Here, in the mounting of the heat flow sensor 83 on the mounting surface of the first member 21, the heat flow sensor 83 is pressed by the pressing plate 24, and the pressing plate 24 is fixed to the mounting surface of the first member 21 by the screws 25a and 25b. It is done by.

As the holding plate 24 for holding the heat flow sensor 33, a resin plate made of a highly heat-insulating and highly heat-resistant material can be used. A slit 22a is formed in the lower portion of the second member 22, and the output wiring of the heat flow sensor 83 is led out to the outside through the slit 22a.

As shown in FIG. 4A, a knurl 41a is formed on the lower surface of the head 41 of the horn 40 used in the ultrasonic bonding device 100 of the first embodiment, and the knurl 41a is ultrasonically bonded. It is known that repeated bonding by the device 100 causes wear as shown in FIG. 4 (B), and as a result, the bonding property of the bonding by the ultrasonic bonding device 100 is lowered.

FIG. 6 is a graph showing an output example of the heat flow sensor 83 when the horn is normal and when the knurl is deteriorated. As shown in FIG. 6A, when the lorlet of the head 41 of the horn 40 is in the initial state, the peak heat flow value detected by the heat flow sensor 83 is approximately 12 V, but when the lorette of the head 41 of the horn 40 is worn, As shown in FIG. 6B, the peak heat flow value detected by the heat flow sensor 83 is reduced to about 9 V, which reduces the bonding property of bonding by the ultrasonic bonding device 100. In FIG. 6, the value obtained by amplifying the mV voltage output from the heat flow sensor 83 is used.

Therefore, in the ultrasonic joining device 100 of the first embodiment, the output of the heat flow sensor 83 is monitored at the time of joining by the ultrasonic joining device 100, and the peak heat flow value detected by the heat flow sensor 83 sets a preset threshold value. If it falls below the set amplitude% of ultrasonic vibration (hereinafter referred to as the set amplitude value), it is automatically controlled so that the peak heat flow value detected by the heat flow sensor 83 returns to the initial peak heat flow value. This is done to prevent poor joining. For example, if the peak heat flow value is smaller than in the initial state, the bonding energy is also small and there is a correlation that the bonding strength is also reduced. In that case, increase the set amplitude value to increase the bonding energy and peak. Shift the heat flow value to the original value.

When the set amplitude value exceeds the preset upper limit value due to the shift according to the set amplitude value, the knurl 41a of the head 41 of the horn 40 is worn and it is time to replace the horn 40. It is configured to notify the exchange.

With such a configuration, it is possible to easily and surely notify the replacement of the horn 40, so that it is possible to surely prevent the ultrasonic bonding device 100 from deteriorating the bondability.

Here, the shift of the set amplitude value is not performed for each single bonding (1 shot) of the ultrasonic bonding device 100, but for each arbitrary number of shots, for example, every 100 shots. It is based on the average value of minutes.

The shift amount of the set amplitude value is configured so that an arbitrary value can be set, and a threshold value is determined in advance to determine whether to shift the set amplitude value, and when the average value of the peak heat flow values falls below the threshold value, the shift is performed. I do.

That is, the ratio of the set amplitude% of the increase and the average value of the increased peak heat flow value to the average value of the peak heat flow values of an arbitrary number of shots after the shift of the set amplitude value is calculated, and based on the data. To determine the set amplitude value that will be the initial peak heat flow value. After returning to the initial peak heat flow value (± several%), fix it at the set amplitude value and continue joining.

Then, when the shifted set amplitude value exceeds the upper limit of the shiftable set amplitude value, an alarm is issued to notify the replacement of the horn 40.

FIG. 7 is a flowchart showing an example of horn replacement notification processing in the ultrasonic bonding device 100 shown in FIG.

In FIG. 7, when this horn replacement notification process is started, the peak heat flow value is detected by the heat flow sensor 83 for each shot bonded by the ultrasonic bonding device 100 (step 701). Then, when the number of bondings by the ultrasonic bonding apparatus 100 reaches a predetermined number of times, for example, 100 shots, the average value of the peak heat flow values of the predetermined number of shots is obtained, and it is examined whether or not this average value is lower than the preset threshold value ( Step 702).

Here, if the average value of the peak heat flow values of the predetermined number of shots is not lower than the preset threshold value (NO in step 702), the process returns to step 701 and the detection of the peak heat flow value is continued.

If it is determined in step 702 that the average value of the peak heat flow values of the predetermined number of shots is below the preset threshold value (YES in step 702), the desired peak heat flow is based on the average value of the peak heat flow values of the predetermined number of shots. The correction value of the set amplitude value to be returned to the value is calculated (step 703). The calculation of the correction value of the set amplitude value to return to the desired peak heat flow value here is the average value of the set amplitude% of the increase and the increased peak heat flow value with respect to the average value of the peak heat flow values of the predetermined number of shots. The ratio is calculated, and the set amplitude value that becomes the initial peak heat flow value is calculated based on the data.

Then, the set amplitude value up to that point is shifted to the set amplitude value calculated in step 703 (step 704). Next, it is examined whether or not the peak heat flow value detected by the heat flow sensor 83 has returned to the initial peak heat flow value by shifting the set amplitude value (step 705). Here, when it is determined that the peak heat flow value has returned to the initial peak heat flow value (step 706), normal joining is possible. Therefore, the joining is continued with this set amplitude value (step 706), and this process is performed. To finish.

Further, if it is determined in step 705 that the peak heat flow value detected by the heat flow sensor 83 does not return to the initial peak heat flow value (NO in step 705), has the shifted set amplitude value exceeded the shiftable upper limit value? (Step 707), if the shiftable upper limit value is exceeded, it is determined that the horn 40 replacement time has been reached, horn replacement notification is performed (step 708), and this process is terminated. If it is determined in step 707 that the shifted set amplitude value does not exceed the shiftable upper limit value (in step 707), the process returns to step 703 and the correction value of the set amplitude value is recalculated.

In the first embodiment, the case where the ultrasonic vibration applied from the horn 40 to the joint target portion 33 of the work 30 is the vibration in the lateral direction X parallel to the joint target portion 33 is shown. The present invention can be similarly applied to the case where the ultrasonic vibration applied from the horn 40 to the joint target portion 33 of the work 30 is a vibration in the vertical direction Y perpendicular to the joint target portion 33. it can.

FIG. 8 is a diagram showing an outline of Example 2 of the ultrasonic bonding device according to the present invention. In the ultrasonic bonding device 200 shown in FIG. 6, the parts having the same functions as the ultrasonic bonding device 100 shown in FIG. 1 are designated by the same reference numerals for convenience of explanation, and detailed description thereof will be omitted.

In the ultrasonic bonding device 200 shown in FIG. 8, as shown in FIG. 8, a work 30 including a bonding target portion 33 is placed on an anvil 20 fixed to a pedestal 10, and the work 30 is placed on the bonding target portion 33 of the work 30. By applying a load from a weighting device (not shown) and applying ultrasonic vibration from the head 41 at the tip of the horn 40, the work 31 and the work 31 are joined on the surface where the work 31 and the work 32 are in contact with each other. It is joined to the work 32.

Here, in the ultrasonic bonding apparatus 200 of the second embodiment, vibration in the vertical direction Y perpendicular to the bonding target portion 33 is applied from the head 41 of the horn 40. This ultrasonic bonding using ultrasonic vibration in the longitudinal direction Y is suitable for, for example, fusion bonding to a resin.

Also in the ultrasonic bonding apparatus 200 of the second embodiment, the heat flow from the bonding target portion 33 of the work 30 is generated by the heat flow sensor 83 fixed by the heat flow sensor fixed structure 80 embedded in the anvil 20 and shown in detail in FIG. Be monitored.

Other configurations are the same as those of the ultrasonic bonding device 100 shown in FIG.

The present invention is not limited to the above-described embodiment, and many modifications can be made by ordinary creative abilities of those skilled in the art within the scope of the technical idea of the present invention.

Also in the ultrasonic bonding apparatus 200 of the second embodiment, the heat flow sensor 83 may be attached to the anvil 20 as shown in FIGS. 3 and 4.

The present invention is not limited to the above-described embodiment, and many modifications can be made by ordinary creative abilities of those skilled in the art within the scope of the technical idea of the present invention.

10 ... Pedestal 20 ... Anvil 21 ... First member 21a ... Work mounting surface 21b ... Work mounting block 22 ... Second member 24 ... Holding plate 30 ... Work 40 ... Horn 41 ... Head 50 ... Cone 60 ... Transducer 70 ... Ultrasonic oscillator 80 ... Heat flow sensor fixed structure 81 ... First high thermal conductivity material 82 ... Second high thermal conductivity material 83 ... Heat flow sensor 84 ... Insulation material 100 ... Ultrasonic bonding device 200 ... Ultrasonic bonding device

Claims (6)

An ultrasonic bonding device that places a work including a bonding target site on an anvil, applies a load to the bonding target site, and applies ultrasonic vibration from an ultrasonic horn to bond the bonding target site.
A heat flow sensor provided at a position close to the joining target portion of the anvil and detecting a heat flow from the joining target portion when joining the joining target portion,
A peak value detecting means that monitors the detection output of the heat flow sensor and detects the peak heat flow value from the detection output of the heat flow sensor.
If the peak heat flow value detected by the peak value detecting means is out of the setting range of the preset peak heat flow value, the the ultrasonic bonding device you comprising a notification means for notifying the exchange of the ultrasonic horn, the ,
When the peak heat flow value detected by the peak value detecting means falls below a preset threshold value, the set amplitude for correcting the set amplitude value of the ultrasonic vibration so that the peak heat flow value returns to the initial peak heat flow value. Correction means and
Equipped with
The notification means is
When the set amplitude value corrected by the set amplitude correction means exceeds a preset upper limit value, the replacement of the ultrasonic horn is notified.
An ultrasonic bonding device characterized by this . The set amplitude correction means
When the average value of the peak heat flow values for bonding a predetermined number of times is lower than the threshold value, the above is based on the ratio of the increase in the set amplitude value to the average value of the peak heat flow values increased by the increase in the set amplitude value. The ultrasonic bonding apparatus according to claim 1 , wherein a set amplitude value for returning to an initial peak heat flow value is determined, and the set amplitude value is corrected by the determined set amplitude value. When the peak heat flow value returns to the initial peak heat flow value due to the correction of the set amplitude value by the set amplitude correction means, the joining is continued.
When the peak heat flow value does not return to the initial peak heat flow value due to the correction of the set amplitude value by the set amplitude correction means, the replacement of the ultrasonic horn is notified by the notification means.
The ultrasonic bonding apparatus according to claim 1 or 2 . The ultrasonic horn
The ultrasonic bonding apparatus according to any one of claims 1 to 3 , wherein a lateral ultrasonic vibration parallel to the bonding target portion is applied. The ultrasonic horn
The ultrasonic bonding apparatus according to any one of claims 1 to 3, wherein ultrasonic vibration in a vertical direction perpendicular to the bonding target portion is applied. A horn replacement notification device for an ultrasonic bonding device that places a workpiece including a bonding target site on an anvil, applies a load to the bonding target site, and applies ultrasonic vibration from an ultrasonic horn to bond the bonding target site. And
A heat flow sensor provided at a position close to the joining target portion of the anvil and detecting a heat flow from the joining target portion when joining the joining target portion,
A peak value detecting means that monitors the detection output of the heat flow sensor and detects the peak heat flow value from the detection output of the heat flow sensor.
When the peak heat flow value detected by the peak value detecting means deviates from the preset range of the peak heat flow value, the notification means for notifying the replacement of the ultrasonic horn and the notification means.
In the horn replacement notification device of the ultrasonic bonding device you equipped with,
When the peak heat flow value detected by the peak value detecting means falls below a preset threshold value, the set amplitude for correcting the set amplitude value of the ultrasonic vibration so that the peak heat flow value returns to the initial peak heat flow value. Correction means and
Equipped with
The notification means is
When the set amplitude value corrected by the set amplitude correction means exceeds a preset upper limit value, the replacement of the ultrasonic horn is notified.
A horn replacement notification device for an ultrasonic bonding device .

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